CN110319857A - A kind of sensor with high resistant connection structure - Google Patents
A kind of sensor with high resistant connection structure Download PDFInfo
- Publication number
- CN110319857A CN110319857A CN201910718284.0A CN201910718284A CN110319857A CN 110319857 A CN110319857 A CN 110319857A CN 201910718284 A CN201910718284 A CN 201910718284A CN 110319857 A CN110319857 A CN 110319857A
- Authority
- CN
- China
- Prior art keywords
- sensor
- butt jointing
- lead
- fixing butt
- banjo fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims abstract description 16
- 241000538562 Banjos Species 0.000 claims description 27
- 238000003032 molecular docking Methods 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 11
- 238000005192 partition Methods 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 239000000565 sealant Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 6
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 230000008447 perception Effects 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 239000000084 colloidal system Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
Abstract
The invention discloses a kind of sensors with high resistant connection structure, and the promising chemistry perception part and electron process part being detachably connected is arranged.The connection type of lead and contact pin in the structure has abandoned intrinsic welding manner, but by changing threading mode, press fitting fixation is carried out using mechanical structure.And the bonding strength of lead and contact pin is not only increased, additionally it is possible to be effectively sealed, epoxy is avoided to enter, guarantee the impedance of junction by injecting epoxy resin in seal chamber and crimp groove after colloid solidification.
Description
Technical field
The present invention relates to sensor technical field more particularly to a kind of sensors with high resistant connection structure.
Background technique
In existing sensor, the Joining Technology of lead and conducting wire is welding, and lead and conducting wire welded gasket need after welding
It is dielectrically separated from, prevents from being shorted with other leads, can there is complex process and the drawbacks such as short circuit, disconnecting easily occur, and welded
Harness encapsulates to warehouse and needs to crimp in inside after the completion of connecing, and can exist in assembly and be dielectrically separated from the drawbacks such as casing obscission.
Summary of the invention
It avoids guaranteeing using welding procedure anchor leg and contact pin technical problem to be solved by the invention is to provide one kind
There is the sensor with high resistant connection structure of enough impedance values between lead and contact pin.
In order to solve the above technical problems, the technical solution used in the present invention is:
A kind of sensor with high resistant connection structure, including sensing mechanism and electron process mechanism, it is characterised in that:
Sensing mechanism, including sensor body, the end of the sensor body inner cavity is fixed with to be made by highly resistant material
Partition, there is the connecting column of evagination in the outside of partition, offering on the connecting column is axial perforation and crimp groove,
The perforation is connected to crimp groove, and the middle part of the perforation is shunk, and forms a seal chamber, the sensor sheet in the outer end of perforation
The lead of body, which passes through, to be perforated and turns down to crimp groove;The end of the sensor body is pressed with banjo fixing butt jointing, the docking
Axial restraint has the public needle of contact on connector, and described one end for contacting public needle is inserted into crimp groove and swaged lead, realizes lead
It is fixed, there is the socket joint type protection being socketed on connecting column on the inner side end of the banjo fixing butt jointing, realize to connecting column outer end
The closure in face, to inject sealant into seal chamber and crimp groove, the outside of the banjo fixing butt jointing has female connector, the contact
The other end of public needle is located in the groove body of female connector;
Electron process mechanism, including measuring instrumentss ontology, are fixed with and banjo fixing butt jointing pair in one end of measuring instrumentss ontology
Fixed docking cap is connect, after there is the pin end docked with female connector, the public needle of the contact are inserted into docking cap in pin end
With the contact mother in pin end for connecing, the female needle of the contact is connect with the wiring board of measuring instrumentss ontology.
A further technical solution lies in: on the outer wall of the male needle of the contact and/or contact mother's needle with banjo fixing butt jointing or right
Connecing the fixed part of cap equidistantly has conical tooth.
A further technical solution lies in: there is screw thread, the docking cap connects with docking on the outer wall of the banjo fixing butt jointing
Head thread connection.
A further technical solution lies in: on the outer wall of the banjo fixing butt jointing embedded with dock cap dock after, the side Yu Erzhe
The first sealing ring sealed between wall.
A further technical solution lies in: it is described docking cap bottom have docked with banjo fixing butt jointing after, the end face Yu Erzhe
Between the second sealing ring for sealing.
A further technical solution lies in: there is indent on the connecting column end face between the perforation and crimp groove, be used for
Accommodate the groove of lead.
A further technical solution lies in: the partition is made by PP or PE.
The beneficial effects of adopting the technical scheme are that
In the sensor, since sensor body is easily-consumed products, be detachably connected two are set by this product
Part, one end are chemistry perception part, and a part is electron process part, and sensor body and instrument are combined as a whole, can
Directly output can teletransmission digital signal, it is more convenient to use, and sensor body can be replaced.
About the connection type of lead and contact pin, intrinsic welding manner has been abandoned, but has changed threading mode, has utilized machine
Tool structure carries out press fitting fixation.Lead is foldd backward from perforation across rear, then by crimp groove, finally recycles contact pin insertion crimping
It is in contact with it in slot and compresses lead, in this configuration, after lead fold, make the direction of insertion of contact pin and lead direction phase
Together, convenient for the insertion of contact pin, and the lead after fold has steering, falls off after can be avoided lead stress, and fixation is more steady
It is fixed.
In addition, being externally provided with socket joint type protection in connecting column, guarantee that the link position of lead and contact pin is separated with the external world, and right
The outer end of seal chamber and crimp groove is blocked, and makes that epoxy resin can be injected in seal chamber and crimp groove, after colloid solidification, no
Increase only the bonding strength of lead and contact pin, additionally it is possible to be effectively sealed, epoxy is avoided to enter, guarantee the resistance of junction
It is anti-.
Detailed description of the invention
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is structural schematic diagram of the invention (before sensing mechanism and the docking of electron process mechanism);
Fig. 2 is the enlarged structure schematic diagram of part A in Fig. 1.
Specific embodiment
With reference to the attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground description, it is clear that described embodiment is a part of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, those skilled in the art's every other embodiment obtained without making creative work,
It shall fall within the protection scope of the present invention.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, but the present invention can be with
Implemented using other than the one described here other way, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by the specific embodiments disclosed below.
As depicted in figs. 1 and 2, a kind of sensor with high resistant connection structure, including sensing mechanism 101 and electron process
Mechanism 102.In the sensor, since sensor body is easily-consumed products, be detachably connected two are set by this product
Part, one end are chemistry perception part, and a part is electron process part, and sensor body and instrument are combined as a whole, can
Directly output can teletransmission digital signal, it is more convenient to use, and sensor body can be replaced.
Specifically, sensing mechanism 101 includes sensor body, the end of the sensor body inner cavity is fixed with by high resistant
Partition 11 made from material have the connecting column 12 of evagination in the outside of partition 11, and offering on the connecting column 12 is axis
To perforation 13 and crimp groove 14, the perforation 13 be connected to crimp groove 14, and the middle part of the perforation 13 is shunk, in perforating 13
Outer end forms a seal chamber, and the lead 15 of the sensor body passes through perforation 13 and turns down to crimp groove 14;The sensing
The end of device ontology is pressed with banjo fixing butt jointing 16, and axial restraint has the public needle 17 of contact on the banjo fixing butt jointing 16, and the contact is public
The interior simultaneously swaged lead 15 of one end insertion crimp groove 14 of needle 17, realizes the fixation of lead 15, the inner end of the banjo fixing butt jointing 16
There is the socket joint type protection 18 being socketed on connecting column 12 on face, realize closure to 12 outer end face of connecting column, with to seal chamber
With inject sealant in crimp groove 14, the outside of the banjo fixing butt jointing 16 has female connector 19, described to contact the another of public needle 17
End is located in the groove body of female connector 19.Wherein, partition 11 and connecting column 12 are integrated injection molding and are made, banjo fixing butt jointing 16, set
It connects formula protection 18 and female connector 19 is integrated injection molding and is made.
Electron process mechanism 102 includes measuring instrumentss ontology, is fixed with and banjo fixing butt jointing in one end of measuring instrumentss ontology
The fixed docking cap 21 of 16 docking has the pin end 22 docked with female connector 19 in docking in cap 21, the public needle 17 of the contact
It is docked after being inserted into pin end 22 with the contact mother needle 23 in pin end 22, the line for contacting female needle 23 and measuring instrumentss ontology
The connection of road plate.
In this configuration, the guide frame of complementary type is arranged on sensing mechanism 101 and electron process mechanism 102,
It can guarantee contact pin corresponding relationship.About the connection type of lead 15 and contact pin, intrinsic welding manner is abandoned, but has been changed
Threading mode carries out press fitting fixation using mechanical structure.After lead 15 is passed through from perforation 13, then foldd backward by crimp groove 14,
It finally recycles and is in contact with it in contact pin insertion crimp groove 14 and compresses lead 15, in this configuration, after lead 15 turns down, make
The direction of insertion of contact pin is identical as 15 direction of lead, and convenient for the insertion of contact pin, and the lead 15 after fold has steering, can
It falls off after avoiding 15 stress of lead, fixation is more stable.
In addition, be externally provided with socket joint type protection 18 in connecting column 12, guarantee lead 15 and contact pin link position and it is extraneous every
It opens, and the outer end of seal chamber and crimp groove 14 is blocked, make that epoxy resin, glue can be injected in seal chamber and crimp groove 14
After body solidification, the bonding strength of lead 15 Yu contact pin is not only increased, additionally it is possible to it is effectively sealed, epoxy is avoided to enter,
Guarantee the impedance of junction.
About the fixed form of contact pin and corresponding part, on the outer wall for contacting male needle 17 and/or contact mother's needle 23 with it is right
The part that connector 16 or docking cap 21 are fixed equidistantly has conical tooth, and during installation, the small end of conical tooth is introduced into installation
In hole, with going deep into for contact pin, big end is extruded, and realizes between the two be fixedly connected.
Dismountable connection type of sensing mechanism 101 and electron process mechanism 102 can be using snapping connection, can also be with
It is that there is screw thread on the outer wall of banjo fixing butt jointing 16, the docking cap 21 is threadedly coupled with banjo fixing butt jointing 16, the indirect mode of screw thread
It is stronger.
In addition, existing sensor and lead 15 are an entirety, after sensor reaches service life, lead 15 also with
Abandon it together, cause the expense that allows of vast resources.Even if some producers accomplish docking on lead 15, but sealing effect compared with
Difference is influenced by use environment, and corrosive gas is easily accessible in connector, leads to contact pin poor contact.
Be that contact pin is in the environment of sealing after guaranteeing docking, on the outer wall of banjo fixing butt jointing 16 embedded with to dock cap 21 right
Connect the first sealing ring 10 that is rear, sealing between Yu Erzhe side wall.Further, the bottom of cap 21 is docked with right with banjo fixing butt jointing 16
Connect the second sealing ring 24 that is rear, sealing between the end face Yu Erzhe.To guarantee that the sensor can be in liquid or escaping gas annular
Normal use.
After docking in order to avoid socket joint type protection 18 with connecting column 12, extruding is caused to form dead angle in lead 15, therefore
There is indent, the groove for accommodating lead 15 on 12 end face of connecting column between perforation 13 and crimp groove 14, so as to avoid
Extruding to lead 15, in addition perforation 13 can also be connected to crimp groove 14 by the groove, in order to pass through hole for injecting glue to the two
Interior injecting glue.
Existing sensor transmissions signal is mostly mV signal, since signal is weaker, the higher material of impedance need to be used as drawing
15 wrapping layer of line, joint then uses polytetrafluoroethylene (PTFE) as contact jaw, since polytetrafluoroethylene material characteristic must not be molded into
Type can only waste vast resources by machining;Contact position need to wrap up high resistant casing, smearing silica gel etc., technique again simultaneously
It is especially complicated.Therefore in this configuration, polytetrafluoroethylene (PTFE) connector is cast out, the partition 11 is made by PP or PE, Neng Goushi
Existing injection molding, processing technology is simple, and can satisfy using effect.
The above is only presently preferred embodiments of the present invention, anyone content according to the present invention makes the present invention a little
Simple modification, deformation and equivalent replacement each fall within protection scope of the present invention.
Claims (7)
1. a kind of sensor with high resistant connection structure, including sensing mechanism (101) and electron process mechanism (102), special
Sign is:
Sensing mechanism (101), including sensor body, the end of the sensor body inner cavity is fixed with to be made by highly resistant material
Partition (11), there is the connecting column (12) of evagination in the outside of partition (11), offering on the connecting column (12) is axis
To perforation (13) and crimp groove (14), the perforation (13) is connected to crimp groove (14), and the middle part of the perforation (13) is shunk,
A seal chamber is formed in the outer end of perforation (13), the lead (15) of the sensor body passes through perforation (13) and turns down and extremely crimps
In slot (14);The end of the sensor body is pressed with banjo fixing butt jointing (16), there is axial restraint on the banjo fixing butt jointing (16)
Public needle (17) is contacted, described one end for contacting public needle (17) is inserted into crimp groove (14) and swaged lead (15), realizes lead
(15) fixation has the socket joint type protection being socketed on connecting column (12) on the inner side end of the banjo fixing butt jointing (16)
(18), the closure to connecting column (12) outer end face is realized, to inject sealant, the docking into seal chamber and crimp groove (14)
The outside of connector (16) has female connector (19), and the other end for contacting public needle (17) is located in the groove body of female connector (19);
Electron process mechanism (102), including measuring instrumentss ontology are fixed with and banjo fixing butt jointing in one end of measuring instrumentss ontology
(16) the fixed docking cap (21) of docking, it is interior with the pin end (22) docked with female connector (19) in docking cap (21), it is described
It is docked after contacting in male needle (17) insertion pin end (22) with the contact mother needle (23) in pin end (22), the female needle of the contact
(23) it is connect with the wiring board of measuring instrumentss ontology.
2. a kind of sensor with high resistant connection structure according to claim 1, it is characterised in that: the public needle of the contact
(17) and/or on the outer wall of the female needle (23) of contact with banjo fixing butt jointing (16) or the part for docking cap (21) fixation equidistantly there is cone
Shape tooth.
3. a kind of sensor with high resistant connection structure according to claim 1, it is characterised in that: the banjo fixing butt jointing
(16) there is screw thread, the docking cap (21) is threadedly coupled with banjo fixing butt jointing (16) on outer wall.
4. a kind of sensor with high resistant connection structure according to claim 1, it is characterised in that: the banjo fixing butt jointing
(16) on outer wall embedded with dock cap (21) dock after, the first sealing ring (10) for being sealed between Yu Erzhe side wall.
5. a kind of sensor with high resistant connection structure according to claim 1 or 4, it is characterised in that: the docking
The bottom of cap (21) has docked with banjo fixing butt jointing (16) after, the second sealing ring (24) for being sealed between the end face Yu Erzhe.
6. a kind of sensor with high resistant connection structure according to claim 1, it is characterised in that: the perforation (13)
There is indent, the groove for accommodating lead (15) on connecting column (12) end face between crimp groove (14).
7. a kind of sensor with high resistant connection structure according to claim 1, it is characterised in that: the partition (11)
It is made by PP or PE.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910718284.0A CN110319857B (en) | 2019-08-05 | Sensor with high-resistance connection structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910718284.0A CN110319857B (en) | 2019-08-05 | Sensor with high-resistance connection structure |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110319857A true CN110319857A (en) | 2019-10-11 |
CN110319857B CN110319857B (en) | 2024-05-14 |
Family
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Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87106642A (en) * | 1986-10-02 | 1988-06-22 | 罗斯蒙德公司 | Be used to improve the digital converter of two-wire transmitter output current |
KR200285966Y1 (en) * | 2002-04-06 | 2002-08-22 | 신진계전 (주) | Temperature sensor housing |
JP2003194764A (en) * | 2001-12-28 | 2003-07-09 | Ngk Spark Plug Co Ltd | Gas sensor |
CN1654939A (en) * | 2005-02-07 | 2005-08-17 | 哈尔滨理工大学 | Pressure and temperature sensor made of semiconductive macromolecule material |
CN1849509A (en) * | 2003-09-17 | 2006-10-18 | 日本特殊陶业株式会社 | Sensor and sensor producing method |
US20080031305A1 (en) * | 2005-09-09 | 2008-02-07 | Isamu Kobayashi | Electronic Clinical Thermometer and Method of Producing the Same |
JP2009109437A (en) * | 2007-10-31 | 2009-05-21 | Tamura Seisakusho Co Ltd | Fixation structure and fixation unit of sensor element having lead |
US20110259084A1 (en) * | 2010-04-23 | 2011-10-27 | Ngk Spark Plug Co., Ltd. | Gas sensor unit |
CN102507045A (en) * | 2011-11-07 | 2012-06-20 | 深圳市泰士特科技有限公司 | Temperature sensor special for oil groove of large water turbine |
CN105870708A (en) * | 2016-06-01 | 2016-08-17 | 河北科瑞达仪器科技股份有限公司 | High-impedance coaxial connector for sensor |
CN108414572A (en) * | 2018-05-24 | 2018-08-17 | 常州联德电子有限公司 | 8 line intelligence nitrogen oxide sensor of chip and packaging method |
CN108613752A (en) * | 2018-05-11 | 2018-10-02 | 广东伊莱特电器有限公司 | A kind of contact pin type temperature sensor and preparation method thereof |
CN210070972U (en) * | 2019-08-05 | 2020-02-14 | 北京恒泰翔基科技有限公司 | Sensor with high-resistance connecting structure |
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87106642A (en) * | 1986-10-02 | 1988-06-22 | 罗斯蒙德公司 | Be used to improve the digital converter of two-wire transmitter output current |
JP2003194764A (en) * | 2001-12-28 | 2003-07-09 | Ngk Spark Plug Co Ltd | Gas sensor |
KR200285966Y1 (en) * | 2002-04-06 | 2002-08-22 | 신진계전 (주) | Temperature sensor housing |
CN1849509A (en) * | 2003-09-17 | 2006-10-18 | 日本特殊陶业株式会社 | Sensor and sensor producing method |
CN1654939A (en) * | 2005-02-07 | 2005-08-17 | 哈尔滨理工大学 | Pressure and temperature sensor made of semiconductive macromolecule material |
US20080031305A1 (en) * | 2005-09-09 | 2008-02-07 | Isamu Kobayashi | Electronic Clinical Thermometer and Method of Producing the Same |
JP2009109437A (en) * | 2007-10-31 | 2009-05-21 | Tamura Seisakusho Co Ltd | Fixation structure and fixation unit of sensor element having lead |
US20110259084A1 (en) * | 2010-04-23 | 2011-10-27 | Ngk Spark Plug Co., Ltd. | Gas sensor unit |
CN102507045A (en) * | 2011-11-07 | 2012-06-20 | 深圳市泰士特科技有限公司 | Temperature sensor special for oil groove of large water turbine |
CN105870708A (en) * | 2016-06-01 | 2016-08-17 | 河北科瑞达仪器科技股份有限公司 | High-impedance coaxial connector for sensor |
CN108613752A (en) * | 2018-05-11 | 2018-10-02 | 广东伊莱特电器有限公司 | A kind of contact pin type temperature sensor and preparation method thereof |
CN108414572A (en) * | 2018-05-24 | 2018-08-17 | 常州联德电子有限公司 | 8 line intelligence nitrogen oxide sensor of chip and packaging method |
CN210070972U (en) * | 2019-08-05 | 2020-02-14 | 北京恒泰翔基科技有限公司 | Sensor with high-resistance connecting structure |
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