TW201318520A - Decorative housing and method for making same - Google Patents
Decorative housing and method for making same Download PDFInfo
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- TW201318520A TW201318520A TW100140802A TW100140802A TW201318520A TW 201318520 A TW201318520 A TW 201318520A TW 100140802 A TW100140802 A TW 100140802A TW 100140802 A TW100140802 A TW 100140802A TW 201318520 A TW201318520 A TW 201318520A
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- ceramic coating
- electronic device
- metal substrate
- device casing
- pattern
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- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000005524 ceramic coating Methods 0.000 claims abstract description 91
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000011247 coating layer Substances 0.000 claims description 31
- 238000007751 thermal spraying Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000003486 chemical etching Methods 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 230000003746 surface roughness Effects 0.000 claims description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 5
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 4
- 238000010285 flame spraying Methods 0.000 claims description 3
- -1 triiron tetroxide Chemical compound 0.000 claims description 3
- 238000005488 sandblasting Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims 3
- LNSPFAOULBTYBI-UHFFFAOYSA-N [O].C#C Chemical group [O].C#C LNSPFAOULBTYBI-UHFFFAOYSA-N 0.000 claims 1
- 239000003086 colorant Substances 0.000 abstract description 6
- 239000007921 spray Substances 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005422 blasting Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- QFXZANXYUCUTQH-UHFFFAOYSA-N ethynol Chemical group OC#C QFXZANXYUCUTQH-UHFFFAOYSA-N 0.000 description 2
- 230000005923 long-lasting effect Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
- C23C4/11—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/18—After-treatment
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49982—Coating
- Y10T29/49986—Subsequent to metal working
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
- Y10T428/1317—Multilayer [continuous layer]
Abstract
Description
本發明涉及一種電子裝置外殼，尤其涉及一種表面具有陶瓷塗層的電子裝置外殼及其製作方法。The invention relates to an electronic device casing, in particular to an electronic device casing with a ceramic coating on the surface and a manufacturing method thereof.
無線通信與資訊處理技術的迅速發展，移動電話、個人數碼助理（personal digital assistant, PDA）等可攜式電子裝置競相湧現，令消費者可隨時隨地充分享受高科技帶來的種種便利。該等可攜式電子裝置除了在功能上更新、擴充之外，隨著流行、使用者的愛好，亦不斷於外觀上、造型上推陳出新。With the rapid development of wireless communication and information processing technology, portable electronic devices such as mobile phones and personal digital assistants (PDAs) are competing to emerge, enabling consumers to fully enjoy the convenience brought by high technology whenever and wherever possible. In addition to functional updates and expansions, these portable electronic devices continue to evolve in appearance and style with the popularity and user hobbies.
目前的可攜式電子裝置外殼主要有兩類，其一金屬殼體，其色彩較為單一，即使於其表面形成烤漆層、電鍍層等保護或裝飾性塗層，也常因使用時不當的碰撞而產生掉皮的現象，使外觀不再美觀亮眼；另一類為塑膠殼體，雖然色彩較多，但由於材料硬度不夠，故在使用過程中容易使殼體的表面產生刮痕，破壞原有的美觀。At present, there are mainly two types of portable electronic device casings, one of which has a single color, and even if a protective layer or a decorative coating such as a baking layer or a plating layer is formed on the surface thereof, it is often caused by improper collision. The phenomenon of peeling off makes the appearance no longer beautiful and bright; the other type is plastic shell, although the color is more, but due to the insufficient hardness of the material, it is easy to cause scratches on the surface of the shell during use, destroying the original Some are beautiful.
有鑒於此，有必要提供一種強度較好、耐刮傷的電子裝置外殼。In view of this, it is necessary to provide an electronic device casing with better strength and scratch resistance.
另外，還有必要提供一種上述電子裝置外殼的製作方法。In addition, it is also necessary to provide a method of fabricating the above-described electronic device housing.
一種電子裝置外殼，包括一金屬基體，該電子裝置外殼還包括形成於該金屬基體表面的第一陶瓷塗層及第二陶瓷塗層，金屬基體包括一第一表面，第一表面上形成有若干凹部及形成於凹部之間的凸部，所述凹部包括若干第一圖案區和若干第二圖案區，該第一陶瓷塗層覆蓋所述第一圖案區，該第二陶瓷塗層覆蓋所述第二圖案區，第一陶瓷塗層與第二陶瓷塗層具有不同的顏色。An electronic device housing comprising a metal substrate, the electronic device housing further comprising a first ceramic coating layer and a second ceramic coating layer formed on the surface of the metal substrate, the metal substrate comprising a first surface, the first surface being formed with a plurality of a concave portion and a convex portion formed between the concave portion, the concave portion including a plurality of first pattern regions and a plurality of second pattern regions, the first ceramic coating covering the first pattern region, the second ceramic coating covering the In the second pattern region, the first ceramic coating and the second ceramic coating have different colors.
一種電子裝置外殼的製作方法，其包括如下步驟：A method of manufacturing an electronic device housing, comprising the steps of:
提供一金屬基體，該金屬基體包括一第一表面及與該第一表面相反的第二表面；Providing a metal substrate, the metal substrate comprising a first surface and a second surface opposite the first surface;
對第一表面的局部區域進行化學蝕刻處理，使被蝕刻區域形成凹部，未被蝕刻區域形成凸部；Performing a chemical etching treatment on a partial region of the first surface to form a recessed portion in the etched region, and forming a convex portion in the unetched region;
對金屬基體進行第一次熱噴塗處理，以於該第一表面形成一第一陶瓷塗層，該第一陶瓷塗層覆蓋所述凹部的部分區域；Performing a first thermal spraying treatment on the metal substrate to form a first ceramic coating on the first surface, the first ceramic coating covering a partial region of the recess;
對金屬基體進行第二次熱噴塗處理，以在該金屬基體上形成一第二陶瓷塗層，該第二陶瓷塗層覆蓋所述第一陶瓷塗層、所述凸部以及所述凹部未被第一陶瓷塗層覆蓋的區域，該第二陶瓷塗層與第一陶瓷塗層具有不同的顏色；Performing a second thermal spraying treatment on the metal substrate to form a second ceramic coating on the metal substrate, the second ceramic coating covering the first ceramic coating, the protrusions, and the recesses are not a region covered by the first ceramic coating, the second ceramic coating having a different color than the first ceramic coating;
對經第二次熱噴塗處理後的金屬基體進行打磨拋光，使所述第一陶瓷塗層及所述凸部露出於該第二陶瓷塗層。The metal substrate after the second thermal spraying treatment is polished and polished to expose the first ceramic coating layer and the convex portion to the second ceramic coating layer.
上述電子裝置外殼於其金屬基體的表面形成凹部，在凹部的不同區域噴塗不同顏色的陶瓷塗層，所述陶瓷塗層與金屬基體結合牢固。藉由陶瓷塗層優異的耐磨耗性，高硬度，高表面緻密性以克服傳統塑膠或金屬材質的缺陷，使該外殼具有高耐磨損、耐刮擦、可持久保持外觀亮麗的優點，同時，還可於外殼表面形成別致的圖案，具有較佳的裝飾效果。The electronic device casing forms a concave portion on the surface of the metal substrate, and sprays different color ceramic coatings on different regions of the concave portion, and the ceramic coating is firmly bonded to the metal substrate. The ceramic coating has excellent wear resistance, high hardness and high surface compactness to overcome the defects of traditional plastic or metal materials, so that the outer casing has the advantages of high wear resistance, scratch resistance and long-lasting appearance. At the same time, a chic pattern can be formed on the surface of the outer casing, which has a better decorative effect.
請參閱圖1，本發明第一實施例的電子裝置外殼10，其包括一金屬基體12及形成於該金屬基體12表面的第一陶瓷塗層14和第二陶瓷塗層16。Referring to FIG. 1, an electronic device housing 10 according to a first embodiment of the present invention includes a metal substrate 12 and a first ceramic coating layer 14 and a second ceramic coating layer 16 formed on the surface of the metal substrate 12.
請參閱圖2及圖3，金屬基體12可由不銹鋼、鋁合金等金屬製成，其厚度大約為0.4~0.6mm，本實施例為0.5mm。金屬基體12包括一第一表面122及與該第一表面122相反的第二表面124。第一表面122上形成有若干凹部125及形成於凹部125之間的凸部126。所述凹部125的表面低於所述凸部126的表面。所述凹部125的表面為粗糙面，其表面粗糙度Ra大約為1.3~2.0μm。所述凹部125包括若干第一圖案區1251和若干第二圖案區1253。較佳地，所述第一圖案區1251與第二圖案區1253交錯排布。所述凸部126可以為相互間隔地設置，也可為連續設置。所述凸部126的組合可形成一圖案。較佳地，所述凹部125與所述凸部126交錯形成。Referring to FIGS. 2 and 3, the metal base 12 may be made of a metal such as stainless steel or aluminum alloy, and has a thickness of about 0.4 to 0.6 mm, which is 0.5 mm in this embodiment. The metal substrate 12 includes a first surface 122 and a second surface 124 opposite the first surface 122. The first surface 122 is formed with a plurality of recesses 125 and protrusions 126 formed between the recesses 125. The surface of the recess 125 is lower than the surface of the protrusion 126. The surface of the concave portion 125 is a rough surface and has a surface roughness Ra of about 1.3 to 2.0 μm. The recess 125 includes a plurality of first pattern regions 1251 and a plurality of second pattern regions 1253. Preferably, the first pattern area 1251 and the second pattern area 1253 are staggered. The convex portions 126 may be disposed at intervals from each other or may be continuously disposed. The combination of the protrusions 126 can form a pattern. Preferably, the concave portion 125 is formed in a staggered manner with the convex portion 126.
請一併參閱圖3，所述第一陶瓷塗層14覆蓋所述第一圖案區1251，所述第二陶瓷塗層16覆蓋所述第二圖案區1253。第一陶瓷塗層14與第二陶瓷塗層16具有不同的顏色，由此於金屬基體12表面形成所需的圖案。該第一陶瓷塗層14、第二陶瓷塗層16與所述凸部126共同構成電子裝置外殼10的外表面。較佳地，該第一陶瓷塗層14、第二陶瓷塗層16與所述凸部126齊平。該第一陶瓷塗層14及第二陶瓷塗層16分別由三氧化二鋁（Al2O3）、四氧化三鐵(Fe3O4)、氧化鈦(TiO2)等氧化物陶瓷材料中的一種組成，其厚度大約為0.1~0.12mm（即所述凹部125的深度），表面粗糙度為0.1~0.3μm。因上述陶瓷材料自身具有顏色，可以根據顏色的需要分別選擇第一陶瓷塗層14與第二陶瓷塗層16的陶瓷材料，比如，用三氧化二鋁製得的陶瓷塗層為白色，用四氧化三鐵製得的陶瓷塗層為黑色，而用氧化鈦製得的陶瓷塗層則為深藍色。Referring to FIG. 3 together, the first ceramic coating 14 covers the first pattern region 1251, and the second ceramic coating layer 16 covers the second pattern region 1253. The first ceramic coating 14 and the second ceramic coating 16 have different colors, thereby forming a desired pattern on the surface of the metal substrate 12. The first ceramic coating layer 14 and the second ceramic coating layer 16 together with the convex portion 126 constitute an outer surface of the electronic device housing 10. Preferably, the first ceramic coating layer 14 and the second ceramic coating layer 16 are flush with the convex portion 126. The first ceramic coating layer 14 and the second ceramic coating layer 16 are respectively made of an oxide ceramic material such as aluminum oxide (Al 2 O 3 ), triiron tetroxide (Fe 3 O 4 ) or titanium oxide (TiO 2 ). A composition having a thickness of about 0.1 to 0.12 mm (i.e., a depth of the concave portion 125) and a surface roughness of 0.1 to 0.3 μm. Since the ceramic material itself has a color, the ceramic material of the first ceramic coating layer 14 and the second ceramic coating layer 16 can be respectively selected according to the color requirement. For example, the ceramic coating layer made of aluminum oxide is white, and four The ceramic coating made of triiron oxide is black, while the ceramic coating made of titanium oxide is dark blue.
上述電子裝置外殼10的製作方法包括以下步驟：The manufacturing method of the electronic device casing 10 includes the following steps:
首先，提供一金屬基體12，其包括該第一表面122及與該第一表面122相反的該第二表面124。First, a metal substrate 12 is provided that includes the first surface 122 and the second surface 124 opposite the first surface 122.
對第一表面122預設的局部區域進行蝕刻處理，使被蝕刻區域的表面低於未被蝕刻區域表面形成凹部125，未被蝕刻區域形成凸部126。該蝕刻處理可以採用化學蝕刻或鐳射蝕刻等方法，本實施例採用化學蝕刻方法，具體可為：首先用油墨對金屬基體12進行遮蔽處理，使不需要蝕刻的表面被遮蔽，而第一表面122需要蝕刻的區域曝露出來；然後將金屬基體12浸置於化學蝕刻液中進行蝕刻處理，使第一表面122被蝕刻區域（即凹部125）低於未被蝕刻區域（即凸部126），然後去除油墨。所述蝕刻深度大約為0.1~0.12mm。The partial region preset by the first surface 122 is etched such that the surface of the etched region is lower than the surface of the unetched region to form the recess 125, and the portion not etched to form the protrusion 126. The etching process may be performed by a chemical etching method or a laser etching method. In this embodiment, a chemical etching method is used. Specifically, the metal substrate 12 is first shielded by ink so that the surface not requiring etching is shielded, and the first surface 122 is shielded. The area to be etched is exposed; then the metal substrate 12 is immersed in a chemical etching solution for etching treatment, so that the first surface 122 is etched (ie, the recess 125) is lower than the unetched area (ie, the convex portion 126), and then Remove the ink. The etching depth is approximately 0.1 to 0.12 mm.
對整個第一表面122進行噴砂處理，第一表面122獲得較大的表面粗糙度。噴砂處理後，第一表面122的粗糙度（Ra）為1.3~2.0μm。噴砂處理增大了金屬基體12的表面粗糙度，可提高後續熱噴塗形成的第一陶瓷塗層14及第二陶瓷塗層16與金屬基體12的結合力。The entire first surface 122 is sandblasted, and the first surface 122 achieves a large surface roughness. After the blasting treatment, the roughness (Ra) of the first surface 122 is 1.3 to 2.0 μm. The blasting treatment increases the surface roughness of the metal substrate 12, and the bonding force between the first ceramic coating layer 14 and the second ceramic coating layer 16 formed by the subsequent thermal spraying and the metal substrate 12 can be improved.
請參閱圖4，使用一遮蔽治具20對第一表面122進行遮蔽，該遮蔽治具20上形成有若干通孔22，所述通孔22組合形成一預設的鏤空的圖案24，該鏤空的圖案24與所述凹部125的局部區域相對應，使所述凹部125的局部區域露出於該遮蔽治具20，得到該第一圖案區1251。第一表面122的其他區域被遮蔽治具20所遮蔽。Referring to FIG. 4, the first surface 122 is shielded by using a shielding fixture 20. The shielding fixture 20 is formed with a plurality of through holes 22, and the through holes 22 are combined to form a predetermined hollow pattern 24, which is hollowed out. The pattern 24 corresponds to a partial area of the recess 125, and a partial area of the recess 125 is exposed to the shielding jig 20 to obtain the first pattern area 1251. Other areas of the first surface 122 are obscured by the shadowing fixture 20.
對經遮蔽治具20遮蔽的第一表面122進行第一次熱噴塗處理，以在所述鏤空的圖案24對應的第一圖案區1251形成該第一陶瓷塗層14，該步驟最好在噴砂處理完成後4小時內進行。該第一次熱噴塗處理可採用以氧-乙炔為燃氣、空氣為送料氣的火焰噴塗法。噴塗材料可選自三氧化二鋁、四氧化三鐵、氧化鈦等氧化物陶瓷材料中的一種。第一陶瓷塗層14的厚度大約為0.12~0.14mm，大於所述蝕刻深度，便於後續的打磨拋光處理。本實施例第一次熱噴塗處理的噴塗材料為四氧化三鐵。The first surface 122 shielded by the masking fixture 20 is subjected to a first thermal spraying process to form the first ceramic coating layer 14 in the first pattern region 1251 corresponding to the hollowed pattern 24, preferably in a sandblasting process. The treatment is carried out within 4 hours after the completion of the treatment. The first thermal spraying treatment may be a flame spraying method using oxy-acetylene as a gas and air as a feed gas. The spray material may be selected from one of oxide ceramic materials such as aluminum oxide, triiron tetroxide, and titanium oxide. The first ceramic coating 14 has a thickness of about 0.12 to 0.14 mm, which is greater than the etching depth, and is convenient for subsequent polishing and polishing. The spray material of the first thermal spray treatment of this embodiment is triiron tetroxide.
去掉所述遮蔽治具20，對金屬基體12進行第二次熱噴塗處理，以在該金屬基體12上形成一第二陶瓷塗層16。該第二陶瓷塗層16覆蓋所述凹部125除第一圖案區1251之外的區域（即第二圖案區1253）、第一陶瓷塗層14及所述凸部126。該第二次熱噴塗處理可採用以氧-乙炔為燃氣、空氣為送料氣的火焰噴塗法。第二次熱噴塗處理的噴塗材料可選自三氧化二鋁、四氧化三鐵、氧化鈦等氧化物陶瓷材料中的一種，且第二次熱噴塗處理所用噴塗材料不同於第一熱噴塗處理所用噴塗材料，以使第一陶瓷塗層14與第二陶瓷塗層16具有不同的顏色。該第二陶瓷塗層16的厚度大約為0.12~0.14mm。本實施例第二次熱噴塗處理的噴塗材料為氧化鈦。The masking fixture 20 is removed and a second thermal spray treatment is applied to the metal substrate 12 to form a second ceramic coating 16 on the metal substrate 12. The second ceramic coating 16 covers a region of the recess 125 other than the first pattern region 1251 (ie, the second pattern region 1253), the first ceramic coating layer 14, and the protrusion portion 126. The second thermal spraying treatment may be a flame spraying method using oxy-acetylene as a gas and air as a feed gas. The spray material of the second thermal spray treatment may be selected from one of oxide ceramic materials such as aluminum oxide, triiron tetroxide, and titanium oxide, and the spray material used in the second thermal spray treatment is different from the first thermal spray treatment. The spray material is used such that the first ceramic coating 14 and the second ceramic coating 16 have different colors. The thickness of the second ceramic coating 16 is approximately 0.12 to 0.14 mm. The spray material of the second thermal spray treatment of this embodiment is titanium oxide.
之後，對經第二次熱噴塗處理後的金屬基體12進行打磨拋光，直至表面光亮，且使第一陶瓷塗層14及凸部126露出於第二陶瓷塗層16，由此使該電子裝置外殼10表面由金屬和陶瓷兩種不同的材料構成，同時，所述第一陶瓷塗層14與第二陶瓷塗層16具有不同的顏色，使第一陶瓷塗層14、第二陶瓷塗層16及金屬的凸部126共同在金屬基體12上形成華麗的圖紋疊加效果。經打磨拋光後，第一陶瓷塗層14與第二陶瓷塗層16厚度大約為0.1~0.12mm，表面粗糙度為0.1~0.3μm。Thereafter, the metal substrate 12 after the second thermal spraying treatment is polished and polished until the surface is bright, and the first ceramic coating layer 14 and the convex portion 126 are exposed to the second ceramic coating layer 16, thereby making the electronic device The surface of the outer casing 10 is composed of two different materials of metal and ceramic, and at the same time, the first ceramic coating 14 and the second ceramic coating 16 have different colors, so that the first ceramic coating 14 and the second ceramic coating 16 are The metal protrusions 126 together form a gorgeous pattern superposition effect on the metal substrate 12. After being polished and polished, the first ceramic coating layer 14 and the second ceramic coating layer 16 have a thickness of about 0.1 to 0.12 mm and a surface roughness of 0.1 to 0.3 μm.
上述實施例的電子裝置外殼於其金屬基體12的表面形成凹部125，在凹部125的不同區域噴塗不同顏色的陶瓷塗層，所述陶瓷塗層與金屬基體12結合牢固。藉由陶瓷塗層優異的耐磨耗性，高硬度，高表面緻密性以克服傳統塑膠或金屬材質的缺陷，使該外殼具有高耐磨損、耐刮擦、可持久保持外觀亮麗的優點，同時，還可於外殼表面形成別致的圖案，具有較佳的裝飾效果。The electronic device casing of the above embodiment forms a recess 125 on the surface of the metal substrate 12, and different ceramic coatings of different colors are sprayed on different regions of the recess 125, and the ceramic coating is firmly bonded to the metal substrate 12. The ceramic coating has excellent wear resistance, high hardness and high surface compactness to overcome the defects of traditional plastic or metal materials, so that the outer casing has the advantages of high wear resistance, scratch resistance and long-lasting appearance. At the same time, a chic pattern can be formed on the surface of the outer casing, which has a better decorative effect.
10．．．電子裝置外殼10. . . Electronic device housing
12．．．金屬基體12. . . Metal substrate
122．．．第一表面122. . . First surface
124．．．第二表面124. . . Second surface
125．．．凹部125. . . Concave
1251．．．第一圖案區1251. . . First pattern area
1253．．．第二圖案區1253. . . Second pattern area
126．．．凸部126. . . Convex
14．．．第一陶瓷塗層14. . . First ceramic coating
16．．．第二陶瓷塗層16. . . Second ceramic coating
20．．．遮蔽治具20. . . Shadowing fixture
22．．．通孔twenty two. . . Through hole
24．．．鏤空的圖案twenty four. . . Hollow pattern
圖1係本發明較佳實施例電子裝置外殼的平面示意圖。1 is a schematic plan view showing an outer casing of an electronic device according to a preferred embodiment of the present invention.
圖2係圖1沿II-II的剖視示意圖。Figure 2 is a cross-sectional view taken along line II-II of Figure 1.
圖3係本發明較佳施例電子裝置外殼的金屬基體的剖視示意圖。3 is a cross-sectional view showing the metal substrate of the electronic device casing of the preferred embodiment of the present invention.
圖4係本發明較佳施例電子裝置外殼的製作方法中所使用的遮蔽治具的平面示意圖。4 is a schematic plan view of a shielding jig used in a method of fabricating an electronic device casing according to a preferred embodiment of the present invention.
10．．．電子裝置外殼10. . . Electronic device housing
12．．．金屬基體12. . . Metal substrate
122．．．第一表面122. . . First surface
124．．．第二表面124. . . Second surface
1251．．．第一圖案區1251. . . First pattern area
1253．．．第二圖案區1253. . . Second pattern area
126．．．凸部126. . . Convex
14．．．第一陶瓷層14. . . First ceramic layer
16．．．第二陶瓷層16. . . Second ceramic layer
Claims (14)
提供一金屬基體，該金屬基體包括一第一表面；
對第一表面的局部區域進行化學蝕刻處理，使被蝕刻區域形成凹部，未被蝕刻區域形成凸部；
對金屬基體進行第一次熱噴塗處理，以於該第一表面形成一第一陶瓷塗層，該第一陶瓷塗層覆蓋所述凹部的部分區域；
對金屬基體進行第二次熱噴塗處理，以在該金屬基體上形成一第二陶瓷塗層，該第二陶瓷塗層覆蓋所述第一陶瓷塗層、所述凸部以及所述凹部未被第一陶瓷塗層覆蓋的區域，該第二陶瓷塗層與第一陶瓷塗層具有不同的顏色；
對經第二次熱噴塗處理後的金屬基體進行打磨拋光，使所述第一陶瓷塗層及所述凸部露出於該第二陶瓷塗層。A method of manufacturing an electronic device housing, comprising the steps of:
Providing a metal substrate, the metal substrate comprising a first surface;
Performing a chemical etching treatment on a partial region of the first surface to form a recessed portion in the etched region, and forming a convex portion in the unetched region;
Performing a first thermal spraying treatment on the metal substrate to form a first ceramic coating on the first surface, the first ceramic coating covering a partial region of the recess;
Performing a second thermal spraying treatment on the metal substrate to form a second ceramic coating on the metal substrate, the second ceramic coating covering the first ceramic coating, the protrusions, and the recesses are not a region covered by the first ceramic coating, the second ceramic coating having a different color than the first ceramic coating;
The metal substrate after the second thermal spraying treatment is polished and polished to expose the first ceramic coating layer and the convex portion to the second ceramic coating layer.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103372074A CN103096650A (en) | 2011-10-31 | 2011-10-31 | Electronic device shell and manufacture method thereof |
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| TW201318520A true TW201318520A (en) | 2013-05-01 |
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| TW100140802A TW201318520A (en) | 2011-10-31 | 2011-11-08 | Decorative housing and method for making same |
Country Status (4)
| Country | Link |
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| US (1) | US20130108813A1 (en) |
| JP (1) | JP5619845B2 (en) |
| CN (1) | CN103096650A (en) |
| TW (1) | TW201318520A (en) |
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| KR102128391B1 (en) * | 2013-10-30 | 2020-06-30 | 삼성전자 주식회사 | Case including metal and electronic device having the same |
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| CN106358408B (en) * | 2015-07-15 | 2019-06-21 | 比亚迪股份有限公司 | A kind of communication apparatus metal shell and preparation method thereof |
| US11104616B2 (en) | 2015-09-30 | 2021-08-31 | Apple Inc. | Ceramic having a residual compressive stress for use in electronic devices |
| KR101775004B1 (en) * | 2015-12-14 | 2017-09-12 | 엘지전자 주식회사 | Mobile terminal and method for manufacturing it |
| US11604514B2 (en) | 2016-04-14 | 2023-03-14 | Apple Inc. | Substrate having a visually imperceptible texture for providing variable coefficients of friction between objects |
| CN106271406B (en) * | 2016-08-15 | 2018-01-19 | 广东欧珀移动通信有限公司 | A kind of processing method of housing, housing and mobile terminal |
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| US10927473B2 (en) * | 2016-09-22 | 2021-02-23 | Apple Inc. | Oxide coatings for metal surfaces |
| JP7054890B2 (en) | 2017-02-14 | 2022-04-15 | 徳武産業株式会社 | Shoe sole member and room shoes with it |
| CN108527622A (en) * | 2017-03-02 | 2018-09-14 | 北京小米移动软件有限公司 | shell and preparation method thereof |
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- 2011-11-08 TW TW100140802A patent/TW201318520A/en unknown
-
2012
- 2012-04-25 US US13/455,820 patent/US20130108813A1/en not_active Abandoned
- 2012-10-15 JP JP2012227752A patent/JP5619845B2/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN103096650A (en) | 2013-05-08 |
| JP2013094667A (en) | 2013-05-20 |
| JP5619845B2 (en) | 2014-11-05 |
| US20130108813A1 (en) | 2013-05-02 |
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