CN110319857B - Sensor with high-resistance connection structure - Google Patents
Sensor with high-resistance connection structure Download PDFInfo
- Publication number
- CN110319857B CN110319857B CN201910718284.0A CN201910718284A CN110319857B CN 110319857 B CN110319857 B CN 110319857B CN 201910718284 A CN201910718284 A CN 201910718284A CN 110319857 B CN110319857 B CN 110319857B
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- CN
- China
- Prior art keywords
- butt joint
- joint
- sensor
- contact
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002788 crimping Methods 0.000 claims abstract description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 15
- 210000001503 joint Anatomy 0.000 claims description 57
- 238000007789 sealing Methods 0.000 claims description 19
- 230000006835 compression Effects 0.000 claims description 9
- 238000007906 compression Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 8
- 239000004593 Epoxy Substances 0.000 abstract description 4
- 239000000084 colloidal system Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000003032 molecular docking Methods 0.000 description 5
- -1 polytetrafluoroethylene Polymers 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
The invention discloses a sensor with a high-resistance connection structure, which is provided with a chemical sensing part and an electronic processing part which are detachably connected. In the structure, the connection mode of the lead and the contact pin abandons the inherent welding mode, but the lead and the contact pin are pressed and fixed by a mechanical structure through changing the threading mode. And through injecting epoxy in sealed chamber and crimping inslot, after the colloid solidification, not only increased the joint strength of lead wire and contact pin, can also carry out effectual sealed, avoid epoxy to get into, guarantee the impedance of junction.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a sensor with a high-resistance connection structure.
Background
In the existing sensor, the connection process of the lead wire and the lead wire is welding, the lead wire and the lead wire welding pad after welding are required to be insulated and isolated, short circuit with other lead wires is prevented, the defects of complex process, easy occurrence of short circuit, disconnection and the like are overcome, the wire harness packaging to the bin body after welding is completed is required to be curled inside, and the defects of insulation isolation sleeve falling-off phenomenon and the like can be overcome in the assembly.
Disclosure of Invention
The invention aims to solve the technical problem of providing a sensor with a high-resistance connection structure, which is capable of avoiding fixing a lead and a contact pin by adopting a welding process and ensuring that the lead and the contact pin have enough resistance values.
In order to solve the technical problems, the invention adopts the following technical scheme:
the utility model provides a sensor with high resistance connection structure, includes sensing mechanism and electronic processing mechanism, its characterized in that:
The sensing mechanism comprises a sensor body, wherein a baffle plate made of high-resistance materials is fixed at the tail end of an inner cavity of the sensor body, a convex connecting column is arranged on the outer side of the baffle plate, the connecting column is provided with a through hole and a compression joint groove which are both axial, the through hole is communicated with the compression joint groove, the middle part of the through hole is contracted, a sealing cavity is formed at the outer end of the through hole, and a lead wire of the sensor body penetrates through the through hole and is folded into the compression joint groove; the end of the sensor body is provided with a butt joint in a pressing mode, a contact male pin is axially fixed on the butt joint, one end of the contact male pin is inserted into the pressing groove and presses a lead wire to fix the lead wire, the inner side end face of the butt joint is provided with a sleeve joint type protection sleeve joint on a connecting column to seal the outer end face of the connecting column, so that sealant is injected into a sealing cavity and the pressing groove, the outer side of the butt joint is provided with a female joint, and the other end of the contact male pin is positioned in a groove of the female joint;
The electronic processing mechanism comprises a measuring instrument body, a butt joint cap which is fixedly in butt joint with the butt joint is fixed at one end of the measuring instrument body, a male joint which is in butt joint with a female joint is arranged in the butt joint cap, a contact male pin is inserted into the male joint and then is in butt joint with a contact female pin in the male joint, and the contact female pin is connected with a circuit board of the measuring instrument body.
The further technical proposal is that: the outer wall of the contact male pin and/or the contact female pin is provided with conical teeth at equal intervals with the part fixed with the butt joint or the butt cap.
The further technical proposal is that: the outer wall of the butt joint is provided with threads, and the butt joint cap is in threaded connection with the butt joint.
The further technical proposal is that: the outer wall of the butt joint is embedded with a first sealing ring which is sealed between the two side walls after being in butt joint with the butt joint cap.
The further technical proposal is that: the bottom of the butt joint cap is provided with a second sealing ring which is sealed between the two end surfaces after being in butt joint with the butt joint connector.
The further technical proposal is that: the end face of the connecting column between the perforation and the crimping groove is provided with a concave groove for accommodating the lead.
The further technical proposal is that: the separator is made of PP or PE.
The beneficial effects of adopting above-mentioned technical scheme to produce lie in:
In this sensor, because the sensor body is the consumable article, consequently set up this product into two parts of detachable connection, one end is the chemical sensing part, and part is the electronic processing part, combines sensor body and instrument as an organic wholely, but the direct output remote transmission's digital signal, it is more convenient to use to can change the sensor body.
Regarding the connection mode of the lead wire and the contact pin, the inherent welding mode is abandoned, the threading mode is changed, and the mechanical structure is utilized for press-fitting and fixing. After the lead passes through the perforation, the lead is backwards turned over by the crimping groove, and finally the pin is inserted into the crimping groove to be in contact with the lead and compress the lead.
In addition, cup joint type protection is arranged outside the connecting column, the connection position of the lead wire and the contact pin is ensured to be separated from the outside, and the outer ends of the sealing cavity and the crimping groove are plugged, so that epoxy resin can be injected into the sealing cavity and the crimping groove, after the colloid is solidified, the connection strength of the lead wire and the contact pin is increased, the connection strength can be effectively sealed, epoxy is prevented from entering, and the impedance of the connection part is ensured.
Drawings
The invention will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a schematic diagram of the structure of the present invention (prior to docking of the sensing mechanism and the electronic processing mechanism);
Fig. 2 is an enlarged schematic view of the portion a in fig. 1.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present invention is not limited to the specific embodiments disclosed below.
As shown in fig. 1 and 2, a sensor with a high resistance connection structure includes a sensing mechanism 101 and an electronic processing mechanism 102. In this sensor, because the sensor body is the consumable article, consequently set up this product into two parts of detachable connection, one end is the chemical sensing part, and part is the electronic processing part, combines sensor body and instrument as an organic wholely, but the direct output remote transmission's digital signal, it is more convenient to use to can change the sensor body.
Specifically, the sensing mechanism 101 includes a sensor body, a separator 11 made of a high-resistance material is fixed at the end of an inner cavity of the sensor body, a convex connecting column 12 is provided at the outer side of the separator 11, a through hole 13 and a compression joint groove 14 are provided on the connecting column 12, the through hole 13 and the compression joint groove 14 are both in axial direction, the middle part of the through hole 13 is contracted, a sealing cavity is formed at the outer end of the through hole 13, and a lead 15 of the sensor body passes through the through hole 13 and is folded into the compression joint groove 14; the end of the sensor body is provided with a butt joint 16 in a pressing mode, a contact male pin 17 is axially fixed on the butt joint 16, one end of the contact male pin 17 is inserted into the pressing groove 14 and presses the lead 15 to fix the lead 15, a sleeve-joint protection 18 sleeved on the connecting column 12 is arranged on the inner side end face of the butt joint 16, the outer end face of the connecting column 12 is plugged, sealing glue is injected into the sealing cavity and the pressing groove 14, a female joint 19 is arranged on the outer side of the butt joint 16, and the other end of the contact male pin 17 is located in a groove of the female joint 19. Wherein, baffle 11 and spliced pole 12 are the integrated injection molding and make, and butt joint 16, cup joint formula protection 18 and female joint 19 are the integrated injection molding and make.
The electronic processing mechanism 102 comprises a measuring instrument body, a butt joint cap 21 which is fixedly in butt joint with the butt joint 16 is fixed at one end of the measuring instrument body, a male joint 22 which is in butt joint with the female joint 19 is arranged in the butt joint cap 21, the contact male pin 17 is inserted into the male joint 22 and then is in butt joint with a contact female pin 23 in the male joint 22, and the contact female pin 23 is connected with a circuit board of the measuring instrument body.
In this structure, complementary guide structures are provided on the sensor mechanism 101 and the electronic processing mechanism 102, so that the corresponding relationship between the pins can be ensured. The connection mode of the lead 15 and the pin is not an inherent welding mode, but a threading mode is changed, and press-fitting and fixing are performed by using a mechanical structure. After the lead 15 passes through the perforation 13, the lead is backwards turned over by the crimping groove 14, and finally, the pin is inserted into the crimping groove 14 to be contacted with the lead and compress the lead 15.
In addition, the socket type protection 18 is arranged outside the connecting column 12, the connection position of the lead 15 and the contact pin is ensured to be separated from the outside, and the outer ends of the sealing cavity and the crimping groove 14 are blocked, so that epoxy resin can be injected into the sealing cavity and the crimping groove 14, after the colloid is solidified, the connection strength of the lead 15 and the contact pin is increased, the connection strength can be effectively sealed, the epoxy is prevented from entering, and the impedance of the connection position is ensured.
Regarding the fixing manner of the pin and the corresponding part, the part on the outer wall of the contact male pin 17 and/or the contact female pin 23, which is fixed with the butt joint 16 or the butt joint cap 21, is provided with conical teeth at equal intervals, when in installation, the small end of the conical teeth firstly enter the installation hole, and the large end of the conical teeth is extruded along with the penetration of the pin, so that the fixed connection between the pin and the pin is realized.
The detachable connection mode of the sensing mechanism 101 and the electronic processing mechanism 102 can adopt a buckle connection mode, or the outer wall of the butt joint 16 is provided with threads, the butt joint cap 21 is in threaded connection with the butt joint 16, and the indirect mode of the threads is firmer.
In addition, the existing sensor is integrated with the lead wire 15, and after the sensor reaches the service life, the lead wire 15 is also discarded with the sensor, so that a great amount of resources are wasted. Even if some manufacturers butt-joint the lead wires 15, the sealing effect is poor, and corrosive gas is easy to enter the connector under the influence of the use environment, so that the contact of the contact pins is poor.
In order to ensure that the pin is in a sealed environment after docking, a first sealing ring 10 is embedded on the outer wall of the docking connector 16, and seals between the two side walls after docking with the docking cap 21. Further, the bottom of the butt cap 21 has a second seal 24 which seals between the end surfaces of the butt joint 16 after being butt-jointed. To ensure that the sensor can be used normally in a liquid or volatile gas annulus.
In order to avoid the situation that the socket type protection 18 is butted with the connecting column 12, the connecting column 12 is extruded to form dead angles, so that the end face of the connecting column 12 between the perforation 13 and the crimping groove 14 is provided with a concave groove for accommodating the lead 15, extrusion of the lead 15 is avoided, and in addition, the perforation 13 and the crimping groove 14 can be communicated through the grooves so as to facilitate glue injection into the perforation 13 and the crimping groove through the glue injection holes.
The existing sensor transmits signals mostly as mV signals, materials with higher impedance are needed to be used as a lead 15 wrapping layer due to weaker signals, polytetrafluoroethylene is used as a contact end at a joint, and the polytetrafluoroethylene material cannot be injection molded due to the characteristics of the polytetrafluoroethylene material, so that a large amount of resources are wasted only by means of mechanical processing; meanwhile, the contact position is required to be wrapped by a high-resistance sleeve, coated by silica gel and the like, and the process is particularly complex. In this structure, therefore, the polytetrafluoroethylene connector is omitted, the separator 11 is made of PP or PE, injection molding can be achieved, the processing process is simple, and the use effect can be satisfied.
The foregoing is only a preferred embodiment of the present invention, and any and all simple modifications, variations and equivalents of the present invention will fall within the scope of the present invention.
Claims (5)
1. A sensor with high resistance connection structure, comprising a sensing mechanism (101) and an electronic processing mechanism (102), characterized in that:
The sensing mechanism (101) comprises a sensor body, wherein a baffle plate (11) made of high-resistance materials is fixed at the tail end of an inner cavity of the sensor body, a convex connecting column (12) is arranged on the outer side of the baffle plate (11), through holes (13) and crimping grooves (14) which are all axial are formed in the connecting column (12), the through holes (13) are communicated with the crimping grooves (14), the middle part of the through holes (13) is contracted, a sealing cavity is formed at the outer end of the through holes (13), and a lead wire (15) of the sensor body penetrates through the through holes (13) and is folded into the crimping grooves (14); the sensor is characterized in that a butt joint (16) is pressed at the tail end of the sensor body, a contact male pin (17) is axially fixed on the butt joint (16), one end of the contact male pin (17) is inserted into a compression joint groove (14) and extrudes a lead (15) to fix the lead (15), a concave groove for accommodating the lead (15) is formed in the end face of a connecting column (12) between the through hole (13) and the compression joint groove (14), a sleeve joint protection (18) sleeved on the connecting column (12) is formed in the inner end face of the butt joint (16), sealing of the outer end face of the connecting column (12) is achieved, sealing glue is injected into a sealing cavity and the compression joint groove (14), a female joint (19) is arranged at the outer side of the butt joint (16), and the other end of the contact male pin (17) is positioned in the groove of the female joint (19).
The electronic processing mechanism (102) comprises a measuring instrument body, wherein a butt joint cap (21) which is fixedly in butt joint with a butt joint connector (16) is fixed at one end of the measuring instrument body, a male joint connector (22) which is in butt joint with a female joint connector (19) is arranged in the butt joint cap (21), a contact male needle (17) is inserted into the male joint connector (22) and then is in butt joint with a contact female needle (23) in the male joint connector (22), the contact female needle (23) is connected with a circuit board of the measuring instrument body, and a first sealing ring (10) which is sealed between the two side walls after being in butt joint with the butt joint cap (21) is embedded on the outer wall of the butt joint connector (16).
2. A sensor having a high resistance connection according to claim 1, wherein: the outer wall of the contact male pin (17) and/or the contact female pin (23) is provided with conical teeth at equal intervals with the part fixed with the butt joint (16) or the butt cap (21).
3. A sensor having a high resistance connection according to claim 1, wherein: the outer wall of the butt joint (16) is provided with threads, and the butt cap (21) is in threaded connection with the butt joint (16).
4. A sensor having a high resistance connection according to claim 1, wherein: the bottom of the butt joint cap (21) is provided with a second sealing ring (24) which is sealed between the end faces of the butt joint cap and the butt joint (16) after being in butt joint.
5. A sensor having a high resistance connection according to claim 1, wherein: the separator (11) is made of PP or PE.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910718284.0A CN110319857B (en) | 2019-08-05 | 2019-08-05 | Sensor with high-resistance connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910718284.0A CN110319857B (en) | 2019-08-05 | 2019-08-05 | Sensor with high-resistance connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110319857A CN110319857A (en) | 2019-10-11 |
| CN110319857B true CN110319857B (en) | 2024-05-14 |
Family
ID=68125376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910718284.0A Active CN110319857B (en) | 2019-08-05 | 2019-08-05 | Sensor with high-resistance connection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110319857B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87106642A (en) * | 1986-10-02 | 1988-06-22 | 罗斯蒙德公司 | Be used to improve the digital converter of two-wire transmitter output current |
| KR200285966Y1 (en) * | 2002-04-06 | 2002-08-22 | 신진계전 (주) | Temperature sensor housing |
| JP2003194764A (en) * | 2001-12-28 | 2003-07-09 | Ngk Spark Plug Co Ltd | Gas sensor |
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| JP2009109437A (en) * | 2007-10-31 | 2009-05-21 | Tamura Seisakusho Co Ltd | Fixation structure and fixation unit of sensor element having lead |
| CN102507045A (en) * | 2011-11-07 | 2012-06-20 | 深圳市泰士特科技有限公司 | Temperature sensor special for oil groove of large water turbine |
| CN105870708A (en) * | 2016-06-01 | 2016-08-17 | 河北科瑞达仪器科技股份有限公司 | High-impedance coaxial connector for sensor |
| CN108414572A (en) * | 2018-05-24 | 2018-08-17 | 常州联德电子有限公司 | 8 line intelligence nitrogen oxide sensor of chip and packaging method |
| CN108613752A (en) * | 2018-05-11 | 2018-10-02 | 广东伊莱特电器有限公司 | A kind of contact pin type temperature sensor and preparation method thereof |
| CN210070972U (en) * | 2019-08-05 | 2020-02-14 | 北京恒泰翔基科技有限公司 | Sensor with high-resistance connecting structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7806587B2 (en) * | 2004-09-29 | 2010-10-05 | Citizen Holdings Co., Ltd. | Electronic clinical thermometer and method of producing the same |
| JP2011242381A (en) * | 2010-04-23 | 2011-12-01 | Ngk Spark Plug Co Ltd | Gas sensor unit |
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2019
- 2019-08-05 CN CN201910718284.0A patent/CN110319857B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87106642A (en) * | 1986-10-02 | 1988-06-22 | 罗斯蒙德公司 | Be used to improve the digital converter of two-wire transmitter output current |
| JP2003194764A (en) * | 2001-12-28 | 2003-07-09 | Ngk Spark Plug Co Ltd | Gas sensor |
| KR200285966Y1 (en) * | 2002-04-06 | 2002-08-22 | 신진계전 (주) | Temperature sensor housing |
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| CN1654939A (en) * | 2005-02-07 | 2005-08-17 | 哈尔滨理工大学 | Pressure and temperature sensor made of semiconductive macromolecule material |
| JP2009109437A (en) * | 2007-10-31 | 2009-05-21 | Tamura Seisakusho Co Ltd | Fixation structure and fixation unit of sensor element having lead |
| CN102507045A (en) * | 2011-11-07 | 2012-06-20 | 深圳市泰士特科技有限公司 | Temperature sensor special for oil groove of large water turbine |
| CN105870708A (en) * | 2016-06-01 | 2016-08-17 | 河北科瑞达仪器科技股份有限公司 | High-impedance coaxial connector for sensor |
| CN108613752A (en) * | 2018-05-11 | 2018-10-02 | 广东伊莱特电器有限公司 | A kind of contact pin type temperature sensor and preparation method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110319857A (en) | 2019-10-11 |
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