CN110230803A - Vehicular illumination device and lamps apparatus for vehicle - Google Patents
Vehicular illumination device and lamps apparatus for vehicle Download PDFInfo
- Publication number
- CN110230803A CN110230803A CN201910117353.2A CN201910117353A CN110230803A CN 110230803 A CN110230803 A CN 110230803A CN 201910117353 A CN201910117353 A CN 201910117353A CN 110230803 A CN110230803 A CN 110230803A
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- Prior art keywords
- illumination device
- vehicular illumination
- heat transfer
- flange
- light
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention provides a kind of Vehicular illumination device and lamps apparatus for vehicle that can be improved thermal diffusivity.Vehicular illumination device involved in embodiment has: flange；The side of the flange is arranged in mounting portion；The side opposite with the mounting portion side of the flange is arranged at least one cooling fin；The end side with flange side opposite side of the mounting portion is arranged in light emitting module, and it has at least one light-emitting component；Heat transfer part is set in the inside of the recess portion of the surface opening of the side for being provided with the cooling fin of the flange.
Description
Technical field
Embodiments of the present invention are related to a kind of Vehicular illumination device and lamps apparatus for vehicle.
Background technique
There is a kind of Vehicular illumination device to have lamp holder and light emitting module, which is arranged in a side end of lamp holder
Side.Lamp holder is with the part being arranged for light emitting module and the cooling fin connecting with the part.Also, light emitting module has substrate
And the light emitting diode (LED:Light Emitting Diode) on the substrate is set.
Light emitting module can generate heat when lighting.If poor to the heat dissipation of generated heat, light emitting diode
Temperature can become excessively high, it is possible to light emitting diode can be damaged.Therefore, using the thermally conductive system such as aluminium alloy or high-termal conductivity resin
The higher material of number makes lamp holder.
In general, making lamp holder using casting die or injection molding method etc..Using casting die or injection molding method etc.
In the case of, if the thickness difference between lamp holder each section is larger, shrink mark or crackle etc. may be generated.Therefore, pass through progress
So-called reduction process reduces the thickness difference between lamp holder each section.
However, shining if making the thickness of the part for light emitting module setting in lamp holder thinning by reduction process
The heat generated in module can be difficult to be transmitted to cooling fin.
Also, in recent years, light emitting diode gradually moves towards high output, therefore generated heat also tends to increase.
Therefore, expect to develop a kind of technology that can be improved thermal diffusivity.
Patent document 1: Japanese Unexamined Patent Publication 2013-247061 bulletin
Summary of the invention
The problem to be solved by the present invention is that providing a kind of Vehicular illumination device that can be improved thermal diffusivity and vehicle is used
Lamps and lanterns.
Vehicular illumination device involved in embodiment has: flange；The one of the flange is arranged in mounting portion
Side；The side opposite with the mounting portion side of the flange is arranged at least one cooling fin；Light emitting module, setting
In the end side with flange side opposite side of the mounting portion, and it has at least one light-emitting component；Heat transfer part,
It is set in the inside of the recess portion of the surface opening of the side for being provided with the cooling fin of the flange.
In above-mentioned Vehicular illumination device, the heat transfer part includes resin and filler.
In above-mentioned Vehicular illumination device, the resin is silicone resin.
In above-mentioned Vehicular illumination device, the heat transfer part includes heat-conducting silicone grease.
In above-mentioned Vehicular illumination device, at least part of the heat transfer part is contacted with the cooling fin.
In above-mentioned Vehicular illumination device, the cooling fin is provided with multiple, and the heat transfer part is arranged the multiple
Between cooling fin.
Lamps apparatus for vehicle involved in embodiment has: above-mentioned Vehicular illumination device；Framework, for the vehicle
Lighting device installation.
Embodiment according to the present invention provides a kind of Vehicular illumination device and vehicle lamp that can be improved thermal diffusivity
Tool.
Detailed description of the invention
Fig. 1 is for illustrating the schematic isometric of Vehicular illumination device involved in present embodiment.
Fig. 2 is the cross-sectional view along line A-A cutting of the Vehicular illumination device 1 in Fig. 1.
Fig. 3 is from the diagrammatic top view when Vehicular illumination device 1 from the direction of arrow B in Fig. 2.
Fig. 4 is for illustrating the schematic sectional view of heat transfer part involved in other embodiments.
Fig. 5 is for illustrating the diagrammatic cross-section fragmentary of lamps apparatus for vehicle.
In figure: 1- Vehicular illumination device, 10- lamp holder, 11- mounting portion, 12- engaging pin, 13- flange, the surface 13a-；
14- cooling fin, the top 14a-, 15- heat transfer part, the end face 15a-, 15b- heat transfer part, 20- light emitting module, 21- substrate, 22- shine
Element, 100- lamps apparatus for vehicle, 101- framework.
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to embodiment.In addition, in the drawings, being marked to identical constitutive requirements
Identical symbol and appropriate detailed description will be omitted.
(Vehicular illumination device)
Vehicular illumination device 1 is such as can be set in automobile or rail vehicle involved in present embodiment.As
Be set to the Vehicular illumination device 1 of automobile, can be used for example in front combination lamp (for example, daytime running lamps (DRL:
Daytime Running Lamp), side-marker lamp, the appropriately combined Assembled lamp together such as turn signal), rear combination lamp is (for example, stop
The appropriately combined Assembled lamp together such as car light, taillight, turn signal, back-up lamp, fog lamp) etc..But Vehicular illumination device 1
Purposes be not only defined in this.
Fig. 1 is for illustrating the schematic isometric of Vehicular illumination device 1 involved in present embodiment.
Fig. 2 is the cross-sectional view along line A-A cutting of the Vehicular illumination device 1 in Fig. 1.
Fig. 3 is from the diagrammatic top view when Vehicular illumination device 1 from the direction of arrow B in Fig. 2.
As shown in Figure 1 to Figure 3, Vehicular illumination device 1 is provided with lamp holder 10, light emitting module 20, power supply 30 and heat transfer
Plate 40.
Lamp holder 10 has mounting portion 11, engaging pin 12, flange 13, cooling fin 14 and heat transfer part 15.
Mounting portion 11 is set to the side of flange 13.Mounting portion 11 be set to flange 13 be provided with the one of cooling fin 14
On the surface of side opposite side.The outer shape of mounting portion 11 can be column.The outer shape of mounting portion 11 is, for example, cylinder
Shape.Mounting portion 11 has in the recess portion 11a with the end face of 13 side opposite side of flange opening.Light emitting module 20 is arranged in recess portion
On the bottom surface 11a1 of 11a.At least one notch 11b can be set in mounting portion 11.Substrate 21 is internally provided in notch 11b
Corner.Size (width dimensions) of the notch 11b in the circumferential direction of mounting portion 11 is more slightly larger than the size in the corner of substrate 21.Cause
This can position substrate 21 by the way that the corner of substrate 21 to be inserted in the inside of notch 11b.
Also, by setting notch 11b, the flat shape of substrate 21 can be increased.Therefore, it can increase and be installed on substrate
The quantity of element on 21.Alternatively, the outer dimension of mounting portion 11 can be reduced, it is thus possible to realize the small-sized of mounting portion 11
Change, and then can be realized the miniaturization of Vehicular illumination device 1.
The outer surface of mounting portion 11 is provided with engaging pin 12.Outer pleurapophysis of the engaging pin 12 to Vehicular illumination device 1
Out.Engaging pin 12 and flange 13 stand facing each other.Engaging pin 12 is provided with multiple.Engaging pin 12 is installed on by Vehicular illumination device 1
It is used when in the framework 101 of lamps apparatus for vehicle 100.Engaging pin 12 is used as twistlock.
Flange 13 is plate-like.Flange 13 for example can be in disk-shaped.The outer surface of flange 13 is located at than engaging pin 12
Outer surface more leans on the outside of Vehicular illumination device 1.
The side opposite with 11 side of mounting portion of flange 13 is arranged in cooling fin 14.Cooling fin 14 can be at least provided with one
It is a.In the example of Fig. 1 to Fig. 3, multiple backings 14 are provided on lamp holder 10.Multiple cooling fins 14 can be arranged along prescribed direction
Column setting.Cooling fin 14 can be plate-like.
Also, the hole 10b being inserted into for connector 105 is provided in lamp holder 10.
Connector 105 with seal member 105a is inserted in the 10b of hole.Therefore, the cross sectional shape of hole 10b corresponds to tool
There is the cross sectional shape of the connector 105 of seal member 105a.
The heat generated in light emitting module 20 is mainly transmitted to cooling fin 14 via mounting portion 11 and flange 13.Transmitting
Heat to cooling fin 14 is mainly discharged from cooling fin 14 to outside.
It is therefore preferable that lamp holder 10 is made by the higher material of thermal coefficient.For example, lamp can be made with metals such as aluminium alloys
Seat 10.
Also, in recent years, people expect that lamp holder 10 can effectively discharge the heat generated in light emitting module 20, and phase
Lightness to lamp holder 10.
It is therefore preferable that lamp holder 10 is made by high-termal conductivity resin.High-termal conductivity resin is for example including resin and by inorganic material
Expect the filler constituted.High-termal conductivity resin is, for example, in PET (Polyethylene terephthalate/ poly terephthalic acid
Glycol ester) or the resins such as nylon in mix resin made of the filler being made of carbon or aluminium oxide etc..
Lamp holder 10 comprising metals such as aluminium alloys can for example be made by casting die.
Lamp holder 10 containing high-termal conductivity resin then can for example be made by injection molding method.
Here, using casting die or injection molding method etc., if the thickness difference between 10 each section of lamp holder
It is larger, then it may generate shrink mark or crackle etc..Therefore, reduced by carrying out so-called reduction process 10 each section of lamp holder it
Between thickness difference.
For example, as shown in Figures 2 and 3, being set in the mode for keeping the thickness of mounting portion 11 roughly the same with the thickness of flange 13
Recess portion 11c is set, surface 13a upper opening of the recess portion 11c in the side for being provided with cooling fin 14 of flange 13.In this way,
It is able to suppress when forming lamp holder 10 and generates shrink mark or crackle etc..
However, if setting recess portion 11c, heat is difficult to be transmitted to dissipating at the position for being arranged far from light emitting module 20
Backing 14.For example, when looking down, the heat for being transmitted to the cooling fin 14 for the peripheral edge margin that mounting portion 11 is arranged in, which is less than, to be transmitted to
The heat of the cooling fin 14 of the middle section of mounting portion 11 is set.Accordingly, it is possible to will lead to the decline of radiating efficiency.
In recent years, people expect the high output of Vehicular illumination device 1, therefore the heat generated in light emitting module 20
Tend to increase.If the heat generated in light emitting module 20 increases, the decline of above-mentioned radiating efficiency may become more significant.
For example, when Vehicular illumination device 1 is to be set to the Vehicular illumination device on automobile, if voltage rating (example
Such as, direct current 13.5V or so) under electrical power become 2W or more, then the decline of above-mentioned radiating efficiency can become more significant.
In this regard, being internally provided with heat transfer in recess portion 11c in the Vehicular illumination device 1 involved in present embodiment
Portion 15.
Heat transfer part 15 can be made of the higher material of thermal coefficient.The higher material of thermal coefficient, which for example can be, includes
The material of resin and the filler being made of metal or inorganic material.The thermal coefficient of heat transfer part 15 for example can be set to 0.5W/ (m 〃
K more than) and 10W/ (m 〃 K) below.
Here, in the case where Vehicular illumination device 1 is to be set to the Vehicular illumination device on automobile, with traveling
And the vibration of generation or the vibration from engine etc. can be applied to Vehicular illumination device 1.Also, due to the temperature of use environment
Degree is -40 DEG C~85 DEG C, therefore thermal stress can be generated between heat transfer part 15 and cooling fin 14 etc..Therefore, heat transfer part 15 is wrapped
The resin contained preferably has flexibility.Silicone resin etc. can be used for example in the resin that heat transfer part 15 is included.In this way, can
Inhibition heat transfer part 15 falls off because of vibration or thermal stress or breakage.Filler for example may include the metals such as aluminium or copper, aluminium oxide or
The ceramics such as aluminium nitride, carbon etc..
For example, the material that filler, solvent and resin mix can be filled in the inside of recess portion 11c and made it dry
To form heat transfer part 15.The device for discharging fixed quantity of liquid such as dispenser can be used for example to carry out in filling.
Also, heat transfer part 15 may include heat-conducting silicone grease.The type of heat-conducting silicone grease is simultaneously not particularly limited, such as can be made
Heat-conducting silicone grease made of above-mentioned filler is mixed in modified silicon oil.The thermal coefficient of heat-conducting silicone grease for example can be set to 1W/ (m 〃
K more than) and 5W/ (m 〃 K) below.
In addition, heat transfer part 15, which can have, to be arranged by heat-conducting silicone grease in the case where heat transfer part 15 includes heat-conducting silicone grease
Sealing on the layer of composition.Sealing for example can be the layer being made of bonding agent or resin plate is adhered to cooling fin 14
Sealing Deng made of etc..If being provided with sealing, it is softened even if heat-conducting silicone grease is heated, can also prevent thermal conductive silicon
Rouge outflow.
At least part of heat transfer part 15 is preferably contacted with cooling fin 14.In this way, can be easy light emitting module 20
The heat of middle generation is efficiently transferred to cooling fin 14.
Also, when being provided with multiple cooling fins 14, heat transfer part 15 be can be set between multiple cooling fins 14.
In addition, heat transfer part 15 with the position of the end face 15a of 20 side opposite side of light emitting module and be not particularly limited.
But as shown in Fig. 2, bumps are not present in 14 side of cooling fin of preferred flange 13.In this way, which air can dissipate
Backing 14 swimmingly flows each other.
In addition, the weight of Vehicular illumination device 1 also becomes larger therewith if the volume of heat transfer part 15 becomes larger.Also, even if
The volume of heat transfer part 15 is increased, also not necessarily realizes further increasing for thermal diffusivity.
Therefore, as shown in Fig. 2, that will be from the top 14a of surface 13a to the cooling fin 14 of 14 side of cooling fin of flange 13
The case where distance only is set as H1 and the distance until the surface 13a to the end face 15a of heat transfer part 15 of flange 13 is set as H2
Under, preferably satisfy following formula.
H2≤0.5×H1
I.e., it is possible to which the part of the position of the half than its height of cooling fin 14 (13 side of flange) more on the lower is made to be conducted heat
Portion 15 covers.
In this way, which the weight for being able to suppress Vehicular illumination device 1 increases, and it can be improved thermal diffusivity.
The Vehicular illumination device 1 involved in present embodiment is provided with heat transfer part 15, therefore, even if setting recess portion
11c, be also able to suppress be transmitted to cooling fin 14 heat it is uneven.Therefore, it can be improved thermal diffusivity.
Fig. 4 is for illustrating the schematic sectional view of heat transfer part 15b involved in other embodiments.
As described above, heat is transmitted as readily to be arranged in the cooling fin 14 near light emitting module 20.Therefore, as shown in figure 4,
The height that the heat transfer part 15b near light emitting module 20 is arranged in can be set to be less than and be arranged far from the position of light emitting module 20
Heat transfer part 15 height.In this way, which the weight for being able to suppress Vehicular illumination device 1 increases.At this point it is possible to utilize resin
Or the loading of heat-conducting silicone grease is easily adjusted the height of heat transfer part 15.
If the heat for being transmitted to multiple cooling fins 14 is impartial, radiating efficiency can be improved, and then can be improved heat dissipation
Property.It is therefore preferable that the height of heat transfer part 15 is set by experiment or simulation test, so as to be transmitted to the heat of multiple cooling fins 14
Amount is impartial.
As shown in Figures 1 and 2, the end side with 13 side opposite side of flange of mounting portion 11 is arranged in light emitting module 20.
Light emitting module 20 has substrate 21, light-emitting component 22, resistance 23, control element 24, frame portion 25 and sealing 26.
The side end side of lamp holder 10 is arranged in substrate 21.Heat transfer plate 40 is arranged in via adhesive portion for substrate 21.That is, base
Plate 21 is adhered to heat transfer plate 40.Bonding agent can be used for example and the aftermentioned bottom surface for be bonded heat transfer plate 40 and recess portion 11a
The identical bonding agent of the bonding agent of 11a1.
Substrate 21 is plate-like.The flat shape of substrate 21 for example can be quadrangle.The material or structure of substrate 21 are not
It is particularly limited.For example, can be by inorganic material, paper phenol or glass epoxides such as ceramic (for example, aluminium oxide or aluminium nitride etc.)
Substrate 21 is made in equal organic materials etc..Also, substrate 21 is also possible to the base made of insulating material clad metal plate surface
Plate.In addition, with insulating material clad metal plate surface, insulating material can be to be made of organic material
Insulating material is also possible to the insulating material being made of inorganic material.In the higher situation of the calorific value of light-emitting component 22
Under, from the angle of heat dissipation, it is preferable to use substrate 21 is made in the higher material of thermal coefficient.As the higher material of thermal coefficient
Material, can include the ceramics such as aluminium oxide or aluminium nitride, high-termal conductivity resin, made of insulating material clad metal plate surface
Material etc..Also, substrate 21 can be single layer structure and be also possible to multilayered structure.
Also, the surface of substrate 21 is provided with Wiring pattern 21a.Wiring pattern 21a for example can be by being main with silver
The material of ingredient is formed.Wiring pattern 21a can for example be formed by silver or silver alloy.But the material of Wiring pattern 21a is not
It is only limited to silver material as main component.Wiring pattern 21a for example can also be by being formed with copper material as main component etc..
The side opposite with the bottom surface side 11a1 of recess portion 11a of substrate 21 is arranged in light-emitting component 22.Light-emitting component 22 is set
It sets on the base plate (21.Light-emitting component 22 is electrically connected with the Wiring pattern 21a on the surface for being set to substrate 21.Light-emitting component 22 is for example
It can be light emitting diode, Organic Light Emitting Diode, laser diode etc..
Light-emitting component 22 is at least provided with one.In the case where being provided with a plurality of light-emitting elements 22, a plurality of light-emitting elements
22 can be serially connected.Also, light-emitting component 22 and resistance 23 are connected in series.
Light-emitting component 22 can be the light-emitting component of shaped like chips.The light-emitting component 22 of shaped like chips can use COB (Chip
On Board/ chip on board) technology is packaged.In this way, more light-emitting components 22 can be arranged in narrow region.
Therefore, it can be realized the miniaturization of light emitting module 20, and then can be realized the miniaturization of Vehicular illumination device 1.Shaped like chips
Light-emitting component 22 can be for example electrically connected via wiring 21b with Wiring pattern 21a.Light-emitting component 22 and Wiring pattern 21a are for example
Terminal conjunction method be can use to be electrically connected.In addition, light-emitting component 22 is also possible to the light-emitting component of surface installing type or has
The light-emitting component of the bullet type of lead.
The side opposite with the bottom surface side 11a1 of recess portion 11a of substrate 21 is arranged in resistance 23.Resistance 23 is set to substrate
On 21.Resistance 23 is electrically connected with the Wiring pattern 21a on the surface that substrate 21 is arranged in.Resistance 23 for example can be surface installing type
Resistor, the resistor (metal-oxide film resistor) with lead, the membranaceous electricity formed by silk screen print method etc.
Hinder device etc..In addition, the resistance 23 illustrated in Fig. 1 is membranaceous resistor.
Ruthenium-oxide (RuO can be used for example in the material of membranaceous resistor2).For example, can use silk screen print method and
Calcination method forms membranaceous resistor.If resistance 23 is membranaceous resistor, can increase between resistance 23 and substrate 21
Contact area, therefore can be improved thermal diffusivity.Also, multiple resistance 23 can be formed by primary process.Therefore, Neng Gouti
High production rate, and there is deviation in the resistance value for being able to suppress multiple resistance 23.
Here, there is fluctuation in the forward voltage characteristic of light-emitting component 22, therefore, if by between anode terminal and ground terminal
Application voltage be set as constant, then brightness (luminous flux, brightness, luminous intensity, the photograph of the light irradiated from light-emitting component 22
Degree) fluctuation can be generated.Therefore, in the range of the value for flowing through the electric current of light-emitting component 22 being adjusted to regulation by resistance 23, from
And the brightness for the light for irradiating light-emitting component 22 is fallen into the range of regulation.At this point, by the resistance value for changing resistance 23,
It can will flow through the value control of the electric current of light-emitting component 22 within the limits prescribed.
In the case wheres the resistor or the resistor with lead etc. that resistance 23 is surface installing type, according to light-emitting component
22 forward voltage characteristic selects the resistance 23 with proper resistor value.In the case where resistance 23 is membranaceous resistor,
By removing a part of resistance 23, resistance value can be increased.For example, can be easily removed by irradiating laser to resistance 23
A part of resistance 23.Quantity, size, configuration of resistance 23 etc. are not limited to illustrate, can be according to the number of light-emitting component 22
Appropriate quantity, size, the configuration etc. for changing resistance 23 such as amount or specification.
The side opposite with the bottom surface side 11a1 of recess portion 11a of substrate 21 is arranged in control element 24.Control element 24 is set
It sets on the base plate (21.Control element 24 is electrically connected with the Wiring pattern 21a on the surface that substrate 21 is arranged in.Control element 24 is set
Purpose be, do not allow backward voltage to be applied to light-emitting component 22 and reversed impulsive noise do not allowed to be applied to light-emitting component
22。
Control element 24 for example can be diode.Control element 24 for example can be the diode of surface installing type, band
There is the diode etc. of lead.The control element 24 illustrated in Fig. 1 is the diode of surface installing type.
In addition, pull down resistor can also be arranged in order to detect the broken string of light-emitting component 22 or mistake is lighted in order to prevent.
Also, the covering portion for covering Wiring pattern 21a or membranaceous resistor etc. can also be set.Covering portion for example may include glass
Material.
In the case where light-emitting component 22 is the light-emitting component of shaped like chips, frame portion 25 and sealing 26 can be set.
The side opposite with the bottom surface side 11a1 of recess portion 11a of substrate 21 is arranged in frame portion 25.Frame portion 25 is arranged in substrate
On 21.Frame portion 25 is adhered to substrate 21.Frame portion 25 is cylindrical in shape, and is configured with light-emitting component 22 in the inside of frame portion 25.For example, frame portion
25 surround a plurality of light-emitting elements 22.Frame portion 25 can be formed from a resin.PBT (polybutylene can be used for example in resin
Terephthalate/ polybutylene terephthalate (PBT)), PC (polycarbonate/ polycarbonate), PET, nylon
(Nylon), PP (polypropylene/ polypropylene), PE (polyethylene/ polyethylene), PS (polystyrene/ polyphenyl
Ethylene) etc. thermoplastic resins.
And it is possible to which the particle of mixed oxidization titanium etc. is in resin to improve to the anti-of light emitted by light-emitting component 22
Penetrate rate.In addition, mixture is not limited solely to the particle of titanium oxide, as long as mixing is with higher to light emitted by light-emitting component 22
The particle of the material of reflectivity.Also, frame portion 25 can also for example be made of white resin.
The inner wall of frame portion 25 is set as inclined surface, and the inclined surface is towards with separate from substrate 21 and far from frame portion 25
The direction of mandrel tilts.Therefore, a part of the light projected from light-emitting component 22 can be reflected and direction by the inner wall of frame portion 25
The front side of Vehicular illumination device 1 projects.That is, frame portion 25 can have both the function of the formation range of determining sealing 26 and anti-
Penetrate the function of mirror.
The inside of frame portion 25 is arranged in sealing 26.Sealing 26 is disposed over the inside of frame portion 25.That is, sealing 26
The inside of frame portion 25, and covering luminous element 22 and wiring 21b etc. are set.Sealing 26 can be by the material with translucency
Material is formed.Sealing 26 can for example be formed and the inside potting resin in frame portion 25.The filling of resin can for example make
With device for discharging fixed quantity of liquid such as dispensers.Silicone resin etc. can be used for example in the resin of filling.
Also, sealing 26 may include fluorophor.Fluorophor for example can be fluorophor (yttrium-aluminium-garnet system, YAG system
Fluorophor).But it is also possible to change the type of fluorophor, suitably to obtain institute according to the purposes etc. of Vehicular illumination device 1
Desired illuminant colour.
Also, frame portion 25 can also be not provided with and sealing 26 is only set.In the case where sealing 26 are only arranged, in base
Dome-type sealing 26 is provided on plate 21.
Power supply 30 has power supply terminal 31 and insulation division 32.
Power supply terminal 31 can be clava.Power supply terminal 31 is prominent from the bottom surface 11a1 of recess portion 11a.Power supply terminal 31 is set
It is equipped with multiple.Multiple power supply terminals 31 can be arranged along prescribed direction.Insulation division 32 is arranged in multiple power supply terminals 31
It is internal.Insulation division 32 is arranged between power supply terminal 31 and lamp holder 10.Multiple power supply terminals 31 insulation division 32 internal stretch,
And it is prominent from the end face of the end face of 20 side of the light emitting module of insulation division 32 and 14 side of cooling fin of insulation division 32.Multiple feeder ears
The end of 20 side of light emitting module of son 31 is electrically connected and is mechanically connected with the Wiring pattern 21a that substrate 21 is arranged in.That is, feeder ear
One side end of son 31 is brazed in Wiring pattern 21a.The end of 14 side of cooling fin of multiple power supply terminals 31 is exposed to hole 10b's
It is internal.Connector 105 is entrenched in the multiple power supply terminals 31 for the inside for being exposed to hole 10b.Power supply terminal 31 is conductive.For
Electric terminal 31 such as can the metal by copper alloy be made.In addition, the quantity of power supply terminal 31, shape, configuration, material etc. are not only
It is limited to illustrate, can be suitably changed.
As described above, it is preferred to which lamp holder 10 is made by the higher material of thermal coefficient.However, the higher material of thermal coefficient has
When it is conductive.For example, high-termal conductivity resin of the metals such as aluminium alloy or the filler comprising consisting of carbon etc. is conductive.
Therefore, insulation division 32 is set in order to keep insulation between power supply terminal 31 and conductive lamp holder 10.Also, it insulate
Portion 32 also has the function of keeping multiple power supply terminals 31.In addition, in lamp holder 10 by the high-termal conductivity resin (example with insulating properties
Such as, the high-termal conductivity resin of filler etc. comprising being made of aluminium oxide) made of in situation, it is convenient to omit insulation division 32.At this point,
Multiple power supply terminals 31 are kept by lamp holder 10.
Insulation division 32 has insulating properties.Insulation division 32 can be formed by the resin with insulating properties.
Here, when Vehicular illumination device 1 is that the Vehicular illumination device 1 on automobile is arranged in, use environment
Temperature is -40 DEG C~85 DEG C.It is therefore preferable that heat of the thermal expansion coefficient of the material of insulation division 32 as far as possible with the material of lamp holder 10
Expansion coefficient similar.Thereby, it is possible to reduce the thermal stress generated between insulation division 32 and lamp holder 10.For example, insulation division 32
The resin contained in high-termal conductivity resin or the high thermal conductive resin contained by lamp holder 10 can be used in material.
Insulation division 32 can be for example pressed into the hole 10a that lamp holder 10 is arranged in, or can also be adhered to the interior of hole 10a
Wall.Also, insert-molding method integrally formed lamp holder 10 and power supply 30 out can also be passed through.
Heat transfer plate 40 is arranged between substrate 21 and the bottom surface 11a1 of recess portion 11a.Heat transfer plate 40 is arranged via adhesive portion
On the bottom surface 11a1 of recess portion 11a.That is, heat transfer plate 40 is adhered to the bottom surface 11a1 of recess portion 11a.
It is preferable to use the higher bonding agents of thermal coefficient for bonding agent for being bonded heat transfer plate 40 and bottom surface 11a1.For example,
Bonding agent can be the bonding agent for being mixed with the filler being made of inorganic material.That it is preferable to use thermal coefficients is higher for inorganic material
Material (for example, the ceramics such as aluminium oxide or aluminium nitride).The thermal coefficient of bonding agent for example can be set to 0.5W/ (m 〃 K) or more and
10W/ (m 〃 K) is below.
Also, heat transfer plate 40 can also be embedded in the bottom surface 11a1 of recess portion 11a by insert-molding method.Also, it conducts heat
Plate 40 can also be installed on the bottom surface 11a1 of recess portion 11a via the layer being made of heat-conducting silicone grease.Heat-conducting silicone grease can for example make
With heat-conducting silicone grease identical with above-mentioned heat-conducting silicone grease.
It is to make the heat generated in light emitting module 20 be transmitted as readily to lamp holder 10 that heat transfer plate 40, which is arranged,.Therefore, it conducts heat
Plate 40 is preferably made of the higher material of thermal coefficient.Heat transfer plate 40 is plate-like, heat transfer plate 40 for example can by aluminium, aluminium alloy,
The metals such as copper, copper alloy are made.
In addition, heat transfer plate 40 is not necessary component, heat transfer plate 40 also can be omitted.But if setting heat transfer plate
40, then it can be improved thermal diffusivity.
(lamps apparatus for vehicle)
Then, lamps apparatus for vehicle 100 is illustrated.
In addition, being below to be illustrated as an example the case where being set to the front combination lamp of automobile by lamps apparatus for vehicle 100.
But lamps apparatus for vehicle 100 is not limited to be set to the front combination lamp of automobile.As long as lamps apparatus for vehicle 100 is to be set to vapour
The lamps apparatus for vehicle of vehicle or rail vehicle etc..
Fig. 5 is for illustrating the diagrammatic cross-section fragmentary of lamps apparatus for vehicle 100.
As shown in figure 5, lamps apparatus for vehicle 100 is provided with Vehicular illumination device 1, framework 101, cover 102, optical element portion
103, seal member 104 and connector 105.
Vehicular illumination device 1 is installed in framework 101.Framework 101 keeps mounting portion 11.Framework 101 is in an end
The box-like of portion's side opening.Framework 101 by lighttight resin such as can be made.It is provided in the bottom surface of framework 101 for peace
The mounting hole 101a of the partial insertion for being provided with engaging pin 12 in dress portion 11.It is provided in the periphery of mounting hole 101a for being set to
The recess portion that the engaging pin 12 of mounting portion 11 is inserted into.Although mounting hole 101a is directly arranged in framework 101 in addition, instantiating at this
The case where, but the installing component with mounting hole 101a can also be set in framework 101.
When Vehicular illumination device 1 is installed on lamps apparatus for vehicle 100, mounting portion 11 is provided with engaging pin 12
In partial insertion mounting hole 101a, and rotate Vehicular illumination device 1.In this way, which engaging pin 12, which is maintained at, is set to peace
In the recess portion for filling the periphery of hole 101a.This installation method is referred to as twistlock.
Cover 102 is arranged to cover the opening of framework 101.Cover 102 can be made of the resin etc. with translucency.Cover 102
Also it can have the function of lens etc..
The light projected from Vehicular illumination device 1 is incident in optical element portion 103.Vehicle is shone in optical element portion 103
Light emitted by bright device 1 reflected, spread, guide-lighting, optically focused, and light distribution patterns as defined in being formed etc..
For example, the optical element portion 103 illustrated in Fig. 5 is reflecting mirror.At this point, optical element portion 103 is to vehicle lighting
Light emitted by device 1 is reflected, thus light distribution patterns as defined in being formed.
Seal member 104 is set between flange 13 and framework 101.Seal member 104 can be annular in shape.Seal member
104 can be made of the flexible material such as rubber or silicone resin.
In the case where Vehicular illumination device 1 is installed on lamps apparatus for vehicle 100, seal member 104 be clipped in flange 13 with
Between framework 101.Therefore, pass through the inner space of the closed framework 101 of seal member 104.In addition, passing through seal member 104
Engaging pin 12 is pressed on framework 101 by elastic force.Therefore, Vehicular illumination device 1 is able to suppress to fall off from framework 101.
Connector 105 is chimeric with the end of multiple power supply terminals 31 of inside for being exposed to hole 10b.In 105 electricity of connector
It is connected with power supply (not shown) etc..Therefore, by the way that connector 105 to be embedded in the end of power supply terminal 31, by electricity (not shown)
Source etc. is electrically connected with light-emitting component 22.
In addition, connector 105 has step part.Also, seal member 105a is installed on step part.Seal member
105a is that moisture invades the inside of hole 10b and is arranged in order to prevent.It is inserted in the connector 105 with seal member 105a
In the case where the 10b of hole, hole 10b is confined to watertight.
Seal member 105a can be annular in shape.Seal member 105a can be by the flexible material such as rubber or silicone resin
Material is made.Connector 105 bonding agent such as can also be by being adhered on the important document of 10 side of lamp holder.
More than, several embodiments of the invention are illustrated, but these embodiments are merely illustrative, not
There is the intention for limiting the scope of the invention.These new embodiments can be implemented in a manner of various other, not depart from the present invention
In the range of objective, various omissions, displacement, change etc. can be carried out.These embodiments or its variation belong to of the invention
In range or objective, and it is also contained in the invention and its equivalent range recorded in technical solution.In addition, above-mentioned is each
Embodiment also can be combined with each other implementation.
Claims (7)
1. a kind of Vehicular illumination device, which is characterized in that have:
Flange；
The side of the flange is arranged in mounting portion；
The side opposite with the mounting portion side of the flange is arranged at least one cooling fin；
The end side with flange side opposite side of the mounting portion is arranged in light emitting module, and it has at least one
A light-emitting component；
Heat transfer part is set in the inside of the recess portion of the surface opening of the side for being provided with the cooling fin of the flange.
2. Vehicular illumination device according to claim 1, which is characterized in that
The heat transfer part includes resin and filler.
3. Vehicular illumination device according to claim 2, which is characterized in that
The resin is silicone resin.
4. Vehicular illumination device according to claim 1, which is characterized in that
The heat transfer part includes heat-conducting silicone grease.
5. according to claim 1 to Vehicular illumination device described in any one in 4, which is characterized in that
At least part of the heat transfer part is contacted with the cooling fin.
6. according to claim 1 to Vehicular illumination device described in any one in 4, which is characterized in that
The cooling fin be provided with it is multiple,
The heat transfer part is arranged between the multiple cooling fin.
7. a kind of lamps apparatus for vehicle, which is characterized in that have:
Vehicular illumination device described in any one in claim 1 to 6；
Framework is installed for the Vehicular illumination device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-039216 | 2018-03-06 | ||
| JP2018039216A JP2019153522A (en) | 2018-03-06 | 2018-03-06 | Vehicular lighting device and vehicular lighting fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110230803A true CN110230803A (en) | 2019-09-13 |
Family
ID=67860319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910117353.2A Pending CN110230803A (en) | 2018-03-06 | 2019-02-15 | Vehicular illumination device and lamps apparatus for vehicle |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2019153522A (en) |
| CN (1) | CN110230803A (en) |
-
2018
- 2018-03-06 JP JP2018039216A patent/JP2019153522A/en active Pending
-
2019
- 2019-02-15 CN CN201910117353.2A patent/CN110230803A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019153522A (en) | 2019-09-12 |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190913 |
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| WD01 | Invention patent application deemed withdrawn after publication |