CN110312376A - A kind of whole hole technique of strength oil removing for printed wiring board hole metallization - Google Patents
A kind of whole hole technique of strength oil removing for printed wiring board hole metallization Download PDFInfo
- Publication number
- CN110312376A CN110312376A CN201910603721.4A CN201910603721A CN110312376A CN 110312376 A CN110312376 A CN 110312376A CN 201910603721 A CN201910603721 A CN 201910603721A CN 110312376 A CN110312376 A CN 110312376A
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- China
- Prior art keywords
- oil removing
- whole hole
- hole
- whole
- wiring board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a kind of whole hole techniques of the strength oil removing for printed wiring board hole metallization, including first cleaning up the whole hole slot of the oil removing of hole metallization production line with tap water；Continue to use deionized water wash cycles, exhausts ejected wash water；The whole hole solution of oil removing is added into the cleaned whole hole slot of oil removing；Start cycle filter pump, oil removing whole hole slot of the heating added with the whole hole solution of oil removing is to 55-65 DEG C；Printed wiring board to hole metallization is put into the whole hole slot of heated oil removing, is handled 5-6 minutes；Treated printed wiring board is taken out, tap water is cleaned up, after the subsequent or even electroless copper process for completing hole metallization, cleaned up, 70-80 DEG C of hot blast drying, to be transferred to full plate plating copper process.The present invention had not only improved the binding force of chemical plating copper layer and hole wall, but also reduced the palladium content in catalytic liquid colloid palladium, improves product quality, reduces the production cost of printed wiring board hole metallization.
Description
Technical field
The invention belongs to printed wiring board processing technique fields, specifically, being related to a kind of for printed wiring plate hole gold
The whole hole technique of the strength oil removing of categoryization (PTH).
Background technique
Printed wiring board hole metallization, although there is the techniques such as " black holes " " shadow " and " Organic Conductive Films " at present.But it reflects
It is still with electroless copper for its mainstream, the critical process of electroless copper is in the stability and reliability of the quality of technique
Hole wall negatively charged after drilling is specifically adjusted to positively charged by the whole hole of oil removing, in favor of catalysis by the whole hole of oil removing
The attachment of colloid palladium.There are following quality hidden danger for the whole hole technique of oil removing at present: 1) since the whole hole dynamics of oil removing is not (i.e. electrically
Adjusted weak), when often result in the backlight bad quality hidden danger of electroless copper (because adsoption catalysis colloid palladium is less)；2) due to removing
The whole hole dynamics of oil is insufficient (electrically adjusting weak), when often result in the undesirable quality defect of binding force of electroless copper and hole wall
(because adsoption catalysis colloid palladium in conjunction with hole wall loosely)；3) since the whole hole dynamics of oil removing is insufficient (electrically adjusting weak), it is
This deficiency is made up, the concentration of the catalysis colloid palladium of electroless copper must control in higher level, cause so a large amount of expensive
The waste of heavy metal palladium, high production cost, while also difficulty, quality problem (colloid at present easy to breed are brought to subsequent dispergation
The concentration of palladium is in 40-80ppm in palladium).
It follows that the oil removing whole hole technique of electroless copper at present, has seriously affected the quality and product of product
Reliability.The a large amount of waste production costs for also resulting in precious metal palladium simultaneously can be in any more, therefore it is whole to solve electroless copper oil removing
Hole is excessively weak, promotes quality, reduces cost, and there is an urgent need to a kind of new whole hole techniques of strength oil removing to replace.
Summary of the invention
The shortcoming of the whole hole technique of strength oil removing in order to solve above-mentioned hole metallization (PTH), the purpose of the present invention exist
It is a kind of for high-quality performance, high reliability, the strength oil removing of inexpensive printed wiring board hole metallization (PTH) in providing
Whole hole new process improves the binding force between hole metallization copper and hole wall to improve the backlight series of hole metallization, with drop
Low catalysis colloid palladium concentration, to realize reduction production cost.
To achieve the goals above, the present invention provides a kind of strengths for printed wiring board hole metallization (PTH) to remove
1) the whole hole technique of oil, the whole hole technique of strength oil removing include the following steps: first by the whole hole slot of the oil removing of hole metallization production line
It is cleaned with tap water dry；2) continue to use deionized water wash cycles, exhaust ejected wash water；3) oil removing cleaned into step 2)
The whole hole solution of oil removing is added in whole hole slot, the whole hole solution of oil removing includes deionized water, triethanolamine, N- crassitude
Ketone, ethylene glycol monobutyl ether, sodium hydroxide and cupric sulfate pentahydrate；4) start cycle filter pump, heating stepses 3) in be added with oil removing
The whole hole slot of the oil removing of whole hole solution is to 55-65 DEG C；5) printed wiring board to hole metallization is put into heated in step 4)
In the whole hole slot of oil removing, handle 5-6 minutes；With 6) take out treated printed wiring board, tap water cleans up, and completes Kong Jin
It after the subsequent or even electroless copper process of categoryization, cleans up, 70-80 DEG C of hot blast drying, to be transferred to full plate plating copper process.
As the further explanation to the whole hole technique of strength oil removing of the present invention, it is preferable that the whole Kong Rong of oil removing
Liquid is composed of the following components: 0.5-1.5wt% triethanolamine, 1-10wt%N- methyl pyrrolidone, 1.0-5.0wt% second two
The only butyl ether of alcohol, 5-15wt% sodium hydroxide and 0.01-0.08wt% cupric sulfate pentahydrate.
As the further explanation to the whole hole technique of strength oil removing of the present invention, it is preferable that the whole Kong Rong of oil removing
The alkali equivalent concentration of liquid: 3.5-4.5N, specific gravity 1.06-1.10g/cm3。
As the further explanation to the whole hole technique of strength oil removing of the present invention, it is preferable that described in step 2)
The time of deionized water cleaning is 30 minutes.
As the further explanation to the whole hole technique of strength oil removing of the present invention, it is preferable that in step 6), take out
After treated printed wiring board, washing time is 1-2 minutes, and washing temperature is room temperature.
As the further explanation to the whole hole technique of strength oil removing of the present invention, it is preferable that in step 7), hot wind
The time of drying is 5-10 minutes.
The whole hole new process of the strength oil removing of printed wiring board hole metallization of the invention has the advantages that (1) is adopted
After the whole hole new process of strength oil removing, since because the electrical property of drilling has obtained strength adjustment, (hole wall after drilling presents negative hole wall
Charge, whole hole are to be changed to be adjusted to positive charge, so that negatively charged catalytic palladium colloid adheres to) improve chemical plating
Binding force between layers of copper and hole wall, so as to avoid hole copper with hole wall after thermal shock due to separate；(2) whole using strength oil removing
After the new process of hole, is adjusted since hole wall has electrically obtained strength, be more conducive to the absorption of catalysis colloid palladium, improve chemistry
Copper-plated backlight series, so as to avoid the Kong Wutong phenomenon occurred by electroless copper；(3) the whole Kong Xin of strength oil removing is used
It after technique, is adjusted since hole wall electrically obtains strength, so that adsoption catalysis colloid palladium becomes very easy, therefore, is catalyzed glue
The concentration of body can be down to (6- in the state of ensuring quality with the concentration that sharp fall is catalyzed palladium in colloid
Original 1/7-1/10 10ppm) is reduced, to save noble metal, reduces cost；(4) raw material sources are wide, it is cheap, at
This is low, and production process is pollution-free, is with a wide range of applications in printed wiring board field.
Specific embodiment
It is detailed now in conjunction with appended preferred embodiment in order to further appreciate that structure of the invention, feature and other purposes
It is carefully described as follows, the embodiment of the present invention is only used to illustrate the technical scheme of the present invention, and the non-limiting present invention.
Embodiment 1
Prepare the whole hole solution of oil removing: triethanolamine: 0.5wt%, N-Methyl pyrrolidone: 3wt%, ethylene glycol monobutyl ether:
2wt%, sodium hydroxide: 6wt%, cupric sulfate pentahydrate: 0.03wt%；Alkali equivalent concentration: 3.5-4.5N, specific gravity 1.06g/
cm3。
The present invention according to following processing step by the whole hole solution of prepared oil removing to the printed wiring board of hole metallization into
Row copper facing, the specific steps are as follows: 1) first clean up the whole hole slot of the oil removing of hole metallization production line with tap water；2) continue
With deionized water wash cycles, ejected wash water is exhausted；3) the whole Kong Rong of oil removing is added in the whole hole slot of the oil removing cleaned into step 2)
Liquid；4) start cycle filter pump, heating stepses 3) in added with the whole hole solution of oil removing the whole hole slot of oil removing to 55 DEG C；It 5) will be to
The printed wiring board of hole metallization is put into the whole hole slot of oil removing heated in step 4), is handled 5 minutes；It is handled with 6) taking-up
Printed wiring board afterwards, tap water clean up, and after the subsequent or even electroless copper process for completing hole metallization, clean up,
70 DEG C of hot blast dryings, to be transferred to full plate plating copper process.
According to above-mentioned steps, after the whole hole process of strength oil removing and hole metallization (PTH) printed wiring board,
Backlight is improved largely, and the concentration for being catalyzed colloid palladium has sharp fall on the basis of ensuring quality, after copper facing,
The ability that hole wall copper bears thermal shock increases substantially.Specific data please refer to table 1, and table 1 lists the whole Kong Xingong of strength oil removing
Skill treated plate, the quality of thermal shock shows relevant parameter after the backlight series and electro-coppering after hole metallization.
Table 1
Remarks: 1, the palladium content of colloid palladium is only 6.7ppm, and after common oil removing whole hole processing, the palladium content of colloid palladium
Usual 40-80ppm, 2, general thermal shock be 288 DEG C, 10S/3 times.
In terms of experimental data, colloid palladium concentration drop very low situation, backlight still show it is very outstanding, and
And although the thermal shock number after copper facing improves, but and non-porous copper segregation phenomenon and hole copper phenomenon of rupture, meet product product
The promotion of matter and the reliability of product, and reduce costs, save precious metal palladium.
Embodiment 2
Prepare the whole hole solution of oil removing: triethanolamine: the only fourth of 1.5wt%, N-Methyl pyrrolidone: 10wt%, ethylene glycol
Ether: 5.0wt%, sodium hydroxide: 15wt%, cupric sulfate pentahydrate: 0.08wt%.The whole hole liquid alkaline equivalent concentration of strength oil removing: 3.5-
4.5N, specific gravity: 1.10g/cm3。
The present invention according to following processing step by the whole hole solution of prepared oil removing to the printed wiring board of hole metallization into
Row copper facing, the specific steps are as follows: 1) first clean up the whole hole slot of the oil removing of hole metallization production line with tap water；2) continue
With deionized water wash cycles, ejected wash water is exhausted；3) the whole Kong Rong of oil removing is added in the whole hole slot of the oil removing cleaned into step 2)
Liquid；4) start cycle filter pump, heating stepses 3) in added with the whole hole solution of oil removing the whole hole slot of oil removing to 65 DEG C；It 5) will be to
The printed wiring board of hole metallization is put into the whole hole slot of oil removing heated in step 4), is handled 6 minutes；It is handled with 6) taking-up
Printed wiring board afterwards, tap water clean up, and after the subsequent or even electroless copper process for completing hole metallization, clean up,
80 DEG C of hot blast dryings, to be transferred to full plate plating copper process.
According to above-mentioned steps, after the whole hole new_type treatment of strength oil removing and hole metallization (PTH) printed wiring
Plate, backlight are improved largely, and the concentration for being catalyzed colloid palladium has sharp fall on the basis of ensuring quality, by copper facing
Afterwards, the ability that hole wall copper bears thermal shock increases substantially.Specific data please refer to table 2, and table 2 lists the whole hole of strength oil removing
Plate after new industrial treatment, the quality of thermal shock shows relevant parameter after the backlight series and electro-coppering after hole metallization.
Table 2
Remarks: 1, the palladium content of colloid palladium is only 6.7ppm, and after common oil removing whole hole processing, the palladium content of colloid palladium is logical
Normal 40-80ppm, 2, general thermal shock be 288 DEG C, 10S/3 times.
In terms of experimental data, colloid palladium concentration drop very low situation, backlight still show it is very outstanding, and
And although the thermal shock number after copper facing improves, but and non-porous copper segregation phenomenon and hole copper phenomenon of rupture, meet product product
The promotion of matter and the reliability of product, and reduce costs, save precious metal palladium.
It is to be understood that foregoing invention content and specific embodiment are intended to prove technical solution provided by the present invention
Practical application, should not be construed as limiting the scope of the present invention.Those skilled in the art are in spirit and original of the invention
In reason, when can various modifications may be made, equivalent replacement or improvement.Protection scope of the present invention is subject to the appended claims.
Claims (6)
1. a kind of whole hole technique of strength oil removing for printed wiring board hole metallization, which is characterized in that the strength oil removing is whole
Hole technique includes the following steps:
1) first the whole hole slot of the oil removing of hole metallization production line is cleaned up with tap water；
2) continue to use deionized water wash cycles, exhaust ejected wash water；
3) be added the whole hole solution of oil removing in the whole hole slot of the oil removing cleaned into step 2), the whole hole solution of oil removing include go from
Sub- water, triethanolamine, N-Methyl pyrrolidone, ethylene glycol monobutyl ether, sodium hydroxide and cupric sulfate pentahydrate；
4) start cycle filter pump, heating stepses 3) in added with the whole hole solution of oil removing the whole hole slot of oil removing to 55-65 DEG C；
5) printed wiring board to hole metallization is put into the whole hole slot of oil removing heated in step 4), is handled 5-6 minutes；With
6) treated printed wiring board is taken out, tap water cleans up, and completes the subsequent or even chemical plating coppersmith of hole metallization
It after sequence, cleans up, 70-80 DEG C of hot blast drying, to be transferred to full plate plating copper process.
2. the whole hole technique of strength oil removing according to claim 1, which is characterized in that the whole hole solution of oil removing is by with the following group
It is grouped as: 0.5-1.5wt% triethanolamine, 1-10wt%N- methyl pyrrolidone, 1.0-5.0wt% ethylene glycol monobutyl ether, 5-
15wt% sodium hydroxide and 0.01-0.08wt% cupric sulfate pentahydrate.
3. the whole hole technique of strength oil removing according to claim 1 or 2, which is characterized in that the alkali of the whole hole solution of oil removing
Equivalent concentration: 3.5-4.5N, specific gravity 1.06-1.10g/cm3。
4. the whole hole technique of strength oil removing according to claim 1, which is characterized in that in step 2), the deionized water is clear
The time washed is 30 minutes.
5. the whole hole technique of strength oil removing according to claim 1, which is characterized in that in step 6), take out treated print
After wiring board processed, washing time is 1-2 minutes, and washing temperature is room temperature.
6. the whole hole technique of strength oil removing according to claim 1, which is characterized in that in step 7), the time of hot blast drying
It is 5-10 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910603721.4A CN110312376A (en) | 2019-07-05 | 2019-07-05 | A kind of whole hole technique of strength oil removing for printed wiring board hole metallization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910603721.4A CN110312376A (en) | 2019-07-05 | 2019-07-05 | A kind of whole hole technique of strength oil removing for printed wiring board hole metallization |
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| CN110312376A true CN110312376A (en) | 2019-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910603721.4A Pending CN110312376A (en) | 2019-07-05 | 2019-07-05 | A kind of whole hole technique of strength oil removing for printed wiring board hole metallization |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114845471A (en) * | 2022-07-04 | 2022-08-02 | 深圳市板明科技股份有限公司 | Oil removing and hole finishing method for PTH (plated through hole) process of printed circuit board, alkaline oil removing and hole finishing agent and preparation method thereof |
| CN115216117A (en) * | 2022-09-21 | 2022-10-21 | 深圳市板明科技股份有限公司 | Modified hole plugging resin for circuit board and preparation method thereof |
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| CN103789780A (en) * | 2014-02-26 | 2014-05-14 | 苏州禾川化学技术服务有限公司 | Alkaline general type deburring solution for IC (Integrated Circuit) element |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114845471A (en) * | 2022-07-04 | 2022-08-02 | 深圳市板明科技股份有限公司 | Oil removing and hole finishing method for PTH (plated through hole) process of printed circuit board, alkaline oil removing and hole finishing agent and preparation method thereof |
| CN114845471B (en) * | 2022-07-04 | 2022-09-27 | 深圳市板明科技股份有限公司 | Oil removing and hole finishing method for PTH (plated through hole) process of printed circuit board, alkaline oil removing and hole finishing agent and preparation method thereof |
| CN115216117A (en) * | 2022-09-21 | 2022-10-21 | 深圳市板明科技股份有限公司 | Modified hole plugging resin for circuit board and preparation method thereof |
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Application publication date: 20191008 |