CN110281085A - A kind of magnetorheological grinding and polishing device of cluster and its application method - Google Patents
A kind of magnetorheological grinding and polishing device of cluster and its application method Download PDFInfo
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- CN110281085A CN110281085A CN201910676443.5A CN201910676443A CN110281085A CN 110281085 A CN110281085 A CN 110281085A CN 201910676443 A CN201910676443 A CN 201910676443A CN 110281085 A CN110281085 A CN 110281085A
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- cluster
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of magnetorheological grinding and polishing devices of cluster, comprising: polishing disk, the bottom surface of polishing disk are equipped at least one groove, and polishing absorption layer is equipped in groove, and polishing absorption layer is equipped at least one workpiece bearing slot；The side wall of polishing disk and bottom surface form the cavity for holding Magnetorheologicai polishing liquid；The abrasive material of Magnetorheologicai polishing liquid includes nanometer abrasive particle, bonding agent and micron magnetic-particle, and nanometer abrasive particle is wrapped in the outer surface of micron magnetic-particle under the action of bonding agent；At least one magnet assemblies set on the lower section of polishing disk, each magnet assemblies include at least two magnet arranged by default rule, so that the surface of workpiece is completely covered in the flexible polishing pad that Magnetorheologicai polishing liquid is formed；It is connected with magnet assemblies, for the magnetic pole driving device of the rotation of drive magnet component and revolution；Support device, polishing disk is height-adjustable to be set in support device.The invention also discloses a kind of application methods of above-mentioned magnetorheological grinding and polishing device of cluster.
Description
Technical field
The present invention relates to polissoir technical fields, more specifically to a kind of magnetorheological grinding and polishing device of cluster.
Moreover, it relates to a kind of application method of the magnetorheological grinding and polishing device of above-mentioned cluster.
Background technique
In technical fields such as optical element, semiconductor wafer, LED substrate and LCD panels, magnetorheological throwing is generallyd use
Light technology carries out polishing to workpiece, planarizes demand to meet the plane of optical element and semiconductor chip.
The polishing effect of Technique of Magnetorheological Finishing is good, subsurface will not be caused to damage workpiece surface, is particularly suitable for hard
The Ultra-precision Turning of crisp material.
The principle of cluster Magnetorheological Polishing is: being based on magnetic rheology effect, abrasive particle is added in magnetorheological fluid and forms throwing
Light liquid forms magnetic rheology effect by matrix of small-size magnetic body, and free abrasive is captured, constrains, is gathered in chainlike distribution
Magnetic particle between formed " micro- bistrique "；Multiple spot magnetic rheology effect " micro- bistrique " array combination is constituted flexible under cluster effect
Polishing pad, to be polished directly to workpiece surface.
The magnetorheological grinding and polishing device of cluster in the prior art, generally includes polishing disk, cluster magnetic substance, magnetorheological throwing
Light working solution, rubbing head main shaft and clamping device.Cluster magnetic substance is uniformly distributed in the lower section of polishing disk, magnetorheological for making
Polishing liquid generates magnetorheological micro- bistrique under magnetic fields；Rubbing head main shaft is for being arranged workpiece, and clamping device is for filling
Rubbing head main shaft is pressed from both sides, rubbing head main shaft and clamping device are set to above polishing disk, and when work, rubbing head main shaft drives workpiece to turn
It is dynamic, meanwhile, cluster magnetic substance is mobile, and the Magnetorheological Polishing working solution on polishing disk is made to generate magnetorheological micro- bistrique, workpiece rotation
When, with magnetorheological micro- bistrique relative motion, the lower surface of workpiece is polished directly using the top of magnetorheological micro- bistrique.
However, the magnetorheological grinding and polishing device of this cluster in the prior art, needs polishing disk to hold Magnetorheological Polishing
While working solution, it is also necessary to which rubbing head main shaft and clamping device realize the clamping of workpiece, guarantees that workpiece is opposite with this
The position of Magnetorheological Polishing working solution, structure is complicated.Simultaneously as workpiece setting on rubbing head main shaft, needs to pass through adjusting
The height of main shaft to guarantee to contact at the top of workpiece lower surface and magnetorheological micro- bistrique, and adjusts the inconvenient of main shaft.Furthermore
In process, while main shaft makes rotating motion, polishing disk is moved synchronously, and motion control is complicated and machine element is huge, is made
Valence is at high cost.In addition, magnetorheological micro- bistrique due to formation is " mountain font " structure, that is, the top surface of magnetorheological micro- bistrique
Product is minimum, therefore, carries out micro-cutting to workpiece using the top of magnetorheological micro- bistrique, polishing area is small, abrasive material utilization rate and throwing
Light efficiency is lower.It adds, due to the rejection sexual behaviour of magnetic-particle in Magnetorheologicai polishing liquid, causes flexible polishing pad close
The one side of magnet assembles a large amount of magnetic-particles, and a large amount of abrasive particles are assembled in one end far from magnet, and processing efficiency is not high and nothing
Method guarantees processing uniformity.Add finally, the abrasive grain of Magnetorheological Polishing working solution escapes out under the action of centrifugal force and cutting force
Work area domain realizes that abrasive material is updated from sharp, the abrasive grain renewal rate of the Magnetorheological Polishing working solution in the structure is relatively slow and utilization rate compared with
It is low.
In conclusion how to provide, a kind of structure is simple and convenient to operate, high in machining efficiency and abrasive grain is updated from sharp rate
The higher magnetorheological grinding and polishing device of cluster, is a problem to be solved by those skilled in the art.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of magnetorheological grinding and polishing device of cluster, structure is simple, operation side
Just, high in machining efficiency and abrasive grain updates higher from sharp rate.
It is a further object to provide a kind of application methods of above-mentioned magnetorheological grinding and polishing device of cluster.
To achieve the goals above, the invention provides the following technical scheme:
A kind of magnetorheological grinding and polishing device of cluster, comprising:
Polishing disk, the bottom surface of the polishing disk are equipped at least one groove, are equipped in the groove for workpiece to be arranged
Absorption layer is polished, the polishing absorption layer is equipped at least one workpiece bearing slot for being used to accommodate workpiece；The side of the polishing disk
Wall and the bottom surface form the cavity for holding Magnetorheologicai polishing liquid, so that the completely dipped workpiece table of the Magnetorheologicai polishing liquid
Face；The abrasive material of the Magnetorheologicai polishing liquid includes nanometer abrasive particle, bonding agent and micron magnetic-particle, the nanometer abrasive grain
Son is wrapped in the outer surface of the micron magnetic-particle under the action of bonding agent；
Set on the lower section of the polishing disk, for providing at least one group of magnets in magnetic field for the Magnetorheologicai polishing liquid
Part, each magnet assemblies include at least two magnet arranged by default rule, so that the Magnetorheologicai polishing liquid shape
At flexible polishing pad the surface of workpiece is completely covered；
It is connected with the magnet assemblies, the magnetic pole driving device for driving the magnet assemblies rotation and revolution；
For the support device of the polishing disk, the magnet assemblies and the magnetic pole driving device, the polishing to be arranged
Disk is height-adjustable to be set in the support device, changes the polishing disk and institute with the height by adjusting the polishing disk
The gap between magnet assemblies is stated, to adjust polish pressure.
Preferably, the magnetic pole driving device includes:
For exporting the rotation drive device of rotary motion；
The active external gear being connected with the output main shaft of the rotation drive device；
With the internal gear of active external gear coaxial arrangement；
Respectively with the active external gear and the internal gear engaged transmission planetary gear, the planetary gear quantity
Identical as the quantity of the magnet assemblies, the magnet assemblies are connected with planetary gear one-to-one correspondence.
Preferably, each magnet assemblies further include magnet retainer, and the magnet retainer is equipped with:
At least two for being arranged the magnet eccentric bushing of the magnet；
The connecting shaft being connected with the magnet eccentric bushing, the connecting shaft pass through eccentric sleeve and the planetary gear axis
Hole socket.
Preferably, described planetary gear one end is equipped with first end cover, and the connecting shaft is corresponding with the first end cover
Position is equipped at least a pair of of locating slot, and the connecting shaft and the first end cover are solid by the positioning pin cooperated with the locating slot
It is fixed to be connected.
Preferably, the rotation drive device includes:
For providing the driving motor of rotary power；
The driving pulley being connected with the line shaft of the driving motor；
Pass through the driven pulley of transmission V belt translation with the driving pulley；The output main shaft includes and the driven pulley
The transmission shaft being fixedly connected and the eccentric shaft being fixedly connected with the active external gear, the eccentric shaft and the transmission eccentric shaft
Setting, and the eccentric shaft is connected with the transmission shaft by transition axis.
Preferably, the polishing absorption layer include the electrical pure iron thin layer set gradually from bottom to top, it is PET film layer, porous
Film layer and surface protection film layer, between the electrical pure iron thin layer and the PET film layer and the PET film layer with it is described porous
Pass through two-sided glue sticking between film layer.
Preferably, the polishing disk is connected with the support device by adjusting knob, to pass through the adjusting knob
Forward and reverse rotation makes the polishing disk close to or far from the magnet assemblies.
Preferably, the top of the side wall is equipped with the gear for preventing the Magnetorheologicai polishing liquid from splashing in process
Plate.
A kind of application method of the magnetorheological grinding and polishing device of cluster is applied to the magnetorheological grinding of any one of the above cluster
Burnishing device, comprising:
It is required according to the size of workpieces processing, the magnet of suitable dimension, suitable quantity and suitable magnetic field strength is selected, by institute
There is the magnet to arrange according to default rule, forms a magnet assemblies, filled with forming local cluster magnet dynamic magnetic field
It sets；
It determines the appropriate number of magnet assemblies, all magnet assemblies is set to the predeterminated position below polishing disk
Place, and the magnet assemblies is made to be connected with magnetic pole driving device, to form global cluster magnet dynamic magnetic field generating device；
It is required according to the size of workpieces processing, selects suitable polishing absorption layer, the polishing absorption layer is placed on institute
It states in the groove on polishing disk, and workpieces processing is placed in the workpiece bearing slot on the polishing absorption layer；
Magnetorheologicai polishing liquid is configured, manufactured Magnetorheologicai polishing liquid is injected into the cavity of the polishing disk, until magnetic
The completely dipped workpiece surface of rheology polishing fluid；
Start magnetic pole driving device, make magnetic pole driving device drive each magnet rotation in the magnet assemblies and
Revolution, the Magnetorheologicai polishing liquid form dynamic flexible bistrique, multiple dynamic flexible bistriques under the action of the magnet
Cluster forms dynamic flexible polishing pad；
By adjusting the height of the polishing disk, to adjust the gap between the polishing disk and the magnet assemblies, with
Guarantee grinding and polishing pressure and forms the dynamic flexible polishing pad stabilization；
The dynamic flexible polishing pad follows the magnet rotation and revolution, to realize the abrasive grain of the Magnetorheologicai polishing liquid
Update and from sharp, so that the dynamic flexible polishing pad is carried out micro-cutting to workpiece surface, complete the grinding to workpiece surface and throw
Light.
The magnetorheological grinding and polishing device of cluster provided by the invention, is provided with polishing absorption layer, workpiece is set on polishing disk
It sets in the workpiece bearing slot of polishing absorption layer, Magnetorheologicai polishing liquid injects in the cavity of polishing disk, and dipped workpiece table completely
Face, when work, under the action of magnetic pole driving device, the rotation of drive magnet component and revolution make the magnetorheological throwing in polishing disk
Light liquid forms more than two flexible bistriques, is polished directly using the bottom of flexible bistrique to workpiece surface.
Compared with the prior art, the magnetorheological grinding and polishing device of the cluster adsorbs fixed workpiece using polishing absorption layer,
The clamping of workpiece is realized without rubbing head main shaft and clamping device, structure is simple；And, it is only necessary to it is driven by magnetic pole
Dynamic device drive magnet component rotation and revolution, without being further added by driving device driving workpiece rotation, movement is simple；Separately
Outside, can be by the way that multiple grooves be arranged in polishing disk, and multiple workpiece bearing slots are set to greatly improve once in polishing absorption layer
Property participate in grinding and polishing workpiece quantity.
Simultaneously as the completely dipped workpiece surface of Magnetorheologicai polishing liquid, the flexible bistrique that Magnetorheologicai polishing liquid is formed is located at
Above workpiece, that is, the present invention carries out micro-cutting to workpiece using the bottom of flexible bistrique, due to the bottom area of flexible bistrique
Therefore maximum increases polishing area, improve abrasive material utilization rate and polishing efficiency.
In addition, the polishing disk in the present invention is height-adjustable in support device, by adjusting the height of polishing disk, come
The gap between polishing disk and magnet assemblies is adjusted, so that the adjustable flexible polishing pad that is formed by is to the polish pressure of workpiece,
In conjunction with revolution revolving speed and rotation revolving speed that magnetic pole driving device exports, the bond strength of workpiece and flexible polishing pad can be changed,
To form stable flexible polishing pad.
Furthermore since the abrasive material of the Magnetorheologicai polishing liquid in the present invention includes nanometer abrasive particle, bonding agent and micron magnetic
Property particle, nanometer abrasive particle are wrapped in the outer surface of micron magnetic-particle under the action of bonding agent.Therefore, it can avoid magnetism
The rejection sexual behaviour of particle avoids flexible polishing pad from assembling a large amount of magnetic-particles by the one side of near magnet, and one far from magnet
The phenomenon that a large amount of abrasive particles, is assembled at end, so as to improve processing efficiency, guarantees the uniformity of workpiece grinding.
Finally, due to single magnet assemblies include more than two magnet, magnetic pole driving device drive magnet component from
When turning and revolving, the Magnetorheologicai polishing liquid in polishing disk is made to form more than two flexible bistriques, it is middle single compared with the prior art
The magnet of a monolith, during magnetic pole driving device is with magnet assemblies rotation and revolution, the corresponding flexibility of each magnet
The abrasive grain of bistrique is easier to escape out machining area under the action of centrifugal force and cutting force, realize the update of abrasive material from sharp, together
When, it can be by changing the rotational velocity and revolution speed of magnet assemblies, the update of Lai Tigao abrasive material is from sharp speed.Therefore, the collection
It is quick from sharp with abrasive material that the magnetorheological grinding and polishing device of group can be realized quickly updating for Magnetorheologicai polishing liquid.
The application method of the magnetorheological grinding and polishing device of cluster provided by the invention is applied to the magnetorheological grinding of above-mentioned cluster
Burnishing device has above-mentioned beneficial effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the structural schematic diagram of the magnetorheological grinding and polishing device of cluster provided by the specific embodiment of the invention；
Fig. 2 is the top view of polishing disk in Fig. 1；
Fig. 3 is the top view of magnet assemblies in Fig. 1；
Fig. 4 is planetary gear distribution schematic diagram in Fig. 1；
Fig. 5 is the schematic diagram for the flexible bistrique that the Magnetorheologicai polishing liquid in Fig. 1 in polishing disk is formed；
Fig. 6 is the top view that absorption layer is polished in Fig. 1；
Fig. 7 is the cross-sectional view of polishing absorption layer shown in Fig. 6.
Appended drawing reference of the Fig. 1 into Fig. 7 is as follows:
1 be polishing disk, 11 be baffle, 12 be groove, 13 be boss, 2 be magnet assemblies, 21 be magnet, 22 be magnet protect
Hold frame, 221 be magnet eccentric bushing, 222 be connecting shaft, 31 be output main shaft, 32 be active external gear, 33 be internal gear, 34 be
Planetary gear, 341 be first end cover, 342 be endcap support frame, 35 be driving motor, 36 be driving pulley, 37 be driven belt
Wheel, 38 be transmission belt, 4 be eccentric sleeve, 5 be positioning pin, 6 be polish absorption layer, 61 be electrical pure iron thin layer, 62 be PET film
Layer, 63 be porous membrane layer, 64 be surface protection film layer, 65 be double-sided adhesive, 71 be support frame, 72 be fixed frame, 721 be heat dissipation
Hole, 73 be pedestal, 8 be adjusting knob, 91 be Magnetorheologicai polishing liquid, 92 be flexible bistrique, 01 be workpiece.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Core of the invention is to provide a kind of magnetorheological grinding and polishing device of cluster, and structure is simple and convenient to operate, processing is imitated
Rate is high and abrasive grain update is higher from sharp rate.Another core of the invention is to provide a kind of magnetorheological grinding and polishing of above-mentioned cluster
The application method of device.
Fig. 1-Fig. 7 is please referred to, Fig. 1 is the knot of the magnetorheological grinding and polishing device of cluster provided by the specific embodiment of the invention
Structure schematic diagram；Fig. 2 is the top view of polishing disk；Fig. 3 is the top view of magnet assemblies；Fig. 4 is planetary gear distribution schematic diagram；
Fig. 5 is the schematic diagram for the flexible bistrique that the Magnetorheologicai polishing liquid in polishing disk is formed；Fig. 6 is the top view for polishing absorption layer；Fig. 7
For the cross-sectional view for polishing absorption layer shown in Fig. 6.
The present invention provides a kind of magnetorheological grinding and polishing device of cluster, is mainly used for being polished directly crystal column surface,
Including polishing disk 1, magnet assemblies 2, magnetic pole driving device and support device.
Polishing disk 1 is for being arranged workpiece 01 and holding Magnetorheologicai polishing liquid 91, that is to say, that is arranged on polishing disk 1 useful
In the station for placing workpiece 01, and polishing disk 1 has circumferential side wall, to form the cavity for accommodating Magnetorheologicai polishing liquid 91.
Specifically, the bottom surface of polishing disk 1 is equipped at least one groove 12, and the throwing for workpiece 01 to be arranged is equipped in groove 12
Light absorption layer 6, polishing absorption layer 6 are equipped at least one workpiece bearing slot for being used to accommodate workpiece 01.The side wall of polishing disk 1 and bottom
Face forms the cavity for holding Magnetorheologicai polishing liquid 91, so that dipped 01 surface of workpiece completely of Magnetorheologicai polishing liquid 91.
Preferably, the central part of polishing disk 1 be equipped with boss 13, polishing disk 1 around central part annular region set there are four
For the groove 12 of polishing absorption layer 6 to be arranged.
Preferably, polishing absorption layer 6 is round polishing absorption layer 6, and accordingly, groove 12 is circular groove.
In processing, workpiece 01 is placed in the workpiece bearing slot of polishing absorption layer 6, and by 91 note of Magnetorheologicai polishing liquid
Enter into the cavity of polishing disk 1, Magnetorheologicai polishing liquid 91 is made to be totally submerged 01 surface of workpiece, in order to subsequent in magnet assemblies 2
In magnet 21 act under, enable Magnetorheologicai polishing liquid 91 formed flexible polishing pad 01 surface of workpiece is completely covered, thus
Grinding is carried out to 01 surface of workpiece.
The lower section of polishing disk 1 is arranged in magnet assemblies 2, for providing magnetic field for Magnetorheologicai polishing liquid 91, so that magnetorheological
Polishing fluid 91 occurs magnetorheological and forms flexible polishing pad under the magnetic fields of magnet assemblies 2.
It should be noted that the quantity of magnet assemblies 2 is at least one, those skilled in the art can be according to actual needs
It selects, the quantity of magnet assemblies 2 is more, then processing efficiency is higher.Preferably, the quantity of magnet assemblies 2 is four.
Each magnet assemblies 2 include at least two magnet 21, and all magnet 21 in single magnet assemblies 2 are towards polishing
In the same plane, magnet 21 is preferably strength columnar magnet 21, and the magnetic field strength of magnet 21 is preferably 0.1T for the end face of disk 1
~2T, the diameter of magnet 21 are preferably 5mm~50mm, and the particular number and size of magnet 21 can be according to the rulers of workpiece to be processed 01
It is very little to reasonably select；In addition, it is necessary to illustrate, all magnet 21 in single magnet assemblies 2 are arranged by default rule, so that
01 surface of workpiece can be completely covered in the flexible polishing pad that Magnetorheologicai polishing liquid 91 is formed.
It is understood that each magnet 21 in single magnet assemblies 2 can make Magnetorheologicai polishing liquid 91 form flexibility
Bistrique 92, corresponding flexible 92 cluster of bistrique of all magnet 21 in single magnet assemblies 2 form flexible polishing pad, this field skill
Art personnel can according to need selection suitable dimension, appropriate number of magnet 21, and by default rule arrangement, to form covering
Continuous polishing pad in 01 surface of workpiece.
It should be noted that the present invention does not limit the default arrangement rule of all magnet 21 in single magnet assemblies 2
It is fixed, for instance, it is preferred that the quantity of the magnet 21 in single magnet assemblies 2 is six, then it is the center of circle with a magnet 21, it is other
Five magnet 21 are uniformly distributed around the circumferential direction of intermediate magnet 21；Further, magnetic pole of the intermediate magnet 21 towards polishing disk 1
With five peripheral magnet 21 towards the magnetic pole of polishing disk 1 on the contrary, that is, the magnetic pole of the magnet 21 of periphery towards polishing disk 1 is protected
It holds unanimously, to form continuous polishing pad.
Magnetic pole driving device is connected with magnet assemblies 2, is used for 2 rotation of drive magnet component and revolution, 2 rotation of magnet assemblies
When, local dynamic magnetic field generating device is formed, to make the flexible polishing pad of the formation local cluster of Magnetorheologicai polishing liquid 91；Magnetic
When iron component 2 revolves, global dynamic magnetic field generating device is formed, so that Magnetorheologicai polishing liquid 91 be made to form the dynamic of global cluster
State flexible polishing pad, with using dynamic flexible polishing pad to 01 surface of workpiece carry out micro-cutting, with reach to 01 surface of workpiece into
The purpose of row grinding and polishing.
It is understood that forming more than two flexibilities since single magnet assemblies 2 include more than two magnet 21
Bistrique 92, compared with the prior art in single monolith magnet 21, in magnetic pole driving device with 2 rotation of magnet assemblies and revolution
During, the abrasive grain of the corresponding flexibility bistrique 92 of each magnet 21 is easier to escape out under the action of centrifugal force and cutting force
Machining area, realize the update of abrasive material from sharp, meanwhile, can be by changing the rotational velocity and revolution speed of magnet assemblies 2, to mention
The update of high abrasive material is from sharp speed.Therefore, the magnetorheological grinding and polishing device of the cluster can be realized the fast of Magnetorheologicai polishing liquid 91
Speed updates quick from sharp with abrasive material.
It should be noted that the present embodiment to the specific structure of magnetic pole driving device without limitation, as long as magnetic can be driven
2 rotation of iron component and revolution.
Support device primarily serves the effect of carrying, is used to support or fixes polishing disk 1, magnet assemblies 2 and magnetic pole driving
Device.Without limitation to the specific structure of support device, those skilled in the art can select the present invention according to actual needs.
In order to adjust the polish pressure that the flexible polishing pad of the formation of Magnetorheologicai polishing liquid 91 applies workpiece 01, polishing disk 1
It is height-adjustable to be set in support device, changed between polishing disk 1 and magnet assemblies 2 with the height by adjusting polishing disk 1
Gap, to facilitate adjustment flexible polishing pad to the polish pressure of workpiece 01.
The present invention is by adjusting the gap between polishing disk 1 and magnet assemblies 2, to change flexible polishing pad to workpiece 01
Polish pressure.
It is understood that the gap between polishing disk 1 and magnet assemblies 2 is smaller, then magnetic field strength is bigger, flexible polishing
The bond strength of pad is bigger, thus bigger to the polish pressure of the application of workpiece 01.Those skilled in the art can be according to practical need
The gap between polishing disk 1 and magnet assemblies 2 is adjusted, so that flexible polishing pad applies suitable polishing pressure to workpiece 01
Workpiece 01 and flexible polishing pad can be changed in conjunction with revolution revolving speed and rotation revolving speed that adjustment magnetic pole driving device exports in power
Bond strength, so that Magnetorheologicai polishing liquid 91 be made to form stable flexible polishing pad.
In addition, compared with the prior art, the magnetorheological grinding and polishing device of the cluster adsorbs fixation using polishing absorption layer 6
Workpiece 01, the clamping of workpiece 01 is realized without rubbing head main shaft and clamping device, and structure is simple；And, it is only necessary to
By 2 rotation of magnetic pole driving device drive magnet component and revolution, rotated without being further added by driving device driving workpiece 01,
Movement is simple；In addition, can be by the way that multiple grooves 12 are arranged in polishing disk 1, and multiple workpiece bearing slots are set in polishing absorption layer 6
To greatly improve the quantity of the disposable workpiece 01 for participating in grinding and polishing.
Simultaneously as dipped 01 surface of workpiece completely of Magnetorheologicai polishing liquid 91, the flexible mill that Magnetorheologicai polishing liquid 91 is formed
First 92 are located at 01 top of workpiece, that is, the present invention carries out micro-cutting to workpiece 01 using the bottom of flexible bistrique 92, due to flexibility
The bottom area of bistrique 92 is maximum, therefore, increases polishing area, improves abrasive material utilization rate and polishing efficiency.
In view of the realization of magnetic pole driving device specific structure, on the basis of above-described embodiment, magnetic pole driving device
Including rotation drive device, active external gear 32, planetary gear 34 and internal gear 33, rotation drive device is for exporting rotation fortune
Dynamic, active external gear 32 is connected with the output main shaft 31 of rotation drive device, and internal gear 33 and active external gear 32 are coaxially disposed,
Planetary gear 34 engages connection, quantity and the magnet assemblies 2 of planetary gear 34 with active external gear 32 and internal gear 33 respectively
Quantity is identical, and magnet assemblies 2 are connected with the one-to-one correspondence of planetary gear 34.
When work, under the action of rotation drive device, output main shaft 31 drives active external gear 32 to rotate, to make to go
Star gear 34 with 33 engaged transmission of active external gear 32 and internal gear, realizes the rotation and revolution of planetary gear 34, in turn respectively
Make planetary gear 34 that magnet assemblies 2 be driven to synchronize rotation and revolution, the Magnetorheologicai polishing liquid 91 in polishing disk 1 is in group of magnets
Under magnet 21 in part 2 acts on, dynamic flexible bistrique 92 is formed, more than two 92 clusters of dynamic flexible bistrique are formed dynamically
Flexible polishing pad, dynamic flexible polishing pad follow 2 rotation of magnet assemblies and revolution, to carry out grinding throwing to 01 surface of workpiece
Light, and realize the update of abrasive grain and from sharp, process 01 surface of workpiece more uniform and smooth.
It should be noted that the present embodiment to the specific structure of rotation drive device without limitation, as long as rotation can be exported
Transhipment is dynamic.
In view of the stationarity of movement, on the basis of above-described embodiment, rotation drive device include driving motor 35,
Driving pulley 36, driven pulley 37 and transmission belt 38, driving motor 35 is for providing rotary power, driving pulley 36 and driving electricity
The line shaft of machine 35 is connected, the transmitting of driving pulley 36 and driven pulley 37 by the realization movement of transmission belt 38, driven pulley 37
It is connected with output main shaft 31, based on being changed by the rotary power for exporting the driving motor 35 that main shaft 31 transmits transmission belt 38
The rotation of dynamic external gear 32.
Preferably, driving pulley 36 is fixed on the line shaft of driving motor 35 by the first flat key.
Preferably, driven pulley 37 is fixed on one of output main shaft 31 far from active external gear 32 by the first fixing screws
End.
In order to improve the linear velocity of active external gear 32, as a preferred embodiment, output main shaft 31 include transmission shaft, partially
The axis of mandrel and transition axis, eccentric shaft and transmission shaft is not conllinear, that is, eccentric shaft and transmission shaft eccentric setting, transmission shaft with
Driven pulley 37 is fixedly connected, and eccentric shaft is fixedly connected with active external gear 32, and transition axis is set between transmission shaft and eccentric shaft,
For realizing being indirectly connected with for transmission shaft and eccentric shaft.
That is, eccentric setting of the present embodiment by eccentric shaft, linear velocity at Lai Tigao eccentric shaft axle center is mentioned with this
The linear velocity of high active external gear 32.
Preferably, active external gear 32 is fixed on eccentric shaft by the second flat key.
In view of the realization of the specific structure of magnet assemblies 2, on the basis of above-mentioned each embodiment, each group of magnets
Part 2 further includes magnet retainer 22, and magnet retainer 22 is equipped with magnet 21 and accommodates set and connecting shaft 222, and magnet 21 accommodates set
For magnet 21 to be arranged, the quantity that magnet 21 accommodates set is identical as the quantity of magnet 21, is at least two；Connecting shaft 222 and magnetic
Iron 21 accommodates set and is connected, for magnet retainer 22 to be fixed on planetary gear 34, the axis of connecting shaft 222 and planetary gear 34
Hole is sleeved and fixed.
In order to improve the linear velocity of magnet 21, as a preferred embodiment, it is magnet eccentric bushing 221 that magnet 21, which accommodates set,
That is, the axle center of magnet 21 is not conllinear with the axle center of magnet eccentric bushing 221.
Further, in order to avoid leakage field, magnet eccentric bushing 221 is diamagnetism magnet eccentric bushing 221, for example, magnet is inclined
Heart set 221 includes stainless steel magnet eccentric bushing 221, copper alloy magnet eccentric bushing 221 or ceramic magnet eccentric bushing 221.
In order to improve the whole linear velocity of magnet retainer 22, as a preferred embodiment, connecting shaft 222 passes through eccentric bushing
Cylinder 4 and the axis hole of planetary gear 34 are sleeved and fixed.
In view of the tightness that connecting shaft 222 is connect with planetary gear 34, the axis of connecting shaft 222 Yu planetary gear 34 is avoided
Hole relatively rotates, and on the basis of above-described embodiment, one end of planetary gear 34 is equipped with first end cover 341, connecting shaft 222 with
The corresponding position of first end cover 341 is equipped at least a pair of of locating slot, and connecting shaft 222 is with first end cover 341 by matching with locating slot
The positioning pin 5 of conjunction is fixedly linked.
That is, the present embodiment passes through the mating connection of positioning pin 5 and locating slot, Lai Shixian connecting shaft 222 and first
End cap 341 is fixedly connected, constant come the relative positional relationship both kept with this, avoids connecting shaft 222 during rotation
It is rotated in the axis hole of planetary gear 34.
In view of the connection relationship of first end cover 341 and planetary gear 34, it is preferable that first end cover 341 is solid by second
Determine screw and is connected with planetary gear 34 far from one end of magnet retainer 22.
In order to improve polishing absorption layer 6 to the stability of workpiece support, it is ensured that the flatness of workpiece, in above-mentioned each implementation
On the basis of example, polishing absorption layer 6 includes electrical pure iron thin layer 61, the PET film layer 62, perforated membrane set gradually from bottom to top
Layer 63 and surface protection film layer 64, between electrical pure iron thin layer 61 and PET film layer 62 and PET film layer 62 and porous membrane layer 63 it
Between be bonded by double-sided adhesive 65.
It is understood that magnetic field strength can be enhanced in electrical pure iron thin layer 61, guarantee 91 particle quilt of Magnetorheologicai polishing liquid
Polishing 6 surface of absorption layer is constrained in, flexible polishing pad is formed, to improve the grinding polishing effect to 01 surface of workpiece.
PET film layer 62 is used to construct the bearing position of support workpiece 01, in order to support workpiece 01.
The surface of porous membrane layer 63 has many microcellular structures, and performance can adsorb workpiece 01 just as vacuum state,
Fix workpiece more stable, so as to preferably guarantee the flatness of workpiece；Porous membrane layer 63 includes that urethane pad is porous
Film layer 63, fabric pad porous membrane layer 63, polyethylene pads porous membrane layer 63, various coarse cloth pad porous membrane layer 63 and villus cloth pad
The combination of one or more of porous membrane layer 63.
Surface protection film layer 64 is for collecting processing remover, transmission Magnetorheologicai polishing liquid 91 and improving polishing absorption layer
6 corrosion and wear resistance performance etc..
It is equipped between electrical pure iron thin layer 61 and PET film layer 62 and between PET film layer 62 and porous membrane layer 63 two-sided
Glue 65, to realize connection between layers.
In view of the convenience that gap adjusts between polishing disk 1 and magnet assemblies 2, on the basis of above-described embodiment,
Polishing disk 1 is connected with support device by adjusting knob 8, to pass through forward and reverse rotation of adjusting knob 8, keeps polishing disk 1 close
Or far from magnet assemblies 2.
Preferably, support device includes the support frame 71 for being used to support polishing disk 1, and support frame 71 and polishing disk 1 pass through tune
Knob 8 is saved to be connected.
That is, the present embodiment rotates the lifting, it can be achieved that polishing disk 1 by the forward and reverse of adjusting knob 8, with
This adjusts the gap between polishing disk 1 and magnet assemblies 2, to achieve the purpose that change polish pressure.
Further it will be understood that under the action of dynamic magnetic field, Magnetorheologicai polishing liquid 91 is being centrifuged in process
Under the action of power, there is the trend splashed to the edge part of polishing disk 1, in process in order to avoid Magnetorheologicai polishing liquid 91
It splashes, on the basis of above-mentioned each embodiment, the top of the edge part of polishing disk 1 is equipped with for preventing Magnetorheologicai polishing liquid
91 baffles 11 to splash in process.
Preferably, baffle 11 is fixed on polishing disk 1 by third screw.
On the other hand, it is contemplated that the fixed form of magnetic pole driving device and support device, on the basis of above-described embodiment
On, support device further includes pedestal 73 and fixed frame 72, and fixed frame 72 is fixed on pedestal 73 by the 4th screw, support frame 71
It is fixed on fixed frame 72 by the 5th screw.
Preferably, 35 fixing seat of driving motor is fixed on pedestal 73 by the 6th screw；Driving motor 35 is fixed on drive
In dynamic 35 fixing seat of motor.
In view of the heat dissipation problem of driving motor 35, it is preferable that fixed frame 72 is offered close to the side of driving motor 35
Several heat release holes 721.
It is further preferred that fixed frame 72 is equipped with the hollow cavity for output main shaft 31 to be arranged, output main shaft 31 passes through
Bearing is connected with hollow cavity.
Preferably, the quantity of bearing is a pair, is respectively arranged on the both ends of the transmission shaft of output main shaft 31.
It preferably, further include the inner sleeve and outer sleeve for being respectively used to the inner ring and outer ring of positioning bearing, inner sleeve and biography
Moving axis socket, outer sleeve are set in hollow cavity.
It is further preferred that the peripheral part of the transition axis of output main shaft 31 is arranged with main shaft end cap, main shaft end cap passes through the
Seven screws are fixed on fixed frame 72.
It is further preferred that further include the endcap support frame 34271 for being used to support the first end cover 341 of planetary gear 34,
Endcap support frame 34271 is fixed on fixed frame 72 by the 8th screw.
It should be noted that the present invention is not specifically limited the abrasive material in Magnetorheologicai polishing liquid 91, can directly select existing
There is 91 abrasive material of conventional Magnetorheologicai polishing liquid in technology.However, due to magnetic of 91 abrasive material of existing conventional Magnetorheologicai polishing liquid
The rejection sexual behaviour of grain causes flexible polishing pad to assemble a large amount of magnetic-particles by the one side of near magnet 21, and far from magnet 21
A large amount of abrasive particles are assembled in one end, so that biggish polish pressure is needed, ability effectively 01 surface of grinding and polishing workpiece, to solve
This problem, on the basis of above-mentioned each embodiment, the abrasive material of Magnetorheologicai polishing liquid 91 includes nanometer abrasive particle, combines
Agent and micron magnetic-particle, nanometer abrasive particle are wrapped in the outer surface of micron magnetic-particle under the action of bonding agent.
Preferably, nanometer abrasive particle includes that nanometer silicon carbide abrasive particle, diamond nano abrasive particle, sapphire are received
One of rice abrasive particle, silica nanometer abrasive particle, cerium dioxide nano abrasive particle are any two or more
Combination.
Preferably, micron magnetic-particle includes iron powder micron magnetic-particle, carbonyl iron dust micron magnetic-particle, reduced iron powder
One of micron magnetic-particle or any two or more combination.
It should be noted that bonding agent is the conventional binders of this field, the present invention is not specifically limited.
Further, nanometer abrasive particle is wrapped up under the action of bonding agent by sintering process, gel method or spray-on process
In the outer surface of micron magnetic-particle.
In addition to the magnetorheological grinding and polishing device of above-mentioned cluster, the present invention also provides cluster magnetic disclosed in a kind of above-described embodiment
The application method of rheology grinding and polishing device, the application method the following steps are included:
It is required according to the size of workpieces processing 01, selects the magnet 21 of suitable dimension, suitable quantity and suitable magnetic field strength,
All magnet 21 are arranged according to default rule, form a magnet assemblies 2, to form the generation of local cluster magnet dynamic magnetic field
Device；
It determines appropriate number of magnet assemblies 2, all magnet assemblies 2 is set to the predetermined position of 1 lower section of polishing disk, and
Magnet assemblies 2 are made to be connected with magnetic pole driving device, to form global cluster magnet dynamic magnetic field generating device；
It is required according to the size of workpieces processing 01, selects suitable polishing absorption layer 6, polishing absorption layer 6 is placed on throwing
In groove 12 on CD 1, and workpieces processing 01 is placed in the workpiece bearing slot on polishing absorption layer 6；
Magnetorheologicai polishing liquid 91 is configured, manufactured Magnetorheologicai polishing liquid 91 is injected into the cavity of polishing disk 1, until magnetic
The dipped workpiece surface completely of rheology polishing fluid 91；
Start magnetic pole driving device, magnetic pole driving device made to drive 21 rotation of each magnet and revolution in magnet assemblies 2,
Magnetorheologicai polishing liquid 91 forms dynamic flexible bistrique 92 under the action of magnet 21, and multiple 92 clusters of dynamic flexible bistrique form dynamic
State flexible polishing pad；
By adjusting the height of polishing disk 1, to adjust the gap between polishing disk and magnet assemblies 2, to guarantee that grinding is thrown
Light pressure simultaneously forms dynamic flexible polishing pad stabilization；
Dynamic flexible polishing pad follows 21 rotation of magnet and revolution, with realize the abrasive grain of Magnetorheologicai polishing liquid update and from
It is sharp, so that dynamic flexible polishing pad is carried out micro-cutting to 01 surface of workpiece, completes the grinding and polishing to workpiece surface.
Below by taking the magnetorheological grinding and polishing device of cluster shown in FIG. 1 as an example, the magnetorheological grinding of the cluster is discussed in detail
The application method of burnishing device.
Step S1: requiring according to the size of workpieces processing 01, selects suitable dimension, suitable quantity and suitable magnetic field strength
Magnet 21 is arranged on magnet retainer 22 according to default rule, forms a magnet assemblies 2, to form local cluster magnetic
21 dynamic magnetic field generating device of iron.
For example, selecting 24 diameters when processing two inches of monocrystalline silicon substrate as 15mm and magnetic field strength being
The untapered cylindrical strong magnets 21 of 0.5T.
When processing four inches of silicon carbide substrate, selects 24 diameters for 30mm and magnetic field strength is the flat of 0.5T
The cylindrical strong magnets 21 of head.
Step S2: determining appropriate number of magnet assemblies 2, selects planetary gear 34 identical with 2 quantity of magnet assemblies, makes
Planetary gear 34 engages installation with active external gear 32 and internal gear 33 respectively, and magnet retainer 22 and planetary gear 34 is fixed
Connection, to form global 21 dynamic magnetic field generating device of cluster magnet.
Step S3: requiring according to the size of workpieces processing 01, selects suitable polishing absorption layer 6, polishing absorption layer 6 is put
It sets in the groove 12 on polishing disk 1, and workpieces processing 01 is placed in the workpiece bearing slot on polishing absorption layer 6.
For example, selection sets the polishing absorption layer 6 there are four workpiece bearing slot when processing two inches of monocrystalline silicon substrate；
Preferably, polishing absorption layer 6 selects polyurethane matter to polish absorption layer 6.
When processing four inches of silicon carbide substrate, selection sets the polishing absorption layer 6 there are three workpiece bearing slot；It is preferred that
Ground, polishing absorption layer 6 select polyurethane matter to polish absorption layer 6.
Step S4: the abrasive material for the above-mentioned Magnetorheologicai polishing liquid 91 that concentration is 2%~20%, concentration are added in deionized water
The antirust agent that dispersing agent and concentration for 1%~10% are 1%~10% after stirring, passes through sonic oscillation 5min
Compound Magnetorheologicai polishing liquid 91 is made in~30min.
Preferably, when processing two inches of monocrystalline silicon substrate, the abrasive material of Magnetorheologicai polishing liquid 91 include 100nm~
The diamond nano abrasive particle of 500nm and 5 μm~10 μm of carbonyl iron dust micron magnetic-particle.
When processing four inches of silicon carbide substrate, the abrasive material of Magnetorheologicai polishing liquid 91 includes the Buddha's warrior attendant of 50nm~100nm
Stone nanometer abrasive particle and 2 μm~5 μm of carbonyl iron dust micron magnetic-particle.
Step S5: manufactured compound Magnetorheologicai polishing liquid 91 is added in the container of feed device, feeding is then started
Device is flowed into compound Magnetorheologicai polishing liquid 91 in the cavity of polishing disk 1, until compound Magnetorheologicai polishing liquid 91 is completely dipped
01 surface 9mm~11mm of workpiece, it is preferable that the complete dipped 01 surface 10mm of workpiece of compound Magnetorheologicai polishing liquid 91.
Step S6: the line shaft of starting driving motor 35, driving motor 35 drives 36 turns of driving pulley by the first flat key
Dynamic, driving pulley 36 drives driven pulley 37 to rotate by transmission belt 38, so that driven pulley 37 be made to drive output main shaft 31
Transmission shaft rotates together, and then makes the eccentric shaft turns for exporting main shaft 31；Eccentric shaft is passed its rotary motion by the second flat key
It is handed to active external gear 32, to make eccentric shaft that active external gear 32 be driven to rotate, and then makes planetary gear 34 respectively and active
33 engaged transmission of external gear 32 and internal gear, realizes the rotation and revolution of planetary gear 34, meanwhile, magnet retainer 22 is with planet
Rotation and the revolution together of gear 34.
Step S7: planetary gear 34 realizes rotation and revolution with moving magnet retainer 22, to make each in magnet assemblies 2
A magnet 21 realizes rotation and revolution, and the Magnetorheologicai polishing liquid 91 in polishing disk 1 forms dynamic flexible under the action of magnet 21
Bistrique 92, multiple flexibility 92 clusters of bistrique form dynamic flexible polishing pad.
Step S8: the height of polishing disk 1 is adjusted, by adjusting knob 8 so as to adjust between polishing disk 1 and magnet assemblies 2
Gap, with this come adjust grinding and polishing pressure and make dynamic flexible polishing pad stabilization formed.
Preferably, when processing two inches of monocrystalline silicon substrate, the gap between polishing disk 1 and magnet assemblies 2 is adjusted, is made
Magnet 21 surface away from polishing 6 upper surface of absorption layer distance be 10mm~15mm.
When processing four inches of silicon carbide substrate, the gap between polishing disk 1 and magnet assemblies 2 is adjusted, so that magnet
Distance of 21 surface away from polishing 6 upper surface of absorption layer is preferably 15mm~20mm.
Step S9: dynamic flexible polishing pad follows 21 rotation of magnet and revolution, to realize the update of abrasive grain and from sharp, moves
State flexible polishing pad carries out micro-cutting to 01 surface of workpiece, realizes that the ultra-smooth on 01 surface of workpiece is uniformly processed.
It should also be noted that, in the present specification, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The magnetorheological grinding and polishing device of cluster provided by the present invention and its application method are described in detail above.
Used herein a specific example illustrates the principle and implementation of the invention, and the explanation of above embodiments is only used
In facilitating the understanding of the method and its core concept of the invention.It should be pointed out that for those skilled in the art,
Without departing from the principle of the present invention, can be with several improvements and modifications are made to the present invention, these improvement and modification
It falls into the protection scope of the claims in the present invention.
Claims (9)
1. a kind of magnetorheological grinding and polishing device of cluster characterized by comprising
Polishing disk (1), the bottom surface of the polishing disk (1) are equipped at least one groove, are equipped in the groove for workpiece to be arranged
(01) polishing absorption layer (6), polishing absorption layer (6) are equipped at least one workpiece bearing for being used to accommodate workpiece (01)
Slot；The side wall of the polishing disk (1) and the bottom surface form the cavity for holding Magnetorheologicai polishing liquid (91), so that the magnetic
Rheology polishing fluid (91) dipped workpiece (01) surface completely；The abrasive material of the Magnetorheologicai polishing liquid (91) includes nanometer abrasive grain
Son, bonding agent and micron magnetic-particle, the nanometer abrasive particle are wrapped in the micron magnetic under the action of bonding agent
The outer surface of property particle；
Set on the lower section of the polishing disk (1), for providing at least one magnet in magnetic field for the Magnetorheologicai polishing liquid (91)
Component (2), each magnet assemblies (2) include at least two magnet (21) arranged by default rule, so that the magnetic
The surface of workpiece (01) is completely covered in the flexible polishing pad that rheology polishing fluid (91) is formed；
It is connected with the magnet assemblies (2), the magnetic pole driving device for driving the magnet assemblies (2) rotation and revolution；
For the support device of the polishing disk (1), the magnet assemblies (2) and the magnetic pole driving device, the throwing to be arranged
CD (1) is height-adjustable to be set in the support device, changes the throwing with height by adjusting the polishing disk (1)
Gap between CD (1) and the magnet assemblies (2), to adjust polish pressure.
2. the magnetorheological grinding and polishing device of cluster according to claim 1, which is characterized in that the magnetic pole driving device packet
It includes:
For exporting the rotation drive device of rotary motion；
The active external gear (32) being connected with the output main shaft (31) of the rotation drive device；
With the internal gear (33) of the active external gear (32) coaxial arrangement；
Respectively with the active external gear (32) and the internal gear (33) engaged transmission planetary gear (34), the planet tooth
The quantity for taking turns (34) is identical as the quantity of the magnet assemblies (2), and the magnet assemblies (2) and the planetary gear (34) are one by one
It is corresponding to be connected.
3. the magnetorheological grinding and polishing device of cluster according to claim 2, which is characterized in that each magnet assemblies
(2) further include magnet retainer (22), the magnet retainer (22) is equipped with:
At least two for being arranged the magnet eccentric bushing (221) of the magnet (21)；
The connecting shaft (222) being connected with the magnet eccentric bushing (221), the connecting shaft (222) pass through eccentric sleeve (4) and institute
State the axis hole socket of planetary gear (34).
4. the magnetorheological grinding and polishing device of cluster according to claim 3, which is characterized in that the planetary gear (34)
One end is equipped with first end cover (341), and the corresponding position of the connecting shaft (222) and the first end cover (341) is equipped at least one
To locating slot, the connecting shaft (222) and the first end cover (341) are solid by the positioning pin (5) cooperated with the locating slot
It is fixed to be connected.
5. the magnetorheological grinding and polishing device of cluster according to claim 2, which is characterized in that the rotation drive device packet
It includes:
For providing the driving motor (35) of rotary power；
The driving pulley (36) being connected with the line shaft of the driving motor (35)；
Pass through the driven pulley (37) that transmission belt (38) are driven with the driving pulley (36)；The output main shaft (31) include with
The transmission shaft that the driven pulley (37) is fixedly connected and the eccentric shaft being fixedly connected with the active external gear (32), it is described inclined
Mandrel and the transmission shaft eccentric setting, and the eccentric shaft is connected with the transmission shaft by transition axis.
6. the magnetorheological grinding and polishing device of cluster according to claim 1-5, which is characterized in that the polishing is inhaled
Attached pad (6) includes the electrical pure iron thin layer (61) set gradually from bottom to top, PET film layer (62), porous membrane layer (63) and surface
Protective film layer (64), between the electrical pure iron thin layer (61) and the PET film layer (62) and the PET film layer (62) and institute
It states and is bonded by double-sided adhesive (65) between porous membrane layer (63).
7. the magnetorheological grinding and polishing device of cluster according to claim 6, which is characterized in that the polishing disk (1) and institute
It states support device to be connected by adjusting knob (8), to make the polishing disk by forward and reverse rotation of the adjusting knob (8)
(1) close to or far from the magnet assemblies (2).
8. the magnetorheological grinding and polishing device of cluster according to claim 6, which is characterized in that the top of the side wall is equipped with
Baffle (11) for preventing the Magnetorheologicai polishing liquid (91) from splashing in process.
9. a kind of application method of the magnetorheological grinding and polishing device of cluster, which is characterized in that be applied to any one of claim 1-8
The magnetorheological grinding and polishing device of the cluster, comprising:
It is required according to the size of workpieces processing, the magnet of suitable dimension, suitable quantity and suitable magnetic field strength is selected, by all institutes
It states magnet to arrange according to default rule, a magnet assemblies is formed, to form local cluster magnet dynamic magnetic field generating device；
It determines the appropriate number of magnet assemblies, all magnet assemblies is set to the predetermined position below polishing disk,
And the magnet assemblies is made to be connected with magnetic pole driving device, to form global cluster magnet dynamic magnetic field generating device；
It is required according to the size of workpieces processing, selects suitable polishing absorption layer, the polishing absorption layer is placed on the throwing
In groove on CD, and workpieces processing is placed in the workpiece bearing slot on the polishing absorption layer；
Magnetorheologicai polishing liquid is configured, manufactured Magnetorheologicai polishing liquid is injected into the cavity of the polishing disk, until magnetorheological
The completely dipped workpiece surface of polishing fluid；
Start magnetic pole driving device, magnetic pole driving device is made to drive each magnet rotation and public affairs in the magnet assemblies
Turn, the Magnetorheologicai polishing liquid forms dynamic flexible bistrique, multiple dynamic flexible bistrique collection under the action of the magnet
Group forms dynamic flexible polishing pad；
By adjusting the height of the polishing disk, to adjust the gap between the polishing disk and the magnet assemblies, to guarantee
Grinding and polishing pressure simultaneously forms the dynamic flexible polishing pad stabilization；
The dynamic flexible polishing pad follows the magnet rotation and revolution, to realize the abrasive grain of the Magnetorheologicai polishing liquid more
It is new and from sharp, so that the dynamic flexible polishing pad is carried out micro-cutting to workpiece surface, completes the grinding and polishing to workpiece surface.
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| CN110900322A (en) * | 2019-12-23 | 2020-03-24 | 广东工业大学 | electro-Fenton cluster magnetorheological composite grinding and polishing device and method |
| CN111941156A (en) * | 2020-09-04 | 2020-11-17 | 深圳市金洲精工科技股份有限公司 | Micro drill polishing method and polishing device |
| CN112975585A (en) * | 2021-03-04 | 2021-06-18 | 上海理工大学 | Fluid-supplementing type magnetic composite fluid polishing device |
| CN113561035A (en) * | 2021-07-30 | 2021-10-29 | 西安工业大学 | Point cloud alternating magnetorheological polishing device and method |
| CN114178975A (en) * | 2021-12-14 | 2022-03-15 | 安镁金属制品（深圳）有限公司 | Novel double-circulation magnetic grinding machine |
| CN114800253A (en) * | 2022-06-06 | 2022-07-29 | 浙江大学杭州国际科创中心 | Grinding device and method for silicon carbide wafer |
| CN115194564A (en) * | 2022-07-01 | 2022-10-18 | 广东工业大学 | Magnetic control grinding and polishing integrated disk for semiconductor wafer and use method thereof |
| CN115415907A (en) * | 2022-07-29 | 2022-12-02 | 广东炬森智能装备有限公司 | Magnetic control flexible cleaning device and method for foreign matters in PCB (printed circuit board) electrode |
| WO2024000759A1 (en) * | 2022-06-29 | 2024-01-04 | 大连理工大学 | Multi-field auxiliary abrasive flushing and polishing method and device |
| CN117428580A (en) * | 2023-12-15 | 2024-01-23 | 成都市凯林机械贸易有限责任公司 | Polishing device for valve machining |
| WO2024077864A1 (en) * | 2022-10-10 | 2024-04-18 | 上海中欣晶圆半导体科技有限公司 | Attaching fitting method for improving polishing flatness and productivity |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6555017B1 (en) * | 2000-10-13 | 2003-04-29 | The Regents Of The University Of Caliofornia | Surface contouring by controlled application of processing fluid using Marangoni effect |
| JP2005186239A (en) * | 2003-12-26 | 2005-07-14 | Hinomoto Kenmazai Kk | Grinding method using magnetic abrasive grain, and grinder |
| CN103273385A (en) * | 2013-06-09 | 2013-09-04 | 湖南大学 | Surface contact magneto-rheological flat polishing device and method with uniform magnetic field |
| CN105328516A (en) * | 2015-11-18 | 2016-02-17 | 广东工业大学 | Dynamic magnetic field self-sharpening finishing device for flexible magnetorheological finishing pad and finishing method for dynamic magnetic field self-sharpening finishing device |
| CN105458840A (en) * | 2015-12-29 | 2016-04-06 | 广东工业大学 | Magnetostatic moving field magnetorheological polishing mechanism test device and processing method thereof |
| CN107877269A (en) * | 2017-10-26 | 2018-04-06 | 广东工业大学 | The device and polishing method of a kind of magnetorheological efficiently polishing high-precise ball of cluster |
| CN210549948U (en) * | 2019-07-25 | 2020-05-19 | 广东工业大学 | Cluster magneto-rheological grinding and polishing device |
-
2019
- 2019-07-25 CN CN201910676443.5A patent/CN110281085B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6555017B1 (en) * | 2000-10-13 | 2003-04-29 | The Regents Of The University Of Caliofornia | Surface contouring by controlled application of processing fluid using Marangoni effect |
| JP2005186239A (en) * | 2003-12-26 | 2005-07-14 | Hinomoto Kenmazai Kk | Grinding method using magnetic abrasive grain, and grinder |
| CN103273385A (en) * | 2013-06-09 | 2013-09-04 | 湖南大学 | Surface contact magneto-rheological flat polishing device and method with uniform magnetic field |
| CN105328516A (en) * | 2015-11-18 | 2016-02-17 | 广东工业大学 | Dynamic magnetic field self-sharpening finishing device for flexible magnetorheological finishing pad and finishing method for dynamic magnetic field self-sharpening finishing device |
| CN105458840A (en) * | 2015-12-29 | 2016-04-06 | 广东工业大学 | Magnetostatic moving field magnetorheological polishing mechanism test device and processing method thereof |
| CN107877269A (en) * | 2017-10-26 | 2018-04-06 | 广东工业大学 | The device and polishing method of a kind of magnetorheological efficiently polishing high-precise ball of cluster |
| CN210549948U (en) * | 2019-07-25 | 2020-05-19 | 广东工业大学 | Cluster magneto-rheological grinding and polishing device |
Cited By (18)
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| CN110722428A (en) * | 2019-10-23 | 2020-01-24 | 中国科学院光电技术研究所 | Magnetorheological sub-aperture polishing device suitable for large-aperture optical element |
| CN110900322A (en) * | 2019-12-23 | 2020-03-24 | 广东工业大学 | electro-Fenton cluster magnetorheological composite grinding and polishing device and method |
| WO2021129124A1 (en) * | 2019-12-23 | 2021-07-01 | 广东工业大学 | Electro-fenton and cluster magnetorheological composite grinding and polishing device and method |
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| CN113561035B (en) * | 2021-07-30 | 2023-04-11 | 西安工业大学 | Point cloud alternating magnetorheological polishing device and method |
| CN113561035A (en) * | 2021-07-30 | 2021-10-29 | 西安工业大学 | Point cloud alternating magnetorheological polishing device and method |
| CN114178975B (en) * | 2021-12-14 | 2022-11-11 | 安镁金属制品（深圳）有限公司 | Novel dual-cycle magnetic grinding machine |
| CN114178975A (en) * | 2021-12-14 | 2022-03-15 | 安镁金属制品（深圳）有限公司 | Novel double-circulation magnetic grinding machine |
| CN114800253A (en) * | 2022-06-06 | 2022-07-29 | 浙江大学杭州国际科创中心 | Grinding device and method for silicon carbide wafer |
| WO2024000759A1 (en) * | 2022-06-29 | 2024-01-04 | 大连理工大学 | Multi-field auxiliary abrasive flushing and polishing method and device |
| CN115194564A (en) * | 2022-07-01 | 2022-10-18 | 广东工业大学 | Magnetic control grinding and polishing integrated disk for semiconductor wafer and use method thereof |
| CN115415907A (en) * | 2022-07-29 | 2022-12-02 | 广东炬森智能装备有限公司 | Magnetic control flexible cleaning device and method for foreign matters in PCB (printed circuit board) electrode |
| WO2024077864A1 (en) * | 2022-10-10 | 2024-04-18 | 上海中欣晶圆半导体科技有限公司 | Attaching fitting method for improving polishing flatness and productivity |
| CN117428580A (en) * | 2023-12-15 | 2024-01-23 | 成都市凯林机械贸易有限责任公司 | Polishing device for valve machining |
| CN117428580B (en) * | 2023-12-15 | 2024-03-19 | 成都市凯林机械贸易有限责任公司 | Polishing device for valve machining |
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