CN110391164A - A kind of welding machine transmission mechanism that can transmit large-sized silicon wafers - Google Patents
A kind of welding machine transmission mechanism that can transmit large-sized silicon wafers Download PDFInfo
- Publication number
- CN110391164A CN110391164A CN201910755549.4A CN201910755549A CN110391164A CN 110391164 A CN110391164 A CN 110391164A CN 201910755549 A CN201910755549 A CN 201910755549A CN 110391164 A CN110391164 A CN 110391164A
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- positioning device
- transmission
- positioning
- welding machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 141
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 109
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 109
- 239000010703 silicon Substances 0.000 title claims abstract description 109
- 235000012431 wafers Nutrition 0.000 title claims abstract description 108
- 238000003466 welding Methods 0.000 title claims abstract description 26
- 230000007246 mechanism Effects 0.000 title claims abstract description 21
- 238000004140 cleaning Methods 0.000 claims description 16
- 239000012634 fragment Substances 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000013065 commercial product Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013082 photovoltaic technology Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of welding machine transmission mechanism that can transmit large-sized silicon wafers, including transmitting device and positioning device, wherein positioning device is set on transmitting device, and the distance between adjacent positioned device and the size of silicon wafer are adapted, convenient for carrying out localized delivery to silicon wafer.The beneficial effects of the invention are as follows with positioning device, the effective position and spacing guaranteed per a piece of silicon wafer, it is matched with the cross-brace of more transmission belts or wide transmission belt, can to avoid die size it is excessive caused by die size deform, it reduces silicon wafer deformation in transmission process to fall and transmission deviation, reduces fragment rate.
Description
Technical field
The invention belongs to photovoltaic technology field, and the welding machine conveyer of large-sized silicon wafers can be transmitted more particularly, to one kind
Structure.
Background technique
Solar battery has had been to be concerned by more and more people as reproducible eco-friendly power source, solar photovoltaic industry
Also it is grown rapidly, with the increase of the demand of generated power of solar cell, the size of solar battery is increasing, too
Transmission structure is not able to satisfy large scale solar battery transmission demand when positive energy welding battery, and deformation is big, transmits unstable, fragment
Rate is low.
Summary of the invention
In view of the above problems, the problem to be solved in the present invention is to provide the welding machine transmission that one kind can transmit large-sized silicon wafers
Mechanism is especially suitable for transmission of the welding machine to cell piece in monocrystalline solar components manufacturing process, convenient for the biography of large scale battery piece
Defeated and positioning, cell piece transmission process is more stable, fragment rate is lower.
In order to solve the above technical problems, the technical solution adopted by the present invention is that: one kind can transmit the weldering of large-sized silicon wafers
Machine transmission mechanism, including transmitting device and positioning device,
Wherein, positioning device is set on transmitting device, and the distance between adjacent positioned device and the size of silicon wafer are mutually fitted
It answers, convenient for carrying out localized delivery to silicon wafer.
Further, positioning device is adjustable is set on transmitting device, the distance between adjacent positioned device and silicon
The size of piece is adapted, convenient for carrying out localized delivery to silicon wafer.
Further, transmitting device includes several transmission belts, and each transmission belt is equipped with several positioning devices, phase
The size of spacing and silicon wafer between adjacent positioning device is adapted, convenient for carrying out localized delivery to silicon wafer；And
The positioning device that same position is arranged in several transmission belts is linearly arranged.
Further, transmitting device is transmission belt, and the width of transmission belt is greater than the width of silicon wafer.
Further, positioning device is positioning wedged block, and positioning wedged block is detachably connected with transmitting device.
Further, transmitting device is equipped with multiple mounting holes, and positioning device is connect by mounting hole with transmitting device.
Further, transmitting device is equipped with multiple bar shaped adjusting holes, and positioning device is filled by bar shaped adjusting hole and transmission
Set connection.
Further, positioning device is magnetic devices, and magnetic devices include fixed magnetic part and mobile magnetic part, fixed magnetic
Property part be fixedly connected with transmitting device, mobile magnetic part is engaged with fixed magnetic part, and mobile magnetic part can be relative to consolidating
It is mobile to determine magnetic part, is adjusted convenient for the distance between adjacent mobile magnetic part.
Further, positioning device is fixed on transmitting device, and the distance between adjacent positioned device and silicon wafer
Size is adapted, convenient for carrying out localized delivery to silicon wafer.
It further, further include clearing apparatus, clearing apparatus is set to the lower part of transmitting device, and clearing apparatus includes cleaning item
With cleaning driving device, cleaning item is connect with driving device is cleaned, and clearing apparatus is engaged with transmitting device, than convenient for biography
Defeated device cleans.
Due to the adoption of the above technical scheme, the welding machine transmission mechanism structure for allowing to transmit large-sized silicon wafers is simply tight
It gathers, it is easy for assemble or unload, there is positioning device, the effective position and spacing guaranteed per a piece of silicon wafer is and more on transmitting device
The cross-brace of root transmission belt or wide transmission belt matches, can to avoid die size it is excessive caused by die size deform,
It reduces silicon wafer deformation in transmission process to fall and transmission deviation, reduces fragment rate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of the invention；
Fig. 2 is the structural schematic diagram of the embodiment of the present invention two；
Fig. 3 is the structural schematic diagram of the embodiment of the present invention one；
Fig. 4 is the structural schematic diagram of the embodiment of the present invention three；
Fig. 5 is the structural schematic diagram of the embodiment of the present invention four；
Fig. 6 is the structural schematic diagram of the embodiment of the present invention five.
In figure:
1, transmission belt 2, silicon wafer 3, positioning device
31, bolt 32, plug assembly 33, holding screw
34, mobile magnetic part 35, fixed magnetic part
Specific embodiment
The present invention is further illustrated in the following with reference to the drawings and specific embodiments.
Fig. 1-6 shows the structural schematic diagram of six embodiments of the invention, and the structure of the present embodiment, this reality has been shown in particular
It applies example and is related to a kind of welding machine transmission mechanism that can transmit large-sized silicon wafers, transmitting in the welding process for large-sized silicon wafers makes
With silicon wafer accurate positioning in transmission process, transmission is more stable, and fragment rate is low.
Embodiment one
A kind of welding machine transmission mechanism that can transmit large-sized silicon wafers, as shown in figures 1 and 3, including transmitting device and fixed
Position device 3, wherein positioning device 3 is adjustable to be set on transmitting device, and the distance between adjacent positioned device 3 can be adjusted
Section, and the distance between adjacent positioned device and the size of silicon wafer 2 are adapted, convenient for carrying out localized delivery to silicon wafer 2.Silicon wafer 2
Carry out transmission process in, silicon wafer is placed on transmitting device by feeding sucker, and silicon wafer 2 be placed on adjacent positioned device 3 it
Between, silicon wafer 2 is positioned when transmitting on transmitting device, silicon wafer is avoided to shake, to silicon wafer precise positioning, is convenient for feeding sucker
Feeding is carried out, accurate feeding and transport is realized, avoids fragment.
Above-mentioned transmitting device includes several transmission belts 1, and each transmission belt 1 is equipped with several positioning devices 3, phase
The size of spacing and silicon wafer 2 between adjacent positioning device 3 is adapted, convenient for carrying out localized delivery to silicon wafer 2.The number of transmission belt 1
Amount is selected according to the size of silicon wafer 2, be can be two three or more, is selected according to actual needs
It selects, does not do specific requirement here.The transmitting device carries out power transmission, transmitting device and transmission by transmission shaft and driving device
Axis connection, transmission shaft are connect by chain conveyer or V belt translation with power drive unit, and power drive unit drives transmission shaft rotation,
Rotation axis rotation drives the transmission belt rotation of transmitting device, realizes the transmission of silicon wafer.Power drive unit is preferably motor.
Scheme is advanced optimized, the positioning device 3 that same position is arranged in several transmission belts 1 is linearly arranged, also
It is that multiple positioning devices 3, the distance between adjacent positioned device 3 basis are equidistantly fixedly installed in each transmission belt 1
Silicon wafer 2 select, each transmission belt 1 position that from first to last each positioning device 3 is installed is identical, and same position
Positioning device 3 in each transmission belt 1 is located along the same line, so that after silicon wafer 2 is placed in transmission belt 1, due to large scale
The size of silicon wafer 2, silicon wafer 2 is contacted with each transmission belt 1 respectively, and after silicon wafer 2 is placed on transmitting device, silicon wafer 2 is located at each
Among two neighboring positioning device 3 in 1 same position of transmission belt, precise positioning is carried out to silicon wafer, so that chip transmission is stablized,
Fragment rate is low.
Multiple positioning devices 3 are installed, the quantity of positioning device 3 is according to the length of actual transmissions band 1 in each transmission belt 1
Degree is selected, and does not do specific requirement here, and transmitting device is enabled to carry out the transmission of multiple silicon wafers simultaneously, is improved silicon wafer and is passed
Defeated efficiency.
The transmission belt 1 is transmission belt, is commercial product, is selected according to actual needs, do not do specific requirement here.
Above-mentioned positioning device 3 is positioning wedged block, and positioning wedged block is detachably connected with transmitting device, and positioning wedged block passes through spiral shell
The connectors such as bolt 31 are fixedly connected with transmission belt 1, and either, positioning wedged block detachably connects with the clamping of transmission belt 1 or other
Mode is connect, is selected according to actual needs, does not do specific requirement here, so that the distance between adjacent positioned fixture block can be adjusted
Section, convenient for carrying out localized delivery to various sizes of silicon wafer 2.
One end of the positioning wedged block is equipped with the connectors such as bolt 31, while multiple mounting holes are equipped on transmitting device,
The mounting hole is blind hole structure, is set in qually spaced in transmission belt 1, and positioning wedged block is connect by mounting hole with transmitting device, will
Positioning wedged block is mounted in transmission belt 1, and the distance between adjacent positioned fixture block can pass through different the distance between mounting holes
It is adjusted.
The mounting hole can be threaded hole, so that positioning wedged block is detachably connected by bolt 31 with mounting hole, due to peace
Dress hole is blind hole, so that bolt will not penetrate transmission belt 1, is convenient for the held stationary in the process of running of transmission belt 1, guarantees silicon wafer
The stability of transmission.
Alternatively, the mounting hole is blind hole, and the diameter of mounting hole is less than the diameter of the bolt 31 on positioning wedged block, bolt 31
It is inserted directly into mounting hole, by interference fit, positioning wedged block is fixedly mounted in transmission belt 1, and bolt 31 will not penetrate
The mounting hole is convenient for transmission belt held stationary in the process of running, guarantees the stability of the transmission of silicon wafer.
The material of above-mentioned positioning wedged block is wear-resisting and has certain degree of hardness, it is preferred that the material of the positioning wedged block is
PEK；The shape of the positioning wedged block can be cylinder, square triangle or abnormally-structured, or
Person is other shapes, is selected according to actual needs, does not do specific requirement here.
Above-mentioned positioning device 3 is mounted in the separate one side contacted with transmission shaft of transmission belt 1, avoid positioning device 3 with
The transmission of transmission belt 1 causes to interfere, and guarantees 1 traveling comfort of transmission belt.
Clearing apparatus is installed in the lower part of transmitting device, transmitting device is cleaned, keeps the cleaning of transmission belt 1
Degree, avoids the dirt in transmission belt 1 from being attached on silicon wafer 2.The clearing apparatus includes cleaning driving device and cleaning item, cleaning item
It is connect with driving device is cleaned, cleaning item movement is driven by cleaning driving device, transmission belt is cleaned, which is hair
Brush, cleaning driving device are motor.
When carrying out chip transmission, the distance between two neighboring positioning device 3 is determined according to the size of silicon wafer 2,
Positioning device is mounted in transmission belt 1 according to determining spacing, transmission belt 1 is mounted on transmission shaft later, and will transmission
Axis is connect with driving device, drives transmission shaft rotation by driving device, and then drive transmitting device rotation, feeding sucker will be sucked
Silicon wafer 2 is placed between two positioning devices 3 in transmission belt 1, carries out the transmission of silicon wafer, realizes precise positioning and biography to silicon wafer
It is defeated；Meanwhile clearing apparatus being mounted on to the lower part of transmitting device, transmission belt 1 is cleaned in the process of running, keeps transmission
With 1 cleaning.
Embodiment two
The present embodiment is with embodiment one the difference is that the difference of transmission structure, remaining structure is all the same, in this implementation
In example, transmission structure is described in detail, remaining is repeated no more.
In the present embodiment, as shown in Fig. 2, above-mentioned transmitting device is transmission belt 1, the width of transmission belt 1 is greater than silicon wafer 2
Width, which is the transmission belt 1 with one fixed width, and the width of the width of the transmission belt 1 and silicon wafer 2 is adapted,
Convenient for being transmitted to silicon wafer.Multiple positioning devices 3, the size phase of the spacing and silicon wafer 2 are equidistantly installed in transmission belt 1
It adapts to, convenient for carrying out feeding transmission to silicon wafer 2；In the width direction of transmission belt 1, at the position for being equipped with positioning device 3,
On the same line, at least there are two positioning devices 3 for installation, convenient for positioning to silicon wafer.The number of positioning device 3 in width direction
Amount, is selected according to actual needs, does not do specific requirement here.
The transmission belt 1 is transmission belt, is commercial product, is selected according to actual needs, do not do specific requirement here.
Embodiment three
The present embodiment and embodiment one, the difference of embodiment two point out the difference for the structure for being positioning device, remaining knot
Structure is all the same, in the present embodiment, the structure of positioning device is described in detail, remaining is repeated no more.
In the present embodiment, as shown in figure 4, positioning device 3 is positioning wedged block, which is equipped with grafting dress
32 are set, the free end of the plug assembly 32 is tip, and plug assembly 32 is plugged in transmission belt 1, and the freedom of plug assembly 32
End will not penetrate transmission belt 1, and positioning wedged block is fixedly mounted in transmission belt 1, which is contact pin, and the number of contact pin
Amount can be one two or multiple, is selected according to actual needs, does not do specific requirement here；Using
Plug assembly 32 carries out the installation of positioning wedged block, so that the distance between adjacent positioned fixture block can be according to the size of practical silicon wafer
It is adjusted, easy for assemble or unload, so that transmission mechanism can adapt to the transmission of different size silicon wafers, use scope is wide.
Example IV
The present embodiment is with embodiment one, embodiment two and embodiment three the difference is that the structure and peace of positioning device
Dress mode is different, remaining structure is all the same, and in the present embodiment, structure and mounting means to positioning device carry out specifically
Bright, remaining is repeated no more.
In the present embodiment, as shown in figure 5, being equipped with multiple bar shaped adjusting holes on transmitting device, positioning device 3 passes through item
Shape adjusting hole is connect with transmitting device, which is the slot with certain length, and the both ends in hole are semicircle
Shape, positioning device 3 pass through the bar shaped adjusting hole and are mounted in transmission belt 1, since bar shaped adjusting hole has certain length, positioning
Device 3 can carry out the adjustment of position along bar shaped adjusting hole, so that the distance between two neighboring positioning device can carry out
Fine tuning, enables transmitting device to transmit different sizes, accurate positioning, and will not cause to damage to silicon wafer, transmits
Device use scope is wide, is not limited by die size.
The cross sectional shape of the bar shaped adjusting hole is dove-tail form, then positioning device with matching is positioning wedged block, this is fixed
One end of position fixture block is dove-tail form, so that positioning wedged block is matched with bar shaped adjusting hole, convenient for positioning wedged block in bar shaped adjusting hole
Interior progress position adjustment, so that the adjustment of the distance between two neighboring positioning device, convenient for being carried out to various sizes of silicon wafer
Localized delivery.
Meanwhile screw 33 being installed on positioning wedged block, after positioning wedged block position determines, screw 33 will be determined
Position fixture block is fixed in bar shaped adjusting hole, is positioned convenient for positioning wedged block.
Embodiment five
The present embodiment and embodiment one, embodiment two, embodiment three and example IV are the difference is that positioning device
Structure and mounting means it is different, remaining structure is all the same, in the present embodiment, structure and mounting means to positioning device into
Row is described in detail, remaining is repeated no more.
In the present embodiment, as shown in fig. 6, positioning device 3 is magnetic devices, biography is mounted on by the magnetic force to attract each other
On defeated band 1, which includes fixed magnetic part 35 and mobile magnetic part 34, and fixed magnetic part 35 is mounted in transmission belt 1,
Mobile magnetic part 34 is cooperated with fixed magnetic part 35 by magnetic contact, so that mobile magnetic part 34 and fixed magnetic part 35 can be with
Relative movement, convenient for adjusting the distance between two neighboring mobile magnetic part 34, convenient for the transmission to various sizes of silicon wafer into
Row positioning.
The fixed magnetic part 35 is bar magnet, and is enclosed with soft anticollision layer, soft anticollision in the outside of bar magnet
Layer is fixedly connected with transmission belt 1, bar magnet is fixedly mounted in transmission belt 1, which is preferably rubber sleeve, is kept away
Exempt from silicon wafer to contact in transmission process with bar magnet, silicon wafer is caused to damage；The soft anticollision layer is fixedly connected with transmission belt 1
Mode can be integrated molding, is bonded welding or other are fixedly connected, carry out according to actual needs
Selection, does not do specific requirement here.The size of the bar magnet and the size of transmission belt 1 are adapted, and magnetic part easy to remove moves
It is dynamic, silicon wafer is positioned.
Above-mentioned mobile magnetic part 34 is magnet, which is low-dimensional magnet, and is enclosed in the outside of magnet soft
Anticollision layer, which is preferably rubber sleeve, so that contacting when silicon wafer is contacted with mobile magnetic part 34 to be soft, not will cause
Silicon wafer collapses damage.Mobile magnetic part 34 and fixed magnetic part 35 are contacted with each other movement by magnetism, are convenient for various sizes of silicon wafer
Carry out localized delivery.
Embodiment six
The present embodiment and embodiment one, embodiment two, embodiment three, example IV and embodiment five the difference is that
Positioning device is different from the connection type of transmitting device, remaining structure is all the same, in the present embodiment, to positioning device in transmission
The connection type of device is described in detail, remaining is repeated no more.
A kind of welding machine transmission mechanism that can transmit large-sized silicon wafers, including transmitting device and positioning device 3, wherein fixed
Position device 3 is fixedly mounted on transmitting device, and the distance between adjacent positioned device 3 is fixed, and between adjacent positioned device 3
Distance and the size of silicon wafer 2 are adapted, convenient for carrying out localized delivery to silicon wafer 2.Silicon wafer 2 in carrying out transmission process, inhale by feeding
Silicon wafer 2 is placed on transmitting device by disk, and silicon wafer is placed between adjacent positioned device 3, is uploaded to silicon wafer 2 in transmitting device
Positioned when defeated, silicon wafer avoided to shake, to silicon wafer precise positioning, carry out feeding convenient for feeding sucker, realize accurate feeding and
Transport, avoids fragment.
Positioning device 3 is positioning wedged block, and positioning wedged block is fixedly mounted on transmitting device, this is fixedly connected with mode and can be
Bonding or welding, are integrally formed or other are fixedly connected with mode, are selected according to actual needs, this
In do not do specific requirement.
When carrying out the transmission of silicon wafer 2, the distance between two neighboring positioning device is determined according to the size of silicon wafer 2,
Positioning device 3 is fixedly mounted in transmission belt 1 by welding mode, transmission belt 1 is mounted on transmission shaft later, and will be passed
Moving axis is connect with driving device, drives transmission shaft rotation by driving device, and then drive transmitting device rotation, feeding sucker will be inhaled
Firmly silicon wafer 2 is placed between two positioning devices 3 in transmission belt, carries out the transmission of silicon wafer, realize to the precise positioning of silicon wafer and
Transmission；Meanwhile clearing apparatus being mounted on to the lower part of transmitting device, transmission belt is cleaned in the process of running, keeps passing
The cleaning of defeated band.
Due to the adoption of the above technical scheme, the welding machine transmission mechanism structure for allowing to transmit large-sized silicon wafers is simply tight
It gathers, it is easy for assemble or unload, there is positioning device, the effective position and spacing guaranteed per a piece of silicon wafer is and more on transmitting device
The cross-brace of root transmission belt or wide transmission belt matches, can to avoid die size it is excessive caused by die size deform,
It reduces silicon wafer deformation in transmission process to fall and transmission deviation, reduces fragment rate.
The embodiments of the present invention have been described in detail above, but content is only the preferred embodiment of the present invention,
It should not be considered as limiting the scope of the invention.Any changes and modifications in accordance with the scope of the present application,
It should still be within the scope of the patent of the present invention.
Claims (10)
1. the welding machine transmission mechanism that one kind can transmit large-sized silicon wafers, it is characterised in that: including transmitting device and positioning device,
Wherein, the positioning device is set on the transmitting device, and the distance between adjacent described positioning device and silicon wafer
Size is adapted, convenient for carrying out localized delivery to the silicon wafer.
2. the welding machine transmission mechanism according to claim 1 that large-sized silicon wafers can be transmitted, it is characterised in that: the positioning
Device is adjustable to be set on the transmitting device, and the distance between adjacent described positioning device and the size of silicon wafer are mutually fitted
It answers, convenient for carrying out localized delivery to the silicon wafer.
3. the welding machine transmission mechanism according to claim 2 that large-sized silicon wafers can be transmitted, it is characterised in that: the transmission
Device includes several transmission belts, and each transmission belt is equipped with several positioning devices, the adjacent positioning device it
Between spacing and the silicon wafer size be adapted, convenient for the silicon wafer carry out localized delivery；And
The positioning device that same position is arranged in several described transmission belts is linearly arranged.
4. the welding machine transmission mechanism according to claim 2 that large-sized silicon wafers can be transmitted, it is characterised in that: the transmission
Device is transmission belt, and the width of the transmission belt is greater than the width of the silicon wafer.
5. according to the described in any item welding machine transmission mechanisms that can transmit large-sized silicon wafers of claim 2-4, it is characterised in that:
The positioning device is positioning wedged block, and the positioning wedged block is detachably connected with the transmitting device.
6. the welding machine transmission mechanism according to claim 5 that large-sized silicon wafers can be transmitted, it is characterised in that: the transmission
Device is equipped with multiple mounting holes, and the positioning device is connect by the mounting hole with the transmitting device.
7. the welding machine transmission mechanism according to claim 5 that large-sized silicon wafers can be transmitted, it is characterised in that: the transmission
Device is equipped with multiple bar shaped adjusting holes, and the positioning device is connect by the bar shaped adjusting hole with the transmitting device.
8. the welding machine transmission mechanism according to claim 5 that large-sized silicon wafers can be transmitted, it is characterised in that: the positioning
Device is magnetic devices, and the magnetic devices include fixed magnetic part and mobile magnetic part, the fixed magnetic part and the biography
Defeated device is fixedly connected, and the mobile magnetic part is engaged with the fixed magnetic part, and the mobile magnetic part can be opposite
It is mobile in the fixed magnetic part, it is adjusted convenient for the distance between adjacent described mobile magnetic part.
9. the welding machine transmission mechanism according to claim 1 that large-sized silicon wafers can be transmitted, it is characterised in that: the positioning
Device is fixed on the transmitting device, and the distance between adjacent described positioning device and the size of silicon wafer are adapted, just
In to silicon wafer progress localized delivery.
10. according to the described in any item welding machine transmission mechanisms that can transmit large-sized silicon wafers of claim 6-9, feature exists
In: further include clearing apparatus, the clearing apparatus be set to the transmitting device lower part, the clearing apparatus include cleaning item and
Driving device is cleaned, the cleaning item is connect with the cleaning driving device, and the clearing apparatus is contacted with the transmitting device
Cooperation, than convenient for transmitting device cleaning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910755549.4A CN110391164A (en) | 2019-08-15 | 2019-08-15 | A kind of welding machine transmission mechanism that can transmit large-sized silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910755549.4A CN110391164A (en) | 2019-08-15 | 2019-08-15 | A kind of welding machine transmission mechanism that can transmit large-sized silicon wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110391164A true CN110391164A (en) | 2019-10-29 |
Family
ID=68288818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910755549.4A Pending CN110391164A (en) | 2019-08-15 | 2019-08-15 | A kind of welding machine transmission mechanism that can transmit large-sized silicon wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110391164A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202473881U (en) * | 2012-02-23 | 2012-10-03 | 常州天合光能有限公司 | Automatic positioning device for automatic silicon chip charging-discharging machine |
| CN207165535U (en) * | 2017-09-06 | 2018-03-30 | 无锡市江松科技有限公司 | The automatic device for pre-positioning of silicon chip upper piece |
| CN207651466U (en) * | 2017-12-29 | 2018-07-24 | 赛能自动化技术（苏州）有限公司 | A kind of photovoltaic silicon wafer fast moves the combined mechanism of positioning |
| CN109671660A (en) * | 2019-01-31 | 2019-04-23 | 武汉三工智能装备制造有限公司 | The transmission mechanism and solar battery bonding machine of cell piece |
| CN210142643U (en) * | 2019-08-15 | 2020-03-13 | 环晟光伏(江苏)有限公司 | Welding machine transmission mechanism capable of transmitting large-size silicon wafers |
-
2019
- 2019-08-15 CN CN201910755549.4A patent/CN110391164A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202473881U (en) * | 2012-02-23 | 2012-10-03 | 常州天合光能有限公司 | Automatic positioning device for automatic silicon chip charging-discharging machine |
| CN207165535U (en) * | 2017-09-06 | 2018-03-30 | 无锡市江松科技有限公司 | The automatic device for pre-positioning of silicon chip upper piece |
| CN207651466U (en) * | 2017-12-29 | 2018-07-24 | 赛能自动化技术（苏州）有限公司 | A kind of photovoltaic silicon wafer fast moves the combined mechanism of positioning |
| CN109671660A (en) * | 2019-01-31 | 2019-04-23 | 武汉三工智能装备制造有限公司 | The transmission mechanism and solar battery bonding machine of cell piece |
| CN210142643U (en) * | 2019-08-15 | 2020-03-13 | 环晟光伏(江苏)有限公司 | Welding machine transmission mechanism capable of transmitting large-size silicon wafers |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101530030B (en) | Permanent-magnet magnetic-attraction precision seeding device | |
| WO2017117638A1 (en) | Structural arrangement in seed metering and conveying system, used in a sowing machine | |
| WO2017161881A1 (en) | Ordered wide range rice seedling throwing apparatus | |
| KR100394223B1 (en) | Wire saw | |
| CN110391164A (en) | A kind of welding machine transmission mechanism that can transmit large-sized silicon wafers | |
| CN208278868U (en) | A kind of high-efficiency cleaning transporter | |
| CN201639962U (en) | Magnetic plug tobacco sower | |
| CN101214486A (en) | High-efficiency bearing cleaning machine | |
| CN205953021U (en) | Device is put to high -speed getting of device | |
| CN104401664A (en) | Material throwing device and silo discharge device | |
| CN210142643U (en) | Welding machine transmission mechanism capable of transmitting large-size silicon wafers | |
| KR101032442B1 (en) | Picker unit for led chip | |
| CN204264868U (en) | Material-throwing device and delivery device | |
| CN107643413A (en) | A kind of reaction reagent uniform shaking mechanism of automatic blood type detector device | |
| CN207682684U (en) | Multi-line cutting machine for processing solar panel | |
| CN211997587U (en) | Automatic dust removal device | |
| CN209367542U (en) | A kind of friction conveying equipment | |
| CN209601354U (en) | Conveying device is used in a kind of processing of monocrystalline silicon | |
| CN210575878U (en) | Conveyer suitable for jumbo size basket of flowers transmission and position are kept | |
| CN208856389U (en) | A kind of roller brush type clearing apparatus for belt conveyor | |
| CN106171174A (en) | A kind of magnetic seeding machine tool | |
| CN216731818U (en) | Suction nozzle type mechanical arm | |
| CN210286075U (en) | Single-belt type silicon wafer separating and conveying device | |
| KR100588420B1 (en) | The roller type tansporting apparatus with moving freely rail | |
| CN220218003U (en) | Soft magnetic grinding magnetic force diverging device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |