CN110391188B - 一种量子芯片封装装置 - Google Patents
一种量子芯片封装装置 Download PDFInfo
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- CN110391188B CN110391188B CN201910646482.0A CN201910646482A CN110391188B CN 110391188 B CN110391188 B CN 110391188B CN 201910646482 A CN201910646482 A CN 201910646482A CN 110391188 B CN110391188 B CN 110391188B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 89
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000004891 communication Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000005056 compaction Methods 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 abstract description 8
- 238000013461 design Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
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- 230000033001 locomotion Effects 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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CN201910646482.0A CN110391188B (zh) | 2019-07-17 | 2019-07-17 | 一种量子芯片封装装置 |
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CN201910646482.0A CN110391188B (zh) | 2019-07-17 | 2019-07-17 | 一种量子芯片封装装置 |
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CN110391188A CN110391188A (zh) | 2019-10-29 |
CN110391188B true CN110391188B (zh) | 2021-04-27 |
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CN201910646482.0A Active CN110391188B (zh) | 2019-07-17 | 2019-07-17 | 一种量子芯片封装装置 |
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Families Citing this family (1)
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CN112113901A (zh) * | 2020-09-18 | 2020-12-22 | 深圳先进技术研究院 | 芯片固定装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100416980B1 (ko) * | 2002-02-22 | 2004-02-05 | 삼성전자주식회사 | 볼 그리드 어레이 칩 고정장치 |
JP4016271B2 (ja) * | 2003-03-26 | 2007-12-05 | 株式会社デンソー | 両面冷却型半導体モジュール |
CN103400831B (zh) * | 2013-07-22 | 2016-04-20 | 国家电网公司 | 一种全压接igbt模块及其装配方法 |
CN104966704B (zh) * | 2015-07-23 | 2019-01-25 | 国网智能电网研究院 | 一种低热阻的压接式功率器件封装 |
CN206558488U (zh) * | 2016-09-29 | 2017-10-13 | 江苏康博光伏电力科技有限公司 | 一种多晶硅片用组合夹具 |
CN206961814U (zh) * | 2016-12-23 | 2018-02-02 | 杨杰 | 一种功率模块的封装结构 |
CN207489846U (zh) * | 2017-10-13 | 2018-06-12 | 宁夏新思科管理咨询有限公司 | 一种半导体封装件 |
CN108598048B (zh) * | 2018-03-29 | 2020-07-28 | 番禺得意精密电子工业有限公司 | 散热器组件 |
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Effective date of registration: 20220512 Address after: 518000 third floor, No. 92 and 94, saierkang Avenue, Xiangshan community, Xinqiao street, Bao'an District, Shenzhen, Guangdong Patentee after: Baonasheng (Shenzhen) Technology Co.,Ltd. Address before: 402260 No. 1 North and South Avenue, Binjiang new town, Jiangjin District, Chongqing. Patentee before: CHONGQING VOCATIONAL INSTITUTE OF ENGINEERING |
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Address after: 518000, Area B, Kaicheng High tech Park, Taoyuan Community, Dalang Street, Longhua District, Shenzhen City, Guangdong Province 505 Patentee after: Baonasheng (Shenzhen) Technology Co.,Ltd. Address before: 518000 third floor, No. 92 and 94, saierkang Avenue, Xiangshan community, Xinqiao street, Bao'an District, Shenzhen, Guangdong Patentee before: Baonasheng (Shenzhen) Technology Co.,Ltd. |
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