CN110342795A - Hot bending die, cover board and preparation method thereof and mobile communication equipment - Google Patents
Hot bending die, cover board and preparation method thereof and mobile communication equipment Download PDFInfo
- Publication number
- CN110342795A CN110342795A CN201910703641.6A CN201910703641A CN110342795A CN 110342795 A CN110342795 A CN 110342795A CN 201910703641 A CN201910703641 A CN 201910703641A CN 110342795 A CN110342795 A CN 110342795A
- Authority
- CN
- China
- Prior art keywords
- hot bending
- substrate
- cover board
- bending die
- indicia grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
- C03B23/03—Re-forming glass sheets by bending by press-bending between shaping moulds
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Signal Processing (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of hot bending die, cover board and preparation method thereof and mobile communication equipments.The preparation method includes: that substrate is placed in hot bending die to carry out hot bending, substrate after obtaining hot bending, substrate after the hot bending has indicia grooves, wherein, the hot bending die includes cavity plate and punch-pin, and the cavity plate has type chamber, and the punch-pin has the boss to match with the shape of the type chamber, mark part outstanding is formed on the boss, the indicia grooves are formed at the mark part；The coating printing ink in the indicia grooves obtains the cover board with identification pattern after dry.The present invention uses special hot bending die, the phenomenon that being prepared with indicia grooves and identification pattern is formed in the mobile communication equipment substrate in the indicia grooves, being in use not in identification pattern abrasion and fall off, outer surface of substrate is flat and smooth, it is more beautiful, better user experience.
Description
Technical field
The present invention relates to mobile communication technology fields, more particularly to hot bending die, cover board and preparation method thereof and movement
Communication apparatus.
Background technique
Currently, the major way that brand LOGO or figure are arranged on hand-held mobile communication, amusement equipment is outside equipment
Printing or grooving patch on cover board.Can occur wear phenomenon in use in the LOGO or figure of lid surface printing, drop
The exposure rate of low brand and the desire to purchase of client.And grooving patch then makes uneven on cover board, touch feeling is bad,
And patch easily falls off, affect experience.
Summary of the invention
Based on this, it is necessary to provide a kind of smooth surface and can be avoided identification pattern abrasion and obscission
Cover board and preparation method thereof.
In addition, also providing a kind of hot bending die for being used to prepare above-mentioned cover board, and the mobile communication including above-mentioned cover board
Equipment.
One kind being used for hot bending die, which includes cavity plate and punch-pin, and the cavity plate has type chamber, the convex mold
There is the boss to match with the shape of the type chamber, is formed with mark part outstanding on the boss.
In one of the embodiments, the mark part relative to the boss projecting height be no more than the cavity plate with
After punch-pin molding between the bottom surface and the boss of the type chamber spacing 1/2.
The material of the cavity plate and the punch-pin is graphite in one of the embodiments,.
A kind of preparation method of cover board, this method comprises:
Substrate is placed in hot bending die and carries out hot bending, the substrate after obtaining hot bending, the substrate after the hot bending has mark
Know groove, wherein the hot bending die includes cavity plate and punch-pin, and the cavity plate has type chamber, and the punch-pin has and the type
The boss that the shape of chamber matches is formed with mark part outstanding on the boss, and the indicia grooves are at the mark part
It is formed；
Marking ink is coated in the indicia grooves, obtains the cover board with identification pattern after dry.
The depth of the indicia grooves is no more than the 1/2 of the thickness of the substrate in one of the embodiments,.
In one of the embodiments, before the substrate is placed in the hot bending die, first to the substrate into
Row pretreatment；The pretreatment includes at least one of cutting, computer numerical control processing, grinding and polishing and cleaning.
The condition of the hot bending includes: and carries out under nitrogen protection in one of the embodiments, temperature be 650 DEG C~
800 DEG C, the time is 50s~100s, and the flow of nitrogen is 100L/min~200L/min.
Before coating marking ink in the indicia grooves in one of the embodiments, first by the base after the hot bending
Plate carries out intermediate treatment；The intermediate treatment includes at least one of grinding and polishing, cleaning, intensive treatment and coating film treatment.
The intensive treatment includes at least one of physical strengthening and chemical strengthening in one of the embodiments,.
The physical strengthening includes: that the substrate after the hot bending is placed in annealing furnace in one of the embodiments,
20min~40min is handled at 600 DEG C~680 DEG C, is subsequently placed in quenching 15s~60s under 10~20 DEG C of cold wind.
The chemical strengthening includes: to contact the substrate after the hot bending with hardening agent in one of the embodiments,.
The coating film treatment includes: to have the mark to the substrate after the hot bending in one of the embodiments,
The one side of groove carries out plated film, obtains the substrate with overlay film.
The overlay film is anti-reflection film in one of the embodiments,.
Include: the step of coating marking ink in the indicia grooves in one of the embodiments,
Marking ink is coated by way of silk-screen printing or spraying in the indicia grooves.
In one of the embodiments, the condition of the drying include: temperature be 80 DEG C~160 DEG C, the time be 15min~
40min。
This method in one of the embodiments, further include: there is the mark in the cover board with identification pattern
Know the one side coating protection ink of groove and dries.
Cover board prepared by the above method.
A kind of mobile communication equipment, including above-mentioned cover board.
From tradition substrate surface print or grooving patch to prepare the method for identification pattern different, it is special that the present invention uses
Hot bending die makes to form indicia grooves on the inside of substrate under hot bending process, then the coating printing ink in the indicia grooves, to make product
The identification patterns such as board LOGO, customized graphics are formed in indicia grooves.When assembling mobile communication equipment, indicia grooves direction is set
It is standby internal, it is in use not in abrasion and obscission, cover board appearance to avoid being exposed to identification pattern outside
Face is flat and smooth, more beautiful, better user experience.In addition, passing it through cover board since identification pattern is located on the inside of cover board
Effect is presented and has more three-dimensional sense, has in terms of promoting the product identification degree of brand quotient, meeting customer personalized obvious
Advantage.
Detailed description of the invention
Fig. 1 is the schematic diagram of the hot bending die of an embodiment；
Fig. 2 is the flow chart of the preparation method of the substrate of an embodiment；
Fig. 3 is to pre-process the flow chart of S000 step in the preparation method of substrate shown in Fig. 2；
Fig. 4 is the flow chart of intermediate treatment S110 step in the preparation method of substrate shown in Fig. 2；
Fig. 5 is that the preparation method of substrate shown in Fig. 2 further comprises the flow chart of step S300；
Fig. 6 is the mobile communication equipment front shroud with indicia grooves (identification pattern is not shown) of embodiment preparation
Schematic diagram；
Fig. 7 is the mobile communication equipment back shroud with indicia grooves (identification pattern is not shown) of embodiment preparation
Schematic diagram.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
The hot bending die of one embodiment, with reference to Fig. 1, which includes cavity plate 1 and punch-pin 2, and cavity plate 1 has type chamber
3, punch-pin 2 has the boss 4 to match with the shape of type chamber 3, is formed with mark part 5 outstanding on boss 4.
When being processed by hot bending process to substrate, usually substrate is placed in the type chamber 3 of cavity plate 1, then will
Cavity plate 1 and punch-pin 2 mold, and under the conditions of hot bending process, mark part 5 outstanding can make substrate side form one on boss 4
Groove, i.e. indicia grooves, for coating printing ink wherein to form identification pattern.
The shapes and sizes of mark part 5 can be adjusted according to the shapes and sizes of identification pattern, quantity and convex
Position on platform 4, which also can according to need, to be designed, and is fixed as long as not influencing cover board and being bonded with communication apparatus.For example,
Mark part 5 can be the geometries such as cuboid or square, can also be the shapes such as text body, floral designs.
Mark part 5 is no more than cavity plate relative to the projecting height of boss in one of the embodiments, and punch-pin molds
1/2 of spacing between the bottom surface and boss of rear profile chamber.That is, the depth for being formed by indicia grooves is no more than substrate
The 1/2 of thickness.In such manner, it is possible to avoid the projecting height due to mark part 5 excessive, cause the indicia grooves of preparation too deep, influences
Substrate integral strength.
Hot bending die is prepared using graphite in one of the embodiments, i.e. the material of cavity plate and punch-pin is stone
Ink.Graphite have hardness height, good conductivity, radiation protection, corrosion-resistant, thermal conductivity is good, high temperature resistant, advantage at low cost, especially fit
It is used to prepare hot bending die.
Above-mentioned hot bending die is particularly useful for making the mobile communication equipment cover board with identification pattern.Using above-mentioned hot bending
The cover board with indicia grooves, the coating printing ink in the indicia grooves, to make can be prepared in mold under hot bending process
The identification patterns such as brand LOGO, customized graphics are formed in groove, avoid printing due to identification pattern or patch is in lid surface
It is caused to wear and fall off.
The preparation method of the cover board of one embodiment, with reference to Fig. 2, this method comprises:
S100: substrate being placed in hot bending die and carries out hot bending, the substrate after obtaining hot bending, and the substrate after hot bending has mark
Know groove.
In step S100, hot bending is carried out to substrate using above-mentioned hot bending die, which includes cavity plate 1 and punch-pin 2,
Cavity plate 1 has type chamber 3, and punch-pin 2 has the boss 4 to match with the shape of type chamber 3, is formed with mark part outstanding on boss 4
5.Due to have on boss 4 it is outstanding have mark part 5 so that during molding hot bending, the side of substrate shape at the mark part 5
At indicia grooves 8, with reference to Fig. 6 and Fig. 7.
The depth of indicia grooves is no more than the 1/2 of the thickness of substrate in one of the embodiments,.In such manner, it is possible to avoid
Groove is too deep, influences substrate integral strength.
In one of the embodiments, before substrate is placed in hot bending die, pretreatment S000 first is carried out to substrate,
To further increase product quality.
In one of the embodiments, pretreatment S000 include cutting, computer numerical control processing (CNC), grinding and polishing and
At least one of cleaning.
Fig. 3 is referred in one of the embodiments, and pretreatment S000 includes the cutting S001 successively carried out, computer number
Control processing S002, grinding and polishing S003 and cleaning S004.
Wherein, substrate is processed as by cutting S001 suitably sized, then passes through S002 pairs of computer numerical control processing
The further finishing impression molding of substrate, then keep substrate surface flat and smooth by grinding and polishing S003, finally by cleaning S004 removal
The impurity of substrate surface, spot, to obtain the free of contamination high-quality substrate of flat and smooth and clean surface.
Cleaning S004 is ultrasonic cleaning in one of the embodiments,.Further, the condition of ultrasonic cleaning includes: super
Acoustical power is 800W~1500W, and scavenging period is 3min~10min.
In one of the embodiments, in step S100, the condition of hot bending includes: to carry out under nitrogen protection, and temperature is
650 DEG C~800 DEG C, the time is 50s~100s, and the flow of nitrogen is 100L/min~200L/min.Under the conditions of above-mentioned hot bending,
Be conducive to substrate and form indicia grooves at the mark part 5 of punch-pin 2.
S200: marking ink is coated in the indicia grooves of the substrate after hot bending to form identification pattern, is obtained after dry
Cover board with identification pattern.
Before coating marking ink in the indicia grooves of the substrate after hot bending in one of the embodiments, first by hot bending
Substrate afterwards carries out intermediate treatment S110, to further increase product quality.That is, after carrying out step S100, after hot bending
Substrate carries out intermediate treatment S110, then carries out the operation of step S200 again.
Intermediate treatment S110 includes in grinding and polishing, cleaning, intensive treatment and coating film treatment in one of the embodiments,
At least one.
It include in one of the embodiments, the grinding and polishing S111 successively carried out with reference to Fig. 4, intermediate treatment S110, clear
Wash S112, intensive treatment S113 and coating film treatment S114.
Wherein, the part for the substrate surface out-of-flatness being likely to occur after hot bending can be removed by grinding and polishing S111,
So that substrate surface is smooth penetrating, the spots such as grounds travel being then adsorbed on substrate by cleaning S112 removal, then will cleaning
Substrate afterwards carries out intensive treatment S113, improves substrate strength and reaches finally by coating film treatment S114 in substrate surface plated film
The effect further beautified or strengthened.
Cleaning S112 is ultrasonic cleaning in one of the embodiments,.Further, the condition of ultrasonic cleaning includes: super
Acoustical power is 800W~1500W, and scavenging period is 3min~10min.
Intensive treatment S113 includes at least one of physical strengthening and chemical strengthening in one of the embodiments,.
In one of the embodiments, physical strengthening include: by the substrate after hot bending be placed in annealing furnace 600 DEG C~
20min~40min is handled at 680 DEG C, is subsequently placed in quenching 15s~60s under 10~20 DEG C of cold wind.
Chemical strengthening includes: to contact the substrate after hot bending with hardening agent in one of the embodiments, so that after hot bending
Substrate surface formed strengthening layer.
Hardening agent includes potassium nitrate and promotor in one of the embodiments, and the weight ratio of potassium nitrate and promotor can
Think 2:(0.1~0.5), promotor such as potassium chloride, potassium hydroxide etc..The dosage of hardening agent is not particularly limited, and generally will
Substrate submergence.Further, in chemical strengthening process, reinforcing can be further increased by way of DC electric field is added
Effect shortens the processing time.
In the step of substrate after hot bending is contacted with hardening agent in one of the embodiments, the condition of contact includes:
Temperature is 380 DEG C~450 DEG C, and the time is 20min~240min.
In one of the embodiments, coating film treatment include: to the one side with indicia grooves of the substrate after hot bending into
Row plated film obtains the substrate with overlay film.At this moment, which is covered on the whole table of the one side with indicia grooves of substrate
Face, that is, the both inside of covering marking groove also covers other regions on substrate in addition to indicia grooves.In this way, by base
Plate integrally carries out overlay film, can improve indicia grooves inside and the product quality in other regions simultaneously.
The overlay film is anti-reflection film in one of the embodiments,.Coating film treatment is carried out using anti-reflection film, substrate can be made
Translucency is stronger, while is more clear identification pattern.
Coating film treatment is carried out by the way of magnetron sputtering plating in one of the embodiments,.
In step S200, according to the pattern being pre-designed, marking ink is coated in indicia grooves, it can be in indicia grooves
Identification pattern needed for interior formation.
Include: the step of coating marking ink in the indicia grooves of the substrate after hot bending in one of the embodiments,
Marking ink is coated by way of silk-screen printing or spraying in indicia grooves.
Wherein, it is 100 mesh~350 mesh that the condition of silk-screen printing, which may include: halftone mesh number, net away from for 2mm~3.5mm,
Travel speed is 100mm/s~300mm/s.
Wherein, it is 0.25Mpa~0.8Mpa that the condition of spraying, which may include: pressure,.
The type of marking ink is various ink commonly used in the art, select according to identification pattern.
Marking ink is ink with mirror effect in one of the embodiments, which can generate the strong light of high reflectance when light irradiates,
So that resulting identification pattern is more eye-catching.It in other embodiments, can also be in marking ink added with conducive to raising mark
Know the various additives of pattern definition, firmness etc..
The marking ink coated in indicia grooves in one of the embodiments, with a thickness of 8~30 μm.
In step S200, it is dried after coating marking ink.Dry condition includes: in one of the embodiments,
Temperature is 80 DEG C~160 DEG C, and the time is 15min~40min.After drying, the cover board with identification pattern can be obtained.
Fig. 5, this method are referred in one of the embodiments, further include:
S300: ink is protected in the one side coating with indicia grooves of the cover board with identification pattern and is dried.Protection
Other regions on the inside of ink covering marking groove and cover board in addition to indicia grooves, had both protected identification pattern to avoid taking off
It falls, also further increases the quality of cover board.
Wherein, protection ink is the common type in this field.Protection ink is epoxy resin in one of the embodiments,
Ink.The thickness for protecting ink can be 8~25 μm.Drying can carry out under normal conditions, for example, at 80 DEG C~160 DEG C
It carries out.
Substrate includes preceding substrate and metacoxal plate in one of the embodiments,.That is, the above method, which can be used for preparing, has mark
Know the mobile communication equipment front shroud 6 (referring to Fig. 6) of pattern, it can also be used to after preparing the mobile communication equipment with identification pattern
Cover board 7 (refers to Fig. 7).
By the above method, the identification patterns such as brand LOGO, customized graphics can be prepared and be formed in indicia grooves
Cover board.When assembling mobile communication equipment, by indicia grooves towards inside equipment, thus avoid for identification pattern being exposed to it is outer,
It is in use not in abrasion and obscission, cover board outer surface is flat and smooth, more beautiful, better user experience.
In addition, the presentation effect for passing it through cover board has more three-dimensional sense since identification pattern is located on the inside of cover board, promoting brand quotient's
Product identification degree, meet it is customer personalized pursue etc. have a clear superiority.
Cover board prepared by the above method with identification pattern.
A kind of mobile communication equipment, including the above-mentioned cover board with identification pattern.
Present invention will be further explained by specific examples below, but is not used in the limitation present invention.
Substrate employed in embodiment and comparative example is the middle lead glass purchased from southern glass/glass Co., Ltd.
Embodiment 1
It using hot bending die as shown in Figure 1, is prepared by graphite, there is cavity plate 1 and punch-pin 2, cavity plate 1 has type
Chamber 3, punch-pin 2 have boss 4, are formed with a mark part 5 outstanding on boss 4, mark part 5 is formed as rectangular shape, position
In on the center line in the portion on the lower side of boss 4.The projecting height of mark part 5 molds 3 bottom surface of rear profile chamber apart from convex for cavity plate 1 and punch-pin 2
The 1/3 of 4 spacing of platform.
Substrate is subjected to following pretreatment: being 6.3 cun by substrate cut, finishing impression molding is processed by computer numerical control, is ground
Grinding and polishing light, is then placed in supersonic wave cleaning machine, is cleaned by ultrasonic 5min through 4 rinse baths in the case where power is 1000W, removes substrate
The impurity on surface, spot obtain pretreated substrate.It places it in above-mentioned hot bending die, leads to the nitrogen protection (stream of nitrogen
Amount is 100L/min), and prevent from entering air, hot bending 50s is carried out at 700 DEG C, is taken out after being down to room temperature, obtains that there is mark
The substrate of groove, the depth of indicia grooves are the 1/3 of the thickness of substrate.Substrate surface after the hot bending is polished directly,
To be then placed in supersonic wave cleaning machine up to surfacing is penetrating or mirror effect, in the case where power is 1000W through 4 rinse baths
It is cleaned by ultrasonic 5min, removes the spots such as the grounds travel being adsorbed on substrate, be then placed in annealing furnace and handled at 600 DEG C
20min, then it is placed in quenching 15s under 10 DEG C of cold wind, it is taken out after cooling.Then, it is splashed in the one side with indicia grooves by magnetic control
One layer of anti-reflection film of mode sputter is penetrated, the substrate with overlay film is obtained.Next, passing through silk-screen printing (condition: halftone mesh number 100
Mesh, net is away from 2mm, travel speed 100mm/s) in indicia grooves coating thickness be 8 μm light tone ink (be purchased from INKTOP, type
Number: MK-5000C), dry 30min, obtains the cover board with identification pattern at 100 DEG C.Finally, passing through silk-screen printing (item
Part: 380 mesh of halftone mesh number, net is away from 2.5mm, travel speed 150mm/s) the face coating thickness with indicia grooves be 10 μm
Epoxy resin protection ink (be purchased from INKTOP, model: GLS series is black), dry 40min, is finally produced at 160 DEG C
Product.
Embodiment 2
The preparation process of the cover board with identification pattern of the present embodiment is roughly the same with embodiment 1, and difference is, passes through
The mode of spraying coats light tone ink in indicia grooves, spray pressure 0.35Mpa, ink thickness is 15 μm.
Comparative example 1
Light tone ink (purchased from INKTOP, model: MK-5000C) is directly coated on substrate by way of silk-screen printing,
The condition of silk-screen printing are as follows: 100 mesh of halftone mesh number, net are 8 μm away from 2mm, travel speed 100mm/s, the ink thickness of coating,
Dry 30min, obtains the cover board for being printed with identification pattern at 100 DEG C.
Comparative example 2
Grooving patch is carried out on substrate, method particularly includes: use engraving machine to carve out depth in upper surface of base plate as base
The groove of plate 1/3 is attached in groove after mark is engraved piece coating adhesive.
Test case
Following test is carried out to cover board prepared by Examples 1 to 2 and comparative example 1~2:
One, appearance is tested
Cover board prepared by Examples 1 to 2 and comparative example 1~2 is assembled into mobile communication equipment, the cover board of Examples 1 to 2
In assembling, indicia grooves towards inside equipment, outwardly, observe after being completed and produce by the identification pattern of the cover board of comparative example 1~2
Product appearance.
As a result: the cover board outer surface of Examples 1 to 2 is flat and smooth, more beautiful, and since identification pattern is located in cover board
Side, the presentation effect for passing it through cover board have more three-dimensional sense, improve the product identification degree of brand quotient.The cover board of comparative example 1~2
Identification pattern do not have three-dimensional sense.
Two, rub resistance is tested
Cover board sample is placed on the plane, using antifriction tester, uses the BON STAR NO0000# steel of 1 × 1cm
Velvet rubs 10 times back and forth under the pressure of loading 1Kg.
As a result: the identification pattern ink layer of the cover board of Examples 1 to 2 is not damaged.The ink layer of the cover board of comparative example 1 damages
Area >=65%；2 chip surface of comparative example is scratched, abraded area >=35%.
Three, UV illumination is tested
Using the accelerated ageing case for having UV light source, 340nm, temperature range is up to 60 DEG C.Cover board sample is placed into ageing oven
In, keep 4h；Turn off UV illumination, temperature is adjusted to 50 DEG C, and humidity exposure 4h is added, and above-mentioned 8h is as a loop test, and one
It recycles 20 times altogether, whether detection protection screen surfaces, which have crackle, fall off or corrode etc., is damaged.
As a result: the lid surface of Examples 1 to 2 is flawless, falls off, corrodes or mechanical damage.The patch of comparative example 2
Viscose aging is connected between lid panel notches to be caused to be detached from.
Four, moisture and hot ageing is tested
Cover board sample inclination is placed in test cabinet, temperature is 25 DEG C, gradually rises temperature extremely in humidity 90%RH, 3h
55 DEG C, 9h is stood, 25 DEG C are then cooled in 3h, keeps 9h, repeats above-mentioned circulation 5 times, test sample surface ink situation.
As a result: the lid surface of Examples 1 to 2 is flawless, falls off, corrodes or mechanical damage.The cover board of comparative example 2
Occur loosening and be detached from.
By the above test result as it can be seen that the identification pattern in cover board of the invention has three-dimensional sense, it is not easy in use process
There is wear phenomenon, good cycle.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (19)
1. a kind of hot bending die, which is characterized in that the hot bending die includes cavity plate and punch-pin, and the cavity plate has type chamber, described
Punch-pin has the boss to match with the shape of the type chamber, is formed with mark part outstanding on the boss.
2. hot bending die according to claim 1, which is characterized in that the mark part is relative to the prominent high of the boss
1/2 of degree no more than spacing between the bottom surface and the boss of the type chamber after the cavity plate and punch-pin molding.
3. hot bending die according to claim 1, which is characterized in that the material of the cavity plate and the punch-pin is stone
Ink.
4. hot bending die according to claim 1, which is characterized in that the hot bending die is used to prepare with identification pattern
Mobile communication equipment cover board.
5. a kind of preparation method of cover board, which is characterized in that this method comprises:
Substrate is placed in hot bending die and carries out hot bending, the substrate after obtaining hot bending, the substrate after the hot bending have identify it is recessed
Slot, wherein the hot bending die includes cavity plate and punch-pin, and the cavity plate has type chamber, and the punch-pin has and the type chamber
The boss that shape matches is formed with mark part outstanding on the boss, and the indicia grooves are formed at the mark part；
Marking ink is coated in the indicia grooves, obtains the cover board with identification pattern after dry.
6. according to the method described in claim 5, it is characterized in that, the depth of the indicia grooves is no more than the thickness of the substrate
The 1/2 of degree.
7. according to the method described in claim 5, it is characterized in that, before the substrate is placed in the hot bending die,
First the substrate is pre-processed；It is described pretreatment include cutting, computer numerical control processing, grinding and polishing and cleaning in extremely
Few one kind.
8. according to the method described in claim 5, it is characterized in that, the condition of the hot bending includes: to carry out under nitrogen protection,
Temperature is 650 DEG C~800 DEG C, and the time is 50s~100s, and the flow of nitrogen is 100L/min~200L/min.
9. according to the method described in claim 5, it is characterized in that, first will before coating marking ink in the indicia grooves
Substrate after the hot bending carries out intermediate treatment；The intermediate treatment includes grinding and polishing, cleaning, intensive treatment and coating film treatment
At least one of.
10. according to the method described in claim 9, it is characterized in that, the intensive treatment includes physical strengthening and chemical strengthening
At least one of.
11. according to the method described in claim 10, it is characterized in that, the physical strengthening includes: by the base after the hot bending
Plate is placed in annealing furnace processing 20min~40min at 600 DEG C~680 DEG C, is subsequently placed in quenching 15s under 10~20 DEG C of cold wind
~60s.
12. according to the method described in claim 10, it is characterized in that, the chemical strengthening includes: by the base after the hot bending
Plate is contacted with hardening agent.
13. according to the method described in claim 9, it is characterized in that, the coating film treatment includes: to the substrate after the hot bending
One side with the indicia grooves carry out plated film, obtain the substrate with overlay film.
14. according to the method for claim 13, which is characterized in that the overlay film is anti-reflection film.
15. according to the method described in claim 5, it is characterized in that, the step of coating marking ink in the indicia grooves
Include:
Marking ink is coated by way of silk-screen printing or spraying in the indicia grooves.
16. according to the method described in claim 5, it is characterized in that, it is 80 DEG C~160 that the condition of the drying, which includes: temperature,
DEG C, the time is 15min~40min.
17. according to the method described in claim 5, it is characterized in that, this method further include: in the lid with identification pattern
The one side coating protection ink with the indicia grooves of plate is simultaneously dried.
18. the cover board that the method as described in claim 5~17 any one is prepared.
19. a kind of mobile communication equipment, which is characterized in that including the cover board described in claim 18.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910703641.6A CN110342795A (en) | 2019-07-31 | 2019-07-31 | Hot bending die, cover board and preparation method thereof and mobile communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910703641.6A CN110342795A (en) | 2019-07-31 | 2019-07-31 | Hot bending die, cover board and preparation method thereof and mobile communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110342795A true CN110342795A (en) | 2019-10-18 |
Family
ID=68183574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910703641.6A Pending CN110342795A (en) | 2019-07-31 | 2019-07-31 | Hot bending die, cover board and preparation method thereof and mobile communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110342795A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111787143A (en) * | 2020-06-30 | 2020-10-16 | 萍乡伊博智能科技有限公司 | Method for processing rear cover plate of glass mobile phone |
| CN113977357A (en) * | 2020-12-31 | 2022-01-28 | 安徽金龙浩光电科技有限公司 | LOGO area polishing method for 3D glass graphite mold |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203159434U (en) * | 2012-07-27 | 2013-08-28 | 正达国际光电股份有限公司 | Glass forming die and glass forming device using same |
| US20180086663A1 (en) * | 2016-09-23 | 2018-03-29 | Apple Inc. | Thermoformed cover glass for an electronic device |
| CN107867793A (en) * | 2017-10-31 | 2018-04-03 | 广东欧珀移动通信有限公司 | Bend glass cover plate, the preparation method of bend glass cover plate and mobile terminal |
| CN207537335U (en) * | 2017-09-19 | 2018-06-26 | 深圳市东方碳素实业有限公司 | A kind of 3D curved surfaces mobile phone glass cover board hot bending graphite jig |
| CN109435209A (en) * | 2018-10-18 | 2019-03-08 | 信利光电股份有限公司 | A kind of 3D cover board processing method and 3D cover board |
| CN109516680A (en) * | 2018-12-27 | 2019-03-26 | 信利光电股份有限公司 | A kind of preparation method of the 3D curved surface cover board with three-dimensional pattern |
-
2019
- 2019-07-31 CN CN201910703641.6A patent/CN110342795A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203159434U (en) * | 2012-07-27 | 2013-08-28 | 正达国际光电股份有限公司 | Glass forming die and glass forming device using same |
| US20180086663A1 (en) * | 2016-09-23 | 2018-03-29 | Apple Inc. | Thermoformed cover glass for an electronic device |
| CN207537335U (en) * | 2017-09-19 | 2018-06-26 | 深圳市东方碳素实业有限公司 | A kind of 3D curved surfaces mobile phone glass cover board hot bending graphite jig |
| CN107867793A (en) * | 2017-10-31 | 2018-04-03 | 广东欧珀移动通信有限公司 | Bend glass cover plate, the preparation method of bend glass cover plate and mobile terminal |
| CN109435209A (en) * | 2018-10-18 | 2019-03-08 | 信利光电股份有限公司 | A kind of 3D cover board processing method and 3D cover board |
| CN109516680A (en) * | 2018-12-27 | 2019-03-26 | 信利光电股份有限公司 | A kind of preparation method of the 3D curved surface cover board with three-dimensional pattern |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111787143A (en) * | 2020-06-30 | 2020-10-16 | 萍乡伊博智能科技有限公司 | Method for processing rear cover plate of glass mobile phone |
| CN113977357A (en) * | 2020-12-31 | 2022-01-28 | 安徽金龙浩光电科技有限公司 | LOGO area polishing method for 3D glass graphite mold |
| CN113977357B (en) * | 2020-12-31 | 2024-04-02 | 安徽金龙浩光电科技有限公司 | LOGO region polishing method for 3D glass graphite mold |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110342795A (en) | Hot bending die, cover board and preparation method thereof and mobile communication equipment | |
| CN108070104A (en) | The processing technology for the plastic casing for dodging grain effect is dazzled with solid | |
| KR102418445B1 (en) | How to form stainless steel parts | |
| US20130049557A1 (en) | Device housing and method for making the device housing | |
| CN107949203A (en) | Preparation method, housing and the electronic equipment of housing | |
| CN110460701A (en) | Cover board and preparation method thereof and mobile communication equipment | |
| TW201318520A (en) | Decorative housing and method for making same | |
| US20080248290A1 (en) | Method for surface treatment of shells | |
| CN109803508B (en) | Shell of electronic equipment, preparation method of shell and electronic equipment | |
| CN102336023A (en) | Surface treatment process for plastic product | |
| US20110250400A1 (en) | Method of fabricating injection-molded product | |
| EP3399852A1 (en) | Aluminum alloy housing and preparation method therefor | |
| CN110406007A (en) | A kind of preparation method of curved optic plastics ear casing | |
| CN101712193B (en) | In-mold decorative method | |
| CN102991255A (en) | Three-dimensional color glass making process | |
| CN109421422A (en) | Space pattern forming method and its product | |
| CN109913913A (en) | A kind of entity gold goods of furniture for display rather than for use and its electrocasting method | |
| CN206004723U (en) | A kind of stainless steel carbon fibre composite mobile phone framework | |
| KR101281833B1 (en) | Insert mold transcription film with lusterless hair-line pattern and method for fabricating the same | |
| CN102975559B (en) | Printing-free frosted hardened film for in-mold decoration | |
| KR101387612B1 (en) | Buckle for belt and manufacturing method thereof | |
| US20100279031A1 (en) | Seashell Decoration and Its Processing | |
| JP2011230404A (en) | Surface decorative article, and method of decorating surface | |
| KR101864283B1 (en) | Brush Handle and Method for Manufacturing Same | |
| JP2012237973A (en) | Resin-made spectacle frame and method for manufacturing parts thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191018 |