CN107403129A - Ultrasonic fingerprint identification module, ultrasonic fingerprint recognition means and electronic equipment - Google Patents
Ultrasonic fingerprint identification module, ultrasonic fingerprint recognition means and electronic equipment Download PDFInfo
- Publication number
- CN107403129A CN107403129A CN201710218418.3A CN201710218418A CN107403129A CN 107403129 A CN107403129 A CN 107403129A CN 201710218418 A CN201710218418 A CN 201710218418A CN 107403129 A CN107403129 A CN 107403129A
- Authority
- CN
- China
- Prior art keywords
- ultrasonic
- piezoelectric layer
- ultrasonic fingerprint
- module
- fingerprint identification
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Abstract
The present invention relates to fingerprint identification technology field, more particularly to a kind of ultrasonic fingerprint recognition means, ultrasonic fingerprint identifies module and electronic equipment, the some or all of non-display area of a corresponding display panel, a kind of ultrasonic fingerprint identification module provided by the invention, it includes a matrix and at least a piezoelectric layer, the piezoelectric layer is located at the one side of described matrix, the piezoelectric layer is the piezoelectric layer in situ to polarize, to launch and received ultrasonic signal, and the ultrasonic signal of reception is converted into electric signal output, to form fingerprint recognition image, present invention also offers the ultrasonic fingerprint recognition means and electronic equipment for employing the ultrasonic fingerprint identification module, the ultrasonic fingerprint recognition means, ultrasonic fingerprint identifies that module and electronic equipment have the advantages of fingerprint recognition effect is preferable.
Description
【Technical field】
The present invention relates to fingerprint identification technology field, more particularly to a kind of ultrasonic fingerprint identification module, ultrasonic fingerprint
Recognition means and electronic equipment.
【Background technology】
At present, fingerprint identification technology has been widely used in password unblock, authentication and programme-control etc. functionally, energy
Enough lives to people bring many facilities.And existing fingerprint identification technology is easily disturbed by some factors, such as
Finger has the materials such as greasy dirt, water and sweat stain, or the factor such as finger decortication, can all reduce the effect to fingerprint recognition, therefore more
Tend to reduce the interference of such factor using ultrasonic fingerprint identification technology come more people.And referred to using the ultrasonic wave
The recognition effect of the ultrasonic fingerprint identification module of line identification technology causes recognition effect to be difficult to carry due to factors such as structure, techniques
The problem of high, the recognition effect of ultrasonic fingerprint identification module is set to go no further.
Therefore, need badly and seek a kind of method and solve the above problems.
【The content of the invention】
To overcome the low technical barrier of existing above-mentioned fingerprint recognition effect, the invention provides fingerprint recognition effect is preferable
A kind of ultrasonic fingerprint identification module, ultrasonic fingerprint recognition means and electronic equipment.
The present invention is to provide a kind of ultrasonic fingerprint identification module to solve the scheme that above-mentioned technical problem provides, right
The some or all of non-display area of a display panel is answered, it includes a matrix and at least a piezoelectric layer, and the piezoelectric layer is located at
The one side of described matrix, the piezoelectric layer are the piezoelectric layer of polarization in situ, to launch and received ultrasonic signal, and will be received
Ultrasonic signal be converted into electric signal output, to form fingerprint recognition image.
Preferably, the piezoelectric layer is two layers, wherein a piezoelectric layer is launching ultrasonic signal;Another piezoelectric layer to
The ultrasonic signal reflected is received, two layers of piezoelectric layer is arranged on the homonymy or heteropleural of matrix.
Preferably, the piezoelectric layer is one layer, and the piezoelectric layer forms any one side in described matrix, launching and
Received ultrasonic signal.
Preferably, the thickness of the piezoelectric layer is less than 30 μm.
Preferably, the thickness of the piezoelectric layer is less than 9 μm.
Preferably, reflecting layer is further comprised, the ultrasonic signal the piezoelectric layer to be sent reflects back into piezoelectricity
Layer.
The present invention is to provide a kind of ultrasonic fingerprint recognition means to solve the yet another aspect that above-mentioned technical problem provides, its
Identify that module and a display module, the display module divide into viewing area and non-display area including above-mentioned ultrasonic fingerprint, institute
State some or all of non-display area that ultrasonic fingerprint identification module corresponds to the display module.
Preferably, the display module includes a cover plate, and the thickness of the cover plate is less than 1100 μm.
Preferably, touch module, the touch module and ultrasonic fingerprint identification module position arranged side by side are further comprised
It is located at the bottom of cover plate and positioned at any of ultrasonic fingerprint identification module in the bottom of the cover plate, or the touch module
Side.
The present invention is to provide a kind of electronic equipment, including above-mentioned ultrasound to solve the yet another aspect that above-mentioned technical problem provides
Ripple fingerprint recognition module and a display panel, the display panel divide into viewing area and non-display area, the ultrasonic fingerprint
Identification module corresponds to some or all of non-display area of the display panel.
Compared with prior art, ultrasonic fingerprint identification module provided by the invention has the advantages that:
(1) the ultrasonic fingerprint identification module includes an at least piezoelectric layer, and the piezoelectric layer is the piezoelectricity in situ to polarize
Layer, the advantages that it has, and thickness of thin, piezo-electric effect are good, and service life is longer, be advantageous to improve ultrasonic fingerprint identification mould
The recognition effect of group and the thickness for reducing ultrasonic fingerprint identification module, improve its service life.
(2) thickness of the piezoelectric layer is less than 30 μm, beneficial to the thickness for reducing the ultrasonic fingerprint identification module, so that
Recognition effect is improved, the thickness of the piezoelectric layer can further be less than 9 μm, so as to can further improve ultrasonic fingerprint identification mould
The recognition effect of group.
(3) piezoelectric layer is two layers, wherein a piezoelectric layer is launching ultrasonic signal;Another piezoelectric layer is receiving
The ultrasonic signal reflected, two layers of piezoelectric layer are arranged on the homonymy or heteropleural of matrix.The ultrasonic fingerprint is known
Other module has the advantages of thickness of thin, recognition effect are good, and technique is simple, during reduction ultrasound signal transmission
Loss.
(4) piezoelectric layer is one layer, and the piezoelectric layer forms any one side in described matrix, to launch and receive
Ultrasonic signal.So as to further reduce the thickness of ultrasonic fingerprint identification module, ultrasonic wave letter is further reduced
Loss in number transmitting procedure, and shorten the transmission path of ultrasonic signal, be advantageous to improve the ultrasonic fingerprint and know
The signal to noise ratio of other module and raising are to fingerprint recognition effect.
(5) reflecting layer is further comprised, the ultrasonic signal the piezoelectric layer to be sent reflects back into piezoelectric layer.Carry
High utilization of the ultrasonic fingerprint identification module to ultrasonic signal, reduces the loss of ultrasonic signal, improves the ultrasound
Ripple signal reaches the sensitivity of sensing face.
Compared with prior art, ultrasonic fingerprint recognition means provided by the invention have the advantages that:
(1) the ultrasonic fingerprint recognition means include above-mentioned ultrasonic fingerprint identification module and a display module, described
Display module divides into viewing area and non-display area, the ultrasonic fingerprint identification module correspond to the display module part or
Person's whole non-display area, the non-display areas of the ultrasonic fingerprint recognition means have recognition effect preferably, thinner thickness, noise
Than it is high, last a long time the advantages that.
(2) display module includes a cover plate, and the thickness of the cover plate is less than 1100 μm, therefore, be can be achieved described
Ultrasonic fingerprint recognition means support the cover plate of thickness in a big way, are more widely applied it.
(3) touch module is further comprised, the touch module is located at institute side by side with ultrasonic fingerprint identification module
The bottom of cover plate is stated, or the touch module is located at the bottom of cover plate and positioned at any one of ultrasonic fingerprint identification module
Side, realize the ultrasonic fingerprint identification in touch-control class product.
Compared with prior art, electronic equipment provided by the invention has the advantages that:
(1) electronic equipment includes above-mentioned ultrasonic fingerprint identification module, and it has, noise fast to fingerprint recognition efficiency
Than high and the advantages that rate is high respectively.
【Brief description of the drawings】
Fig. 1 is that ultrasonic fingerprint identification module provided by the invention has the structural representation that finger contacts.
Fig. 2 is operation principle schematic diagram when ultrasonic fingerprint identification module provided by the invention has finger contact.
Fig. 3 is operation principle schematic diagram when ultrasonic fingerprint identification module provided by the invention contacts without finger.
Fig. 4 A are an embodiment Rotating fields schematic diagrames of ultrasonic fingerprint identification module provided by the invention.
Fig. 4 B are another embodiment Rotating fields schematic diagrames of ultrasonic fingerprint identification module provided by the invention.
Fig. 4 C are the another embodiment Rotating fields schematic diagrames of ultrasonic fingerprint identification module provided by the invention.
Fig. 5 is the another embodiment Rotating fields schematic diagram of ultrasonic fingerprint identification module provided by the invention.
Fig. 6 is a variant embodiment Rotating fields schematic diagram of the identification module of ultrasonic fingerprint described in Fig. 5.
Fig. 7 A are the enlarged diagrams of the embodiment at A in Fig. 6.
Fig. 7 B are the enlarged diagrams of another embodiment at A in Fig. 6.
Fig. 7 C are the enlarged diagrams of the another embodiment at A in Fig. 6.
Fig. 8 is an embodiment Rotating fields schematic diagram of ultrasonic fingerprint recognition means provided by the invention.
Fig. 9 is another embodiment Rotating fields schematic diagram of ultrasonic fingerprint recognition means provided by the invention.
Figure 10 A are that the embodiment Rotating fields that ultrasonic fingerprint recognition means provided by the invention have display module are illustrated
Figure.
Figure 10 B are that the another embodiment Rotating fields that ultrasonic fingerprint recognition means provided by the invention have display module show
It is intended to.
Figure 11 A are that the embodiment Rotating fields that ultrasonic fingerprint recognition means provided by the invention have touch module are illustrated
Figure.
Figure 11 B are that the another embodiment Rotating fields that ultrasonic fingerprint recognition means provided by the invention have touch module show
It is intended to.
Figure 11 C are that the another embodiment Rotating fields that ultrasonic fingerprint recognition means provided by the invention have touch module show
It is intended to.
Figure 12 A are an example structure schematic diagrams of electronic equipment provided by the invention.
Figure 12 B are another example structure schematic diagrams of electronic equipment provided by the invention.
【Embodiment】
In order that the purpose of the present invention, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and embodiment,
The present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention,
It is not intended to limit the present invention.
Referring to Fig. 1, first embodiment of the invention provides a kind of ultrasonic fingerprint identification module 10, can apply but unlimited
In electronic equipments such as mobile phone, tablet personal computer, portable mobile phone, desktop computer, gate control systems.The ultrasonic fingerprint identification
Module 10, to obtain the fingerprint recognition image of finger 20 in the sensing face 101, the sensing face 101 is identification finger 20
The plane placed during fingerprint for finger 20, the ultrasonic fingerprint identification module 10 include matrix 110 and an at least piezoelectric layer
120, the piezoelectric layer 120 is located at the one side of described matrix 110, and the piezoelectric layer 120 is believed to launch ultrasonic wave to finger 20
Number, and the ultrasonic signal returned up to the back reflection of finger 20 is received, the piezoelectric layer 120 converts the ultrasonic signal of reception
For electric signal.The electric signal is available for conversion into fingerprint recognition image, and the fingerprint recognition figure of finger can be formed according to the electric signal
Picture.The piezoelectric layer 120 is the piezoelectric layer 120 in situ to polarize.
Fingerprint recognition image is formed using the electric signal, the mode of realization can be formed in described matrix 110;
Can be that other positions beyond matrix 110 are formed, such as by the way that electric signal is led into the other positions to realize.Cause
This, described matrix can be in itself the substrate of a carrying piezoelectric layer 120 or convert electrical signals to fingerprint recognition figure
The element of picture.
The piezoelectric layer 120 is to polarize to be formed by the way of original position is polarized.Specifically, the piezoelectric layer 120 is in base
The one side of body 110 is formed in situ piezoelectric film, and the piezoelectric film includes relative first surface and second surface, makes the piezoelectric film
First surface potential is zero;The first electric field and the second electric field, the first electric field are provided in the top of the second surface of the piezoelectric film
Potential be higher than the second electric field potential;The environmental gas above the piezoelectric film is ionized in the presence of the first electric field, the ring
Border gas is gathered in the second surface of piezoelectric film through the second electric field, makes to be formed along film thickness direction in the piezoelectric film
Film internal electric field, polarization is carried out to the piezoelectric film and forms the piezoelectric layer 120.
In actual production, can be will using modes such as chemical vapor deposition, physical vapour deposition (PVD), plasma sputterings
Piezoelectric film is formed on matrix 110.In the prior art, piezoelectric film passes through one layer of bonding typically by existing finished product is purchased
Layer is adhered on matrix to be polarized, and generally, the piezoelectric layer thickness that such a method is formed is not suitable with existing more than 30 μm
The frivolous development trend of electronic device, and module is identified using the ultrasonic fingerprint of this piezoelectric layer, because piezoelectric layer is too thick,
Therefore resolution ratio is relatively low.And the piezoelectric layer 120 of the offer of the present invention is formed in situ on matrix 110, therefore very thin thickness, and
Formation process is simple, so as to reduce the transmission loss of ultrasonic signal, is advantageous to improve the finger of ultrasonic fingerprint identification module 10
The resolution ratio of line identification.Furthermore the present invention sets electrode compared to the upper and lower surface directly in piezoelectric layer 120, will not make piezoelectricity
Layer 120 directly bears applied high voltage electric field, is avoided that piezoelectric layer 120 is breakdown.The present invention can use ion body polarization (tool
Body can be found in the Chinese patent application of Application No. 201710108374.9) or X ray polarization (for details, reference can be made to Application No.
201611222575.3 Chinese patent application) mode form the piezoelectric layer 120, the piezoelectric layer 120 formed can be done
To very thin, moreover, the piezo-electric effect of the piezoelectric layer 120 of the present invention is preferable and service life length, can be good at being useful in super
In sound wave fingerprint recognition module 10, beneficial to realize ultrasonic fingerprint identify 10 preferable recognition effect of module.In the present invention, carry out
The piezo-electric effect D of the piezoelectric layer 120 of polarization in situ33Scope be 20-35pC/N.
The material of the piezoelectric layer 120 is piezoelectric, specific to can be selected but be not limited to:Kynoar, polyvinyl chloride,
Poly-γ-methyl-L-glutamate, one or several kinds of combinations in makrolon, polyvinylidene fluoride copolymer.
In some embodiments of the invention, the copolymer of the material selection Kynoar of the piezoelectric layer 120 is poly-
Vinylidene-trifluoro-ethylene copolymer, in order to obtain the preferable piezoelectric layer 120 of piezo-electric effect, the Kynoar and trifluoro
The scope of the mass ratio of ethene is (60-95):(5-30), it is preferable that the scope of its mass ratio is (75-86):(15-
25), it is further preferred that its mass ratio is 80:20, the Kynoar and trifluoro-ethylene copolymer are more individually from poly- inclined
PVF can reduce cost, and it also has preferable piezo-electric effect.
The thickness of the piezoelectric layer is less than 30 μm, and its thickness may further be less than 9 μm, and yet further, its thickness can
, further, can be with for 1.5-7.4 μm, 1.9-7.2 μm, 2.2-8.6 μm, 2.8-8.4 μm or 3.6-6.6 μm
Specifically 1.8 μm, 2.4 μm, 2.6 μm, 3.7 μm, 3.9 μm, 4.2 μm, 4.6 μm, 5.6 μm, 5.8 μm, 6.7 μm, 8.6 μm, 8.7 μ
m。
A wherein embodiment is, described matrix 110 can be specifically the matrix 110 that surface is provided with thin film transistor (TFT) 111, institute
State and be electrically connected between thin film transistor (TFT) 111 and foregoing piezoelectric layer 120, the thin film transistor (TFT) 111 is to by foregoing electric signal
Conversion forms fingerprint recognition image.
The matrix 110 for being provided with thin film transistor (TFT) 111 in following examples for surface with matrix 110 illustrates, and institute
Stating matrix 110 includes relative two sides, and the thin film transistor (TFT) 111 is arranged on the wherein one side of described matrix 110.
Referring to Fig. 2, the concrete operating principle of the ultrasonic fingerprint identification module 10 is:Applied in the piezoelectric layer 120
Add a driving voltage, the piezoelectric layer 120 is produced vibration so as to send transmission signal 121.When sensing face 101 has finger 20
During contact, the fingerprint of finger 20 includes fingerprint ridge and fingerprint valley, because fingerprint ridge directly contacts with sensing face 101, and fingerprint valley
Air is filled between sensing face 101, therefore the acoustic impedance values for making fingerprint ridge and fingerprint valley correspond at sensing face 101 are different.
When the transmission signal 121 is respectively transmitted in the sensing face 101 and reaches the fingerprint ridge and fingerprint valley of finger 20, referring to
At wrinkle ridge, the part of transmission signal 121 is absorbed by fingerprint ridge, and part forms the first feedback signal 122 and reflexes to piezoelectric layer
120;At fingerprint valley, the almost all of transmission signal 121 forms the second feedback signal 123 and reflexes to piezoelectric layer 120, described
Capacity volume variance between first feedback signal 122 and the second feedback signal 123 be present, and formed and connect in the piezoelectric layer 120 jointly
The collection of letters number, the reception signal is converted into electric signal and sends thin film transistor (TFT) 111 to by the piezoelectric layer 120, to form fingerprint
Identify image.
Referring to Fig. 3, when sensing face 101 contacts without finger 20, the transmission signal 121 is sent to the sensing face
It is completely reflected on 101 and almost to form the 3rd feedback signal 124 to piezoelectric layer 120, due to the 3rd feedback letter reflected
Numbers 124 and capacity volume variance is not present, therefore, fingerprint recognition image will not be formed.
First feedback signal 122, the second feedback signal 123, the 3rd feedback signal 124, transmission signal 121 and connect
The collection of letters number is a different expression form for ultrasonic signal, has difference specially on energy size, direction of transfer.
Fig. 4 A-4C are referred to, in some embodiments of the invention, the piezoelectric layer 120 is two layers, wherein a piezoelectricity
Layer 120 is launching ultrasonic signal;To receive the ultrasonic signal reflected, described two are laminated another piezoelectric layer 120
Electric layer 120 is arranged on the homonymy or heteropleural of matrix 110.
Specifically, in an embodiment of the present invention, wherein one layer of two layers of piezoelectric layer 120 be emission layer 120a to
Launch ultrasonic signal;Another layer is receiving layer 120b receiving the ultrasonic signal reflected.As shown in Figure 4 A, launch
Layer 120a and receiving layer 120b can be arranged at the side that described matrix 110 is provided with thin film transistor (TFT) 111, preferably described to connect
Receive layer 120b and be formed in situ the one side that thin film transistor (TFT) 111 is provided with matrix, the receiving layer 120b and film crystal can be beneficial to
Electrical couplings between pipe 111.As shown in Figure 4 B, or emission layer 120a and receiving layer 120b can be arranged at it is described
Matrix 110 is provided with the relative side of thin film transistor (TFT) 111, and preferably described receiving layer 120b is formed in situ to be provided with matrix 110
The relative one side of thin film transistor (TFT) 111, the receiving layer 120b and thin film transistor (TFT) 111 electrical couplings can be beneficial to.Such as Fig. 4 C
It is shown, or emission layer 120a and receiving layer 120b be separately positioned on the opposing sides of described matrix 110, preferably described reception
Layer 120b be arranged on matrix 110 be provided with thin film transistor (TFT) 111 one side, beneficial to the electrical couplings of thin film transistor (TFT) 111.
When receiving layer 120b, which is not disposed on matrix 110, is provided with 111 one side of thin film transistor (TFT), can by perforation,
The modes such as lead realize receiving layer 120b and thin film transistor (TFT) 111 electrical couplings, to realize receiving layer 120b by the super of reception
Acoustic signals are converted into electric signal transmission and are imaged to thin film transistor (TFT) 111.
The material of two piezoelectric layers 120 can be from equally or from different.
Referring to Fig. 5, in other embodiments of the present invention, the piezoelectric layer 120 is one layer, the piezoelectric layer 120
Any one side in described matrix 110 is formed, to launch and received ultrasonic signal, preferably described piezoelectric layer 120 are formed
Described matrix 110 is provided with the one side of thin film transistor (TFT) 111.The structure of the present embodiment has obtained further optimization, is embodied in into one
Step reduces the thickness of ultrasonic fingerprint identification module 10, improves recognition speed beneficial to realizing, and can shorten ultrasonic signal
Transmission path, be advantageous to improve the signal to noise ratio of the ultrasonic fingerprint identification module 10.
When the piezoelectric layer 120 is one layer, in an embodiment, the method for Time-sharing control can be used to realize the ultrasound
Identification of the ripple recognition means 10 to fingerprint.Can be that time segment controls the piezoelectric layer 120 to launch and received ultrasonic signal,
Such as ultrasonic signal transmitting and the conversion received are realized by the driving voltage that applies on the piezoelectric layer 120 of interruption.
The time interval of the Time-sharing control is 1-20 μ s, in order to further realize transmitting and receive conversion stability and in real time
Property, the time interval of the Time-sharing control is 6-7 μ s.
In another embodiment, it can also be while control transmitting and the received ultrasonic signal of the piezoelectric layer 120,
When fingerprint is identified, the difference of automatic identification ultrasonic signal or electric signal so as to realize the transmitting of ultrasonic signal and
The conversion of reception.
Referring to Fig. 6, in some variant embodiments of the present invention, the ultrasonic fingerprint identification module 10 further wraps
Reflecting layer 170 is included, the ultrasonic signal the piezoelectric layer 120 to be sent reflects back into piezoelectric layer 120.
Specifically, the reflecting layer 170 is located at side of the matrix 110 away from the sensing face 101 and is located at piezoelectric layer 120
Away from the sensing face 101 side, and/or the reflecting layer 170 be located at it is adjacent towards sensing face 101 on piezoelectric layer 120
On face.The reflecting layer 170 reflexing to the sensing face again by the ultrasonic signal that can not reach sensing face 101
101 either strengthen the ultrasonic signal for reaching sensing face 101, and sensing face 101 is reached to improve the ultrasonic signal
Sensitivity.
Please continue to refer to Fig. 6, and Fig. 7 A-7C are referred to, in the variant embodiment of the present invention, as shown in Figure 7 A, due to pressure
Electric layer 120 is arranged on matrix 110 close to the side of sensing face 101, then reflecting layer 170a is arranged on matrix 110 away from sensing face
101 one side;If piezoelectric layer 120 is arranged on one side of the matrix 110 away from sensing face 101, the reflecting layer 170a can be
It is formed directly into one side of the piezoelectric layer 120 backwards to sensing face 101.Or, define piezoelectric layer 120 as shown in Figure 7 B
The face adjacent towards sensing face 101 is the side of the piezoelectric layer 120, and the reflecting layer 170b is arranged on the side of piezoelectric layer 120
Face.As seen in figure 7 c, it can also be the reflecting layer 170c in side of the piezoelectric layer 120 away from sensing face 101 and in piezoelectricity
Layer 170c side is respectively provided with.
The material in the reflecting layer 170 can be selected but be not limited to any of Ag, Au, Cu, Al, preferably Ag, its thickness
For 10-100nm.
Referring to Fig. 8, second embodiment of the invention provides a kind of ultrasonic fingerprint recognition means 30, have one to supply finger
20 sensing faces 101 placed, that includes the ultrasonic fingerprint module 10 in first embodiment, and a cover plate 140, the lid
Plate 140 is folded to be located on the ultrasonic fingerprint identification module 10, and sensing face 101 is located at cover plate 140 and known away from ultrasonic fingerprint
The side of other module 10.
One kind that the cover plate 140 can be selected but be not limited in the materials such as metal, glass, ceramics, plastics, preferably described lid
The material of plate 140 is glass.Because the ultrasonic fingerprint identification 10 more existing ultrasonic wave of module of first embodiment of the invention refers to
Line identification module has that resolution ratio is higher, therefore the thickness of supported cover plate 140 can further improve.
The thickness of the cover plate 140 is less than 1100 μm, can be specially 300 μm, 400 μm, 450 μm, 550 μm, 600 μm,
750 μm, 800 μm, 850 μm, 874 μm, 910 μm, 987 μm, 1010 μm or 1050 μm.Due to the ultrasonic fingerprint identifier
Part 30 can support the cover plate 140 of thickness in a big way, hence in so that it is more widely applied.
Referring to Fig. 9, in some embodiments of the invention, the ultrasonic fingerprint recognition means 30 also include a transition
Layer 160, the transition zone 160 is arranged on the side of the cover plate 140 away from described matrix 110, the acoustic impedance values of transition zone 160
Between the acoustic impedance values of air and cover plate 140.The one side of the transition zone 160 away from cover plate 140 is that finger 20 provides
Foregoing sensing face 101.
When being not provided with the transition zone 160, the acoustic impedance between the air and cover plate 140 of the both sides of sensing face 101
Value difference easily causes the loss of ultrasonic signal away from larger;After setting the transition zone 160, in the both sides of the sensing face 101
Air and cover plate between acoustic impedance values reduce gap using the transition zone 160, so as to reduce reach sensing face 101
Ultrasonic signal loss, and more conducively described ultrasound signal transmission is to sensing face 101, so as to improve recognition effect.
The material of the transition zone 160 can be selected but be not limited to:Aluminium, silica, aluminum oxide, brass, beryllium, cadmium, copper, carbon
Change one or several kinds of combinations in boron.
In some embodiments, the ultrasonic fingerprint recognition means can be applied in mobile phone, tablet personal computer, Portable movable
Phone, desktop computer, gate control system etc..
Figure 10 A are referred to, in other embodiments of the present invention, it is aobvious that the ultrasonic fingerprint recognition means 30 include one
Show module 410, the display module 410 divides into viewing area 411 and non-display area 412, and the ultrasonic fingerprint identifies module
The some or all of non-display area 412 of the 10 corresponding display modules 410.
As shown in Figure 10 A, in an embodiment of ultrasonic fingerprint recognition means 30, the ultrasonic fingerprint identifies module 10
Whole non-display areas 412 of the corresponding display module 410, for realizing that the non-display area 412 of display module 410 is all made
For the application of ultrasonic fingerprint identification.It is as shown in Figure 10 B, described super in another embodiment of ultrasonic fingerprint recognition means 30 '
The part non-display area 412 ' of the corresponding display module 410 ' of sound wave fingerprint recognition module 10 ', for meeting display module
The partly application as ultrasonic fingerprint identification of 410 ' non-display area 412 '.In one variant embodiment, the display module
410 (410 ') include carrier board 140.
Figure 11 A are referred to, in some specific embodiments of the present invention, the ultrasonic fingerprint recognition means 30 are further
Including touch module 50, as shown in Figure 11 A, the touch module 50 is located at institute side by side with ultrasonic fingerprint identification module 10
State the side (i.e. the bottom of cover plate) away from sensing face 101 on cover plate 140;As shown in Figure 11 B, or the touch module 50
Between the cover plate 140 and ultrasonic fingerprint identification module 10;As shown in Figure 11 C, or the touch module 50 is located at institute
State side of the ultrasonic fingerprint identification module 10 away from the cover plate 140.
In embodiments of the invention, in order to better illustrate the effect of ultrasonic fingerprint recognition means 30 of the present invention, it can enter
One step provides specific embodiment and illustrated, specific as follows:
First specific embodiment:
The ultrasonic fingerprint recognition means 30 include one lamination electric layer 120, the sensing face 101 backwards to finger 20 one
Side sets gradually cover plate 140, piezoelectric layer 120, matrix 110, wherein the material of the cover plate 140 is glass, its thickness is 900 μ
m;The thickness of the piezoelectric layer 120 is 5 μm, material selection Kynoar.
By dependence test, the resolution ratio of first specific embodiment is 97%, and fingerprint recognition speed is 400ms, letter
Make an uproar than for 10dB.
Second specific embodiment:
The difference of second specific embodiment and the first specific embodiment is:The piezoelectric layer 120 is two layers, i.e. area
Be divided into an emission layer 120a and a receiving layer 120b, the sensing face 101 down set gradually cover plate 140, receiving layer 120b,
Matrix 110 and emission layer 120a.
By dependence test, the resolution ratio of second specific embodiment is 94%, and fingerprint recognition speed is 450ms, letter
Make an uproar than for 9.5dB.
3rd specific embodiment:
The difference of 3rd specific embodiment and first specific embodiment is that the piezoelectric layer 120 is two layers,
An emission layer 120a and a receiving layer 120b are divided into, the sensing face 101 down sets gradually cover plate 140, emission layer
120a, receiving layer 120b and matrix 110.
By dependence test, the resolution ratio of the 3rd specific embodiment is 92%, and fingerprint recognition speed is 430ms, letter
Make an uproar than for 9.4dB.
4th specific embodiment:
The difference of 4th specific embodiment and first specific embodiment is, the sensing face 101 down according to
Secondary setting transition zone 160, cover plate 140, piezoelectric layer 120 and matrix 110, the material of the transition zone 160 is silica.
By dependence test, the resolution ratio of the 4th specific embodiment is 95%, and fingerprint recognition speed is 420ms, letter
Make an uproar than for 9.6dB.
5th specific embodiment:
The difference of 5th specific embodiment and first specific embodiment is, the sensing face 101 down according to
Secondary setting cover plate 140, piezoelectric layer 120, matrix 110 and reflecting layer 170, the material selection Ag in the reflecting layer 170, the reflection
The thickness of layer 170 is 50nm.
By dependence test, the resolution ratio of the 5th specific embodiment is 93%, and fingerprint recognition speed is 415ms, letter
Make an uproar than for 9.7dB.
Figure 12 A are referred to, third embodiment of the invention provides a kind of electronic equipment 50, and the present invention is real using above-mentioned first
The electronic equipment 50 applied the ultrasonic fingerprint identification module 10 described in example and built, the electronic equipment 50 is a Portable movable
Phone, including a shell 514 and display panel 510, the display panel 510 are embedded on the shell 514.
The display panel 510 divides into viewing area 511 and non-display area 512, and the ultrasonic fingerprint identifies module 10
The some or all of non-display area 512 of the corresponding display panel 510, the electronic equipment 50 has imitates to fingerprint recognition
The advantages that rate is fast, high resolution, high signal to noise ratio.
Specifically, as illustrated in fig. 12, in the electronic equipment 50, the corresponding institute of ultrasonic fingerprint identification module 10
State the whole of non-display area 512.As shown in Figure 12 B, in the electronic equipment 40 ', the display panel 510 ' it is non-display
There is a button 513 ', the corresponding button 413 ' of ultrasonic fingerprint identification module 10 in area 512 '.
The display panel 510 includes foregoing display module 410, and the display panel 510 can also further comprise foregoing
Touch module 50.
Compared with prior art, ultrasonic fingerprint identification module provided by the invention has the advantages that:
(1) the ultrasonic fingerprint identification module includes an at least piezoelectric layer, and the piezoelectric layer is the piezoelectricity in situ to polarize
Layer, the advantages that it has, and thickness of thin, piezo-electric effect are good, and service life is longer, be advantageous to improve ultrasonic fingerprint identification mould
The recognition effect of group and the thickness for reducing ultrasonic fingerprint identification module, improve its service life.
(2) thickness of the piezoelectric layer is less than 30 μm, beneficial to the thickness for reducing the ultrasonic fingerprint identification module, so that
Recognition effect is improved, the thickness of the piezoelectric layer can further be less than 9 μm, so as to can further improve ultrasonic fingerprint identification mould
The recognition effect of group.
(3) piezoelectric layer is two layers, wherein a piezoelectric layer is launching ultrasonic signal;Another piezoelectric layer is receiving
The ultrasonic signal reflected, two layers of piezoelectric layer are arranged on the homonymy or heteropleural of matrix.The ultrasonic fingerprint is known
Other module has the advantages of thickness of thin, recognition effect are good, and technique is simple, during reduction ultrasound signal transmission
Loss.
(4) piezoelectric layer is one layer, and the piezoelectric layer forms any one side in described matrix, to launch and receive
Ultrasonic signal.So as to further reduce the thickness of ultrasonic fingerprint identification module, ultrasonic wave letter is further reduced
Loss in number transmitting procedure, and shorten the transmission path of ultrasonic signal, be advantageous to improve the ultrasonic fingerprint and know
The signal to noise ratio of other module and raising are to fingerprint recognition effect.
(5) reflecting layer is further comprised, the ultrasonic signal the piezoelectric layer to be sent reflects back into piezoelectric layer.Carry
High utilization of the ultrasonic fingerprint identification module to ultrasonic signal, reduces the loss of ultrasonic signal, improves the ultrasound
Ripple signal reaches the sensitivity of sensing face.
Compared with prior art, ultrasonic fingerprint recognition means provided by the invention have the advantages that:
(1) the ultrasonic fingerprint recognition means include above-mentioned ultrasonic fingerprint identification module and a display module, described
Display module divides into viewing area and non-display area, the ultrasonic fingerprint identification module correspond to the display module part or
Person's whole non-display area, the non-display areas of the ultrasonic fingerprint recognition means have recognition effect preferably, thinner thickness, noise
Than it is high, last a long time the advantages that.
(2) display module includes a cover plate, and the thickness of the cover plate is less than 1100 μm, therefore, be can be achieved described
Ultrasonic fingerprint recognition means support the cover plate of thickness in a big way, are more widely applied it.
(3) touch module is further comprised, the touch module is located at institute side by side with ultrasonic fingerprint identification module
The bottom of cover plate is stated, or the touch module is located at the bottom of cover plate and positioned at any one of ultrasonic fingerprint identification module
Side, realize the ultrasonic fingerprint identification in touch-control class product.
Compared with prior art, electronic equipment provided by the invention has the advantages that:
(1) electronic equipment includes above-mentioned ultrasonic fingerprint identification module, and it has, noise fast to fingerprint recognition efficiency
Than high and the advantages that rate is high respectively.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all originals in the present invention
Any modification made within then, equivalent substitution and improvement etc. all should be included within protection scope of the present invention.
Claims (10)
1. a kind of ultrasonic fingerprint identifies module, some or all of non-display area of a corresponding display panel, it is characterised in that:
It includes a matrix and at least a piezoelectric layer, and the piezoelectric layer is located at the one side of described matrix, and the piezoelectric layer polarizes to be in situ
Piezoelectric layer, to launch and received ultrasonic signal, and the ultrasonic signal of reception is converted into electric signal output, to be formed
Fingerprint recognition image.
2. ultrasonic fingerprint identification module as described in the appended claim 1, it is characterised in that:The piezoelectric layer is two layers, wherein one
Piezoelectric layer is launching ultrasonic signal;Another piezoelectric layer is receiving the ultrasonic signal reflected, two layers of the piezoelectricity
Layer is arranged on the homonymy or heteropleural of matrix.
3. ultrasonic fingerprint identification module as described in the appended claim 1, it is characterised in that:The piezoelectric layer is one layer, the pressure
Electric layer forms any one side in described matrix, to launch and received ultrasonic signal.
4. ultrasonic fingerprint identification module as described in the appended claim 1, it is characterised in that:The thickness of the piezoelectric layer is less than 30 μ
m。
5. ultrasonic fingerprint identification module as claimed in claim 4, it is characterised in that:The thickness of the piezoelectric layer is less than 9 μm.
6. ultrasonic fingerprint identifies module as any one of claim 1-5, it is characterised in that:Further comprise reflecting
Layer, the ultrasonic signal the piezoelectric layer to be sent reflect back into piezoelectric layer.
A kind of 7. ultrasonic fingerprint recognition means, it is characterised in that:Refer to including ultrasonic wave any one of claim 1-5
Line identifies module and a display module, and the display module divides into viewing area and non-display area, the ultrasonic fingerprint identification
Module corresponds to some or all of non-display area of the display module.
8. ultrasonic fingerprint recognition means as recited in claim 7, it is characterised in that:The display module includes a cover plate,
The thickness of the cover plate is less than 1100 μm.
9. ultrasonic fingerprint recognition means as claimed in claim 8, it is characterised in that:Further comprise touch module, it is described
Touch module is located at the bottom of the cover plate with ultrasonic fingerprint identification module side by side, or the touch module is positioned at lid
The bottom of plate and any side that module is identified positioned at ultrasonic fingerprint.
10. a kind of electronic equipment, it is characterised in that:Mould is identified including the ultrasonic fingerprint any one of claim 1-5
Group and a display panel, the display panel divide into viewing area and non-display area, and the ultrasonic fingerprint identification module is corresponding
The some or all of non-display area of the display panel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710218418.3A CN107403129A (en) | 2017-04-05 | 2017-04-05 | Ultrasonic fingerprint identification module, ultrasonic fingerprint recognition means and electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710218418.3A CN107403129A (en) | 2017-04-05 | 2017-04-05 | Ultrasonic fingerprint identification module, ultrasonic fingerprint recognition means and electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107403129A true CN107403129A (en) | 2017-11-28 |
Family
ID=60404366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710218418.3A Pending CN107403129A (en) | 2017-04-05 | 2017-04-05 | Ultrasonic fingerprint identification module, ultrasonic fingerprint recognition means and electronic equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107403129A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108846318A (en) * | 2018-05-24 | 2018-11-20 | 业成科技(成都)有限公司 | Ultrasonic fingerprint identification device and preparation method thereof and the electronic device for applying it |
WO2019210708A1 (en) * | 2018-05-04 | 2019-11-07 | 京东方科技集团股份有限公司 | Sensor and production method therefor, panel, and recognition device |
CN110579271A (en) * | 2019-09-24 | 2019-12-17 | 成都大超科技有限公司 | Acoustic impedance calibration method based on ultrasonic waves, ultrasonic sensor, ultrasonic fingerprint identification module and electronic equipment |
CN112130688A (en) * | 2019-06-24 | 2020-12-25 | Oppo广东移动通信有限公司 | Display screen, electronic equipment and control method thereof |
WO2021081776A1 (en) * | 2019-10-29 | 2021-05-06 | 南昌欧菲生物识别技术有限公司 | Ultrasonic fingerprint module, manufacturing method therefor, and electronic device |
CN113219707A (en) * | 2021-05-19 | 2021-08-06 | 业泓科技(成都)有限公司 | Liquid crystal display module and electronic equipment |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006326523A (en) * | 2005-05-27 | 2006-12-07 | Canon Inc | Film deposition method, piezoelectric film formed by the film deposition method, piezoelectric element with the piezoelectric film, and ink jet apparatus using the piezoelectric element |
US20140265724A1 (en) * | 2013-03-14 | 2014-09-18 | Tdk Corporation | Piezoelectric element, piezoelectric actuator, piezoelectric sensor, hard disk drive, and inkjet printer device |
CN104424420A (en) * | 2013-08-30 | 2015-03-18 | 业鑫科技顾问股份有限公司 | Electronic device |
CN104677399A (en) * | 2014-11-24 | 2015-06-03 | 麦克思智慧资本股份有限公司 | Ultrasonic sensor |
CN105474419A (en) * | 2013-08-21 | 2016-04-06 | 富士胶片戴麦提克斯公司 | Multi-layered thin film piezoelectric devices & methods of making the same |
CN105631402A (en) * | 2015-12-18 | 2016-06-01 | 麦克思商务咨询(深圳)有限公司 | Fingerprint recognition device and fingerprint recognition method |
KR20160092373A (en) * | 2015-01-27 | 2016-08-04 | 엘지이노텍 주식회사 | Finger printing sensor |
CN106056077A (en) * | 2016-05-30 | 2016-10-26 | 京东方科技集团股份有限公司 | Integrated circuit device, display panel and display device |
-
2017
- 2017-04-05 CN CN201710218418.3A patent/CN107403129A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006326523A (en) * | 2005-05-27 | 2006-12-07 | Canon Inc | Film deposition method, piezoelectric film formed by the film deposition method, piezoelectric element with the piezoelectric film, and ink jet apparatus using the piezoelectric element |
US20140265724A1 (en) * | 2013-03-14 | 2014-09-18 | Tdk Corporation | Piezoelectric element, piezoelectric actuator, piezoelectric sensor, hard disk drive, and inkjet printer device |
CN105474419A (en) * | 2013-08-21 | 2016-04-06 | 富士胶片戴麦提克斯公司 | Multi-layered thin film piezoelectric devices & methods of making the same |
CN104424420A (en) * | 2013-08-30 | 2015-03-18 | 业鑫科技顾问股份有限公司 | Electronic device |
CN104677399A (en) * | 2014-11-24 | 2015-06-03 | 麦克思智慧资本股份有限公司 | Ultrasonic sensor |
KR20160092373A (en) * | 2015-01-27 | 2016-08-04 | 엘지이노텍 주식회사 | Finger printing sensor |
CN105631402A (en) * | 2015-12-18 | 2016-06-01 | 麦克思商务咨询(深圳)有限公司 | Fingerprint recognition device and fingerprint recognition method |
CN106056077A (en) * | 2016-05-30 | 2016-10-26 | 京东方科技集团股份有限公司 | Integrated circuit device, display panel and display device |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019210708A1 (en) * | 2018-05-04 | 2019-11-07 | 京东方科技集团股份有限公司 | Sensor and production method therefor, panel, and recognition device |
CN108846318A (en) * | 2018-05-24 | 2018-11-20 | 业成科技(成都)有限公司 | Ultrasonic fingerprint identification device and preparation method thereof and the electronic device for applying it |
CN108846318B (en) * | 2018-05-24 | 2021-08-31 | 业泓科技(成都)有限公司 | Ultrasonic fingerprint identification device, manufacturing method thereof and electronic device applying ultrasonic fingerprint identification device |
CN112130688A (en) * | 2019-06-24 | 2020-12-25 | Oppo广东移动通信有限公司 | Display screen, electronic equipment and control method thereof |
CN112130688B (en) * | 2019-06-24 | 2023-03-24 | Oppo广东移动通信有限公司 | Display screen, electronic equipment and control method thereof |
CN110579271A (en) * | 2019-09-24 | 2019-12-17 | 成都大超科技有限公司 | Acoustic impedance calibration method based on ultrasonic waves, ultrasonic sensor, ultrasonic fingerprint identification module and electronic equipment |
WO2021081776A1 (en) * | 2019-10-29 | 2021-05-06 | 南昌欧菲生物识别技术有限公司 | Ultrasonic fingerprint module, manufacturing method therefor, and electronic device |
CN113219707A (en) * | 2021-05-19 | 2021-08-06 | 业泓科技(成都)有限公司 | Liquid crystal display module and electronic equipment |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107403129A (en) | Ultrasonic fingerprint identification module, ultrasonic fingerprint recognition means and electronic equipment | |
CN109829419A (en) | Fingerprint recognition mould group and its driving method and production method, display device | |
US11120243B2 (en) | Fingerprint identification module, manufacturing method and driving method thereof, display device | |
US11247234B2 (en) | Ultrasonic fingerprint recognition module and display panel | |
CN104424420B (en) | Electronic installation | |
CN105447470A (en) | Electronic apparatus | |
WO2020215628A1 (en) | Self-sounding display device | |
TWI684917B (en) | Panel structure | |
CN106886753B (en) | Electronic device using acoustic wave type fingerprint identification device | |
US20200184176A1 (en) | Ultrasound fingerprint detection and related apparatus and methods | |
CN107832665A (en) | Display module and electronic equipment | |
US10445549B2 (en) | Fingerprint identification device and electronic device using same | |
CN110210435A (en) | A kind of display panel, its control method and display device | |
CN107798300A (en) | Ultrasonic fingerprint identification module, device and electronic equipment | |
CN110046556A (en) | A kind of display panel and its terminal part | |
CN207182332U (en) | Ultrasonic fingerprint identifies module and electronic equipment | |
CN206849038U (en) | Ultrasonic fingerprint identification module, ultrasonic fingerprint recognition means and electronic equipment | |
CN109492493A (en) | Ultrasonic fingerprint identifies mould group and electronic equipment | |
WO2023284740A1 (en) | Display module and electronic device | |
CN109522884A (en) | Fingerprint recognition senses mould group and display panel | |
WO2023284734A1 (en) | Display module and electronic device | |
TWI764361B (en) | Touch recognition device, display device and manufacturing method thereof | |
CN107967444A (en) | Display module and electronic equipment | |
CN107967443A (en) | Display module and electronic equipment | |
US11823482B2 (en) | Ultrasonic sensor, display panel and display apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |