CN110265324A - A kind of wafer detecting apparatus - Google Patents
A kind of wafer detecting apparatus Download PDFInfo
- Publication number
- CN110265324A CN110265324A CN201910474761.3A CN201910474761A CN110265324A CN 110265324 A CN110265324 A CN 110265324A CN 201910474761 A CN201910474761 A CN 201910474761A CN 110265324 A CN110265324 A CN 110265324A
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- CN
- China
- Prior art keywords
- wafer
- sensors
- controller
- sensor
- slot position
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention discloses a kind of wafer detecting apparatus, including controller, two sensors and sensor fixed mechanism, two sensors are arranged on sensor fixed mechanism, plane where two center sensors is parallel with cassette slot position, two sensors and sensor fixed mechanism are connect with controller, controller controls the lifting of sensor fixed mechanism so that two sensors successively scan the slot position inside cassette, two sensors scan the two sides of same slot position respectively every time, and controller is used to export wafer oblique cutting information when the signal that two sensors acquire is inconsistent.This programme corresponds to slot position to cassette by two sensors and is scanned, it can be determined that wafer whether there is the abnormal conditions of oblique cutting, avoid generating the fragmentation exception because of caused by wafer oblique cutting in production process.
Description
Technical field
The present invention relates to automation equipment field more particularly to a kind of wafer detecting apparatus.
Background technique
Wafer machines carry out the crawl of wafer by the arm of solid mechanical formula, automatically grab wafer in mechanical arm
Before, the scanning for needing first to carry out wafer state information is read, and is believed with the cassette slot position etc. for obtaining the quantity of wafer and being placed
Breath carries out accurate wafer crawl to mechanical arm to feed back by control terminal and assign instruction.Industry is common single at present
The sub-scannings device such as sensor scans the cassette to operation, so that the analysis of data feedback control terminal is obtained pair that wafer is placed
Slot position is answered, instruction is precisely assigned to mechanical arm and carries out wafer crawl.But board only scans whether cassette corresponds to slot position at present
There is wafer, can not judge that wafer whether there is the abnormal conditions of oblique cutting.When oblique cutting occurs, grabbing wafer at this time will lead to wafer
It is broken.
Summary of the invention
For this reason, it may be necessary to provide a kind of wafer detecting apparatus, wafer oblique cutting feelings can not be obtained by solving existing wafer machines
The problem of condition.
To achieve the above object, a kind of wafer detecting apparatus, including controller, two sensors and biography are inventor provided
Sensor fixed mechanism, two sensors are arranged on sensor fixed mechanism, plane and cassette slot where two center sensors
Bit parallel, two sensors and sensor fixed mechanism are connect with controller, and controller control sensor fixed mechanism lifting makes
It obtains two sensors and successively scans the slot position inside cassette, two sensors scan the two sides of same slot position respectively every time, control
Device is used to export wafer oblique cutting information when the signal that two sensors acquire is inconsistent.
It further, further include the mechanical arm of rotary type, controller is connect with mechanical arm, and controller is used in crystalline substance
When circle oblique cutting, control mechanical arm rotation one grabs wafer after adjusting the angle.
Further, the controller is used to recycle trigonometric function to calculate according to the width and difference in height of oblique cutting wafer oblique
Limb angle value is to adjust the angle.
Further, the controller has crystalline substance for when all collecting signal according to two sensors, exporting the slot position
Round information.
Further, the controller is for exporting the slot position and not having when all not collecting signal according to two sensors
There is the information of wafer.
Further, the sensor is camera or distance measuring sensor.
It is different from the prior art, above-mentioned technical proposal corresponds to slot position to cassette by two sensors and is scanned, can be with
Judge that wafer whether there is the abnormal conditions of oblique cutting, avoids generating the fragmentation exception because of caused by wafer oblique cutting in production process.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of wafer detecting apparatus described in specific embodiment；
Fig. 2 is the structural schematic diagram of wafer normal storage in cassette described in specific embodiment；
Fig. 3 is the structural schematic diagram of wafer oblique cutting in cassette described in specific embodiment；
Fig. 4 is the structural schematic diagram of wafer oblique cutting angle calculation in cassette described in specific embodiment；
Fig. 5 is the structural schematic diagram of wafer oblique cutting angle calculation in cassette described in specific embodiment.
Description of symbols:
10, sensor；
11, sensor fixed mechanism；
12, cassette；
13, slot position.
Specific embodiment
Technology contents, construction feature, the objects and the effects for detailed description technical solution, below in conjunction with specific reality
It applies example and attached drawing is cooperated to be explained in detail.
Fig. 1 to Fig. 5 is please referred to, the present embodiment provides a kind of wafer detecting apparatus, including controller, controller be can be set
Perhaps setting such as can be computer, PLC controller or embedded Control in wafer machines in wafer detecting apparatus
Device etc..It further include two sensors 10 and sensor fixed mechanism 11, two sensors are arranged on sensor fixed mechanism, and two
Plane where a center sensor is parallel with 12 slot position 13 of cassette, when such wafer is normally placed in slot position, two sensings
Plane where device center can be parallel with wafer.Two sensors and sensor fixed mechanism are connect with controller, controller control
Sensor fixed mechanism is gone up and down so that two sensors successively scan the slot position inside cassette, can scan from top to bottom or from
Under up scan.Two sensors scan the two sides of same slot position respectively every time, what controller was used to acquire in two sensors
Wafer oblique cutting information is exported when signal is inconsistent.When normal, more wafers are placed in cassette, as shown in Fig. 2, wafer is horizontally
It is placed in each slot position.Controller control sensor fixed mechanism center sensor is risen to it is parallel with each slot position, and
If having wafer in slot position afterwards, then two sensors can all collect wafer information, if can all collect not without wafer
There is wafer information.
Specifically when acquisition judges, Fig. 2 and Fig. 3 are please referred to, Fig. 2 is the schematic diagram that each wafer is all normally placed, then passes
When sensor fixed mechanism drives sensor to scan from top to bottom, in the slot position for having wafer, such as slot position 1,2,4,5,7, two
Sensor can scan the two sides of wafer, and two sensors can all collect wafer, and collected information is consistent.In no wafer
Slot position, such as slot position 3,6, sensor can scan empty situation, and collected information is consistent, then wafer does not have oblique cutting.Fig. 3 is
There is the case where wafer oblique cutting schematic diagram, then when sensor fixed mechanism drives sensor to scan from top to bottom, in scanning slot
When position 5, the case where it is empty information that the sensor in left side, which collects wafer, and the sensor on right side has collected wafer,
Then the collected information of the sensor of two sides is inconsistent, and being judged as has wafer oblique cutting.When scanning slot position 6, the biography on right side
The case where it is empty information that sensor, which collects wafer, and the sensor on right side has collected wafer, then the sensor acquisition of two sides
The information arrived is inconsistent, and being judged as has wafer oblique cutting.Have tiltedly so as to board, avoid this information conveyance directly to grab
The slot position for inserting wafer avoids generating the fragmentation exception because of caused by wafer oblique cutting in production process.
In order to realize the crawl to oblique cutting wafer, the present apparatus further includes the mechanical arm of rotary type, and mechanical arm is to grab
The mechanical arm of wafer is taken, front end has rotating mechanism, the handgrip of mechanical arm can be driven to rotate, so as to grab inclination
Wafer.Controller is connect with mechanical arm, and controller is used in wafer oblique cutting, and control mechanical arm rotation one adjusts the angle
After grab wafer.Adjustment angle can be pre-stored in controller, if cassette is fixed type, then its inclination angle of the wafer of oblique cutting
It spends substantially stationary, it is only necessary to know turn left inclined downward or inclined downward of turning right.By scanning from top to bottom, if
The collected information of two side sensers is inconsistent for the first time and is that right sensor has wafer, as shown in figure 4, then illustrating on the left of wafer
Downward oblique cutting, then wafer is turned left inclined downward, then controller drives mechanical arm to rotate an adjustment angle toward lower left.If
The collected information of two side sensers is inconsistent for the first time and is that left sensor has wafer, as shown in figure 5, then illustrating on the right side of wafer
Downward oblique cutting, then wafer is turned right inclined downward, then controller drives mechanical arm to rotate an adjustment angle toward lower right.
In certain embodiments, tilt angle can also be calculated automatically by controller, the controller is used for root
It recycles trigonometric function to calculate oblique cutting angle value according to the width and difference in height of oblique cutting wafer to be to adjust the angle, may be implemented so certainly
Dynamic angle calculation.In certain embodiments, the height of oblique cutting wafer can also be calculated automatically by sensor fixed mechanism
It is poor to spend, and specifically, the time of oblique cutting wafer is collected by the up and down motion speed and sensor of sensor fixed mechanism
The two multiplication is calculated the difference in height of oblique cutting wafer two sides by difference, then sharp again according to difference in height and two sensor spacing
Calculating oblique cutting angle value with trigonometric function is adjustment angle.The time difference of oblique cutting wafer is side scanning to wafer to the other side
Scan the time difference of wafer.So as to realize the automatic calculating of wafer oblique cutting angle.It is high to can be adapted for different slot positions
Degree.Generally, the rotating mechanism of mechanical arm is all in the position of center, is also to grab in middle position when taking wafer
It takes, then the height at its center of the wafer of oblique cutting can decline, and controller is collecting oblique cutting crystalline substance by obtaining sensor fixed mechanism
Two round side positions take median according to two side positions, it can get the middle position of wafer, then controller can drive
Dynamic mechanical arm rotates an adjustment angle to the position, it can crawl.
And which slot position having wafer to make board available, which slot position does not have wafer, and the controller is used
When all collecting signal according to two sensors, the information that the slot position has wafer is exported.And it can control device and obtain this
When sensor fixed mechanism position, i.e. the position of wafer then can control mechanical arm to the position and carry out crawl wafer.
The controller is for when all not collecting signal according to two sensors, exporting the slot position not to have the information of wafer.
Two sensors can be identical structure, can only can get wafer situation, and such as sensor is camera shooting
Head or distance measuring sensor.Then it can judge whether image specific position has by way of Image Acquisition if it is camera
Wafer.If it is distance measuring sensor, such as laser or infrared, can be judged as there is wafer by measuring relatively short distance, measure compared with
No wafer is judged over long distances.
It should be noted that being not intended to limit although the various embodiments described above have been described herein
Scope of patent protection of the invention.Therefore, it based on innovative idea of the invention, change that embodiment described herein is carried out and is repaired
Change, or using equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it directly or indirectly will be with
Upper technical solution is used in other related technical areas, is included within scope of patent protection of the invention.
Claims (6)
1. a kind of wafer detecting apparatus, it is characterised in that: including controller, two sensors and sensor fixed mechanism, two
Sensor is arranged on sensor fixed mechanism, and plane where two center sensors is parallel with cassette slot position, two sensors
It is connect with sensor fixed mechanism with controller, controller controls the lifting of sensor fixed mechanism so that two sensors are successively swept
The slot position inside cassette is retouched, two sensors scan the two sides of same slot position respectively every time, and controller is used in two sensors
Wafer oblique cutting information is exported when the signal of acquisition is inconsistent.
2. a kind of wafer detecting apparatus according to claim 1, it is characterised in that: further include the manipulator of rotary type
Arm, controller are connect with mechanical arm, and controller is used in wafer oblique cutting, and control mechanical arm rotation one is grabbed after adjusting the angle
Take wafer.
3. a kind of wafer detecting apparatus according to claim 2, it is characterised in that: the controller is used for according to oblique cutting crystalline substance
It is to adjust the angle that round width and difference in height, which recycle trigonometric function to calculate oblique cutting angle value,.
4. a kind of wafer detecting apparatus according to claim 1, it is characterised in that: the controller is used to be passed according to two
When sensor all collects signal, the information that the slot position has wafer is exported.
5. a kind of wafer detecting apparatus according to claim 1, it is characterised in that: the controller is used to be passed according to two
When sensor does not all collect signal, exporting the slot position does not have the information of wafer.
6. a kind of wafer detecting apparatus according to claim 1, it is characterised in that: the sensor is camera or survey
Away from sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910474761.3A CN110265324A (en) | 2019-06-03 | 2019-06-03 | A kind of wafer detecting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910474761.3A CN110265324A (en) | 2019-06-03 | 2019-06-03 | A kind of wafer detecting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110265324A true CN110265324A (en) | 2019-09-20 |
Family
ID=67916387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910474761.3A Pending CN110265324A (en) | 2019-06-03 | 2019-06-03 | A kind of wafer detecting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110265324A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111180378A (en) * | 2019-12-31 | 2020-05-19 | 中芯集成电路（宁波）有限公司 | Method and device for detecting wafer oblique insertion in wafer boat |
| CN112729181A (en) * | 2020-12-25 | 2021-04-30 | 上海广川科技有限公司 | Device and method for carrying out wafer positioning detection |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02154105A (en) * | 1988-12-05 | 1990-06-13 | Nec Corp | Inspection instrument for wafer cassette distortion |
| JPH06211320A (en) * | 1993-01-12 | 1994-08-02 | Sony Corp | Wafer carrying-in and out device |
| JPH10173030A (en) * | 1996-12-10 | 1998-06-26 | Canon Inc | Substrate carrier and exposure apparatus using the same |
| CN1242753A (en) * | 1997-10-17 | 2000-01-26 | 奥林巴斯光学工业株式会社 | Waffer transport device |
| JP2002270674A (en) * | 2001-03-14 | 2002-09-20 | Disco Abrasive Syst Ltd | Carry-out device |
| JP2002305224A (en) * | 2001-04-05 | 2002-10-18 | Oki Electric Ind Co Ltd | Wafer storage unit |
| CN103346098A (en) * | 2013-05-14 | 2013-10-09 | 上海集成电路研发中心有限公司 | System and method for static scanning of silicon chip position information |
-
2019
- 2019-06-03 CN CN201910474761.3A patent/CN110265324A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02154105A (en) * | 1988-12-05 | 1990-06-13 | Nec Corp | Inspection instrument for wafer cassette distortion |
| JPH06211320A (en) * | 1993-01-12 | 1994-08-02 | Sony Corp | Wafer carrying-in and out device |
| JPH10173030A (en) * | 1996-12-10 | 1998-06-26 | Canon Inc | Substrate carrier and exposure apparatus using the same |
| CN1242753A (en) * | 1997-10-17 | 2000-01-26 | 奥林巴斯光学工业株式会社 | Waffer transport device |
| JP2002270674A (en) * | 2001-03-14 | 2002-09-20 | Disco Abrasive Syst Ltd | Carry-out device |
| JP2002305224A (en) * | 2001-04-05 | 2002-10-18 | Oki Electric Ind Co Ltd | Wafer storage unit |
| CN103346098A (en) * | 2013-05-14 | 2013-10-09 | 上海集成电路研发中心有限公司 | System and method for static scanning of silicon chip position information |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111180378A (en) * | 2019-12-31 | 2020-05-19 | 中芯集成电路（宁波）有限公司 | Method and device for detecting wafer oblique insertion in wafer boat |
| CN111180378B (en) * | 2019-12-31 | 2023-12-29 | 中芯集成电路（宁波）有限公司 | Method and device for detecting wafer oblique insertion in wafer boat |
| CN112729181A (en) * | 2020-12-25 | 2021-04-30 | 上海广川科技有限公司 | Device and method for carrying out wafer positioning detection |
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Application publication date: 20190920 |
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