CN108597377B - Display module and display device - Google Patents

Display module and display device Download PDF

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Publication number
CN108597377B
CN108597377B CN201810401091.8A CN201810401091A CN108597377B CN 108597377 B CN108597377 B CN 108597377B CN 201810401091 A CN201810401091 A CN 201810401091A CN 108597377 B CN108597377 B CN 108597377B
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Prior art keywords
substrate
carrier
pads
display module
light emitting
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CN108597377A (en
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吕绍平
谢嘉定
郭家玮
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AU Optronics Corp
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AU Optronics Corp
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention provides a display module and a display device. The display module comprises a light-emitting panel and a back panel. The light-emitting panel comprises a substrate, a plurality of micro light-emitting diodes, a plurality of active elements and a plurality of substrate connecting pads. The micro light-emitting diode is positioned on the first surface of the substrate. The active element is electrically connected with the micro light-emitting diode. The substrate pad is located on the first surface of the substrate. The substrate pad is electrically connected with the active device. The back plate comprises a carrier plate, a carrier plate connecting pad and at least one flexible circuit board. The second surface of the carrier plate faces the first surface of the substrate. The size of the carrier plate is smaller than that of the substrate. The carrier pads are located on the second surface of the carrier. The carrier pad is electrically connected to the substrate pad. The flexible circuit board is electrically connected with the carrier pad.

Description

Display module and display device
Technical Field
The present disclosure relates to display modules, and particularly to a display module and a display device including a light emitting panel and a back panel.
Background
With the rapid development of display technology, the market demand for Large Format Display (LFD) is increasing. Currently, the tiling technology is one of the main ways to realize large-size displays.
The splicing technology is to splice a plurality of sub-display panels with smaller sizes to form a large-size display. However, the peripheral area of each sub-display panel needs to reserve the space for disposing the circuit. Therefore, the spliced large-sized display may have seams of pictures at these spaces for disposing circuits. Causing it to display a discontinuous picture. Therefore, a solution to the above-mentioned problems is needed.
Disclosure of Invention
The invention provides a display module, and aims to solve the problem of discontinuous pictures in the splicing technology.
Another object of the present invention is to increase the area of a region in which wiring can be provided in a display module.
The invention provides a display device which can solve the problem of discontinuous pictures in the splicing technology.
In at least one embodiment of the present invention, the display module includes a light emitting panel and a back panel. The light-emitting panel comprises a substrate, a plurality of micro light-emitting diodes, a plurality of active elements and a plurality of substrate connecting pads. The micro light-emitting diode is positioned on the first surface of the substrate. The active element is electrically connected with the micro light-emitting diode. The substrate pad is located on the first surface of the substrate. The substrate pad is electrically connected with the active device. The back plate comprises a carrier plate, a carrier plate connecting pad and at least one flexible circuit board. The carrier plate is provided with a first surface, a second surface opposite to the first surface of the carrier plate and a side surface connecting the first surface and the second surface of the carrier plate. The second surface of the carrier plate faces the first surface of the substrate. The size of the carrier plate is smaller than that of the substrate. The carrier pads are located on the second surface of the carrier. The carrier pad is electrically connected to the substrate pad. The flexible circuit board is electrically connected with the carrier pad.
In at least one embodiment of the present invention, a display device includes a plurality of light emitting panels, a plurality of back panels, and a plurality of assemblies. Each light-emitting panel comprises a substrate, a plurality of micro light-emitting diodes, a plurality of active elements and a plurality of substrate connecting pads. The substrate has a first face. The micro light-emitting diodes are positioned on the first surface of the substrate. The plurality of active elements are electrically connected with the plurality of micro light-emitting diodes. The plurality of substrate pads are located on the first surface of the substrate. The substrate pads are electrically connected with the active devices. Each of the back plates is arranged corresponding to one of the light emitting panels. Each back plate comprises a carrier plate, a plurality of carrier plate connecting pads and a plurality of flexible circuit boards. The carrier plate is provided with a first surface, a second surface opposite to the first surface and a side surface connecting the first surface and the second surface. The second surface of the carrier plate faces the first surface of the corresponding substrate. The size of the carrier plate is smaller than the size of the corresponding substrate. The carrier pads are located on the second surface of the carrier. The carrier pad is electrically connected to the substrate pads. The flexible circuit boards are electrically connected with the corresponding carrier plate connecting pads respectively. The flexible circuit boards extend to the side surface of the carrier plate. Each carrier plate is fixed on a corresponding assembly, wherein a plurality of adjacent assemblies are mutually jointed.
The display module can solve the problem of discontinuous pictures in the splicing technology. Meanwhile, the invention can increase the area of the region which can be wired in the display module.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic top view of a display module according to an embodiment of the invention.
Fig. 2A is a schematic sectional view along line AA' of fig. 1.
Fig. 2B is a schematic sectional view along the line BB' of fig. 1.
Fig. 2C is a schematic sectional view along line CC' of fig. 1.
Fig. 3 is a schematic cross-sectional view of a display module according to an embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a display module according to an embodiment of the invention.
Fig. 5 is a schematic cross-sectional view of a display module according to an embodiment of the invention.
Fig. 6A is a schematic cross-sectional view of a display module according to an embodiment of the invention.
Fig. 6B is a schematic cross-sectional view of a display module according to an embodiment of the invention.
Fig. 7 is a schematic cross-sectional view of a display module according to an embodiment of the invention.
Fig. 8 is an exploded view of a display device according to an embodiment of the invention.
Description of the symbols:
1: display device
10. 20, 30, 40, 50a, 50b, 60: display module 100, 100', 100 ": light-emitting panel
110: semiconductor layer
120. 140, 140 ', 160', 188: insulating layer 122: a first insulating layer
124: a second insulating layer
130: grid electrode
152: drain electrode
154: source electrode
156: signal line
170. 190: conductive layer
172. 174, and (3) a step of: conductive pad
176: substrate pad
182: first semiconductor layer
184: luminescent layer
186: a second semiconductor layer
192. 194: connecting electrode
200. 200', 200 ": back plate
212: signal line pad
214: carrier pad
220: fan-out line
300. 300', 300 ": assembly unit
310. 310', 310 ": main body part
320. 320', 320 ": projecting part
320H, 320H', 320H ": gap
330. 330', 330 ": handle of hand grip
AC: containing space
AK1, AK 1', AK 2: alignment mark
B1, B1': substrate
B2: support plate
BM: light shielding layer
C1: first conductive structure
C2: second conductive structure
L1, L2, L3: light filtering element
E1, E2, E3: light conversion element
COF: flexible circuit board
D. D1, D2, D3: micro light-emitting diode
F: flexible carrier plate
I: bump
IC: driving chip
K adhesive layer
O: opening holes
OR: open area
P, P': concave part
P1: a first electrode
P2: second electrode
PD: pixel definition layer
PS, PS': spacer
QD1, QD2, QD 3: quantum dot material
R: reflective layer
RS1, RS2, RS 3: reflection structure
S1, S4: first side
S2, S3: second surface
S5: side surface
T, T1, T2, T3: active component
W: transparent insulator
X: circuit arrangement
Z: direction of rotation
Detailed Description
Fig. 1 is a schematic top view of a display module according to an embodiment of the invention. Fig. 2A is a schematic sectional view along line AA' of fig. 1. Fig. 2B is a schematic sectional view along the line BB' of fig. 1. Fig. 2C is a schematic sectional view along line CC' of fig. 1. Fig. 1 shows only the substrate of the light-emitting panel, the micro light-emitting diode, the carrier of the back plate, and the flexible printed circuit board of the back plate, and other components are omitted.
Referring to fig. 1 and fig. 2A, the display module 10 includes a light emitting panel 100, a back panel 200 and a driving chip IC.
The light-emitting panel 100 includes a substrate B1, a plurality of micro light-emitting diodes D, a plurality of active devices T, and a plurality of substrate pads 176. The substrate B1 includes a first face S1 and a second face S2 opposite to the first face S1. The active device T, the micro led D and the substrate pad 176 are disposed on the first surface S1 of the substrate B1. The substrate B1 is made of transparent or translucent material, such as transparent glass substrate or transparent soft substrate, which is made of glass, quartz, organic polymer or other suitable material.
In the present embodiment, the active device T includes a semiconductor layer 110, an insulating layer 120, a gate 130, a source 154 and a drain 152. The semiconductor layer 110 is formed on the substrate B1. The semiconductor layer 110 is a single-layer or multi-layer structure, and includes amorphous silicon, polycrystalline silicon, microcrystalline silicon, single crystal silicon, an organic semiconductor material, an oxide semiconductor material (e.g., indium zinc oxide, indium gallium zinc oxide, or other suitable materials, or combinations thereof), or other suitable materials or materials containing a dopant (dopant) therein or combinations thereof. The insulating layer 120 is formed on the semiconductor layer 110. The gate electrode 130 is formed on the insulating layer 120, and at least a portion of the insulating layer 120 is located between the gate electrode 130 and the semiconductor layer 110. The insulating layer 120 may optionally include a first insulating layer 122 and a second insulating layer 124, but the invention is not limited thereto. The insulating layer 140 is formed on the substrate B1, the insulating layer 120, and the gate electrode 130. The source electrode 154 and the drain electrode 152 fill the opening of the insulating layer 120 and the opening of the insulating layer 140, and are electrically connected to the semiconductor layer 110, respectively. In the present embodiment, the signal line 156, the source 154 and the drain 152 are all formed on the insulating layer 140, and the signal line 156, the source 154 and the drain 152 belong to the same patterned conductive layer, for example, but the invention is not limited thereto. In other embodiments, the signal line 156 may belong to other patterned conductive layers, for example, the same patterned conductive layer as the gate 130. The signal line 156 is applied with, for example, a ground voltage or a voltage supplied from a power supply.
Although the active device T is illustrated as a top gate thin film transistor in the present embodiment, the invention is not limited thereto. According to other embodiments, the active device T may be a bottom gate thin film transistor or other similar switching devices.
The insulating layer 160 is formed on the active device T and the insulating layer 140. The conductive layer 170 is formed on the insulating layer 160, and at least a portion of the conductive layer 170 fills the opening of the insulating layer 160. In the present embodiment, the conductive layer 170 includes a conductive pad 172, a conductive pad 174 and a substrate pad 176. The conductive pads 172, 174 and 176 are disposed on the first side S1 of the substrate B1. The conductive pad 172, the conductive pad 174 and the substrate pad 176 are electrically connected to the signal line 156, the drain 152 of the active device T and the source 154 of the active device T, respectively. In the embodiment, a bump I is further sandwiched between a portion of the substrate pad 176 and the insulating layer 160, but the invention is not limited thereto. In the embodiment, the conductive pads 172, the conductive pads 174 and the substrate pads 176 belong to the same patterned conductive layer 170, but the invention is not limited thereto. In other embodiments, the substrate pad 176 does not belong to the conductive layer 170, and the substrate pad 176 may be electrically connected to the source 154 of the active device T through other conductive structures.
The micro light emitting diode D is disposed on the insulating layer 160. The micro light emitting diode D may be formed on a growth substrate (not shown), for example, and then transferred onto the insulating layer 160 by Mass Transfer (Mass Transfer) technique. In an embodiment, an adhesion layer K may be further included between the micro light emitting diode D and the insulating layer 160 for adhering the micro light emitting diode D to the insulating layer 160, but the invention is not limited thereto. In some embodiments, the insulating layer 160 has an adhesive property, so the micro light emitting diode D can be directly adhered to the insulating layer 160.
The micro light emitting diode D includes, for example, a first semiconductor layer 182, a light emitting layer 184 and a second semiconductor layer 186 stacked in sequence. One of the first semiconductor layer 182 and the second semiconductor layer 186 is an N-type doped semiconductor, and the other is a P-type doped semiconductor. The material of the first semiconductor layer 182 and the second semiconductor layer 186 includes, for example, gallium nitride (GaN), indium gallium nitride (InGaN), gallium arsenide (GaAs), aluminum gallium indium phosphide (AlGaInP), gallium phosphide (GaP), aluminum indium phosphide (AlInP), gallium arsenide (GaAs), or other materials composed of IIIA and VA elements, or other suitable materials, but the invention is not limited thereto. The light-emitting layer 184 has, for example, a Quantum Well (QW), such as: a Single Quantum Well (SQW), a Multiple Quantum Well (MQW), or other quantum well, holes provided by the P-type doped semiconductor layer and electrons provided by the N-type doped semiconductor layer can combine in the light-emitting layer 184 and release energy in the form of light. In some embodiments, the material of the light emitting layer 184 includes indium gallium aluminum nitride (In), for examplexGayAl(1-x-y)N) aluminum gallium indium phosphide (Al)(1-x-y)GayInxP), indium arsenideAluminum gallium (In)xAl(1-x-y)GayAs) or other group IIIA and VA elements or other suitable materials.
In some embodiments, the micro light emitting diode D further includes an insulating layer 188, and the insulating layer 188 has at least two openings, which respectively expose a portion of the top surface of the first semiconductor layer 182 and a portion of the top surface of the second semiconductor layer 186. In some embodiments, the micro light emitting diode D further includes a first electrode P1 and a second electrode P2 filled in the opening of the insulating layer 188 and electrically connected to the first semiconductor layer 182 and the second semiconductor layer 186, respectively, but the invention is not limited thereto.
Although the micro light emitting diode D is a horizontal micro light emitting diode in the embodiment, the invention is not limited thereto. In other embodiments, the micro led D may also be a vertical micro led or other types of micro leds.
The conductive layer 190 is formed on the micro light emitting diode D. The conductive layer 190 includes a connection electrode 192 and a connection electrode 194. The drain 152 of the active device T is electrically connected to the first electrode P1 of the micro led D through the connection electrode 192 and the conductive pad 174, but the invention is not limited thereto. The active device T and the micro light emitting diode D may be electrically connected by other methods. The signal line 156 is electrically connected to the second electrode P2 of the micro led D through the connecting electrode 194 and the conductive pad 172, but the invention is not limited thereto. The signal line 156 and the micro light emitting diode D may be electrically connected by other methods.
Although only one active device T is illustrated in the present embodiment, the invention is not limited thereto. In some embodiments, the micro light emitting diode D may be connected to at least one transistor such as 2T1C (two transistors and one capacitor), 3T1C (three transistors and one capacitor), 4T1C (four transistors and one capacitor), 5T2C (five transistors and two capacitors), 6T1C (six transistors and one capacitor), and at least one capacitor circuit or other electronic components.
In this embodiment, the light emitting panel 100 may optionally include a pixel defining layer PD, and the pixel defining layer PD may be located between the micro light emitting diodes D, but the invention is not limited thereto. The pixel defining layer PD includes, for example, a light shielding material or a light transmitting material, and the present invention is not particularly limited.
The backplane 200 comprises a carrier B2, carrier pads 214, signal line pads 212, fanout lines 220, and a flexible circuit board COF. The carrier board B2 has a first face S4, a second face S3 opposite to the first face S4, and a side face S5 connecting the first face S4 and the second face S3. The second face S3 of the carrier board B2 faces the first face S1 of the substrate B1. The signal line pads 212, the carrier pads 214 and the fan-out lines 220 are located on the second surface S3 of the carrier B2.
The material of the carrier B2 may be glass, quartz, organic polymer, opaque/reflective material (e.g., conductive material, metal, wafer, ceramic, or other suitable material) or other suitable material. If the carrier B2 is made of conductive material or metal, an insulating layer (not shown) is covered on the carrier B2 to avoid short circuit problem.
The flexible printed circuit COF includes a flexible carrier F and a circuit X thereon. In some embodiments, the circuit X has a fan-out function, but the invention is not limited thereto. The circuit X on the flexible circuit COF is electrically connected to the driving chip IC.
In some embodiments, the micro leds D are overlapped with the carrier B2 in a vertical projection direction (direction Z) of the substrate B1, and the carrier B2 has a reflective layer or a reflective structure for reflecting light emitted by the micro leds D, wherein the reflective layer may be formed on the carrier B2 in whole or in multiple pieces on the carrier B2, which is not limited in the invention.
The first conductive structure C1 is located between the signal line pad 212 and the substrate pad 176, and electrically connects the substrate pad 176 to the corresponding signal line pad 212. The second conductive structure C2 is located between the carrier pad 214 and the circuit X of the flexible circuit board COF, and electrically connects the carrier pad 214 to the circuit X. In some embodiments, the material of the first conductive structure C1 and the second conductive structure C2 includes anisotropic conductive paste, solder or other materials. In some embodiments, the material of the first conductive structure C1 and the second conductive structure C2 includes anisotropic conductive adhesive, and the current is limited to flow in a fixed direction, such as the normal direction of the carrier B2, so that a single first conductive structure C1 can electrically connect the substrate pads 176 to the signal line pads 212, a single second conductive structure C2 can electrically connect the carrier pads 214 to the circuit X of the flexible circuit COF, and the first conductive structure C1 and the second conductive structure C2 can be connected to or separated from each other.
The signal line pads 212 are electrically connected to the carrier pads 214. For example, the fanout line 220 electrically connects the signal line pads 212 to the carrier pad 214, so that if the distance between adjacent signal line pads 212 is larger than the distance between adjacent carrier pads 214. Compared with the fan-out line 220 disposed in the light-emitting panel 100, the area of the area on the carrier 200 where wiring can be performed is large, and thus, the manufacturing difficulty of the display module 10 can be reduced.
The carrier pad 214 is electrically connected to the substrate pad 176. In the embodiment, the flexible circuit board COF is electrically connected to the source 154 of the active device T through the second conductive structure C2, the carrier pad 214, the fanout line 220, the signal line pad 212, the first conductive structure C1 and the substrate pad 176. In some embodiments, the gate 130 and/or the signal line 156 of the active device T may also be electrically connected to the flexible circuit COF and/or other flexible circuit COFs.
In the present embodiment, the carrier B2 has at least one opening O. The flexible circuit board COF passes through the opening O and extends toward the side S5 of the carrier B2. In detail, the flexible circuit board COF extends to the position of the opening O along the second surface S3 of the carrier B2 and passes through the opening O along the side surface S5 of the carrier B2, so that the flexible circuit board COF can be simultaneously located on the first surface S4 and the second surface S3 of the carrier B2. The shape of the opening O is a triangle, a rectangle, a pentagon, a hexagon, a circle, an ellipse or other shapes, and the invention is not particularly limited to the shape of the opening O.
In the embodiment, the flexible circuit board COF passes through the opening O of the carrier B2, but the invention is not limited thereto. As long as the size (e.g., the size of the front projection area) of the carrier B2 is smaller than the size (e.g., the size of the front projection area) of the substrate B1, the flexible circuit board COF can straddle the carrier B2 along the side S5 of the carrier B2 to be located on the first side S4 and the second side S3 of the carrier B2 at the same time. The side S5 is not limited to the outward side of the carrier B2, but can also be the inward side of the carrier B2. In detail, the opening O of the carrier B2 may be located in the middle of the carrier B2, and the side of the opening O located in the middle of the carrier B2 is the side of the carrier B2 facing inward.
In this embodiment, the display module 10 further includes another light emitting panel 100 'and another back panel 200'. The light-emitting panel 100 'is electrically connected to the back panel 200', and the light-emitting panel 100 'and the back panel 200' have structures similar to those of the light-emitting panel 100 and the back panel 200, respectively, for example, and are not described herein again. In the embodiment, the opening O of the back plate 200 is located at the edge of the carrier plate B2 and overlaps the light-emitting panel 100', but the invention is not limited thereto. In other embodiments, opening O of backplane 200 may be located at other positions on carrier B2.
Based on the above, the present embodiment arranges the driving chip IC on the first surface S4 of the back panel 200 (or another back panel 200 '), so that the problem of discontinuous pictures between the light-emitting panel 100 and another light-emitting panel 100' can be improved.
Referring to fig. 1 and 2B, in some embodiments, a spacer PS may be optionally disposed between the light-emitting panel 100 and the rear panel 200 to maintain a distance between the light-emitting panel 100 and the rear panel 200. The spacer PS is formed on the alignment mark AK1 of the light emitting panel 100 or the alignment mark AK2 of the back panel 200, and is located between the alignment marks AK1 and AK2, but the invention is not limited thereto.
Referring to fig. 1 and 2C, another light-emitting panel 100 ' includes a substrate B1 ', an insulating layer 140 ', an insulating layer 160 ', and an alignment mark AK1 '. In some embodiments, a spacer PS 'is formed on the alignment mark AK 1' of another light emitting panel 100 'and between the flexible circuit board COF and the alignment mark AK 1' of another light emitting panel 100 'to prevent the another light emitting panel 100' from contacting the flexible circuit board COF, but the invention is not limited thereto.
Fig. 3 is a schematic cross-sectional view of a display module according to an embodiment of the invention. It should be noted that the embodiment of fig. 3 follows the element numbers and part of the contents of the embodiments of fig. 1 and fig. 2A to 2C, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.
The main differences between the display module 20 and the display module 10 are: the display module 20 includes a plurality of reflective structures RS1 on the first side S1 of the substrate B1.
In the embodiment, the display module 20 includes active devices T1, T2, T3 and micro light emitting diodes D1, D2, D3 electrically connected to the active devices T1-T3, respectively. The micro light emitting diodes D1-D3 may emit lights of the same or different colors, for example, including blue light, red light, green light, yellow light and/or white light, and the invention is not particularly limited.
The reflective structure RS1 includes a transparent insulator W and a reflective layer R. The transparent insulator W covers the micro light emitting diodes D1 to D3, respectively, for example. The transparent insulator W is, for example, an optical cement or other transparent insulating material. The reflective layers R cover the transparent insulators W, respectively. The light emitted by the micro light emitting diodes D1-D3 can be reflected by the reflective layer R and exit the second surface S2 of the display module 20.
Fig. 4 is a schematic cross-sectional view of a display module according to an embodiment of the invention. It should be noted that the embodiment of fig. 4 follows the element numbers and partial contents of the embodiment of fig. 3, wherein the same or similar element numbers are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.
The main differences between the display module 30 and the display module 20 are: the plurality of reflective structures RS1 of the display module 20 are located on the first side S1 of the substrate B1, and the plurality of reflective structures RS2 of the display module 30 are located on the second side S3 of the carrier B2.
The micro light emitting diodes D1-D3 of the display module 30 are overlapped with the backplate 200.
The reflective structures RS2 are disposed corresponding to the micro LEDs D1-D3, and each reflective structure RS2 has a concave portion P facing the corresponding micro LEDs D1-D3. In the present embodiment, the inner contour of the concave portion P is illustrated as a semicircle, but the invention is not limited thereto. The light emitted by the micro light emitting diodes D1-D3 can be reflected by the reflective structure RS2 and exit the second surface S2 of the display module 30.
Fig. 5 is a schematic cross-sectional view of a display module according to an embodiment of the invention. It should be noted that the embodiment of fig. 5 follows the element numbers and partial contents of the embodiment of fig. 4, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.
The main differences between the display module 40 and the display module 30 are: the recess P of the reflective structure RS2 of the display module 30 has a different shape from the recess P' of the reflective structure RS3 of the display module 40.
In the present embodiment, the bottom of the recess P 'is connected to a portion of the carrier board B2, and the recess P' may also be said to include an opening penetrating through the reflective structure RS3, and the opening exposes a portion of the carrier board B2. The carrier B2 may include a reflective material, and both the carrier B2 and the reflective structure RS3 may be used to reflect light emitted by the micro light emitting diodes D1-D3.
Fig. 6A is a schematic cross-sectional view of a display module according to an embodiment of the invention. It should be noted that the embodiment of fig. 6A follows the element numbers and partial contents of the embodiment of fig. 5, wherein the same or similar element numbers are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.
In the present embodiment, the display module 50a includes a light-shielding layer BM and a plurality of filter elements L1, L2, and L3.
The light-shielding layer BM is located on the second surface S2 of the substrate B1. The second face S2 of the substrate B1 is opposite to the first face S1 of the substrate B1. The light-shielding layer BM has a plurality of opening regions OR. The micro light emitting diodes D1-D3 are disposed corresponding to the opening area OR.
In some embodiments, the filter elements L1-L3 are filter elements of different colors, such as a red filter element, a blue filter element, and a green filter element, respectively.
Fig. 6B is a schematic cross-sectional view of a display module according to an embodiment of the invention. It should be noted that the embodiment of fig. 6B follows the element numbers and partial contents of the embodiment of fig. 5, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.
In the present embodiment, the display module 50b includes a light-shielding layer BM and a plurality of light conversion elements E1, E2, E3.
In some embodiments, the light conversion elements E1-E3 are light conversion elements of different colors, and the light conversion elements E1-E3 may be formed by doping quantum dot materials with photoresist materials, for example. The light conversion elements E1 to E3 include quantum dot materials QD1, QD2, and QD3, and can convert light (for example, blue light) emitted from the micro light emitting diodes D1 to D3 into light of other wavelengths (for example, red light and/or green light). The quantum dot materials QD1 to QD3 are semiconductor quantum dot materials such as cadmium selenide (CdSe), cadmium sulfide (CdS), or zinc sulfide (ZnS), for example. The light emitted by the micro light emitting diodes D1 to D3 may excite the quantum dot materials QD1 to QD3 in the light conversion elements E1 to E3, so that the light may emit light of corresponding colors. The quantum dot materials QD 1-QD 3 may be the same or different materials, for example.
In the present embodiment, the substrate B1 is located between the light conversion elements E1 through E3 and the micro light emitting diodes D1 through D3. The light conversion elements E1 to E3 are located in the opening area OR of the light-shielding layer BM, for example.
Fig. 7 is a schematic cross-sectional view of a display module according to an embodiment of the invention. It should be noted that the embodiment of fig. 7 follows the element numbers and partial contents of the embodiment of fig. 6B, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.
The main difference between the embodiment of fig. 7 and the embodiment of fig. 6 is that: the light conversion elements E1-E3 of the display module 60 of fig. 7 are located between the substrate B1 and the micro light emitting diodes D1-D3.
In the present embodiment, the light conversion elements E1 to E3 include quantum dot materials QD1 to QD3, respectively. The light conversion elements E1 through E3 and the micro light emitting diodes D1 through D3 are formed on the same growth substrate (not shown), and then transferred onto the substrate B1 by Mass Transfer (Mass Transfer) technology. In the embodiment, the insulating layer 188 covers the side surfaces of the light conversion elements E1 to E3, but the invention is not limited thereto.
Fig. 8 is an exploded view of a display device according to an embodiment of the invention. It should be noted that the embodiment of fig. 8 follows the element numbers and partial contents of the embodiment of fig. 7, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein. Fig. 8 only shows the substrate of the light-emitting panel, the carrier of the back panel and the assembly, and other components are omitted.
The display device 1 comprises a light emitting panel 100, a light emitting panel 100 ', a light emitting panel 100 ", a backplane 200 ', a backplane 200", an assembly 300 ', and an assembly 300 ". In the present embodiment, the light emitting panel 100, the rear panel 200, and the assembly 300 belong to the same splicing unit, the light emitting panel 100 ', the rear panel 200 ', and the assembly 300 ' belong to the same splicing unit, and the light emitting panel 100 ", the rear panel 200", and the assembly 300 "belong to the same splicing unit. Although the embodiment only illustrates that the display device 1 includes three splicing units, the invention is not limited thereto. The display device 1 may include more than 1 splicing unit, the number of the splicing units may be determined according to the requirement, and each splicing unit may be arranged in any manner according to the requirement.
In the present embodiment, the light emitting panel 100' and the light emitting panel 100 ″ are similar to the light emitting panel 100 in any of the foregoing embodiments, and thus, the description thereof is omitted.
In this embodiment, the backplate 200' and the backplate 200 ″ are similar to the backplate 200 in any of the aforementioned embodiments, and are not described herein again.
In the present embodiment, carrier B2 of backplane 200, carrier B2 of backplane 200 ', and carrier B2 of backplane 200 "are fixed to assembly 300, assembly 300', and assembly 300", respectively.
The assembly 300 includes a body portion 310, a plurality of projections 320, a plurality of indentations 320H, and a grip 330. The protrusion 320 and the notch 320H are located around the main body 310, and the grip 330 is located on the back of the main body 310. In some embodiments, a receiving space AC is formed between the carrier B2 and the main body 310, and the flexible circuit board COF (please refer to fig. 2A) passes through the opening O of the carrier B2 and extends into the receiving space AC between the carrier B2 and the main body 310 of the assembly 300.
Assembly 300 ' includes a body portion 310 ', a plurality of projections 320 ', a plurality of indentations 320H ', and a grip 330 '. The assembly 300 "includes a body portion 310", a plurality of projections 320 ", a plurality of indentations 320H", and a grip 330 ". The assembly 300, the assembly 300', and the assembly 300 ″ have, for example, similar structures, which are not described herein.
The assembly 300, the assembly 300', and the assembly 300 "may be engaged or joined to each other in any manner. For example, the partial protrusion 320 of the assembly 300 may engage with the partial notch 320H 'of the assembly 300', and the partial protrusion 320 of the assembly 300 may engage with the partial notch 320H "of the assembly 300". The partial protrusion 320 'of the assembly 300' may engage with the partial notch 320H of the assembly 300, and the partial protrusion 320 "of the assembly 300" may engage with the partial notch 320H of the assembly 300. Although the assembly 300, the assembly 300', and the assembly 300 ″ of the present embodiment are engaged or jointed with each other by using the protrusions and the notches, the present invention is not limited thereto. The assembly 300, the assembly 300', and the assembly 300 ″ may also be engaged or connected to each other in other manners.
At least one embodiment of the invention can improve the problem of discontinuous pictures at the joints of different splicing units in the display device.
At least one embodiment of the present invention can increase the area of a region where wiring can be provided in a display device.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims (17)

1. A display module, comprising:
a light emitting panel, comprising:
a substrate having a first surface;
a plurality of micro light emitting diodes positioned on the first surface of the substrate;
the plurality of active elements are electrically connected with the plurality of micro light-emitting diodes; and
a plurality of substrate pads located on the first surface of the substrate, the plurality of substrate pads being electrically connected to the plurality of active devices; and
a backing plate, comprising:
a carrier plate having a first surface, a second surface opposite to the first surface of the carrier plate, and a lateral surface connecting the first surface and the second surface of the carrier plate, wherein the second surface of the carrier plate faces the first surface of the substrate, and the size of the carrier plate is smaller than that of the substrate;
a plurality of carrier pads located on the second surface of the carrier, wherein the plurality of carrier pads are electrically connected to the plurality of substrate pads; and
at least one flexible circuit board electrically connected to the carrier pads.
2. The display module of claim 1, wherein the backplane further comprises:
the fan-out lines are positioned on the second surface of the carrier plate and are electrically connected with the carrier plate connecting pads; and
and a plurality of signal line pads located on the second surface of the carrier board, wherein the plurality of signal line pads are electrically connected to the plurality of fanout lines and the plurality of substrate pads.
3. The display module of claim 2, further comprising:
a first conductive structure electrically connecting the plurality of substrate pads to the plurality of signal line pads; and
and the second conductive structure is electrically connected with the plurality of carrier plate connecting pads to the at least one flexible circuit board.
4. The display module of claim 3, wherein the first conductive structure and the second conductive structure comprise anisotropic conductive paste or solder.
5. The display module of claim 1, wherein the at least one flexible printed circuit extends toward the side of the carrier.
6. The display module of claim 1, wherein the carrier of the backplane has at least one opening through which the at least one flexible printed circuit passes.
7. The display module of claim 6, further comprising another light emitting panel and another back panel, the another light emitting panel electrically connected to the another back panel, wherein the at least one opening of the back panel overlaps the another light emitting panel.
8. The display module of claim 7, wherein the plurality of micro light emitting diodes in the light emitting panel are disposed overlapping the backplane.
9. The display module of claim 1, further comprising a plurality of reflective structures on the first side of the substrate, each of the reflective structures comprising:
a transparent insulator covering the corresponding micro light emitting diode; and
a reflective layer covering the transparent insulator.
10. The display module of claim 1, further comprising a plurality of reflective structures disposed on the second surface of the carrier, wherein the plurality of reflective structures are disposed corresponding to the plurality of micro light emitting diodes, and each of the reflective structures has a recess facing the plurality of micro light emitting diodes.
11. The display module of claim 1, wherein the at least one flexible printed circuit is electrically connected to a driving chip.
12. The display module of claim 1, further comprising:
a light shielding layer located on a second surface of the substrate, the second surface of the substrate being opposite to the first surface of the substrate, wherein the light shielding layer has a plurality of opening areas, and the plurality of micro light emitting diodes correspond to the plurality of opening areas; and
and the substrate is positioned between the plurality of filter elements and the plurality of micro light-emitting diodes.
13. The display module of claim 1, further comprising:
a light shielding layer located on a second surface of the substrate, the second surface of the substrate being opposite to the first surface of the substrate, wherein the light shielding layer has a plurality of opening areas, and the plurality of micro light emitting diodes correspond to the plurality of opening areas; and
the substrate is positioned between the plurality of light conversion elements and the plurality of micro light-emitting diodes.
14. The display module of claim 1, further comprising:
a light shielding layer located on a second surface of the substrate, the second surface of the substrate being opposite to the first surface of the substrate, wherein the light shielding layer has a plurality of opening areas, and the plurality of micro light emitting diodes correspond to the plurality of opening areas; and
and the light conversion elements comprise quantum dot materials and are positioned between the substrate and the micro light-emitting diodes.
15. A display device, comprising:
a plurality of light-emitting panels, each of the light-emitting panels comprising:
a substrate having a first surface;
a plurality of micro light emitting diodes positioned on the first surface of the substrate;
the plurality of active elements are electrically connected with the plurality of micro light-emitting diodes; and
a plurality of substrate pads located on the first surface of the substrate, the plurality of substrate pads being electrically connected to the plurality of active devices; and
a plurality of backplates, each this backplate corresponds one of them luminescent panel setting, and each this backplate includes:
a carrier plate having a first surface, a second surface opposite to the first surface of the carrier plate, and a side surface connecting the first surface and the second surface of the carrier plate, wherein the second surface of the carrier plate faces the first surface of the corresponding substrate, and the size of the carrier plate is smaller than that of the corresponding substrate;
a plurality of carrier pad pads located on the second surface of the carrier, the plurality of carrier pad pads being electrically connected to the corresponding plurality of substrate pad pads; and
a plurality of flexible circuit boards, which are respectively electrically connected with the corresponding plurality of carrier plate connecting pads and extend to the side surface of the carrier plate; and
and each carrier plate is fixed on the corresponding assembly, wherein the adjacent assemblies are mutually jointed.
16. The display device according to claim 15, wherein the plurality of flexible printed circuits of each of the plurality of back plates further extend between the corresponding carrier and the corresponding assembly.
17. The display device as claimed in claim 15, wherein the carrier of each of the back plates has a plurality of openings, and the plurality of flexible printed circuits pass through the plurality of openings.
CN201810401091.8A 2018-02-06 2018-04-28 Display module and display device Active CN108597377B (en)

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