CN110370478B - Multi-section type semiconductor crystal bar cutting machine based on sliding rail type side turning principle - Google Patents
Multi-section type semiconductor crystal bar cutting machine based on sliding rail type side turning principle Download PDFInfo
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- CN110370478B CN110370478B CN201910564154.6A CN201910564154A CN110370478B CN 110370478 B CN110370478 B CN 110370478B CN 201910564154 A CN201910564154 A CN 201910564154A CN 110370478 B CN110370478 B CN 110370478B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a sliding rail type side-turning principle-based multi-section type semiconductor crystal bar cutting machine which structurally comprises a cutting host machine, a heat dissipation groove, a controller, fixing support legs, an access door, an equipment main body and a processing table board. According to the invention, a workpiece is placed in the side lining strips after penetrating through the stabilizing component, the stabilizing component drives the workpiece to advance in a segmented manner through the feeding rotating shaft after equipment is started, the workpiece is cut by matching with the cutting host, a processed wafer is vertically guided through the raising plate and the guide plate in the side turning mechanism, and finally the vertical rolling guide rail and the buffering legs slowly guide the processed wafer out, so that the quality of the wafer is effectively ensured after the whole machine is used, the collision and damage in the discharging process are avoided, stable limit control is provided for the head and the tail of the crystal bar in the cutting process, and the error variable of the thickness of the wafer is maximally reduced.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a sliding rail type side-turning principle-based multi-section type semiconductor crystal bar cutting machine.
Background
The ingot is the whole monocrystalline silicon, because the preparation of the monocrystalline silicon rod is completed by the czochralski method and the zone melting method, and the prepared finished product is a rod shape, so the ingot is called an ingot, a semiconductor wafer is a product separated by a cutting machine, the wafer is the most common semiconductor material at present, and because the wafer needs to be processed into various circuit element structures at the later stage to prepare semiconductor chips, the quality requirement on the processing technology of the cutting machine is higher. The prior art on the market has the following problems in the using process:
although the current clipper can accurately carry out multi-section cutting, due to the problem of crystal bar length, if the rear section position is not well controlled in the cutting process, the change of the slice thickness is extremely easy to cause due to vibration, and the sliced product is easy to collide with and damage and needs to be optimized.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a sliding rail type side-turning principle-based multi-section type semiconductor crystal bar cutting machine, which aims to solve the problems that although the conventional cutting machine can accurately perform multi-section type cutting, if the position of the rear section is not well controlled in the cutting process due to the length of a crystal bar, the thickness of a cut piece is easily changed due to vibration, and the cut product is easily collided and damaged and needs to be optimized.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a cutting machine of multistage formula semiconductor crystal bar based on slide rail formula principle of turning on one's side, its structure is including cutting the host computer, the radiating groove, a controller, fixed stabilizer blade, the access door, the equipment main part, the processing mesa is installed in equipment main part top through the lock mode, install in processing mesa surface right-hand member through the embedding mode cutting host computer bottom, the cutting host computer right side is located to the radiating groove, and structure as an organic whole, the controller is installed in equipment main part right side rear end through the lock mode, equipment main part right side front end is equipped with the recess of movable mounting access door, fixed stabilizer blade is equipped with four, and even equidistance is installed in equipment main part four ends.
As the further optimization of this technical scheme, processing mesa includes side turning mechanism, standing groove, side gib, stabilizing component, mesa main part, and mesa main part middle part is located to the standing groove to structure as an organic whole, side gib are equipped with two, and distribute in both ends about the standing groove, and structure as an organic whole, and the stabilizing component bottom is installed in the standing groove middle part through the embedding mode, and mesa main part front end is equipped with the recess of installation side turning mechanism.
As the further optimization of this technical scheme, side turning mechanism is including choosing high board, eliminating resistance pulley, guide board, immediately rolling guide, buffering foot are young, and buffering foot is young to be located and immediately rolls the guide front end to structure as an organic whole, immediately roll the guide inboard and be connected through the lock mode with guide board outside front end, the guide board is located chooses high board left end, and the bottom is integrated structure, eliminating resistance pulley is equipped with two, and install in choosing high board top through the embedding mode.
As the further optimization of this technical scheme, stabilizing the subassembly and including positioning frame, segmentation dead lever, damping axle, work piece, pay-off pivot, the segmentation dead lever left end is installed in positioning frame right side through the lock mode, and the damping axle is located segmentation dead lever upper right end, and segmentation dead lever bottom is equipped with the pay-off pivot, and the work piece runs through positioning frame and is connected with damping axle bottom, and pay-off pivot top and work piece bottom laminating.
As the further optimization of this technical scheme, the cutting host computer includes that the dibit pushes away cover, protection casing, cuts saw bit, pneumatic base, and the inside both ends of cutting host computer are located to pneumatic base, and the dibit pushes away the cover and installs respectively in pneumatic base inboard, cuts the saw bit and installs in the inside upper end of protection casing through the lock mode, and the inside lower extreme of protection casing is equipped with the work piece, cuts the saw bit and is connected with the work piece.
As the further optimization of the technical scheme, a plurality of balls are uniformly and equidistantly distributed on the surface of the side lining strip and used for reducing certain resistance when the side lining strip is used for a workpiece, and the sliding property is improved.
As the further optimization of the technical scheme, the surfaces of the damping shaft and the feeding rotating shaft are sleeved with a layer of sponge, so that the surface scratch and the damage caused in the contact process with a workpiece are avoided.
As the further optimization of the technical scheme, the inner cavity of the buffering leg is designed to be spirally folded, the cut semiconductor wafer can be laterally turned and guided out, the buffering effect is achieved, and the rolling and falling are avoided.
Advantageous effects
The invention relates to a slide rail type side-turn principle-based multi-stage semiconductor crystal bar cutting machine, which is characterized in that a workpiece is placed on a processing table board, the controller is started to carry out sectional conveying on the workpiece, the cutting is cut off and cut by a cutting host machine, an access door is opened when the inside of an equipment main body is maintained, a stabilizing component is arranged in the middle of a placing groove, the workpiece can be conveyed after being sleeved, two side lining strips support two sides of the workpiece, balls on the surfaces are used for increasing the sliding property and reducing the resistance, a wafer generated by cutting is finally buffered and horizontally placed through a side-turn mechanism to avoid damage, a resistance-eliminating pulley drives the wafer to move forwards at the moment, a guide plate enables one end of the wafer to move downwards through an inclined surface structure at the top part and finally to stand into a vertical rolling guide rail, the wafer is buffered and placed by side-turn through a spiral folding inner cavity in the vertical rolling guide rail when passing through a buffering leg, and a damping shaft is used for fixing the top part of the workpiece, the feeding rotating shaft rotates in a segmented mode according to the driving control of the equipment main body so as to complete conveying control, the height and the distance of the segmented fixed rods can be adjusted through the positioning frame, the segmented fixed rods can be suitable for semiconductor crystal bars with various diameters, workpieces are cut and cut through the cut saw blades, the pneumatic base is matched with the cut saw blades to run synchronously, and the two-position push sleeve is timely pushed out to stabilize the head end of the workpiece.
Based on the prior art, the invention can achieve the following advantages after operation:
the work piece is placed in the side liner after running through the stabilizing component, stabilizing component drives the work piece segmentation through the pay-off pivot and gos forward behind the starting equipment, the cooperation cutting host computer cuts, the wafer that processing produced stands vertically with the guide board through the board of choosing in the mechanism of turning on one's side, it is young with its slow speed derivation with buffering foot finally to immediately roll the guide rail, the quality of wafer has effectively been ensured after the whole use, avoid the damage of colliding with in the ejection of compact process, and the cutting in-process has all possessed stable limit control to the crystal bar head and the tail, the maximize has reduced the error variable of wafer thickness.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural diagram of a multi-section semiconductor crystal bar cutting machine based on a slide rail type side-turning principle.
Fig. 2 is a schematic view of a top view structure of a processing table of a multi-section semiconductor crystal bar cutting machine based on a slide rail type side-turning principle.
Fig. 3 is a schematic structural diagram of a side-turning mechanism of the cutting machine for multi-section semiconductor crystal bars based on the slide rail type side-turning principle.
Fig. 4 is a schematic side view of a stabilizing assembly of the cutting machine for multi-segment semiconductor crystal bars based on the sliding rail type side-turning principle according to the present invention.
Fig. 5 is a front view of the internal structure of a cutting main machine of the cutting machine for the multi-segment semiconductor crystal bar based on the sliding rail type side-turning principle.
Fig. 6 is a schematic top view of a side-turning mechanism of the multi-segment semiconductor crystal bar cutting machine based on the slide rail type side-turning principle.
Reference numerals in the drawings indicate: the cutting machine comprises a cutting main machine-1 k, a heat dissipation groove-2 k, a controller-3 k, a fixed support leg-4 k, an access door-5 k, an equipment main body-6 k, a machining table-7 k, a side turning mechanism-7 k1, a placement groove-7 k2, a side lining strip-7 k3, a stabilizing component-7 k4, a table-top main body-7 k5, a raising plate-7 k11, a damping pulley-7 k12, a guide plate-7 k13, a vertical rolling guide rail-7 k14, a buffering leg-7 k15, a positioning frame-7 k41, a segmented fixed rod-7 k42, a damping shaft-7 k43, a workpiece-7 k44, a feeding rotating shaft-7 k45, a double-position pushing sleeve-1 ka, a saw blade-1 kb, a cutting blade-1 kc and a pneumatic base-1 kd.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
The upper and lower, inner and outer, front and rear, and left and right in the present invention are referred to with reference to the orientation in fig. 1.
Examples
Referring to fig. 1-6, the invention provides a cutting machine for a multi-section semiconductor crystal bar based on a slide rail type side-turning principle, which comprises a cutting host machine 1k, a heat dissipation groove 2k, a controller 3k, a fixed support leg 4k, an access door 5k, an equipment main body 6k and a processing table 7k, wherein the processing table 7k is arranged at the top of the equipment main body 6k in a buckling manner, the bottom of the cutting host machine 1k is arranged at the right end of the surface of the processing table 7k in an embedding manner, the heat dissipation groove 2k is arranged at the right side of the cutting host machine 1k and is an integrated structure, the controller 3k is arranged at the rear end of the right side of the equipment main body 6k in a buckling manner, a groove for movably installing the access door 5k is arranged at the front end of the right side of the equipment main body 6k, four fixed support legs 4k are uniformly and equidistantly arranged at four ends of the equipment main body 6k, the work 7k44 is placed on the work table 7k, the controller 3k is started to transport the work 7k44 in stages, the cutting is performed by the cutting main machine 1k, and the access door 5k is opened when the inside of the apparatus main body 6k is inspected and maintained.
The processing table 7k comprises a side turning mechanism 7k1, a placing groove 7k2, side strips 7k3, a stabilizing assembly 7k4 and a table body 7k5, wherein the placing groove 7k2 is arranged in the middle of the table body 7k5 and is of an integrated structure, two side strips 7k3 are arranged and distributed at the left end and the right end of the placing groove 7k2 and are of an integrated structure, the bottom of the stabilizing assembly 7k4 is installed in the middle of the placing groove 7k2 in an embedding mode, a groove for installing the side turning mechanism 7k1 is formed in the front end of the table body 7k5, the stabilizing assembly 7k4 is arranged in the middle of the placing groove 7k2, the workpiece 7k44 can be conveyed after being nested, the two side strips 7k3 support the two sides of the workpiece 7k44, balls on the surfaces are used for increasing the sliding performance and reducing the resistance, and finally wafers generated by cutting are horizontally placed through the side turning mechanism 7k1 to avoid damage.
The side-turning mechanism 7k1 comprises a raising plate 7k11, an anti-drag pulley 7k12, a guide plate 7k13, a vertical rolling guide rail 7k14 and a buffering leg 7k15, wherein the buffering leg 7k15 is arranged at the front end of the vertical rolling guide rail 7k14, and is an integrated structure, the inner side of the vertical rolling guide rail 7k14 is connected with the front end of the outer side of the guide plate 7k13 in a buckling way, the guide plate 7k13 is positioned at the left end of the raising plate 7k11, the bottom of the raising plate is of an integrated structure, two resistance eliminating pulleys 7k12 are arranged, the wafer is installed on the top of the raising plate 7k11 in an embedding mode, after the wafer is completely disconnected, the wafer is laterally laid to the tops of the raising plate 7k11 and the guide plate 7k13, at the moment, the resistance eliminating pulley 7k12 drives the wafer to move forwards, the guide plate 7k13 enables one end of the wafer to move downwards through the inclined surface structure of the top, finally the wafer is erected into the vertical rolling guide rail 7k14, and the wafer is laterally turned and buffered by the spiral folding inner cavity inside when passing through the buffering leg 7k 15.
The stabilizing assembly 7k4 comprises an adjusting frame 7k41, a segmented fixing rod 7k42, a damping shaft 7k43, a workpiece 7k44 and a feeding rotating shaft 7k45, wherein the left end of the segmented fixing rod 7k42 is mounted on the right side of the adjusting frame 7k41 in a buckling mode, the damping shaft 7k43 is arranged at the upper right end of the segmented fixing rod 7k42, the feeding rotating shaft 7k45 is arranged at the bottom of the segmented fixing rod 7k42, the workpiece 7k44 penetrates through the adjusting frame 7k41 to be connected with the bottom of the damping shaft 7k43, the top of the feeding rotating shaft 7k45 is attached to the bottom of the workpiece 7k44, the damping shaft 7k43 is used for fixing the top of the workpiece 7k44, the feeding rotating shaft 7k45 rotates in a segmented mode according to the driving control of an equipment main body 6k to complete conveying control, and the segmented fixing rod 7k42 can adjust the height and the distance of semiconductor crystal bars with various diameters through the adjusting frame 7k 41.
A plurality of balls are uniformly distributed on the surface of the side lining strip 7k3 at equal intervals and used for reducing certain resistance when the side lining strip is used for being matched with a workpiece 7k44, and the sliding property is improved.
The surfaces of the damping shaft 7k43 and the feeding rotating shaft 7k45 are sleeved with a layer of sponge, so that surface scratches and damage caused in the contact process with the workpiece 7k44 are avoided.
The inner cavity of the buffering leg 7k15 is designed to be spirally folded, so that the cut semiconductor wafer can be laterally turned and guided out, the buffering effect is achieved, and the rolling and falling are avoided.
The principle of the invention is as follows: the method comprises the steps of placing a workpiece 7k44 on a processing table 7k, starting a controller 3k, then carrying out sectional conveying on the workpiece 7k44, cutting and cutting the workpiece by a cutting main machine 1k, opening the controller through an access door 5k when carrying out maintenance on the interior of an equipment main body 6k, arranging a stabilizing component 7k4 in the middle of a placing groove 7k2, conveying the workpiece 7k44 after being sleeved, arranging two side lining strips 7k3 to support two sides of the workpiece 7k44 in a lining mode, enabling balls on the surfaces of the two side lining strips to be used for increasing the sliding performance and reducing the resistance, finally buffering and flatly placing the cut wafer through a side-turning mechanism 7k1 to avoid damage, driving the damping pulley 7k12 to move forwards, enabling one end of the wafer to move downwards through a top slope structure through a guide plate 7k13, enabling one end of the wafer to finally stand up to enter a vertical rolling guide rail 7k14, carrying out side-turning buffering and placing the damping shaft 7k43 to fix the top of the workpiece 7k44 through a buffering pin 7k15, the feeding rotating shaft 7k45 rotates in a segmented mode according to the driving control of the equipment main body 6k to complete conveying control, the height and the distance of the segmented fixed rod 7k42 can be adjusted through the positioning frame 7k41, the segmented fixed rod can be suitable for semiconductor crystal bars with various diameters, a workpiece 7k44 is cut and cut through the cutting saw blade 1kc, the pneumatic base 1kd is matched with the cutting saw blade 1kc to run synchronously, and the two-position push sleeve 1ka is pushed out timely to stabilize the head end of the workpiece 7k 44.
The invention solves the problem that the existing cutting machine can accurately cut in a multi-section way, but because of the problem of the length of a crystal bar, if the position of the rear section is not well controlled in the cutting process, the change of the slice thickness is extremely easy to cause due to vibration, and the sliced product is easy to collide and damage and needs to be optimized, the invention has the advantages that through the mutual combination of the components, a workpiece 7k44 is placed in a side lining strip 7k3 after penetrating through a stabilizing component 7k4, the stabilizing component 7k4 drives the workpiece 7k44 to advance in sections through a feeding rotating shaft 7k45 after starting the device, the cutting host machine 1k is matched for cutting, the processed wafer is vertically guided through a raising plate 7k11 and a guide plate 7k13 in a side turning mechanism 7k1, finally the vertical rolling guide rail 7k14 and a buffer pin 7k15 are slowly led out, the quality of the wafer is effectively ensured after the whole use, and the damage of the wafer in the discharging process is avoided, and the end of the crystal bar is stably limited and controlled in the cutting process, so that the error variable of the thickness of the wafer is reduced to the maximum extent.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (1)
1. The utility model provides a cutting machine of multistage formula semiconductor crystal bar based on slide rail formula principle of turning on one's side, its structure is including cutting host computer (1k), radiating groove (2k), controller (3k), fixed stabilizer blade (4k), access door (5k), equipment principal (6k), processing mesa (7k) lock is installed in equipment principal (6k) top, embedding is installed in processing mesa (7k) surface right-hand member cutting host computer (1k) bottom, cutting host computer (1k) right side is located in radiating groove (2k), controller (3k) lock is installed in equipment principal (6k) right side rear end, equipment principal (6k) right side front end is equipped with movable access door (5k), fixed stabilizer blade (4k) equidistance is installed in equipment principal (6k) four ends, processing mesa (7k) are including the mechanism of turning on one's side (7k1), The table top comprises a placing groove (7k2), side lining strips (7k3), a stabilizing assembly (7k4) and a table top body (7k5), wherein the placing groove (7k2) is arranged in the middle of the table top body (7k5), the side lining strips (7k3) are distributed at the left end and the right end of the placing groove (7k2), the bottom of the stabilizing assembly (7k4) is embedded in the middle of the placing groove (7k2), the front end of the table top body (7k5) is provided with a side turning mechanism (7k1), the side turning mechanism (7k1) comprises a raising plate (7k11), a resistance eliminating pulley (7k12), a guide plate (7k13), a vertical rolling guide rail (7k14) and a buffer leg (7k15), the buffer leg (7k15) is arranged at the front end of the vertical rolling guide rail (7k14), the inner side of the vertical guide rail (7k14) is connected with the guide plate (7k 56), and the guide plate (7k) is positioned at the left end of the raising plate (86 13), the damping pulley (7k12) is embedded in the top of the elevating plate (7k11), the stabilizing assembly (7k4) comprises a positioning frame (7k41), a segmented fixing rod (7k42), a damping shaft (7k43), a workpiece (7k44) and a feeding rotating shaft (7k45), the left end of the segmented fixing rod (7k42) is mounted on the right side of the positioning frame (7k41) in a buckling mode, the damping shaft (7k43) is arranged at the upper right end of the segmented fixing rod (7k42), the feeding rotating shaft (7k45) is arranged at the bottom of the segmented fixing rod (7k42), the workpiece (7k44) penetrates through the positioning frame (7k41) and is connected with the bottom of the damping shaft (7k43), the top of the feeding rotating shaft (7k45) is attached to the bottom of the workpiece (7k44), the damping shaft (7k 395) is used for fixing the top of the workpiece (7k 3923), and the feeding rotating shaft (587 k) drives the main body (5736) to rotate according to a segmented control device, the automatic cutting machine is characterized in that conveying control is completed, the height and the distance of a segmented fixed rod (7k42) can be adjusted through a positioning frame (7k41), the cutting main machine (1k) comprises a double-position pushing sleeve (1ka), a protective cover (1kb), a cutting saw blade (1kc) and a pneumatic base (1kd), the pneumatic base (1kd) is arranged at two ends inside the cutting main machine (1k), the double-position pushing sleeve (1ka) is respectively arranged on the inner side of the pneumatic base (1kd), the cutting saw blade (1kc) is arranged at the upper end inside the protective cover (1kb) in a buckling mode, a workpiece (7k44) is arranged at the lower end inside the protective cover (1kb), and the cutting saw blade (1kc) is connected with the workpiece (7k 44);
the method comprises the steps of placing a workpiece (7k44) on a processing table top (7k), starting a controller (3k), conveying the workpiece (7k44) in a sectional mode, cutting off and cutting the workpiece by a cutting main machine (1k), opening the workpiece through an access door (5k) when the interior of an equipment main body (6k) is overhauled and maintained, arranging a stabilizing component (7k4) in the middle of a placing groove (7k2), conveying the workpiece (7k44) after the workpiece is sleeved, supporting two sides of the workpiece (7k44) by two side lining strips (7k3), increasing the sliding property and reducing the resistance through surface balls, buffering and horizontally placing the wafer which is finally laterally turned over through a side mechanism (7k1) generated by cutting to avoid damage, driving the wafer to move forwards through a damping pulley (7k12) at the moment, enabling one end of the wafer to move downwards through a top slope structure by a guide plate (7k13), finally standing up and entering the interior of a vertical rolling guide rail (7k14), and buffering and placing the spiral folding inner cavity for buffering when the wafer passes through a buffering pin (7k15), the cutting and cutting device is suitable for semiconductor crystal bars with various diameters, a workpiece (7k44) is cut and cut through the cutting saw blade (1kc), the pneumatic base (1kd) is matched with the cutting saw blade (1kc) to synchronously run, and the two-position push sleeve (1ka) is timely pushed out to stabilize the head end of the workpiece (7k 44).
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| CN201910564154.6A CN110370478B (en) | 2019-06-26 | 2019-06-26 | Multi-section type semiconductor crystal bar cutting machine based on sliding rail type side turning principle |
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| CN110370478B true CN110370478B (en) | 2021-09-03 |
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| CN109571788A (en) * | 2018-02-28 | 2019-04-05 | 福州大学 | A kind of diamond fretsaw cutting equipment with servo-actuated lifting filtering solution case |
| CN109773993A (en) * | 2019-03-27 | 2019-05-21 | 天通日进精密技术有限公司 | A kind of crystal bar method for cutting using multisection type semiconductor crystal bar shear |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9950402B2 (en) * | 2012-12-31 | 2018-04-24 | Corner Star Limited | System and method for aligning an ingot with mounting block |
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- 2019-06-26 CN CN201910564154.6A patent/CN110370478B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0743140A2 (en) * | 1995-04-14 | 1996-11-20 | Shin-Etsu Handotai Company Limited | Wire saw |
| CN205905228U (en) * | 2016-08-04 | 2017-01-25 | 山东大海新能源发展有限公司 | Semiconductor monocrystalline silicon stick clipper presss from both sides tight fixing device |
| CN106827274A (en) * | 2017-04-01 | 2017-06-13 | 上海日进机床有限公司 | Silicon rod intercept unit and silicon rod method for cutting |
| CN109571788A (en) * | 2018-02-28 | 2019-04-05 | 福州大学 | A kind of diamond fretsaw cutting equipment with servo-actuated lifting filtering solution case |
| CN208645713U (en) * | 2018-05-14 | 2019-03-26 | 福州天瑞线锯科技有限公司 | A kind of silicon single crystal rod conveying device and cutting machine |
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| CN110370478A (en) | 2019-10-25 |
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