CN110293480A - Grinding attachment - Google Patents

Grinding attachment Download PDF

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Publication number
CN110293480A
CN110293480A CN201910211295.XA CN201910211295A CN110293480A CN 110293480 A CN110293480 A CN 110293480A CN 201910211295 A CN201910211295 A CN 201910211295A CN 110293480 A CN110293480 A CN 110293480A
Authority
CN
China
Prior art keywords
unit
grinding
wafer
workbench
retaining surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910211295.XA
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Chinese (zh)
Inventor
吉田真司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN110293480A publication Critical patent/CN110293480A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

Grinding attachment is provided, if having found cross hairs on chip after grinding, position accompanying by the attachment corresponding with graticulated position is formed on chip of workbench retaining surface can be then grasped immediately as operator and removes attachment, prevent from generating cross crack in grinding wafer later.Grinding attachment (1) includes workbench (30), with retaining surface (300a)；Unit (37), makes worktable rotary；Unit (32) is ground the chip (W) kept；Unit (17), to operator's notification information；Unit (40) is irradiated the ground face (Wb) of chip and shoots ground face using illumination (400)；Unit (91), detection shoot the cross hairs in image；Unit (90) stores the X-axis Y axis coordinate position of the intersection point of cross hairs；Point light source (41), is irradiated retaining surface according to the coordinate position stored；With control unit (9), cross hairs has been arrived using notification unit notice detection, and has acted the grinding of device and stops.

Description

Grinding attachment
Technical field
The present invention relates to the grinding attachments being ground to machined objects such as semiconductor wafers.
Background technique
In the grinding attachment being ground to chip, the mill for the grinding grinding tool for being positioned to the rotation parallel with retaining surface is utilized Bevel is ground the chip for keeping the retaining surface of workbench being made of porous material to be kept.When in holding workbench It is clipped between retaining surface and the lower surface of chip in the state of the attachments such as grindstone dust or abrasive grain using grinding grinding tool to retaining surface When the chip kept is ground, splitting for cross shape can be formed on the ground face of the chip of the surface of attachment Line.Also, in order not to form cross crack on chip, by cleaning device documented by patent document 1 or 2 to attracting holding Retaining surface before chip is cleaned.
Patent document 1: No. 4079289 bulletins of Japanese Patent
Patent document 2: No. 5538971 bulletins of Japanese Patent
It, can shape but when remaining attachment in the retaining surface after stating cleaning device in use and being cleaned At cross crack.As a result, using before keeping the retaining surface of workbench to carry out attracting holding to chip, need to confirm retaining surface Whether there is or not attachments.Therefore, retaining surface is shot using shooting camera, but had the following problems: clapped according to being formed by Image is taken the photograph, operator is difficult to judge the pattern of porous ceramics or attachment.
Accordingly, there exist following projects: in grinding attachment, if having found cross crack on chip after grinding, The holding for keeping workbench corresponding with the position for foring the cross crack on chip can be grasped immediately by operator The position (attachment accompanying in the position of retaining surface) in face and attachment is removed, to prevent in grinding wafer later Cross crack is generated on chip.
Summary of the invention
The purpose of the present invention is to provide a kind of grinding attachments, if having found cross crack on chip after grinding, The attachment corresponding with graticulated position is formed on chip of workbench retaining surface can be grasped immediately by operator Attachment position and attachment is removed, prevent from generating cross crack in grinding wafer later.
According to the present invention, grinding attachment is provided, holding workbench is included, with porous plate, which has pair The retaining surface that chip is kept；Worktable rotary unit is kept, makes to keep workbench with the center of the holding workbench Axis is rotated；Grinding unit is ground the chip kept in the retaining surface using grinding grinding tool；Notification unit, It notifies various information to operator；Shooting unit utilizes the grinding grinding tool to what is kept in the retaining surface using illumination The ground face for the chip being ground is irradiated, and the shooting unit shoots ground face；Detection unit, It detects the cross hairs in image taken by the shooting unit；Storage unit detects the detection unit To the X-axis Y axis coordinate position of intersection point of cross hairs stored；Point light source, the X-axis Y stored according to the storage unit Coordinate positions are irradiated the retaining surface；And control unit, so that the notification unit is notified the detection list to operator Member has detected that cross hairs, and the control unit makes the grinding of device act stopping.
According to the present invention, if producing cross crack on chip after grinding, can using point light source irradiate this ten The retaining surface of the underface of word crackle, after removing chip from retaining surface, operator can grasp in retaining surface immediately It is attached with the position of grindstone dust or abrasive grain etc..Also, by being adhered to by operator at the position for the retaining surface irradiated Object removal can immediately remove attachment the reason of becoming cross crack from retaining surface.
Detailed description of the invention
Fig. 1 is the perspective view for showing an example of grinding attachment.
Fig. 2 is the cross-sectional view for showing an example for keeping workbench, cleaning unit and shooting unit.
Fig. 3 is to show to utilize the ground face for the chip for keeping using retaining surface and being ground using grinding grinding tool The cross-sectional view of state that illumination is irradiated and is shot using shooting unit.
Fig. 4 is to show to utilize the ground face for the chip for keeping using retaining surface and being ground using grinding grinding tool The top view of state that illumination is irradiated and is shot using shooting unit.
Fig. 5 is explanation the case where illustrating the cross hairs that detection unit detects in image taken by shooting unit Figure.
Label declaration
1: grinding attachment；10: pedestal；11: column；17: notification unit；30: keeping workbench；300: porous plate；300a: it protects Hold face；301: framework；31: thick grinding unit；310: rotary shaft；311: shell；312: motor；314: grinding emery wheel；314a: Roughly grind skiving tool；32: fine ginding unit；324a: fine ginding grinding tool；330: robot；331: the first boxes；332: the second boxes； 333a: workbench is temporarily put；333b: bit cell；333c: notch detection portion；334: cleaning unit；335: the first transport unit； 336: the second transport unit；34: turntable；35: corase grinding cuts feed unit；350: ball-screw；351: guide rail；352: motor； 353: lifting unit；36: fine ginding feed unit；360: ball-screw；361: guide rail；362: motor；363: lifting unit；37: Keep worktable rotary unit；370: main shaft；371: motor；372: driving pulley；373: endless belt；374: driven pulley； 379: rotary encoder；38: adjustment for angle of inclination；39: attracting source；8: cleaning unit；80: rotary shaft；81: shell；82: cleaning Grinding tool；83: lifting unit；89:Y axis mobile unit；40: shooting unit；400: illumination；401: cabinet；402: half-reflecting mirror； 403: shoot part；41: point light source；9: control unit；90: storage unit；91: detection unit；W: chip；Wa: the front of chip； Wb: the ground face (back side) of chip；T: protection band；N: notch；C: cross hairs.
Specific embodiment
Grinding attachment 1 shown in FIG. 1 is the dress to the wafer W implementation grinding for keeping 30 attracting holdings of workbench It sets.Wafer W shown in FIG. 1 is, for example, the semiconductor wafer for the circular plate being made of silicon base material, the crystalline substance in Fig. 1 downward Multiple devices are formed on the positive Wa of piece W, protection band T is pasted with and is protected.The back side Wb conduct of wafer W upward Implement the ground face of grinding.In the shape that the outer peripheral edge of wafer W is recessed according to the center towards wafer W to radially inner side State is formed with the label i.e. notch N for indicating crystal orientation.
It is equipped in the front side (-X direction side) of the pedestal 10 of grinding attachment 1 for defeated to grinding attachment 1 for operator Enter the input unit 19 of processing conditions etc..The wafer W before grinding is stored in addition, the front side on pedestal 10 is equipped The first box 331 and the second box 332 for being stored of wafer W that grinding is completed.The first box 331 and the second box 332 it Between be equipped with robot 330, the robot 330 have by grinding before wafer W is moved out from the first box 331, and will grinding The wafer W of completion is moved in the multi-joint arm of the second box 332.
The movable area of robot 330 is provided with the temporary of wafer W before temporarily putting processing and puts workbench 333a, is temporarily putting work Make to be equipped with bit cell 333b on platform 333a.Bit cell 333b, which will be moved out and will be placed in from the first box 331, temporarily puts workbench The wafer W of 333a is using the alignment pin contraposition (centering) of undergauge in defined position.
The test section 333c detected to the notch N of wafer W is equipped in the side for temporarily putting workbench 333a.Test section 333c is for example made of the optical sensor of light reflection-type or infiltration type, as what is kept to the wafer W after centering temporarily puts The rotation of workbench 333a, detection zone (lower section) of the periphery of wafer W in test section 333c pass through, so as to being formed in The notch N of the outer peripheral edge of wafer W is detected.Alternatively, it is also possible to be, test section 333c, test section 333c are made of camera etc. Image procossing is carried out to shooting image taken by camera, to detect to the notch N of the outer peripheral edge of wafer W.
The cleaning unit 334 cleaned to the wafer W that grinding is completed is equipped in the movable area of robot 330.Clearly Wash the rotary cleaning device that unit 334 is, for example, one chip.
It is equipped the first transport unit 335 near bit cell 333b, is equipped near cleaning unit 334 Two transport unit 336.First transport unit 335 will be placed in the chip before temporarily putting workbench 333a and the grinding felt relieved W transports the mill for being kept any holding workbench 30 to any holding workbench 30 shown in FIG. 1, the second transport unit 336 The wafer W for cutting completion is transported to cleaning unit 334.
The rear side of the first transport unit 335 on pedestal 10 is equipped with turntable 34, the upper surface of turntable 34 for example It separates in the circumferential at equal intervals and keeps workbench 30 (only illustrating two) there are four being arranged.Turntable 34 can on pedestal 10 around The axle center rotation of Z-direction.By the rotation of turntable 34, workbench 30 is kept to be positioned at 335 He of the first transport unit by any Near second transport unit 336.
As shown in Fig. 2, keep workbench 30 for example its shape be round, include wafer W is adsorbed it is porous Plate 300；And to the framework 301 that porous plate 300 is supported.Porous plate 300 is connected to attraction sources 39 such as device for vacuum generation, Attraction source 39 is attracted and the attraction that generates is transferred to the exposed surface i.e. retaining surface 300a of porous plate 300, to keep work Make platform 30 and attracting holding is carried out to wafer W on retaining surface 300a.Retaining surface 300a is formed to have with its rotation center as top The extremely gentle inclined circular conical surface of point.
Worktable rotary unit 37 is kept keeping the lower face side of workbench 30 to be connected with, keeps workbench 30 can be On turntable 34 shown in FIG. 1 by keep worktable rotary unit 37 about the z axis direction axle center rotate.
In addition, keeping the lower section of workbench 30 to be equipped with adjustment for angle of inclination 38 by connector etc..Tilt adjustment The retaining surface 300a inclination with respect to the horizontal plane for keeping workbench 30 can be adjusted in mechanism 38.
Keeping worktable rotary unit 37 is, for example, belt wheel mechanism, which includes main shaft 370, axial direction is Z-direction, and the upper end is connect with the lower surface for the framework 301 for keeping workbench 30；And motor 371, It as driving source makes that workbench 30 is kept to rotate to keep the center axis of workbench 30.Pacify on the axis of motor 371 Equipped with driving pulley 372, endless belt 373 is wound on driving pulley 372.Driven pulley 374 is installed on main shaft 370, Endless belt 373 is also wound in the driven pulley 374.Motor 371 make driving pulley 372 rotation driving, thus endless belt 373 with The rotation of driving pulley 372 and rotate, by the rotation of endless belt 373 to which driven pulley 374 and main shaft 370 rotate.
Such as the rotation angle for being connected with the rotation angle to motor 371 on motor 371, keeping workbench 30 The rotary encoder 379 detected.
As shown in Figure 1, rear side (+X direction side) setting on pedestal 10 is provided with column 11, in the front surface of column 11 Be equipped with side by side: corase grinding cuts feed unit 35, by thick grinding unit 31 relative to keep the wafer W that is kept of workbench 30 into Row grinding and feeding；And fine ginding feed unit 36, by fine ginding unit 32 relative to the crystalline substance for keeping workbench 30 to be kept Piece W carries out grinding and feeding.
Corase grinding cuts feed unit 35 and includes: ball-screw (not shown), the axle center with vertical direction (Z-direction)； A pair of guide rails 351, they are arranged to parallel with ball-screw；Motor 352 links with ball-screw, turns ball-screw It is dynamic；And lifting unit 353, internal nut are screwed togather with ball-screw, and its side and 351 sliding contact of guide rail, with Motor 352 rotates ball-screw, and the lifting unit 353 supported to thick grinding unit 31 is guided and carried out by guide rail 351 Lifting.
Fine ginding feed unit 36 includes: ball-screw (not shown), the axle center with vertical direction；A pair of guide rails 361, they are arranged to parallel with ball-screw；Motor 362 links with ball-screw, makes ball screw turns；And it rises Drop portion 363, internal nut are screwed togather with ball-screw, and its side and 361 sliding contact of guide rail, with motor 362 Rotate ball-screw, the lifting unit 363 supported to fine ginding unit 32 is guided and gone up and down by guide rail 361.
Thick grinding unit 31 includes rotary shaft 310, and axial direction is vertical direction；Shell 311, rotary shaft 310 is supported For that can rotate；Motor 312 makes the rotation driving of rotary shaft 310；Mounting base 313 is installed on the lower end of rotary shaft 310； And grinding emery wheel 314, it is connect in a manner of assemble and unassemble with mounting base 313.It is annular in shape on the bottom surface of grinding emery wheel 314 It is equipped with multiple corase grinding skivings tool 314a of approximately cuboid shape.Corase grinding skiving tool 314a is to utilize defined bonding agent cementation Diamond abrasive grain etc. and it is molding.Roughly grinding skiving tool 314a is, for example, the bigger grinding tool of abrasive grain contained in grinding tool.
Such as in the inside of rotary shaft 310, penetrated through in the axial direction of rotary shaft 310 and be formed with flow path (not shown), it should Flow path provides source with grinding water and be connected to, becomes the channel of grinding water, flow path is on the bottom surface for being ground emery wheel 314 according to being capable of direction The mode that corase grinding skiving tool 314a sprays grinding water is open.
Fine ginding unit 32 can be to by roughly grinding the fine ginding cut the wafer W for having carried out thinning and improve flatness. That is, fine ginding unit 32 has fine ginding grinding tool 324a, roughly ground by 314 Duis of the grinding emery wheel installed in the way of it can rotate The back side Wb for cutting the wafer W after grinding of unit 31 is further ground.Abrasive grain contained in fine ginding grinding tool 324a is partial size The abrasive grain smaller than abrasive grain contained by corase grinding skiving tool 314a.Structure other than the fine ginding grinding tool 324a of fine ginding unit 32 and thick The structure of grinding unit 31 is identical.
It is equipped with above the movement routine for keeping workbench 30 clear to keeping the retaining surface 300a of workbench 30 to carry out The cleaning unit 8 washed.As shown in Fig. 2, the cleaning unit 8 includes rotary shaft 80, the axle center with vertical direction；Shell 81, It can rotate the bearing of rotary shaft 80；Grinding tool 82 is cleaned, the lower end of rotary shaft 80 is disposed in；And lifting unit 83, It goes up and down shell 81.Also, cleaning unit 8 can be reciprocal in the Y-axis direction by Y-axis mobile unit 89 shown in FIG. 1 It is mobile.
Y-axis mobile unit 89 shown in FIG. 1 for example includes ball-screw 890, the axle center with Y direction；Bridge portion 891, ball-screw 890 is supported；Movable part 892, internal nut are screwed togather with ball-screw 890, the movable part 892 move back and forth along the y axis on ball-screw 890；And motor (not shown), one end with ball-screw 890 Connection rotates ball-screw 890.Cleaning unit 8 is equipped in the front surface of movable part 892.
Resinoid bonded grinding tool, resin material or ceramic material are for example formed as circular plate by cleaning grinding tool 82, will be attached In keeping the pollutants such as the grindstone dust of retaining surface 300a of workbench 30 to grind off.In addition, cleaning unit 8 also can replace cleaning Grinding tool 82 and have cleaning brush.
Lifting unit 83 includes track 830, slides for shell 81；And motor, it is set to such as shell 81 It is internal；Etc., which can be such that shell 81 goes up and down.
Grinding attachment 1 includes shooting unit 40, using illumination 400 (referring to Fig. 2) to the retaining surface for keeping workbench 30 The ground face Wb of the wafer W being ground using fine ginding grinding tool 324a kept on 300a is irradiated, and to quilt Grinding surface Wb is shot；And point light source 41, the retaining surface 300a of holding workbench 30 is irradiated.
Shooting unit 40 be, for example, line sensor camera, be disposed in the side of the shell 81 of cleaning unit 8, can with it is clear Unit 8 is washed to move in Y direction and Z-direction together.As shown in Fig. 2, shooting unit 40 is for example with covering exterior light The cabinet 401 of rectangular-shape, is equipped with the illumination being irradiated from the top of wafer W to wafer W on the side of cabinet 401 400.Illumination 400 is, for example, LED or xenon lamp etc., and light caused by illumination 400 transmits optical system by optical fiber (not shown) etc. System is sent to inside cabinet 401.The light quantity for the light that illumination 400 is issued can be adjusted by adjuster (not shown) etc..
Shooting unit 40 includes half-reflecting mirror 402, is disposed in cabinet 401, will illuminate the 400 light directions issued Lower section is reflected and carries out direction conversion；Object lens (not shown) are disposed in the downside of the half-reflecting mirror 402 in cabinet 401, for The light reflected on half-reflecting mirror 402 is incident；And shoot part 403, be disposed in the upside of half-reflecting mirror 402, to Reflection occurs in wafer W and is carried out photoelectric conversion by the reflected light that object lens capture and is exported as image information.
The multiple light receiving elements such as being configured to laterally be arranged with CCD to a column in the X-axis direction of shoot part 403.Shooting Length on the length direction (X-direction) in portion 403 is roughly the same with the radius of retaining surface 300a of workbench 30 is kept Length, shoot part 403 have the shooting area of the length of the radius of wafer W or more.Each pixel of light receiving element passes through reflected light The data conveyed of intensity for example by brightness value with 8 gray scale representations, i.e. according to 0~255 totally 256 grayscale tables Show.
Point light source 41 is, for example, the LED that can be irradiated from top in the dotted retaining surface 300a to holding workbench 30 Lamp etc., is installed near shooting unit 40, is installed on the side of the shell 81 of cleaning unit 8 in the present embodiment.In addition, The incident angle of the point light of point light source 41 can be for example adjusted by adjustment unit (not shown), also can be by a light diameter It is reduced into desired value.In addition, the arranging position of point light source 41 is also not limited to Fig. 1, example shown in Fig. 2.
As shown in Figure 1 and Figure 2, grinding attachment 1 has control unit 9, and the control unit 9 is by the storages list such as CPU and memory Member 90 is constituted, and carries out the control of device entirety.Control unit 9 passes through wiring (not shown) and fine ginding feed unit 36, Y-axis Mobile unit 89 and keep the equal electrical connection of worktable rotary unit 37, under the control of control unit 9, to be based on fine ginding into To the shift action in the Z-axis direction of fine ginding unit 32 of unit 36, based on the shooting unit 40 of Y-axis mobile unit 89 in Y Location action in axis direction and the spinning movement etc. based on the holding workbench 30 for keeping worktable rotary unit 37 carry out Control.
Grinding attachment 1 has the notification unit 17 that various information are notified to operator.Notification unit 17 shows notification information It is shown in monitor (not shown), or from alarm equipment alarm.
Hereinafter, the movement of the grinding attachment 1 in the case where to being ground using grinding attachment 1 shown in FIG. 1 to wafer W It is illustrated.
Firstly, turntable 34 shown in FIG. 1 carries out rotation, so that the holding workbench 30 for not loading the state of wafer W carries out Revolution keeps workbench 30 to be moved near the first transport unit 335.Robot 330 is by a wafer W from the first box 331 Wafer W is moved to and temporarily puts workbench 333a by middle pull-out.
By bit cell 333b by wafer W after temporarily putting and being felt relieved on workbench 333a, pass through test section 333c The notch N for the outer peripheral edge for being formed in wafer W is detected.Then, wafer W is rotated by temporarily workbench 333a is put, thus Notch N is positioned to the defined position in circumferential direction.Then, the first transport unit 335 will carry out centering and notch N is positioned at The wafer W of defined position in circumferential direction is moved to holding work in such a way that the circumferential position of the notch N grasped does not deviate Make on platform 30.
Such as it can be formed on keeping workbench 30 and not scheme for what is aligned when loading wafer W with notch N The notch alignment part (alignment mark) shown.On keeping workbench 30, by the notch of the notch N of wafer W and holding workbench 30 Alignment part is aligned.That is, workbench is being put from temporary in the position of notch N when the first transport unit 335 keeps wafer W It is determined when 333a is kept and moved out to wafer W, therefore workbench 30 is kept to rotate defined angle, put workbench according to temporary The position of the notch N for the wafer W that 333a is kept is aligned with the consistent mode of notch alignment part of workbench 30 is kept.So Afterwards, according to the substantially uniform mode in center at the center and wafer W for keeping workbench 30, upward according to back side Wb by wafer W State is placed on retaining surface 300a.
Then, source 39 (referring to Fig. 2) is attracted to be acted and the attraction that generates is transferred to the retaining surface of porous plate 300 300a, so that workbench 30 be kept to carry out attracting holding to wafer W on retaining surface 300a.In addition, becoming institute's attracting holding The position of the notch N of wafer W passes through the state that control unit 9 is grasped.
In addition, the position of the notch N of the wafer W of institute's attracting holding on workbench 30 is kept to be in the shape grasped always State, at least to aftermentioned second transport unit 336 by wafer W from keep workbench 30 move out when until.That is, when by keeping work Make platform rotary unit 37 carry out keep workbench 30 rotation when, it is shown in Fig. 2 keep worktable rotary unit 37 rotation compile Code device 379 exports code device signal (revolving speed of motor 371) to control unit 9.Control unit 9 passes through a received coding Device signal carries out feedback control, and energy to the rotation speed based on the holding workbench 30 for keeping worktable rotary unit 37 The position of enough notch N for gradually grasping the wafer W rotated.
In addition, about keep workbench 30 on wafer W notch N position grasp, using shooting unit 40 into In the case that row is directed at the edge of wafer W, it can be aligned with the edge and carry out together.In edge alignment, work is kept Platform 30 is rotated, and multiple positions of the outer peripheral edge of the wafer W kept using 40 pairs of holding workbench 30 of shooting unit are carried out Shooting.Then, such as to the coordinate of separated 3 point of outer peripheral edge detect, pass through the geometry of the coordinate based on 3 points Calculation process is learned, the accurate centre coordinate for keeping the wafer W on workbench 30 is found out.In addition, according to shooting figure is formed by Picture grasps the coordinate position of notch N.
Keep workbench 30 to wafer W carry out attracting holding after, make turntable 34 shown in FIG. 1 from +Z direction to Clockwise direction rotation.Then, the holding workbench 30 kept to wafer W revolves, according to thick grinding unit 31 The rotation center of corase grinding skiving tool 314a deviates defined distance and corase grinding relative to the rotation center of wafer W in the horizontal direction The rotational trajectory of skiving tool 314a positions wafer W by way of the rotation center of wafer W.In addition, according to as flat The mode retaining surface 300a of slow circular conical surface parallel with corase grinding skiving tool grinding surface (lower surface) of 314a, passes through tilt adjustment Mechanism 38 (referring to Fig. 2) is adjusted the inclination for keeping workbench 30, to follow retaining surface 300a and be attracted to maintain The back side Wb of wafer W is parallel with the corase grinding skiving tool grinding surface of 314a.
Thick grinding unit 31 is cut feed unit 35 by corase grinding and is fed to -Z direction, and the corase grinding skiving of rotation has 314a and protects The back side Wb for holding the wafer W that workbench 30 is kept is abutted and is carried out corase grinding and cut.In addition, with worktable rotary unit 37 is kept Make that workbench 30 is kept to be rotated according to the rotation speed of regulation, the wafer W on retaining surface 300a is also rotated, therefore thick It is ground the thick grinding that grinding tool 314a carries out the entire back side Wb of wafer W.In grinding, to corase grinding skiving tool 314a and wafer W The contact site of the back side Wb grinding water is provided, to contact site carry out it is cooling, clean.
Wafer W is slightly being ground to close to after completion thickness, corase grinding, which cuts feed unit 35, rises thick grinding unit 31 And leave wafer W.
Then, turntable 34 is made to rotate and will carry out to wafer W clockwise the guarantor of attracting holding from +Z direction Hold the lower section that workbench 30 is moved to fine ginding unit 32.After having carried out the contraposition of fine ginding grinding tool 324a and wafer W, essence Grinding unit 32 is fed downwards by fine ginding feed unit 36, the fine ginding grinding tool 324a of accompanying rotation and the back of wafer W Face Wb is abutted, and workbench 30 is kept to be rotated, so that the entire back side Wb to wafer W carries out fine ginding.
Make fine ginding unit 32 leave be ground to completion thickness and after improving the wafer W of the flatness of back side Wb, Make the rotation clockwise from +Z direction of turntable 34, so that wafer W is moved near the second transport unit 336. Then, the second transport unit 336 will keep the wafer W on workbench 30 to transport to cleaning unit 334.In cleaning unit 334 After being cleaned to wafer W, wafer W is moved out from cleaning unit 334 and moves in wafer W to the second box by robot 330 In 332.In grinding attachment 1, repeats such a series of grinding movement and multiple wafer Ws are ground.
As described above, when being ground to wafer W, grindstone dust or it the abrasive grain of threshing has occurred can enter Fig. 1 institute sometimes Between the retaining surface 300a of the holding workbench 30 shown and the protection band T for being pasted on wafer W, the grindstone dust or abrasive grain are attached to guarantor Hold face 300a.When being ground in this state to wafer W, the crackle (cross hairs) of cross shape is generated on the wafer W.Separately Outside, when being inhaled using retaining surface 300a to next wafer W in the state that the attachment remains on retaining surface 300a When drawing holding and being ground to the back side Wb of next wafer W, the crackle of cross shape is generated in next wafer W.
Therefore, cleaning unit 8 is moved in the Y-axis direction by Y-axis mobile unit 89, and cleaning grinding tool 82 is positioned at and is moved out The top of the retaining surface 300a of the holding workbench 30 of wafer W.Then, worktable rotary unit 37 is kept to make to keep workbench 30 rotations, and lifting unit 83 declines the cleaning grinding tool 82 of rotation, and cleaning grinding tool 82 is pressed into retaining surface 300a.In Be, will from retaining surface 300a, grindstone dust outstanding etc. is ground off upwards, retaining surface 300a is cleaned.
For example, the clear of the retaining surface 300a for using 8 pairs of holding workbench 30 of cleaning unit is added according to opportunity appropriate Wash and the case where multiple wafer Ws of continuous grinding etc., it is sometimes residual on the retaining surface 300a after the cleaning for having carried out cleaning unit 8 There are attachments, in this case, form cross on the back side Wb of the retaining surface 300a wafer W kept by grinding Line.
Therefore, it is necessary to prevent from being formed on the wafer W in the state of cross hairs being ground multiple wafer Ws, the present invention Grinding attachment 1 implement movement described below.
For example, multiple defined wafer Ws are ground to completion thickness by fine ginding and make fine ginding list shown in FIG. 1 After member 32 leaves wafer W, make the rotation clockwise from +Z direction of turntable 34, and Y-axis mobile unit 89 makes to clap Unit 40 is taken the photograph to move in the Y-axis direction, it can be to the back for the wafer W for keeping 30 attracting holdings of workbench according to shooting unit 40 The mode that face Wb is shot aligns wafer W and shooting unit 40.That is, as shown in Figure 3, Figure 4, shoot part 403 according to It is linear to be aligned above the center Wc of wafer W across to the mode above outer peripheral edge.In addition, being omitted in Fig. 3, Fig. 4 Structure other than the shoot part 403 of shooting unit 40 and show.
Then, worktable rotary unit 37 is kept to rotate holding workbench 30 under the control of control unit 9 defined Angle keeps the imaginary line L1 of the center Wc and notch N by wafer W parallel with X-direction, and will lack for example, as shown in figure 4 Mouth N is positioned at the position (0 degree of position as shooting starting position) of +X direction side.
In addition, shooting unit 40 is acted, move up and down shooting unit 40 by lifting unit 83 shown in Fig. 2 Carry out the focusing of object lens (not shown).It is focused in the focus of object lens in the opportunity of the back side Wb of wafer W, lifting unit 83 makes to shoot The stopping of unit 40 moves up and down.
In this state, as shown in Figure 3, Figure 4, worktable rotary unit 37 is kept for example to make to keep workbench 30 according to rule Fixed rotation speed rotates counterclockwise from +Z direction side.In addition, the illumination 400 of shooting unit 40 (referring to Fig. 2) Illumination is incident upon to the back side Wb of wafer W by half-reflecting mirror 402, the reflected light of the back side Wb from wafer W is by object (not shown) Mirror captures and is incident to the light receiving element of shoot part 403.Then, using shooting unit 40 from the center Wc of wafer W to its periphery Edge continuously shoots the back side Wb of the wafer W relative to 40 relative rotation of shooting unit line by line.
The shooting image of row (line) unit is gradually sent to Fig. 1, control unit shown in Fig. 29 by shoot part 403.It should The shooting image of row unit is successively stored in the way of it can constitute and shine upon the shooting image of the entire back side Wb of wafer W out The storage unit 90 of control unit 9.In addition, control unit 9 according to from make keep workbench 30 rotate holding worktable rotary Rotary encoder 379 (referring to Fig. 2) received code device signal of unit 37, will show 1 row relevant to the back side Wb of wafer W Shooting image and keep workbench 30 relative to take show 1 row shooting image when shooting starting position (0 degree of position Set) rotation angle establish association and be successively stored in storage unit 90.
Then, make shooting unit 40 in crystalline substance when keeping worktable rotary unit 37 to be rotated by 360 ° holding workbench 30 When completing one week above the back side Wb of piece W by (notch N, which is back to, shoots starting position), the entire of wafer W out is shone upon in formation The shooting image of back side Wb, and stop keeping the rotation of workbench 30.
The light quantity (light income) for being incident to the reflected light of each light receiving element of shoot part 403 has in the back side Wb of wafer W Difference can be generated in the case where cross hairs.That is, in each light receiving element of shoot part 403, have ten in the back side Wb of wafer W The position of wordline, light income increase, brightness value close to 255 and close to white, wafer W back side Wb do not have it is graticulated Region, light income are reduced, brightness value close to 0 and close to black.Therefore, the imagination of defined resolution ratio shown in Fig. 5 is defeated It is shown on frame out to shine upon in the shooting image G of the entire back side Wb of wafer W out, the cross hairs of the back side Wb of wafer W C Such as indicate that the back side Wb of surrounding wafer W is indicated with grey with white.
Furthermore it is possible to carry out binary conversion treatment to shooting image G, cross hairs C and its surrounding can be more clearly distinguished.
As shown in Figure 1 and Figure 2, grinding attachment 1 has detection unit 91, and the detection unit 91 is to captured by shooting unit 40 To shooting image G in cross hairs C detected, detection unit 91 is for example assembled to control unit 9.91 mapping of detection unit According to the Y direction of the pixel of the white in the back side Wb of the wafer W in shooting image G shown in fig. 5 (in gray area) The summation of the X-direction of the pixel of summation and white is counted, and is detected to cross hairs C, and calculate cross hairs C Size.In addition, determining the pixel of the intersection point of cross hairs C.
Then, the X-axis Y axis coordinate position of the pixel of the intersection point of detected cross hairs C is determined by detection unit 91. The coordinate position of center Wc with the wafer W for keeping the rotation center of workbench 30 substantially uniform is for example determined as origin (0,0) is drawn the imaginary line L2 of the pixel connection of origin (0,0) and the intersection point for indicating identified cross hairs C.Imagination Shooting when angle, θ 1 between line L1 and imaginary line L2 is with from the shooting image for taking the row unit for shining upon cross hairs C out is opened The angle that beginning position holding workbench 30 is rotated is identical, is stored in the known value of storage unit 90.
In addition, the length of imaginary line L2 passes through the pixel until origin (0,0) to the pixel of the intersection point of cross hairs C It counts and calculates (such as calculated value is set as r).Then, the X-axis Y-axis of the pixel of the intersection point of detected cross hairs C is sat Cursor position (x, y) is determined as (rcos θ 1 ,-rsin θ 1).It then, will be as the X-axis Y axis coordinate position of the intersection point of cross hairs C (rcos θ 1 ,-rsin θ 1) is stored in storage unit 90.
In addition, the determination of the X-axis Y axis coordinate position (x, y) of the pixel of the intersection point of detected cross hairs C is not limited to Above-mentioned example.Such as it is also possible to draw the imaginary line L3 vertical with imaginary line L1 (in Fig. 5 from the pixel of the intersection point of cross hairs C It is not shown), imagination is determined by the pixel counts until from origin (0,0) to the intersection point of imaginary line L1 and imaginary line L3 The X axis coordinate of the intersection point of line L1 and imaginary line L3.Then, further progress is from the intersection point of imaginary line L1 and imaginary line L3 to cross Pixel counts until the intersection point of line C and the intersection point Y axis coordinate position for determining cross hairs C, to finally determine the friendship of cross hairs C The X-axis Y axis coordinate position (x, y) of the pixel of point.
When the X-axis Y axis coordinate position (rcos θ 1 ,-rsin θ 1) of the intersection point of cross hairs C is stored in storage unit 90, Fig. 1, point light source shown in Fig. 2 41 are to the stored X-axis Y axis coordinate position (rcos θ 1 ,-the rsin θ of the back side Wb of wafer W 1) it is irradiated.That is, under the control of control unit 9, implement point light source 41 based on Y-axis mobile unit 89 in the Y-axis direction Movement, point light source 41 movement in the Z-axis direction and/or point light source 41 based on lifting unit 83 be based on adjustment (not shown) The adjustment of the incident angle for the point light of unit irradiated, so that point light source 41 puts diameter to the back side Wb of wafer W according to regulation The stored X-axis Y axis coordinate position (rcos θ 1 ,-rsin θ 1) be irradiated.In addition, the point diameter of the point light of point light source 41 Diameter e.g. bigger than the length in length and breadth of cross hairs C.
As previously described above, it when detection unit 91 detects cross hairs C, will be controlled from control unit 9 Signal is sent to notification unit 17, and notification unit 17 detects cross hairs C to operator's notice on the wafer W.In addition, controlling Under the control of unit 9, stop grinding movement and stops following movement: being moved in wafer W to removing using the first transport unit 335 The holding workbench 30 kept other than workbench 30 that the wafer W for being formed with cross hairs C is kept；Work is kept to other Make the thick grinding (fine ginding processing) for the wafer W that platform 30 is kept；Cross hairs will be formed with using the second transport unit 336 The wafer W of C is from the conveying of holding workbench 30 to cleaning unit 334；And rotation of turntable 34 etc..Operator will be formed as a result, There is the wafer W of cross hairs C from keeping workbench 30 to remove, grinding attachment 1 is then made to become the guarantor that can will keep workbench 30 Hold the state of the attachment removal of face 300a.
In addition, in the same manner as illustrated before, passing through turntable in the case where not detecting cross hairs C on the wafer W Wafer W is moved near the second transport unit 336 by 34 rotation, and the second transport unit 336 will be kept on workbench 30 Wafer W is transported to cleaning unit 334.
As described above, after the grinding movement that stopped grinding attachment 1, about the wafer W for being detected cross hairs C, Release keep workbench 30 to the attracting holding of wafer W after, the chip as uncomfortable combination product chip is by operator from guarantor Workbench 30 is held to move out.Therefore, according to the point diameter of regulation to the X-axis Y axis coordinate position of the storage of the back side Wb of wafer W The point light source 41 (referring to Fig. 2) that (rcos θ 1 ,-rsin θ 1) is irradiated is in a manner of light to being formed with cross on the wafer W The retaining surface 300a of the underface of the X-axis Y axis coordinate position (rcos θ 1 ,-rsin θ 1) of line C is irradiated.That is, becoming retaining surface Attachment (the reason of it as cross hairs C is formed on the wafer W) on 300a is shone in a manner of pinpoint by point light source 41 The state penetrated.
Operator can be grasped at once by the point light of point light source 41 and be attached with grindstone dust or abrasive grain on retaining surface 300a The position of equal attachments.Therefore, operator is for example able to use the tool (such as scraper plate or cleaning brush etc.) of attachment removal The attachment of at once by as cross hairs C the reason of is removed from retaining surface 300a.
After implementing operator as described above to the removal of the attachment of retaining surface 300a, according to can start again at Grinding attachment 1 is arranged by operator in the mode of the grinding movement of grinding attachment 1, thus will not be in next wafer W becoming It is formed on the holding workbench 30 of the retaining surface 300a of the state of cross hairs C and wafer W is kept, and implement the grinding.
In addition, grinding attachment 1 of the invention is not limited to the above embodiment, in addition, for each device shown in the drawings Structure etc., be also not necessarily limited to this, can suitably be changed in the range of can play effect of the invention.
Such as be also possible in the wafer W that will test cross hairs C by operator after keeping workbench 30 to move out, Point light source 41 starts the X-axis Y axis coordinate position (rcos θ 1 ,-rsin θ 1) to the intersection point for the cross hairs C for being stored in storage unit 90 It is irradiated.

Claims (1)

1. a kind of grinding attachment, includes
Workbench is kept, with porous plate, which has the retaining surface kept to chip；
Worktable rotary unit is kept, makes that workbench is kept to be rotated with the center axis of the holding workbench；
Grinding unit is ground the chip kept in the retaining surface using grinding grinding tool；
Notification unit notifies various information to operator；
Shooting unit, using illumination to the quilt of the chip being ground using the grinding grinding tool kept in the retaining surface Grinding surface is irradiated, and the shooting unit shoots ground face；
Detection unit detects the cross hairs in image taken by the shooting unit；
Storage unit stores the X-axis Y axis coordinate position of the intersection point of cross hairs detected by the detection unit；
Point light source, the X-axis Y axis coordinate position stored according to the storage unit are irradiated the retaining surface；And
Control unit makes the notification unit notify the detection unit to have detected that cross hairs, and the control list to operator Member makes the grinding of device act stopping.
CN201910211295.XA 2018-03-23 2019-03-20 Grinding attachment Pending CN110293480A (en)

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Application publication date: 20191001