CN111763934A - Cyanide-free chemical thick gold plating process for printed circuit board - Google Patents

Cyanide-free chemical thick gold plating process for printed circuit board Download PDF

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Publication number
CN111763934A
CN111763934A CN202010485277.3A CN202010485277A CN111763934A CN 111763934 A CN111763934 A CN 111763934A CN 202010485277 A CN202010485277 A CN 202010485277A CN 111763934 A CN111763934 A CN 111763934A
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Prior art keywords
gold plating
printed circuit
circuit board
cyanide
electroless
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CN202010485277.3A
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Chinese (zh)
Inventor
董先友
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Dongguan Standard Electronic Material Co ltd
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Dongguan Standard Electronic Material Co ltd
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Priority to CN202010485277.3A priority Critical patent/CN111763934A/en
Publication of CN111763934A publication Critical patent/CN111763934A/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention belongs to the technical field of printed circuit board processing, and particularly relates to a cyanide-free chemical thick gold plating process for a printed circuit board. The cyanide-free chemical thick gold plating process comprises the following steps: 1) cleaning the electroless gold plating tank; 2) adding cyanide-free chemical thick gold plating liquid medicine into the chemical gold plating groove; the electroless gold plating solution comprises NaAuCI4, Na2SO3, Na2S2O3, Na2B4O, thiourea, hydroquinone, EDTA, glutamic acid and glycine; 3) starting a circulating filter pump, and heating the electroless gold plating tank to 75-85 ℃; 4) placing the printed circuit board which is chemically plated with nickel and cleaned up into the chemical gold plating tank for soaking; 5) taking out the printed circuit board, cleaning the printed circuit board by using deionized water, and then cleaning the printed circuit board by using hot deionized water; 6) drying the printed circuit board by hot air; 7) and loading the printed circuit board into a shape processing procedure.

Description

Cyanide-free chemical thick gold plating process for printed circuit board
Technical Field
The invention belongs to the technical field of printed circuit board processing, and particularly relates to a cyanide-free chemical thick gold plating process for a printed circuit board.
Background
The chemical gold plating of the printed circuit board mostly adopts a displacement reaction, namely, gold replaces nickel, because the common chemical gold plating liquid has stronger attack to a nickel layer, the subsequent nickel corrosion is easily caused, and the welding performance and the welding reliability are seriously influenced, while the chemical deposited gold replacing the common chemical gold plating liquid has micro cyanogen content and has toxic action to the environment, so the cyanide-free chemical thick gold plating process is urgent for solving the nickel corrosion of the chemical plated nickel and gold, improving the welding performance and the welding reliability and reducing the toxicity of the chemical gold plating to the environment.
Therefore, it is necessary to provide a technical means to solve the above-mentioned drawbacks.
Disclosure of Invention
In order to solve the defects of the prior art, the invention aims to provide a cyanide-free chemical thick gold plating process for a printed circuit board. The cyanide-free chemical thick gold plating process is used for improving the welding performance of the printed circuit board and reducing the toxicity of cyanide to the environment due to the welding reliability.
In order to achieve the above object, the present invention provides a cyanide-free electroless thick gold plating process for a printed circuit board, which comprises the following steps:
1) cleaning the electroless gold plating tank;
2) adding cyanide-free chemical thick gold plating liquid medicine into the chemical gold plating groove; the electroless gold plating solution comprises NaAuCI4, Na2SO3, Na2S2O3, Na2B4O, thiourea, hydroquinone, EDTA, glutamic acid and glycine;
3) starting a circulating filter pump, and heating the electroless gold plating tank to 75-85 ℃;
4) placing the printed circuit board which is chemically plated with nickel and cleaned up into the chemical gold plating tank for soaking;
5) taking out the printed circuit board, cleaning the printed circuit board by using deionized water, and then cleaning the printed circuit board by using hot deionized water;
6) drying the printed circuit board by hot air;
7) and loading the printed circuit board into a shape processing procedure.
In a preferred embodiment, the step 1) includes the following steps: a) after the electroless gold plating bath solution is completely discharged, washing the bath solution clean by tap water; b) circularly cleaning with deionized water; c) and discharging residual liquid in the chemical gold plating groove again.
In a preferred embodiment, the time for the deionized water washing in step b) is 30 minutes.
In a preferred technical scheme, the NaAuCI4 is 0.1-0.5 wt%: na2SO3 of 0.2-0.8 wt%, Na2S2O3 of 1.5-6 wt%, Na2B4O of 0.15-0.75 wt%, thiourea of 0.01-0.06 wt%, hydroquinone of 0.005-0.025 wt%, EDTA of 1.0-4.0 wt%, glutamic acid of 0.03-0.06 wt%, glycine of 0.005-0.01 wt%
In a preferred technical scheme, the pH value of the cyanide-free electroless plating thick gold liquid is 7.5-9.5, and the specific gravity is 1.08-1.12g/cm 3.
In a preferred technical scheme, the soaking time of the printed circuit board in the step 4) is 8-12 minutes.
In a preferred technical scheme, the deionized water cleaning time in the step 5) is 1-2 minutes, the hot deionized water cleaning temperature is 70-80 ℃, and the cleaning time is 1-2 minutes.
In a preferable technical scheme, the hot air drying temperature in the step 6) is 75-85 ℃, and the time is 3-5 minutes.
The oxygen-free chemical thick gold plating process has the following beneficial effects:
(1) the chemical gold plating process is adopted to replace the traditional replacement type chemical gold plating process, so that the problem of attack on a chemical nickel plating layer caused by gold replacement is solved.
(2) The nickel corrosion caused by gold replacement is solved.
(3) The problem of poor weldability caused by nickel corrosion is solved.
(4) The problem of poor welding reliability caused by nickel corrosion is solved.
(5) Solves the pollution and poison of micro-cyanogen replacement gold to the environment.
(6) The quality problem of the printed circuit board with high welding property and high welding reliability is solved fundamentally.
(7) The raw materials have wide sources, low price, low cost and no pollution in the production process, thereby having wide application prospect in the field of printed circuit boards.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
Example 1
Completely discharging the electroless gold plating bath solution, washing the electroless gold plating bath solution with tap water, continuously and circularly cleaning the electroless gold plating bath solution with deionized water for 30 minutes, discharging the cleaning water, and adding 0.1 wt% of NaAuCl into the electroless gold plating bath40.2 wt% of Na2SO3、1.5wt％Na2S2O30.15 wt% of Na2B4O, 0.01 wt% of thiourea, 0.05 wt% of hydroquinone, 1.0 wt% of EDTA, 0.03 wt% of glutamic acid, 0.005 wt% of glycine, and cyanide-free electroless plating solution with pH value of 8.5 and specific gravity of 1.08g/cm3Heating a chemical gold plating tank to 80 ℃, starting a circulating filter pump, cleaning a printed circuit board after chemical nickel plating, soaking the printed circuit board in the chemical gold plating tank for 10 minutes, taking out the printed circuit board, cleaning the printed circuit board with deionized water for 2 minutes, cleaning the printed circuit board with hot deionized water for 1-2 minutes, drying the printed circuit board with hot air at 85 ℃ for 5 minutes, and then transferring the printed circuit board to an appearance processing procedure.
The experimental result shows that the cyanide-free chemical plating thick gold has excellent weldability, excellent welding reliability and no pollution and toxicity to the environment; the quality of the printed circuit board with high welding performance and high welding reliability is improved. (see Table 1, Table 1 lists the relevant parameters for the impact of cyanide-free electroless gold plating on quality)
Watch 1
Figure BDA0002518824850000041
Example 2
After the electroless gold plating bath solution is completely discharged, the electroless gold plating bath solution is washed clean by tap water, the electroless gold plating bath solution is continuously cleaned for 30 minutes by using ionic water in a circulating way, the cleaning water is drained, 0.5 wt% of NaAuCl4, 0.6 wt% of Na2SO3, 6 wt% of Na2S2O3, 0.75 wt% of Na2B4O, 0.06 wt% of thiourea, 0.025 wt% of hydroquinone, 4.0 wt% of EDTA, 0.06 wt% of glutamic acid, 0.01 wt% of glycine and cyanide-free electroless thick gold plating solution are added into the electroless gold plating bath: the pH value is 9.5, the specific gravity is 1.128g/cm3, the electroless gold plating tank is heated to 85 ℃, a circulating filter pump is started, the printed circuit board after electroless nickel plating is cleaned, the printed circuit board is placed into the electroless gold plating tank to be soaked for 12 minutes, the printed circuit board is taken out and cleaned by deionized water for 1.5 minutes, then cleaned by hot deionized water for 1-2 minutes, then the printed circuit board is dried by hot air at 80 ℃ for 4 minutes, and then the printed circuit board is transferred to the shape processing procedure.
The experimental result shows that the cyanide-free chemical plating thick gold has excellent weldability, excellent welding reliability and no pollution and toxicity to the environment; the quality of the printed circuit board with high welding performance and high welding reliability is improved. (see Table 2, Table 2 lists the relevant parameters for the impact of cyanide-free electroless gold plating on quality)
TABLE 2
Figure BDA0002518824850000051
Example 3
The method comprises the steps of completely discharging electroless gold plating bath solution, then washing the electroless gold plating bath solution with tap water, continuously washing the electroless gold plating bath solution with ionized water for 30 minutes in a circulating manner, draining washing water, adding 0.5 wt% of NaAuCl4, 0.6 wt% of Na2SO3, 6 wt% of Na2S2O3, 0.75 wt% of Na2B4O, 0.06 wt% of thiourea, 0.025 wt% of hydroquinone, 4.0 wt% of EDTA, 0.06 wt% of glutamic acid, 0.01 wt% of glycine and cyanide-free electroless thick gold plating solution into the electroless gold plating bath, wherein the solution comprises the following components of pH value of 7.5, specific gravity of 1.128g/cm3, heating the electroless nickel plating bath solution to 75 ℃, starting a circulating filter pump, washing a printed circuit board after electroless nickel plating, placing the printed circuit board in the electroless nickel plating bath for soaking for 8 minutes, taking the printed circuit board out, washing the printed circuit board for 1 minute by using hot air at 75 ℃, and drying the printed circuit board for 3 minutes, and further.
The experimental result shows that the cyanide-free chemical plating thick gold has excellent weldability, excellent welding reliability and no pollution and toxicity to the environment; the quality of the printed circuit board with high welding performance and high welding reliability is improved. (see Table 3, Table 2 for relevant parameters of the effect of cyanide-free electroless gold plating on quality)
TABLE 3
Figure BDA0002518824850000061
The above description is only exemplary of the present invention, and the structure is not limited to the above-mentioned shapes, and any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. A cyanide-free chemical thick gold plating process for printed circuit boards is characterized in that: the cyanide-free chemical thick gold plating process comprises the following steps:
1) cleaning the electroless gold plating tank;
2) adding cyanide-free chemical thick gold plating liquid medicine into the chemical gold plating groove; the electroless gold plating solution comprises NaAuCI4, Na2SO3, Na2S2O3, Na2B4O, thiourea, hydroquinone, EDTA, glutamic acid and glycine;
3) starting a circulating filter pump, and heating the electroless gold plating tank to 75-85 ℃;
4) placing the printed circuit board which is chemically plated with nickel and cleaned up into the chemical gold plating tank for soaking;
5) taking out the printed circuit board, cleaning the printed circuit board by using deionized water, and then cleaning the printed circuit board by using hot deionized water;
6) drying the printed circuit board by hot air;
7) and loading the printed circuit board into a shape processing procedure.
2. The cyanide-free electroless thick gold plating process for the printed wiring board according to claim 1, characterized in that: the step 1) comprises the following steps: a) after the electroless gold plating bath solution is completely discharged, washing the bath solution clean by tap water; b) circularly cleaning with deionized water; c) and discharging residual liquid in the chemical gold plating groove again.
3. The cyanide-free electroless thick gold plating process for the printed wiring board according to claim 2, characterized in that: the time for washing by deionized water in the step b) is 30 minutes.
4. The cyanide-free electroless thick gold plating process for the printed wiring board according to claim 1, characterized in that: the NaAuCI4 accounts for 0.1-0.5 wt%: 0.2 to 0.8 weight percent of Na2SO3, 1.5 to 6 weight percent of Na2S2O3, 0.15 to 0.75 weight percent of Na2B4O, 0.01 to 0.06 weight percent of thiourea, 0.005 to 0.025 weight percent of hydroquinone, 1.0 to 4.0 weight percent of EDTA, 0.03 to 0.06 weight percent of glutamic acid and 0.005 to 0.01 weight percent of glycine.
5. The cyanide-free chemical thick gold plating process for the printed circuit board according to claim 1, which is characterized in that: the PH value of the cyanide-free chemical plating thick gold liquid is 7.5-9.5, and the specific gravity is 1.08-1.12g/cm 3.
6. The cyanide-free electroless thick gold plating process for the printed wiring board according to claim 1, characterized in that: the soaking time of the printed circuit board in the step 4) is 8-12 minutes.
7. The cyanide-free electroless thick gold plating process for the printed wiring board according to claim 1, characterized in that: the deionized water cleaning time in the step 5) is 1-2 minutes, the hot deionized water cleaning temperature is 70-80 ℃, and the cleaning time is 1-2 minutes.
8. The cyanide-free electroless thick gold plating process for the printed wiring board according to claim 1, characterized in that: the hot air drying temperature in the step 6) is 75-85 ℃, and the time is 3-5 minutes.
CN202010485277.3A 2020-06-01 2020-06-01 Cyanide-free chemical thick gold plating process for printed circuit board Pending CN111763934A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102212805A (en) * 2011-05-11 2011-10-12 深圳市精诚达电路有限公司 Cyanogen-free gold leaching liquid and cyanogen-free gold leaching process
CN103014685A (en) * 2013-01-14 2013-04-03 厦门大学 Double-tank method for continuously plating thick gold with cyanide-free chemical gold plating solutions
CN103993300A (en) * 2014-04-28 2014-08-20 深圳市荣伟业电子有限公司 Environment-friendly cyanogen-free chemical thick-gold plating liquid and cyanogen-free chemical thick-gold plating method
CN105543816A (en) * 2016-02-01 2016-05-04 哈尔滨工业大学（威海） Chemical gold plating solution
CN106399983A (en) * 2015-07-28 2017-02-15 上村工业株式会社 Non-cyanide electroless gold plating bath and electroless gold plating method
CN106894003A (en) * 2016-12-30 2017-06-27 广东致卓环保科技有限公司 Without the thick gold method of cyanogen chemical plating and plating liquid making method on Ni-based material

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102212805A (en) * 2011-05-11 2011-10-12 深圳市精诚达电路有限公司 Cyanogen-free gold leaching liquid and cyanogen-free gold leaching process
CN103014685A (en) * 2013-01-14 2013-04-03 厦门大学 Double-tank method for continuously plating thick gold with cyanide-free chemical gold plating solutions
CN103993300A (en) * 2014-04-28 2014-08-20 深圳市荣伟业电子有限公司 Environment-friendly cyanogen-free chemical thick-gold plating liquid and cyanogen-free chemical thick-gold plating method
CN106399983A (en) * 2015-07-28 2017-02-15 上村工业株式会社 Non-cyanide electroless gold plating bath and electroless gold plating method
CN105543816A (en) * 2016-02-01 2016-05-04 哈尔滨工业大学（威海） Chemical gold plating solution
CN106894003A (en) * 2016-12-30 2017-06-27 广东致卓环保科技有限公司 Without the thick gold method of cyanogen chemical plating and plating liquid making method on Ni-based material

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Application publication date: 20201013