CN110348334A - Fingerprint recognition mould group and display device - Google Patents
Fingerprint recognition mould group and display device Download PDFInfo
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- CN110348334A CN110348334A CN201910554076.1A CN201910554076A CN110348334A CN 110348334 A CN110348334 A CN 110348334A CN 201910554076 A CN201910554076 A CN 201910554076A CN 110348334 A CN110348334 A CN 110348334A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Image Input (AREA)
- Position Input By Displaying (AREA)
Abstract
It includes array substrate, piezoelectric thin film layer, display layer and touch control layer that the present invention, which provides a kind of fingerprint recognition mould group and display device, the fingerprint recognition mould group,；Wherein, the piezoelectric thin film layer includes: thermal insulation layer, insulating layer, first electrode layer, surface and the second electrode lay set on the insulating layer far from the thermal insulation layer side.The technical effects of the invention are that increasing thermal insulation layer close to the surface of array substrate side in piezoelectric thin film layer, extra heat is absorbed, improves the thermal diffusivity of fingerprint recognition mould group, brain Hu Zhiwen mould group improves the service life of fingerprint mould group and the stability of device.
Description
Technical field
The present invention relates to display field, in particular to a kind of fingerprint recognition mould group and display device.
Background technique
Currently, ultrasonic fingerprint identification technology due to not interfered by water and greasy dirt, has stronger adaptive capacity to environment, it can
For more complex environment.To which ultrasonic fingerprint identification is gradually widely paid attention to, it is increasingly being used for
Every field, such as the safety of mobile phone, computer, plate and access control system electronic product is promoted, it is close compared to traditional number
Code, due to the rapidity of unlocked by fingerprint, many conveniences are brought to people's lives.
But the performance of current ultrasonic fingerprint sensor and not fully up to expectations.Piezoelectric thin film layer inputing power is given, it is made
It is converted into mechanical energy and high-frequency vibration occurs, so that ultrasonic wave occur；When ultrasonic wave fires back, it can also cause piezoelectric thin film layer
Vibration, for reconvert at electric energy, the efficiency of this energy conversion is very low, and usually less than 10%.It is had in the conversion process of energy
A large amount of energy loss, is converted into thermal energy.Generated thermal energy can destroy the performance of fingerprint mould group, it is made gradually to fail.
Summary of the invention
It is an object of the present invention to solve the extra heat diffusion of existing ultrasonic fingerprint identification mould group to piezoelectric membrane
Layer destroys the transmitting of fingerprint mould group and receives the performance of ultrasonic wave；Extra heat can generate thermocurrent, increase making an uproar for fingerprint recognition
Sound, to influence the technical problems such as the precision of fingerprint recognition.
To achieve the above object, the present invention provides a kind of fingerprint recognition mould group, comprising: array substrate；Piezoelectric thin film layer, if
In the surface of the array substrate side；And touch-control display layer, the piezoelectric thin film layer is set to far from the array substrate one
The surface of side；Wherein, the piezoelectric thin film layer includes: thermal insulation layer, set on the surface of the array substrate side；Insulating layer, if
In edge of the thermal insulation layer far from the array substrate side；First electrode layer, be set to the insulating layer far from it is described every
The surface of thermosphere side；Piezoelectric material layer, the surface set on the first electrode layer far from the insulating layer side；And second
Electrode layer, the surface set on the piezoelectric material layer far from the first electrode layer side.
Further, the material of the thermal insulation layer includes silica gel or liquid metal.
Further, the touch-control display layer includes: the first polaroid, is set to the piezoelectric thin film layer far from the array
The surface of substrate side；First substrate layer, the surface set on first polaroid far from the piezoelectric thin film layer side；First
Liquid crystal layer, set on the surface of first substrate layer far from first polaroid side；Second substrate layer is set to described first
Surface of the liquid crystal layer far from first substrate layer side；First touch control layer is set to second substrate layer far from described first
The surface of liquid crystal layer side；And first polarizer, set on the table of first touch control layer far from second substrate layer side
Face.
Further, the touch-control display layer includes: the second polaroid, is set to the piezoelectric thin film layer far from the array
The surface of substrate side；Third substrate layer, the surface set on second polaroid far from the piezoelectric thin film layer side；Second
Liquid crystal layer, set on the surface of the third substrate layer far from second polaroid side；Second touch control layer is set to described second
Surface of the liquid crystal layer far from third substrate layer side；4th substrate layer is set to second touch control layer far from described second
The surface of liquid crystal layer side；And second polarizer, set on the table of the 4th substrate layer far from second touch control layer side
Face.
Further, the touch-control display layer includes: display layer, is set to the piezoelectric thin film layer far from the array substrate
The surface of side；Second glue-line, the surface set on the display layer far from the piezoelectric thin film layer side；And third touch-control
Layer, the surface set on second glue-line far from the display layer side.
Further, the fingerprint recognition mould group further include: the first glue-line is set to polarizer far from the touch control layer side
Surface；And protective layer, the surface set on first glue-line far from the touch control layer side.
Further, the first electrode layer and the material of the second electrode lay include silver, aluminium, molybdenum, gold, chromium, nickel,
At least one of copper, platinum.
Further, the material of the piezoelectric material layer includes aluminium nitride, lead zirconate titanate, Kynoar, polyvinylidene fluoride
At least one of alkene-trifluoro-ethylene copolymer.
Further, the material of the protective layer includes any one of glass, sapphire, transparent polymer material.
To achieve the above object, the present invention also provides a kind of display devices, including above-mentioned fingerprint recognition mould group.
The technical effects of the invention are that increasing thermal insulation layer close to the surface of array substrate side in piezoelectric thin film layer, inhale
Receive extra heat, improve the thermal diffusivity of fingerprint recognition mould group, protect fingerprint mould group, improve fingerprint mould group service life and
The stability of device.
Detailed description of the invention
Fig. 1 is the schematic diagram of fingerprint recognition mould group described in the embodiment of the present invention 1；
Fig. 2 is the schematic diagram of piezoelectric thin film layer described in the embodiment of the present invention 1；
Fig. 3 is the schematic diagram of another fingerprint recognition mould group described in the embodiment of the present invention 2；
Fig. 4 is the schematic diagram of fingerprint recognition mould group described in the embodiment of the present invention 3.
Members mark is as follows:
1, array substrate；2, piezoelectric thin film layer；3, touch-control display layer；4, the first glue-line；5, protective layer；
21, thermal insulation layer；22, insulating layer；23, first electrode layer；24, piezoelectric material layer；25, the second electrode lay；
301, the first polaroid；302, the first substrate layer；303, the first liquid crystal layer；304, the second substrate layer；
305, the first touch control layer；306, the first polarizer；
311, the second polaroid；312, third substrate layer；313, the second liquid crystal layer；314, the second touch control layer；
315, the 4th substrate layer；316, the second polarizer；
321, display layer；322, the second glue-line；323, third touch control layer.
Specific embodiment
Below in conjunction with Figure of description, the preferred embodiments of the present invention are described in detail, with complete to those of skill in the art
It is whole to introduce technology contents of the invention, prove that the present invention can be implemented with citing, so that technology contents disclosed by the invention are more
It is clear, so that will more readily understand how implement the present invention by those skilled in the art.However the present invention can pass through many differences
The embodiment of form emerges from, and protection scope of the present invention is not limited only to the embodiment mentioned in text, Examples below
The range that is not intended to limit the invention of explanation.
The direction term that the present invention is previously mentioned, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outside", "
Side " etc. is only the direction in attached drawing, and direction term used herein is of the invention for explanation and illustration, rather than is used
To limit the scope of protection of the present invention.
In the accompanying drawings, the identical component of structure is indicated with same numbers label, everywhere the similar component of structure or function with
Like numeral label indicates.In addition, in order to facilitate understanding and description, the size and thickness of each component shown in the drawings are any
It shows, the present invention does not limit the size and thickness of each component.
When certain components, when being described as " " another component "upper", the component can be placed directly within described another group
On part；There may also be an intermediate module, the component is placed on the intermediate module, and the intermediate module is placed in another group
On part.When a component is described as " installation is extremely " or " being connected to " another component, the two can be understood as direct " installation "
Or " connection " or a component pass through an intermediate module " installation is extremely " or " being connected to " another component.
Embodiment 1
The present embodiment provides the first display device, the display device includes the first fingerprint recognition mould group.
As shown in Figure 1, the first fingerprint recognition mould group include array substrate 1, piezoelectric thin film layer 2, touch-control display layer 3,
First glue-line 4 and protective layer 5.
Array substrate 1 is the circuit layer of display panel, including grid and source-drain electrode, provides circuit to display panel and supports,
To control the opening and closing of pixel region.
Piezoelectric thin film layer 2 is set to the upper surface of array substrate 1, when piezoelectric thin film layer 1 senses the electricity from array substrate 1
After pressure, high-frequency vibration occurs for piezoelectric thin film layer 2, generates ultrasonic wave, in this process, electric energy is converted into mechanical energy, there is 90%
Above energy loss, is converted into thermal energy.
As shown in Fig. 2, piezoelectric thin film layer 2 includes thermal insulation layer 21, insulating layer 22, first electrode layer 23, piezoelectric material layer 24
And the second electrode lay 25.
Thermal insulation layer 21 is set to the upper surface of array substrate 1, can directly form a film in the upper surface of array substrate 1, thermal insulation layer 21
It can be thermal grease or liquid metal for conducting heat cooling fin, the silica gel and the cooling fin have excellent heat-sinking capability, can incite somebody to action
It extra energy absorption and spreads out.Thermal insulation layer 21 is very thin, prevents take up additional space, therefore will not be to first fingerprint
Identification mould group has an impact.
In the present embodiment, thermal insulation layer 21 is preferably silica gel, and silica gel directly can be bought or make by oneself, and silica gel Homemade method is specific
Including step S1~S5.
S1 the first reaction solution preparation step, by 100 parts of vinyl silicone oils, 3~8 parts of methyl-silicone oils, 7~15 parts of Silicon Containing Hydrogens
Oil, 500~800 parts of zinc oxide and 40~100 parts of aluminium oxide are added in stirred tank, are 60~80 DEG C in temperature, revolving speed is
It is stirred 1.5~2 hours under 300r~500rpm, forms the first reaction solution.S2 the second reaction solution preparation step, exists after mixing evenly
3~8 parts of fumed silicas and 2~5 parts of silane coupling agents are added in first reaction solution, is 60~80 DEG C in temperature, turns
Speed is to stir 30~50 minutes under 300r~500rpm, obtains the second reaction solution.S3 catalytic step, by the second reaction liquid cooling
But room temperature is arrived, 0.5~1.2 part of catalyst is added, is stirred 30~45 minutes at revolving speed 150r~180rpm.S4 vacuumizes step
Suddenly, wherein vacuum degree is less than -0.09MPa, sloughs bubble, obtains paste material.S5 curing schedule, by the paste material in PET film
Centre is rolled into the sheet of 0.5~5.0 mm of thickness, cuts into required size, under the conditions of 140~150 DEG C of temperature, solidification
1~1.5 hour, obtain silica gel.
Thermal insulation layer 21 completely cuts off extra heat to completely cut off array substrate 1 and piezoelectric thin film layer 2, thermal insulation layer 21, and raising refers to
Line identifies the thermal diffusivity of mould group, enters in piezoelectric thin film layer 2 after preventing heat diffusion, if heat diffusion enters piezoelectric thin film layer 2,
It then will affect the performance of piezoelectric thin film layer 2, to destroy the transmitting of fingerprint recognition mould group and receive the performance of ultrasonic wave, and piezoresistive material
Material is all thermoelectric material, and extra heat will increase the noise of the first fingerprint recognition mould group, to influence fingerprint recognition
Accuracy.So increasing thermal insulation layer 21 in the present embodiment to protect piezoelectric thin film layer 2, and then improve first fingerprint recognition
The recognition effect of mould group improves the stability of the first fingerprint recognition mould group, extends making for the first fingerprint recognition mould group
Use the service life.
Insulating layer 22 is set to the upper surface of thermal insulation layer 21, and is set to the edge of thermal insulation layer 21, and intermediate there are cavitys, described
Cavity provides space for the vibration of piezoelectric thin film layer 2, prevents the problems such as disengaging between film layer is caused in vibration processes, while absolutely
Edge layer 22 plays insulating effect, prevents subsequent electrode layer and array substrate 1 from generating short circuit problem.The material of insulating layer 22 includes
The insulating materials such as butyl rubber, acrylic rubber, nitrile rubber and silicon rubber, polyurethane, polyvinyl chloride and epoxy resin.On
The use temperature range for stating a variety of materials is very wide, can satisfy the requirement within the scope of -50~200 DEG C.And insulating materials
Cheap, contour machining procedure is simple, cheap using manufacturing cost.
First electrode layer 23 is set to the upper surface of insulating layer 22, the material of first electrode layer 23 include silver-colored (Ag), aluminium (Al),
At least one of molybdenum (Mo), golden (Au), chromium (Cr), nickel (Ni), copper (Cu), platinum (Pt).
Piezoelectric material layer 24 is set to the upper surface of first electrode layer 23, and the material of piezoelectric material layer 24 includes aluminium nitride
(AlN), lead zirconate titanate (PZT), Kynoar (PVDF), copolymer are Kynoar-trifluoro-ethylene copolymer (P
At least one of (VDF-TrFE)).
The second electrode lay 25 is set to the upper surface of piezoelectric material layer 24, and the material of the second electrode lay 25 includes silver (Ag), aluminium
(Al), at least one of molybdenum (Mo), golden (Au), chromium (Cr), nickel (Ni), copper (Cu), platinum (Pt).
Touch-control display layer 3 is set to the upper surface of piezoelectric thin film layer 2, and touch-control display layer 3 is to touch-control and display, the present embodiment
In touch control layer be in cell touch-control.
In the present embodiment, touch-control display layer 3 includes the first polaroid 301, the first substrate layer 302, the first liquid crystal layer
303, the second substrate layer 304, the first touch control layer 305 and the first polarizer 306.
First polaroid 301 is set to the upper surface of piezoelectric thin film layer 2, and the first polaroid 301 has good polarity.
First substrate layer 302 is set to the upper surface of the first polaroid 301, and the material of the first substrate layer 302 is glass, is used as
The film forming of subsequent film.
First liquid crystal layer 303 is set to the upper surface of the first substrate layer 302, and liquid crystal layer 303, can be directly first to show
It forms a film on substrate layer 302.
Second substrate layer 304 is set to the upper surface of the first liquid crystal layer 303, and the material of the second substrate layer 304 is glass, is used as
The film forming of subsequent film.
First touch control layer 305 is set to the upper surface of the first substrate layer 304, and the first touch control layer 305 can directly exist to touch-control
It forms a film on second substrate layer 304.
First polarizer 305 is set to the upper surface of the first touch control layer 304, and the first polarizer 305 plays the role of polarisation, guarantees
Good display effect.
Protective layer 5 is bonded to the first polarizer 305 by the first glue-line 4.The material of protective layer 5 is translucent material, including
Any one of glass, sapphire, transparent polymer material, protective layer 5 is to protect touch-control display layer 3.
First fingerprint display module described in the present embodiment has technical effect that, high-frequency vibration shape occurs in piezoelectric thin film layer
At ultrasonic wave, amount of heat can be generated during electric energy is converted to mechanical energy, piezoelectric thin film layer lower surface increase every
Thermosphere, the thermal insulation layer can completely cut off extra heat, prevent heat from entering piezoelectric thin film layer, improve the first fingerprint recognition mould
The thermal diffusivity of group avoids influencing the first fingerprint display module transmitting and receives the performance of ultrasonic wave, protects described first to refer to
Line identifies mould group, and then improves the service life and stability of the first fingerprint recognition mould group.
Embodiment 2
The present embodiment provides second of display device, the display device includes the second fingerprint recognition mould group.
As shown in figure 3, the second fingerprint recognition mould group include array substrate 1, piezoelectric thin film layer 2, touch-control display layer 3,
First glue-line 4 and protective layer 5.
Array substrate 1 is the circuit layer of display panel, including grid and source-drain electrode, provides circuit to display panel and supports,
To control the opening and closing of pixel region.
Piezoelectric thin film layer 2 is set to the upper surface of array substrate 1, when piezoelectric thin film layer 1 senses the electricity from array substrate 1
After pressure, high-frequency vibration occurs for piezoelectric thin film layer 2, generates ultrasonic wave, in this process, electric energy is converted into mechanical energy, there is 90%
Above energy loss, is converted into thermal energy.
As shown in Fig. 2, piezoelectric thin film layer 2 includes thermal insulation layer 21, insulating layer 22, first electrode layer 23, piezoelectric material layer 24
And the second electrode lay 25.
Thermal insulation layer 21 is set to the upper surface of array substrate 1, can directly form a film in the upper surface of array substrate 1, thermal insulation layer 21
It can be thermal grease or liquid metal for conducting heat cooling fin, the silica gel and the cooling fin have excellent heat-sinking capability, can incite somebody to action
It extra energy absorption and spreads out.Thermal insulation layer 21 is very thin, prevents take up additional space, therefore will not be to first fingerprint
Identification mould group has an impact.
In the present embodiment, thermal insulation layer 21 is preferably silica gel, and silica gel directly can be bought or make by oneself, and silica gel Homemade method is specific
Including step S1~S5.
S1 the first reaction solution preparation step, by 100 parts of vinyl silicone oils, 3~8 parts of methyl-silicone oils, 7~15 parts of Silicon Containing Hydrogens
Oil, 500~800 parts of zinc oxide and 40~100 parts of aluminium oxide are added in stirred tank, are 60~80 DEG C in temperature, revolving speed is
It is stirred 1.5~2 hours under 300r~500rpm, forms the first reaction solution.S2 the second reaction solution preparation step, exists after mixing evenly
3~8 parts of fumed silicas and 2~5 parts of silane coupling agents are added in first reaction solution, is 60~80 DEG C in temperature, turns
Speed is to stir 30~50 minutes under 300r~500rpm, obtains the second reaction solution.S3 catalytic step, by the second reaction liquid cooling
But room temperature is arrived, 0.5~1.2 part of catalyst is added, is stirred 30~45 minutes at revolving speed 150r~180rpm.S4 vacuumizes step
Suddenly, wherein vacuum degree is less than -0.09MPa, sloughs bubble, obtains paste material.S5 curing schedule, by the paste material in PET film
Centre is rolled into the sheet of 0.5~5.0 mm of thickness, cuts into required size, under the conditions of 140~150 DEG C of temperature, solidification
1~1.5 hour, obtain silica gel.
Thermal insulation layer 21 completely cuts off extra heat to completely cut off array substrate 1 and piezoelectric thin film layer 2, thermal insulation layer 21, improves institute
The thermal diffusivity for stating the second fingerprint recognition mould group enters in piezoelectric thin film layer 2 after preventing heat diffusion, if heat diffusion enters piezoelectricity
Film layer 2, then will affect the performance of piezoelectric thin film layer 2, thus destroy the transmitting of fingerprint recognition mould group and receive the performance of ultrasonic wave,
And piezoelectric material is all thermoelectric material, extra heat will increase the noise of fingerprint recognition mould group, to influence fingerprint recognition
Accuracy.So increasing thermal insulation layer 21 in the present embodiment to protect piezoelectric thin film layer 2, and then improve the knowledge of fingerprint recognition mould group
Other effect improves the stability of fingerprint recognition mould group, extends the service life of fingerprint recognition mould group.
Insulating layer 22 is set to the upper surface of thermal insulation layer 21, and is set to the edge of thermal insulation layer 21, and intermediate there are cavitys, described
Cavity provides space for the vibration of piezoelectric thin film layer 2, prevents the problems such as disengaging between film layer is caused in vibration processes, while absolutely
Edge layer 22 plays insulating effect, prevents subsequent electrode layer and array substrate 1 from generating short circuit problem.The material of insulating layer 22 includes
The insulating materials such as butyl rubber, acrylic rubber, nitrile rubber and silicon rubber, polyurethane, polyvinyl chloride and epoxy resin.On
The use temperature range for stating a variety of materials is very wide, can satisfy the requirement within the scope of -50~200 DEG C.And insulating materials
Cheap, contour machining procedure is simple, cheap using manufacturing cost.
First electrode layer 23 is set to the upper surface of insulating layer 22, the material of first electrode layer 23 include silver-colored (Ag), aluminium (Al),
At least one of molybdenum (Mo), golden (Au), chromium (Cr), nickel (Ni), copper (Cu), platinum (Pt).
Piezoelectric material layer 24 is set to the upper surface of first electrode layer 23, and the material of piezoelectric material layer 24 includes aluminium nitride
(AlN), lead zirconate titanate (PZT), Kynoar (PVDF), copolymer are Kynoar-trifluoro-ethylene copolymer (P
At least one of (VDF-TrFE)).
The second electrode lay 25 is set to the upper surface of piezoelectric material layer 24, and the material of the second electrode lay 25 includes silver (Ag), aluminium
(Al), at least one of molybdenum (Mo), golden (Au), chromium (Cr), nickel (Ni), copper (Cu), platinum (Pt).
Touch-control display layer 3 is set to the upper surface of piezoelectric thin film layer 2, and touch-control display layer 3 is to touch-control and display, the present embodiment
In touch control layer be on cell touch-control.
In the present embodiment, touch-control display layer 3 includes the second polaroid 311, third substrate layer 312, the second liquid crystal layer
313, the second touch control layer 314, the 4th substrate layer 315 and the second polarizer 316.
Second polaroid 311 is set to the upper surface of piezoelectric thin film layer 2, and the second polaroid 311 has good polarity.
Third substrate layer 312 is set to the upper surface of the second polaroid 311, and the material of third substrate layer 312 is glass, is used as
The film forming of subsequent film.
Second liquid crystal layer 313 is set to the upper surface of third substrate layer 312, and the second liquid crystal layer 313 can directly exist to show
It forms a film on third substrate layer 312.
Second touch control layer 314 is set to the upper surface of the second liquid crystal layer 313, and the second touch control layer 314 can directly exist to touch-control
It forms a film on second liquid crystal layer 313.
4th substrate layer 315 is set to the upper surface of the second touch control layer 314, and the material of the 4th substrate layer 315 is glass, is used as
The film forming of subsequent film.
Second polarizer 316 is set to the upper surface of the 4th substrate layer 315, and the second polarizer 316 plays the role of polarisation, guarantees
Good display effect.
Protective layer 5 is bonded to the second polarizer 316 by the first glue-line 4.The material of protective layer 5 is translucent material, including
Any one of glass, sapphire, transparent polymer material, protective layer 5 is to protect touch-control display layer 3.
First fingerprint display module described in the present embodiment has technical effect that, high-frequency vibration shape occurs in piezoelectric thin film layer
At ultrasonic wave, amount of heat can be generated during electric energy is converted to mechanical energy, piezoelectric thin film layer lower surface increase every
Thermosphere, the thermal insulation layer can completely cut off extra heat, prevent heat from entering piezoelectric thin film layer, improve the first fingerprint recognition mould
The thermal diffusivity of group avoids influencing the first fingerprint display module transmitting and receives the performance of ultrasonic wave, protects described first to refer to
Line identifies mould group, and then improves the service life and stability of the first fingerprint recognition mould group.
Embodiment 3
The present embodiment provides the third display device, the display device includes third fingerprint recognition mould group.
As shown in figure 4, the third fingerprint recognition mould group include array substrate 1, piezoelectric thin film layer 2, touch-control display layer 3,
First glue-line 4 and protective layer 5.
Array substrate 1 is the circuit layer of display panel, including grid and source-drain electrode, provides circuit to display panel and supports,
To control the opening and closing of pixel region.
Piezoelectric thin film layer 2 is set to the upper surface of array substrate 1, when piezoelectric thin film layer 1 senses the electricity from array substrate 1
After pressure, high-frequency vibration occurs for piezoelectric thin film layer 2, generates ultrasonic wave, in this process, electric energy is converted into mechanical energy, there is 90%
Above energy loss, is converted into thermal energy.
As shown in Fig. 2, piezoelectric thin film layer 2 includes thermal insulation layer 21, insulating layer 22, first electrode layer 23, piezoelectric material layer 24
And the second electrode lay 25.
Thermal insulation layer 21 is set to the upper surface of array substrate 1, can directly form a film in the upper surface of array substrate 1, thermal insulation layer 21
It can be thermal grease or liquid metal for conducting heat cooling fin, the silica gel and the cooling fin have excellent heat-sinking capability, can incite somebody to action
It extra energy absorption and spreads out.Thermal insulation layer 21 is very thin, prevents take up additional space, therefore will not be to first fingerprint
Identification mould group has an impact.
In the present embodiment, thermal insulation layer 21 is preferably silica gel, and silica gel directly can be bought or make by oneself, and silica gel Homemade method is specific
Including step S1~S5.
S1 the first reaction solution preparation step, by 100 parts of vinyl silicone oils, 3~8 parts of methyl-silicone oils, 7~15 parts of Silicon Containing Hydrogens
Oil, 500~800 parts of zinc oxide and 40~100 parts of aluminium oxide are added in stirred tank, are 60~80 DEG C in temperature, revolving speed is
It is stirred 1.5~2 hours under 300r~500rpm, forms the first reaction solution.S2 the second reaction solution preparation step, exists after mixing evenly
3~8 parts of fumed silicas and 2~5 parts of silane coupling agents are added in first reaction solution, is 60~80 DEG C in temperature, turns
Speed is to stir 30~50 minutes under 300r~500rpm, obtains the second reaction solution.S3 catalytic step, by the second reaction liquid cooling
But room temperature is arrived, 0.5~1.2 part of catalyst is added, is stirred 30~45 minutes at revolving speed 150r~180rpm.S4 vacuumizes step
Suddenly, wherein vacuum degree is less than -0.09MPa, sloughs bubble, obtains paste material.S5 curing schedule, by the paste material in PET film
Centre is rolled into the sheet of 0.5~5.0 mm of thickness, cuts into required size, under the conditions of 140~150 DEG C of temperature, solidification
1~1.5 hour, obtain silica gel.
Thermal insulation layer 21 improves the thermal diffusivity of the third fingerprint recognition mould group, prevents heat to absorb extra heat
Enter in piezoelectric thin film layer 2 after diffusion, if heat diffusion enters piezoelectric thin film layer 2, will affect the performance of piezoelectric thin film layer 2,
To destroy the third fingerprint recognition mould group transmitting and receive the performance of ultrasonic wave, and piezoelectric material is all thermoelectric material, more
Remaining heat will increase the noise of the third fingerprint recognition mould group, to influence the accuracy of the third fingerprint recognition.Institute
Piezoelectric thin film layer 2 is protected to increase thermal insulation layer 21 in the present embodiment, and then improves the knowledge of the third fingerprint recognition mould group
Other effect improves the stability of the third fingerprint recognition mould group, extends the service life of the third fingerprint recognition mould group.
Insulating layer 22 is set to the upper surface of thermal insulation layer 21, and is set to the edge of thermal insulation layer 21, and intermediate there are cavitys, described
Cavity provides space for the vibration of piezoelectric thin film layer 2, prevents the problems such as disengaging between film layer is caused in vibration processes, while absolutely
Edge layer 22 plays insulating effect, prevents subsequent electrode layer and array substrate 1 from generating short circuit problem.The material of insulating layer 22 includes
The insulating materials such as butyl rubber, acrylic rubber, nitrile rubber and silicon rubber, polyurethane, polyvinyl chloride and epoxy resin.On
The use temperature range for stating a variety of materials is very wide, can satisfy the requirement within the scope of -50~200 DEG C.And insulating materials
Cheap, contour machining procedure is simple, cheap using manufacturing cost.
First electrode layer 23 is set to the upper surface of insulating layer 22, the material of first electrode layer 23 include silver-colored (Ag), aluminium (Al),
At least one of molybdenum (Mo), golden (Au), chromium (Cr), nickel (Ni), copper (Cu), platinum (Pt).
Piezoelectric material layer 24 is set to the upper surface of first electrode layer 23, and the material of piezoelectric material layer 24 includes aluminium nitride
(AlN), lead zirconate titanate (PZT), Kynoar (PVDF), copolymer are Kynoar-trifluoro-ethylene copolymer (P
At least one of (VDF-TrFE)).
The second electrode lay 25 is set to the upper surface of piezoelectric material layer 24, and the material of the second electrode lay 25 includes silver (Ag), aluminium
(Al), at least one of molybdenum (Mo), golden (Au), chromium (Cr), nickel (Ni), copper (Cu), platinum (Pt).
Touch-control display layer 3 is set to the upper surface of piezoelectric thin film layer 2, and touch-control display layer 3 is to touch-control and display, the present embodiment
In touch control layer be on cell touch-control.
In the present embodiment, touch-control display layer 3 includes display layer 321, the second glue-line 322 and third touch control layer 323, this reality
The control mode touch mode in example is applied as integrated touch-control structure (OGS).
Display layer 321 is set to the upper surface of piezoelectric thin film layer 2, display layer 321 showing, including pixel region, data line,
Scan line etc. is all the prior art, is not specifically addressed herein.
Third touch control layer 323 is bonded to display layer 321 by the second glue-line 322, and third touch control layer 323 is to touch-control.
Protective layer 5 is bonded to third touch control layer 323 by the first glue-line 4.The material of protective layer 5 is translucent material, including
Any one of glass, sapphire, transparent polymer material, protective layer 5 is to protect touch-control display layer 3.
First fingerprint display module described in the present embodiment has technical effect that, high-frequency vibration shape occurs in piezoelectric thin film layer
At ultrasonic wave, amount of heat can be generated during electric energy is converted to mechanical energy, piezoelectric thin film layer lower surface increase every
Thermosphere, the thermal insulation layer can completely cut off extra heat, prevent heat from entering piezoelectric thin film layer, improve the first fingerprint recognition mould
The thermal diffusivity of group avoids influencing the first fingerprint display module transmitting and receives the performance of ultrasonic wave, protects described first to refer to
Line identifies mould group, and then improves the service life and stability of the first fingerprint recognition mould group.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a kind of fingerprint recognition mould group characterized by comprising
Array substrate；
Piezoelectric thin film layer, set on the surface of the array substrate side；And
Touch-control display layer, the surface set on the piezoelectric thin film layer far from the array substrate side；
Wherein, the piezoelectric thin film layer includes:
Thermal insulation layer, set on the surface of the array substrate side；
Insulating layer, the edge set on the thermal insulation layer far from the array substrate side；
First electrode layer, the surface set on the insulating layer far from the thermal insulation layer side；
Piezoelectric material layer, the surface set on the first electrode layer far from the insulating layer side；And
The second electrode lay, the surface set on the piezoelectric material layer far from the first electrode layer side.
2. fingerprint recognition mould group as described in claim 1, which is characterized in that
The material of the thermal insulation layer includes silica gel or liquid metal.
3. fingerprint recognition mould group as described in claim 1, which is characterized in that
The touch-control display layer includes:
First polaroid, the surface set on the piezoelectric thin film layer far from the array substrate side；
First substrate layer, the surface set on first polaroid far from the piezoelectric thin film layer side；
First liquid crystal layer, set on the surface of first substrate layer far from first polaroid side；
Second substrate layer, set on the surface of first liquid crystal layer far from first substrate layer side；
First touch control layer, set on the surface of second substrate layer far from first liquid crystal layer side；And
First polarizer, set on the surface of first touch control layer far from second substrate layer side.
4. fingerprint recognition mould group as described in claim 1, which is characterized in that
The touch-control display layer includes:
Second polaroid, the surface set on the piezoelectric thin film layer far from the array substrate side；
Third substrate layer, the surface set on second polaroid far from the piezoelectric thin film layer side；
Second liquid crystal layer, set on the surface of the third substrate layer far from second polaroid side；
Second touch control layer, set on the surface of second liquid crystal layer far from third substrate layer side；
4th substrate layer, set on the surface of second touch control layer far from second liquid crystal layer side；And
Second polarizer, set on surface of the 4th substrate layer far from second touch control layer side.
5. fingerprint recognition mould group as described in claim 1, which is characterized in that
The touch-control display layer includes:
Display layer, the surface set on the piezoelectric thin film layer far from the array substrate side；
Second glue-line, the surface set on the display layer far from the piezoelectric thin film layer side；And
Third touch control layer, the surface set on second glue-line far from the display layer side.
6. fingerprint recognition mould group as described in claim 1, which is characterized in that further include:
First glue-line, the surface set on polarizer far from the touch control layer side；And
Protective layer, the surface set on first glue-line far from the touch control layer side.
7. fingerprint recognition mould group as described in claim 1, which is characterized in that
The first electrode layer and the material of the second electrode lay include silver, aluminium, molybdenum, gold, chromium, nickel, copper, at least one in platinum
Kind.
8. fingerprint recognition mould group as described in claim 1, which is characterized in that
The material of the piezoelectric material layer includes that aluminium nitride, lead zirconate titanate, Kynoar, Kynoar-trifluoro-ethylene are total
At least one of polymers.
9. fingerprint recognition mould group as claimed in claim 6, which is characterized in that
The material of the protective layer includes any one of glass, sapphire, transparent polymer material.
10. a kind of display device, including fingerprint recognition mould group as described in any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910554076.1A CN110348334A (en) | 2019-06-25 | 2019-06-25 | Fingerprint recognition mould group and display device |
| PCT/CN2019/106646 WO2020258540A1 (en) | 2019-06-25 | 2019-09-19 | Fingerprint identification module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910554076.1A CN110348334A (en) | 2019-06-25 | 2019-06-25 | Fingerprint recognition mould group and display device |
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| CN110348334A true CN110348334A (en) | 2019-10-18 |
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ID=68183060
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910554076.1A Pending CN110348334A (en) | 2019-06-25 | 2019-06-25 | Fingerprint recognition mould group and display device |
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| CN (1) | CN110348334A (en) |
| WO (1) | WO2020258540A1 (en) |
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| WO2020258540A1 (en) | 2020-12-30 |
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