CN110355438A - Rapid cooling system - Google Patents
Rapid cooling system Download PDFInfo
- Publication number
- CN110355438A CN110355438A CN201810312632.XA CN201810312632A CN110355438A CN 110355438 A CN110355438 A CN 110355438A CN 201810312632 A CN201810312632 A CN 201810312632A CN 110355438 A CN110355438 A CN 110355438A
- Authority
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- Prior art keywords
- product
- cooling system
- connecting pipeline
- detecting
- rapid cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 52
- 239000007789 gas Substances 0.000 claims description 61
- 238000010438 heat treatment Methods 0.000 claims description 32
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 230000005856 abnormality Effects 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000112 cooling gas Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 13
- 238000005476 soldering Methods 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001594 aberrant effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000000626 liquid-phase infiltration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Abstract
The present invention provides a kind of rapid cooling systems, comprising: processing equipment, cooling device, arrangement for detecting and control device.Rapid cooling system through the invention; when processing equipment breaks down and shuts down; directly the product in high-temperature region is rapidly cooled using inactive cooling gas, product caused by long-time was stopped in high-temperature region so as to avoid product and scraps, and improved product yields.
Description
Technical field
The present invention relates to field of semiconductor manufacture, more particularly to a kind of rapid cooling system.
Background technique
Reflow Soldering is one of important process in semiconductor convex block encapsulation technology.In reflow soldering process, Reflow Soldering board
The set temperature of high-temperature region is more than the fusing point of soldered ball, and product is stopped with the process time set in high-temperature region, makes the weldering on product
Ball melts and completes the technical process of setting.When the failures such as cancel closedown occurs in Reflow Soldering board, need to wait board high temperature
The temperature in area can take out aberrant batches product after naturally cooling to soldered ball fusing point or less, which, which generally far surpasses, sets
The fixed process time.Therefore, in the prior art, it is too long to will lead to residence time of the product in high-temperature region extremely for board, causes
Soldered ball melts and flows other regions of infiltration product surface, and then product is caused to be scrapped.
Therefore, it is necessary to propose a kind of rapid cooling system, for when Reflow Soldering board is abnormal, to high-temperature region system
Product are rapidly cooled, and prevent product from scrapping, and are solved the above problems.
Summary of the invention
In view of the foregoing deficiencies of prior art, it the purpose of the present invention is to provide a kind of rapid cooling system, is used for
The problem of when Reflow Soldering board is abnormal, product is too long in the high-temperature region residence time for solution, and product is caused to be scrapped.
To achieve the above object and other related purposes, the present invention provide a kind of rapid cooling system, the rapid cooling
System includes processing equipment, cooling device, arrangement for detecting and control device.
The processing equipment includes processing chamber housing, the product plummer for carrying product and heating plate；Wherein, the system
Product plummer and the heating plate are respectively positioned in the processing chamber housing.
The cooling device includes gas source, gas piping and valve, described gas piping one end and the gas source phase
Connection, the other end extend in the processing chamber housing；The valve is set on the gas piping.
The arrangement for detecting detects the working condition of the processing equipment.
The control device is connected with the arrangement for detecting and the valve, for being fed back according to the arrangement for detecting
Signal control the valve opening or closing.
As a preferred solution of the present invention, the gas source includes at least nitrogen and inert gas.
As a preferred solution of the present invention, the cooling device further includes gas outlet, and the gas outlet is located at described
In processing chamber housing, the gas outlet extends to the indoor one end of the processing chamber with the gas piping and is connected, and extends to
The product back side.
As a preferred solution of the present invention, the quantity of the gas outlet is multiple, and multiple gas outlets are uniformly divided
It is distributed on the product plummer.
As a preferred solution of the present invention, the heating plate is set on the product carrying platform, and is located at institute
The lower section of product is stated, the heating plate is for during processing heating the product.
As a preferred solution of the present invention, the heating plate is set to side wall or the top of the processing chamber housing, uses
In being heated during processing to the product.
As a preferred solution of the present invention, the processing equipment includes solder reflow device.
As a preferred solution of the present invention, the processing chamber housing includes high-temperature region, the product plummer and described
Heating plate is respectively positioned in the high-temperature region.
As a preferred solution of the present invention, the valve is three-way valve, and the rapid cooling system further includes true
Empty device and the second connecting pipeline；The gas piping includes supply air line and the first connecting pipeline, described supply air line one end
It is connected with the gas source, the other end is connected with the three-way valve, first connecting pipeline one end and the threeway
Valve is connected, and the other end extends in the processing chamber housing；Second connecting pipeline one end is connected with the triple valve, separately
One end is connected with the vacuum plant.
As a preferred solution of the present invention, the arrangement for detecting includes:
Detecting module, for detecting the working condition of the processing equipment；
Feedback module is connected with the detecting module and the control device, for detecting in the detecting module
Valve closing signal is fed back to the control module when working condition of the processing equipment is normal condition, is filled by the control
It sets the control three-way valve first connecting pipeline is connected with second connecting pipeline, and first communicating pipe
Road and the supply air line are blocked；And the working condition of the processing equipment is detected as abnormality in the detecting module
Or valve opening signal is fed back to the control device when emergency shutdown state, the three-way valve is controlled by the control device
First connecting pipeline is connected with the supply air line, and first connecting pipeline and the second connecting pipeline phase
Partition.
As described above, the present invention provides a kind of rapid cooling system, have the advantages that
The present invention uses inactive cooling when processing equipment breaks down and shuts down by introducing rapid cooling system
Gas is directly rapidly cooled the product in high-temperature region, caused by stopping long-time in high-temperature region so as to avoid product
Product is scrapped, and product yields is improved.
Detailed description of the invention
Fig. 1 to Fig. 3 is shown as the rapid cooling system schematic provided in the embodiment of the present invention one.
Fig. 4 is shown as the rapid cooling system schematic provided in the embodiment of the present invention two.
Component label instructions
10 processing equipments
101 processing chamber housings
102 product plummers
103 heating plates
104 products
11 cooling devices
111 gas sources
112 gas pipings
1121 supply air lines
1122 first connecting pipelines
113 valves
114 gas outlets
115 three-way valves
12 arrangement for detecting
121 detecting modules
122 feedback modules
13 control devices
14 vacuum plants
15 second connecting pipelines
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Disclosed content understands further advantage and effect of the invention easily.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
It please refers to Fig.1 to Fig.4.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of invention, though only show in diagram with related component in the present invention rather than package count when according to actual implementation
Mesh, shape and size are drawn, when actual implementation form, quantity and the ratio of each component can arbitrarily change for one kind, and its
Assembly layout form may also be increasingly complex.
Embodiment one
Referring to Fig. 1, the present invention provides a kind of rapid cooling system, including processing equipment 10, cooling device 11, detecting
Device 12 and control device 13；The processing equipment 10 includes processing chamber housing 101, the product plummer for carrying product 104
102 and heating plate 103；Wherein, the product plummer 102 and the heating plate 103 are respectively positioned in the processing chamber housing 101；
The cooling device 11 includes gas source 111, gas piping 112 and valve 113, described 112 one end of gas piping and the gas
Body source 111 is connected, and the other end extends in the processing chamber housing 101；The valve 113 is set to the gas piping 112
On；The arrangement for detecting 12 detects the working condition of the processing equipment 10；The control device 13, with the arrangement for detecting 12
And the valve 113 is connected, the signal for being fed back according to the arrangement for detecting 12 controls the valve 113 and opens or close
It closes.It is described when the working condition that the arrangement for detecting 12 detects the processing equipment 10 is normal in article treating process
Arrangement for detecting 12 feeds back valve closing signal to the control device 13, and the control device 13 maintains the shape of the valve 113
State is to close；When the working condition that the arrangement for detecting 12 detects the processing equipment 10 occurs abnormal, the detecting dress
It sets 12 and feeds back valve opening signal to the control device 13, the control device 13 opens the valve 113, the gas source
Cooling gas in 111 enters the processing chamber housing 101 by gas piping 112, cools down to the product 104.
As an example, the gas source 111 includes at least nitrogen and inert gas.Due at high temperature, the product 104
It is easily chemically reacted with oxygen isoreactivity gas, and then product is caused to be scrapped.Therefore, it is passed through the processing chamber housing 101
Cooling gas must be the gas that will not be chemically reacted with the product 104, such as nitrogen or inert gas etc..As this
The preferred embodiment of invention selects nitrogen to cool down as gas source to the product 104.
As an example, the cooling device 11 further includes gas outlet 114, the gas outlet 114 is located at the processing chamber housing
In 101, the gas outlet 114 is connected with one end that the gas piping 112 extends in the processing chamber housing 101, and prolongs
Extend to 104 back side of product.Cooling gas is directly purged the product by the gas outlet 114 by the cooling device 11
104 back side, this not only can effectively cool down the product 104, and also avoiding directly purging 104 front of product may cause
Soldered ball deformation or the defects of particle contamination.
As an example, the quantity of the gas outlet 114 be it is multiple, multiple gas outlets 114 are uniformly distributed in the system
On product plummer 102.Referring to Fig. 2, thering are multiple gas outlets 114 to be uniformly distributed in the product plummer in Fig. 2
On 102, when being passed through cooling gas, compared to the setting of the single gas outlet 114, multiple gas outlets 114 will make described
The cooling procedure of product 104 is more rapid and uniform.
As an example, the heating plate 103 is set on the product carrying platform 102, and it is located at the product 104
Lower section, the heating plate 103 is for during processing heating the product 104.As shown in Figure 1, working as the heating
When plate 103 is located at the lower section of the product 104, the heating plate 103 supports the product 104 during processing, and to institute
Product 104 is stated to be heated.The gas outlet 114 pass through the heating plate 103, in cooling procedure to the product 104 into
Row cooling.
As an example, the heating plate 103 is set to side wall or the top of the processing chamber housing 101, for processed
The product 104 is heated in journey.As shown in figure 3, being that the heating plate 103 is set to 101 top of processing chamber housing
The case where.According to the difference of used heating method, the heating plate 103 be can be set in the processing chamber housing 101 not
Same position, to obtain optimal heating effect.The gas outlet 114 and the heating plate 103 are provided separately, can make to cool down
Gas is far from heating source, to generate better cooling effect.
As an example, the processing equipment 10 includes solder reflow device.In existing solder reflow device, once occur different
The often failures such as shutdown, after can only waiting board temperature natural cooling, further take out the abnormal product in equipment.This can make to rest on height
The product of warm area generates exception and scraps.Solder reflow device can be effectively improved in exception using rapid cooling system of the invention
The case where waste product is generated when shutdown.
As an example, the processing chamber housing includes high-temperature region, the product plummer and the heating plate are respectively positioned on described
In high-temperature region.The processing chamber housing can generally be equipped with heating zone, heat preservation zone, high-temperature region and cold according to the needs of process flow
But area, the product sequentially enter each region.Each region have different setting technological temperatures, and to enter each region
The product 104 carry out corresponding process.In above-mentioned each region, only the temperature of high-temperature region can be higher than the molten of soldered ball
Point, cancel closedown may result in soldered ball and melt infiltration.Therefore, it is arranged in the high-temperature region of the processing chamber housing of the present invention
Rapid cooling system the product of high-temperature region can be rapidly cooled, scrapped to prevent product.
Embodiment two
Referring to Fig. 4, comparing embodiment one the present invention also provides the another embodiment of the Rapid Cleaning system
Have following difference: the valve is three-way valve 115, and the rapid cooling system further includes vacuum plant 14 and the second communicating pipe
Road 15；The gas piping 112 include supply air line 1121 and the first connecting pipeline 1122, described 1121 one end of supply air line with
The gas source 111 is connected, and the other end is connected with the three-way valve 115, described first connecting pipeline, 1122 one end with
The triple valve 115 is connected, and the other end extends in the processing chamber housing 101；Described second connecting pipeline, 15 one end and institute
It states triple valve 115 to be connected, the other end is connected with the vacuum plant 14.
Compared to embodiment one, former valve 113 has been changed into three-way valve 115 in the present embodiment, and by the triple valve
One end that door 115 has more connects the vacuum plant 14.The vacuum plant 14 passes through first connecting pipeline 1122 and institute
It states the second connecting pipeline 15 and provides negative pressure of vacuum to the processing equipment 10.Vacuum environment is for some process treatment process to pass
It is important, such as in reflow soldering process, by introducing vacuum back-flow weldering, weld tabs voidage can be effectively reduced, improving product can
By property；For another example the product 104 can also be absorbed and fixed at by the product plummer by negative pressure of vacuum during processing
On 102.Two-way pipeline is integrated on connecting pipeline all the way, i.e., the first connection by the present invention by introducing the three-way valve 115
Pipeline 1122, without additionally installing connecting pipeline and gas outlet additional on board.Equipment cost has not only been saved in the design, is also saved
The design space of the processing equipment 10.
As an example, the arrangement for detecting 12 includes: detecting module 121 and feedback module 122；The detecting module 121,
For detecting the working condition of the processing equipment 10；The feedback module 122, with the detecting module 121 and the control
Device 13 is connected, when the working condition for detecting the processing equipment 10 in the detecting module 121 is normal condition
Valve closing signal is fed back to the control module 13, the three-way valve 115 is controlled for described the by the control device 13
A connecting pipe road 1122 is connected with second connecting pipeline 15, and first connecting pipeline 1122 and the supply air line
1121 is blocked；It and in the working condition that the detecting module 121 detects the processing equipment 10 is abnormality or urgent
Valve opening signal is fed back to the control device 13 when shutdown status, the three-way valve is controlled by the control device 13
115 are connected first connecting pipeline 1122 with the supply air line 1121, and first connecting pipeline 1122 and institute
It is blocked to state the second connecting pipeline 15.
The detecting module 121 connects the processing equipment 10 and detects its working condition.The work of the processing equipment 10
It is divided into normal condition, cancel closedown state or emergency shutdown state as state.The working condition is real by the detecting module 121
When detect, and working state signal is transmitted to the feedback module 122.The normal condition, that is, processing equipment 10 is no different
Often, the product 104 normally passes in and out the processing chamber housing 101 according to the process time of setting and temperature.The cancel closedown shape
State is that the detecting module 121 detects the 104 appearance position exception of product or transmission abnormality and 101 temperature of the processing chamber housing
Temperature range of the degree beyond setting causes described in the product 104 can not normally pass in and out according to the process time of setting and temperature
Processing chamber housing 101.When the emergency shutdown state is that Field Force presses EMO (EMERGENCY OFF) button according to judgement, institute
State state when emergency shutdown occurs for processing equipment 10.
The feedback module 122 is separately connected the detecting module 121 and the control device 13, when the detecting module
When the signal of 121 transmission is normal condition, Xiang Suoshu control module 13 feeds back valve closing signal, is controlled by the control device 13
It makes the three-way valve 115 and first connecting pipeline 1122 is connected with second connecting pipeline 15, and described first
Connecting pipeline 1122 and the supply air line 1121 are blocked.At this point, the vacuum plant 14 passes through first connecting pipeline
1122 are connected with second connecting pipeline 15 with the processing chamber housing 101, and provide vacuum to the processing chamber housing 101 and bear
Pressure.When the signal of the detecting module 121 transmission is abnormality or emergency shutdown state, Xiang Suoshu control device 13 is fed back
Valve opening signal, by the control device 13 control the three-way valve 115 by first connecting pipeline 1122 with it is described
Supply air line 1121 is connected, and first connecting pipeline 1122 and second connecting pipeline 15 are blocked.At this point, described
Three-way valve 115 is switched to connection first connecting pipeline 1122 and the supply air line 1121, and the gas source 111 is to institute
It states in processing chamber housing 101 and is passed through cooling gas, the product 114 is rapidly cooled.
In conclusion the present invention provides a kind of rapid cooling systems.The rapid cooling system include: processing equipment,
Cooling device, arrangement for detecting and control device.Rapid cooling system through the invention breaks down shutdown in processing equipment
When, directly the product in high-temperature region is rapidly cooled using inactive cooling gas, so as to avoid product in high temperature
Area stopped product caused by long-time and scrapped, and improved product yields.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (10)
1. a kind of rapid cooling system, which is characterized in that including processing equipment, cooling device, arrangement for detecting and control device；
The processing equipment includes processing chamber housing, the product plummer for carrying product and heating plate；Wherein, the product is held
Microscope carrier and the heating plate are respectively positioned in the processing chamber housing；
The cooling device includes gas source, gas piping and valve, and described gas piping one end is connected with the gas source,
The other end extends in the processing chamber housing；The valve is set on the gas piping；
The arrangement for detecting detects the working condition of the processing equipment；
The control device is connected with the arrangement for detecting and the valve, the letter for being fed back according to the arrangement for detecting
Number the control valve opening or closing.
2. rapid cooling system according to claim 1, which is characterized in that the gas source includes at least nitrogen and inertia
Gas.
3. rapid cooling system according to claim 1, which is characterized in that the cooling device further includes gas outlet, institute
It states gas outlet to be located in the processing chamber housing, the gas outlet and the gas piping extend to the indoor one end of the processing chamber
It is connected, and extends to the product back side.
4. rapid cooling system according to claim 3, which is characterized in that the quantity of the gas outlet be it is multiple, it is multiple
The gas outlet is uniformly distributed on the product plummer.
5. rapid cooling system according to claim 1, which is characterized in that the heating plate is set to the product carrying
On platform, and it is located at the lower section of the product, the heating plate is for during processing heating the product.
6. rapid cooling system according to claim 1, which is characterized in that the heating plate is set to the processing chamber housing
Side wall or top, for being heated during processing to the product.
7. rapid cooling system according to claim 1, which is characterized in that the processing equipment includes solder reflow device.
8. rapid cooling system according to claim 1, which is characterized in that the processing chamber housing includes high-temperature region, described
Product plummer and the heating plate are respectively positioned in the high-temperature region.
9. rapid cooling system according to claim 1, which is characterized in that the valve is three-way valve, described quick
Cooling system further includes vacuum plant and the second connecting pipeline；
The gas piping includes supply air line and the first connecting pipeline, and described supply air line one end is connected with the gas source
It connects, the other end is connected with the three-way valve, and first connecting pipeline one end is connected with the triple valve, and the other end prolongs
It extends in the processing chamber housing；
Second connecting pipeline one end is connected with the triple valve, and the other end is connected with the vacuum plant.
10. rapid cooling system according to claim 9, which is characterized in that the arrangement for detecting includes:
Detecting module, for detecting the working condition of the processing equipment；
Feedback module is connected with the detecting module and the control device, described for detecting in the detecting module
Valve closing signal is fed back to the control module when working condition of processing equipment is normal condition, by the control device control
Make the three-way valve and first connecting pipeline be connected with second connecting pipeline, and first connecting pipeline with
The supply air line is blocked；It and in the working condition that the detecting module detects the processing equipment is abnormality or tight
Valve opening signal is fed back to the control device when anxious shutdown status, the three-way valve is controlled for institute by the control device
It states the first connecting pipeline to be connected with the supply air line, and first connecting pipeline is separated by with second connecting pipeline
It is disconnected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810312632.XA CN110355438A (en) | 2018-04-09 | 2018-04-09 | Rapid cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810312632.XA CN110355438A (en) | 2018-04-09 | 2018-04-09 | Rapid cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110355438A true CN110355438A (en) | 2019-10-22 |
Family
ID=68212178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810312632.XA Pending CN110355438A (en) | 2018-04-09 | 2018-04-09 | Rapid cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110355438A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070267144A1 (en) * | 2006-05-18 | 2007-11-22 | Makoto Inagawa | Heating and Cooling Plate for a Vacuum Chamber |
| CN102615370A (en) * | 2012-02-27 | 2012-08-01 | 华中科技大学 | Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof |
| CN103889631A (en) * | 2011-10-25 | 2014-06-25 | 乔治洛德方法研究和开发液化空气有限公司 | Method and device for cooling soldered printed circuit boards |
| CN107112247A (en) * | 2014-12-26 | 2017-08-29 | 富士电机株式会社 | Heating-cooling apparatus |
| CN208322371U (en) * | 2018-04-09 | 2019-01-04 | 中芯长电半导体（江阴）有限公司 | rapid cooling system |
-
2018
- 2018-04-09 CN CN201810312632.XA patent/CN110355438A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070267144A1 (en) * | 2006-05-18 | 2007-11-22 | Makoto Inagawa | Heating and Cooling Plate for a Vacuum Chamber |
| CN103889631A (en) * | 2011-10-25 | 2014-06-25 | 乔治洛德方法研究和开发液化空气有限公司 | Method and device for cooling soldered printed circuit boards |
| CN102615370A (en) * | 2012-02-27 | 2012-08-01 | 华中科技大学 | Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof |
| CN107112247A (en) * | 2014-12-26 | 2017-08-29 | 富士电机株式会社 | Heating-cooling apparatus |
| CN208322371U (en) * | 2018-04-09 | 2019-01-04 | 中芯长电半导体（江阴）有限公司 | rapid cooling system |
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