CN110391261B - Micro light-emitting diode display panel - Google Patents
Micro light-emitting diode display panel Download PDFInfo
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- CN110391261B CN110391261B CN201810347760.8A CN201810347760A CN110391261B CN 110391261 B CN110391261 B CN 110391261B CN 201810347760 A CN201810347760 A CN 201810347760A CN 110391261 B CN110391261 B CN 110391261B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
Abstract
The invention discloses a micro light-emitting diode display panel. The micro light-emitting diode display panel is provided with a bottom plate, a plurality of micro light-emitting diodes, a plurality of driving chips and a shading layer. The bottom plate is provided with a first surface and a display area, and the micro light-emitting diode is arranged on the first surface of the bottom plate and is positioned in the display area. Each micro light emitting diode is provided with a bottom surface and a front light-emitting surface which are respectively positioned at two opposite sides, the bottom surface is adjacent to the first surface, and the front light-emitting surface is far away from the first surface. The driving chip is also arranged on the first surface of the bottom plate and positioned in the display area, the driving chip is electrically connected with at least one micro light-emitting diode, and the shading layer is arranged on the bottom plate, covers the driving chip and exposes the front light-emitting surface of the micro light-emitting diode.
Description
Technical Field
The present invention relates to a light emitting diode display panel, and more particularly, to a micro light emitting diode display panel.
Background
Light emitting diodes have high energy conversion efficiency, small size and long service life, and are widely used in various electronic products, such as indication, illumination or display devices to provide images. Briefly, a light emitting diode having an active light emitting layer and at least two doping types of semiconductor layers is manufactured by manufacturers by adjusting the materials used in the active light emitting layer.
In practice, however, the light emitting diode needs to be controlled finely for displaying images, and the amorphous silicon thin film transistor circuit fabricated on the conventional glass substrate is not used. Particularly, for high-resolution display panels, smaller-sized leds and low-current driving are required, and therefore, it is one of the research and development directions of led display panels to improve the accuracy of current control of the leds and the quality of the display images displayed by the leds.
Disclosure of Invention
The invention provides a micro light emitting diode display panel to overcome the problem that a pixel driving chip is easily affected by environmental factors when the pixel driving chip is arranged on a display substrate.
The invention discloses a micro light-emitting diode display panel. The micro light-emitting diode display panel is provided with a bottom plate, a plurality of micro light-emitting diodes, a plurality of driving chips and a shading layer. The bottom plate has a first surface and a display area. Each micro light emitting diode is arranged on the first surface of the bottom plate and positioned in the display area, each micro light emitting diode is provided with a bottom surface and a front light-emitting surface which are respectively positioned on two opposite sides, the bottom surface is adjacent to the first surface, and the front light-emitting surface is far away from the first surface. Each driving chip is arranged on the first surface of the bottom plate and is positioned in the display area. Each driving chip is electrically connected with at least one micro light-emitting diode. The light shielding layer is arranged on the first surface of the bottom plate. The shading layer covers the driving chips and exposes the front light-emitting surfaces of the micro light-emitting diodes.
The micro light emitting diode display panel further comprises a display driving circuit formed on the bottom plate and electrically connected with the micro light emitting diodes and the driving chips, wherein the light shielding layer is provided with a plurality of openings, and the micro light emitting diodes are positioned in the openings.
The light shielding layer is provided with a second surface, and the distance between the second surface and the first surface is greater than the distance between the front light-emitting surface of the micro light-emitting diodes and the first surface.
The light shielding layer is provided with a plurality of concave parts and a plurality of convex parts, the micro light-emitting diodes are arranged in the concave parts, the driving chips are arranged in the convex parts, the distance between the surfaces of the concave parts and the first surface is smaller than the distance between the front light-emitting surfaces of the micro light-emitting diodes and the first surface, and the distance between the surfaces of the convex parts and the first surface is larger than the distance between the front light-emitting surfaces of the micro light-emitting diodes and the first surface.
One of the driving chips has a top surface, and the distance between the top surface and the first surface is greater than the distance between the front light-emitting surface of the micro light-emitting diodes and the first surface.
The micro light emitting diode display panel further comprises a sensing element arranged on the bottom plate and positioned in the display area of the bottom plate, and the sensing element is covered by the shading layer.
The micro light emitting diode display panel further comprises a sensing element arranged on the bottom plate and positioned in the display area of the bottom plate, the light shielding layer exposes a top surface of the sensing element, and the sensing element is positioned among the micro light emitting diodes.
The light shielding layer is provided with a plurality of concave parts and a plurality of convex parts, the micro light emitting diodes and the sensing element are arranged in the concave parts, the driving chips are arranged in the convex parts, the distance between the surfaces of the concave parts and the first surface is smaller than the distance between the front light-emitting surface of the micro light emitting diodes and the first surface, the distance between the surfaces of the concave parts and the first surface is smaller than the distance between the top surface of the sensing element and the first surface, and the distance between the surfaces of the convex parts and the first surface is larger than the distance between the front light-emitting surface of the micro light emitting diodes and the first surface.
The micro light-emitting diode display panel further comprises a plurality of touch control elements, the touch control elements are arranged on the bottom plate and distributed in the display area, and the light shielding layer covers the touch control elements.
The micro light-emitting diodes comprise red light micro light-emitting diodes, green light micro light-emitting diodes and blue light micro light-emitting diodes, and distances from the front light-emitting surfaces of the red light micro light-emitting diodes, the front light-emitting surfaces of the green light micro light-emitting diodes and the front light-emitting surfaces of the green light micro light-emitting diodes to the first surface are different.
The micro light-emitting diode display panel further comprises a plurality of pixel units, and each pixel unit is provided with at least one red light micro light-emitting diode, at least one green light micro light-emitting diode and at least one blue light micro light-emitting diode.
The light shielding layer has a second surface, and the distance between the second surface and the first surface is greater than the distance between a top surface of the driving chips and the first surface and less than the distance between the front light-emitting surface of the micro light-emitting diodes and the first surface.
The above description of the present invention and the following description of the embodiments are provided to illustrate and explain the spirit and principles of the present invention and to provide further explanation of the invention as claimed in the appended claims.
Drawings
Fig. 1A is a top view of a micro led display panel according to an embodiment of the invention.
FIG. 1B is a cross-sectional view of the micro LED display panel 1B-1B shown in FIG. 1A.
Fig. 2A is a top view of a micro led display panel according to another embodiment of the invention.
FIG. 2B is a cross-sectional view of a cross-section 2B-2B of the micro LED display panel shown in FIG. 2A according to an embodiment.
Fig. 3 is a cross-sectional view of a micro led display panel according to another embodiment of the invention.
Fig. 4 is a cross-sectional view of a micro led display panel according to another embodiment of the invention.
Fig. 5 is a cross-sectional view of a micro led display panel according to another embodiment of the invention.
Wherein, the reference numbers:
1. 2, 3, 4, 5 micro light-emitting diode display panel
10. 20, 30, 40, 50 bottom plate
121. 221, 321, 421, 521 driving chip
14 to 54 light-shielding layer
46 sensing element
AA display area
B1, B2 conductive bump
C display driving circuit
DNT recess
PTR convex part
D micro light-emitting diode
Pins of E1 driver chip
Electrode of E2 micro light-emitting diode
H1、H1’、H2、H2’、H2”、H3、H3’、H4、HDDistance between two adjacent plates
NA non-display area
O opening
P pixel unit
S1 first surface
S2, S2' second surface
S3 third surface
Top surface of S4
SB bottom surface
SI Top surface
LS positive light emitting surface
TH1, TH2 thickness
TP touch control element
Detailed Description
The detailed features and advantages of the present invention are described in detail in the embodiments below, which are sufficient for anyone skilled in the art to understand the technical contents of the present invention and to implement the present invention, and the related objects and advantages of the present invention can be easily understood by anyone skilled in the art according to the disclosure of the present specification, the protection scope of the claims and the attached drawings. The following examples further illustrate aspects of the present invention in detail, but are not intended to limit the scope of the invention in any way.
The invention provides a micro light-emitting diode display panel. The micro light-emitting diode display panel is provided with a bottom plate, a plurality of micro light-emitting diodes, a plurality of driving chips and a light shielding layer. In the embodiments of the present invention, the micro light emitting diodes and the driving chips in the drawings are illustrated as examples, but the number of the micro light emitting diodes and the driving chips is not limited thereto. On the other hand, the micro light emitting diode shown in the drawings is a horizontal structure, and in practice, the micro light emitting diode of the present invention may also be a vertical structure. In addition, the micro led display panel has a plurality of pixel units and a plurality of different elements, and for brevity, a partial structure of the micro led display panel is described herein, and a person skilled in the art can deduce the overall structure of the micro led display panel after reading the present specification in detail.
Referring to fig. 1A to 1B, fig. 1A is a top view of a micro led display panel 1 according to an embodiment of the invention, and fig. 1B is a cross-sectional view of a cross-section 1B-1B of the micro led display panel shown in fig. 1A. The micro led display panel 1 has a bottom plate 10, a plurality of driving chips 121, a plurality of micro leds D, and a light shielding layer 14. The base plate 10 has a first surface S1, a display area AA, and a non-display area NA. The display area AA is an area for displaying a picture, and the display area AA has a plurality of pixel units P arranged in an array and separated from each other, and each pixel unit P in the embodiment includes a plurality of micro light emitting diodes D; the non-display area NA is located at the periphery of the display area AA and is used for disposing peripheral circuits, traces or other electronic components, such as a camera lens.
The micro light emitting diodes D are electrically connected to the base plate 10 and disposed on the first surface S1. The micro light emitting diode D has a front light emitting surface LS (light emitting surface) and a bottom surface SB respectively located at two opposite sides, the bottom surface SB is adjacent to and faces the first surface S1, and in the embodiment, the micro light emitting diode D further has two electrodes E2 disposed on the bottom surface SB, and the front light emitting surface LS is far from the first surface S1. The first surface S1, the bottom surface SB and the front light emitting surface LS are approximately parallel, that is, the bottom surface SB is located between the first surface S1 and the front light emitting surface LS. Each pixel unit P includes three micro light emitting diodes D, which are red micro light emitting diodes (R micro LEDs), green micro light emitting diodes (G micro LEDs), and blue micro light emitting diodes (B micro LEDs), respectively, for providing red light, green light, and blue light, but not limited thereto.
The driving chips 121 are also electrically connected to the base plate 10 and disposed in the display area AA. The driving chip 121 is electrically connected to each of the micro light emitting diodes D in the pixel unit P for controlling and driving each of the electrically connected micro light emitting diodes D, so that each of the pixel units P emits a predetermined display color and brightness. The driving chip 121 is, for example, an integrated circuit chip (IC) manufactured by a semiconductor process. In the present embodiment, one driving chip 121 correspondingly drives the micro light emitting diodes D in eight pixel units P. In practice, the one or more driving chips 121 may drive the one or more micro light emitting diodes D in the one or more pixel units P in a one-to-one, one-to-many or many-to-one manner, which is not limited to the examples.
The micro led display panel 1 further has a display driving circuit C, which is a conductive trace formed on the first surface S1 of the bottom plate 10 in this embodiment and is used to electrically connect the driving chip 121 and the corresponding micro led D. In other embodiments, the display drive line C may also be a line including a transistor element.
In practice, the pin E1 of the driving chip 121 is electrically connected to the display driving circuit C through a corresponding conductive bump (bump) B1, and the electrode E2 of the micro light emitting diode D is electrically connected to the display driving circuit C through a corresponding conductive bump B2. The trace design of the driving circuit C corresponds to the connection relationship between the pin E1 of the driving chip 221 and the electrode E2 of each micro led D. Details related thereto are not described herein.
The light shielding layer 14 is formed on the bottom plate 10 by photoresist coating and has a thickness enough to cover the driving chip 121, and then the micro light emitting diode D is exposed by exposure and development patterning. The patterned light-shielding layer 14 in this embodiment covers each driving chip 121 and has a plurality of openings O respectively corresponding to the pixel units P. The micro light emitting diodes D and a portion of the display driving circuit C are located in the opening O, that is, exposed out of the light shielding layer 14. More specifically, the orthographic projection of the light shielding layer 14 on the first surface S1 surrounds the pixel unit P, that is, the orthographic projection of the light shielding layer 14 on the first surface S1 does not overlap with the orthographic projection of the micro light emitting diode D on the first surface S1, so that the light shielding layer 14 exposes the front light emitting surface LS of the micro light emitting diode D. From another perspective, the micro light emitting diode D is not covered by the light shielding layer 14, and the driving chip 121 is completely covered by the light shielding layer 14. In practice, the material of the light-shielding layer 14 is, for example, a black photoresist, an opaque adhesive, a multi-layer chrome film, a resin, etc.
More specifically, the light-shielding layer 14 has a second surface S2, the second surface S2 is far away from the first surface S1, and a distance H1 between the second surface S2 and the first surface S1 is greater than distances H2, H2', and H2 ″ between the front light-emitting surface LS of each micro light-emitting diode D and the first surface S1. Therefore, the light-shielding layer 14 can isolate the influence of light emission between pixels, thereby improving the contrast of the image. In other words, the front light emitting surface LS of each micro light emitting diode D does not protrude from the second surface S2 of the light shielding layer 14.
In addition, in this embodiment, the distances H2, H2' and H2 ″ between the front light emitting surface LS of the micro leds D of different colors and the first surface S1 are different, so that when the micro leds D of different colors are transferred from the temporary substrate (not shown) to the bottom plate 10 in batches, the micro leds D transferred to the bottom plate 10 are prevented from being damaged by collision when the micro leds D of different colors are transferred. More specifically, the transfer sequence of the micro light emitting diodes D is respectively arranged according to the different distances between the front light emitting surface LS of the micro light emitting diodes D and the first surface S1. In this embodiment, the micro led D corresponding to the minimum distance H2 is shifted first, the middle distance H2' is the next to the micro led D corresponding to the maximum distance H2 ″ is the last to be shifted. The distance between the front light emitting surface LS and the first surface S1 is related to the thickness of the micro light emitting diode D, including the thickness of the epitaxial layer (not shown) and the electrode E2. The distance between the front light emitting surface LS of each micro light emitting diode D and the first surface S1 is exemplary, but not limited to the illustrated example. In other embodiments, the distance between the front light emitting surface LS and the first surface S1 can be controlled by other methods, such as the thickness of the conductive bump B2, the trace thickness of the display driving circuit C, and even the pattern undulation of the first surface S1.
In the present embodiment, the light-shielding layer 14 surrounds each pixel unit P. In another aspect, the light shielding layer 14 does not directly contact each of the micro light emitting diodes D. In addition to the light-shielding layer 14 for covering the driving chip 121 to prevent the driving chip 121 from being deteriorated by light, the light-shielding layer 14 can further prevent the light emitted from each of the micro light-emitting diodes D in different pixel units P from interfering with each other. Conversely, the light-shielding layer 14 higher than the micro light-emitting diodes D surrounds each pixel unit P, so as to improve the contrast of the image provided by the micro light-emitting diode panel 1.
Referring to fig. 2A and 2B, fig. 2A is a top view of a micro led display panel 2 according to still another embodiment of the invention, and fig. 2B is a cross-sectional view of an implementation aspect of a cross-section 2B-2B of the micro led display panel shown in fig. 2A.
The embodiment shown in fig. 2A is similar to the micro led display panel 1 of fig. 1A, and the micro led display panel 2 of the present embodiment has a bottom plate 20, a plurality of driving chips 221 disposed on the first surface S1 of the bottom plate 20, a plurality of micro leds D, and a light shielding layer 24. The main difference is that the light-shielding layer 24 has a convex portion PTR and a concave portion DNT formed in a connected manner, and each driving chip 221 corresponds to four pixel units P. The light shielding layer 24 covers the first surface S1 of the bottom plate 20, covers the driving chip 221, and surrounds a portion of the side surface of each micro led D. The front light emitting surface LS of the micro light emitting diode D is exposed out of the light shielding layer 24. That is, in this embodiment, a part of the structure of each micro led D is exposed out of the light shielding layer 24, and another part of the structure is covered by the light shielding layer 24.
Further, the light shielding layer 24 covers the driving chip 221 and the display driving line C. In addition, the convex portion PTR of the light shielding layer 24 corresponds to the position of the driving chip 221 and covers the driving chip 221, and the concave portion DNT corresponds to the position of the micro light emitting diodes D and covers a part of the micro light emitting diodes D and the display driving circuit C. More specifically, the light-shielding layer 24 has a second surface S2 and a third surface S3, wherein the second surface S2 is a surface of the convex portion PTR, and the third surface S3 is a surface of the concave portion DNT. The micro light emitting diode D is located in a recess DNT, which isThe orthographic projection of the surface of DNT (the third surface S3) on the first surface S1 partially overlaps the orthographic projection of the micro light emitting diode D on the first surface S1. Stated another way, unlike the embodiment of fig. 1B, the light-shielding layer 24 extends into the pixel unit P where the micro light-emitting diode D is located. On the other hand, the distance H between the surface of the recess DNT and the first surface S1DIs smaller than the distance H2 between the front light emitting surface LS of each micro light emitting diode D and the first surface S1. That is, in this embodiment, a portion of the epitaxial structure of each micro led D is also exposed to the recess DNT of the light-shielding layer 24 and is not covered by the light-shielding layer 34. In this embodiment, the driving chip 221 has a top surface S4. The top surface S4 has a distance H3 from the first surface S1. The distance H3 is greater than the distance H2, and the protrusion PTR of the light-shielding layer 24 covers the driving chip 221, so the distance H1 from the surface (the second surface S2) of the protrusion PTR to the first surface S1 is also greater than the distance H2 from the front light-emitting surface LS of the micro light-emitting diode D to the first surface S1.
In this embodiment, the display driving circuit C in the display area AA is further covered by the light-shielding layer 24, which not only reduces the influence of light on the elements of the display driving circuit C, but also improves the problem of display quality degradation caused by the reflected light.
Fig. 3 is a cross-sectional view of a micro led display panel 3 according to another embodiment of the invention. The micro led display panel 3 shown in fig. 3 is similar to the embodiment shown in fig. 2B, and the micro led display panel 3 of this embodiment has a bottom plate 30, a plurality of driving chips 321 disposed on the first surface S1 of the bottom plate 30, a plurality of micro leds D, and a light shielding layer 34. The main difference is that the driving chip 321 is disposed on the bottom plate 30 at a lower level than the micro light emitting diode D is disposed on the bottom plate 30. Therefore, in this embodiment, based on the convenience of the process, the light-shielding layer 34 is not defined with the concave portion DNT or the convex portion PTR as shown in fig. 2B, but the light-shielding layer 34 is made to cover the driving chip 321 by the thickness thereof, but the front light-emitting surface LS of the micro light-emitting diode D is exposed, for example, by controlling the coating height. From another perspective, the light shielding layer 34 has a second surface S2, the driving chip 321 has a top surface S4, a distance H1 is between the second surface S2 of the light shielding layer 34 and the first surface S1, a distance H2 is between the front light emitting surface LS of the micro light emitting diode D and the first surface S1, and a distance H3 'is between the top surface S4 of the driving chip 321 and the first surface S1, wherein the distance H3' is less than the distance H1, and the distance H1 is less than the distance H2.
Referring to fig. 4 again, fig. 4 is a cross-sectional view of a micro led display panel 4 according to still another embodiment of the invention. The micro led display panel 4 of the present embodiment is similar to the micro led display panel 2 of fig. 2B, and the micro led display panel 4 of the present embodiment has a bottom plate 40, a plurality of driving chips 421 disposed on the first surface S1 of the bottom plate 40, a plurality of micro leds D, and a light shielding layer 44. The main difference is that the micro led display panel 4 of the present embodiment further includes a sensing element 46, and the sensing element 46 is a photosensitive element or a photosensitive element and is located in the display area AA. The light shielding layer 44 exposes the top surface SI of the sensing element 46. Similar to the embodiment shown in fig. 2B, the light-shielding layer 44 has a convex portion PTR and a concave portion DNT defined therein. The convex portion PTR covers the driving chip 421, and the micro light emitting diode D and the sensing element 46 are located in the concave portion DNT. Similarly, the light-shielding layer 44 has a second surface S2 and a third surface S3, wherein the second surface S2 is the surface of the convex portion PTR, and the third surface S3 is the surface of the concave portion DNT. The driving chip 421 has a top surface S4. The second surface S2 of the light-shielding layer 44 has a distance H1 from the first surface S1, the front light-emitting surface LS of the micro light-emitting diode D has a distance H2 from the first surface S1, and the surface of the recess DNT has a distance H1 from the first surface S1DAnd the distance H4 is between the top surface SI of the sensing element 46 and the first surface S1. In this embodiment, the distance HDLess than distance H2, distance HDLess than distance H4, and distance H1 is greater than distance H2.
Referring to fig. 5, fig. 5 is a cross-sectional view of a micro led display panel 5 according to another embodiment of the invention. The micro led display panel 5 of the present embodiment is similar to the embodiment of fig. 4, and the main difference is that the micro led display panel 5 of the present embodiment further includes a touch device TP, which in the present embodiment is a sensing circuit disposed on the bottom plate 50 for sensing a touch action. The convex portion PTR covers the driving chip 521 and the touch device TP, and the micro light emitting diode D is located in the concave portion DNT and exposes the front light emitting surface LS thereof. In particular, the thickness TH1 of the convex portion PTR of the light-shielding layer 54 on the driver chip 521 is different from the thickness TH2 of the convex portion PTR of the light-shielding layer 54 on the touch panel TP. In another aspect, the light-shielding layer 54 has a second surface S2 and a second surface S2 ', the second surface S2 corresponds to the surface of the protrusion PTR on the driving chip 521, and the second surface S2' corresponds to the surface of the protrusion PTR on the touch device TP. In this embodiment, the distance H1 between the second surface S2 and the first surface S1 is greater than the distance H1 'between the second surface S2' and the first surface S1.
In summary, the present invention provides a micro led display panel having a light shielding layer to cover an integrated circuit on a substrate, so as to prevent the drift of electrical parameters caused by the influence of light on the integrated circuit elements. On the other hand, the light-shielding layer can further cover other elements on the substrate to prevent the elements from reflecting light to affect the display quality. In one embodiment, the light-shielding layer may have a concave portion and a convex portion to further significantly improve the image contrast. On the other hand, in one class of embodiments, the micro led display panel further has a detector, and the light shielding portion may cover the detector or not cover the detector depending on the type of the detector.
Claims (10)
1. A micro light emitting diode display panel, comprising:
a bottom plate having a first surface and a display area;
the micro light-emitting diodes are arranged on the first surface of the bottom plate and positioned in the display area, each micro light-emitting diode is provided with a bottom surface and a front light-emitting surface which are respectively positioned on two opposite sides, the bottom surface is adjacent to the first surface, and the front light-emitting surface is far away from the first surface;
a plurality of driving chips disposed on the first surface of the base plate and in the display region, each driving chip being electrically connected to at least one of the micro light emitting diodes, wherein each driving chip has a top surface, and a distance is provided between the top surface and the first surface; and
a light shielding layer disposed on the first surface of the bottom plate, covering the driver chips and exposing the front light-emitting surface of the micro light-emitting diodes, wherein the light shielding layer has a thickness enough to cover the top surface of each of the driver chips, and the thickness is greater than the distance,
the light shielding layer is provided with a plurality of concave parts and a plurality of convex parts which are formed in a connected mode, the micro light-emitting diodes are arranged in the concave parts, the driving chips are arranged in the convex parts, the distance between the surfaces of the concave parts and the first surface is smaller than the distance between the front light-emitting surfaces of the micro light-emitting diodes and the first surface, and the distance between the surfaces of the convex parts and the first surface is larger than the distance between the front light-emitting surfaces of the micro light-emitting diodes and the first surface.
2. The micro light-emitting diode display panel of claim 1, further comprising a display driving circuit formed on the bottom plate and electrically connecting the micro light-emitting diodes and the driving chips, wherein the light-shielding layer has a plurality of openings, and the micro light-emitting diodes are disposed in the openings.
3. The micro light-emitting diode display panel of claim 1, wherein the distance between the top surface and the first surface is greater than the distance between the front light-emitting surface of the micro light-emitting diodes and the first surface.
4. The micro light-emitting diode display panel of claim 1, further comprising a sensing element disposed on the bottom plate and in the display region of the bottom plate, the sensing element being covered by the light-shielding layer.
5. The micro light-emitting diode display panel of claim 1, further comprising a sensing element disposed on the bottom plate and in the display region of the bottom plate, wherein the light-shielding layer exposes a top surface of the sensing element, and the sensing element is disposed between the micro light-emitting diodes.
6. The micro light-emitting diode display panel of claim 5, wherein the sensing element is disposed in the recesses, and a distance between a surface of the recesses and the first surface is smaller than a distance between a top surface of the sensing element and the first surface.
7. The micro light-emitting diode display panel of claim 1, further comprising a plurality of touch-sensing elements disposed on the bottom plate and distributed in the display area, wherein the light-shielding layer covers the touch-sensing elements.
8. The micro light-emitting diode display panel of claim 1, wherein the micro light-emitting diodes comprise red micro light-emitting diodes, green micro light-emitting diodes and blue micro light-emitting diodes, and distances from the front light-emitting surfaces of the red micro light-emitting diodes, the green micro light-emitting diodes and the green micro light-emitting diodes to the first surface are different.
9. The micro led display panel of claim 8, further comprising a plurality of pixel units, each pixel unit having at least one red micro led, at least one green micro led, and at least one blue micro led.
10. The micro LED display panel of claim 1, wherein the light shielding layer has a second surface, and the distance between the second surface and the first surface is greater than the distance between the top surface of the driving chips and the first surface.
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| CN201810347760.8A CN110391261B (en) | 2018-04-18 | 2018-04-18 | Micro light-emitting diode display panel |
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| CN111261658B (en) * | 2020-02-10 | 2023-02-28 | Tcl华星光电技术有限公司 | Micro light-emitting diode display panel and transfer printing method of micro light-emitting diode |
| CN111326082B (en) * | 2020-04-14 | 2021-08-03 | Tcl华星光电技术有限公司 | Backboard unit, manufacturing method thereof and display device |
| US11526079B2 (en) | 2020-04-14 | 2022-12-13 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backplane unit and its manufacturing method and display device |
| CN111540754B (en) * | 2020-04-23 | 2022-12-02 | 上海天马微电子有限公司 | Micro light-emitting diode display panel, manufacturing method thereof and display device |
| CN113594194A (en) * | 2020-04-30 | 2021-11-02 | 华为机器有限公司 | Stacking structure, display screen and display device |
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