CN109435209A - A kind of 3D cover board processing method and 3D cover board - Google Patents
A kind of 3D cover board processing method and 3D cover board Download PDFInfo
- Publication number
- CN109435209A CN109435209A CN201811215976.5A CN201811215976A CN109435209A CN 109435209 A CN109435209 A CN 109435209A CN 201811215976 A CN201811215976 A CN 201811215976A CN 109435209 A CN109435209 A CN 109435209A
- Authority
- CN
- China
- Prior art keywords
- cover board
- processing method
- decorative pattern
- hot bending
- bending die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/02—Stamping using rigid devices or tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
Abstract
The embodiment of the invention discloses a kind of 3D cover board processing method and 3D cover board, solves not three-dimensional enough, the more stiff problem of 3D cover board decorative pattern that existing 3D cover board processing method processes.3D cover board processing method of the invention includes: that will form 3D hot bending die surface of internal cavity to process the corresponding embossing device for presetting decorative pattern；Machined material soften and is placed in 3D hot bending die inner cavity and is processed to obtain the 3D cover board with default decorative pattern.
Description
Technical field
The present invention relates to field of material processing more particularly to a kind of 3D cover board processing method and 3D cover boards.
Background technique
Currently, with the development of science and technology requirement of the people to material life is higher and higher.With electronics such as mobile phone, IPAD
Product is popularized, higher and higher to the surface characteristic requirement of 3D cover board used on touch panel, and product is constantly to diversification
Development.
The processing method of traditional 3D cover board is generally cold worked, but the method being cold worked processes 3D product, by beating
It grinds equipment and two-dimensional surface material is polished into 3D cover board, it is not three-dimensional enough to result in the 3D cover board decorative pattern processed, more stiff
Problem.
Summary of the invention
The embodiment of the invention provides a kind of 3D cover board processing methods and 3D cover board to solve existing 3D cover board processing side
Not three-dimensional enough, the more stiff problem of the 3D cover board decorative pattern that formula processes.
A kind of 3D cover board processing method provided in an embodiment of the present invention includes:
S1: 3D hot bending die surface of internal cavity will be formed and process the corresponding embossing device for presetting decorative pattern；
S2: machined material, which soften, to be placed in 3D hot bending die inner cavity and processed to obtain has in advance
If the 3D cover board of decorative pattern.
Optionally, the machined material in the step S2 includes glass, plastic cement and metal material.
A kind of 3D cover board provided in an embodiment of the present invention, comprising:
Decorative pattern is provided on the 3D cover board.
As can be seen from the above technical solutions, the embodiment of the present invention has the advantage that
A kind of 3D cover board processing method provided in an embodiment of the present invention and 3D cover board, wherein 3D cover board processing method includes:
3D hot bending die surface of internal cavity will be formed and process the corresponding embossing device for presetting decorative pattern；Machined material is subjected to softening juxtaposition
In 3D hot bending die inner cavity and processed to obtain the 3D cover board with default decorative pattern.
In the present embodiment, by the way that 3D hot bending die inner surface to be processed to the embossing device of default decorative pattern and by rapidoprint
It is placed into inside 3D hot bending die and is integrally formed, solve the 3D cover board decorative pattern that existing 3D cover board processing method processes
Not three-dimensional enough, more stiff problem.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of 3D cover board processing method flow diagram provided in an embodiment of the present invention；
Fig. 2 is the molding 3D hot bending die and 3D cover board knot in a kind of 3D cover board processing method provided in an embodiment of the present invention
Structure schematic diagram；
Wherein, appended drawing reference are as follows:
1,3D hot bending die 2,3D cover board are formed.
Specific embodiment
The embodiment of the invention provides a kind of 3D cover board processing method and 3D cover boards, solve existing 3D cover board processing side
Not three-dimensional enough, the more stiff problem of the 3D cover board decorative pattern that formula processes.
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
Those of ordinary skill's all other embodiment obtained without making creative work, belongs to protection of the present invention
Range.
Referring to Fig. 1, being that a kind of one embodiment of 3D cover board processing method provided in an embodiment of the present invention includes:
101,3D hot bending die surface of internal cavity will be formed and processes the corresponding embossing device for presetting decorative pattern；
It should be noted that the effect of decorative patterns that the embossing device generates is different from existing patterned etch, can accomplish same
Many different depths are made on cover board, truly accomplish stereoscopic effect.
102, machined material soften being placed in 3D hot bending die inner cavity and being processed to obtain to have and be preset
The 3D cover board of decorative pattern.
It should be noted that, by heating, after glass or metal softening, applying to upper mold certain in 3D hot bending
Pressure, be 3D cover board and decorative pattern one-pass molding.And this kind of decorative pattern production can be produced on any of cover board regardless of front and back sides
One position (front, the back side, side), is not limited by cover board spatial form, can accomplish 360 ° of decorative pattern production without dead angle.
Further, machined material includes glass, plastic cement and metal material.
Referring to Fig. 2, being a kind of 3D cover board for being provided with decorative pattern provided in an embodiment of the present invention and this 3D cover board of production
Mold.
In the present embodiment, by the way that 3D hot bending die inner surface to be processed to the embossing device of default decorative pattern and by rapidoprint
It is placed into inside 3D hot bending die and is integrally formed, solve the 3D cover board decorative pattern that existing 3D cover board processing method processes
Not three-dimensional enough, more stiff problem.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (3)
1. a kind of 3D cover board processing method characterized by comprising
S1: 3D hot bending die surface of internal cavity will be formed and process the corresponding embossing device for presetting decorative pattern；
S2: machined material, which soften, to be placed in 3D hot bending die inner cavity and processed to obtain has default flower
The 3D cover board of line.
2. a kind of 3D cover board processing method according to claim 1, which is characterized in that
The machined material in the step S2 includes glass, plastic cement and metal material.
3. a kind of 3D cover board, which is characterized in that be provided with decorative pattern on the 3D cover board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811215976.5A CN109435209A (en) | 2018-10-18 | 2018-10-18 | A kind of 3D cover board processing method and 3D cover board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811215976.5A CN109435209A (en) | 2018-10-18 | 2018-10-18 | A kind of 3D cover board processing method and 3D cover board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109435209A true CN109435209A (en) | 2019-03-08 |
Family
ID=65546605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811215976.5A Pending CN109435209A (en) | 2018-10-18 | 2018-10-18 | A kind of 3D cover board processing method and 3D cover board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109435209A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110342795A (en) * | 2019-07-31 | 2019-10-18 | 江西沃格光电股份有限公司 | Hot bending die, cover board and preparation method thereof and mobile communication equipment |
| CN111003929A (en) * | 2019-11-25 | 2020-04-14 | Oppo广东移动通信有限公司 | Hot bending die, shell assembly, electronic device and shell manufacturing method |
| CN116493872A (en) * | 2023-06-12 | 2023-07-28 | 广东省一匠节能科技有限公司 | Metal plate heating softening embossing process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002083397A1 (en) * | 2001-04-17 | 2002-10-24 | Allegheny Solid Surface Technologies | Methods and arrangements for texturing, patterning and bending polymer sheet materials |
| CN106186711A (en) * | 2016-07-05 | 2016-12-07 | 信利光电股份有限公司 | A kind of curved surface figured glass and manufacture method thereof |
| CN107867793A (en) * | 2017-10-31 | 2018-04-03 | 广东欧珀移动通信有限公司 | Bend glass cover plate, the preparation method of bend glass cover plate and mobile terminal |
-
2018
- 2018-10-18 CN CN201811215976.5A patent/CN109435209A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002083397A1 (en) * | 2001-04-17 | 2002-10-24 | Allegheny Solid Surface Technologies | Methods and arrangements for texturing, patterning and bending polymer sheet materials |
| CN106186711A (en) * | 2016-07-05 | 2016-12-07 | 信利光电股份有限公司 | A kind of curved surface figured glass and manufacture method thereof |
| CN107867793A (en) * | 2017-10-31 | 2018-04-03 | 广东欧珀移动通信有限公司 | Bend glass cover plate, the preparation method of bend glass cover plate and mobile terminal |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110342795A (en) * | 2019-07-31 | 2019-10-18 | 江西沃格光电股份有限公司 | Hot bending die, cover board and preparation method thereof and mobile communication equipment |
| CN111003929A (en) * | 2019-11-25 | 2020-04-14 | Oppo广东移动通信有限公司 | Hot bending die, shell assembly, electronic device and shell manufacturing method |
| CN111003929B (en) * | 2019-11-25 | 2022-03-22 | Oppo广东移动通信有限公司 | Hot bending die, shell assembly, electronic device and shell manufacturing method |
| CN116493872A (en) * | 2023-06-12 | 2023-07-28 | 广东省一匠节能科技有限公司 | Metal plate heating softening embossing process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109435209A (en) | A kind of 3D cover board processing method and 3D cover board | |
| KR101030226B1 (en) | Method for manufacturing of multitude curved surface complex plate | |
| CN107056027B (en) | The processing method and electronic equipment of 3D glass product | |
| CN107197063A (en) | A kind of hand-set lid and preparation method thereof and mobile terminal | |
| CN109534663A (en) | A kind of connection with production of structures method of glass cover-plate | |
| CN107508933A (en) | A kind of manufacture method of composite 3D mobile phone backboards | |
| CN101804684A (en) | In-mould decorating injection moulding method and mould | |
| KR101354579B1 (en) | Manufacturing method of decoration glass using jig and uv(ultra violet) molding | |
| CN208776579U (en) | AG glass hot forming tool | |
| CN207362050U (en) | One kind is not susceptible to deformation 3D bend glass cover board hot bending graphite jigs | |
| CN104441358A (en) | Manufacture method of ceramic die blank | |
| CN105712612A (en) | Manufacturing method of 3D glass cover plates | |
| CN101225692A (en) | Metal plate having emboss and processing mould therefor | |
| CN102320215A (en) | Manufacturing method of crystal handicraft product | |
| KR101039438B1 (en) | Method for forming patterns on surface of metal base using laser | |
| CN111116020A (en) | Hot forging forming processing technology for shell with different thicknesses of electronic device | |
| CN106738980A (en) | The technique that a kind of utilization resin or plastic production sight sugar are drawn | |
| CN109761482A (en) | A kind of preparation method of 3D cover board | |
| CN108215234A (en) | Metallo-plastic engaging member and preparation method thereof | |
| CN111116019A (en) | Hot bending processing technology for electronic device shell | |
| CN105835597A (en) | Method for producing embossment elbow-board | |
| CN207357935U (en) | Sheet fabrication frock | |
| CN202683762U (en) | S-shaped bent spring die | |
| CN102454869A (en) | Arc-shaped plate and machining process thereof | |
| CN107225182A (en) | Dimensional piece part processing mold and process forming method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190308 |
|
| RJ01 | Rejection of invention patent application after publication |