CN110387165A - It is used to prepare printing slurry, the thermocouple and preparation method thereof of thermocouple - Google Patents
It is used to prepare printing slurry, the thermocouple and preparation method thereof of thermocouple Download PDFInfo
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- CN110387165A CN110387165A CN201810350642.2A CN201810350642A CN110387165A CN 110387165 A CN110387165 A CN 110387165A CN 201810350642 A CN201810350642 A CN 201810350642A CN 110387165 A CN110387165 A CN 110387165A
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- printing paste
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- thermocouple
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- 238000007639 printing Methods 0.000 title claims abstract description 238
- 238000002360 preparation method Methods 0.000 title abstract description 18
- 239000002002 slurry Substances 0.000 title abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 239000002184 metal Substances 0.000 claims abstract description 58
- 239000000843 powder Substances 0.000 claims abstract description 37
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 49
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 36
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 34
- 238000011282 treatment Methods 0.000 claims description 23
- 239000011241 protective layer Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 17
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 14
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000000654 additive Substances 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 238000007641 inkjet printing Methods 0.000 claims description 12
- 239000003960 organic solvent Substances 0.000 claims description 12
- 230000000996 additive effect Effects 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 claims description 9
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910018135 Cu55Ni45 Inorganic materials 0.000 claims description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000004809 Teflon Substances 0.000 claims description 4
- 229920006362 Teflon® Polymers 0.000 claims description 4
- 238000007646 gravure printing Methods 0.000 claims description 4
- 238000007644 letterpress printing Methods 0.000 claims description 4
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- 229920003180 amino resin Polymers 0.000 claims description 3
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 3
- 239000002241 glass-ceramic Substances 0.000 claims description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000004447 silicone coating Substances 0.000 claims description 3
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- 150000005846 sugar alcohols Polymers 0.000 claims description 2
- 239000005010 epoxy-amino resin Substances 0.000 claims 1
- 239000005007 epoxy-phenolic resin Substances 0.000 claims 1
- 238000009529 body temperature measurement Methods 0.000 abstract description 25
- 230000035945 sensitivity Effects 0.000 abstract description 16
- 230000004044 response Effects 0.000 abstract description 14
- 239000006185 dispersion Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 description 11
- 238000007254 oxidation reaction Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- 238000007745 plasma electrolytic oxidation reaction Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000003792 electrolyte Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- -1 m-phenylenediamine, tetrabutyl Chemical group 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000007669 thermal treatment Methods 0.000 description 2
- 230000005678 Seebeck effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/103—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds of aldehydes, e.g. phenol-formaldehyde resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses printing slurry, thermocouples for being used to prepare thermocouple and preparation method thereof.The printing slurry includes metal powder, wherein the gross mass based on the printing slurry, the content of the metal powder are 75~90wt%；The partial size of the metal powder is 8~50 microns.The good dispersion of the printing slurry, adhesive force are good, at low cost as a result,；When being used to prepare thermocouple, printing, curing performance are excellent；It is formed by that thermocouple breakage ratio is low, temperature measurement accuracy is high, high sensitivity, thermal response speed is fast, stability is excellent.
Description
Technical Field
The invention relates to the technical field of temperature measurement, in particular to printing paste for preparing a thermocouple, the thermocouple and a preparation method of the thermocouple.
Background
The thermocouple is used as a common temperature measuring element, can convert a temperature signal into an electromotive force signal, and then converts the electromotive force signal into temperature through a secondary instrument. The basic principle is that two conductors made of different materials are combined together to form a closed loop, and if a temperature gradient exists at two contact points, a thermal electromotive force which is in a monotonic relation with the temperature difference exists in the loop, namely the seebeck effect. The thermocouple has higher measurement precision and temperature measurement range, is simple to prepare and low in price, and is widely applied to the field of temperature measurement. Among them, thin film thermocouples have been studied by researchers in recent years because of their advantages such as small volume and small heat capacity. The thin-film thermocouple not only can replace the traditional thermocouple sensor, but also is more suitable for non-invasive measurement of transient change temperature on the surface of an object and in small-gap places, and is widely applied to instantaneous temperature detection in the occasions of turbine blades, combustion chamber wall surfaces, aircraft surfaces, cutting processing, explosion and the like.
However, currently, there is still a need for improvement in printing pastes for preparing thermocouples, thermocouples and methods for preparing the same.
Disclosure of Invention
The present invention is based on the discovery and recognition by the inventors of the following facts and problems:
the inventor finds that the existing method for preparing the thin-film thermocouple generally has the problems of high preparation cost, high processing difficulty, low preparation efficiency and the like. The inventors have found that this is mainly due to the fact that the current methods of manufacturing thin film thermocouples mainly focus on Physical Vapor Deposition (PVD) methods such as vacuum evaporation, vacuum sputtering, and ion beam. The method needs to vacuumize the environment and then the thermocouple material is accumulated on the surface of the base material in an atomic mode, so that the preparation time is at least more than 2-4 hours, the processing difficulty is high, the preparation cost is high, and the improvement space of the processing efficiency is limited. The inventor finds that in recent years, the printed electronic technology is increasingly applied to the technical field of traditional processing and manufacturing, and the role in transparent conductive films, solar cells, light emitting and display devices, high mobility transistors and the like is increasingly shown, the technology is an innovative application of the traditional printing method in the technical field of electronic device manufacturing, and conductive paste or conductive ink is printed on the surface of a circuit board by means of printing, such as conductive silver paste and ITO, and the technology is widely applied to the technical field of electronics. The inventor surprisingly finds that the thermocouple is prepared by the printing electronic technology, namely, the pasty thermocouple material is prepared into the thermocouple by the traditional printing mode, so that the cost of a finished product can be greatly reduced, and the preparation speed and the preparation stability of the finished product can be greatly improved.
The present invention aims to alleviate or solve at least to some extent at least one of the above mentioned problems.
In one aspect of the present invention, a printing paste for preparing a thermocouple is provided. The printing paste includes a metal powder; wherein the content of the metal powder is 75-90 wt% based on the total mass of the printing paste; the particle size of the metal powder is 8-50 microns. Therefore, the printing paste has good dispersibility, good adhesion and low cost; when the printing ink is used for preparing a thermocouple, the printing and curing performances are excellent; the formed thermocouple has low disconnection rate, high temperature measurement precision, high sensitivity, high thermal response speed and excellent stability.
According to an embodiment of the invention, the metal powder comprises nickel, silver, copper, Pt90Rh10、Pt87Rh13、Pt70Rh30、Ni90Cr10、Pt94Rh6Platinum, Ni97Si3、Ni97Al3、Cu55Ni45And Ni94.5Si4.5At least one of Mg. Therefore, the performance of the printing paste can be further improved, and the prepared thermocouple is low in disconnection rate, high in temperature measurement precision, high in sensitivity, high in thermal response speed and excellent in stability.
According to an embodiment of the present invention, the printing paste includes: the metal powder; an adhesive; a curing agent; an additive; an organic solvent; wherein the content of the adhesive is 5-12 wt% based on the total mass of the printing paste; the content of the curing agent is 1-3 wt%; the content of the additive is 0.5-3 wt%; the content of the organic solvent is 2-5 wt%. Therefore, the printing paste has good dispersibility, good adhesion and low cost; when the printing paste is used for preparing the thermocouple, the printing and curing performances are excellent, the printing paste is suitable for preparing the thermocouple on various base materials, and the adhesion between the printing paste and the base materials is improved.
According to an embodiment of the present invention, the adhesive includes at least one of an epoxy resin, a phenolic resin, an amino resin, and a polyurethane; the curing agent comprises at least one of m-phenylenediamine, maleic anhydride, phthalic anhydride and dicyandiamide; the additive comprises at least one of tetrabutyl titanate, methylimidazole and polyamide wax; the organic solvent comprises at least one of butyl acetate, toluene, xylene, styrene, ethyl acetate, butyl acetate, polyhydric alcohol, dimethyl succinate, polyethylene glycol and N, N-dimethylformamide. Thereby, the performance of the printing paste can be further improved.
According to the embodiment of the invention, the content of the epoxy resin is 5-12 wt% based on the total mass of the printing paste; the content of the m-phenylenediamine is 1-3 wt%; the content of the tetrabutyl titanate is 0.5-3 wt%; the content of the butyl acetate is 2-5 wt%. Thereby, the performance of the printing paste can be further improved.
According to the embodiment of the invention, the viscosity of the printing paste is 8000-30000 mPa & s; the yield value of the printing paste is 0.005-0.02N; the specific heat capacity of the printing paste is 300-1500J/(kg.K); the thermal conductivity of the printing paste is 10-400W/(m.K). Therefore, the printing paste has good adhesion performance and excellent printing performance, and can be used for preparing thermocouples with low wire breakage rate, high temperature measurement precision, high sensitivity, high thermal response speed and excellent stability.
In another aspect of the invention, a method of making a thermocouple is provided. The method comprises the following steps: providing a first printing paste and a second printing paste, wherein the first printing paste and the second printing paste are respectively and independently the printing paste, and metal powder contained in the first printing paste and the second printing paste is different; providing a substrate; printing a first printing paste on a first target area of the base material in a printing mode, and performing first heat treatment to form a first electrode; printing a second printing paste on a second target area of the base material by adopting the printing mode, and performing second heat treatment to form a second electrode; forming a protective layer on one side of the first electrode and one side of the second electrode, which are far away from the base material; wherein the first electrode and the second electrode have at least one contact area therebetween. The thermocouple prepared by the method can be prepared by printing by using the printing paste described above, so that the thermocouple can have all the characteristics and advantages of the printing paste described above, and further description is omitted. Generally, the method is simple and convenient to operate, low in control precision requirement on process parameters, high in process feasibility, good in reliability, low in cost, high in production efficiency and suitable for large-scale production, and the prepared thermocouple is low in disconnection rate, high in temperature measurement precision, high in sensitivity, high in thermal response speed and excellent in stability.
According to an embodiment of the present invention, the printing means includes at least one of screen printing, gravure printing, letterpress printing, and inkjet printing. Thus, the method for preparing the thermocouple using the printing paste can be implemented by various printing methods.
According to the embodiment of the invention, the average thickness of the first electrode and the average thickness of the second electrode are respectively and independently 5-100 micrometers; the resistances of the first electrode and the second electrode are respectively independent and are not more than 100 ohms; the area of the contact area is 0.5-200 square millimeters. Therefore, the prepared thermocouple has the advantages of low disconnection rate, high temperature measurement precision, high sensitivity, high thermal response speed and excellent stability.
According to an embodiment of the present invention, the substrate includes one of ceramic, glass ceramics, and metal whose surface is subjected to an insulating treatment. Therefore, the method is suitable for preparing the thermocouples on various base materials in a printing mode, and the base materials are wide in source, easy to obtain and low in cost.
According to an embodiment of the present invention, the metal having an insulation-treated surface is prepared by: forming an insulating layer on a metal base to form the substrate; wherein a material forming the metal matrix includes at least one of an aluminum alloy, a titanium alloy, and a stainless steel alloy. Therefore, the prepared thermocouple has good temperature measurement effect, high stability and good adaptability to electrodes by using the metal with the insulated surface as the base material.
According to an embodiment of the present invention, the first heat treatment and the second heat treatment independently include: and preserving the heat for 15-60 minutes at the temperature of 150-450 ℃. Therefore, the printing paste can be completely cured to form the electrode, and the performance of the thermocouple prepared by the method is further improved.
According to an embodiment of the invention, the protective layer is a teflon or silicone coating; the thickness of the protective layer is 10-100 microns. Therefore, the protective layer can protect the thermocouple, damage to the thermocouple is avoided, the temperature measuring effect is not affected, the protective layer is not too thin to protect the thermocouple, and the temperature measuring accuracy of the thermocouple is not affected due to too thick thickness.
In yet another aspect of the present invention, a thermocouple is provided. The thermocouple includes: a substrate; a first electrode and a second electrode, both disposed on a first surface of the substrate, having at least one contact area therebetween, and formed by a printing method based on printing paste containing different metal powders; and the protective layer is arranged on one side of the first electrode and one side of the second electrode, which are far away from the base material. The thermocouple may be manufactured using the method described above, and thus may have all the features and advantages of the method described above, which will not be described herein again. In general, the thermocouple is simple and convenient to prepare, low in wire breakage rate, high in temperature measurement precision, high in sensitivity, high in thermal response speed and excellent in stability.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 shows a schematic flow diagram of a method of making a thermocouple according to one embodiment of the present invention;
FIG. 2 is a schematic view showing a partial structure of a thermocouple according to an embodiment of the present invention;
FIG. 3 is a schematic view showing a partial structure of a thermocouple according to another embodiment of the present invention;
FIG. 4 is a schematic view showing a partial structure of a thermocouple according to still another embodiment of the present invention;
FIG. 5 shows a physical photograph of a first mask and a second mask according to an embodiment of the present invention; and
fig. 6 is a schematic view showing a partial structure of a thermocouple according to an embodiment of the present invention.
Description of reference numerals:
100: a substrate; 210: a first electrode; 220: a second electrode; 300: and a protective layer.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In one aspect of the present invention, a printing paste for preparing a thermocouple is provided. The printing paste comprises metal powder, wherein the content of the metal powder is 75-90 wt% based on the total mass of the printing paste; the particle size of the metal powder is 8-50 microns. Therefore, the printing paste has good dispersibility, good adhesion and low cost; when the printing ink is used for preparing a thermocouple, the printing and curing performances are excellent; the formed thermocouple has low disconnection rate, high temperature measurement precision, high sensitivity, high thermal response speed and excellent stability.
According to an embodiment of the present invention, the printing paste includes: metal powder, adhesive, curing agent, additive and organic solvent as described above. Wherein based on the total mass of the printing paste, the content of the metal powder can be 75-90 wt%, and the content of the adhesive can be 5-12 wt%; the content of the curing agent can be 1-3 wt%; the content of the additive can be 0.5-3 wt%; the content of the organic solvent may be 2 to 5 wt%. Therefore, the printing paste has good dispersibility, good adhesion and low cost; when the printing paste is used for preparing the thermocouple, the printing and curing performances are excellent, the printing paste is suitable for preparing the thermocouple on various base materials, and the adhesion between the printing paste and the base materials is improved.
The inventor surprisingly finds that the thermocouple prepared by the printing paste in a printing mode not only can greatly reduce the cost of a finished product, but also can greatly improve the preparation speed and the preparation stability of the finished product. Specifically, the metal powder, the adhesive, the curing agent, the additive and the organic solvent are mixed according to the above ratio to prepare a printing slurry, and then the printing slurry is printed on the substrate in a printing mode to obtain a required pattern, wherein the printing pattern can be selected according to actual requirements, the printing mode and the printing frequency are not particularly limited, and the printing method can include at least one of screen printing, gravure printing, letterpress printing and inkjet printing; subsequently, heat-treating the printing paste to cure it; finally, a protective layer may be formed on the cured printing paste to finally prepare the desired thermocouple.
The respective components in the printing paste are explained in detail below:
according to an embodiment of the present invention, the material forming the metal powder is not particularly limited, and may be selected by those skilled in the art according to actual needs. For example, according to embodiments of the present invention, the metal powder may include nickel, silver, copper, Pt90Rh10、Pt87Rh13、Pt70Rh30、Ni90Cr10、Pt94Rh6Platinum, Ni97Si3、Ni97Al3、Cu55Ni45And Ni94.5Si4.5At least one of Mg. Therefore, the performance of the printing paste can be further improved, the prepared thermocouple has low wire breakage rate, and the wire breakage rate is measuredHigh temperature precision, high sensitivity, high thermal response speed and excellent stability.
According to the embodiment of the present invention, the type of the adhesive is not particularly limited, and may be selected by those skilled in the art according to actual needs. For example, according to an embodiment of the present invention, the adhesive includes at least one of an epoxy resin, a phenolic resin, an amino resin, and a polyurethane. The type of the curing agent according to the embodiment of the present invention is not particularly limited, and may be selected by those skilled in the art according to actual needs. For example, according to an embodiment of the present invention, the curing agent includes at least one of m-phenylenediamine, maleic anhydride, phthalic anhydride, and dicyandiamide. The type of the additive according to the embodiment of the present invention is not particularly limited, and may be selected by those skilled in the art according to actual needs. For example, according to an embodiment of the present invention, the additive includes at least one of tetrabutyltitanate, methylimidazole, and polyamide wax. The inventor finds that the addition of tetrabutyl titanate is beneficial to improving the adhesion between a structure (such as an electrode of a thermocouple) formed by the printing paste after subsequent heat treatment (such as sintering) and a base material, the addition of methylimidazole can improve the curing performance of the printing paste, and the addition of polyamide wax can prevent metal powder in the printing paste from settling. The type of the organic solvent according to the embodiment of the present invention is not particularly limited, and may be selected by those skilled in the art according to actual needs. For example, according to an embodiment of the present invention, the organic solvent includes at least one of butyl acetate, toluene, xylene, styrene, ethyl acetate, butyl acetate, polyol, dimethyl succinate, polyethylene glycol, and N, N-dimethylformamide. Thereby, the performance of the printing paste can be further improved.
According to the embodiment of the present invention, the viscosity of the printing paste is not particularly limited, and those skilled in the art can select the viscosity according to actual needs. For example, according to an embodiment of the present invention, the viscosity of the printing paste may be 8000 to 30000mPa · s. Therefore, the printing paste has moderate viscosity and good film forming property in subsequent printing. The yield value of the printing paste according to the embodiment of the present invention is not particularly limited and may be selected by those skilled in the art according to actual needs. For example, according to an embodiment of the present invention, the yield value of the printing paste may be 0.005 to 0.02N. Therefore, the printing paste has a moderate yield value and good film forming property in subsequent printing. According to the embodiment of the present invention, the specific heat capacity of the printing paste is not particularly limited, and may be selected by those skilled in the art according to actual needs. For example, according to an embodiment of the present invention, the specific heat capacity of the printing paste may be 300 to 1500J/(kg. K). According to the embodiment of the present invention, the thermal conductivity of the printing paste is not particularly limited, and may be selected by those skilled in the art according to actual needs. For example, according to an embodiment of the present invention, the thermal conductivity of the printing paste may be 10 to 400W/(mK). Therefore, when the viscosity, yield value, specific heat capacity and thermal conductivity of the printing paste are in the ranges, the printing paste has good adhesion performance and excellent printing performance, and can be used for preparing thermocouples with low wire breakage rate, high temperature measurement precision, high sensitivity, high thermal response speed and excellent stability.
According to an embodiment of the present invention, the printing paste may include the above metal powder, epoxy resin, m-phenylenediamine, tetrabutyl titanate, and butyl acetate, wherein the content of the metal powder is 75 to 90 wt%, the content of the epoxy resin is 5 to 12 wt%, the content of the m-phenylenediamine is 1 to 3 wt%, the content of the tetrabutyl titanate is 0.5 to 3 wt%, and the content of the butyl acetate is 2 to 5 wt%, based on the total mass of the printing paste. Thereby, the performance of the printing paste can be further improved.
In another aspect of the invention, a method of making a thermocouple is provided. The thermocouple prepared by the method can be prepared by printing by using the printing paste described above, so that the thermocouple can have all the characteristics and advantages of the printing paste described above, and further description is omitted. Generally, the method is simple and convenient to operate, low in control precision requirement on process parameters, high in process feasibility, good in reliability, low in cost, high in production efficiency and suitable for large-scale production, and the prepared thermocouple is low in disconnection rate, high in temperature measurement precision, high in sensitivity, high in thermal response speed and excellent in stability. According to an embodiment of the invention, with reference to fig. 1, the method comprises:
s100: providing a first printing paste and a second printing paste
In this step, the first printing paste and the second printing paste are provided independently of each other as the printing paste described above, wherein the first printing paste and the second printing paste contain different metal powders. As mentioned above, the first printing paste and the second printing paste may be obtained by mixing different metal powders and adhesives, curing agents, additives, and organic solvents according to the above-mentioned ratio. According to an embodiment of the present invention, the first printing paste and the metal powder in the first printing paste are selected from nickel, silver, copper, Pt90Rh10、Pt87Rh13、Pt70Rh30、Ni90Cr10、Pt94Rh6Platinum, Ni97Si3、Ni97Al3、Cu55Ni45And Ni94.5Si4.5Two different materials of Mg may be used, and the combination thereof is not particularly limited, and for example, Pt may be selected90Rh10Forming a first printing paste, selecting Pt87Rh13A second printing paste is formed.
S200: providing a substrate
In this step, the specific type of the substrate is not particularly limited and may be selected by those skilled in the art according to actual needs, and for example, the substrate may include one of ceramic, glass ceramics, and metal whose surface is subjected to an insulating treatment. Therefore, the method is suitable for preparing the thermocouples on various base materials in a printing mode, and the base materials are wide in source, easy to obtain and low in cost. It should be noted that, the sequence of the steps of providing the first printing paste and the second printing paste and the step of providing the base material is not particularly limited, and the first printing paste and the second printing paste may be provided first, and then the base material is provided; or providing the base material first, and then providing the first printing paste and the second printing paste.
According to the embodiment of the invention, when the base material is ceramic or microcrystalline glass, in order to further improve the performance of preparing the thermocouple, the ceramic or microcrystalline glass may be pretreated before preparing the thermocouple, and specifically, the pretreatment may include sanding treatment and cleaning treatment.
According to an embodiment of the present invention, the metal having an insulation-treated surface may be prepared by: an insulating layer is formed on the metal base to form a base material. Among them, the specific material forming the metal base is not particularly limited, and may include at least one of an aluminum alloy, a titanium alloy, and a stainless steel alloy, for example. Therefore, the prepared thermocouple has good temperature measurement effect, high stability and good adaptability to electrodes by using the metal with the insulated surface as the base material.
The following describes in detail a specific manner of forming an insulating layer on a metal base to form a substrate:
according to the embodiment of the invention, firstly, the metal matrix is subjected to sanding treatment and is cleaned, and then the insulating layer is formed on the surface of the metal matrix, and the insulating layer can be formed by performing oxidation treatment on the metal matrix. The specific type of oxidation treatment is not particularly limited, and those skilled in the art can select different oxidation treatment processes according to the requirements of the workpiece. For example, according to an embodiment of the present invention, the oxidation treatment may be an anodic oxidation treatment, and when the anodic oxidation treatment is performed, the specific type of the electrolyte to be disposed, the temperature of the electrolyte, the reaction time of the anodic oxidation treatment, and the voltage range to be used are not particularly limited. Therefore, the anodic oxidation treatment can be simply and conveniently carried out, and the performance of the prepared thermocouple is further improved. Alternatively, according to the embodiment of the present invention, the oxidation treatment may be micro-arc oxidation, and when the micro-arc oxidation treatment is performed, the specific type of the configured electrolyte, the temperature of the electrolyte, the reaction time of the micro-arc oxidation treatment, and the voltage range used are not particularly limited. Therefore, micro-arc oxidation treatment can be simply and conveniently carried out, and the performance of the prepared thermocouple is further improved. More specifically, when the metal substrate is an aluminum alloy, an insulating layer of aluminum oxide may be formed on the surface of the aluminum alloy by anodic oxidation or micro-arc oxidation. The thickness of the insulating layer formed on the metal substrate according to the embodiment of the present invention is not particularly limited, and may be selected by those skilled in the art according to actual needs. For example, according to the embodiment of the invention, the thickness of the insulating layer can be 20-200 microns. Under the condition of the thickness, the insulating layer has stronger binding force with the metal matrix, and simultaneously has excellent insulating property, so that the performance of the thermocouple can be further improved.
S300: forming a first electrode
In this step, referring to fig. 2 (a) is a schematic cross-sectional structure, and fig. 2 (b) is a schematic plan-view structure), a first printing paste is printed on a first target region of the substrate 100 by a printing method, and after a first heat treatment, the first printing paste on the first target region is cured to form the first electrode 210.
According to an embodiment of the present invention, the specific type of printing method employed is not particularly limited, and only that the first electrode 210 can be formed after the heat treatment. For example, according to an embodiment of the present invention, the printing means may include at least one of screen printing, gravure printing, letterpress printing, and inkjet printing. Thus, the method for preparing the thermocouple using the printing paste can be implemented by various printing methods. According to the embodiment of the present invention, the temperature and time for performing the first heat treatment on the first printing paste are not particularly limited, and the first printing paste is cured to form the first electrode 210. For example, according to an embodiment of the present invention, the first heat treatment includes: and preserving the heat for 15-60 minutes at the temperature of 150-450 ℃. Therefore, the printing paste can be completely cured to form the first electrode, and the performance of the thermocouple prepared by the method is further improved.
In order to further improve the production efficiency of the thermocouple preparation method, before printing the first printing paste, the area of the base material 100 except the first target area may be covered with a gummed paper, then the first printing paste is printed in the first target area, after the first printing paste is primarily dried, the gummed paper is finally torn off, and after heat treatment, the first printing paste is cured to form the first electrode 210. Therefore, the production efficiency can be improved, and the first printing paste can not pollute the place except the first target area in the printing process.
According to the embodiment of the present invention, the first electrode 210 is obtained by printing the first printing paste and curing, and thus, the specific material of the first electrode is formed by the metal powder in the first printing paste, i.e. the material forming the first electrode may also include nickel, silver, copper, Pt90Rh10、Pt87Rh13、Pt70Rh30、Ni90Cr10、Pt94Rh6Platinum, Ni97Si3、Ni97Al3、Cu55Ni45And Ni94.5Si4.5At least one of Mg.
According to the embodiment of the present invention, the specific shape and thickness of the first electrode 210 are not particularly limited, and those skilled in the art can adjust the printing process, and after the heat treatment, the first printing paste is cured to obtain the desired shape and thickness of the first electrode 210. For example, referring to fig. 2 and 5, when the inkjet printing method is used, a first mask (e.g., a shown in fig. 5) may be used to cover the substrate 100, and then the inkjet printing method is performed to spray the first printing paste, and after the thermal treatment, the hollow portion (the first target region) of the first mask forms the first electrode 210, that is, the first electrode 210 may determine the shape of the first electrode 210 obtained by final curing according to the shape of the mask, and the thickness of the first electrode 210 obtained by final curing may be determined according to the spraying amount of the first printing paste sprayed by the inkjet printing. According to an embodiment of the present invention, the average thickness of the first electrode 210 may be 5 to 100 μm. In some embodiments of the present invention, the average thickness of the first electrode 210 may be 10 microns, 30 microns, 50 microns, 80 microns, 100 microns. Therefore, the prepared thermocouple is good in temperature measuring effect, so that the first electrode 210 has higher reliability and better wear resistance, is better in uniformity and is more attractive visually. According to an embodiment of the present invention, the resistance of the first electrode 210 is not greater than 100 ohms. In some embodiments of the present invention, the resistance of the first electrode 210 may be 10 ohms, 20 ohms, 40 ohms, 60 ohms, 80 ohms, 100 ohms. Therefore, the prepared thermocouple has good conductivity, high sensitivity, good temperature measurement effect and high thermal response speed.
S400: forming a second electrode
In this step, referring to fig. 3 (a) is a schematic cross-sectional structure, fig. 3 (b) is a schematic plan-view structure) and fig. 4 (a) is a schematic cross-sectional structure, fig. 4 (b) is a schematic plan-view structure), a second printing paste is printed on a second target region of the substrate 100 in a printing manner, and after a second heat treatment, the second electrode 220 is formed. According to an embodiment of the present invention, the printing method for forming the second electrode 220 may be the same as the printing method for forming the first electrode 210, and is not described herein again. According to the embodiment of the present invention, the temperature and time for performing the second heat treatment on the second printing paste are not particularly limited, and the second printing paste is cured to form the second electrode 220. For example, according to an embodiment of the present invention, the second heat treatment includes: and preserving the heat for 15-60 minutes at the temperature of 150-450 ℃. Therefore, the printing paste can be completely cured to form the second electrode 220, and the performance of the thermocouple prepared by the method is further improved. It should be noted that, the sequence of the step of forming the first electrode and the step of forming the second electrode is not particularly limited, and the first electrode may be formed first, and then the second electrode may be formed; or the second electrode is formed first and then the first electrode is formed.
In order to further improve the production efficiency of the thermocouple preparation method, before printing the second printing paste, the area of the base material except the second target area may be covered with a gummed paper, then the second printing paste is printed in the second target area, after the second printing paste is primarily dried, the gummed paper is finally torn off, and after heat treatment, the second printing paste is cured to form the second electrode 220. Therefore, the production efficiency can be improved, and the second printing paste can not pollute the place except the second target area in the printing process.
According to embodiments of the present inventionThe second electrode 220 is obtained by printing the second printing paste and curing, and thus, the specific material of the second electrode 220 is formed by the metal powder in the second printing paste, i.e. the material forming the second electrode may also include nickel, silver, copper, Pt90Rh10、Pt87Rh13、Pt70Rh30、Ni90Cr10、Pt94Rh6Platinum, Ni97Si3、Ni97Al3、Cu55Ni45And Ni94.5Si4.5At least one of Mg. According to an embodiment of the present invention, the metal powder contained in the first printing paste and the second printing paste are different, and thus, the materials of the first electrode 210 and the second electrode 220 are formed differently. According to the embodiment of the present invention, the first electrode 210 and the second electrode 220 are not particularly limited as long as they are different materials selected from two of the above materials, and the combination thereof is not particularly limited, for example, in some specific embodiments of the present invention, Pt is selected90Rh10Forming a first electrode, selecting Pt87Rh13Forming a second electrode. Therefore, the prepared thermocouple is good in temperature measurement effect and high in stability and sensitivity.
According to the embodiment of the present invention, the specific shape and thickness of the second electrode 220 are not particularly limited, and those skilled in the art can adjust the printing process, and after the heat treatment, the second printing paste is cured to obtain the desired shape and thickness of the second electrode 220. For example, referring to fig. 3 to 5, when the inkjet printing method is used, a second mask (e.g., b shown in fig. 5) may be used to cover the substrate 100, and then the inkjet printing method is performed to spray the second printing paste, and after the thermal treatment, the hollow portion (the second target region) of the second mask forms the second electrode 220, that is, the shape of the second electrode 220 obtained by final curing may be determined according to the shape of the mask, and the thickness of the second electrode 220 obtained by final curing may be determined according to the spraying amount of the inkjet printing sprayed second printing paste. According to an embodiment of the present invention, the second electrode 220 may have an average thickness of 5 to 100 μm. In some embodiments of the present invention, the average thickness of the second electrode 220 may be 10 microns, 30 microns, 50 microns, 80 microns, 100 microns. Therefore, the prepared thermocouple is good in temperature measurement effect, the second electrode 220 has higher reliability and better wear resistance, the uniformity is better, and the appearance is more attractive visually. According to an embodiment of the present invention, the resistance of the second electrode 220 is not greater than 100 ohms. In some embodiments of the present invention, the resistance of the second electrode 220 may be 10 ohms, 20 ohms, 40 ohms, 60 ohms, 80 ohms, 100 ohms. Therefore, the prepared thermocouple has good conductivity, high sensitivity, good temperature measurement effect and high thermal response speed.
According to an embodiment of the present invention, the first electrode 210 and the second electrode 220 formed by printing and curing have at least one contact area therebetween, and as described above, the first electrode 210 and the second electrode 220 are formed of different materials. Specifically, referring to fig. 3 or 4, a schematic structural diagram of the second electrode 220 formed on the surface of the substrate 100 is shown. According to an embodiment of the present invention, the contact area may include only a contact surface (as shown in fig. 3 a) perpendicular to the substrate 100; alternatively, the contact region may include both a contact surface perpendicular to the substrate 100 and a contact surface parallel to the substrate 100 (B shown in fig. 4 (a)). According to the embodiment of the present invention, the area of the contact region (e.g., a shown in fig. 3) is not particularly limited, and one skilled in the art can flexibly select the area as needed as long as the requirement is satisfied. In some embodiments of the invention, the area of the contact region may be 0.5 to 200 square millimeters. In some embodiments of the invention, the contact area may have an area of 0.5 mm, 1 mm, 10 mm, 50 mm, 100 mm, 150 mm, 200 mm. Therefore, the prepared thermocouple has good linearity, large thermoelectromotive force and high sensitivity, and the reliability of temperature measurement is higher on the premise of ensuring accurate judgment of the position of the temperature measurement point.
It should be noted that, by preparing the first electrode 210 and the second electrode 220 by printing, a more complex thermocouple pattern can be realized by performing a graphic design on a mask during printing, that is, according to different product requirements, the present invention can adjust a printing process by a reasonable design of the mask to print different device structures, thereby ensuring printing dimensional accuracy, avoiding smearing of a printing material (substrate), and further performing printing again after the printing paste is dried, thereby realizing a multi-layer structure, printing a complex electronic structure, for example, printing a first printing paste and a second printing paste respectively, and forming the first electrode 210 and the second electrode 220 after curing. In addition, the electrode is prepared by adopting a printing mode, the process is simple, the electrode is suitable for printing on various base materials, and the electrode has the characteristics of large area, high efficiency, low cost, low pollution and the like of a printing preparation technology, wherein the cost of a finished product is greatly reduced by the special advantages of continuity and large batch of the printing mode, the preparation speed which is difficult to achieve by physical vapor deposition can be realized, the preparation time of the electrode can be improved to several minutes from two or three hours originally, and the preparation efficiency is obviously improved.
S500: forming a protective layer
In the step, a passivation layer is formed on the first electrode 210 and the second electrode 220 away from the substrate 100. For example, referring to fig. 6, a protection layer 300 is formed on the first electrode 210 away from the substrate 100.
According to the embodiment of the invention, the protective layer 300 is formed to cover the electrode, so that the thermocouple can be protected, and the temperature measurement effect is prevented from being influenced by damage of the thermocouple. The specific material of the protective layer 300 is not particularly limited according to an embodiment of the present invention, and one skilled in the art may flexibly select it as needed as long as the requirement is satisfied. In some embodiments of the present invention, the specific material type of the protective layer 300 may be teflon or a silicone coating.
The thickness of the protective layer 300 is not particularly limited according to an embodiment of the present invention, and may be flexibly selected as needed by those skilled in the art as long as the requirements are satisfied. In some embodiments of the present invention, the thickness of the protective layer 300 may be 10-100 microns. In some embodiments of the present invention, the thickness of the protective layer may be 10 microns, 30 microns, 50 microns, 80 microns, 100 microns. Therefore, the thickness of the protective layer is selected, so that the thermocouple cannot be protected due to the fact that the thickness is too thin, and the temperature measurement precision of the thermocouple cannot be influenced due to the fact that the thickness is too thick.
In yet another aspect of the present invention, a thermocouple is provided. According to an embodiment of the present invention, referring to fig. 1 to 4, and 6, the thermocouple includes: a substrate 100, a first electrode 210, a second electrode 220, and a protective layer 300. According to an embodiment of the present invention, the first electrode 210 and the second electrode 220 are both disposed on the first surface of the substrate 100, the first electrode 210 and the second electrode 220 have at least one contact region therebetween, and the first electrode 210 and the second electrode 220 are formed by a printing method based on printing paste containing different metal powders. According to the embodiment of the invention, the passivation layer 300 is disposed on the first electrode 210 and the second electrode 220 on the side away from the substrate. The thermocouple may be manufactured by the above-described method or by printing using the above-described printing paste, and thus may have all the features and advantages of the above-described method or printing paste, which will not be described herein again. In general, the thermocouple is simple and convenient to prepare, low in wire breakage rate, high in temperature measurement precision, high in sensitivity, high in thermal response speed and excellent in stability. According to the embodiment of the invention, the application field of the thermocouple is not particularly limited, for example, the thermocouple can be arranged on the surface of a cooker, the surface of a baking tray, the inner surface of a water heater and the like, and the thermocouple can be close to the surface of an object to be measured to the greatest extent, so that the real-time and accurate temperature measurement function can be realized, and the product performance and the user experience are good.
Examples of the present invention are described in detail below:
example 1:
(1) providing a first printing paste and a second printing paste
First printing paste: the metal powder being Ni90Cr10Epoxy resin, m-phenylenediamine, tetrabutyl titanate and butyl acetate, wherein based on the total mass of the first printing paste, Ni90Cr10Is 80 wt%, and the content of the epoxy resin is 11 wt%Percent, 3 percent of m-phenylenediamine, 3 percent of tetrabutyl titanate and 3 percent of butyl acetate, and uniformly mixing to obtain the first printing paste.
And (3) second printing paste: the metal powder being Ni97Si3Epoxy resin, m-phenylenediamine, tetrabutyl titanate and butyl acetate, wherein based on the total mass of the first printing paste, Ni97Si3The content of (A) is 80 wt%, the content of epoxy resin is 11 wt%, the content of m-phenylenediamine is 3 wt%, the content of tetrabutyl titanate is 3 wt%, and the content of butyl acetate is 3 wt%.
(2) Providing a substrate
The surface of the aluminum alloy (200 x 400 x 2mm) is subjected to sanding treatment and cleaning treatment, and then an aluminum oxide insulating layer, namely a dense oxide layer with the thickness of 40um, is formed in advance in the area where the thermocouple needs to be prepared through anodic oxidation treatment.
(3) Forming a first electrode
Pasting gummed paper on an area (except a first target area) of a substrate where a first electrode does not need to be formed, covering a first mask plate with a hollowed first electrode pattern on the surface of the aluminum alloy subjected to insulation treatment, spraying first printing slurry on the first target area by adopting an ink jet printing method, tearing off the gummed paper after the first printing slurry is primarily dried, and then preserving heat at 200 ℃ for 50min to enable the gummed paper to be completely cured. The average resistance thickness of the first electrode formed after baking was 35 μm and the resistance was 90 ohms.
(4) Forming a second electrode
Pasting gummed paper on the area (except the second target area) of the substrate where the second electrode does not need to be formed, covering a second mask plate with hollowed second electrode patterns on the aluminum alloy with the surface subjected to insulation treatment, wherein the hollowed patterns on the second mask plate and the hollowed patterns on the first mask plate have an overlapping area with the area of 2 x 2mm2And forming a contact area in the overlapping area, namely a temperature measuring point. Spraying the second printing paste on the second target area by adopting an ink jet printing method, tearing off the gummed paper after the second printing paste is primarily dried, and then 200 DEGAnd preserving the temperature for 50min at the temperature to completely cure the epoxy resin. The average resistance thickness of the first electrode formed after drying was 45 μm and the resistance was 15 ohms.
(5) Forming a protective layer
And a layer of Teflon with the average thickness of 20 micrometers is formed on the side, away from the substrate, of the first electrode and the second electrode.
In the description of the present invention, the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention but do not require that the present invention must be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description herein, references to the description of "one embodiment," "another embodiment," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction. In addition, it should be noted that the terms "first" and "second" in this specification are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (14)
1. A printing paste for preparing a thermocouple, comprising a metal powder;
wherein,
the content of the metal powder is 75-90 wt% based on the total mass of the printing paste;
the particle size of the metal powder is 8-50 microns.
2. The printing paste of claim 1, wherein the metal powder comprises nickel, silver, copper, Pt90Rh10、Pt87Rh13、Pt70Rh30、Ni90Cr10、Pt94Rh6Platinum, Ni97Si3、Ni97Al3、Cu55Ni45And Ni94.5Si4.5At least one of Mg.
3. The printing paste as claimed in claim 1, comprising:
the metal powder;
an adhesive;
a curing agent;
an additive;
an organic solvent;
wherein the content of the adhesive is 5-12 wt% based on the total mass of the printing paste; the content of the curing agent is 1-3 wt%; the content of the additive is 0.5-3 wt%; the content of the organic solvent is 2-5 wt%.
4. The printing paste of claim 3,
the adhesive comprises at least one of epoxy resin, phenolic resin, amino resin and polyurethane;
the curing agent comprises at least one of m-phenylenediamine, maleic anhydride, phthalic anhydride and dicyandiamide;
the additive comprises at least one of tetrabutyl titanate, methylimidazole and polyamide wax;
the organic solvent comprises at least one of butyl acetate, toluene, xylene, styrene, ethyl acetate, butyl acetate, polyhydric alcohol, dimethyl succinate, polyethylene glycol and N, N-dimethylformamide.
5. The printing paste as claimed in claim 4, wherein the content of the epoxy resin is 5 to 12 wt% based on the total mass of the printing paste; the content of the m-phenylenediamine is 1-3 wt%; the content of the tetrabutyl titanate is 0.5-3 wt%; the content of the butyl acetate is 2-5 wt%.
6. The printing paste of claim 3,
the viscosity of the printing paste is 8000-30000 mPa & s;
the yield value of the printing paste is 0.005-0.02N;
the specific heat capacity of the printing paste is 300-1500J/(kg.K);
the thermal conductivity of the printing paste is 10-400W/(m.K).
7. A method of making a thermocouple, comprising:
providing a first printing paste and a second printing paste, wherein the first printing paste and the second printing paste are respectively independent of the printing paste of any one of claims 1 to 6, and metal powder contained in the first printing paste and the second printing paste are different;
providing a substrate;
printing a first printing paste on a first target area of the base material in a printing mode, and performing first heat treatment to form a first electrode;
printing a second printing paste on a second target area of the base material by adopting the printing mode, and performing second heat treatment to form a second electrode;
forming a protective layer on one side of the first electrode and one side of the second electrode, which are far away from the base material;
wherein,
the first electrode and the second electrode have at least one contact area therebetween.
8. The method of claim 7, wherein the printing comprises at least one of screen printing, gravure printing, letterpress printing, and inkjet printing.
9. The method of claim 7, wherein the average thickness of the first electrode and the second electrode is independently 5 to 100 micrometers;
the resistances of the first electrode and the second electrode are respectively independent and are not more than 100 ohms;
the area of the contact area is 0.5-200 square millimeters.
10. The method of claim 7, wherein the substrate comprises one of ceramic, glass-ceramic, and metal having an insulating surface.
11. The method according to claim 10, wherein the metal having the surface subjected to the insulation treatment is prepared by:
forming an insulating layer on a metal base to form the substrate;
wherein a material forming the metal matrix includes at least one of an aluminum alloy, a titanium alloy, and a stainless steel alloy.
12. The method of claim 7, wherein the first and second heat treatments are each independently comprised of:
and preserving the heat for 15-60 minutes at the temperature of 150-450 ℃.
13. The method of claim 7, wherein the protective layer is a teflon or silicone coating;
the thickness of the protective layer is 10-100 microns.
14. A thermocouple, comprising:
a substrate;
a first electrode and a second electrode, both disposed on a first surface of the substrate, having at least one contact area therebetween, and formed by a printing method based on printing paste containing different metal powders;
and the protective layer is arranged on one side of the first electrode and one side of the second electrode, which are far away from the base material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810350642.2A CN110387165A (en) | 2018-04-18 | 2018-04-18 | It is used to prepare printing slurry, the thermocouple and preparation method thereof of thermocouple |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810350642.2A CN110387165A (en) | 2018-04-18 | 2018-04-18 | It is used to prepare printing slurry, the thermocouple and preparation method thereof of thermocouple |
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| CN110387165A true CN110387165A (en) | 2019-10-29 |
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Cited By (1)
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| WO2023126686A1 (en) * | 2021-12-30 | 2023-07-06 | Bosch Car Multimedia Portugal, S.A. | PRINTABLE INK FORMULATION BASED ON NiCr AND NiAl ALLOYS AND METHOD FOR PRODUCING THE PRINTABLE INK FORMULATION |
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| CN103474568A (en) * | 2013-08-27 | 2013-12-25 | 中国计量学院 | Preparation method of film thermocouple based on electronic printing technology |
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| WO2023126686A1 (en) * | 2021-12-30 | 2023-07-06 | Bosch Car Multimedia Portugal, S.A. | PRINTABLE INK FORMULATION BASED ON NiCr AND NiAl ALLOYS AND METHOD FOR PRODUCING THE PRINTABLE INK FORMULATION |
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