CN110324973A - The circuit structure and preparation method thereof of overlay film injection molding - Google Patents
The circuit structure and preparation method thereof of overlay film injection molding Download PDFInfo
- Publication number
- CN110324973A CN110324973A CN201910727198.6A CN201910727198A CN110324973A CN 110324973 A CN110324973 A CN 110324973A CN 201910727198 A CN201910727198 A CN 201910727198A CN 110324973 A CN110324973 A CN 110324973A
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- diaphragm
- engagement pad
- injection molding
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Abstract
The present invention provides a kind of circuit structures and preparation method thereof of overlay film injection molding.This method comprises: printing electrically conductive ink in the one side of diaphragm forms conducting wire, conducting wire has at least one engagement pad；Engagement pad printing dielectric ink is avoided in conducting wire forms the first insulating layer, the dress patch electronic component in corresponding engagement pad；Diaphragm is formed, is cut；The diaphragm cut and connector positioning are put into mold, connector contacts fitting with the corresponding engagement pad；And injected plastics material is provided into mold, injection molded layers are formed in the injection molding that carries out on one side with electronic component of diaphragm, a part of connector is embedded in injection molded layers.The component that the circuit structure for using above-mentioned production method to obtain can not be split for one, it is frivolous, have the advantages that moisture-proof, weatherability is strong, strong shock resistance.Conducting wire is that electrically conductive ink prints, and manufacture craft process is few, environmental protection.The three-dimensional multiplicity of moulding, structure are simple.
Description
Technical field
The present invention relates to printed electronics field more particularly to a kind of circuit structures and its system of overlay film injection molding
Make method.
Background technique
The surface structure body of traditional home appliance product, automotive upholstery, consumer electronics product etc. is by plastic part and modeling
The components such as the subsequent integrated circuit board of glue component fit together composition, integrated circuit board by printed circuit board (hollow plate) and
The electronic component composition of welding on a printed circuit, with structure is complicated, volume is thick and heavy, manufacturing process is cumbersome, waterproofness
The disadvantages of energy is poor, weatherability is not strong, impact resistance is poor, and there are environmental pollutions to ask when printing production for integrated circuit board
Topic.
Summary of the invention
Above-mentioned production electronic product surface structure body traditional handicraft there are aiming at the problem that and defect, the present invention provides
A kind of production method of the circuit structure of overlay film injection molding, comprising the following steps:
Step 1: conducting wire is formed in the one side printing electrically conductive ink of diaphragm, the conducting wire is at least one contact
Pad；
Step 2: the engagement pad printing dielectric ink is avoided in the conducting wire and forms the first insulating layer, corresponding
Dress patch electronic component in the engagement pad；
Step 3: the diaphragm with the conducting wire, first insulating layer and the electronic component is carried out
It forms, cut；
Step 4: the positioning of the diaphragm and connector that have cut is put into mold, the connector and the conducting wire
The diaphragm the same face and contact fitting with the corresponding engagement pad；And
Step 5: providing injected plastics material in Xiang Suoshu mold, carries out in the one side with the electronic component of the diaphragm
Injection molding forms injection molded layers, and a part of the connector is embedded in the injection molded layers, and another part stretches out the injection molded layers.
Preferably, before the step 1 further include: black/white/coloured silk is printed in region some or all of on the diaphragm
Color ink forms pattern layer, and the conducting wire is printed in the pattern layer.
Preferably, after forming the pattern layer further include: print dielectric ink in the pattern layer and form the second insulation
Layer, the conducting wire printing is on the second insulating layer.
Preferably, the step 2 further include: avoid the engagement pad and print protection ink on the first insulating layer
Form protective layer.
Preferably, the step 2 further include: avoid engagement pad printing injection adhesive on the protective layer
Form injection molding adhesive layer.
Preferably, the step 2 further include: printing electroconductive binder forms first and leads in the corresponding engagement pad
Electric adhesive layer, the electronic component dress are attached in first conductive adhesive.
Preferably, the step 2 further include: be used to protect the electronics member in the surface printing of the electronic component
The scour protection ink of device forms wash-prime coat.
Preferably, before the step 4 puts the positioning of the diaphragm and connector that have cut into mold further include:
Printing electroconductive binder forms the second conductive adhesive in the corresponding engagement pad, and the connector and second conduction are viscous
It closes layer and directly contacts fitting.
Preferably, the material of diaphragm 1 is PC, PET, PVC, PP, PMMA, PC+PMMA, cladding or cloth
Preferably, the material of the electrically conductive ink is selected from conductive silver paste, conductive charcoal slurry or conductive copper paste.
Preferably, the material of the dielectric ink is gloss oil.
Preferably, the material of the protection ink and scour protection ink is selected from gloss oil or UV ink.
Preferably, injected plastics material PC, PET, PVC, PP, PMMA, ABS, PC+ABS or TPU
Preferably, the forming method in the step 3 uses hot-forming or high-pressure molding.
Preferably, the cutting method in the step 3 is cut using cutting die or computer digital control machine tool is cut.
Compared with the traditional handicraft of production electronic product surface structure body, beneficial effects of the present invention:
The production method of the circuit structure of overlay film injection molding provided by the invention is conductive circuit and dress on diaphragm
Electronic component is pasted, then carries out in-mould injection molding, the circuit structure for using above-mentioned production method to obtain can not be split for one
Component, solve production electronic product surface structure body traditional handicraft " plastic components, integrated circuit board be different portions
Part needs multitask sequence to assemble " the problem of.And conducting wire is that electrically conductive ink prints, than conditional electronic product appearance knot
Structure body manufacture craft process is few, environmentally friendly.Conducting wire, electronic component are embedded between diaphragm and injection molded layers, and thickness ratio is by more
Conditional electronic product appearance structure body thickness after the assembling of a component is frivolous, and because of the characteristic that it can not be split, with more it is moisture-proof,
The advantages of weatherability is strong, strong shock resistance.The three-dimensional multiplicity of moulding, structure are simple, improve the performance and competitiveness of product.
Above-mentioned conditional electronic product appearance structural body there are aiming at the problem that and defect, the present invention also provides a kind of overlay films
The circuit structure of injection molding, comprising: diaphragm, conducting wire, the first insulating layer, electronic component, connector and injection molding
Layer；
The conducting wire is printed on the one side of the diaphragm, and the conducting wire has at least one engagement pad, and described first
Insulating layer is avoided the engagement pad and is printed in the conducting wire, and the electronic component dress is attached to the corresponding engagement pad
On, the connector contacts fitting, institute with the conducting wire in the same face of the diaphragm and with the corresponding engagement pad
The one side with the electronic component that injection molded layers are located at the diaphragm is stated, a part of the connector is embedded in the injection molding
In layer, another part stretches out the injection molded layers.
Preferably, further includes: pattern layer, second insulating layer, protective layer, injection molding adhesive layer, the first conductive adhesive, second
At least one in conductive adhesive and wash-prime coat；
The pattern layer is printed on the diaphragm, and some or all of upper region, the second insulating layer are printed on the figure on one side
In pattern layer, conducting wire printing on the second insulating layer, the protective layer avoid the engagement pad be printed on it is described
On first insulating layer, the protective layer covers the pattern layer, the conducting wire and first insulating layer, the injection molding
Adhesive layer is avoided the engagement pad and is printed on the protective layer, and first conductive adhesive is printed on the corresponding contact
So that the electronic component is attached in the corresponding engagement pad by first conductive adhesive dress on pad, described second
Conductive adhesive is printed in the corresponding engagement pad so that the connector is by second conductive adhesive and accordingly
The engagement pad contact fitting, the wash-prime coat is printed on the surface of the electronic component.
Compared with conditional electronic product appearance structural body, beneficial effects of the present invention:
Conducting wire, electronic component and injection molded layers are combined into a structural body that can not be split, solve conventional plastic component, collection
The problem of being different components at circuit board, multitask sequence needed to assemble.Conducting wire and electronic component are embedded in diaphragm and note
It moulds between layer, thickness can be more frivolous than the assembly thickness after tradition assembling, and because of the characteristic that it can not be split, with more anti-
The advantages of tide, weatherability be strong, strong shock resistance, the three-dimensional multiplicity of moulding, structure are simple, improve the performance and competition of product
Power.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structure sectional view of the circuit structure of overlay film injection molding of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.In the description of the present invention, it should be noted that unless otherwise specific
Regulation and restriction, term " connection " such as occur shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to detachably connect
It connects, or is integrally connected, can be mechanical connection, be also possible to be electrically connected, can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected or the connection of two component internals；" being printed on XXX " also shall be understood in a broad sense, and can be and directly prints
On XXX, it is also possible to through intermediary indirect printing on XXX；" contact fitting " also shall be understood in a broad sense, and can be straight
Contact fitting, is also possible to be bonded by mediate contact between intermediary.For the ordinary skill in the art, may be used
The concrete meaning of above-mentioned term in the present invention is understood with concrete condition.
It please refers to shown in Figure of description 1.
The present invention provides a kind of production methods of the circuit structure of overlay film injection molding, comprising the following steps:
Step 1: conducting wire 2 is formed in the one side printing electrically conductive ink of diaphragm 1, conducting wire 2 is at least one contact
Pad.The material of diaphragm 1 be PC, PET, PVC, PP, PMMA, PC+PMMA, cladding or cloth, but not limited to this.
Step 2: engagement pad printing dielectric ink is avoided in conducting wire 2 and forms the first insulating layer 3.First insulating layer 3
The region of conducting wire 2 is only covered, but the region other than conducting wire 2 can also be covered and print insulating oil in diaphragm full page
Ink.But the region for only covering conducting wire 2 can save material, more environmentally-friendly.The material of dielectric ink is gloss oil or other tools
The ink of insulation effect.The effect of first insulating layer 3 is when preventing some touch-control sensing area on finger touch circuit structural body,
When adjacent touch-control sensing area may also be triggered simultaneously or finger touches non-touch-control induction zone, neighbouring touch-control sensing
Area may be triggered, so as to cause accidentally touching.The dress patch electronic component 4 in corresponding engagement pad, electronic component 4 include core
Piece, LED, resistance, capacitor etc., but not limited to this.
Step 3: the diaphragm 1 with conducting wire 2, the first insulating layer 3 and electronic component 4 is formed, is cut out
It cuts.Forming method uses hot-forming or high-pressure molding, but not limited to this.Cutting method is cut using cutting die or computer number
Word control lathe is cut, but not limited to this.
Step 4: the diaphragm 1 cut and the positioning of connector 5 are put into mold.By the location structure of mold by film
Piece 1 positions in a mold, is well-known to those skilled in the art, and the location structure can be according to specific
It needs to be designed.In certain embodiments, location structure is the ridge and/or block and/or column and/or notch of mold shape.Even
It connects device 5 and contacts fitting with conducting wire 2 in the same face of diaphragm 1 and with the corresponding engagement pad.According to the shape of diaphragm 1,
Connector 5 can be placed on the one side with conducting wire 2 of diaphragm 1 horizontally, vertically or at any suitable angle
On.Since mold has location structure (ridge and/or block and/or column and/or notch etc.), connector 5 is put into mold can be with
It is precisely inerrably docked with the corresponding engagement pad in conducting wire 2, does not generate dislocation, be provided for the liquid injection molding of molding
Material also will not usually make connector 5 mobile in flow process.If connector 5 is first fixed on diaphragm 1 by front the step of
Conducting wire 2 corresponding engagement pad on, then by connector 5 and diaphragm 1 be sent into mold together in be molded, due to film
The more frivolous softness of piece 1, and connector 5 is more thick and heavy, in multiple processing or moving process, it is easy to connector 5 occur
The phenomenon that generating pressing mold with mold well dislocation position.
Step 5: providing injected plastics material into mold, carries out injection molding shape on one side with electronic component 4 in diaphragm 1
At injection molded layers 6.In a part insertion injection molded layers 6 of connector 5, another part stretches out the injection molded layers 6.Injected plastics material be PC,
PET, PVC, PP, PMMA, ABS, PC+ABS or TPU.Conducting wire 2, electronic component 4 be embedded in diaphragm 1 and injection molded layers 6 it
Between, thickness is than by the spy frivolous, and can not be split by it of conditional electronic product appearance structure body thickness after the assembling of multiple components
Property, have the advantages that moisture-proof, weatherability is strong, strong shock resistance.The three-dimensional multiplicity of moulding, structure are simple.
Mode of printing includes ink jet printing, hectographic printing, intaglio printing, silk-screen printing, flexographic printing etc., but is not limited to
This.
On the basis of the above embodiments, further, before step 1 further include: the part or complete on diaphragm 1
Portion region prints black/white/colored ink and forms pattern layer 7, and conducting wire 2 is printed in pattern layer 7.By pattern layer 7, conductor wire
Road 2, electronic component 4 and injection molded layers 6 are combined into a component that can not be split, and solve conditional electronic product appearance structural body
The problem of " plastic components, decorative pattern, integrated circuit board are different components, need the assembling of multitask sequence ", thickness is more frivolous,
And have change in pattern multiplicity, rub resistance, the not advantages such as easy oxidation discoloration, corrosion-resistant, environmentally friendly, beautiful and stylish,
On the basis of the above embodiments, further, after forming pattern layer 7 further include: print dielectric ink in pattern layer 7
It is formed second insulating layer (not showing in figure), conducting wire 2 is printed over the second dielectric.Second insulating layer can prevent user
Electric shock occurs when contacting the circuit structure and prevents signal interference between touch-control sensing area.
On the basis of the above embodiments, further, step 2 further include: avoid engagement pad on the first insulating layer 3
Printing protection ink forms protective layer 8, is used for covering protection conducting wire 2 and the first insulating layer 3.The material for protecting ink is light
Oil or UV ink, but not limited to this.Further, the also coverage diagram pattern layer of protective layer 8.
On the basis of the above embodiments, further, step 2 further include: avoid engagement pad and printed on protective layer 8
Adhesive forms injection molding adhesive layer 9.The effect for being molded adhesive layer 9 is to keep diaphragm 1 and injection molded layers 6 stronger in combination.
On the basis of the above embodiments, further, step 2 further include: printed in corresponding engagement pad conductive viscous
Mixture forms the first conductive adhesive 10, and the dress of electronic component 4 is attached in the first conductive adhesive 10.First conductive adhesive 10
Effect be keep electronic component 4 and engagement pad adhesively stronger and prevent electronic component 4 fill patch during shift.
On the basis of the above embodiments, further, step 2 further include: used in the surface printing of electronic component 4
In the scour protection ink of protection electronic component 4, wash-prime coat 11 is formed.The material of scour protection ink is UV ink or light
Oil, but not limited to this.The effect of wash-prime coat 11 is to prevent from electronic component 4 to be flushed away in injection molding to be displaced.
On the basis of the above embodiments, further, the diaphragm 1 cut and the positioning of connector 5 are put in step 4
Before progressive die tool further include: electroconductive binder, which is printed, in corresponding engagement pad forms the second conductive adhesive (not showing in figure),
Connector 5 directly contacts fitting with the second conductive adhesive.The effect of second conductive adhesive is to keep connector 5 and engagement pad viscous
It closes stronger and prevents connector 5 from shifting.
On the basis of the above embodiments, further, printing pattern layer 7, conductive circuit 2, printing the are completed
One insulating layer 3, printing second insulating layer, printing protective layer 8, printing injection adhesive layer 9, printing wash-prime coat 11 and dress patch electronics
Semi-finished product are all subjected to baking-curing after each procedure of component 4.
The present invention also provides a kind of circuit structures of overlay film injection molding, comprising: diaphragm 1, conducting wire 2, first
Insulating layer 3, electronic component 4, connector 5 and injection molded layers 6；
Conducting wire 2 is printed on the one side of diaphragm 1, and conducting wire 2 has at least one engagement pad, and the first insulating layer 3 is avoided connecing
Touch pad is printed in conducting wire 2, and the dress of electronic component 4 is attached in corresponding engagement pad, and connector 5 and conducting wire 2 are in film
The same face of piece 1 simultaneously contacts fitting with corresponding engagement pad, and injection molded layers 6 are located at the one side with electronic component 4 of diaphragm 1,
In a part insertion injection molded layers 6 of connector 5, another part stretches out injection molded layers 6.
On the basis of the above embodiments, further, further includes: pattern layer 7, second insulating layer, protective layer 8, injection molding
At least one in adhesive layer 9, the first conductive adhesive 10, the second conductive adhesive and wash-prime coat 11；
Pattern layer 7 is printed on diaphragm 1, and some or all of upper region, second insulating layer are printed in pattern layer 7 on one side, conductor wire
Road 2 is printed over the second dielectric, and protective layer 8 is avoided engagement pad and is printed on the first insulating layer 3,8 coverage diagram pattern layer of protective layer
7, conducting wire 2 and the first insulating layer 3, injection molding adhesive layer 9 are avoided engagement pad and are printed on protective layer 9, the first conductive adhesion
Layer 10 is printed in corresponding engagement pad so that electronic component 4 is attached to corresponding engagement pad by the first conductive adhesive 10 dress
On, the second conductive adhesive is printed in corresponding engagement pad so that connector 5 is connect by the second conductive adhesive with corresponding
Touch pad contact fitting, wash-prime coat 11 are printed on the surface of electronic component 4.
The above is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all in the present invention
Inventive concept under, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/be used in it indirectly
His relevant technical field is equal.It is included within the scope of the present invention.
Claims (10)
1. a kind of production method of the circuit structure of overlay film injection molding, which comprises the following steps:
Step 1: conducting wire is formed in the one side printing electrically conductive ink of diaphragm, the conducting wire is at least one contact
Pad；
Step 2: the engagement pad printing dielectric ink is avoided in the conducting wire and forms the first insulating layer, corresponding
Dress patch electronic component in the engagement pad；
Step 3: the diaphragm with the conducting wire, first insulating layer and the electronic component is carried out
It forms, cut；
Step 4: the positioning of the diaphragm and connector that have cut is put into mold, the connector and the conducting wire
The diaphragm the same face and contact fitting with the corresponding engagement pad；And
Step 5: providing injected plastics material in Xiang Suoshu mold, carries out in the one side with the electronic component of the diaphragm
Injection molding forms injection molded layers, and a part of the connector is embedded in the injection molded layers, and another part stretches out the injection molded layers.
2. the production method of the circuit structure of overlay film injection molding according to claim 1, which is characterized in that described
Before step 1 further include: region printing black/white/colored ink forms pattern layer some or all of on the diaphragm, described
Conducting wire is printed in the pattern layer.
3. the production method of the circuit structure of overlay film injection molding according to claim 2, which is characterized in that form institute
After stating pattern layer further include: print dielectric ink in the pattern layer and form second insulating layer, the conducting wire is printed on
In the second insulating layer.
4. the production method of the circuit structure of overlay film injection molding according to claim 1, which is characterized in that the step
Rapid two further include: avoid the engagement pad and print protection ink formation protective layer on the first insulating layer.
5. the production method of the circuit structure of overlay film injection molding according to claim 4, which is characterized in that the step
Rapid two further include: avoid engagement pad printing injection adhesive on the protective layer and form injection molding adhesive layer.
6. according to claim 1 to the production method of the circuit structure of overlay film injection molding described in 5 any one, feature
It is, the step 2 further include: printing electroconductive binder forms the first conductive adhesive, institute in the corresponding engagement pad
Electronic component dress is stated to be attached in first conductive adhesive.
7. according to claim 1 to the production method of the circuit structure of overlay film injection molding described in 5 any one, feature
It is, the step 2 further include: be used to protect the erosion control of the electronic component in the surface printing of the electronic component
Ink is protected, wash-prime coat is formed.
8. according to claim 1 to the production method of the circuit structure of overlay film injection molding described in 5 any one, feature
It is, before the step 4 puts the positioning of the diaphragm and connector that have cut into mold further include: corresponding described
Electroconductive binder is printed in engagement pad and forms the second conductive adhesive, and the connector directly connects with second conductive adhesive
Touching fitting.
9. a kind of circuit structure of overlay film injection molding characterized by comprising diaphragm, conducting wire, the first insulating layer,
Electronic component, connector and injection molded layers；
The conducting wire is printed on the one side of the diaphragm, and the conducting wire has at least one engagement pad, and described first
Insulating layer is avoided the engagement pad and is printed in the conducting wire, and the electronic component dress is attached to the corresponding engagement pad
On, the connector contacts fitting, institute with the conducting wire in the same face of the diaphragm and with the corresponding engagement pad
The one side with the electronic component that injection molded layers are located at the diaphragm is stated, a part of the connector is embedded in the injection molding
In layer, another part stretches out the injection molded layers.
10. the circuit structure of overlay film injection molding according to claim 9, which is characterized in that further include: pattern layer,
At least one in second insulating layer, protective layer, injection molding adhesive layer, the first conductive adhesive, the second conductive adhesive and wash-prime coat
It is a；
The pattern layer is printed on the diaphragm, and some or all of upper region, the second insulating layer are printed on the figure on one side
In pattern layer, conducting wire printing on the second insulating layer, the protective layer avoid the engagement pad be printed on it is described
On first insulating layer, the protective layer covers the pattern layer, the conducting wire and first insulating layer, the injection molding
Adhesive layer is avoided the engagement pad and is printed on the protective layer, and first conductive adhesive is printed on the corresponding contact
So that the electronic component is attached in the corresponding engagement pad by first conductive adhesive dress on pad, described second
Conductive adhesive is printed in the corresponding engagement pad so that the connector is by second conductive adhesive and accordingly
The engagement pad contact fitting, the wash-prime coat is printed on the surface of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910727198.6A CN110324973B (en) | 2019-08-07 | 2019-08-07 | Film-coated injection-molded circuit structure and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910727198.6A CN110324973B (en) | 2019-08-07 | 2019-08-07 | Film-coated injection-molded circuit structure and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110324973A true CN110324973A (en) | 2019-10-11 |
| CN110324973B CN110324973B (en) | 2022-10-28 |
Family
ID=68125689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910727198.6A Active CN110324973B (en) | 2019-08-07 | 2019-08-07 | Film-coated injection-molded circuit structure and method for manufacturing same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110324973B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112497641A (en) * | 2020-11-25 | 2021-03-16 | 莱州市广利印制版有限公司 | Injection molding embedded type LED electronic circuit and production method thereof |
| CN113342187A (en) * | 2021-06-02 | 2021-09-03 | 深圳市合盛创杰科技有限公司 | In-mold electronic touch control panel and manufacturing method thereof |
| CN113382531A (en) * | 2021-06-02 | 2021-09-10 | 深圳市合盛创杰科技有限公司 | In-mold electronic panel with double-layer plastic structure and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160290878A1 (en) * | 2015-04-02 | 2016-10-06 | Tacto Tek Oy | Multilayer structure for capacitive pressure sensing |
| CN106797702A (en) * | 2014-03-06 | 2017-05-31 | 塔科图特科有限责任公司 | Method, relevant apparatus and product for manufacturing electronic product |
| CN107113972A (en) * | 2014-12-29 | 2017-08-29 | 塔科图特科有限责任公司 | Sandwich construction and relative manufacturing process for accommodating electronic device |
| CN107709007A (en) * | 2015-05-19 | 2018-02-16 | 塔科图特科有限责任公司 | For the thermoforming plastic covering part of electronic device and the manufacture method of correlation |
| US20180295711A1 (en) * | 2017-04-10 | 2018-10-11 | Tactotek Oy | Method for manufacturing an electronic assembly |
| CN109729648A (en) * | 2019-02-22 | 2019-05-07 | 上海仪电电子印刷科技有限公司 | The decoration panel and preparation method thereof for having sensing function |
-
2019
- 2019-08-07 CN CN201910727198.6A patent/CN110324973B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106797702A (en) * | 2014-03-06 | 2017-05-31 | 塔科图特科有限责任公司 | Method, relevant apparatus and product for manufacturing electronic product |
| CN107113972A (en) * | 2014-12-29 | 2017-08-29 | 塔科图特科有限责任公司 | Sandwich construction and relative manufacturing process for accommodating electronic device |
| US20160290878A1 (en) * | 2015-04-02 | 2016-10-06 | Tacto Tek Oy | Multilayer structure for capacitive pressure sensing |
| CN107709007A (en) * | 2015-05-19 | 2018-02-16 | 塔科图特科有限责任公司 | For the thermoforming plastic covering part of electronic device and the manufacture method of correlation |
| US20180295711A1 (en) * | 2017-04-10 | 2018-10-11 | Tactotek Oy | Method for manufacturing an electronic assembly |
| CN109729648A (en) * | 2019-02-22 | 2019-05-07 | 上海仪电电子印刷科技有限公司 | The decoration panel and preparation method thereof for having sensing function |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112497641A (en) * | 2020-11-25 | 2021-03-16 | 莱州市广利印制版有限公司 | Injection molding embedded type LED electronic circuit and production method thereof |
| CN113342187A (en) * | 2021-06-02 | 2021-09-03 | 深圳市合盛创杰科技有限公司 | In-mold electronic touch control panel and manufacturing method thereof |
| CN113382531A (en) * | 2021-06-02 | 2021-09-10 | 深圳市合盛创杰科技有限公司 | In-mold electronic panel with double-layer plastic structure and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110324973B (en) | 2022-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102047352B (en) | In-molded resistive and shielding elements | |
| CN101809691B (en) | In-molded capacitive switch | |
| CN110324973A (en) | The circuit structure and preparation method thereof of overlay film injection molding | |
| CN106603768B (en) | A kind of handset shell and its processing technology of 3D structure | |
| CN107146946A (en) | A kind of antenna manufacturing method of terminal, antenna and terminal | |
| CN106444967A (en) | Waterproof notebook computer | |
| JP5225178B2 (en) | Capacitance sensor and manufacturing method thereof | |
| CN104053315A (en) | Casing | |
| TW200933675A (en) | Method of manufacturing key with three-dimensional pattern | |
| CN110430663A (en) | Electric circuit construction body in a kind of duplicature | |
| CN101115354B (en) | Moulding circuit board and manufacturing method therefor | |
| CN101715278B (en) | Shell and manufacturing method thereof | |
| CN108021296A (en) | Integral intelligent surface structure function part and its manufacture method | |
| CN210351776U (en) | Electronic circuit structure in double-layer film | |
| JP7264923B2 (en) | IME structure using electronic circuit plating method and its manufacturing method | |
| CN213026099U (en) | Electroluminescent casing | |
| CN210091114U (en) | Touch panel | |
| JP7128791B2 (en) | Molded products, electrical products and methods for manufacturing molded products | |
| CN102862261A (en) | Relief production process of injection molding product for in-mold molding | |
| CN112770491A (en) | Flexible circuit board with black PET structure and production process thereof | |
| JP3133721U (en) | Thin button structure that can generate glare | |
| CN111497116A (en) | Preparation method of injection molding structural part with integrated intelligent surface | |
| JP3028642U (en) | Electromagnetic wave shield touch switch panel | |
| CN215264745U (en) | Intra-mold electronic panel with double-layer thin film structure | |
| CN213321109U (en) | IMR (in-mold decoration) process double-sided decorative in-mold injection molding part |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |