CN110340557A - A kind of diffusion connecting mold and diffusion connection method - Google Patents
A kind of diffusion connecting mold and diffusion connection method Download PDFInfo
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- CN110340557A CN110340557A CN201910660566.XA CN201910660566A CN110340557A CN 110340557 A CN110340557 A CN 110340557A CN 201910660566 A CN201910660566 A CN 201910660566A CN 110340557 A CN110340557 A CN 110340557A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/14—Preventing or minimising gas access, or using protective gases or vacuum during welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
- B23K28/02—Combined welding or cutting procedures or apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/16—Arc welding or cutting making use of shielding gas
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/08—Iron or steel
- C23G1/086—Iron or steel solutions containing HF
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/12—Light metals
- C23G1/125—Light metals aluminium
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The present invention relates to a kind of diffusion connecting mold and diffusion connection methods, belong to accurate panel beating technical field, solve the problems, such as that current multi-layer board large area diffusion connection high temperature sagging deflections, welded rate are low and low efficiency.Diffusion connecting mold include upper mold and with the matched lower die of upper mold, upper mold is equipped with the first sealing stalk, air cavity and the air passage for being filled with high-voltage flexible gas to air cavity；Lower die is slab construction, and lower die is equipped with the second sealing stalk and vacuum way.Diffusion connection method is as follows: production multi-layer board large area diffusion connection blank；Connection blank is spread to multi-layer board large area to be surface-treated；Make multi-layer board large area diffusion connection blank interleaving agent pattern；The assembling of multi-layer board large area diffusion connection blank, periphery melting welding and vacuum tube weld to obtain multilayer plate seals；Diffusion connection multilayer plate seals.The present invention can be used for the diffusion connection of multi-layer board large area.
Description
Technical field
The present invention relates to accurate panel beating technical field more particularly to a kind of diffusion connecting mold and diffusion connection sides
Method.
Background technique
It is hollow more that manufacture can be processed in a kind of advanced lightweight manufacturing process of superplastic forming/diffusion connecting process of part
Layer structure, the component of production are widely used to the fields such as aerospace, weaponry.Carrying out part under normal conditions
Multiple-plate diffusion connection is completed before superplastic forming, therefore higher between the intensity requirement of Diffusion Bonding Joint each laminate.
The slab of smaller size is easier to guarantee proliferation welding rate when being diffused connection；And when size of plate blank is larger and diffusion connects
Connect region it is larger when diffusion connection welded rate be difficult to ensure can also there be the problem on deformation such as high temperature is sagging.This can reduce each laminate
Between Diffusion Bonding Joint intensity, not only make superplastic forming process be difficult to carry out, and influence product quality.
Aiming at the problem that large-scale part large area spreads and connects, the prior art mainly uses two methods: first is that rigidity
Diffusion connection, i.e., the multilayer slab that need to spread connection is pressed in centre and provides mold clamping force realization by two flat plate molds at high temperature
The diffusion of part connects.Second is that the multilayer slab that need to spread connection, i.e., be put between upper die and lower die tool by air pressure diffusion connection
And compress, the diffusion connection that high pressure gas realizes part is passed through in the die cavity of upper die and lower die.Face big for large-scale part
Product diffusion connection procedure, existing two kinds of main technique methods have shortcoming: first is that rigid diffusion connection method is to upper mold
It is very high with the coupling surface planarity requirements of lower mold, therefore mold difficulty of processing is big, it is at high cost；Further, since mold processing essence
The problems such as degree or die deformation, is difficult to realize high proliferation welding rate.Though second is that air pressure diffusion connect can guarantee proliferation welding rate,
But plate due to the easy sagging deflections of self gravity, influences the quality and qualification rate of final part at high temperature.
Summary of the invention
In view of above-mentioned analysis, the object of the present invention is to provide a kind of diffusion connecting mold and diffusion connection methods, at least
Be able to solve one of following technical problem: (1) welded rate is low；(2) difficulty of processing of mold is big, at high cost；(3) the sagging change of high temperature
Shape；(4) qualification rate is low.In order to achieve the above object, the present invention is achieved through the following technical solutions:
On the one hand, the present invention provides a kind of diffusion connecting mold, the diffusion connecting mold include upper mold and with it is described
The matched lower die of upper mold, upper mold are equipped with the first sealing stalk, air cavity and the air passage for being filled with high-voltage flexible gas to air cavity；
Lower die is slab construction, and lower die is equipped with the second sealing stalk and vacuum way.
Further, the material of the diffusion connecting mold is stainless steel.
Further, the hardness of the diffusion connecting mold is 35-45HRC.
On the other hand, the present invention also provides a kind of diffusion connection method, the diffusion connection method includes the following steps:
S1, production multi-layer board large area diffusion connection blank；
S2, multi-layer board large area diffusion connection blank is surface-treated；
S3, production multi-layer board large area diffusion connection blank interleaving agent pattern；
S4, the assembling of multi-layer board large area diffusion connection blank, periphery melting welding and vacuum tube weld to obtain multilayer plate seals；
S5, diffusion connection multilayer plate seals；
The quantity of multilayer plate seals is one or more in S5.
Further, in the S1, the size of multiple-plate every laminate is all the same, are as follows:
L1=L2+2W3；W1=W2+2W3；
In formula, L1For the length of every laminate blank, L2For the length of the sealing stalk of lower die, W3For melting welding width, W1It is every layer
The width of plate blank material, W2For the width of the sealing stalk of lower die.
Further, in the S1, production multi-layer board large area diffusion connection blank method be Water Cutting, laser cutting or
Numerical control punching.
Further, in the S2, surface treatment method is chemical pickling or sanding and polishing.
Further, in the S3, make interleaving agent pattern the step of include: according to multi-layer board part model draw blank expand
The line of demarcation for dissipating join domain and non-diffusing join domain sprays interleaving agent on the surface of blank non-diffusing join domain.
Further, in the S5, diffusion connection multilayer plate seals include the following steps:
S51, the multilayer plate seals in S4 are put between upper die and lower die, by the air passage of upper mold, the vacuum of lower die
Air flue, multilayer plate seals vacuum tube be separately connected；
S52, vacuumize process is carried out to the vacuum tube of multilayer plate seals before upper die and lower die molding, then by upper mold
It molds with lower die and persistently the vacuum tube of multilayer plate seals is vacuumized；
S53, kept the temperature after mold be warming up to the diffusion connection temperature of plate, mold clamping force applied to mold, to lower die with
It is persistently vacuumized between multilayer plate seals；Argon gas pressure maintaining 2- after air pressure reaches 2.5-3.5MPa is passed through into upper mold air cavity
3h completes the diffusion connection of multi-layer board large area.
Further, the rate that argon gas is passed through in the S53 is 0.04-0.07MPa/min.
Compared with prior art, the present invention can at least realize one of following beneficial effect:
A) lower die of diffusion connecting mold provided by the invention uses slab construction, can reduce and want to the processing of mold plane
It asks, it is easy to accomplish mold sealing, while the lower die of slab construction is directly contacted with large area diffusion connector, to the big face of multi-layer board
Product diffusion connector is played a supporting role, and can effectively avoid multi-layer board large area diffusion connector at high temperature due to itself weight
Sagging deflections problem caused by power guarantees product quality, improves product qualification rate.
B) diffusion connecting mold provided by the invention uses plate lower die, and is passed through high-voltage flexible to upper mold by air passage
Gas realizes diffusion connection.In this way under the premise of guaranteeing to obtain high diffusivity welded rate, adding for diffusion connecting mold can be reduced
Work difficulty and cost.
C) form and double containment stalk structure that mold provided by the invention is vacuumized using lower die and multi-layer board can be effectively real
Existing part sealing, improves the qualification rate of part.
D) diffusion connection method operating process provided by the invention is simple and easy to do, while one-mold multiple-member may be implemented while expanding
Connection is dissipated, the production cycle is greatly shortened, improves production efficiency.
Other features and advantages of the present invention will illustrate in the following description, also, partial become from specification
It obtains it is clear that understand through the implementation of the invention.The objectives and other advantages of the invention can be by written explanation
Book and attached drawing are achieved and obtained.
Detailed description of the invention
Attached drawing is only used for showing the purpose of specific embodiment, and is not to be construed as limiting the invention, in entire attached drawing
In, identical reference symbol indicates identical component.
Fig. 1 is the diagrammatic cross-section of diffusion connecting mold provided by the invention；
Fig. 2 is that three ply board provided by the invention spreads join domain schematic diagram；
Fig. 3 is the enlarged diagram at A；
Fig. 4 is the mold schematic diagram in comparative example of the invention.
Appended drawing reference:
1- upper mold；2- lower die；The sealing stalk of 3- first；4- air cavity；5- air passage；The sealing stalk of 6- second；7- vacuum way；8-
Spread join domain；9- non-diffusing join domain.
Specific embodiment
Specifically describing the preferred embodiment of the present invention with reference to the accompanying drawing, wherein attached drawing constitutes the application a part, and
Together with embodiments of the present invention for illustrating the principle of the present invention, it is not intended to limit the scope of the present invention.
Embodiment 1
As shown in Figure 1, present embodiments providing a kind of diffusion connecting mold.Diffusion connecting mold include upper mold 1 and with it is upper
The matched lower die 2 of mould, upper mold 1 are equipped with the first sealing stalk 3, air cavity 4 and the ventilation for being filled with high-voltage flexible gas to air cavity
Road 5；Lower die 2 is slab construction, and lower die 2 is equipped with the second sealing stalk 6 and vacuum way 7.
Upper mold has sealing stalk, air cavity and air passage；Lower die is slab construction, has sealing stalk and vacuum way.Upper mold
Air passage be used to be filled with high-voltage flexible gas to air cavity, the vacuum way of lower die for lower die and multi-layer board it is interstitial take out it is true
It is empty.Compared with prior art, lower mould provided by the invention uses slab construction, it is therefore prevented that hangs down at a high temperature of large size plate
Etc. problem on deformation；Vacuum way is arranged in lower die simultaneously, can effectively extract the air between lower die and multi-layer board out, guarantees the flat of part
Face degree；Upper mold can be reduced the requirement to mold plane degree, be both able to achieve high diffusion welding (DW) using the diffusion connection of air cavity air pressure-loading
Conjunction rate, and reduce mold processing cost and difficulty；In addition, the present invention using upper die and lower die there is double containment to obstruct form, energy
Enough guarantee the leakproofness of part.
Specifically, the uniformity in order to guarantee upper mold gas intracavity gas, the position that air passage 5 is connect with air cavity 4 is located at gas
The middle part of chamber 4, the gas being filled in this way from air passage 5 can be rapidly and evenly distributed to inside air cavity, guarantee gas intracavity gas
Uniformity.
Specifically, diffusion connecting mold is for carrying out multiple-plate large area diffusion connection.Preferably, multiple-plate number of plies
N >=2, large area refer to area S >=0.4m2。
Specifically, the material of diffusion connecting mold is stainless steel, preferably 1Cr18Ni9Ti is high using the mold of such material
Warm good in oxidation resistance, heat resistance are high, thermal stability is good；With good growth performance resistant to high temperatures, multiple-plate quality can be ensured
With dimensional accuracy etc., and there is longer service life.
Specifically, the tensile strength of diffusion connecting mold is 500-600MPa, hardness 35-45HRC.
Embodiment 2
A kind of diffusion connection method is present embodiments provided, using the diffusion connecting mold of such as embodiment 1, diffusion connection
Method includes the following steps:
S1, diffusion connecting mold production；
S2, multi-layer board large area diffusion connection blank design and production；
S3, multi-layer board large area diffusion connection blank is surface-treated；
S4, the diffusion connection blank interleaving agent pattern production of multi-layer board large area；
S5, the assembling of multi-layer board large area diffusion connection blank, periphery melting welding and vacuum tube weld to obtain multilayer plate seals；
S6, the diffusion connection of multilayer plate seals, include the following steps:
S61, between the multilayer plate seals in S5 are put in upper die and lower die, by filling for the air passage of upper mold and former
Tracheae is connected, and connection type is ferrule-type compression joint；The vacuum way of lower die is connected with the vacuum-pumping tube of former, is connected
Mode is ferrule-type compression joint；The vacuum tube of multilayer plate seals is connected with the vacuum-pumping tube of former, and connection type is card
Sleeve type pipe joint.
S62, vacuumize process is carried out to the vacuum tube of multilayer plate seals before upper die and lower die molding, specifically takes out three
It is secondary, 1~2min every time；Then upper die and lower die are molded and persistently the vacuum tube of multilayer plate seals is vacuumized, to guarantee
Spreading the vacuum degree inside connection procedure multilayer plate seals is 100-200Pa, and vacuum degree is excessively high to require height to vaccum-pumping equipment,
Energy consumption is high, and cost is big；It is larger that vacuum degree crosses low oxygen content, influences diffusion connection and carries out.
S63, mold is put in former be warming up to multiple-plate diffusion connection temperature after keep the temperature 1-2 hours,
Former applies mold clamping force appropriate (mold clamping force should ensure that diffusion join domain pressure is 15MPa) to mold, under
Carried out between mould and multilayer plate seals it is lasting vacuumize, be passed through high pressure argon gas into upper mold air cavity later, reach to air pressure
Pressure maintaining certain time after 2.5-3.5MPa completes the diffusion connection of multi-layer board large area.
In view of mold materials and part material difference, mold is different with the high temperature linear expansion coefficient of part in S1, if not
Scaling appropriate is carried out to mold, the part completed the process has biggish scale error；Therefore the large area of mold, which is spread, connects
The size for connecing region carries out scaling processing appropriate according to the size of part.
Specifically, the design principle of multi-layer board diffusion connection billet size is more after should ensure that upper die and lower die closure in S2
Four sides of laminate press against the region other than sealing stalk, and the size of multi-layer board every laminate when making is all the same, it is contemplated that multi-layer board
To pass through edge sealing melting welding, so the size of every laminate blank are as follows:
L1=L2+2W3；W1=W2+2W3；
In formula, L1For the length of blank, L2For the length of the sealing stalk of lower die, W3For melting welding width, W1For the width of blank
Degree, W2For the width of the sealing stalk of lower die.
Specifically, the production method of multi-layer board diffusion connection blank can use Water Cutting, laser cutting or numerical control in S2
The method of punching.
Specifically, in S3 multi-layer board diffusion connection blank surface treatment method can be chemical pickling or sanding and polishing,
The purpose of surface treatment is to remove the oxide layer on surface, prevents oxide layer from influencing diffusion quality of connection.Preferably, chemical pickling can
Using the cleaning of the mixed liquor of hydrofluoric acid and nitric acid.
Specifically, the step of interleaving agent pattern makes in S4 includes: to draw multi-layer board diffusion according to multi-layer board part model
The line of demarcation of blank diffusion join domain 8 and non-diffusing join domain 9 is connected, as Figure 2-3；Connection base is spread in multi-layer board
The surface of the non-diffusing join domain 9 of material sprays interleaving agent, and the main component of interleaving agent is BN.
Specifically, in sequence multi-layer board is assembled in S5, periphery melting welding then is carried out to assembled multi-layer board
It is welded with vacuum tube, the purpose of periphery melting welding and vacuum tube welding only stays one to make multiple-plate Inner Constitution confined space
A vacuum tube is communicated with outside, carries out vacuumize process by vacuum tube when being diffused connection, it is ensured that do not have inside multi-layer board
There is air remaining or be in vacuum state, vacuum degree is higher, can more improve diffusion quality of connection and diffusion welding (DW) inside multi-layer board
Conjunction rate.
Specifically, the quantity of multilayer plate seals can be one or more in S61.
Specifically, multilayer plate seals heat up simultaneously with mold in S6, without using first mold is heated up, then by multilayer
The method that plate seals are put into, this is because multilayer plate seals exhaust in vacuum pushed down and can be guaranteed to greatest extent with sealing stalk again
The vacuum degree in portion improves diffusion quality of connection；If placing into sealing element after first mold heats up, high-temperature operation is difficult first,
Secondly inside parts are easier to be oxidized under high temperature.
Specifically, in S63, it is contemplated that the rate for being passed through high pressure argon gas is excessive more demanding to gas tube, poor sealing；
The rate too small high temperature lower residence time is long, and tissue crystal grain is grown up obviously, influences material property, therefore the speed that will be passed through high pressure argon gas
Rate control is 0.04-0.07MPa/min.
Specifically, the dwell time is 2-3 hours in S63.Dwell time, short diffusion connection was insufficient, and welded rate is low；Pressure maintaining
The time long high temperature lower residence time is long, and tissue crystal grain is grown up obviously, influences material property.
Embodiment 3
The large area for present embodiments providing a kind of 5A90 aluminium lithium alloy three ply board part (long 1200mm, wide 400mm) expands
Connection method is dissipated, the present embodiment is using the mold of such as embodiment 1, and this method comprises the following steps:
S1, diffusion connecting mold, large area are made according to 5A90 aluminium lithium alloy three ply board three-dimensional part model size design
It spreads join domain size and amplifies 3.5 ‰ according to part size；
S2,5A90 aluminium lithium alloy three ply board blank design being carried out, the blank size of three plates is 1220mm × 420mm,
Baiting method uses Water Cutting；
S3, plate progress pickled surface processing, removal are opened to 5A90 aluminium lithium alloy three using the mixed liquor of hydrofluoric acid and nitric acid
Surface scale；And the line of demarcation of blank diffusion join domain and non-diffusing join domain is drawn according to three ply board part model,
And in the non-diffusing join domain surface even application BN interleaving agent of three plates, as shown in Figure 2；
S4, the 5A90 aluminium lithium alloy three for spraying BN interleaving agent is opened plate and is assembled, when assembling sprays BN interleaving agent pattern
One side inwardly, prevent the changing of the relative positions with the blue multi-layer board that clamps of card after assembling, 5A90 aluminium carried out by the way of manual argon arc welding
The periphery melting welding of lithium alloy three ply board and vacuum tube weld to obtain three ply board sealing element；
S5, three ply board sealing element is put into mold；By the air passage of upper mold, the vacuum way of lower die, three ply board sealing element
Vacuum tube connected respectively with the pipe of equipment, upper die and lower die molding before the vacuum tube of three ply board sealing element is taken out
It is vacuum-treated, specifically takes out three times, each 1-2min；Upper die and lower die are molded after exhausting vacuum and persistently three ply board is sealed
The vacuum tube of part vacuumizes, to guarantee the vacuum degree inside diffusion connection procedure three ply board sealing element；Mold is put in forming to set
It heats up in standby and with the rate of 2 DEG C/min, when reaching that heat preservation 1 is small after 535-545 DEG C；Former applies mold suitable
When mold clamping force, to carrying out lasting vacuumize between lower die and three ply board sealing element；Later into upper mold air cavity with 0.04MPa/
The rate of min is passed through high pressure argon gas, pressure maintaining 2.5 hours after air pressure reaches 3.0MPa, completes 5A90 aluminium lithium alloy three ply board
Large area diffusion connection.
Specifically, the quantity of three ply board sealing element is 6 in S5, i.e., the present embodiment once carries out 6 part preparations simultaneously
(number 1-6), dwell time, sagging deflections amount, proliferation welding rate and qualified or not result are as shown in table 1 below.
Comparative example 1
Comparative example 1 uses the existing mold preparation 5A90 aluminium lithium alloy three ply board (as shown in Figure 4) for having die cavity up and down
Part prepares 1 part every time, prepares 6 (number D1-D6) altogether；Preparation time, sagging deflections amount, proliferation welding rate and conjunction
Result whether lattice is as shown in table 1 below.
As can be seen from Table 1, the embodiment of the present application 3 prepare 6 part sagging deflections amounts be no more than 0.3mm, lower than pair
The sagging deflections amount (0.4-0.8mm) of ratio；The part qualification rate of the embodiment of the present application is 100%, higher than the qualification of comparative example
Rate 67%, 6 parts of the application carry out simultaneously, dwell time 2.5h, 6 part dwell time 15h of documents, and the application is real
Efficiency is applied to be obviously improved.
The result of table 1 embodiment 1 and comparative example 1
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by anyone skilled in the art,
It should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of diffusion connecting mold, which is characterized in that the diffusion connecting mold includes upper mold (1) and matches with the upper mold
Lower die (2), the upper mold (1) is equipped with the first sealing stalk (3), air cavity (4) and for being filled with high-voltage flexible gas to air cavity
Air passage (5)；The lower die (2) is slab construction, and the lower die (2) is equipped with the second sealing stalk (6) and vacuum way (7).
2. diffusion connecting mold according to claim 1, which is characterized in that the material of the diffusion connecting mold is stainless
Steel.
3. diffusion connecting mold according to claim 1, which is characterized in that the hardness of the diffusion connecting mold is 35-
45HRC。
4. a kind of diffusion connection method, which is characterized in that using diffusion connecting mold described in claim 1-3, the diffusion
Connection method includes the following steps:
S1, production multi-layer board large area diffusion connection blank；
S2, multi-layer board large area diffusion connection blank is surface-treated；
S3, production multi-layer board large area diffusion connection blank interleaving agent pattern；
S4, the assembling of multi-layer board large area diffusion connection blank, periphery melting welding and vacuum tube weld to obtain multilayer plate seals；
S5, diffusion connection multilayer plate seals；
In the S5, the quantity of multilayer plate seals is one or more.
5. diffusion connection method according to claim 4, which is characterized in that in the S1, every laminate of multilayer plate blank material
The size of blank is all the same, the size of every laminate blank are as follows:
L1=L2+2W3；W1=W2+2W3；
In formula, L1For the length of every laminate blank, L2For the length of the sealing stalk of lower die, W3For melting welding width, W1For every laminate base
The width of material, W2For the width of the sealing stalk of lower die.
6. diffusion connection method according to claim 4, which is characterized in that in the S1, production multi-layer board large area expands
The method for dissipating connection blank is Water Cutting, laser cutting or numerical control punching.
7. diffusion connection method according to claim 4, which is characterized in that in the S2, surface treatment method is chemistry
Pickling or sanding and polishing.
8. diffusion connection method according to claim 4, which is characterized in that in the S3, make the step of interleaving agent pattern
It suddenly include: the line of demarcation that blank diffusion join domain and non-diffusing join domain is drawn according to multi-layer board part model, in blank
The surface of non-diffusing join domain sprays interleaving agent.
9. diffusion connection method according to claim 4, which is characterized in that in the S5, diffusion connection multi-layer board sealing
Part includes the following steps:
S51, the multilayer plate seals in S4 are put between upper die and lower die, by the air passage of upper mold, lower die vacuum way,
The vacuum tube of multilayer plate seals is separately connected；
S52, vacuumize process is carried out to the vacuum tube of multilayer plate seals before upper die and lower die molding, then by upper mold under
Mould is molded and is persistently vacuumized to the vacuum tube of multilayer plate seals；
S53, kept the temperature after be warming up to multiple-plate diffusion connection temperature for mold, mold clamping force applied to mold, to lower die with
It is persistently vacuumized between multilayer plate seals；Argon gas pressure maintaining 2- after air pressure reaches 2.5-3.5MPa is passed through into upper mold air cavity
3h completes the diffusion connection of multi-layer board large area.
10. diffusion connection method according to claim 9, which is characterized in that the rate for being passed through argon gas in the S53 is
0.04-0.07MPa/min。
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112959002A (en) * | 2021-02-01 | 2021-06-15 | 哈尔滨工业大学 | Superplastic forming/diffusion connection forming method for hollow lightweight structure with local weight-reduction thin-wall complex profile |
| CN113500263A (en) * | 2021-07-27 | 2021-10-15 | 苏州世沃电子科技有限公司 | Copper sheet welding method using new auxiliary carrier |
| CN113814655A (en) * | 2021-08-23 | 2021-12-21 | 成都飞机工业（集团）有限责任公司 | Complicated surface pneumatic loading superplastic forming diffusion bonding method |
| CN114346396A (en) * | 2021-12-28 | 2022-04-15 | 北京航星机器制造有限公司 | Double-layer opening cover wall plate superplastic forming diffusion connection mold and method |
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| CN113500263A (en) * | 2021-07-27 | 2021-10-15 | 苏州世沃电子科技有限公司 | Copper sheet welding method using new auxiliary carrier |
| CN113814655A (en) * | 2021-08-23 | 2021-12-21 | 成都飞机工业（集团）有限责任公司 | Complicated surface pneumatic loading superplastic forming diffusion bonding method |
| CN113814655B (en) * | 2021-08-23 | 2023-12-08 | 成都飞机工业（集团）有限责任公司 | Complex-profile pneumatic loading superplastic forming diffusion connection method |
| CN114346396A (en) * | 2021-12-28 | 2022-04-15 | 北京航星机器制造有限公司 | Double-layer opening cover wall plate superplastic forming diffusion connection mold and method |
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