CN110349720A - Metal-oxide varistor and its manufacturing method - Google Patents
Metal-oxide varistor and its manufacturing method Download PDFInfo
- Publication number
- CN110349720A CN110349720A CN201810301249.4A CN201810301249A CN110349720A CN 110349720 A CN110349720 A CN 110349720A CN 201810301249 A CN201810301249 A CN 201810301249A CN 110349720 A CN110349720 A CN 110349720A
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- Prior art keywords
- packaging part
- metal
- oxide varistor
- terminal
- metallic electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/102—Varistor boundary, e.g. surface layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
- H01C7/108—Metal oxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1006—Thick film varistors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
Abstract
The present invention relates to a kind of metal-oxide varistor, which includes: the discoid pieces made of piezoresistive material (2)；First metallic electrode (3), first metallic electrode (3) are arranged on discoid pieces (2)；And the packaging part (1) being made of insulating material, discoid pieces (2) are at least partially embedded in packaging part (1).In addition, the present invention relates to a kind of methods for manufacturing metal-oxide varistor, wherein the packaging part (1) being made of insulating material is to apply on discoid pieces (2) by thermoforming.
Description
Technical field
The present invention relates to the methods of metal-oxide varistor and manufacture metal-oxide varistor.
Background technique
CN1925072A discloses a kind of piezoresistor being arranged in closing chamber.
By dipping process or spraying process by insulator-coating to piezoresistor, due to these mistakes
The property of journey and the size that final products may not be able to be accurately controlled.In addition, in order to which other component is assembled to pressure-sensitive electricity
Device is hindered, additional shell is needed.
Summary of the invention
It is pressure-sensitive for manufacturing that the purpose of the present invention is to provide a kind of improved metal-oxide varistors and one kind
The method of resistor.
Subject matter of the independent claims realize the purpose.
A kind of metal-oxide varistor is provided, which includes: by varistor
Discoid pieces made of material；First metallic electrode, first metallic electrode are arranged on discoid pieces；And by insulating materials
Manufactured packaging part, discoid pieces are at least partially embedded in the packaging part.
Insulating materials can be epoxy resin or silicone resin.
The discoid pieces made of piezoresistive material can have any shape.Discoid pieces are preferably flat.Thus,
The height of discoid pieces --- between the second metallic electrode i.e. in the opposite side of the first metallic electrode and discoid pieces away from
From --- can be than the width of discoid pieces --- i.e. the extended distances on the direction with high perpendicular of discoid pieces --- it is smaller.
Metal-oxide varistor can not need additional shell to make the plate-like made of piezoresistive material
Part insulation.But insulation can be provided by the packaging part being made of insulating material.
The packaging part being made of insulating material can be used on discoid pieces by thermoforming.Thermoforming can permit with
High-precision applications insulating materials.Thus, piezoresistor can be configured to have accurate size.In addition, thermoforming can be permitted
Perhaps the thin layer being made of insulating material is formed.Therefore, it is possible to construct lesser piezoresistor.Therefore, it is answered by thermoforming
It can contribute to that piezoresistor is miniaturized with insulating materials.
Thermoforming is to provide the manufacturing method of higher flexibility in the fabrication process.Thus, thermoforming can make insulation material
The application of material is adapted to the desired characteristic of piezoresistor.
Packaging part can only partially cover the first metallic electrode, and the window for making the exposure of the first metallic electrode is consequently formed
Mouthful.Therefore, the first metallic electrode can be in electrical contact by contact in the window, which is fixed to --- for example weld
Extremely --- the first metallic electrode.
First terminal can be disposed on the first metallic electrode.First terminal can be hardware, metal member
Part includes the hardware for being fixed to the first metallic electrode.Piezoresistor can be electrically contacted via first terminal.
Packaging part can only partially cover first terminal, and the window for making first terminal exposure is consequently formed.Thus, first
Terminal can be electrically contacted in the window.
Discoid pieces can be completely covered in packaging part, and first terminal may include the first contact element stretched out from packaging part
Part.First terminal can be in electrical contact by contacting first contact element.
First contact element can along with discoid pieces by application have the parallel direction in the surface of the first metallic electrode from
Packaging part stretches out.Alternatively, first contact element can be along the surface for being had the first metallic electrode by application with discoid pieces
Vertical direction is stretched out from packaging part.
Metal-oxide varistor can also include the second metallic electrode, and second metallic electrode is with first
Metallic electrode opposite side is arranged on discoid pieces.Electricity can be applied between the first metallic electrode and the second metallic electrode
Pressure.
Packaging part can only partially cover the second metallic electrode, and the window for making the exposure of the second metallic electrode is consequently formed
Mouthful.
Second terminal can be disposed on the second metallic electrode.
Packaging part can only partially cover Second terminal, and the window for making Second terminal exposure is consequently formed.
Discoid pieces can be completely covered in packaging part, and Second terminal includes the second contact element stretched out from packaging part.
Second contact element can along with discoid pieces by application have the parallel direction in the surface of the second metallic electrode from
Packaging part stretches out.Alternatively, second contact element can be along the surface for being had the second metallic electrode by application with discoid pieces
Vertical direction is stretched out from packaging part.
Packaging part may include the protrusion for component to be assembled to metal-oxide varistor.Protrusion can pass through
The thermoforming of insulating materials is formed.It can not need other component is fixed to metal-oxide varistor
Additional shell.
The invention further relates to it is a kind of include at least one protrusion metal-oxide varistor and be fixed on it is prominent
The component of component on rising.The component can be SMD component (SMD=surface mount device).
The present invention relates to a kind of methods for manufacturing above-mentioned metal-oxide varistor according to another aspect, wherein by
Packaging part made of insulating materials is applied on discoid pieces by thermoforming.Packaging part is applied to provide using thermoforming
Many advantages.Particularly, insulating materials can also be applied with high precision even if on the piezoresistor in smaller size.In addition,
Protrusion can be formed with insulating materials directly on packaging part, thus allow other component being fixed to piezoresistor.
Detailed description of the invention
Hereinafter, the present invention is carried out referring to the attached drawing for showing the preferred embodiment of the present invention further detailed
Description.
Fig. 1 a and Fig. 1 b show the perspective view of metal-oxide varistor according to first embodiment.
Fig. 2 a and Fig. 2 b show the perspective views according to the metal-oxide varistor of second embodiment.
Fig. 3 a and Fig. 3 b show the perspective view of the metal-oxide varistor according to third embodiment.
Fig. 4 a and Fig. 4 b show the perspective view of the metal-oxide varistor according to the 4th embodiment.
Fig. 5 a and Figure 5b shows that the perspective views according to the metal-oxide varistor of the 5th embodiment.
Fig. 6 a and Fig. 6 b show the perspective view of the metal-oxide varistor according to sixth embodiment.
Specific embodiment
Fig. 1 a and Fig. 1 b show the perspective view of metal-oxide varistor.In Figure 1b, packaging part 1 is shown as
It is bright to keep the element in packaging part 1 visible.
Piezoresistor includes discoid pieces 2 made of piezoresistive material.Discoid pieces 2 have rectangular shape.Plate-like
Part 2 has top surface and the bottom surface opposite with top surface.The base regions of discoid pieces 2 are generally square.Discoid pieces 2 and base area
The vertical height in domain is significantly less than the side length of generally square base regions.Thus, discoid pieces 2 are flat.The present invention is not
It is limited to the discoid pieces 2 with the shape.But discoid pieces 2 can have any other shape.
The first metallic electrode 3 is disposed on the top surface of discoid pieces 2.The second gold medal is disposed on the bottom surface of discoid pieces 2
Belong to polarizing electrode 4.
Discoid pieces 2 and metallic electrode 3,4 are at least partially embedded in packaging part 1.It is real shown in Fig. 1 a and Fig. 1 b
It applies in mode, discoid pieces 2 and metallic electrode 3,4 are completely embedded into packaging part 1.Packaging part 1 is made of insulating materials.
Piezoresistor further includes the first terminal 5 being arranged on the first metallic electrode 3.First terminal 5 includes welding
To the flat metal structural member 5a of the first metallic electrode 3.First terminal 5 further includes stretching out into the contact element far from discoid pieces 2
Part 5b.Contact element 5b is arranged in the edge of flat metal structural member 5a.Contact element 5b is perpendicular to flat metal structural member
5a.Contact element 5b also is normal to the first metallic electrode 3.
The flat metal structural member 5a of terminal 5 is completely covered in packaging part 1.Contact element 5b is stretched out from packaging part 1.It can be to
Contact element 5b applies potential.The potential is applied to the first metallization electricity via flat metal structural member 5a by contact element 5b
Pole 3.
In addition, piezoresistor includes the Second terminal 6 for being fixed to the second metallic electrode 4.Second terminal 6 includes flat
Hardware 6a and contact element 6b.Flat metal structural member 6a is soldered to the second metallic electrode 4.Contact element 6b arrangement
On the edge of flat metal structural member 6a and stretch out at far from flat metal structural member 6b.The flat metal of Second terminal 6
Structural member 6a is packaged part 1 and is completely covered.The contact element 6a of Second terminal 6 is stretched out from packaging part 1.The contact of Second terminal 6
Contact element 5b of the element 6b perpendicular to first terminal 5.
The packaging part 1 being made of insulating material is applied by thermoforming.2, two gold of discoid pieces are completely covered in packaging part 1
Belong to flat metal structural member 5a, 6a of polarizing electrode 3,4 and terminal 5,6.Only contact element 5b, 6b is stretched out from packaging part 1.
The packaging part 1 as made of insulating materials is applied by thermoforming, and packaging part 1 can be with high precision
Using.In addition, packaging part 1 does not need many spaces.Thus, apply packaging part 1 to allow to construct with smaller by thermoforming
The piezoresistor of size.
Fig. 2 a and Fig. 2 b show the piezoresistors according to second embodiment.In figure 2b, packaging part 1 is shown as
Bright.Second embodiment is only different from the first embodiment in the design aspect of first terminal 5.Particularly, implement second
The contact element 5b of first terminal 5 is not orthogonal to the first metallic electrode 3 in mode.But contact element 5b is stretched from packaging part 1
Out and contact element 5b is parallel to the first metallic electrode 3.
In this second embodiment, discoid pieces 2, described two metallic electrodes 3,4 and terminal is also completely covered in packaging part 1
5,6 flat metal structural member 5a, 6a.Packaging part 1 is applied also by thermoforming.Thus, second embodiment also provides
The advantages of piezoresistor of high-precision manufacturing process and smaller size.Second embodiment is shown is answered by thermoforming
Packaging part 1 can be combined with two terminals 5,6 of any design type.Terminal 5,6 can be mutually the same or can be with that
This is different.
Fig. 3 a and Fig. 3 b show the piezoresistor according to third embodiment.In fig 3b, packaging part 1 is shown as
Bright.
It is metallized according to the discoid pieces made of piezoresistive material 2, second of the piezoresistor of third embodiment
Electrode 4 and Second terminal 6 are with the respective element of piezoresistor according to first embodiment and according to second embodiment
The respective element of piezoresistor is identical.
First metallic electrode 3 is applied to the top surface of discoid pieces 2.First terminal 5 is fixed to the first metallic electrode 3.
First terminal 5 is different from the first terminal 5 of aforementioned embodiments.First terminal 5 according to third embodiment does not include from envelope
The contact element 5b that piece installing 1 is stretched out.But first terminal 5 is by the flat metal structural member that is welded on the first metallic electrode 3
5a is constituted.
The endless all standing first terminal 5 of packaging part 1.Packaging part 1 only partially covers first terminal 5.Packaging part 1 is first
Window 7 is formed above terminal 5, the non-encapsulated part 1 of first terminal 5 covers at window 7.For contacting piezoresistor in addition
Element can be fixed to first terminal 5 in the window 7 in packaging part 1.
Particularly, connector can be soldered to first terminal 5 by solder at window 7.It is low in the case where overheat
Warm solder will be melted and be disconnected with piezoresistor.
Other than the window 7 on first terminal 5, piezoresistor is completely covered in packaging part 1.Packaging part 1 via heat at
Type is applied.Thus, packaging part 1 is applied with lesser space requirement with high precision.
Fig. 4 a and Fig. 4 b show the piezoresistor according to the 4th embodiment.In fig. 4b, packaging part 1 is shown as
Bright.
According to the discoid pieces made of piezoresistive material 2 of the 4th embodiment and metallic electrode 3,4 and before
The respective element for stating the piezoresistor of embodiment is identical.
First terminal 5 and Second terminal 6 are made of flat metal structural member 5a, 6a respectively.The flat metal of first terminal 5
Structural member 5a is soldered to the first metallic electrode 3.The flat metal structural member 6a of Second terminal 6 is soldered to the second metallic electrode
4.First terminal 5 and Second terminal 6 do not include contact element 5b, the 6b stretched out from packaging part 1.
Packaging part 1 forms first window 7 and above the bottom surface of piezoresistor in the top face of piezoresistor
Form the second window 7.Packaging part 1 does not cover first terminal 5 and Second terminal 6.First window 7 in packaging part 1 is than according to the
Window 7 in the packaging part of three embodiments is bigger.
Other element can be fixed to first terminal 5 and Second terminal 6 for being in electrical contact varistor at window 7
Device.Particularly, connector can be soldered to first terminal 5 by solder in first window 7.Another connector can be second
Second terminal 6 is soldered to by solder in window 7.In the case where piezoresistor overheat, solder interconnecting piece will
It melts and is thus disconnected with piezoresistor.
Fig. 5 a and Figure 5b shows that the piezoresistors according to the 5th embodiment.In figure 5b, packaging part 1 is shown as
Bright.
The difference of piezoresistor according to the piezoresistor of the 5th embodiment and according to the 4th embodiment
Be: piezoresistor does not include first terminal 5 and Second terminal 6.But in piezoresistor in packaging part 1
Top face forms first window 7 so that the first metallic electrode 3 is exposed to the lower section of first window 7.In packaging part 1 in
The second window 7 is formed above the bottom surface of piezoresistor so that the second metallic electrode 4 is exposed to the lower section of the second window 7.
Contact can be soldered directly to each of the first metallic electrode 3 and the second metallic electrode 4.Contact
It can permit electrical contact piezoresistor.Contact can be soldered to corresponding metallic electrode 3,4 by solder.
Packaging part 1 partly covers discoid pieces 2.Packaging part 1 is above each metallic electrode in metallic electrode 3,4
It is respectively formed window 7.Packaging part 1 is applied by thermoforming.
Fig. 6 a and Fig. 6 b show the piezoresistor according to sixth embodiment.In figure 6b, packaging part 1 is shown as
Bright.
Piezoresistor according to sixth embodiment is based on the piezoresistor according to third embodiment.Separately
It outside, include two protrusions 8,9 according to the piezoresistor of sixth embodiment.Each protrusion in protrusion 8,9 is configured to use
In component is assembled to piezoresistor.
Protrusion 8,9 is formed by packaging part 1.Protrusion 8,9 is arranged on the top surface of piezoresistor.A protrusion in protrusion
8 with rectangular shape and another protrusion 9 has cylindrical shape.Protrusion 8,9 can also have any other shape.Protrusion
8,9 be on packaging part 1 to the fixing piece that assembles with other component.Accordingly, it is not necessary to which additional shell is by varistor
Device is combined with other component.But piezoresistor and other component can form following components: the other component in the component
It is fixed in the protrusion 8,9 of the packaging part 1 of piezoresistor.
Packaging part 1 is applied by thermoforming.Therefore, it is possible to highly precisely apply packaging part 1.Thus, it is possible to be formed
Reliable fixing piece.
Since packaging part 1 is applied by thermoforming, forming process can be easily varied so that protrusion
8,9 number and/or change in shape for being arranged at different positions or making protrusion 8,9.Thus, thermoforming is in packaging part 1
Design aspect provide larger flexibility, thus allow packaging part 1 be adapted to that the component of piezoresistor will be fixed to
Various configurations.
It can also be added with according to each piezoresistor in the piezoresistor of other embodiments one or more
A protrusion 8,9 as illustration is given in figure 6 a andb.
Reference signs list
1 packaging part
2 discoid pieces
3 first metallic electrodes
4 second metallic electrodes
5 first terminals
5a flat metal structural member
5b contact element
6 Second terminals
6a flat metal structural member
6b contact element
7 windows
8 protrusions
9 protrusions
Claims (15)
1. a kind of metal-oxide varistor, comprising:
The discoid pieces made of piezoresistive material (2),
- the first metallic electrode (3), first metallic electrode (3) are arranged on the discoid pieces (2),
The packaging part (1) being made of insulating material, the discoid pieces (2) are at least partially embedded in the packaging part (1).
2. according to metal-oxide varistor described in previous claim,
Wherein, the packaging part (1) being made of insulating material is used on the discoid pieces (2) by thermoforming.
3. metal-oxide varistor according to one of the preceding claims,
Wherein, the packaging part (1) only partially covers first metallic electrode (3), and being consequently formed makes first gold medal
Belong to the window (7) of polarizing electrode (3) exposure.
4. metal-oxide varistor described in one according to claim 1 or in 2,
Wherein, first terminal (5) are disposed on first metallic electrode (3).
5. according to metal-oxide varistor described in previous claim,
Wherein, the packaging part (1) only partially covers the first terminal (5), and being consequently formed keeps the first terminal (5) sudden and violent
The window (7) of dew.
6. metal-oxide varistor described in one according to claim 1 or in 2,
Wherein, the packaging part (1) is completely covered the discoid pieces (2), and
Wherein, the first terminal (5) includes the first contact element (5b) stretched out from the packaging part (1).
7. according to metal-oxide varistor described in previous claim,
Wherein, the first contact element (5b) has first metallic electrode (3) along with being applied for the discoid pieces (2)
The parallel direction in surface stretched out from the packaging part (1),
Or
Wherein, the first contact element (5b) has first metallic electrode (3) along with being applied for the discoid pieces (2)
The vertical direction in the surface stretched out from the packaging part (1).
8. metal-oxide varistor according to one of the preceding claims,
Further include the second metallic electrode (4), second metallic electrode (4) with the first metallic electrode opposite side
It is arranged on the discoid pieces (2).
9. according to metal-oxide varistor described in previous claim,
Wherein, the packaging part (1) only partially covers second metallic electrode (4), and being consequently formed makes second gold medal
Belong to the window (7) of polarizing electrode (4) exposure.
10. metal-oxide varistor according to claim 8,
Wherein, Second terminal (6) are disposed on second metallic electrode (4).
11. according to metal-oxide varistor described in previous claim,
Wherein, the packaging part (1) only partially covers the Second terminal, and being consequently formed makes the Second terminal (6) exposure
Window (7).
12. metal-oxide varistor according to claim 10,
Wherein, the packaging part (1) is completely covered the discoid pieces (2), and
Wherein, the Second terminal (6) includes the second contact element (6b) stretched out from the packaging part (1).
13. metal-oxide varistor according to one of the preceding claims,
Wherein, the packaging part (1) include for component is assembled to the protrusion of the metal-oxide varistor (8,
9)。
14. it is a kind of include the metal-oxide varistor according to previous claim and be fixed on the protrusion (8,
9) component of the component on.
15. a kind of method for manufacturing metal-oxide varistor according to one of the preceding claims,
Wherein, the packaging part (1) being made of insulating material is applied on the discoid pieces (2) by thermoforming.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810301249.4A CN110349720A (en) | 2018-04-04 | 2018-04-04 | Metal-oxide varistor and its manufacturing method |
| PCT/EP2019/058303 WO2019193007A1 (en) | 2018-04-04 | 2019-04-02 | Metal oxide varistor and method of manufacturing |
| TW108111927A TWI834653B (en) | 2018-04-04 | 2019-04-03 | Metal oxide varistor and method of manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810301249.4A CN110349720A (en) | 2018-04-04 | 2018-04-04 | Metal-oxide varistor and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110349720A true CN110349720A (en) | 2019-10-18 |
Family
ID=66049217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810301249.4A Pending CN110349720A (en) | 2018-04-04 | 2018-04-04 | Metal-oxide varistor and its manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN110349720A (en) |
| TW (1) | TWI834653B (en) |
| WO (1) | WO2019193007A1 (en) |
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|---|---|---|---|---|
| GB2052856A (en) * | 1979-06-18 | 1981-01-28 | Gen Electric | Coating protecting varistor during manufacture |
| CN103098150A (en) * | 2010-06-21 | 2013-05-08 | 兴亚株式会社 | Surface mounting varistor |
| CN203070854U (en) * | 2013-01-22 | 2013-07-17 | 隆科电子(惠阳)有限公司 | Varistor with window having function of installation protection |
| CN203596230U (en) * | 2014-01-09 | 2014-05-14 | 东莞市令特电子有限公司 | Self-control anti-arcing voltage dependent resistor |
| CN106949984A (en) * | 2016-01-07 | 2017-07-14 | 矢崎北美公司 | Terminal thermistor component |
| CN107910145A (en) * | 2017-10-12 | 2018-04-13 | 爱普科斯电子元器件(珠海保税区)有限公司 | A kind of embedded varistor and its manufacture craft |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3886898T2 (en) * | 1987-05-28 | 1994-06-30 | Matsushita Electric Ind Co Ltd | SURGE ARRESTERS. |
| CN100561611C (en) | 2005-09-03 | 2009-11-18 | 徐忠厚 | Be provided with the piezo-resistance of alloy-type temperature fuse |
| EP2874159A3 (en) * | 2013-05-14 | 2015-10-07 | Longke Electronics (Huiyang) Co., Ltd. | Base metal combination electrode of electronic ceramic component and manufacturing method thereof |
| CN203659556U (en) * | 2013-09-10 | 2014-06-18 | 广西新未来信息产业股份有限公司 | Direct current piezoresistor |
| US10431508B2 (en) * | 2015-07-19 | 2019-10-01 | Vq Research, Inc. | Methods and systems to improve printed electrical components and for integration in circuits |
| CN206059374U (en) * | 2016-07-28 | 2017-03-29 | 广东百圳君耀电子有限公司 | High-power surface mount elements and its processing tool |
-
2018
- 2018-04-04 CN CN201810301249.4A patent/CN110349720A/en active Pending
-
2019
- 2019-04-02 WO PCT/EP2019/058303 patent/WO2019193007A1/en active Application Filing
- 2019-04-03 TW TW108111927A patent/TWI834653B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2052856A (en) * | 1979-06-18 | 1981-01-28 | Gen Electric | Coating protecting varistor during manufacture |
| CN103098150A (en) * | 2010-06-21 | 2013-05-08 | 兴亚株式会社 | Surface mounting varistor |
| CN203070854U (en) * | 2013-01-22 | 2013-07-17 | 隆科电子(惠阳)有限公司 | Varistor with window having function of installation protection |
| CN203596230U (en) * | 2014-01-09 | 2014-05-14 | 东莞市令特电子有限公司 | Self-control anti-arcing voltage dependent resistor |
| CN106949984A (en) * | 2016-01-07 | 2017-07-14 | 矢崎北美公司 | Terminal thermistor component |
| CN107910145A (en) * | 2017-10-12 | 2018-04-13 | 爱普科斯电子元器件(珠海保税区)有限公司 | A kind of embedded varistor and its manufacture craft |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI834653B (en) | 2024-03-11 |
| WO2019193007A1 (en) | 2019-10-10 |
| TW201942920A (en) | 2019-11-01 |
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Application publication date: 20191018 |
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