CN110303257A - 一种激光复合切割分离透明脆性材料的方法及装置 - Google Patents
一种激光复合切割分离透明脆性材料的方法及装置 Download PDFInfo
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- CN110303257A CN110303257A CN201910693520.8A CN201910693520A CN110303257A CN 110303257 A CN110303257 A CN 110303257A CN 201910693520 A CN201910693520 A CN 201910693520A CN 110303257 A CN110303257 A CN 110303257A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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CN201910693520.8A CN110303257B (zh) | 2019-07-30 | 2019-07-30 | 一种激光复合切割分离透明脆性材料的方法及装置 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111515526A (zh) * | 2020-05-15 | 2020-08-11 | 广东正业科技股份有限公司 | 一种多光束加工装置及加工方法 |
CN112593855A (zh) * | 2020-12-03 | 2021-04-02 | 中国工程物理研究院激光聚变研究中心 | 一种基于二维光学元件整形的复合激光破岩装置及方法 |
CN113664393A (zh) * | 2021-09-30 | 2021-11-19 | 卡门哈斯激光科技(苏州)有限公司 | 一种太阳能光伏电池片的无损切割方法及装置 |
CN114083144A (zh) * | 2020-12-31 | 2022-02-25 | 武汉华工激光工程有限责任公司 | 用于控制透明脆性材料的光学切割宽度的方法及装置 |
CN114985990A (zh) * | 2022-07-14 | 2022-09-02 | 中国科学院半导体研究所 | 双激光裂片方法和装置 |
CN115041814A (zh) * | 2021-02-26 | 2022-09-13 | 深圳市大族半导体装备科技有限公司 | 一种脆性材料的激光加工装置及加工方法 |
CN117226254A (zh) * | 2023-11-02 | 2023-12-15 | 武汉华日精密激光股份有限公司 | 基于超快激光-长脉冲激光复合的激光打孔装置及方法 |
CN117340450A (zh) * | 2023-12-06 | 2024-01-05 | 国科大杭州高等研究院 | 晶圆切割系统和方法 |
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JP2001212684A (ja) * | 2000-02-02 | 2001-08-07 | Shibuya Kogyo Co Ltd | ビアホール加工方法およびその装置 |
CN102785031A (zh) * | 2012-08-15 | 2012-11-21 | 武汉隽龙科技有限公司 | 一种利用超短脉冲激光的透明材料切割方法及切割装置 |
CN104968620A (zh) * | 2012-11-20 | 2015-10-07 | Uab阿尔特克纳研究与开发所 | 透明材料的高速激光加工 |
CN105921884A (zh) * | 2015-10-29 | 2016-09-07 | 福建中科光汇激光科技有限公司 | 脉冲-连续波复合型激光的加工系统 |
CN106346141A (zh) * | 2016-09-07 | 2017-01-25 | 华中科技大学 | 一种基于复合激光束的金属切割装置 |
CN107892469A (zh) * | 2017-12-15 | 2018-04-10 | 华中科技大学 | 一种多激光束合束焊接玻璃材料的方法及装备 |
CN109514099A (zh) * | 2018-12-12 | 2019-03-26 | 武汉华工激光工程有限责任公司 | 一种利用贝赛尔光束切割磨砂脆性材料的激光加工方法 |
CN210548928U (zh) * | 2019-07-30 | 2020-05-19 | 华中科技大学 | 一种激光复合切割分离透明脆性材料的装置 |
-
2019
- 2019-07-30 CN CN201910693520.8A patent/CN110303257B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001212684A (ja) * | 2000-02-02 | 2001-08-07 | Shibuya Kogyo Co Ltd | ビアホール加工方法およびその装置 |
CN102785031A (zh) * | 2012-08-15 | 2012-11-21 | 武汉隽龙科技有限公司 | 一种利用超短脉冲激光的透明材料切割方法及切割装置 |
CN104968620A (zh) * | 2012-11-20 | 2015-10-07 | Uab阿尔特克纳研究与开发所 | 透明材料的高速激光加工 |
CN105921884A (zh) * | 2015-10-29 | 2016-09-07 | 福建中科光汇激光科技有限公司 | 脉冲-连续波复合型激光的加工系统 |
CN106346141A (zh) * | 2016-09-07 | 2017-01-25 | 华中科技大学 | 一种基于复合激光束的金属切割装置 |
CN107892469A (zh) * | 2017-12-15 | 2018-04-10 | 华中科技大学 | 一种多激光束合束焊接玻璃材料的方法及装备 |
CN109514099A (zh) * | 2018-12-12 | 2019-03-26 | 武汉华工激光工程有限责任公司 | 一种利用贝赛尔光束切割磨砂脆性材料的激光加工方法 |
CN210548928U (zh) * | 2019-07-30 | 2020-05-19 | 华中科技大学 | 一种激光复合切割分离透明脆性材料的装置 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111515526A (zh) * | 2020-05-15 | 2020-08-11 | 广东正业科技股份有限公司 | 一种多光束加工装置及加工方法 |
CN112593855A (zh) * | 2020-12-03 | 2021-04-02 | 中国工程物理研究院激光聚变研究中心 | 一种基于二维光学元件整形的复合激光破岩装置及方法 |
CN114083144A (zh) * | 2020-12-31 | 2022-02-25 | 武汉华工激光工程有限责任公司 | 用于控制透明脆性材料的光学切割宽度的方法及装置 |
CN114083144B (zh) * | 2020-12-31 | 2023-01-17 | 武汉华工激光工程有限责任公司 | 用于控制透明脆性材料的光学切割宽度的方法及装置 |
CN115041814A (zh) * | 2021-02-26 | 2022-09-13 | 深圳市大族半导体装备科技有限公司 | 一种脆性材料的激光加工装置及加工方法 |
CN113664393A (zh) * | 2021-09-30 | 2021-11-19 | 卡门哈斯激光科技(苏州)有限公司 | 一种太阳能光伏电池片的无损切割方法及装置 |
CN114985990A (zh) * | 2022-07-14 | 2022-09-02 | 中国科学院半导体研究所 | 双激光裂片方法和装置 |
CN117226254A (zh) * | 2023-11-02 | 2023-12-15 | 武汉华日精密激光股份有限公司 | 基于超快激光-长脉冲激光复合的激光打孔装置及方法 |
CN117340450A (zh) * | 2023-12-06 | 2024-01-05 | 国科大杭州高等研究院 | 晶圆切割系统和方法 |
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Effective date of registration: 20240416 Address after: Room 1409, Building 1, Haipengyuan, No. 229 Guyuan Road, Lugu Street, High tech Development Zone, Changsha City, Hunan Province, 410221 Patentee after: Changsha Kunlun Precision Technology Co.,Ltd. Country or region after: China Address before: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Patentee before: HUAZHONG University OF SCIENCE AND TECHNOLOGY Country or region before: China |