CN110356022B - Manufacturing method of low-warpage low-temperature thermoplastic resin fixed film - Google Patents
Manufacturing method of low-warpage low-temperature thermoplastic resin fixed film Download PDFInfo
- Publication number
- CN110356022B CN110356022B CN201910611847.6A CN201910611847A CN110356022B CN 110356022 B CN110356022 B CN 110356022B CN 201910611847 A CN201910611847 A CN 201910611847A CN 110356022 B CN110356022 B CN 110356022B
- Authority
- CN
- China
- Prior art keywords
- punching
- low
- holes
- thermoplastic resin
- temperature thermoplastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
The application discloses a manufacturing method of a low-warpage low-temperature thermoplastic resin fixing film, which comprises the following steps: extruding and molding a low-temperature thermoplastic resin raw material into a resin film material; punching the resin film material by a punch according to the set mesh structure; processing and molding a resin film material with meshes into a resin fixed film with a set shape; wherein punching is performed according to one or a combination of the following methods: (1) punching holes from inside to outside in sequence; (2) punching small holes and then big holes; (3) punching a single hole and then punching multiple holes; (4) punching small holes alternately in the multi-hole punching process, wherein the number ratio of the multiple holes to the single holes is set to be 2-8: 1. The manufacturing method combines various punching methods, the warping degree of the obtained fixed film is low and is not more than 2cm, the deformation degree of the fixed film is improved, and the post-processing difficulty is reduced.
Description
Technical Field
The application belongs to the technical field of medical instrument consumables, and particularly relates to a manufacturing method of a low-warpage low-temperature thermoplastic resin fixing film.
Background
The low-temperature thermoplastic material is a high-molecular material, has the advantages of low softening point, repeated shaping, certain fixing strength, light and breathable property, good X-ray permeability, easy biodegradation and the like, is widely applied to the medical field, is widely used for bone surgery fixation, radiotherapy positioning, orthopedic brace and rehabilitation brace manufacture at present, and is convenient for doctors to operate and use.
Due to the fact that the application fields are more and more extensive, requirements of doctors and patients are more and more accurate, for example, the low-temperature thermoplastic fixing film is often required to be made into fixing films with different hole patterns, different loosening and ventilating functions and different fixing effects according to requirements, and the fixing films can be highly matched with different patients. This requires that the thermoplastic fixing film have accurately positioned patterns, reinforcing ribs for reinforcement, which not only improves the fixing effect, but also makes the wearing more comfortable, and the treatment can achieve better effect. However, the thermoplastic fixing film with complex lines is difficult to perform in the subsequent process due to large warping deformation during punching.
Disclosure of Invention
In order to solve at least one of the above-mentioned technical problems of the prior art, an embodiment of the present application discloses a method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film, including:
extruding and molding a low-temperature thermoplastic resin raw material into a resin film material;
punching a resin film material by a punch according to a set mesh structure to form a mesh structure;
processing and molding a resin film material with a set mesh structure into a resin fixed film with a set shape;
wherein punching is performed according to one or a combination of the following methods:
(1) punching holes from inside to outside in sequence;
(2) punching small holes and then big holes;
(3) punching a single hole and then punching multiple holes;
(4) punching single holes in the multi-hole punching process;
wherein the ratio of the number of the plurality of holes to the number of the single holes is set to 2 to 8: 1.
Some embodiments disclose a method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film, wherein the punching machine comprises a pneumatic punching machine and an oil pressing machine.
Some embodiments disclose a method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film, wherein a punching pressure of an air press is set to 0.3 to 0.8 Mpa.
In some embodiments, the method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film includes setting a punching pressure of an oil pressure punch to 80 to 300 Mpa.
Some embodiments disclose a method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film, wherein the processing and forming comprise:
(1) cutting the resin film material according to the set size and shape;
(2) performing surface treatment and paint spraying on the resin film material obtained by cutting;
(3) and (3) carrying out irradiation treatment on the resin film material subjected to the surface treatment to obtain the resin fixed film.
Some embodiments disclose a method for manufacturing a low-warpage low-temperature thermoplastic resin fixed film, wherein the low-temperature thermoplastic resin raw material comprises polycaprolactone, polyethylene and a DCP crosslinking agent.
Some embodiments disclose a method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film, wherein the low-temperature thermoplastic resin raw material comprises, by mass:
60-80 parts of polycaprolactone
18-25 parts of polyethylene
0.2-0.4 part of DCP crosslinking agent.
Some embodiments disclose a method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film, wherein a low-temperature thermoplastic resin raw material is extruded and molded on a single-screw extruder, and the temperature of each section of the single-screw extruder is set as follows: the first zone is 85 ℃, the second zone is 100 ℃, the third zone is 125 ℃, the fourth zone is 135 ℃, the fifth zone is 140 ℃, the flange zone is 135 ℃ and the head is 120 ℃.
Some embodiments disclose a method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film, wherein the punching comprises a combination of at least three methods.
Some embodiments disclose methods for manufacturing a low-warpage low-temperature thermoplastic resin fixing film, wherein the ratio of the number of the plurality of holes to the number of the single holes is set to 4-8: 1.
The manufacturing method of the low-warpage low-temperature thermoplastic resin fixed film disclosed by the embodiment of the application combines multiple punching methods, the warpage of the obtained fixed film is low and is not more than 2cm, the deformation degree of the fixed film is improved, and the post-processing difficulty is reduced.
Drawings
FIG. 1 is a schematic view of a method for sequentially punching holes from inside to outside
FIG. 2 is a schematic diagram of a method for punching a small hole and then a large hole
FIG. 3 is a schematic view of a method for punching a single hole and multiple holes alternately in sequence
FIG. 4 is a schematic diagram of a method for filling single hole by inserting in a multi-hole punching process
The components and the like disclosed in the embodiments in the drawings are not drawn to scale in order to emphasize their structural features, and the specific features of the components are subject to the disclosure in the specification.
Detailed Description
The word "embodiment" as used herein, is not necessarily to be construed as preferred or advantageous over other embodiments, including any embodiment illustrated as "exemplary". The performance index measurements in the examples of this method, unless otherwise indicated, were carried out using test methods conventional in the art. It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; other test methods and techniques not specifically mentioned in the present application refer to those commonly employed by those of ordinary skill in the art.
The terms "substantially" and "about" are used throughout this disclosure to describe small fluctuations. For example, they may mean less than or equal to ± 5%, such as less than or equal to ± 2%, such as less than or equal to ± 1%, such as less than or equal to ± 0.5%, such as less than or equal to ± 0.2%, such as less than or equal to ± 0.1%, such as less than or equal to ± 0.05%. The use of the ordinal numbers such as first, second, etc. herein is merely to distinguish between different elements or features, unless the context clearly dictates otherwise.
In this disclosure, including the claims, all conjunctions such as "comprising," including, "" carrying, "" having, "" containing, "" involving, "" containing, "and the like are to be understood as being open-ended, i.e., to mean" including but not limited to. Only the conjunctions "consisting of … …" and "consisting of … …" are closed conjunctions.
On the premise of no conflict, the technical features disclosed in the embodiments of the present application may be combined with each other, and the obtained technical solution belongs to the content disclosed in the present application.
In some embodiments, a method of manufacturing a low warpage low temperature thermoplastic resin anchoring film includes: extruding and molding a low-temperature thermoplastic resin raw material into a resin film material; punching a resin film material by a punch according to a set mesh structure to form a mesh structure; processing and molding a resin film material with a set mesh structure into a resin fixed film with a set shape; wherein punching is performed according to one or a combination of the following methods: (1) punching holes from inside to outside in sequence; (2) punching small holes and then big holes; (3) punching a single hole and then punching multiple holes; (4) punching single holes alternately in the multi-hole punching process, wherein the number ratio of the multi-holes to the single holes is set to be 2-8: 1.
Generally, the low temperature thermoplastic resin anchoring film includes a plurality of openings arranged in different shapes and patterns, and the openings have various and different diameters and shapes, and the plurality of openings form a specific mesh structure on the anchoring film so as to have different air-transmitting functions and to be suitable for anchoring requirements of different parts, and have different anchoring effects. As an alternative, the openings are typically divided into circular holes of different sizes, typically holes with a diameter of less than 3mm may be referred to as small holes, e.g. 2.2mm, 2.4mm, 2.6 mm; pores with a diameter greater than 3mm may be referred to as mesopores, e.g., 3.2mm, 3.4mm, 3.6mm mesopores, and macropores with a diameter greater than 6mm, e.g., 6.4mm, 6.6mm, 6.8mm macropores.
In general, the number of holes, the hole density, the hole arrangement pattern, the pattern formed by the holes, and the like in the low-temperature thermoplastic resin anchor film can be designed according to the use of the anchor film, but the holes having such designs can be obtained by a punching method, and can be produced by the production method disclosed in the embodiment of the present application.
As an alternative, the method of punching holes sequentially from inside to outside generally means that the act of punching the fixed film material generally starts from the middle of the resin film material and then punches holes around it, gradually spreading radially outwards. The method for punching the holes in sequence from inside to outside can better avoid the buckling deformation of the fixed film, and is beneficial to the further processing and molding of the resin fixed film in the later period. As shown in fig. 1, after a first through hole 11 is punched from a first through hole 11 in the middle of a resin fixing film, eight second through holes 12 are sequentially punched around the first through hole 11, and then sixteen third through holes 13 around the second through holes 12 are punched and formed, and then the mesh structure designed on the fixing film is obtained through sequential operations.
As an alternative embodiment, the punching of the small holes and then the large holes generally means that the small holes are punched from the small hole distribution area according to the distribution situation of the mesh structure on the fixed film, and the small holes are punched from the large hole distribution area after the small holes are formed. The method of punching small holes and then large holes can better avoid the buckling deformation of the fixed membrane. As shown in fig. 2, a small hole array is provided in one region of the fixing film, and a large hole array is provided in an adjacent region, so that when punching is performed, punching can be performed from the small hole array region 21, after the small hole punching is completed, punching can be performed from the large hole array region 22, and a large hole can be obtained by punching.
Alternatively, the punching operation in the small hole region may be performed in accordance with a method of sequentially punching from the inside to the outside, and the obtained fixing film has a lower warpage rate.
As an alternative mode, the punching forming process of the large hole area can be carried out according to a method from inside to outside, and the warping rate of the obtained fixed film is lower.
As an alternative, punching a single hole and then punching multiple holes may reduce the warping rate of the fixed film. Punching a single hole refers to punching and forming each time to obtain one open hole, and punching a plurality of holes refers to punching and forming each time to obtain a plurality of open holes. The ratio of the number of the plurality of holes to the number of the single holes is usually set to 2 to 8:1, and alternatively, the ratio of the number of the plurality of holes to the number of the single holes is set to 4 to 8: 1. The method of punching a single hole and then punching a plurality of holes can also effectively reduce the warping rate of the fixed film.
As an alternative, punching a single hole and punching a plurality of holes are performed alternately in sequence. As shown in fig. 3, three single holes 31 arranged vertically may be punched, then a first multi-hole array 32 formed by seven holes may be punched, then three single holes 31 arranged vertically in a second row may be punched, then a second multi-hole array 33 formed by seven holes may be punched, then three single holes 31 arranged vertically in a third row may be punched, and then a third multi-hole array 34 formed by seven holes may be punched, in this order, the punching of the single holes and the punching of the multi-holes may be performed alternately in this order.
As an alternative embodiment, a single hole can be punched firstly to form a certain single hole array, a certain area to be punched is left, and after the single hole punching is finished, the multi-hole punching operation is carried out on the area to be punched.
As an alternative, punching a single hole and punching a plurality of holes are performed in combination with punching from the inside to the outside. As shown in fig. 4, the multi-hole array 42 includes four holes arranged in a square shape, the single holes 41 are disposed between the multi-hole arrays 42, and during the forming process, the multi-hole arrays 42 are crossed with the adjacent single holes 41, and gradually extended to a longer distance, and the punching is performed.
As an alternative, the punching of the single hole and then punching of the multiple holes are combined with the punching of the small holes and then punching of the large holes.
As an optional embodiment, the step of punching the single hole in the multi-hole punching process is to perform the multi-hole punching operation to form a certain mesh array, leave a certain area to be punched, and continue the single hole punching operation in the area to be punched after the multi-hole punching operation is finished. The ratio of the number of the plurality of holes to the number of the single holes is usually set to 2 to 8:1, and alternatively, the ratio of the number of the plurality of holes to the number of the single holes is set to 4 to 8: 1.
As an optional implementation mode, punching single holes in a multi-hole punching process is performed alternately, and punching is performed sequentially from inside to outside.
As an optional implementation mode, a single-hole punching mode is performed alternately in the multi-hole punching process, and meanwhile, the sequence of punching small holes first and then punching large holes is combined.
As an alternative embodiment, in the method for manufacturing the low-warpage low-temperature thermoplastic resin fixing film, the punching includes a combination of at least three methods. More punching forming methods are beneficial to reducing the warping rate of the fixing film.
In some embodiments, the punching process is performed using a punch press, which includes a pneumatic punch press and an oil pressure punch press.
In an optional embodiment, the punching pressure of the pneumatic press is set to 0.3 to 0.8 MPa.
In an alternative embodiment, the punching pressure of the hydraulic press is set to 80 to 300 MPa.
In some embodiments, the resin film material having mesh holes is formed into a resin fixed film of a set shape, the forming including:
(1) cutting the resin film material according to the set size and shape;
(2) the resin film material obtained by cutting is subjected to surface treatment and spray painting, and for example, spray painting using an aqueous release coating can be performed to obtain a smooth and uniform surface;
(3) the resin fixed film is obtained by subjecting the surface-treated resin film material to irradiation treatment, for example, with an irradiation dose set between 1 and 20 kGy.
In some embodiments, the low temperature thermoplastic resin feedstock comprises polycaprolactone, polyethylene, and a DCP crosslinker. As an optional embodiment, the low-temperature thermoplastic resin raw material comprises, by mass, 60-80 parts of polycaprolactone, 18-25 parts of polyethylene and 0.2-0.4 part of DCP cross-linking agent.
In some embodiments, the low temperature thermoplastic resin feedstock is extruded on a single screw extruder, the temperature of the individual sections of the single screw extruder being set to: the first zone is 85 ℃, the second zone is 100 ℃, the third zone is 125 ℃, the fourth zone is 135 ℃, the fifth zone is 140 ℃, the flange zone is 135 ℃ and the head is 120 ℃.
In the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present disclosure. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In the examples, some methods, means, instruments, apparatuses, etc. known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.
Example 1
Mixing 80 parts of polycaprolactone, 19.8 parts of PE and 0.2 part of DCP crosslinking agent, stirring for 15min, adding into a single-screw extruder, and carrying out blending extrusion, wherein the temperature of each section of the extruder is set as follows: first zone 85 ℃, second zone 100 ℃, third zone 125 ℃, fourth zone 135 ℃, fifth zone 140 ℃, flange zone 135 ℃, head 120 ℃, extrusion resin film material with the size of about 600mm x 600 mm.
The punching mode is combined by sequentially punching from inside to outside, punching small holes first and then large holes, and punching single holes first and then multiple holes, the ratio of the multiple holes to the single holes is 3:1, and the highest point warping degree of the fixed film after punching is 1.5 cm.
Example 2
Mixing 75 parts of polycaprolactone, 24.8 parts of PE and 0.2 part of DCP crosslinking agent, stirring for 15min, adding into a single-screw extruder, and carrying out blending extrusion, wherein the temperature of each section of the extruder is set as follows: first zone 85 deg.C, second zone 110 deg.C, third zone 135 deg.C, fourth zone 135 deg.C, fifth zone 140 deg.C, flange zone 135 deg.C, head 120 deg.C, extruding resin film material with size of about 600mm x 600 mm.
The punching mode is carried out by combining the modes of punching small holes and then large holes, punching single holes and then multi holes, and punching single holes alternately in the process of punching multi holes, wherein the ratio of the multi holes to the single holes is 8:1, after punching, the warpage of the highest point of the fixed film is 1.6 cm.
Example 3
Mixing 80 parts of polycaprolactone, 19.7 parts of PE and 0.3 part of DCP crosslinking agent, stirring for 15min, adding into a single-screw extruder, and carrying out blending extrusion, wherein the temperature of each section of the extruder is set as follows: first zone 85 deg.C, second zone 110 deg.C, third zone 135 deg.C, fourth zone 135 deg.C, fifth zone 140 deg.C, flange zone 135 deg.C, head 120 deg.C, extruding resin film material with size of about 600mm x 600 mm.
The punching mode is carried out by combining the modes of punching small holes and then large holes, punching single holes and then multi holes, and punching single holes alternately in the process of punching multi holes, wherein the ratio of the multi holes to the single holes is 6: 1, after punching, the warpage of the highest point of the fixed film is 1.8 cm.
Comparative example 1
Mixing 80 parts of polycaprolactone, 19.8 parts of PE and 0.2 part of DCP crosslinking agent, stirring for 15min, adding into a single-screw extruder, and carrying out blending extrusion, wherein the temperature of each section of the extruder is set as follows: first zone 85 deg.C, second zone 110 deg.C, third zone 135 deg.C, fourth zone 135 deg.C, fifth zone 140 deg.C, flange zone 135 deg.C, head 120 deg.C, extruding resin film material with size of about 600mm x 600 mm.
The punching mode is carried out by combining the methods of punching big holes first and then punching small holes and punching multiple holes first and then punching single holes, and the ratio of the multiple holes to the single holes is 9: 1, after punching, the warping degree of the highest point of the plate is 3.6 cm.
The manufacturing method of the low-warpage low-temperature thermoplastic resin fixed film disclosed by the embodiment of the application combines multiple punching methods, the warpage of the obtained fixed film is low and is not more than 2cm, the deformation degree of the fixed film is improved, and the post-processing difficulty is reduced.
The technical solutions and technical details disclosed in the embodiments of the present application are only examples to illustrate the concept of the present application, and do not constitute limitations of the present application, and all inventive changes that are made to the technical details disclosed in the present application have the same inventive concept as the present application and are within the scope of the claims of the present application.
Claims (10)
1. A method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film is characterized by comprising the following steps of:
extruding and molding a low-temperature thermoplastic resin raw material into a resin film material;
punching a resin film material by a punch according to a set mesh structure to form a mesh structure;
processing and molding a resin film material with a set mesh structure into a resin fixed film with a set shape;
wherein the punching is performed according to one or a combination of the following methods:
(1) punching holes from inside to outside in sequence;
(2) punching small holes and then big holes;
(3) punching a single hole and then punching multiple holes;
(4) punching single holes in the multi-hole punching process;
wherein the ratio of the number of the plurality of holes to the number of the single holes is set to 2 to 8: 1.
2. The method of claim 1, wherein the press comprises a pneumatic press and an oil press.
3. The method for manufacturing a low-temperature thermoplastic resin fixing film with low warpage according to claim 2, wherein the punching pressure of the pneumatic punching machine is set to 0.3 to 0.8 Mpa.
4. The method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film according to claim 2, wherein the punching pressure of the hydraulic punch press is set to 80 to 300 Mpa.
5. The method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film according to claim 1, wherein the machining and molding comprises:
(1) cutting the resin film material according to the set size and shape;
(2) performing surface treatment on the resin film material obtained by cutting and spraying paint;
(3) and irradiating the resin film material subjected to the surface treatment to obtain the resin fixed film.
6. The method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film according to claim 1, wherein the low-temperature thermoplastic resin raw material comprises polycaprolactone, polyethylene and a DCP crosslinking agent.
7. The method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film according to claim 6, wherein the low-temperature thermoplastic resin raw material comprises, in parts by mass:
60-80 parts of polycaprolactone
18-25 parts of polyethylene
0.2-0.4 part of DCP crosslinking agent.
8. The method for manufacturing a low-warpage low-temperature thermoplastic resin fixing film according to claim 6, wherein the low-temperature thermoplastic resin raw material is extruded and molded on a single-screw extruder, and the temperature of each section of the single-screw extruder is set as follows: the first zone is 85 ℃, the second zone is 100 ℃, the third zone is 125 ℃, the fourth zone is 135 ℃, the fifth zone is 140 ℃, the flange zone is 135 ℃ and the head is 120 ℃.
9. The method of claim 1, wherein the punching comprises a combination of at least three methods.
10. The method for manufacturing a low-temperature thermoplastic resin fixing film with low warpage according to claim 1, wherein the ratio of the number of the plurality of holes to the number of the single holes is set to 4 to 8: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910611847.6A CN110356022B (en) | 2019-07-08 | 2019-07-08 | Manufacturing method of low-warpage low-temperature thermoplastic resin fixed film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910611847.6A CN110356022B (en) | 2019-07-08 | 2019-07-08 | Manufacturing method of low-warpage low-temperature thermoplastic resin fixed film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110356022A CN110356022A (en) | 2019-10-22 |
| CN110356022B true CN110356022B (en) | 2021-01-26 |
Family
ID=68218229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910611847.6A Active CN110356022B (en) | 2019-07-08 | 2019-07-08 | Manufacturing method of low-warpage low-temperature thermoplastic resin fixed film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110356022B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1357388A (en) * | 2001-07-18 | 2002-07-10 | 易民 | New-type medical bandage |
| CN1509772A (en) * | 2002-12-25 | 2004-07-07 | 上海材料研究所 | Medical polymer fixing material and producing method thereof |
| CN1875899A (en) * | 2006-05-30 | 2006-12-13 | 蔡子辛 | Secondary mesh combined plastic punched film and method for making same |
| CN101062977A (en) * | 2006-04-24 | 2007-10-31 | 广州科莱瑞迪医疗器材有限公司 | Low-temperature thermoplastic material and preparation technique thereof |
| CN203342203U (en) * | 2013-07-11 | 2013-12-18 | 吴持跃 | Radiotherapy positioning membrane |
-
2019
- 2019-07-08 CN CN201910611847.6A patent/CN110356022B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1357388A (en) * | 2001-07-18 | 2002-07-10 | 易民 | New-type medical bandage |
| CN1509772A (en) * | 2002-12-25 | 2004-07-07 | 上海材料研究所 | Medical polymer fixing material and producing method thereof |
| CN101062977A (en) * | 2006-04-24 | 2007-10-31 | 广州科莱瑞迪医疗器材有限公司 | Low-temperature thermoplastic material and preparation technique thereof |
| CN1875899A (en) * | 2006-05-30 | 2006-12-13 | 蔡子辛 | Secondary mesh combined plastic punched film and method for making same |
| CN203342203U (en) * | 2013-07-11 | 2013-12-18 | 吴持跃 | Radiotherapy positioning membrane |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110356022A (en) | 2019-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE10233401B4 (en) | Bioresorbable multichannel nerve regeneration conduit and method of making the same | |
| DE60319988T2 (en) | Method for producing a microstructure | |
| CN111479597B (en) | Adjustable external fixation brace | |
| WO2004074425A2 (en) | Method and device for the formation of biological cell material | |
| EP3172037B1 (en) | Method for manufacturing a component by a generative manufacturing process, apparatus for manufacturing a component by a generative manufacturing process, and medical implant generated for an individual patient | |
| CN101698743B (en) | Low-temperature thermoplastic material and preparation method thereof | |
| CN110356022B (en) | Manufacturing method of low-warpage low-temperature thermoplastic resin fixed film | |
| CN112500151B (en) | Bioactive ceramic support, flexible adjustable three-dimensional green body and preparation method thereof | |
| CN101062977B (en) | Low-temperature thermoplastic material and preparation technique thereof | |
| EP1948421B1 (en) | Method for producing grained plastic mouldings | |
| DE102011107577B4 (en) | Implant, component set, method for producing an implant and / or a component set and apparatus for carrying out a method for producing an implant and / or a component | |
| JP2021522978A (en) | Percutaneous drug transfer patch and its manufacturing method | |
| CN110776724A (en) | Functional elastic foaming material and preparation method and application thereof | |
| CN1509772A (en) | Medical polymer fixing material and producing method thereof | |
| US1586076A (en) | Process for producing perforated sheet sponge rubber | |
| CN104788923A (en) | Novel low-temperature thermoplastic material and preparation method thereof | |
| EP0772425A1 (en) | Membrane for regenerating body tissues and use of said membrane as a wound covering and substitute skin | |
| CN105420848B (en) | Superfine polyglycolide fiber, preparation method and device thereof, application thereof and patch | |
| CN1460058A (en) | Porous film and process for producing same | |
| DE4102258A1 (en) | Negative copy mfr. from component using laser-cured fluid - by converting profile data into control signals for swivelling laser which locally cures resin around components which descends through fluid | |
| CN1544096A (en) | Shape memory processing biodegradating vitro fixed material for medical use and its preparation | |
| CN1357388A (en) | New-type medical bandage | |
| CN108030573A (en) | Load complex stephanoporate bracket of drug bearing microsphere and its preparation method and application | |
| CN105348655A (en) | Ethylene-propylene-diene monomer rubber-based microporous foam material and preparation method thereof | |
| DE19849263C2 (en) | Process for producing a component by coextrusion |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |