CN110337190A - A kind of manufacturing method of printed circuit board - Google Patents
A kind of manufacturing method of printed circuit board Download PDFInfo
- Publication number
- CN110337190A CN110337190A CN201910585082.3A CN201910585082A CN110337190A CN 110337190 A CN110337190 A CN 110337190A CN 201910585082 A CN201910585082 A CN 201910585082A CN 110337190 A CN110337190 A CN 110337190A
- Authority
- CN
- China
- Prior art keywords
- silk
- screen
- manufacturing
- circuit board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
The present invention relates to PCB circuit board manufacturing technology fields, disclose a kind of manufacturing method of printed circuit board, comprising the following steps: select plate；Silk-screen route；Drying；Cover copper；Cleaning；It is armor coated；Drying；Silk-screen insulating layer；UV solidification；Obtain finished product.This manufacturing method is additive process process, with electrically conductive ink and covers the mode of copper, and the route in circuit diagram is formed on the insulation board for not covering copper foil；Compared to traditional PCB subtractive process technique, the technological process of production is simplified.And do not need to erode a large amount of material as traditional handicraft, reduce the waste of raw materials of production process, be especially the reduction of the loss and waste of copper, improves the utilization rate of material；Significantly reduce the totle drilling cost of PCB circuit board.Moreover, production process does not need to be greatly decreased in PCB manufacturing process using chemicals such as strong acid and strong bases to the pollution of environment and destruction, environmental protection and safety.
Description
Technical field
The present invention relates to PCB circuit board manufacturing technology field more particularly to a kind of manufacturing methods of printed circuit board.
Background technique
-- press mold -- exposure -- development -- erosion that traditional PCB industry is produced using subtractive process mode, conventional process flow: internal layer
Quarter, -- moving back film, -- lamination -- -- -- -- -- -- -- plated copper and tin -- to move back film -- etching -- to move back press mold for exposure in hole for drilling for pressing by development
Tin -- silk-screen -- surface treatment etc..This method has the following problems and disadvantage: 1, technique is cumbersome, and production efficiency is not high；2, raw
It is big to produce technical requirements height, production difficulty, it is with high costs；3, production equipment investment is more, and occupancy plant area is big etc.；4, production process
Strong acid and strong base is needed, environmental pollution is serious.
Summary of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides a kind of manufacturing method of printed circuit board, mistakes
Journey is simple, high-efficient, more environmentally friendly.
The technical solution adopted by the present invention to solve the technical problems are as follows:
A kind of manufacturing method of printed circuit board, comprising the following steps: step 1. selects plate: select insulation board as substrate；
Step 2. silk-screen route: electrically conductive ink is used, by the route silk-screen in circuit diagram on substrate；Step 3. drying: to silk-screen mistake
The substrate of route carries out drying and processing；Step 4. covers copper: carrying out covering Copper treatment to the route that silk-screen crosses electrically conductive ink, be formed conductive
Route；Step 5. cleaning: it the substrate that copper is crossed will be covered is placed in clear water and clean；Step 6. is armor coated: what is cleaned
Armor coated liquid on substrate；Step 7. drying: drying and processing is carried out to the substrate of coated protective layer liquid；Step 8. thread
Print insulating layer: by green oil silk-screen on substrate；Step 9.UV solidifies: the substrate for crossing insulating layer to silk-screen carries out UV curing process；
Step 10. obtains finished product.
As an improvement of the above technical solution, in step 1, substrate uses epoxy glass-fiber-plate, RF4 epoxy plate or F881A ring
Oxygen glass cloth laminated board.
As an improvement of the above technical solution, in step 2, electrically conductive ink includes following component by weight: copper powder
45~60 parts, 10~20 parts of ink, 10~15 parts of solder(ing) paste, 3~10 parts of silane coupling agent, 5~15 parts of formaldehyde.
As an improvement of the above technical solution, in step 2 and step 8, the mesh number of silk screen used by silk-screen is 300 mesh-
400 mesh.
As an improvement of the above technical solution, in step 4, the route of electrically conductive ink is crossed to silk-screen by the way of electro-coppering
It carries out covering Copper treatment.
As an improvement of the above technical solution, in step 4, using under 47 DEG C~52 DEG C of alkaline environment, made with formaldehyde
For reducing agent, the route that the mode for restoring copper ion crosses electrically conductive ink to silk-screen carries out covering Copper treatment.
As an improvement of the above technical solution, in step 3 and step 7, the temperature of drying is 180 degree~220 degree, and the time is
3min-5min。
As an improvement of the above technical solution, in step 6, protective layer liquid is antioxidant.
As an improvement of the above technical solution, step 8 is specifically, circuit by photocuring welding resistance green oil silk-screen on substrate
Chart face forms insulating layer；As needed, using photocuring white oil, by the label silk-screen such as component figure, character in substrate
Component face.
As an improvement of the above technical solution, in step 9, the cured power of UV is 3KW, time 2min-3min.
The beneficial effects of the present invention are as follows:
The manufacturing method of this printed circuit board is additive process process, with electrically conductive ink and covers the mode of copper, is not having
Cover the route formed in circuit diagram on the insulation board of copper foil；Compared to traditional PCB subtractive process technique, production technology stream is simplified
Journey.And do not need to erode a large amount of material as traditional handicraft, reduce the waste of raw materials of production process, especially subtracts
The loss and waste for having lacked copper improves the utilization rate of material；Significantly reduce the totle drilling cost of PCB circuit board.Moreover, producing
Journey does not need to be greatly decreased in PCB manufacturing process to the pollution of environment and destruction, environmental protection is again using chemicals such as strong acid and strong bases
Safety.
Specific embodiment
Embodiment 1
The invention discloses a kind of manufacturing methods of printed circuit board, comprising the following steps:
Step 1. selects plate: selecting insulation board as substrate；
Step 2. silk-screen route: electrically conductive ink is used, by the route silk-screen in circuit diagram on substrate；
Step 3. drying: the substrate for crossing route to silk-screen carries out drying and processing；
Step 4. covers copper: carrying out covering Copper treatment to the route that silk-screen crosses electrically conductive ink, forms conducting wire；
Step 5. cleaning: it the substrate that copper is crossed will be covered is placed in clear water and clean；
Step 6. is armor coated: the armor coated liquid on the substrate cleaned；
Step 7. drying: drying and processing is carried out to the substrate of coated protective layer liquid；
Step 8. silk-screen insulating layer: by green oil silk-screen on substrate；
Step 9.UV solidifies: the substrate for crossing insulating layer to silk-screen carries out UV curing process；
Step 10. obtains finished product.
Specifically, this manufacturing method is additive process process, with electrically conductive ink and the mode of copper is covered, is not covering copper foil
The route in circuit diagram is formed on insulation board；Compared to traditional PCB subtractive process technique, the technological process of production is simplified.And not
It needs to erode a large amount of material as traditional handicraft, reduces the waste of raw materials of production process, be especially the reduction of copper
Loss and waste, improve the utilization rate of material；Significantly reduce the totle drilling cost of PCB circuit board.Moreover, production process is not required to
The chemicals such as strong acid and strong base are used, can be greatly decreased in PCB manufacturing process to the pollution of environment and destruction, environmental protection and safety.
Embodiment 2
The invention also discloses a kind of manufacturing methods of printed circuit board, comprising the following steps:
Step 1. selects plate: selecting insulation board as substrate, wherein substrate uses epoxy glass-fiber-plate, RF4 epoxy plate or F881A
Epoxy glass cloth laminated board.
Step 2. silk-screen route: electrically conductive ink is used, by the route silk-screen in circuit diagram on substrate；Wherein, conductive oil
Ink includes following component by weight: 45~60 parts of copper powder, 10~20 parts of ink, 10~15 parts of solder(ing) paste, silane coupling
3~10 parts of agent, 5~15 parts of formaldehyde；The mesh number of silk screen used by silk-screen is 300-400 mesh, and silk screen will even up whole, the line of silk screen
Item is straight line, and does not have breakpoint, can make route silkscreen precision high in this way.Copper powder, solder(ing) paste, Ke Yi great are added in electrically conductive ink
The big electric conductivity for increasing electrically conductive ink；Ink is added, is conducive to electrically conductive ink printing upper substrate；Silane coupling agent is added, it can be with
Enhance the coupling performance of electrically conductive ink；Formaldehyde functions as reducing agent, and electrically conductive ink is prevented to be oxidized.
Step 3. drying: the substrate for crossing route to silk-screen carries out drying and processing；Wherein, the temperature of drying is 180 degree -220
Degree, time 3min-5min.Make ink solidification, improves degree of covering.
Step 4. covers copper: carrying out covering Copper treatment to the route that silk-screen crosses electrically conductive ink, forms conducting wire；Specifically, adopting
The route that the copper-plated mode of electricity consumption crosses electrically conductive ink to silk-screen carries out covering Copper treatment.
Step 5. cleaning: it the substrate that copper is crossed will be covered is placed in clear water and clean；It washes and covers copper solution on substrate.
Step 6. is armor coated: the armor coated liquid on the substrate cleaned；Wherein, protective layer liquid is antioxygen
Agent, model Mei Beishi MS0424, protective layer liquid can protect copper not oxidized.
Step 7. drying: drying and processing is carried out to the substrate of coated protective layer liquid；Wherein, the temperature of drying is 180
- 220 degree of degree, time 3min-5min.The protective layer liquid for accelerating substrate surface is dry.
Step 8. silk-screen insulating layer: by circuit diagram surface of the photocuring welding resistance green oil silk-screen on substrate, insulating layer is formed；
As needed, using photocuring white oil, by the label silk-screen such as component figure, character in the component face of substrate；Silk-screen is adopted
The mesh number of silk screen is 300-400 mesh, and silk screen will even up whole, and the lines of silk screen are straight line, and do not have breakpoint, can be made in this way
Insulating layer silkscreen precision is high.Photocuring welding resistance green oil can protection circuit plate safe welding.
Step 9.UV solidifies: the substrate for crossing insulating layer to silk-screen carries out UV curing process；Wherein, the cured power of UV is
3KW, time 2-3min.That improves photocuring welding resistance green oil and photocuring white oil covers power and hardness.
Step 10. obtains finished product.
Further, in step 2, the composition of electrically conductive ink, by weight, can be 45 parts of copper powder, 10 parts of ink,
10 parts of solder(ing) paste, 3 parts of silane coupling agent, 5 parts of formaldehyde；It can also be 60 parts of copper powder, 20 parts of ink, 15 parts of solder(ing) paste, silane coupling
10 parts of mixture, 15 parts of formaldehyde；It can also be 53 parts of copper powder, 15 parts of ink, 12 parts of solder(ing) paste, 7 parts of silane coupling agent, formaldehyde 10
Part.The partial size of the copper powder is 500 mesh.The ink is selected from the UV501 produced by Zhong Yi printing ink paint Co., Ltd, Zhongshan city
Ink or the UV3006S ink produced by matt Electron Material Co., Ltd are produced by Japanese Goo Chemical Co., Ltd.
PSR310A ink.The silane coupling agent is selected from one of KH550, KH560, KH570, KH792, Z-6040, Z-6020
Or it is a variety of.This electrically conductive ink conducts electricity very well, and adhesive force is good, and 0 grade of international rating class.
Embodiment 3
The invention also discloses the manufacturing methods of another printed circuit board, are with the difference of embodiment 2:
Step 4. covers copper: carrying out covering Copper treatment to the route that silk-screen crosses electrically conductive ink, forms conducting wire；Specifically, adopting
Under 47 DEG C~52 DEG C of alkaline environment, using formaldehyde as reducing agent, the mode that copper ion is reduced to copper crosses silk-screen and leads
The route of electric ink carries out covering Copper treatment.Reaction equation is as follows:
Cu2++2HCHO+4OH-→Cu+2HCOO-+2H2O+H2↑(50℃)
The above, only better embodiment of the invention, but the present invention is not limited to above-described embodiments, as long as
The technical effect of the present invention is achieved by any identical or similar means for it, all should belong to protection scope of the present invention.
Claims (10)
1. a kind of manufacturing method of printed circuit board, it is characterised in that: the following steps are included:
Step 1. selects plate: selecting insulation board as substrate；
Step 2. silk-screen route: electrically conductive ink is used, by the route silk-screen in circuit diagram on substrate；
Step 3. drying: the substrate for crossing route to silk-screen carries out drying and processing；
Step 4. covers copper: carrying out covering Copper treatment to the route that silk-screen crosses electrically conductive ink, forms conducting wire；
Step 5. cleaning: it the substrate that copper is crossed will be covered is placed in clear water and clean；
Step 6. is armor coated: the armor coated liquid on the substrate cleaned；
Step 7. drying: drying and processing is carried out to the substrate of coated protective layer liquid；
Step 8. silk-screen insulating layer: by green oil silk-screen on substrate；
Step 9.UV solidifies: the substrate for crossing insulating layer to silk-screen carries out UV curing process；
Step 10. obtains finished product.
2. a kind of manufacturing method of printed circuit board according to claim 1, it is characterised in that: in step 1, substrate is used
Epoxy glass-fiber-plate, RF4 epoxy plate or F881A epoxy glass cloth laminated board.
3. a kind of manufacturing method of printed circuit board according to claim 1, it is characterised in that: in step 2, electrically conductive ink
Including following component by weight: 45~60 parts of copper powder, 10~20 parts of ink, 10~15 parts of solder(ing) paste, silane coupling agent 3
~10 parts, 5~15 parts of formaldehyde.
4. a kind of manufacturing method of printed circuit board according to claim 1, it is characterised in that: in step 2 and step 8,
The mesh number of silk screen used by silk-screen is -400 mesh of 300 mesh.
5. a kind of manufacturing method of printed circuit board according to claim 1, it is characterised in that: in step 3 and step 7,
The temperature of drying is the degree of 180 degree -220, time 3min-5min.
6. a kind of manufacturing method of printed circuit board according to claim 1, it is characterised in that: in step 4, using plating
The route that the mode of copper crosses electrically conductive ink to silk-screen carries out covering Copper treatment.
7. a kind of manufacturing method of printed circuit board according to claim 1, it is characterised in that: in step 4, using 47
DEG C~52 DEG C of alkaline environment under, using formaldehyde as reducing agent, the mode that copper ion is reduced to copper is crossed into electrically conductive ink to silk-screen
Route carry out covering Copper treatment.
8. a kind of manufacturing method of printed circuit board according to claim 1, it is characterised in that: in step 6, protective layer liquid
Body is antioxidant.
9. a kind of manufacturing method of printed circuit board according to claim 1, it is characterised in that: step 8 is specifically, by light
Solidify circuit diagram surface of the welding resistance green oil silk-screen on substrate, forms insulating layer；It as needed, will be first using photocuring white oil
Component graphics, character etc. mark silk-screen in the component face of substrate.
10. a kind of manufacturing method of printed circuit board according to claim 1, it is characterised in that: in step 9, UV solidification
Power be 3KW, time 2min-3min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910585082.3A CN110337190A (en) | 2019-07-01 | 2019-07-01 | A kind of manufacturing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910585082.3A CN110337190A (en) | 2019-07-01 | 2019-07-01 | A kind of manufacturing method of printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN110337190A true CN110337190A (en) | 2019-10-15 |
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ID=68144648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201910585082.3A Pending CN110337190A (en) | 2019-07-01 | 2019-07-01 | A kind of manufacturing method of printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113733771A (en) * | 2021-09-26 | 2021-12-03 | 江油星联电子科技有限公司 | Special solder mask manufacturing method |
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|---|---|---|---|---|
| CN102051607A (en) * | 2009-10-29 | 2011-05-11 | 比亚迪股份有限公司 | Electroless copper plating solution |
| CN102191491A (en) * | 2010-03-10 | 2011-09-21 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
| CN102612269A (en) * | 2012-04-01 | 2012-07-25 | 鞍山市正发电路有限公司 | All-printed circuit board |
| CN104651814A (en) * | 2014-11-28 | 2015-05-27 | 广东致卓精密金属科技有限公司 | Chemical copper plating solution and chemical copper plating method |
| CN109943150A (en) * | 2019-02-01 | 2019-06-28 | 广东华祐新材料有限公司 | A kind of electrically conductive ink and its preparation method and application |
-
2019
- 2019-07-01 CN CN201910585082.3A patent/CN110337190A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102051607A (en) * | 2009-10-29 | 2011-05-11 | 比亚迪股份有限公司 | Electroless copper plating solution |
| CN102191491A (en) * | 2010-03-10 | 2011-09-21 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
| CN102612269A (en) * | 2012-04-01 | 2012-07-25 | 鞍山市正发电路有限公司 | All-printed circuit board |
| CN104651814A (en) * | 2014-11-28 | 2015-05-27 | 广东致卓精密金属科技有限公司 | Chemical copper plating solution and chemical copper plating method |
| CN109943150A (en) * | 2019-02-01 | 2019-06-28 | 广东华祐新材料有限公司 | A kind of electrically conductive ink and its preparation method and application |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113733771A (en) * | 2021-09-26 | 2021-12-03 | 江油星联电子科技有限公司 | Special solder mask manufacturing method |
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Application publication date: 20191015 |