CN110233142A - Laminated packaging structure and forming method thereof - Google Patents
Laminated packaging structure and forming method thereof Download PDFInfo
- Publication number
- CN110233142A CN110233142A CN201910356394.7A CN201910356394A CN110233142A CN 110233142 A CN110233142 A CN 110233142A CN 201910356394 A CN201910356394 A CN 201910356394A CN 110233142 A CN110233142 A CN 110233142A
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- electrical connector
- top surface
- package
- metal pad
- moulding material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
Abstract
The present invention provides a kind of package-on-package structures and forming method thereof, wherein a kind of packaging part includes package parts, and package parts further comprise top surface and the metal pad at package parts top surface.Packaging part further includes positioned at metal pad top and the not reflowable electrical connector for being bonded to metal pad and the moulding material above package parts.Not reflowable electrical connector is molded in moulding material and is contacted with moulding material.The top surface of not reflowable electrical connector is lower than the top surface of moulding compound.
Description
The application be submitted on October 14th, 2013 application No. is 201310479253.7 entitled " stacked packages
The divisional application of the application for a patent for invention of structure and forming method thereof ".
Cross reference to related applications
This application claims entitled " the Package-on-Package Structures submitted on March 14th, 2013
U.S. Provisional Patent Application the 61/783rd, 050 priority of and Methods for Forming the Same ",
Full content is hereby expressly incorporated by reference.
Background technique
In traditional stacked package (PoP) technique, the top seal of the first component pipe core of engagement is further by soldered ball
It is bonded to bottom package.Bottom package also may include being bonded on the second component pipe core therein.Second component pipe core can
To be located on the same side of bottom package with soldered ball.
Before top seal is bonded to bottom package, moulding compound is applied to bottom package, so that molding
Material the second component pipe core of covering and soldered ball.Since soldered ball is embedded in moulding compound, implement laser ablation or drilling in mould
Hole is formed in plastics, so that soldered ball exposes.It is then possible to which top seal and bottom are sealed by the soldered ball in bottom package
Piece installing engagement.
Summary of the invention
According to an aspect of the invention, there is provided a kind of packaging part, comprising: bottom package comprising the first encapsulation
Component, the first package parts include top surface and the metal pad at the top surface of the first package parts again, and bottom package is also
Including being located above metal pad and being bonded to the not reflowable electrical connector of metal pad and be located at the first encapsulation part
Moulding material above part is molded in moulding material to not reflowable electrical connector part and contacts with moulding material,
Wherein, the top surface of not reflowable electrical connector is lower than the top surface of moulding material；Top seal is located in bottom package
Side；And solder areas, not reflowable electrical connector is bonded to top seal, solder areas and not reflowable electrical connector
Including different materials.
Preferably, the top surface of not reflowable electrical connector includes rounded portion, and wherein the central part of rounded portion is low
Remainder in top surface.
Preferably, not reflowable electrical connector has the bottom surface of sphering, and the shape of bottom surface is part sphere.
Preferably, the packaging part further include: soldering paste, soldering paste be arranged in the sphering of not reflowable electrical connector bottom surface and
It is contacted between metal pad and with the bottom surface of sphering and metal pad.
Preferably, not reflowable electrical connector and solder areas are physically contacted.
Preferably, not reflowable electrical connector includes copper.
Preferably, packaging part further include: be bonded to the second package parts of the top surface of the first package parts, wherein mould
Moulding material at least moulds the lower part of the second packaging part wherein.
According to another aspect of the present invention, a kind of packaging part is provided, comprising: bottom package, including package substrate, envelope
Fitted lining bottom includes top surface and the metal pad at the top surface of package substrate, and bottom package further includes being located on metal pad
Side and be bonded to metal pad part metals ball (part metals ball is formed by not reflowable material), be located at package substrate
Top and it is bonded to the tube core of package substrate and the moulding material above package substrate, part metals ball and tube core
Lower part is molded in moulding material；Top seal, positioned at the top of bottom package；And electrical connector, by part metals
For ball bond to top seal, electrical connector and part metals ball include identical conductive material.
Preferably, part metals ball has top surface, and the central part of the top surface of part metals ball is lower than moulding material
Top surface.
Preferably, part metals ball has uneven top surface.
Preferably, the top surface of part metals ball includes rounded portion, and the minimum point of rounded portion is close to part metals ball
The center of top surface.
Preferably, the packaging part further include: be arranged between the sphering bottom surface of part metals ball and metal pad and with
The soldering paste of the sphering bottom surface of part metals ball and metal pad contact.
Preferably, part metals ball and electrical connector include copper.
Preferably, part metals ball and electrical connector include solder.
According to another aspect of the invention, it provides a method, comprising: molding moulding compound in side's is on the package substrate with shape
At bottom package, wherein the electrical connector of bottom package passes through the top surface of moulding material and exposes；And it is gone using electric arc
Except the top of electrical connector, retain the bottom of electrical connector after the removal step.
Preferably, this method further include: top encapsulation component is bonded to package substrate, top encapsulation component is by being electrically connected
Fitting is bonded to package substrate.
Preferably, the step of implementing the top of removal electrical connector is until the portion top surface of electrical connector is lower than moulding material
Top surface.
Preferably, electrical connector includes solder areas, method further include: soldered ball is placed on the metal pad of package substrate
Side；And before molding process, solder balls are to form electrical connector.
Preferably, after the step of removing the top of electrical connector, the entire top surface of the remainder of electrical connector is low
In the top surface of moulding material.
Preferably, the step of generating electric arc includes: that electrode is placed in above electrical connector and is aligned with electrical connector；With
And apply voltage difference between electrical connector and electrode.
Detailed description of the invention
In order to which embodiment and its advantage is more fully understood, it is described below now in conjunction with attached drawing reference, in which:
Fig. 1 to Fig. 6 B is according to the laminated packaging structures of some exemplary embodiments in the section in the intermediate stage of manufacture
Figure.
Specific embodiment
The manufacture and use of various embodiments of the present invention are discussed further below.It should be appreciated, however, that the present invention provides many
The applicable concept that can be realized in various specific environments.The purpose that the specific embodiment discussed is only intended to illustrate,
Rather than it limits the scope of the invention.
The present invention provides stacked package (PoP) structure and its manufacturing method according to various embodiments.According to some implementations
It is illustrated the intermediate stage to form PoP structure.Discuss the deformation of embodiment.In various views of the invention and illustrative
In embodiment, similar reference symbol is for indicating similar element.
Referring to Fig. 1, package parts 10 are provided.In some embodiments, package parts 10 are package substrates, therefore logical
In piece description, package parts 10 are referred to as package substrate 10, but it may be other types.In an alternative embodiment, it encapsulates
Component 10 includes intermediary layer.Package parts 10 can be a part of the package parts including multiple same package components 10.Example
Such as, package parts 10 can be package substrate, and it includes being formed as multiple package substrates of array not cut that it, which is located at,
In package substrate band.
Package substrate 10 may include the substrate 18 formed by dielectric material.It is alternatively possible to by such as semiconductor material
The other materials of (for example, silicon) forms substrate 18.In some exemplary embodiments, as shown in Figure 1, substrate 18 is built upon core
Increasing layer (build-up) substrate in the heart.Optionally, substrate 18 can be laminated substrates comprising together by laminate adhesive
Laminated dielectric film.When substrate 18 is formed by dielectric material, dielectric material may include being mixed with glass fibre and/or resin
Composite material.
Package substrate 10 is configured as the electrical connector 12 on first surface 10A being electrically connected on second surface 10B
Conductive component 16, wherein surface 10A and 10B are the apparent surface of package substrate 10.Electrical connector 12 and conductive component 16 are for example
It can be metal pad, therefore be referred to as metal pad 12 and 16.Package substrate 10 may include such as metal wire/through-hole 14
Conducting connecting part, and it can also include the through-hole through substrate 18.
In some embodiments, soldering paste 22 is coated on some or all of metal pads 12.Next, as shown in Fig. 2,
Electrical connector 24 is bonded on metal pad 12.Engagement may include that electrical connector 24 is placed on soldering paste 22, then plus
Heat-seal substrate 10, so that electrical connector 24 is fixed on metal pad 12.Electrical connector 24 is electrically connected to metal pad 12,
In, soldering paste 22 provides the fastening force of fixed electrical connector 24.In addition, soldering paste 22 helps to provide electrical connector 24 and following gold
Belong to the electrical connection between pad 12.
In some embodiments, electrical connector 24 is not reflowable metal ball.Common for melting the temperature of solder
It spends under the conditions of (for example, can be in the range of about 200 DEG C to about 280 DEG C), electrical connector 24 will not melt.According to some implementations
Example, electrical connector 24 is copper ball and aluminium ball etc..Electrical connector 24 also may include selected from substantially by copper, aluminium, nickel, platinum, tin, tungsten
With the metal in the group of their composition of alloy.In some embodiments, it except the technique of non-formation ball changes, is otherwise electrically connected
The shape of part 24 can be the spherical shape of almost Perfect.After engaging electrical connector 24, electrical connector 24 can keep spherical,
Wherein the bottom end of each ball 24 pass through a point contact respectively below metal pad 12, although ball can also pass through soldering paste 22
The thin layer of formation is spaced apart with following metal pad 12.(it is the spherical surface of almost Perfect for the bottom surface of each electrical connector 24
A part) respectively following metal pad 12 is electrically connected to also by soldering paste 22 (contact point may also be passed through).
In an alternative embodiment, electrical connector 24 is the soldered ball that may include eutectic solder or eutectic solder.Work as electrical connection
When part 24 is formed by solder, the engagement of electrical connector 24 includes reflux technique, wherein the electrical connector 24 containing solder is flowed back.
In these embodiments, soldering paste 22 can not used.Alternatively, reflux can be improved using scaling powder (not shown).
Referring to Fig. 3, package parts 20 are bonded to package substrate 10 by metal pad 12.Therefore, being formed includes encapsulation lining
The bottom package 100 at bottom 10 and tube core 20.Package parts 20 can be component pipe core, therefore hereinafter optionally be claimed
For tube core 20, although package parts 20 are also possible to the another type of package parts of such as packaging part.Tube core 20 can be packet
Include the circuit die of the integrated circuit device (not shown) of transistor, capacitor, inductor, resistor etc..In addition, tube core
20 can be the logic circuit tube core of such as central processing unit (CPU) tube core.Solder engagement or direct metal-can be passed through
The engagement of engagement (such as copper-copper engagement) Lai Shixian tube core 20 and metal pad 12 of metal.
Referring to fig. 4, in 10 upper mold molding moulding material 28 of tube core 20 and package substrate.Implement after application moulding material 28
Curing process.According to some embodiments, moulding material 28 may include filler material, polymer and curing agent.Illustrative real
It applies in example, polymer can be moulding compound, bottom filler, molded underfill object (MUF), epoxy resin etc..In some realities
It applies in example, the top surface 28A of moulding material 28 and the top surface 20A of tube core 20 are concordant, and therefore, tube core 20 is revealed by moulding material 28
Out.In an alternative embodiment, moulding material 28 can be fully enclosed wherein by tube core 20, a part covering of moulding material 28
On tube core 20.In a further alternative embodiment, moulding material 28 can surround and contact the lower part of tube core 20, and tube core 20
Top be located above the top surface 28A of moulding material 28.
The top of electrical connector 24 is located at the top of the top surface 28A of moulding material 28.In some exemplary embodiments,
The height H1 that electrical connector 24 is located at the top above the 28A of top surface is greater than about the 1/4 or about 1/3 of the height H2 of electrical connector 24.
In some embodiments, the ratio of H1/H2 also can be close to 0.5.
Referring to Fig. 5, the top of electrical connector 24 is removed.The bottom of electrical connector 24, which retains, not to be moved, therefore, electrical connector 24
Become part sphere.In some embodiments, implement to be electrically connected by generating electric arc 30 between electrical connector 24 and electrode 32
The removal of fitting 24.The surface portion that the temperature of electric arc 30 can cause electrical connector 24 to expose rises to very high temperature
(for example, between about 8000 DEG C and about 12000 DEG C), therefore evaporate the surface portion of electrical connector 24.According to some embodiments,
For generate electric arc 30, by multiple electrodes 32 formed by metal be placed on the top of electrical connector 24 and with electrical connector 24 it is right
Together.It needs to remove each electrical connector 24 at the top of it to be aligned with an electrode 32.Between electrode 32 and electrical connector 24
Apply voltage VarcTo generate electric arc 30, wherein voltage source 36 is electrically connected to electrode 32 and electrical connector 24 to provide electricity therebetween
Press Varc.For example, voltage VarcIt can be between about 50V between about 500V, although different voltage also can be used.
In some embodiments, such as by bottom metal pad 16 and bottom electrode 34 keep electrical connector 24 electrically grounded,
Wherein, metal pad 16 is electrically connected to voltage source 36 by bottom electrode 34.Since metal pad 16 is electrically connected to electrical connector 24,
So electrical connector 24 is electrically connected to voltage source 36.During generating electric arc 30, electrode 32 can control close to electrical connection
Part 24.Electric field between electrode 32 and electrical connector 24 correspondingly increases, and when between electrode 32 and electrical connector 24 away from
From it is close enough when, it is final to generate electric arc 30.After the top of removal electrical connector 24, electrode 32,34 and voltage source 36 are removed.
In some embodiments, after the top of removal electrical connector 24, the top surface 24A of the electrical connector 24 of generation is
It is uneven.For example, it may be possible to which sphering top surface 24A, makes its minimum point close to the center of corresponding top surface 24A.In addition, top surface 24A
At least part can be lower than the top surface 28A of moulding material 28.In some embodiments, entire electrical connector 24 and moulding material
28 top surface 28A is concordant or lower than it, this indicates that entire top surface 24A is concordant or lower than it with the top surface 28A of moulding material 28.
Fig. 6 A and Fig. 6 B show the engagement of top seal 50 Yu bottom package 100.Therefore, the structure of formation is
PoP structure.For example, with reference to Fig. 6 A, top seal 50 is placed on 10 top of package substrate first.Top seal 50 can be with
It is the packaging part for including component pipe core 52 and package substrate 54, wherein component pipe core 52 is bonded to package substrate 54.Show some
In the embodiment of example property, component pipe core 52 is such as static random access memory (SRAM) tube core, dynamic random access memory
(DRAM) the storage tube core of tube core etc..In addition, before top seal 50 is bonded to package substrate 10, it can be in device pipe
Pre-molded moulding material 56 on core 52 and package substrate 54.
In some embodiments, top seal 50 includes the electrical connector 58 at 50 bottom surface of top seal.Electricity
The position of connector 58 and the aligned in position of electrical connector 24.Due to the recessed top surface lower than moulding material 28 of electrical connector 24
28A, so can be easily fixed in a groove by electrical connector 58, therefore, top seal 50 will not be relative to bottom package
Part 100 slides.Further, since electrical connector 24 is recessed, so the overall thickness of the PoP structure generated reduces.In some realities
It applies in example, electrical connector 58 includes solder, and can be soldered ball.In an alternative embodiment, electrical connector 58 may include all
Such as the not reflowable part of metal column or metal pad.The not reflowable part of electrical connector 58 can by selected from can not
The identical candidate materials of electrical connector 24 of reflux are formed.In addition, electrical connector 58 may include can not refluxing portion positioned at it
Surface on solder cap.
It flows back in the not reflowable embodiment of electrical connector 24 to the solder in electrical connector 58 referring to Fig. 6 A,
Period does not flow back to electrical connector 24.Top seal 50 is bonded to electrical connector 24 by obtained electrical connector 58.
After reflow, the bottom surface of electrical connector 58 is suitble to the shape and profile of 24 top surface of electrical connector.
Solder referring to Fig. 6 B, in the embodiment that electrical connector 24 includes solder, after reflux technique, in soldered ball 58
It fuses with the solder in electrical connector 24 to form the socket area for making top seal 50 be connected to package substrate 10 60.
In an embodiment of the present invention, by the top of the electrical connector in removal bottom package, PoP structure is reduced
Total height.In addition, having used not reflowable metal ball in bottom package.Therefore, because not reflowable metal ball
Size and shape it is easily controllable, it is possible to reduction top seal is bonded between the electrical connector of bottom package
Away from.
According to some embodiments, a kind of packaging part includes package parts, and package parts further comprise top surface and are located at envelope
Fill the metal pad on member top face.Packaging part further includes being located above metal pad and being bonded to can not returning for metal pad
The electrical connector of stream and the moulding material above package parts.Not reflowable electrical connector is molded in mold member
It is contacted in material and with moulding material.The top surface of not reflowable electrical connector is lower than the top surface of moulding compound.
According to other embodiments, a kind of packaging part includes package substrate comprising top surface and is located on package substrate top surface
Metal pad.Part metals ball is arranged above metal pad and is engaged with it, wherein part metals ball is by that can not return
The material of stream is formed.Tube core is located above package substrate and is engaged with it.Moulding material setting is square on the package substrate,
In, the lower part of part metals ball and tube core is molded in moulding material.
According to other embodiment, a kind of method is included in above package substrate molding moulding material to form bottom package
Part, wherein the electrical connector in bottom package passes through the top surface of moulding material and exposes.Then, electricity is removed using electric arc
The top of connector retains the bottom of electrical connector after the removal step.
Although the invention has been described in detail and its component, it is to be understood that can be wanted without departing substantially from appended right
In the case where the spirit and scope for seeking the embodiment of restriction, a variety of different changes, replacement and change are made.Moreover, the application
Range is not limited in the specific reality of technique described in this specification, machine, manufacture, material component, tool, method and steps
Apply example.As it will be recognized by one of ordinary skill in the art that by the invention it is possible to using existing or Future Development for holding
The row function essentially identical to the used corresponding embodiment according to the present invention obtains the technique of essentially identical structure, machine
Device, manufacture, material component, tool, the method or step present invention.Correspondingly, appended claims mean include such as technique,
Machine, manufacture, material component, tool, method or step range.In addition, each claim constitutes an independent reality
Example is applied, and the combination of different claims and embodiment is within the scope of the present disclosure.
Claims (20)
1. a kind of packaging part, comprising:
Bottom package, comprising:
First package parts, comprising:
Top surface；With
Metal pad, at the top surface of first package parts；
Not reflowable electrical connector is located above the metal pad and by metal pad described in point contact；With
Moulding material is located above first package parts, is molded in the not reflowable electrical connector part described
It is contacted in moulding material and with the moulding material, wherein the top surface of the not reflowable electrical connector is lower than the mould
The top surface of moulding material；
Top seal is located above the bottom package；And
The not reflowable electrical connector is bonded to the top seal by solder areas, the solder areas and it is described can not
The electrical connector of reflux includes different material.
2. packaging part according to claim 1, wherein the top surface of the not reflowable electrical connector includes sphering portion
Point, wherein the central part of the rounded portion is lower than the remainder of the top surface.
3. packaging part according to claim 1, wherein the not reflowable electrical connector has the bottom surface of sphering, institute
The shape for stating bottom surface is part sphere.
4. packaging part according to claim 3, further includes: described not reflowable be electrically connected is arranged in soldering paste, the soldering paste
It is contacted between the bottom surface and the metal pad of the sphering of fitting and with the bottom surface of the sphering and the metal pad.
5. packaging part according to claim 1, wherein the not reflowable electrical connector connects with the solder areas physics
Touching.
6. packaging part according to claim 1, wherein the not reflowable electrical connector includes copper.
7. packaging part according to claim 1, further includes: be bonded to the second encapsulation of the top surface of first package parts
Component, wherein the moulding material at least moulds the lower part of second packaging part wherein.
8. a kind of packaging part, comprising:
Bottom package, comprising:
Package substrate, comprising:
Top surface；With
Metal pad, at the top surface of the package substrate；
Part metals ball is located above the metal pad and by metal pad described in point contact, wherein the part gold
Belong to ball to be formed by not reflowable material；
Tube core above the package substrate and is bonded to the package substrate；With
Moulding material is located above the package substrate, and the lower part of the part metals ball and the tube core is molded in the mould
In moulding material；
Top seal, positioned at the top of the bottom package；And
Electrical connector, by the part metals ball bond to the top seal, the electrical connector and the part metals
Ball includes identical conductive material.
9. packaging part according to claim 8, wherein the part metals ball has top surface, and the part metals
The central part of the top surface of ball is lower than the top surface of the moulding material.
10. packaging part according to claim 8, wherein the part metals ball has uneven top surface.
11. packaging part according to claim 10, wherein the top surface of the part metals ball includes rounded portion, described
Center of the minimum point of rounded portion close to the top surface of the part metals ball.
12. packaging part according to claim 8, further includes: the sphering bottom surface of the part metals ball and described is arranged in
The soldering paste contacted between metal pad and with the sphering bottom surface of the part metals ball and the metal pad.
13. packaging part according to claim 8, wherein the part metals ball and the electrical connector include copper.
14. packaging part according to claim 8, wherein the part metals ball and the electrical connector include solder.
15. a kind of method, comprising:
The metal pad that electrical connector is passed through to point contact package substrate moulds moulding compound above the package substrate to be formed
Bottom package, wherein the electrical connector of the bottom package passes through the top surface of the moulding material and exposes；And
The top of the electrical connector is removed using electric arc, retains the bottom of the electrical connector after the removal step.
16. according to the method for claim 15, further includes: top encapsulation component is bonded to the package substrate, it is described
Top encapsulation component is bonded to the package substrate by the electrical connector.
17. according to the method for claim 15, wherein implement the step of removing the top of the electrical connector until described
The portion top surface of electrical connector is lower than the top surface of the moulding material.
18. according to the method for claim 15, wherein it further include solder areas, the method also includes:
Soldering paste is placed in above the metal pad of the package substrate；And
Before molding process, the soldering paste that flows back is with the fixation electrical connector.
19. according to the method for claim 15, wherein described after the step of removing the top of the electrical connector
The entire top surface of the remainder of electrical connector is lower than the top surface of the moulding material.
20. according to the method for claim 15, wherein the step of generating the electric arc include:
Electrode is placed in above the electrical connector and is aligned with the electrical connector；And
Apply voltage difference between the electrical connector and the electrode.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361783050P | 2013-03-14 | 2013-03-14 | |
| US61/783,050 | 2013-03-14 | ||
| US13/922,117 | 2013-06-19 | ||
| US13/922,117 US9412723B2 (en) | 2013-03-14 | 2013-06-19 | Package on-package structures and methods for forming the same |
| CN201310479253.7A CN104051356A (en) | 2013-03-14 | 2013-10-14 | Package-on-Package Structure and Method for Forming the Same |
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| CN201310479253.7A Division CN104051356A (en) | 2013-03-14 | 2013-10-14 | Package-on-Package Structure and Method for Forming the Same |
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| CN110233142A true CN110233142A (en) | 2019-09-13 |
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| CN201310479253.7A Pending CN104051356A (en) | 2013-03-14 | 2013-10-14 | Package-on-Package Structure and Method for Forming the Same |
| CN201910356394.7A Pending CN110233142A (en) | 2013-03-14 | 2013-10-14 | Laminated packaging structure and forming method thereof |
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| CN201310479253.7A Pending CN104051356A (en) | 2013-03-14 | 2013-10-14 | Package-on-Package Structure and Method for Forming the Same |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121764A1 (en) * | 2003-12-04 | 2005-06-09 | Debendra Mallik | Stackable integrated circuit packaging |
| US20090146301A1 (en) * | 2007-12-11 | 2009-06-11 | Panasonic Corporation | Semiconductor device and method of manufacturing the same |
| WO2012012323A2 (en) * | 2010-07-19 | 2012-01-26 | Tessera, Inc. | Stackable molded microelectronic packages |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100800478B1 (en) * | 2006-07-18 | 2008-02-04 | 삼성전자주식회사 | Stack type semiconductor package and method of fabricating the same |
| CN101958261B (en) * | 2009-08-25 | 2012-09-05 | 日月光半导体制造股份有限公司 | Semiconductor process and stackable semiconductor device packages |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121764A1 (en) * | 2003-12-04 | 2005-06-09 | Debendra Mallik | Stackable integrated circuit packaging |
| US20090146301A1 (en) * | 2007-12-11 | 2009-06-11 | Panasonic Corporation | Semiconductor device and method of manufacturing the same |
| WO2012012323A2 (en) * | 2010-07-19 | 2012-01-26 | Tessera, Inc. | Stackable molded microelectronic packages |
| CN103109367B (en) * | 2010-07-19 | 2016-02-10 | 德塞拉股份有限公司 | Stackable molding microelectronics Packaging |
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