CN110246785B - Transfer apparatus and transfer method - Google Patents
Transfer apparatus and transfer method Download PDFInfo
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- CN110246785B CN110246785B CN201910554526.7A CN201910554526A CN110246785B CN 110246785 B CN110246785 B CN 110246785B CN 201910554526 A CN201910554526 A CN 201910554526A CN 110246785 B CN110246785 B CN 110246785B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
The present invention provides a transfer apparatus and a transfer method, the transfer apparatus including: a carrier substrate; the transfer printing device comprises a bearing substrate, a plurality of transfer printing heads arranged on the bearing substrate in an array mode, and the transfer printing heads are used for grabbing target devices to be transferred and transferring the target devices to be transferred to the target substrate. According to the invention, a plurality of transfer printing heads can be adopted to grab a plurality of target devices at the same time, and the plurality of target devices are simultaneously transferred onto the target substrate, so that the transfer printing efficiency can be greatly improved while the transfer printing precision is ensured.
Description
Technical Field
The invention relates to the technical field of micro transfer printing, in particular to transfer printing equipment and a transfer printing method.
Background
The Micro transfer printing technology is a fine technology for transferring a target device to a corresponding substrate, the production efficiency and the production quality of the technology directly influence the mass production of the next generation technology such as Micro-LED (Micro-LED, also called mu LED) and the like, and the technology can generate revolutionary influence on the whole display industry.
In the prior art, the transfer technique places the target devices and the target substrate on the same plane, and then grasps the target devices one by one and transfers them onto the target substrate one by one according to a set program or a manual operation. Although the way of 'grabbing-transferring' one by one can control high precision, the transferring efficiency is too low, and the large-scale mass production is not facilitated.
Disclosure of Invention
In view of the above, the present invention provides a transfer printing apparatus and a transfer printing method, which are used to solve the problem of low transfer printing efficiency due to the need to grasp and transfer printing target devices one by one in the existing transfer printing technology.
In order to solve the above technical problem, the present invention provides a transfer apparatus comprising:
a carrier substrate;
the transfer printing device comprises a bearing substrate, a plurality of transfer printing heads arranged on the bearing substrate in an array mode, and the transfer printing heads are used for grabbing target devices to be transferred and transferring the target devices to be transferred to the target substrate.
Optionally, the plurality of transfer heads are arranged in at least one row;
the transfer apparatus further includes:
at least one transfer printing track is arranged on the bearing substrate, each row of transfer printing heads is arranged on one transfer printing track, and the transfer printing heads can move along the corresponding transfer printing tracks.
Optionally, the transfer apparatus further comprises:
the transfer printing device comprises a transfer track, wherein the extension direction of the transfer track is perpendicular to the extension direction of the transfer printing track, and the transfer printing track is movably arranged on the transfer printing track.
Optionally, the transfer apparatus further comprises:
and the electrical test heads are arranged at two ends of each transfer printing track or on the track transfer tracks and are used for communicating an external electrical test tool with the test points on the target substrate.
Optionally, the transfer apparatus further comprises:
the optical sensors are arranged on the transfer printing heads and correspond to the transfer printing heads one by one;
and the processor is connected with the optical sensor and used for determining the position of the bad target device according to the sensing signal transmitted by the optical sensor.
Optionally, the transfer apparatus further comprises:
the repair heads are arranged on the bearing substrate in an array mode and used for repairing bad target devices transferred to the target substrate.
Optionally, the plurality of repair heads are arranged in at least one row;
the transfer apparatus further includes:
at least one repair track is arranged on the orbital transfer track, each row of repair heads is arranged on one repair track, and the repair heads can move along the corresponding repair tracks.
The invention also provides a transfer printing method, which is applied to the transfer printing equipment and comprises the following steps:
grabbing a plurality of target devices to be transferred from an area for placing the target devices to be transferred;
and simultaneously transferring the plurality of grabbed target devices to be transferred to the target substrate.
Optionally, the transfer apparatus further comprises:
and the electrical test heads are arranged at two ends of each transfer printing track or on the track transfer tracks and are used for communicating an external electrical test tool with the test points on the target substrate.
After the plurality of grabbed target devices to be transferred are transferred to the target substrate at the same time, the method further comprises the following steps:
communicating an external electrical test tool with the test point on the target substrate through an electrical test head;
energizing, by the electrical test tool, a target device transferred to the target substrate to determine whether the target device is defective.
Optionally, the transfer apparatus further comprises:
the repair heads are arranged on the bearing substrate in an array mode and used for repairing bad target devices transferred to the target substrate.
After the plurality of grabbed target devices to be transferred are transferred to the target substrate at the same time, the method further comprises the following steps:
moving the repairing head to a position corresponding to a bad target device;
removing the bad target device by using the repairing head;
and grabbing a target device to be supplemented by adopting the repairing head, and transferring the target device to the position of the bad target device.
The technical scheme of the invention has the following beneficial effects:
in the embodiment of the invention, the transfer printing equipment is provided with the plurality of transfer printing heads, so that the plurality of target devices can be grabbed by the plurality of transfer printing heads at the same time and can be simultaneously transferred onto the target substrate, and the transfer printing efficiency can be greatly improved while the transfer printing precision is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a side view of a transfer apparatus according to an embodiment of the present invention;
FIG. 2 is a top view of a transfer apparatus according to an embodiment of the present invention;
FIG. 3 is a top view of a target substrate according to one embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a repair head according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a process of performing defective target device repair by the transfer apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic view of a transfer apparatus according to an embodiment of the present invention in a transfer process;
FIG. 7 is a flowchart illustrating a transfer method according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Referring to fig. 1 and 2, fig. 1 is a side view of a transfer apparatus according to an embodiment of the present invention, and fig. 2 is a top view of the transfer apparatus according to the embodiment of the present invention, the transfer apparatus including:
a carrier substrate 10;
the transfer printing device comprises a plurality of transfer printing heads 20 arranged on the bearing substrate 10, wherein the transfer printing heads 20 are arranged in an array mode, and the transfer printing heads 20 are used for grabbing target devices to be transferred and transferring the target devices to be transferred to a target substrate.
In the embodiment of the invention, the transfer printing equipment is provided with the plurality of transfer printing heads, so that the plurality of target devices can be grabbed by the plurality of transfer printing heads at the same time and can be simultaneously transferred onto the target substrate, and the transfer printing efficiency can be greatly improved while the transfer printing precision is ensured.
In this embodiment of the present invention, optionally, each of the transfer heads 20 may be independently controlled to extend and contract.
In the embodiment of the present invention, the plurality of transfer heads 20 on the carrier substrate 10 are arranged in at least one row, and each row includes a plurality of transfer heads 20. Preferably, the plurality of transfer heads 20 are arranged in a plurality of rows, so that when performing transfer, a plurality of target devices can be simultaneously grasped and transferred by the plurality of rows of transfer heads 20 to further improve transfer efficiency.
In the embodiment of the present invention, optionally, each row of the transfer heads 20 has an independent alignment function to improve the transfer precision, referring to fig. 2, each sheet of the transfer heads 20 has an independent alignment point 90.
In the embodiment of the present invention, optionally, the distance between two adjacent transfer heads 20 in each row is adjustable to adapt to the transfer tasks and the transfer precision control at different positions, so that multiple types of target substrates with different line pitches of target devices can be manufactured, or target substrates with target devices arranged irregularly can be manufactured. As shown in fig. 3, the target devices 101 on the target substrate 100 shown in fig. 3 are arranged irregularly (after the adjacent target devices 101 are linked to form a shape, they are not rectangular, and may be called irregular arrangement), and during transfer, the position of each transfer head 20 in each row is adjusted so that the arrangement of the transfer heads 20 is in a corresponding irregular arrangement. When transferring target devices in an irregular arrangement, it is preferable that the transfer apparatus includes a plurality of rows of transfer heads, thereby avoiding the problem of repeated alignment due to the need to repeatedly adjust the interval between the transfer heads for a single row.
In an embodiment of the present invention, in order to realize that the distance between two adjacent transfer heads 20 in each row is adjustable, referring to fig. 2, in an embodiment of the present invention, optionally, the transfer apparatus includes: at least one transfer track 30 is disposed on the carrier substrate 10, each row of the transfer heads 20 is disposed on one of the transfer tracks 30, and the transfer heads 20 are movable along the corresponding transfer track 30. That is, the transfer head 20 is movably connected to the corresponding transfer rail 30, and the transfer head 20 has a member cooperating with the transfer rail 30 to be fixed to the transfer rail 30 and to move along the transfer rail 30. In the embodiment shown in fig. 2, the transfer apparatus includes a plurality of transfer rails 30, the plurality of transfer rails 30 being arranged in parallel, and a plurality of transfer heads 20 being disposed on each transfer rail 30.
In the embodiment of the present invention, referring to fig. 2, optionally, each of the transfer heads 20 is disposed at a designated position on the transfer track 30 and can move within a designated movement range, and the designated movement range can be determined according to the density of the transfer heads 20 and the size of the transfer heads 20.
Of course, in some other embodiments of the present invention, besides the adjustment of the spacing between two adjacent transfer heads 20 of each row by the transfer rail 30, other structures can be used, which are not described in detail herein.
In the above-described embodiments, the distance between two adjacent transfer heads 20 in each row is adjustable, and the transfer heads 20 can move in the extending direction of the row (i.e., the transverse direction in fig. 2), in other embodiments of the present invention, the distance between the transfer heads 20 in different rows is optionally adjustable, that is, the transfer heads 20 can also move in the column direction, so as to adapt to the transfer task and the transfer accuracy control in different positions.
In order to realize the adjustable distance between the transfer heads 20 in different rows, referring to fig. 2, in an embodiment of the present invention, optionally, the transfer apparatus further includes: a track transfer rail 40, the extension direction of the track transfer rail 40 being perpendicular to the extension direction of the transfer rail 30 (in fig. 2, the transfer rail 30 extends in the transverse direction, and the track transfer rail 40 extends in the longitudinal direction), the transfer rail 30 being movably disposed on the track transfer rail 40, and by moving the transfer rail 30, the pitch between the transfer heads 20 of different rows can be adjusted to manufacture a plurality of types of target substrates having different column pitches of target devices.
In the embodiment of the present invention, as shown in fig. 2, optionally, the transfer device includes two track changing rails 40 respectively located at two ends of the transfer rail 30, and the transfer rail 30 has a component matching with the track changing rails 40 so as to be capable of being fixed on the track changing rails 40 and moving along the track changing rails 40.
Taking the huge transfer of the mu LED as an example, the transfer yield is extremely high, so if the transfer target device cannot be tested in time, the quality of the product is greatly affected. Thus, in an embodiment of the present invention, optionally, the transfer apparatus further includes: and an electrical test head (not shown) disposed on the carrier substrate 10 for communicating an external electrical test tool with a target device on the target substrate. In the embodiment of the present invention, the electrical test heads may be disposed at both ends of each of the transfer rails 30 or on the transfer rails 40. For example, if the electrical test heads are disposed at both ends of each of the transfer tracks 30, when the plurality of transfer heads 20 on the transfer track 30 transfer the grabbed target devices onto the target substrate, the electrical test heads at both ends of the transfer track 30 are electrically connected to the target devices on the target substrate transferred by the transfer heads 20 on the transfer track 30, and at this time, without removing the transfer apparatus, the electrical test heads on the transfer track 30 are electrically connected to an external electrical test tool, so that the external electrical test tool is connected to the test points on the target substrate, the test points are connected to the target devices on the target substrate, an electrical signal is input to the electrical test heads through the electrical test tool, the target devices transferred by the transfer heads 20 on the transfer track 30 are lighted, and the transfer effect is checked, and a defective target device (i.e., a defective dot) is measured. The structure can test the transferred target device immediately after the transfer printing is finished so as to ensure the transfer success rate of the target device, and the test is timely and simple in process.
In an embodiment of the present invention, optionally, the transfer apparatus further includes:
a plurality of optical sensors (not shown) provided on the transfer heads 20 in one-to-one correspondence with the transfer heads 20, i.e., one optical sensor is provided on each transfer head 20;
and the processor (not shown) is connected with the optical sensor and used for determining the position of the bad target device according to the sensing signals transmitted by the optical sensor.
In the embodiment of the present invention, when the plurality of transfer heads 20 on the transfer track 30 transfer the grabbed target devices onto the target substrate, without removing the transfer apparatus, the transferred target devices are powered on, and the optical sensors on the transfer heads 20 sense the optical signals of the target devices, the optical sensors generate sensing signals according to the sensing results and transmit the sensing signals to the processor, if a certain target device is not bright or has low brightness, the processor determines that the target device is a non-bright target device according to the sensing signals of the optical sensors, and determines the positions of the defective target devices according to the positions of the optical sensors.
If the target device with the transfer printing defect cannot be repaired in time, the quality of the product is greatly influenced. Therefore, optionally, referring to fig. 2, the transfer apparatus in the embodiment of the present invention further includes: a plurality of Repair (Repair) heads 50 disposed on the carrier substrate 10, the Repair heads 50 being arranged in an array, the Repair heads 50 being configured to Repair a defective target device transferred onto the target substrate.
In the embodiment of the invention, the transfer printing equipment is provided with the repairing head, and the transfer printing and repairing can be continuously completed, so that the transfer printing quality is greatly improved.
In the embodiment of the present invention, optionally, each of the repair heads 50 may be independently controlled to extend and retract.
In the embodiment of the present invention, the plurality of repair heads 50 on the carrier substrate 10 are arranged in at least one row, and each row includes a plurality of repair heads 50. Preferably, the plurality of repair heads 50 are arranged in a plurality of rows, so that a plurality of bad target devices can be repaired simultaneously by using the plurality of rows of repair heads 50 to further improve the repair efficiency.
In the embodiment of the present invention, optionally, the distance between two adjacent repair heads 50 in each row is adjustable, so as to repair multiple types of target substrates with different row pitches of target devices, or repair target substrates with target devices arranged irregularly.
In this embodiment of the present invention, in order to realize that the distance between two adjacent repair heads 50 in each row is adjustable, referring to fig. 2, in this embodiment of the present invention, optionally, the transfer apparatus includes: at least one repair track 60 is disposed on the carrier substrate 10, each row of the repair heads 50 is disposed on one of the repair tracks 60, and the repair heads 50 can move along the corresponding repair track 60. That is, the repair head 50 is movably connected to the corresponding repair rail 60, and the repair head 50 has a part that is engaged with the repair rail 60 to be fixed to the repair rail 60 and moved along the repair rail 60. In the embodiment shown in fig. 2, the transfer apparatus includes one repair rail 60, and a plurality of repair heads 50 are disposed on each repair rail 60, and the repair rail 60 is disposed in parallel with the transfer rail 30 and behind the transfer rail 30 (here, behind is referred to the moving direction of the carrier substrate 10 at the time of transfer). The number of repair heads 50 on each repair track 60 may be equal to or less than the number of transfer heads 20 on each transfer track 30.
In the embodiment of the present invention, referring to fig. 2, optionally, each of the repair heads 50 is disposed at a designated position on the repair track 60 and is capable of moving within a designated moving range, and the designated moving range may be consistent with the designated moving range of the transfer head 20.
In the embodiment of the present invention, optionally, the repair track 60 may also be disposed on the orbital transfer track 40 to achieve the longitudinal movement of the repair head 50 as required. The repair rail 60 has a member that is engaged with the transfer rail 40 so as to be fixed to the transfer rail 40 and moved along the transfer rail 40. In the embodiment of the present invention, after the position of the defective target device is determined, the carrier substrate 10 may be moved forward (forward is relative to the moving direction of the carrier substrate 10 during transfer printing), so that the repair rail 60 is over against the defective target device, and then the defective target device is repaired. While repairing, the transfer head 20 on the transfer track 30 can be used to perform the next transfer at the same time, so as to improve the working efficiency.
In the embodiment of the present invention, referring to fig. 4, optionally, the repair head 50 includes: the device comprises a supplementing head 51 and a dissociation head 52, wherein the dissociation head 52 is used for dissociating a bad target device on the target substrate, and the supplementing head 51 is used for supplementing the target device to the position of the bad target device on the target substrate. The dissociation head 51 may process a defective target device by means of high temperature, ultraviolet rays or laser, and then take away the processed target device by means of adsorption. During repair, the repair head 51 may be used to capture a target device to be repaired, the repair head 50 is controlled to move to a position where an undesirable target device is located, the undesirable target device on the target substrate is dissociated by the dissociation head 52, and finally a new target device is supplemented at the same position by the repair head 51. Fig. 4 shows the structure of the repair head according to an embodiment of the present invention, but of course, in other embodiments of the present invention, the repair head may have other structures. For example, the repair head 50 includes only the dissociation head 52, and does not include the replenishment head 51, but replenishes the position of the dissociated target device with a new target device by the transfer head 20 on the transfer orbit. Referring to fig. 5, in the embodiment shown in fig. 5, for a defective target device 101 (a target device framed by a dashed circle) on the target substrate 100, a transfer head 20 (a transfer head framed by a dashed circle) at a corresponding position on the transfer rail 30 may be used to supplement a new target device.
In the embodiment of the invention, when repairing, a row of repairing heads can be controlled to simultaneously grab a plurality of target devices, then only individual repairing heads are adopted for repairing, and other target devices at positions which do not need to be repaired are reserved for subsequent repairing, so that the number of times of taking parts can be reduced, and the working efficiency is improved. Of course, if the target device grabbed on the repair track is not enough to complete the next repair, the carrier substrate may be moved to an area for placing the target device to be transferred, and the target device may be additionally grabbed.
In the embodiment of the invention, when a plurality of rows of repairing heads are provided during repairing, the repairing heads at the front row can be controlled to dissociate the target device, and the repairing heads at the rear row can supplement the target device, so that the dissociation and supplement actions at two rows can be simultaneously completed, and the working efficiency is improved.
Referring to fig. 6, the transfer apparatus according to the embodiment of the present invention may further include: the transfer apparatus includes a stage base 200, and the stage base 200 includes a first region 201 for placing a target device to be transferred and a second region 202 for placing a target substrate 100.
Referring to fig. 1 and 6, the transfer apparatus according to the embodiment of the present invention may further include: and a transport rail 70 on which the carrier substrate 10 is disposed and which is movable on the transport rail 70, so that the carrier substrate 10 can move back and forth above the first region 201 and above the second region 202 of the base 200, completing the grasping and transferring of the target device. In addition, optionally, the transfer apparatus further includes: and the telescopic shaft 80, through which the carrier substrate 10 is disposed on the transportation rail 70, is capable of being vertically telescopic, so that the carrier substrate 10 is controlled to move upwards or downwards when the target device is grabbed or transferred.
Referring to fig. 7, an embodiment of the present invention further provides a transfer method applied to the transfer apparatus in any one of the above embodiments, where the transfer method includes:
step 701: grabbing a plurality of target devices to be transferred from an area for placing the target devices to be transferred;
step 702: and simultaneously transferring the plurality of grabbed target devices to be transferred to the target substrate.
Optionally, the transfer apparatus in an embodiment of the present invention includes: and the electrical test heads are arranged at two ends of each transfer printing track or on the track transfer tracks and are used for communicating an external electrical test tool with the test points on the target substrate.
After the plurality of grabbed target devices to be transferred are transferred to the target substrate at the same time, the method further comprises the following steps:
step 703: communicating an external electrical test tool with the test point on the target substrate through an electrical test head;
step 704: energizing, by the electrical test tool, a target device transferred to the target substrate to determine whether the target device is defective.
Optionally, the transfer apparatus in an embodiment of the present invention includes: the repair heads are arranged on the bearing substrate in an array mode and used for repairing bad target devices transferred to the target substrate.
After the plurality of grabbed target devices to be transferred are transferred to the target substrate at the same time, the method further comprises the following steps:
step 705: moving the repairing head to a position corresponding to a bad target device;
step 706: removing the bad target device by using the repairing head;
step 707: and grabbing a target device to be supplemented by adopting the repairing head, and transferring the target device to the position of the bad target device.
In other embodiments of the present invention, the transfer head may also be used to pick up the target device to be replenished and transfer it to the location of the defective target device.
In an embodiment of the present invention, the transfer method may further include: when the target device is repaired by the repairing head, the transfer printing head is adopted to perform the next transfer printing, so that the working efficiency is improved.
In the embodiment of the present invention, the grabbing a target device to be supplemented by using the repair head and transferring the target device to a position where the defective target device is located may include: a row of repair heads are controlled to simultaneously grab a plurality of target devices, then only individual repair heads are adopted for repairing, and other target devices at positions which do not need to be repaired are reserved for subsequent repair, so that the number of times of taking the target devices can be reduced, and the working efficiency is improved. Of course, if the target device grabbed on the repair track is not enough to complete the next repair, the carrier substrate may be moved to an area for placing the target device to be transferred, and the target device may be additionally grabbed.
In an embodiment of the present invention, the removing the bad target device by using the repair head may include: the repairing heads of the front row are controlled to dissociate the target device, and the repairing heads of the rear row are controlled to supplement the target device, so that dissociation and supplement actions of two rows are completed simultaneously, and the working efficiency is improved.
In the above embodiments of the present invention, the target device may be a Micro-LED or a mini-LED.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (5)
1. A transfer apparatus, characterized by comprising:
a carrier substrate;
the transfer printing heads are arranged in an array mode and used for grabbing target devices to be transferred and transferring the target devices to be transferred to a target substrate;
the plurality of transfer heads are arranged in at least one row;
the transfer apparatus further includes:
at least one transfer printing track arranged on the bearing substrate, wherein each row of transfer printing heads is arranged on one transfer printing track and can move along the corresponding transfer printing track;
the extension direction of the orbital transfer is perpendicular to that of the transfer printing track, and the transfer printing track is movably arranged on the orbital transfer;
the electrical test heads are arranged at two ends of each transfer printing track or on the track transfer tracks and are used for communicating an electrical test tool outside the transfer printing equipment with the test points on the target substrate;
the optical sensors are arranged on the transfer printing heads and correspond to the transfer printing heads one by one;
and the processor is connected with the optical sensor and used for determining the position of a bad target device according to the sensing signal transmitted by the optical sensor, wherein the sensing signal is used for representing the brightness information of the target device.
2. The transfer apparatus according to claim 1, further comprising:
the repair heads are arranged on the bearing substrate in an array mode and used for repairing bad target devices transferred to the target substrate.
3. The transfer apparatus according to claim 2,
the plurality of repair heads are arranged in at least one row;
the transfer apparatus further includes:
at least one repair track is arranged on the orbital transfer track, each row of repair heads is arranged on one repair track, and the repair heads can move along the corresponding repair tracks.
4. A transfer method applied to the transfer apparatus according to any one of claims 1 to 3, the transfer method comprising:
grabbing a plurality of target devices to be transferred from an area for placing the target devices to be transferred;
simultaneously transferring the plurality of grabbed target devices to be transferred to a target substrate;
after the plurality of grabbed target devices to be transferred are transferred to the target substrate at the same time, the method further comprises the following steps:
communicating an external electrical test tool with the test point on the target substrate through an electrical test head;
energizing, by the electrical test tool, a target device transferred to the target substrate to determine whether the target device is defective.
5. The transfer method according to claim 4, applied to the transfer apparatus according to claim 2 or 3, further comprising, after simultaneously transferring the plurality of target devices to be transferred that are grasped to the target substrate:
moving the repairing head to a position corresponding to the bad target device;
removing the bad target device by using the repairing head;
and grabbing a target device to be supplemented by adopting the repairing head, and transferring the target device to the position of the bad target device.
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| CN201910554526.7A CN110246785B (en) | 2019-06-25 | 2019-06-25 | Transfer apparatus and transfer method |
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| CN201910554526.7A CN110246785B (en) | 2019-06-25 | 2019-06-25 | Transfer apparatus and transfer method |
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| CN110246785B true CN110246785B (en) | 2022-04-15 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8349116B1 (en) * | 2011-11-18 | 2013-01-08 | LuxVue Technology Corporation | Micro device transfer head heater assembly and method of transferring a micro device |
| CN106228913A (en) * | 2016-08-24 | 2016-12-14 | 京东方科技集团股份有限公司 | Transfer apparatus and printing transferring method thereof |
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| CN109411392B (en) * | 2018-10-16 | 2019-06-25 | 广东工业大学 | A kind of the flood tide transfer device and transfer method of Micro-LED |
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| US8349116B1 (en) * | 2011-11-18 | 2013-01-08 | LuxVue Technology Corporation | Micro device transfer head heater assembly and method of transferring a micro device |
| CN106228913A (en) * | 2016-08-24 | 2016-12-14 | 京东方科技集团股份有限公司 | Transfer apparatus and printing transferring method thereof |
| CN208352324U (en) * | 2018-07-16 | 2019-01-08 | 江西兆驰半导体有限公司 | A kind of micro-led transfer system |
| CN109273387A (en) * | 2018-10-16 | 2019-01-25 | 广东工业大学 | A kind of the electronic component flood tide transfer device and method of variable spacing |
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