CN110286441B - Optical antenna preparation method and optical chip - Google Patents
Optical antenna preparation method and optical chip Download PDFInfo
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- CN110286441B CN110286441B CN201910403568.0A CN201910403568A CN110286441B CN 110286441 B CN110286441 B CN 110286441B CN 201910403568 A CN201910403568 A CN 201910403568A CN 110286441 B CN110286441 B CN 110286441B
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- optical antenna
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- grating structure
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
Abstract
The embodiment of the invention provides an optical antenna preparation method and an optical chip, and belongs to the technical field of photons. The method comprises the following steps: carrying out single etching processing on a preset platform to obtain an optical antenna; the optical antenna comprises a waveguide region and a grating structure, wherein the grating structure is located on the side face of the waveguide region. According to the method provided by the embodiment of the invention, the optical antenna is obtained by carrying out single etching processing on the preset platform. The optical antenna preparation method and the optical chip provided by the embodiment of the invention can provide coupling efficiency which is comparable to that of multiple times of etching. Because can be through single etching process, the manufacturing process that etches the structure than many times is simpler, can show reduction in processing cost to the range of application is wider, and the practicality is preferred.
Description
Technical Field
The embodiment of the invention relates to the technical field of photons, in particular to a preparation method of an optical antenna and an optical chip.
Background
An optical antenna on a chip can convert light into and out of a waveguide on the chip and free space, and is a key device of an integrated optical platform. In the related art, the method mainly adopts a mode of multiple etching, so that the cost is high and the coupling efficiency is low. In addition, the optical chip including the optical antenna has a narrow application range and is poor in practicability.
Disclosure of Invention
In order to solve the above problems, embodiments of the present invention provide an optical antenna manufacturing method and an optical chip that overcome the above problems or at least partially solve the above problems.
According to a first aspect of embodiments of the present invention, there is provided a method for manufacturing an optical antenna, including:
carrying out single etching processing on a preset platform to obtain an optical antenna; the optical antenna comprises a waveguide region and a grating structure, wherein the grating structure is located on the side face of the waveguide region.
According to a second aspect of embodiments of the present invention, there is provided an optical chip including: an optical antenna prepared based on any one of the various possible implementations of the first aspect; one end of the waveguide region in the optical antenna is connected with other structures within the optical chip so that the optical paths communicate.
According to the optical antenna preparation method and the optical chip provided by the embodiment of the invention, the optical antenna is obtained by carrying out single etching processing on the preset platform. Because the coupling efficiency which is similar to that of multiple times of etching can be provided, the manufacturing process is simpler than that of a multiple times of etching structure through single etching processing, the processing cost can be obviously reduced, and therefore, the application range is wider, and the practicability is better.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of embodiments of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for manufacturing an optical antenna according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an optical antenna according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an optical antenna according to an embodiment of the present invention;
FIG. 4 is a diagram illustrating a far-field radiation field according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a far-field radiation optical field according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An on-chip optical antenna, which can interconvert light in an on-chip waveguide and free space, is a key device for an integrated optical chip. In the related art, the cost is high mainly by means of multiple etching.
In view of the problems in the related art, in combination with the above description, an embodiment of the present invention provides a method for manufacturing an optical antenna. Referring to fig. 1, the method includes: 101. carrying out single etching processing on a preset platform; 102. an optical antenna is obtained.
The optical antenna comprises a waveguide region and a grating structure, wherein the grating structure is located on the side face of the waveguide region. Based on the above description of the embodiments, as an alternative embodiment, the default platform is a wafer for integrated optical manufacturing. The structure of the optical antenna can refer to fig. 2, in fig. 2, the structure formed by 4 arcs is a grating structure. The 5 columnar regions are waveguide regions, and the length of the waveguide regions may be 80um as shown in the figure, or may be of other specifications, which is not specifically limited in this embodiment of the present invention. The region connected to the waveguide region is a region connected to the outside, the region is used for connecting to an external optical path, the length of the region may be 69um, the width may be 18um, and other specifications may also be used. The region corresponding to 1.4um is the channel for input waveguide, and 1.4um represents the channel width. It should be noted that the channel width of the input waveguide portion is 1.4um, which is mainly for matching the width of a single-mode waveguide on a preset platform, and this is not specifically limited in the embodiment of the present invention. Taking the preset platform as a flat plate as an example, the waveguide region and the grating structure are etched on the flat plate at a single time, and the shape structure thereof can refer to fig. 3.
According to the method provided by the embodiment of the invention, the optical antenna is obtained by carrying out single etching processing on the preset platform. Because the coupling efficiency which is similar to that of multiple times of etching can be provided, the manufacturing process is simpler than that of a multiple times of etching structure through single etching processing, the processing cost can be obviously reduced, and therefore, the application range is wider, and the practicability is better.
Based on the content of the above embodiments, as an alternative embodiment, the wafer for integrated optical manufacturing is a silicon nitride wafer or a silicon wafer on an insulating substrate. In particular, it may be a 200nm thick silicon nitride wafer.
The silicon nitride platform has the advantages of wide spectrum, low loss, low thermo-optic coefficient, CMOS compatibility and the like, and has wide application prospect in the fields of biosensing, laser radar and the like. Based on the above description of the embodiments, as an alternative embodiment, the predetermined mesa is a silicon nitride mesa. Of course, the present invention may also be a platform for other processes, and the embodiment of the present invention is not limited thereto.
Based on the content of the above embodiment, as an alternative embodiment, the grating structure is located at the side of the waveguide region; wherein light is guided through the waveguide region and interferes through the grating structure.
Based on the content of the above embodiments, as an alternative embodiment, the waveguide structure of the waveguide region is a strip waveguide, a tapered waveguide or a multi-mode interference coupler.
Based on the content of the above embodiments, as an alternative embodiment, the grating structure is composed of grating teeth, and the shape of the grating teeth is rectangular or arc.
Based on the content of the above embodiments, as an alternative embodiment, the grating period of the grating structure is 1.2 um.
In combination with the content of the above embodiments, the embodiment of the present invention further provides an optical chip. The optical chip includes: an optical antenna prepared according to any one of the above embodiments of the optical antenna preparation method; wherein one end of the waveguide region in the optical antenna is connected with other structures in the optical chip so that the optical paths are communicated.
Based on the content of the above embodiments, as an alternative embodiment, if the optical antenna is used as a light emitter in an optical chip, light enters the grating structure and the free space in the optical antenna from the waveguide area in sequence; the grating teeth in the grating structure have preset phase difference, and radiation spots can be formed in a far field through interference of light. Fig. 4 and 5 are schematic diagrams of the far-field radiation light field, and the off-white areas in fig. 4 and 5 are radiation light spots.
Based on the content of the above embodiments, as an alternative embodiment, if the optical antenna is used as an optical receiver, due to the reversibility of the optical path, the light irradiated on the grating structure in the optical antenna is coupled with the antenna mode field and enters the waveguide area.
For ease of understanding, the predetermined mesa is a silicon nitride mesa. The silicon nitride platform may be a silicon nitride chip, the thickness of which may be 200mm, and the structure dimensions of which refer to fig. 2 and 3. Where the width of the input waveguide section 1.4um is to match the width of a single mode waveguide on a selected silicon nitride platform. The grating period of the grating structure is 1.2um, the duty cycle can be 50%, and the radiation efficiency can be 37%.
The above-described method embodiments are merely illustrative, wherein units illustrated as separate components may or may not be physically separate, and components shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. An optical antenna manufacturing method, comprising:
carrying out single etching processing on a preset platform to obtain an optical antenna; the optical antenna comprises a waveguide region and a grating structure, wherein the grating structure is positioned on the side surface of the waveguide region;
wherein the grating structure comprises a plurality of grating teeth, and the waveguide region comprises a multipath waveguide structure;
the grating teeth are arc-shaped;
wherein the grating period of the grating structure is 1.2um, and the duty ratio is 50%;
the grating structure is positioned on the side surface of the waveguide region; wherein light is guided through the waveguide region and interferes through the grating structure.
2. The method of claim 1, wherein the predetermined platform is a wafer for integrated optical manufacturing.
3. The method of claim 2, wherein the wafer for integrated optical fabrication is a silicon nitride wafer or a silicon on insulator substrate.
4. The method of claim 1, wherein the waveguide structure of the waveguide region is a slab waveguide, a tapered waveguide, or a multimode interference coupler.
5. An optical chip, comprising: an optical antenna produced based on the method of any one of claims 1 to 4; one end of the waveguide region in the optical antenna is connected with other structures in the optical chip so that the optical paths are communicated.
6. The optical chip according to claim 5, wherein if the optical antenna is used as a light emitter in the optical chip, the light enters the grating structure and the free space in the optical antenna from the waveguide region in sequence; wherein, the grating teeth in the grating structure can form a radiation spot in a far field through the interference of light.
7. The optical chip according to claim 5, wherein if the optical antenna is used as a light receiver, light impinging on the grating structure in the optical antenna couples with the antenna mode field and enters the waveguide region.
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| KR100576712B1 (en) * | 2003-12-15 | 2006-05-03 | 한국전자통신연구원 | High frequency optical source integrated 3 dB coupler with gratings and method for fabricating the same |
| TWI229751B (en) * | 2003-12-26 | 2005-03-21 | Ind Tech Res Inst | Adjustable filter and manufacturing method thereof |
| US9036968B2 (en) * | 2011-07-13 | 2015-05-19 | Innolume Gmbh | Adiabatic mode-profile conversion by selective oxidation for photonic integrated circuit |
| US20150117817A1 (en) * | 2013-10-25 | 2015-04-30 | Forelux Inc. | Optical device for redirecting incident electromagnetic wave |
| JP6460637B2 (en) * | 2014-03-31 | 2019-01-30 | 富士通株式会社 | Semiconductor optical waveguide device |
| DE102017211910A1 (en) * | 2017-07-12 | 2019-01-17 | Dr. Johannes Heidenhain Gmbh | Diffractive biosensor |
| CN109283626B (en) * | 2018-11-06 | 2020-03-17 | 西安交通大学 | Compact Bragg reflector type concave diffraction grating wavelength division multiplexer and design method thereof |
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| CN101982796A (en) * | 2010-09-15 | 2011-03-02 | 中国科学院半导体研究所 | Silicon-on-insulator waveguide grating coupler and manufacturing method thereof |
| KR101872077B1 (en) * | 2015-11-17 | 2018-06-28 | 한국과학기술원 | Nanophotonic radiators using grating structures for photonic phased array antenna |
| CN109541744A (en) * | 2017-09-22 | 2019-03-29 | 北京万集科技股份有限公司 | A kind of silicon-based optical antenna and preparation method based on reflecting layer |
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