CN110318047A - Chemical palladium solution applied to gold-palladium gold plate chemical on PCB - Google Patents
Chemical palladium solution applied to gold-palladium gold plate chemical on PCB Download PDFInfo
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- CN110318047A CN110318047A CN201910685004.0A CN201910685004A CN110318047A CN 110318047 A CN110318047 A CN 110318047A CN 201910685004 A CN201910685004 A CN 201910685004A CN 110318047 A CN110318047 A CN 110318047A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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Abstract
The invention discloses a kind of chemical palladium solution applied to gold-palladium gold plate chemical on PCB, including main salt, complexant, reducing agent, stabilizer, pH buffer and surfactant, as unit of mass concentration, the ratio of said components are as follows: the palladium concentration in main salt: 0.4-0.6g/L；Complexant: 0.1-30g/L；Reducing agent: 0.1-25g/L；Stabilizer: 1-150mg/L；PH buffer: 1-25g/L；Surfactant: 0.1-10mg/L；Remaining group is divided into pure water.Palladium layers made from the palladium solution can satisfy good welding and bonding requirement, while be also applied for line width/line-spacing in the even smaller circuit surface processing of 0.5mil/0.5mil or less.
Description
Technical field
The present invention relates to PCB technical field more particularly to a kind of chemical palladium applied to gold-palladium gold plate chemical on PCB are molten
Liquid.
Background technique
COF is a kind of IC package technology, is the carrier with flexible base plate circuit FPC as encapsulation chip, through hot pressing
Conjunction engages the golden convex block (Gold Bump) on chip with the interior pin (Inner Lead) on flexible base plate circuit
(Bonding) technology.COF production after the completion of, after liquid crystal display (LCD Panel) module factory obtain IC after, can first with
It is punched (Punch) equipment and the IC in winding is cut into monolithic, have design input terminal on the flexible base plate circuit of usual COF
(Input) and the both ends output end (Output) outer pin (Outer Lead), the meeting of input terminal outer pin and glass of liquid crystal display
Substrate engages, and pin can then be engaged with the printed circuit board (PCB) of control signal in input terminal.
The intelligent portable epoch, using mobile phone, computer and display class as the high speed development of the small-sized electronic product of representative.
COF FPC support plate, which is then used, subtracts into the entirely different SAP semi-additive process production method of etching method with standard, because standard subtracts into
The FPC line width line-spacing that etching method is produced is minimum general all in 2mil/2mil or more, COF production finer for route
Technique is substantially helpless.And COF FPC line width line-spacing is more fine compared with common FPC, is difficult to adopt standard and subtracts into erosion
Lithography production.The two-sided FPC product of especially LCD and high-end rigid-flex combined board, the densification of route and via hole
Bring the size microminiaturization of the miniaturization of line width/line spacing and via diameter.Currently, the line of the single side of LCD and two-sided FPC
Width/line-spacing 1.5mil/1.5mil, via diameter 0.05mm are generally realized in COF.
Existing process of surface treatment (change nickel gold, NiPdAu, porpezite, change silver, change tin, OSP, spray tin) can not meet simultaneously
The performances such as gold thread bonding, fine-line (1.5mil/1.5mil and line width/line-spacing below) and (180 ° bend 3 times) resistant to bending.
And gold-palladium gold process can meet the above performance simultaneously；The coating that wherein gold-palladium gold process is deposited is divided into three layers of gold-palladium gold,
Middle first layer is layer gold, thickness 0.5-1.0 μ inch；The second layer is palladium layers, and thickness 3-5 μ inch, third layer is layer gold, with a thickness of
2-3μinch。
Wiring board is after surface treatment, in order to carry out effective electrical property connection, main processing work with other components
Skill has two kinds of techniques of scolding tin (the tin ball bonding including IC) and routing (wire bonding).Existing surface treatment mode spray tin,
Change tin, change the process of surface treatment such as silver and OSP mainly reply scolding tin Joining Technology, main disadvantage is then that can only apply
In the design of most basic route with electronic product, because of the limitation of its scolding tin itself, it is difficult to cope with the electronics electricity of elaborate
Road deisgn product.
Another Joining Technology is then routing, and the material of routing mainly has gold thread, silver wire, plating palladium copper currently on the market
Line, electrum line and copper wire, the line footpath of various lines is not of uniform size, and thick reaches 2mil (50um), most can carefully accomplish 0.5mil
(12um) is even more thin.Wherein line footpath is thinner, and the routing ability for coping with fine-line is stronger.And change nickel gold plate be only suitable for it is wide/
Surface treatment of the line-spacing in 2mil/2mil or more；NiPdAu coating is suitble to line width/line-spacing 1.5mil/1.5mil's or more
Surface treatment；Porpezite coating is suitble to line width/line-spacing in the surface treatment of 1.0mil/1.0mil or more；And involved in the present invention
Gold-palladium gold plate can satisfy good welding requirements, while be also applied for line width/line-spacing 0.5mil/0.5mil or less very
To the processing of smaller circuit surface.
Summary of the invention
Shortcoming present in view of the above technology, the invention discloses one kind to be applied to chemical gold-palladium gold plating on PCB
The chemical palladium solution of layer, which can satisfy good welding requirements, while be also applied for line width/line-spacing in 0.5mil/
In the even smaller circuit surface processing of 0.5mil or less.
To achieve the above object, the present invention provides a kind of chemical palladium solution applied to gold-palladium gold plate chemical on PCB, packet
Include main salt, complexant, reducing agent, stabilizer, pH buffer and surfactant, as unit of mass concentration, said components
Ratio are as follows:
Palladium concentration in main salt: 0.4-0.6g/L
Complexant: 0.1-30g/L
Reducing agent: 0.1-25g/L
Stabilizer: 1-150mg/L
PH buffer: 1-25g/L
Surfactant: 0.1-10mg/L
Remaining group is divided into pure water；
According to golden sump volume, and carry mixing pump；
The pure water for first adding 50% in golden slot, sequentially adds complexant, reducing agent, stabilizer during being stirred continuously
And surfactant, tank liquor pH is adjusted in the range of 7.0-7.8, pH buffer is then added, and is eventually adding main salt and constant volume
Form palladium solution.
Wherein, the obtained palladium layers flat appearance of the palladium solution is bright, on fine-line without plating, the hole of micropore and blind hole
Interior no plating leakage, route do not whiten, obscission；Plating 8-18 minutes, thickness of coating was between 3.0-5.0 μ inch, palladium solution
Stability reaches 5MTO or more, and 3M tape method binding force of cladding material is good；And palladium solution is suitable for line width/line-spacing in 0.5mil/
In the even smaller circuit surface processing of 0.5mil or less.
Wherein, the main salt is one of palladium chloride, four ammino palladium of dichloro, palladium sulfate or sulfate of ammoniac palladium or a variety of.
Wherein, the complexant are as follows: ethylenediamine, benzylamine, N- benzylmethylamine, 4- fluorin benzyl amine, N- methyl-1-naphthalene methylamine, chaff
One of amine is a variety of.
Wherein, the stabilizer is 7- (lignocaine) cumarin, Thiodiglycol acid, 2,2- bipyridyls, 2,3- dihydroxies
In base quinoxaline one of or it is a variety of.
Wherein, the reducing agent is hydroxylamine hydrochloride, hydroxyl sulfate, N, N- diethyl hydroxylamine, N, N- dibenzylhydroxylamine, N-
One of methyl hydroxylamine hydrochloride, methoxy amine hydrochlorate, O- benzyl hydroxylamine hydrochloride, PEARLITOL 25C are a variety of.
Wherein, the pH buffer is one of glycine, ammonium sulfate, ammonium chloride, ammonium acetate or a variety of.
Wherein, the surfactant be one of 4-butyl ammonium hydrogen sulfate, hexadecyltrimethylammonium hydrogensulphate or
It is a variety of.
The beneficial effects of the present invention are: compared with prior art, it is provided by the invention to be applied to chemical gold-palladium gold plating on PCB
The chemical palladium solution of layer, has the advantage that
1) the conduct main salt of palladium sulfate or sulfate of ammoniac palladium, the coordination system formed with complexant in this system are more steady
Fixed, the service life is longer for tank liquor；
2) appropriate level of complexant can control the deposition rate of palladium and the compactness of palladium layers well, while can obtain
The palladium layers excellent to ductility；
3) reducing agent used will not generate by-product phosphorus, boron, and the pure palladium layers of available densification, pure palladium layers are than phosphorus palladium layers
With more ductility, bending resistance is more preferably；Meanwhile the amount for adjusting reducing agent can control the deposition speed of palladium according to demand
Rate, fine and close palladium layers can also stop after multi-reflow, and substrate copper is migrated to layer gold；
4) stabilizer can control the generation of self-catalyzed reaction in palladium slot well, prevent palladium slot from occurring in use homogeneously
It is catalyzed and analyses slot, preferably guarantee the continual and steady progress of out-phase surface self-catalyzed reaction in tank liquor；
5) presence of pH buffer may insure palladium slot in service life, and the pH value of tank liquor maintains a dynamic equilibrium
In the range of, it is ensured that the stabilization of deposition rate, the quality of coating and tank liquor service life；
6) presence of surfactant can be the wetting of micropore in pcb board, blind hole, step groove, prevent pad, in hole,
Plating leakage in slot；
7) due to the difference of furling plating, layer gold is bigger compared with the difficulty of palladium heavy on nickel layer, and the heavy of thick palladium layers is realized in layer gold
Product, plating palladium liquid need to have reproducibility.Meanwhile in layer gold depositing Pd compared with depositing Pd on nickel layer its compactness to coating, binding force
And deposition rate requirement is also different；
8) palladium solution used is suitable for IC support plate, wafer level packaging, printed circuit board, flexible electrical in gold-palladium gold process of the present invention
In road plate or rigid-flex combined board；
10) present invention had not only met good welding requirements, but be applicable in line width/line-spacing 0.5mil/0.5mil or less even
Smaller circuit surface processing, the present invention can fully meet the promotion of precise circuit, HDI plate upper surface processing technique ability；
In gold-palladium gold process, to meet alloy good binding force layer by layer, intermediate palladium layers are deposited in the form of reduction reaction；
The palladium layers of deposition are pure palladium layers, and the by-products such as not phosphorous, boron extend, and more preferably, gold-palladium gold bending resistance is even more bending performance
Better than common soft board nickel gold plate and NiPdAu coating；Meanwhile plate palladium liquid using sulfuric acid type main salt can obtain it is stable
Coordination palladium ion system can reduce attack of the plating palladium liquid to solder mask again.
Detailed description of the invention
Fig. 1 is expression figure of the palladium liquid in plating speed and coating stability in embodiment 1；
Fig. 2 is expression figure of the palladium liquid in plating speed and coating stability in embodiment 2；
Fig. 3 is expression figure of the palladium liquid in plating speed and coating stability in embodiment 3；
Fig. 4 is expression figure of the palladium liquid in plating speed and coating stability in embodiment 4；
Fig. 5 is expression figure of the palladium liquid in plating speed and coating stability in embodiment 5；
Fig. 6 is expression figure of the palladium liquid in plating speed and coating stability in comparative example 1；
Fig. 7 is expression figure of the palladium liquid in plating speed and coating stability in comparative example 2.
Specific embodiment
In order to more clearly state the present invention, the present invention is further described below with reference to example.
The present invention provides a kind of chemical palladium solution applied to gold-palladium gold plate chemical on PCB, including main salt, complexant,
Reducing agent, stabilizer, pH buffer and surfactant, for configuring 1L slot allocation, as unit of mass concentration, said components
Ratio are as follows:
Palladium concentration in main salt: 0.4-0.6g/L
Complexant: 0.1-30g/L
Reducing agent: 0.1-25g/L
Stabilizer: 1-150mg/L
PH buffer: 1-25g/L
Surfactant: 0.1-10mg/L
Remaining group is divided into pure water；
According to golden sump volume, and carry mixing pump；Here mainly determine that the palladium needed to configure is molten with the volume of golden slot
The solvent of liquid.
In golden slot first plus 50% water, be once added during being stirred continuously complexant, reducing agent, stabilizer and
PH is adjusted after surfactant in the range of 7.0-7.8, and pH buffer is then added, is eventually adding main salt constant volume 1L and is formed
Palladium solution.
Compared to the prior art, the chemical palladium solution provided by the invention applied to gold-palladium gold plate chemical on PCB, has
Following advantage:
1) the conduct main salt of palladium sulfate or sulfate of ammoniac palladium, the coordination system formed with complexant in this system are more steady
Fixed, the service life is longer for tank liquor；
2) appropriate level of complexant can control the deposition rate of palladium and the compactness of palladium layers well, while can obtain
The palladium layers excellent to ductility；
3) reducing agent used will not generate by-product phosphorus, the pure palladium layers of available densification, and pure palladium layers have than phosphorus palladium layers
There is more ductility, bending resistance is more preferably；Meanwhile the amount for adjusting reducing agent can control the deposition rate of palladium according to demand,
Fine and close palladium layers can also stop after multi-reflow, and substrate copper is migrated to layer gold；
4) stabilizer can control the generation of self-catalyzed reaction in palladium slot well, prevent palladium slot from occurring in use homogeneously
It is catalyzed and analyses slot, preferably guarantee the continual and steady progress of out-phase surface self-catalyzed reaction in tank liquor；
5) presence of pH buffer may insure palladium slot in service life, and the pH value of tank liquor maintains a dynamic equilibrium
In the range of, it is ensured that the stabilization of deposition rate, the quality of coating and tank liquor service life；
6) presence of surfactant can be the wetting of micropore in pcb board, blind hole, step groove, prevent pad, in hole,
Plating leakage in slot；
7) due to the difference of furling plating, layer gold is bigger compared with the difficulty of palladium heavy on nickel layer, and the heavy of thick palladium layers is realized in layer gold
Product, plating palladium liquid need to have reproducibility.Meanwhile in layer gold depositing Pd compared with depositing Pd on nickel layer its compactness to coating, binding force
And deposition rate requirement is also different；
8) palladium solution used is suitable for IC support plate, wafer level packaging, printed circuit board, flexible electrical in gold-palladium gold process of the present invention
In road plate or rigid-flex combined board；
10) present invention had not only met good welding requirements, but be applicable in line width/line-spacing 0.5mil/0.5mil or less even
Smaller circuit surface processing, the present invention can fully meet the promotion of precise circuit, HDI plate upper surface processing technique ability；
In gold-palladium gold process, to meet alloy good binding force layer by layer, intermediate palladium layers are deposited in the form of reduction reaction；
The palladium layers of deposition are pure palladium layers, and the by-products such as not phosphorous, boron extend, and more preferably, gold-palladium gold bending resistance is even more bending performance
Better than common soft board nickel gold plate and NiPdAu coating；Meanwhile plate palladium liquid using sulfuric acid type main salt can obtain it is stable
Coordination palladium ion system can reduce attack of the plating palladium liquid to solder mask again；
11) the technology of the present invention solves in Copper base material in porpezite process of surface treatment, and in multi-reflow postwelding, copper ion is easy
It migrates across palladium layers to layer gold, leads to later period failure welding problem；After solution single, double surface FPC develops toward the direction HDI, finely
The plating problem in surface treatment of route (1.5mil/1.5mil and line width below and line-spacing), can be used for more tiny weldering
The bonding of disk；It solves to be also easy to produce crack problem after common FPC surface treatment is repeatedly bent.
In the present embodiment, the obtained palladium layers flat appearance of the palladium solution is bright, on fine-line without plating, micropore and
Without plating leakage in the hole of blind hole, route do not whiten, obscission, plating 8-18 minutes, thickness of coating be 3.0-5.0 μ inch it
Between, palladium stability of solution reaches 5MTO, and 3M tape method binding force of cladding material is good；And palladium solution is suitble to fine-line；And this is fine
Route is 1.5mil or 1.5mil line width below and line-spacing, this illustrates that palladium solution is suitble to fine-line；The palladium solution uses
Temperature be 40-60 DEG C, pH control in 7.0-7.8.
In the present embodiment, the main salt be one of palladium chloride, four ammino palladium of dichloro, palladium sulfate or sulfate of ammoniac palladium or
A variety of, palladium concentration is (with Pd2+Meter) it is 0.4-0.6g/L.
In the present embodiment, the complexant are as follows: ethylenediamine, benzylamine, N- benzylmethylamine, 4- fluorin benzyl amine, N- methyl-1-naphthalene
One of methylamine, chaff amine are a variety of.Wherein when single use, ethylenediamine: 1-15g/L, benzylamine: 1-10g/L；4- fluorin benzyl amine:
0.1-2g/L, chaff amine: 0.1-5g/L.It then illustrates, if only select a kind of among these respectively, the concentration of selection is above-mentioned mention
Out, if a variety of collocation use, with equivalent effect.
In the present embodiment, the stabilizer be 7- (lignocaine) cumarin, Thiodiglycol acid, 2,2- bipyridyls,
In 2,3- dihydroxy quinoxalines one of or it is a variety of.Wherein when single use, 7- (lignocaine) cumarin: 1-50mg/
L, Thiodiglycol acid: 1-100mg/L, if a variety of collocation use, with equivalent effect.
In the present embodiment, the reducing agent is hydroxylamine hydrochloride, hydroxyl sulfate, N, N- diethyl hydroxylamine, N, N- dibenzyl
One of hydroxylamine, N- methyl hydroxylamine hydrochloride, methoxy amine hydrochlorate, O- benzyl hydroxylamine hydrochloride, PEARLITOL 25C are more
Kind.Wherein when single use, hydroxyl sulfate: 0.1-10g/L, N, N- diethyl hydroxylamine: 0.1-10g/L, PEARLITOL 25C: 0.1-
5g/L, if a variety of collocation use, with equivalent effect.
In the present embodiment, the pH buffer is one of glycine, ammonium sulfate, ammonium chloride, ammonium acetate or a variety of.
Wherein when single use, glycine: 1-10g/L, ammonium sulfate 1-15g/L, if a variety of collocation use, with equivalent effect.
In the present embodiment, the surfactant is 4-butyl ammonium hydrogen sulfate, in hexadecyltrimethylammonium hydrogensulphate
It is one or more, wherein when single use, 4-butyl ammonium hydrogen sulfate 0.1-2mg/L；Hexadecyltrimethylammonium hydrogensulphate:
0.1-5mg/L, if a variety of collocation use, with equivalent effect.
The present invention obtains Au-Pd-Au coating on copper base by the following method.
Oil removing cleaning (55-60 DEG C, 5 minutes) → hot water wash (55-60 DEG C, 1-2 minutes) → pure water washes I (room temperature, 1 minute)
→ microetch (potassium peroxydisulfate 80g/L, sulfuric acid 30mL/L, 2-3 minutes) → pure water washes II (room temperature, 1 minute) → preimpregnation (sulfuric acid
20mL/L, room, 1 minute) (the matched golden slot liquid medicine of gold-palladium gold process, pH are 6.2~6.8,84-90 DEG C, 1-3 to → chemistry leaching gold
Minute) → rear leaching (leaching liquid medicine, pH are 3.0~4.0, room temperature, 1 minute after gold-palladium gold process is matched) → pure water wash III (room temperature,
1 minute) → pure water wash IV (room temperature, 1 minute) → chemical palladium-plating (use in the present invention embodiment plating palladium formula of liquid, pH for 7.0~
7.8,40~60 DEG C, 8-18 minutes) → pure water washes V (room temperature, 1 minute) → pure water and washes VI (room temperature, 1 minute) → pure water and wash VII
(the matched golden slot liquid medicine of our company gold-palladium gold process, pH are 6.2~6.8,84-90 DEG C, 10- to (room temperature, 1 minute) → chemistry leaching gold
15 minutes) → hot water wash (70-80 DEG C, 1 minute) → pure water washes VIII (room temperature, 1 minute) → drying.
By following specific embodiment, the present invention will be described:
Embodiment 1:
Palladium sulfate is (with Pd2+Meter): 0.3g/L, ethylenediamine: 5g/L, 4- fluorin benzyl amine: 2g/L, hydroxyl sulfate: 3g/L, 7- (two
Ethylamino) cumarin: 15mg/L, glycine: 5g/L, ammonium sulfate: 8g/L, 4-butyl ammonium hydrogen sulfate: 2mg/L temperature: 60 DEG C, pH
7.5。
Resulting palladium layers flat appearance is bright under the above parameter, on fine-line without plating, without plating leakage in micro-, hole,
Phenomena such as route does not whiten, falls off, thickness of coating are 4.3 μ inch (plating 15 minutes), and it is (right that Stability of Bath Solution reaches 6MTO
Copper base plating palladium carries out circulation experiment, in building the plating solution situation that slot palladium concentration is 0.3g/L, by the palladium analysis of 0.3g/L to base
It is referred to as 1MTO on plate), 3M tape method binding force of cladding material is good.Meanwhile after the test of coating bending resistance, 100 times of amplification is not seen
Observe obvious crackle；Scolding tin test, pad wetting is good, and upper tin is full；Bonding function admirable, gold thread tensile test up to 10g with
On.
Embodiment 2:
Sulfate of ammoniac palladium is (with Pd2+Meter): 0.6g/L, ethylenediamine: 10g/L, benzylamine: 1g/L, N, N- diethyl hydroxylamine: 10g/L,
7- (lignocaine) cumarin: 50mg/L, glycine: 1g/L, ammonium sulfate: 4g/L, 4-butyl ammonium hydrogen sulfate: 0.1mg/L temperature:
40 DEG C, pH 7.0
Resulting palladium layers flat appearance is bright under the above parameter, on fine-line without plating, without plating leakage in micro-, hole,
Phenomena such as route does not whiten, falls off, thickness of coating are 3.2 μ inch (plating 10 minutes), and Stability of Bath Solution reaches 6MTO, 3M
Tape method binding force of cladding material is good.Meanwhile after the test of coating bending resistance, obvious crackle is not observed in 100 times of amplification；Scolding tin is surveyed
Examination, pad wetting is good, and upper tin is full；Bonding function admirable, gold thread tensile test reach 10g or more.
Embodiment 3:
Sulfate of ammoniac palladium is (with Pd2+Meter): 0.4g/L, chaff amine: 5g/L, benzylamine: 10g/L, PEARLITOL 25C: 2g/L, thio two is sweet
Alkyd: 100mg/L, glycine: 3g/L, ammonium sulfate: 15g/L, hexadecyltrimethylammonium hydrogensulphate: 5mg/L temperature: 50 DEG C,
pH 7.2
Resulting palladium layers flat appearance is bright under the above parameter, on fine-line without plating, without plating leakage in micro-, hole,
Phenomena such as route does not whiten, falls off, thickness of coating are 4.6 μ inch (plating 15 minutes), and Stability of Bath Solution reaches 5.5MTO,
3M tape method binding force of cladding material is good.Meanwhile after the bending resistance of coating, obvious crackle is not observed in 100 times of amplification；Scolding tin is surveyed
Examination, pad wetting is good, and upper tin is full；Bonding function admirable, gold thread tensile test reach 10g or more.
Embodiment 4:
Palladium sulfate is (with Pd2+Meter): 0.5g/L, ethylenediamine: 5g/L, 4- fluorin benzyl amine: 2g/L, N, N- diethyl hydroxylamine: 3g/L,
7- (lignocaine) cumarin: 15mg/L, glycine: 5g/L, ammonium sulfate:
8g/L, 4-butyl ammonium hydrogen sulfate: 2mg/L temperature: 40 DEG C, pH 7.5
Resulting palladium layers flat appearance is bright under the above parameter, on fine-line without plating, without plating leakage in micro-, hole,
Phenomena such as route does not whiten, falls off, thickness of coating are 3.0 μ inch (plating 8 minutes), and Stability of Bath Solution reaches 5MTO, 3M glue
Band method binding force of cladding material is good.Meanwhile after the bending resistance of coating, obvious crackle is not observed in 100 times of amplification；Scolding tin test,
Pad wetting is good, and upper tin is full；Bonding function admirable, gold thread tensile test reach 10g or more.
Embodiment 5:
Sulfate of ammoniac palladium is (with Pd2+Meter): 0.3g/L, ethylenediamine: 2g/L, 4- fluorin benzyl amine: 2g/L, chaff amine: 3g/L, sulfuric acid hydroxyl
Amine: 10g/L, 7- (lignocaine) cumarin: 15mg/L, glycine: 5g/L, ammonium sulfate: 8g/L, 4-butyl ammonium hydrogen sulfate:
2mg/L temperature: 60 DEG C, pH 7.8
Resulting palladium layers flat appearance is bright under the above parameter, on fine-line without plating, without plating leakage in micro-, hole,
Phenomena such as route does not whiten, falls off, thickness of coating are 5.0 μ inch (plating 18 minutes), and Stability of Bath Solution reaches 6MTO, 3M
Tape method binding force of cladding material is good.Meanwhile after the bending resistance of coating, obvious crackle is not observed in 100 times of amplification；Scolding tin is surveyed
Examination, pad wetting is good, and upper tin is full；Bonding function admirable, gold thread tensile test reach 10g or more.
Comparative example 1:
Sulfuric acid tetramine palladium is (with Pd2+Meter): 2.5g/L
Main complexing agent: ammonium hydroxide 30mL/L, malic acid 20g/L；
Auxiliary complex-former: succinic acid 1g/L, sodium potassium tartrate tetrahydrate 12g/L；
Reducing agent: formic acid 10g/L；
Stabilizer: bismuth nitrate 0.1g/L；
PH buffer: borax 15g/L；
Surfactant: nothing；
Plating conditions: temperature: 60 DEG C；PH:6.5；
Plating palladium liquid in NiPdAu technique is prepared using the above parameter for the palladium layers in gold-palladium gold process, although test board
Without plating leakage in micro-, hole, phenomena such as route does not fall off, but test board pad appearance is dim, and there are obvious color difference, essences for pad
Also there is slight plating in fine rule road, plating 15 minutes, thickness of coating was 1.4 μ inch, extended plating time, and the growth of palladium thickness is slack-off,
The palladium thickness for depositing 5.0 μ inch at least needs 45 minutes.Meanwhile Stability of Bath Solution can only accomplish 3MTO, 3M adhesive tape in senile experiment
Method binding force of cladding material occurs getting rid of palladium phenomenon.
Comparative example 2:
Palladium sulfate is (with Pd2+Meter): 1.2g/L；
Complexing agent: ethylenediamine 10g/L, glycine 10g/L；Triethanolamine 3g/L
Reducing agent: sodium hypophosphite 5g/L；
Stabilizer: thiocarbamide 0.2g/L；
PH buffer: potassium dihydrogen phosphate 20g/L；
Surfactant: nothing；
Plating conditions: temperature: 60 DEG C；PH:7.0.
Plating palladium liquid in NiPdAu technique is prepared using the above parameter for the palladium layers in gold-palladium gold process, test board palladium layers
Flat appearance is bright, has serious plating in micro-, blind hole without plating leakage, but on fine-line, and whitening occurs in route, pad color difference is serious
Phenomena such as, plating 10 minutes, thickness of coating was 1.3 μ inch, extended plating time, and the growth of palladium thickness is slack-off, 5.0 μ inch's of deposition
Palladium thickness at least needs 35 minutes.Meanwhile in senile experiment, bath life can only achieve 4MTO, and 3M tape method binding force of cladding material goes out
Palladium, test resistant to bending are now seriously got rid of, apparent crackle occurs in coating.
In conjunction with above embodiments 1-5's and comparative example 1,2 result and figure, it will thus be seen that comparative example 1,2 plates palladium liquid and exists
Obviously poorer than plating palladium liquid provided by the invention in terms of plating speed and coating stability, especially comparative example 1 and 2 is unable to satisfy gold-palladium gold
To the demand of fine-line in technique, the plating palladium liquid of comparative example 1 and 2 is in line width 0.5mil, the fine-line of line-spacing 0.8mil
There are apparent platings.Plating palladium formula palladium deposition rate of the invention is moderate, and stability is good, generally can achieve 5MTO or more,
And can get surfacing, bright dense palladium coating, especially there is good welding, bonding and fine pattern transfer performance,
It is able to satisfy the demand of gold-palladium gold product of new generation.
Disclosed above is only several specific embodiments of the invention, but the present invention is not limited to this, any ability
What the technical staff in domain can think variation should all fall into protection scope of the present invention.
Claims (8)
1. a kind of chemical palladium solution applied to gold-palladium gold plate chemical on PCB, which is characterized in that including main salt, complexant, go back
Former agent, stabilizer, pH buffer and surfactant, as unit of mass concentration, the ratio of said components are as follows:
Palladium concentration in main salt: 0.4-0.6g/L
Complexant: 0.1-30g/L
Reducing agent: 0.1-25g/L
Stabilizer: 1-150mg/L
PH buffer: 1-25g/L
Surfactant: 0.1-10mg/L
Remaining group is divided into pure water；
According to golden sump volume, and carry mixing pump；
The pure water for first adding 50% in golden slot, sequentially adds complexant, reducing agent, stabilizer and table during being stirred continuously
Face activating agent adjusts tank liquor pH in the range of 7.0-7.8, pH buffer is then added, is eventually adding main salt and isochoric formation
Palladium solution.
2. the chemical palladium solution according to claim 1 applied to gold-palladium gold plate chemical on PCB, which is characterized in that should
The obtained palladium layers flat appearance of palladium solution is bright, on fine-line without plating, without plating leakage in the hole of micropore and blind hole, route does not have
Have whiten, obscission, plating 8-18 minutes, for thickness of coating between 3.0-5.0 μ inch, palladium stability of solution reached 5MTO,
3M tape method binding force of cladding material is good；And palladium solution is suitable for line width/line-spacing in 0.5mil/0.5mil or less even smaller line
In road surfaces processing.
3. the chemical palladium solution according to claim 1 applied to gold-palladium gold plate chemical on PCB, which is characterized in that institute
Stating main salt is one of palladium chloride, four ammino palladium of dichloro, palladium sulfate or sulfate of ammoniac palladium or a variety of.
4. the chemical palladium solution according to claim 1 applied to gold-palladium gold plate chemical on PCB, which is characterized in that institute
State complexant are as follows: one of ethylenediamine, benzylamine, N- benzylmethylamine, 4- fluorin benzyl amine, N- methyl-1-naphthalene methylamine, chaff amine are more
Kind.
5. the chemical palladium solution according to claim 1 applied to gold-palladium gold plate chemical on PCB, which is characterized in that institute
Stating stabilizer is 7- (lignocaine) cumarin, Thiodiglycol acid, 2,2- bipyridyls, in 2,3- dihydroxy quinoxalines in
It is one or more.
6. the chemical palladium solution according to claim 1 applied to gold-palladium gold plate chemical on PCB, which is characterized in that institute
State reducing agent be hydroxylamine hydrochloride, hydroxyl sulfate, N, N- diethyl hydroxylamine, N, N- dibenzylhydroxylamine, N- methyl hydroxylamine hydrochloride,
One of methoxy amine hydrochlorate, O- benzyl hydroxylamine hydrochloride, PEARLITOL 25C are a variety of.
7. the chemical palladium solution according to claim 1 applied to gold-palladium gold plate chemical on PCB, which is characterized in that institute
Stating pH buffer is one of glycine, ammonium sulfate, ammonium chloride, ammonium acetate or a variety of.
8. the chemical palladium solution according to claim 1 applied to gold-palladium gold plate chemical on PCB, which is characterized in that institute
Stating surfactant is one of 4-butyl ammonium hydrogen sulfate, hexadecyltrimethylammonium hydrogensulphate or a variety of.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110983305A (en) * | 2019-12-19 | 2020-04-10 | 广东东硕科技有限公司 | Application of quaternary ammonium salt compound in preparation of composition for inhibiting chemical plating and diffusion plating and preparation method of metal layer |
| CN112609172A (en) * | 2020-11-30 | 2021-04-06 | 江苏矽智半导体科技有限公司 | Chemical palladium plating solution for wafer packaging field and preparation method thereof |
| CN114245602A (en) * | 2021-12-22 | 2022-03-25 | 江苏本川智能电路科技股份有限公司 | Method for manufacturing electroplated tin layer capable of being welded |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104498918A (en) * | 2014-11-28 | 2015-04-08 | 广东致卓精密金属科技有限公司 | Chemical palladium plating solution for intermediate layer of chemical nickel, palladium and gold plating process |
-
2019
- 2019-07-26 CN CN201910685004.0A patent/CN110318047B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104498918A (en) * | 2014-11-28 | 2015-04-08 | 广东致卓精密金属科技有限公司 | Chemical palladium plating solution for intermediate layer of chemical nickel, palladium and gold plating process |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110983305A (en) * | 2019-12-19 | 2020-04-10 | 广东东硕科技有限公司 | Application of quaternary ammonium salt compound in preparation of composition for inhibiting chemical plating and diffusion plating and preparation method of metal layer |
| CN112609172A (en) * | 2020-11-30 | 2021-04-06 | 江苏矽智半导体科技有限公司 | Chemical palladium plating solution for wafer packaging field and preparation method thereof |
| CN114245602A (en) * | 2021-12-22 | 2022-03-25 | 江苏本川智能电路科技股份有限公司 | Method for manufacturing electroplated tin layer capable of being welded |
| CN114245602B (en) * | 2021-12-22 | 2024-04-05 | 江苏本川智能电路科技股份有限公司 | Weldable manufacturing method of electroplated tin layer |
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