CN110373140B - Epoxy adhesive and preparation method thereof - Google Patents
Epoxy adhesive and preparation method thereof Download PDFInfo
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- CN110373140B CN110373140B CN201910737606.6A CN201910737606A CN110373140B CN 110373140 B CN110373140 B CN 110373140B CN 201910737606 A CN201910737606 A CN 201910737606A CN 110373140 B CN110373140 B CN 110373140B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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Abstract
The invention provides an epoxy adhesive, which can solve the problem that the mechanical properties such as toughness, strength and the like of the epoxy adhesive cannot be obviously improved by using the existing filler. The curing agent is prepared from epoxy resin, a curing agent and a filler in proportion, wherein the filler is a graphene nanosheet, and the graphene nanosheet is uniformly dispersed in the epoxy resin and the curing agent. Meanwhile, the invention also provides a preparation method of the epoxy adhesive.
Description
Technical Field
The invention relates to the field of structural adhesives, in particular to the technical field of modification of epoxy adhesives in structural adhesives, and specifically relates to an epoxy adhesive and a preparation method thereof.
Background
The adhesive structure is widely used in various fields such as civil engineering, aerospace, medicine and the like because of its advantages of light weight, no damage to the continuity of the adhered member, uniform distribution of adhesive stress and the like. The actual strength of the glued joint structure is mainly determined by the properties of the glued joint piece and the glued joint layer, the glued joint layer is usually the weakest part of the whole glued joint structure and is most easily damaged, and therefore, the exploration of the related properties of the glue at the glued joint part is of great significance.
The epoxy adhesive has excellent mechanical property and adhesive property, and is a high molecular thermosetting material widely applied in recent years. It is a curing system prepared by epoxy resin (as a matrix) and a curing agent according to a certain proportion. The molecular structure of the epoxy resin is characterized in that a molecular chain contains active epoxy groups, and the epoxy groups can be positioned at the tail ends, in the middle or in a ring structure. Because the molecular structure contains active epoxy groups, the epoxy groups can generate cross-linking reaction with various curing agents to form insoluble high polymers with a three-dimensional network structure. The cured epoxy resin (namely, epoxy adhesive) has good physical and chemical properties, excellent bonding strength to the surfaces of metal and non-metal materials, good dielectric property, small deformation shrinkage, good stability, high hardness, good flexibility, and stability to alkali and most solvents, but is difficult to meet engineering technical requirements due to the defects of large brittleness, poor fatigue resistance, poor crack propagation resistance and the like, so that the epoxy resin needs to be modified.
At present, scholars at home and abroad mostly adopt fillers such as rubber elastomers, thermoplastic resins and the like to improve the performance of the epoxy adhesive. However, there are many problems, for example, the use of rubber elastomer modified epoxy resin greatly improves the toughness of the material, but sacrifices the strength and other mechanical properties of the material. The thermoplastic resin can improve the toughness of the epoxy resin and make up for the defect of toughening the epoxy resin by the rubber elastomer, but the thermoplastic resin has poor solubility and increases the viscosity of an epoxy resin system, so that the processing technology becomes complicated.
Disclosure of Invention
Aiming at the technical problem that the mechanical properties such as toughness, strength and the like of the epoxy adhesive cannot be obviously improved by using the existing filler, the invention provides the epoxy adhesive, the mechanical properties such as toughness, strength and the like of which are obviously superior to those of the conventional epoxy adhesive, and simultaneously, the invention also provides a preparation method of the epoxy adhesive, and the preparation process is simple.
The technical scheme is as follows:
the epoxy adhesive is prepared from epoxy resin, a curing agent and a filler in proportion, and is characterized in that: the filler graphene nanosheets are uniformly dispersed in the epoxy resin and the curing agent.
It is further characterized in that:
the mass of the graphene nanosheets accounts for 0.25-0.75% of the total mass of the epoxy resin and the curing agent.
The number of layers of the layered structure in the graphene nanosheet is 1-19.
The preparation method of the epoxy adhesive is characterized by comprising the following steps: and fully and uniformly mixing the graphene nanosheets and the epoxy resin to obtain graphene nanosheet modified epoxy resin, adding the curing agent into the graphene nanosheet modified epoxy resin, and fully and uniformly mixing the curing agent and the graphene nanosheet modified epoxy resin to finally obtain the graphene nanosheet modified epoxy adhesive.
It is further characterized in that:
fully stripping and dispersing the graphene nanosheets before fully and uniformly mixing the graphene nanosheets and the epoxy resin.
The method for fully stripping and dispersing the graphene nanosheets comprises the following steps: dissolving the graphene nanosheets in HPLC acetone, sealing a container containing the graphene nanosheets and the HPLC acetone, and then placing the container into a water bath for ultrasonic oscillation, wherein the ultrasonic oscillation time is 6-7 h, and the water bath temperature is 20-30 ℃.
And dissolving each 2mg of the graphene nanosheets in 0.8-1.2 ml of HPLC acetone.
The method for fully mixing the graphene nanosheets and the epoxy resin comprises the following steps: adding the epoxy resin into the mixture of the graphene nanosheets and the HPLC acetone subjected to ultrasonic oscillation, stirring the mixture by using a magnetic stirrer, primarily mixing the mixture by stirring at normal temperature, heating to 100 ℃, continuously stirring, evaporating the HPLC acetone in the mixture, and evaporating the HPLC acetone to dryness to obtain the graphene nanosheet modified epoxy resin.
The whole evaporation process is controlled within 3 h.
The method for fully mixing the curing agent and the graphene nanosheet modified epoxy resin comprises the following steps: adding the curing agent into the graphene nanosheet modified epoxy resin, putting the graphene nanosheet modified epoxy resin into a planetary mixer, wherein the rotating speed of a main shaft of the planetary mixer is 1800rpm, the mixing time is 90s, and vacuumizing is performed while mixing to finish the preparation of the graphene nanosheet modified epoxy adhesive.
The invention has the beneficial effects that:
according to the epoxy adhesive, the filler is the graphene nanosheet, and the graphene has excellent mechanical properties, so that the graphene can help bear a certain load after being dispersed in the epoxy resin and the curing agent, the effect of transferring force and supporting a structure is achieved, and the mechanical properties such as toughness and strength of the epoxy adhesive are greatly improved; in addition, the dispersed graphene nanosheets can reduce the free volume in the molecular chain of the epoxy resin, so that the thermal stability of the epoxy adhesive is improved, and the functional groups (namely hydroxyl or carboxyl) attached to the surfaces of the graphene nanosheets can form stable chemical bonding with the epoxy groups on the epoxy resin, so that the bonding force between the filler and the epoxy resin is improved.
According to the preparation method of the epoxy adhesive, the graphene nanosheets and the epoxy resin are fully and uniformly mixed, so that the graphene nanosheets are uniformly distributed in the epoxy resin and form stable chemical combination with the epoxy resin, and the free volume in the molecular chain of the epoxy resin is reduced; and finally, fully and uniformly mixing the curing agent and the graphene nanosheet modified epoxy resin to prepare the final graphene nanosheet modified epoxy adhesive, so that the uniformly dispersed graphene nanosheets can effectively improve the mechanical properties such as strength, toughness and the like of the epoxy adhesive.
Drawings
FIG. 1 is a front view of a single lap joint glue joint construction;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a tensile force-displacement curve for shear failure of a single lap joint bond structure prepared using the epoxy adhesive of the present invention;
FIG. 4 is an error bar graph of the maximum tensile force required for shear failure of a single lap joint bond structure made using the epoxy adhesive of the present invention;
fig. 5 is a tensile shear stress-displacement curve for a single lap joint bonded structure prepared using the epoxy adhesive of the present invention.
Detailed Description
The epoxy adhesive is prepared by epoxy resin, a curing agent and a filler in proportion, wherein the proportion relation of the epoxy resin and the curing agent is in accordance with the conventional proportion relation of the existing epoxy adhesive, the filler is a graphene nanosheet, the number of layers of a layered structure in the graphene nanosheet is 1-19, the mass of the graphene nanosheet accounts for 0.25-0.75% of the total mass of the epoxy resin and the curing agent, and the graphene nanosheet is uniformly dispersed in the epoxy resin and the curing agent.
The common graphene nanosheet is formed by stacking dozens of layers of graphene, the graphene is in a two-dimensional layered structure, the thickness of single-layer graphene is only 0.34nm, the thickness of the graphene nanosheet can be thinner by controlling the number of layers of the layered structure in the graphene nanosheet to be 1-19 layers, and therefore stress concentration points are not easily formed after the graphene nanosheet is dispersed in epoxy resin and a curing agent.
Taking WD3003 building structure adhesive of Haokada chemical new materials Co., Ltd as an example, the mass ratio of the epoxy resin to the curing agent in the building structure adhesive is 3:1, when the building structure adhesive is modified by using graphene nanosheets, the mass ratio of the epoxy resin to the curing agent is still 3:1, and the mass of the graphene nanosheets accounts for 0.50-0.75% of the total mass of the epoxy resin and the curing agent.
The preparation method of the epoxy adhesive comprises the following steps:
s1, determining the mass ratio of epoxy resin to a curing agent according to the type of the epoxy adhesive, weighing the epoxy resin and the curing agent according to a certain mass ratio, and weighing graphene nanosheets according to the mass of the graphene nanosheets accounting for 0.25-0.75% of the total mass of the epoxy resin and the curing agent;
s2, fully stripping and dispersing the graphene nanosheets to reduce the thickness of the graphene nanosheets to 1-19 layers, and the specific method comprises the following steps: directly pouring graphene nanosheets into a container filled with HPLC acetone, enabling the graphene nanosheets and the HPLC acetone to be mutually dissolved, sealing the container (the opening of the container can be covered by a preservative film and sleeved with a rubber band for fixation) to prevent the HPLC acetone from volatilizing, and then putting the container into a water bath for ultrasonic oscillation for 6-7 h, wherein the temperature of the water bath is 20-30 ℃; the graphene nanosheets can be fully stripped through ultrasonic oscillation, the number of the layers of the graphene nanosheets is reduced to several to more than ten layers, and the graphene nanosheets can be uniformly dispersed to avoid agglomeration; it is noted that each 2mg of graphene nanosheets are dissolved in 0.8-1.2 ml of HPLC acetone, and if the HPLC acetone is too little, the graphene nanosheets cannot be dispersed during ultrasonic oscillation, so that the dispersion effect is poor; if the HPLC acetone is too much, the subsequent evaporation time is long, and the structure of epoxy molecules can be damaged in a long-term high-temperature evaporation environment;
s3, adding epoxy resin into the mixture of graphene nanosheets and HPLC acetone subjected to ultrasonic oscillation, stirring the mixture by using a magnetic stirrer, wherein the epoxy resin is layered when added into the mixture of the graphene nanosheets and the HPLC acetone, so that the mixture is primarily mixed by stirring at normal temperature for 5 minutes, heating to 100 ℃, continuing stirring, evaporating the HPLC acetone in the mixture, controlling the whole evaporation process within 3 hours, and obtaining the mixture after the HPLC acetone is evaporated to dryness, namely the graphene nanosheet modified epoxy resin; the evaporation time is controlled within 3 hours, so that the HPLC acetone added before can be fully and completely volatilized, and epoxy molecules cannot be damaged;
s4, adding a curing agent into the graphene nanosheet modified epoxy resin, stirring in a planetary stirrer (ZYMC-200V non-intrusive material homogenizer of Shenzhen Uygur Co.), wherein the rotating speed of a main shaft of the planetary stirrer is 1800rpm, and the stirring time is 90S, so that a good stirring effect can be ensured, the phenomenon that the epoxy resin is heated in a large amount and is cured in advance due to excessive stirring is avoided, meanwhile, a vacuumizing function is started in the stirring process to eliminate bubbles, and the preparation of the graphene nanosheet modified epoxy adhesive is completed after the stirring is finished.
Generally, the performance evaluation of the epoxy adhesive is to test the mechanical properties of the single-lap joint structure by testing the relevant mechanical properties of the single-lap joint structure, and then preparing the single-lap joint structure by using the epoxy adhesive of the invention and testing the mechanical properties of the single-lap joint structure.
The epoxy adhesive is WD3003 building structural adhesive of Shanghai Kangda chemical new materials, Inc., the mass of the graphene nanosheets accounts for 0, 0.25%, 0.50% and 0.75% of the total mass of the epoxy resin and the curing agent, and the epoxy adhesive is prepared by the preparation method provided by the invention, wherein when the content of the graphene nanosheets is 0, the epoxy resin and the curing agent are mixed according to the ratio of 3:1, the mixture is put into the planetary mixer to be stirred. For convenience of description, the epoxy adhesive without the graphene nanosheets is recorded as 0GNP, the epoxy adhesive with 0.25% of the graphene nanosheets is recorded as 0.25% GNP, the epoxy adhesive with 0.50% of the graphene nanosheets is recorded as 0.50% GNP, the epoxy adhesive with 0.75% of the graphene nanosheets is recorded as 0.75% GNP, and then the four epoxy adhesives are used to respectively prepare a single-lap-joint bonded structure.
A single lap adhesive joint structure is shown in fig. 1 and 2, and the single lap adhesive joint structure is prepared by a conventional method. The material of sample 1 is 45-gauge steel, the width W of the sample is 25.4mm, and the length L, the width B and the thickness H of the cementing layer 2 are 12.70mm, 25.40mm and 0.2mm respectively. In order to ensure accurate experimental results, 4 samples were prepared for each epoxy adhesive.
After the preparation is finished, under the room-temperature quasi-static (0.5 mm/min) working condition, the single-lap-jointed glued structure is stretched by an electronic universal tester to obtain a typical tensile force-displacement curve of shear failure, which is shown in figure 3; the results of the maximum tensile force and the maximum displacement amount of each curve in fig. 3 are summarized in table 1; the error bar for maximum tensile force is shown in FIG. 4; dividing the tensile force by the area of the adhesive layer to obtain a tensile shear stress-displacement curve of the single lap adhesive structure, as shown in fig. 5; from the integrated area under each curve in fig. 5, the toughness values of the material can be roughly estimated, which are summarized in table 2.
As can be seen from table 1, with the increase of the graphene content, the maximum stretching force and the maximum displacement of the epoxy adhesive shear failure are increased and then decreased, and the maximum stretching force and the maximum displacement of 0.5% GNP reach maximum values, which are respectively increased by about 93.9% and 73.3% compared with 0 GNP; maximum tensile force and maximum displacement of 0.75% GNP; the maximum tensile force and maximum displacement of 0.25% GNP and 0.75% GNP are not as good as 0.5% GNP, but are better than 0 GNP.
As can be seen from table 2, with the increase of the graphene content, the toughness of the epoxy adhesive is increased and then decreased, and the toughness of 0.5% GNP reaches the maximum value, which is increased by about 233% compared with that of 0 GNP; 0.75% GNP, second order toughness; the 0.25% and 0.75% GNPs are less tough than the 0.5% GNPs, but both are better than the 0 GNPs.
As can be found from fig. 4, the heterogeneity of 0.5% GNP is higher, which indicates that the graphene nanoplatelets have the best dispersibility in the epoxy resin matrix and exhibit better anisotropic distribution, so that when the single lap joint adhesive structure is subjected to a huge external load carrying fracture tendency, 0.5% of graphene plays the best role of transferring and dispersing in the adhesive layer, and the strength and toughness of the structure are greatly improved.
TABLE 1 Peak load and maximum Displacement for different epoxy Adhesives
TABLE 2 toughness of different epoxy adhesives
From the peak loads in table 1, the tensile shear strength of the epoxy adhesive was calculated as τ = Pmax/(B × L) according to the following formula. In the formula:
τ -tensile shear strength, MPa;
pmax — the maximum load of shear failure of the test specimen (i.e., the maximum tensile force in table 1), N;
b-width of the cementing layer, mm;
l-length of the adhesive layer, mm.
The calculated tensile shear strengths are shown in table 3. As can be seen from table 3, with the increase of the graphene content, the tensile shear strength of the epoxy adhesive increases first and then decreases, and the tensile shear strength of 0.5% GNP reaches the maximum value, which is about 94% higher than that of 0 GNP; 0.75% GNP, less than the tensile shear strength; the tensile shear strength of 0.25% and 0.75% GNPs is not as good as 0.5% GNPs, but is better than 0 GNPs.
The reason for analysis is that the graphene nanosheets themselves have higher strength and hardness, and a certain amount of graphene nanosheets are dispersed in the epoxy resin, so that the graphene nanosheets can help bear a certain load, and the functions of transferring force and supporting structures are achieved, and the mechanical property of the epoxy adhesive is greatly improved. However, when the graphene is continuously added to a certain amount, the graphene is easily dispersed in the epoxy resin unevenly, and is easily agglomerated to form a stress concentration point, so that the mechanical property is reduced.
TABLE 3 tensile shear strength of different epoxy adhesives
In conclusion, the epoxy adhesive disclosed by the invention has the advantages that when the addition amount of the graphene is within the range of 0.25-0.75%, the mechanical properties such as the maximum tensile force, the maximum displacement, the toughness, the tensile shear strength and the like of the shear failure of the epoxy adhesive are superior to those of the common epoxy adhesive.
The method of preparing the epoxy adhesive of the present invention will be described in detail with reference to several specific examples.
Example 1
Taking WD3003 building structure adhesive as a raw material, weighing 30g of epoxy resin, 10g of curing agent and 0.1g (0.25%) of graphene nanosheet; directly pouring 0.1g of graphene nanosheets into a container filled with 40ml of HPLC acetone, covering the opening of the container with a preservative film, sleeving a rubber band for fixation, and then putting the container into a water bath for ultrasonic oscillation for 6 hours, wherein the temperature of the water bath is 20 ℃; adding 30g of epoxy resin into the mixture of the graphene nanosheets and the HPLC acetone subjected to ultrasonic oscillation, stirring the mixture by using a magnetic stirrer, stirring for 5 minutes at normal temperature, heating to 100 ℃, continuing stirring, evaporating the HPLC acetone in the mixture, controlling the whole evaporation process to be 3 hours, and obtaining the mixture after the HPLC acetone is evaporated to dryness, namely the graphene nanosheet modified epoxy resin; and finally, adding 10g of curing agent into the graphene nanosheet modified epoxy resin, stirring in a planetary stirrer, wherein the rotating speed of a main shaft of the planetary stirrer is 1800rpm, the stirring time is 90s, the vacuumizing function is started in the stirring process to eliminate bubbles, and the preparation of the graphene nanosheet modified epoxy adhesive is completed after the stirring is finished.
Example 2
Taking WD3003 building structure adhesive as a raw material, weighing 30g of epoxy resin, 10g of curing agent and 0.2g (0.50%) of graphene nanosheet; directly pouring 0.2g of graphene nanosheets into a container filled with 100ml of HPLC acetone, covering the opening of the container with a preservative film, sleeving a rubber band for fixation, and then putting the container into a water bath for ultrasonic oscillation for 7h, wherein the temperature of the water bath is 30 ℃; adding 30g of epoxy resin into the mixture of the graphene nanosheets and the HPLC acetone subjected to ultrasonic oscillation, stirring the mixture by using a magnetic stirrer, stirring for 5 minutes at normal temperature, heating to 100 ℃, continuing stirring, evaporating the HPLC acetone in the mixture, controlling the whole evaporation process to be 3 hours, and obtaining the mixture after the HPLC acetone is evaporated to dryness, namely the graphene nanosheet modified epoxy resin; and finally, adding 10g of curing agent into the graphene nanosheet modified epoxy resin, stirring in a planetary stirrer, wherein the rotating speed of a main shaft of the planetary stirrer is 1800rpm, the stirring time is 90s, the vacuumizing function is started in the stirring process to eliminate bubbles, and the preparation of the graphene nanosheet modified epoxy adhesive is completed after the stirring is finished.
Example 3
Taking WD3003 building structure adhesive as a raw material, weighing 30g of epoxy resin, 10g of curing agent and 0.3g (0.75%) of graphene nanosheet; directly pouring 0.3g of graphene nanosheets into a container filled with 180ml of HPLC acetone, covering the opening of the container with a preservative film, sleeving a rubber band for fixation, and then putting the container into a water bath for ultrasonic oscillation for 6.5h, wherein the temperature of the water bath is 25 ℃; adding 30g of epoxy resin into the mixture of the graphene nanosheets and the HPLC acetone subjected to ultrasonic oscillation, stirring the mixture by using a magnetic stirrer, stirring for 5 minutes at normal temperature, heating to 100 ℃, continuing stirring, evaporating the HPLC acetone in the mixture, controlling the whole evaporation process to be 3 hours, and obtaining the mixture after the HPLC acetone is evaporated to dryness, namely the graphene nanosheet modified epoxy resin; and finally, adding 10g of curing agent into the graphene nanosheet modified epoxy resin, stirring in a planetary stirrer, wherein the rotating speed of a main shaft of the planetary stirrer is 1800rpm, the stirring time is 90s, the vacuumizing function is started in the stirring process to eliminate bubbles, and the preparation of the graphene nanosheet modified epoxy adhesive is completed after the stirring is finished.
Claims (2)
1. The epoxy adhesive is prepared from epoxy resin, a curing agent and a filler in proportion, and is characterized in that: the filler graphene nanoplatelets are uniformly dispersed in the epoxy resin and the curing agent;
the mass of the graphene nanosheet accounts for 0.50% of the total mass of the epoxy resin and the curing agent;
the number of layers of the layered structure in the graphene nanosheet is 1-19;
the epoxy adhesive is prepared by the following method, the graphene nanosheet is fully and uniformly mixed with the epoxy resin to obtain graphene nanosheet modified epoxy resin, the curing agent is added into the graphene nanosheet modified epoxy resin and the curing agent are fully and uniformly mixed to finally obtain the graphene nanosheet modified epoxy adhesive;
fully stripping and dispersing the graphene nanosheets before fully and uniformly mixing the graphene nanosheets with the epoxy resin;
the method for fully stripping and dispersing the graphene nanosheets comprises the following steps: dissolving the graphene nanosheets in HPLC acetone, sealing a container containing the graphene nanosheets and the HPLC acetone, and then placing the container into a water bath for ultrasonic oscillation, wherein the ultrasonic oscillation time is 6-7 h, and the temperature of the water bath is 20-30 ℃;
dissolving each 2mg of graphene nanosheets in 0.8-1.2 ml of HPLC acetone;
the method for fully mixing the graphene nanosheets and the epoxy resin comprises the following steps: adding the epoxy resin into the mixture of the graphene nanosheets and the HPLC acetone subjected to ultrasonic oscillation, stirring the mixture by using a magnetic stirrer, firstly stirring at normal temperature to preliminarily mix the mixture, then heating to 100 ℃, continuing stirring, evaporating the HPLC acetone in the mixture, and obtaining the mixture after the HPLC acetone is evaporated to dryness, namely the graphene nanosheet modified epoxy resin;
the method for fully mixing the curing agent and the graphene nanosheet modified epoxy resin comprises the following steps: adding the curing agent into the graphene nanosheet modified epoxy resin, putting the graphene nanosheet modified epoxy resin into a planetary mixer, wherein the rotating speed of a main shaft of the planetary mixer is 1800rpm, the mixing time is 90s, and vacuumizing is performed while mixing to finish the preparation of the graphene nanosheet modified epoxy adhesive.
2. The epoxy adhesive of claim 1, wherein: the whole evaporation process is controlled within 3 h.
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| CN115302895A (en) * | 2022-07-11 | 2022-11-08 | 张家港飞腾复合新材料股份有限公司 | Light composite board with stable application and production process thereof |
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