CN110227734B - Method for improving Mg/Ti connection interface performance - Google Patents
Method for improving Mg/Ti connection interface performance Download PDFInfo
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- CN110227734B CN110227734B CN201910401564.9A CN201910401564A CN110227734B CN 110227734 B CN110227734 B CN 110227734B CN 201910401564 A CN201910401564 A CN 201910401564A CN 110227734 B CN110227734 B CN 110227734B
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- B21B1/38—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling sheets of limited length, e.g. folded sheets, superimposed sheets, pack rolling
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- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
- C22C32/0063—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides based on SiC
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- B21B1/38—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling sheets of limited length, e.g. folded sheets, superimposed sheets, pack rolling
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Abstract
The invention discloses a method for improving an Mg/Ti layer interface by introducing a SiCp reinforcing phase through designing a composite material interlayer, and relates to a preparation method of a 'titanium/aluminum-based composite material/magnesium/aluminum-based composite material/titanium' layered material for improving the Mg/Ti interface performance. The method comprises the steps of firstly preparing SiCp reinforced aluminum matrix composite with uniformly distributed particles by a semi-solid stirring casting method, then carrying out hot rolling to obtain an aluminum matrix composite component plate, and then carrying out hot pressing and annealing on a laminated plate stacked in the order of titanium/aluminum matrix composite/magnesium/aluminum matrix composite/titanium. The invention adopts the hot pressing method with simple process, low cost and stable and controllable plate quality, on one hand, the dispersion strengthening and fine grain strengthening effects are generated on the component layer metal, so that the deformation between titanium and aluminum is more coordinated, on the other hand, the toughness of the interface area is improved, and the comprehensive performance of the composite plate is obviously improved.
Description
Technical Field
The invention belongs to the technical field of light alloy processing and forming, and particularly relates to a preparation method of a titanium/aluminum-based composite material/magnesium/aluminum-based composite material/titanium layered material for improving the Mg/Ti interface performance.
Background
In engineering application, magnesium and magnesium alloy have the disadvantages of low strength and rigidity, poor corrosion resistance and room temperature plasticity and the like, particularly poor corrosion resistance and low rigidity limit the wide application of the magnesium and magnesium alloy, and the advantages of titanium and titanium alloy can be complemented with those of magnesium and magnesium alloy in consideration of excellent high temperature resistance and corrosion resistance, high strength and high rigidity of the titanium and titanium alloy. However, the great difference in properties between magnesium and titanium makes it difficult to bond them, and a method of covering both sides of the magnesium layer with aluminum layers having excellent corrosion resistance and excellent plasticity as titanium-magnesium intermediate bonding layers has proven to be feasible. The titanium/aluminum/magnesium three-metal composite plate has the advantages of excellent processability of Al alloy, high temperature resistance and corrosion resistance of Ti alloy, low density of Mg alloy and the like, can save the consumption of noble metal and reduce the cost of products by reasonable design under the condition of meeting industrial requirements, and has huge application potential. But the sheet material has poor formability due to the inevitable formation of brittle intermetallic compounds at the Ti/Al and Mg/Al interfaces during processing.
Disclosure of Invention
Aiming at the problem that interface intermetallic compounds seriously influence the bonding strength, the mechanical property and the like of plates in the preparation process of the Ti/Al/Mg laminated composite plate, the invention adopts silicon carbide particle reinforced aluminum matrix composite (SiCp/AMCs) as an interface bonding layer and utilizes the silicon carbide particles (SiCp) to regulate and control the Ti/Al and Al/Mg interface intermetallic compounds so as to prepare the Ti/Al/Mg laminated composite material with fine and uniformly distributed intermetallic compound layers.
The invention adopts the following technical scheme:
a method for improving the performance of Mg/Ti connection interface improves the interface state so as to improve the forming capability of the Mg/Ti connection interface, introduces silicon carbide particle reinforced aluminum matrix composite (SiCp/AMCs) to replace Al, and prepares a 'Ti/AMCs/Mg/AMCs/Ti' composite plate. Wherein SiCp has the following effects: firstly, replacing an Al plate with a SiCp/AMCs plate to enable deformation between the Ti plate and the Al plate to be more coordinated; secondly, the dispersion strengthening effect of the SiCp reinforcement can further improve the elastic modulus and the high-temperature strength of the plate, so that the plate is expected to be applied to a higher-temperature environment; thirdly, the thinning effect of SiCp on the metal grains of each component layer can improve the strength and the plasticity of the plate; and fourthly, SiCp has a regulating effect on intermetallic compounds, so that the intermetallic compounds can be changed into fine discontinuous state from coarse continuous state, the discontinuous state distribution can limit the propagation of cracks on the interface to a certain extent, the toughness of the interface region is improved, and the bonding performance of the composite plate is further improved.
Further, the preparation method of the Ti/AMCs/Mg/AMCs/Ti composite board specifically comprises the following steps:
firstly, preparing SiCp/AMCs;
secondly, rolling the prepared SiCp/AMCs;
(III) respectively cleaning the surfaces of Ti, AMCs and Mg;
fourthly, stacking the cleaned Ti, AMCs and Mg into a composite board in the sequence of Ti/AMCs/Mg/AMCs/Ti;
placing the composite board in a hot-pressing mould for hot pressing;
and (VI) annealing the composite board obtained by hot pressing to obtain the layered composite material with the interface intermetallic compounds distributed uniformly and finely.
Further, in the first step, the AMCs is prepared by a semi-solid stirring casting method, which comprises the following specific steps:
introducing Ar + CO2 mixed gas before the Al alloy is completely melted, and preserving the heat for 1h at the temperature of about 100 ℃ above the melting point of the Al alloy, so that the Al alloy is completely melted;
then cooling to a semi-solid state, wherein the temperature is 550-;
after SiCp is completely doped, carrying out homogenization stirring for 15-30min and stirring degassing for 10 min;
heating the melt to be about 100 ℃ above the Al melting point in the stirring degassing process, preserving the heat for 10min, pouring the melt into a die-casting die, and setting the step-by-step load: 100N/5s +450N/180s, selecting general compression resistance: and the speed is 0.5mm/s, and the SiCp/AMCs are obtained.
Further, the Al alloy proportioning material comprises, by mass, 4.03% of Cu, 1.54% of Mg, 0.145% of Si, 0.19% of Fe, 0.55% of Mn and 93.545% of Al.
Further, the size of the spherical SiCp is 10 μm in diameter, and the volume fraction of particles is.
Further, the SiCp accounts for 5-20% of the volume fraction of the composite material, is placed in a drying furnace in advance, is heated to 600 ℃ along with the furnace, and is kept for 1-3 hours.
Further, the die-casting die is preheated to 150 ℃ and brushed with graphite oil before use, and then preheated to 400 ℃ and kept warm for 1-3 hours.
Further, in the second step, the die-casting AMCs with the thickness of 3-5mm are subjected to n-pass hot rolling at the temperature of 400-450 ℃ and the speed of 2-5 m/s.
Further, in the fourth step, the thickness ratio of Ti, AMCs, and Mg is: 0.3:0.5-1:2.
Further, in the fifth step, the step-by-step load setting is carried out under the condition of hot pressing at the temperature of 400-450 ℃: the pressure is maintained at 1000kN for 30-60min, and then at 600kN for 30 min.
Further, in the sixth step, annealing is carried out under the conditions of 250-350 ℃/2 h.
The invention has the beneficial effects that:
the invention adopts a hot-pressing method to prepare the 'Ti/AMCs/Mg/AMCs/Ti' layered composite material, the hot-pressing method is applied to the preparation of Mg/Al, Al/Ti and other layered composite materials for many times in the existing research, but the preparation of Ti/Al/Mg or Ti/AMCs/Mg three-metal layered composite plates is the first time; AMCs are adopted to replace an Al alloy layer, and a SiCp enhanced phase is introduced to regulate and control the interface morphology and the interface microstructure of the layer, so that the performance of the composite plate is improved.
Compared with the prior art, the invention provides a preparation method of a Ti/Al/Mg layered composite material with an adjustable interface, SiCp/AMCs are prepared in the first step, and SiCp is uniformly introduced into Al alloy by a semi-solid stirring casting method; secondly, hot rolling is carried out on the SiCp/AMCs obtained in the first step, so that the aluminum alloy matrix grains are effectively refined, and the casting defects are improved; and fifthly, step-by-step fixed-load hot pressing is carried out on the laminated plate, so that firm metallurgical bonding is formed between the titanium-magnesium-aluminum laminated plates, and the SiCp which is a reinforcement not only plays roles of dispersion strengthening and fine grain strengthening for the component plates, but also can regulate and control the form of an interface intermetallic compound and the microstructure of an interface layer, so that the propagation of cracks on the interface is hindered to a certain extent, the toughness of an interface area is improved, and further the comprehensive performance of the composite plate is improved.
Drawings
FIG. 1 is a macroscopic cross-sectional view of a composite panel according to one embodiment, wherein (a) is a Ti/AMCs/Mg/AMCs/Ti composite panel and (b) is a Ti/Al/Mg/Al/Ti composite panel.
Fig. 2 is a graph showing the vickers hardness change at different positions of the composite board manufactured according to the first embodiment, in which (a) is the vickers hardness change at the center and at the interface of each Ti/Al/Mg/Al/Ti component board, and (b) is the vickers hardness change at the center and at the interface of each Ti/AMCs/Mg/AMCs/Ti component board.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments, which are merely preferred embodiments of the invention, and all equivalent changes in the features and principles described in the claims of the invention are included in the scope of the invention.
The embodiment is a method for improving Mg/Al and Al/Ti layer interfaces by introducing a SiCp enhanced phase, which is specifically carried out according to the following steps:
firstly, SiCp/AMCs are prepared. The grain size of the spherical SiCp is 10 mu m, the volume fraction of the silicon carbide particles in the silicon carbide particle reinforced aluminum matrix composite material is 12 percent, the weighed SiCp is placed in a drying furnace, the temperature is raised to 600 ℃ along with the furnace, and the temperature is kept for 2 to 3 hours. Preheating the die-casting mould to 150 ℃ and brushing graphite oil, then preheating to 400 ℃ and keeping the temperature for 1-3 h. Before preparing the aluminum matrix composite, the inner surface of the crucible is uniformly coated with talcum powder and ZnO to block possible reaction between the crucible and the melt. Preparing the aluminum-based composite material by adopting a semi-solid state stirring casting method, and introducing Ar + CO before the aluminum alloy is completely melted2And (3) keeping the temperature of the mixed gas for 1h at about 100 ℃ (760 ℃) above the melting point of the aluminum alloy, so that the aluminum alloy is completely melted. And then cooling to a semi-solid state, wherein the temperature range is about 550-640 ℃, the temperature is adjusted to +/-10 ℃ according to the vortex size of the melt, SiCp is doped into the aluminum alloy melt by a mechanical stirring method, the mechanical stirring speed is 300-1000 rpm, and positive and negative rotation are alternately carried out. After the SiCp is completely doped, the process of homogenizing and stirring for 15-30min and stirring and degassing for 10min is carried out. Under stirringHeating the melt to about 100 ℃ (760 ℃) above the melting point of the aluminum alloy in the degassing process, preserving heat for 10min, pouring the melt into a die-casting die, and setting step by step load-fixing: 100N/5s +450N/180s, then selecting general compression resistance: and demolding at the speed of 0.5mm/s to obtain the silicon carbide particle reinforced aluminum matrix composite.
And secondly, rolling the SiCp/AMCs prepared in the first step. The die-casting aluminum-based composite material with the thickness of 3-5mm is subjected to n-pass hot rolling at the temperature of 400-450 ℃ and the speed of 2-5 m/s.
And thirdly, cleaning the surfaces of the Ti, AMCs and Mg plates. And (3) polishing the surfaces of the titanium alloy, magnesium alloy and aluminum-based composite material plates by using No. 80 coarse sand paper, and ultrasonically cleaning and drying the titanium alloy, magnesium alloy and aluminum-based composite material plates in alcohol.
Fourthly, stacking the cleaned Ti, AMCs and Mg in a form of Ti/AMCs/Mg/AMCs/Ti, wherein the thickness ratio of the Ti to the AMCs to the Mg is as follows: 0.3:0.7:2.
Fifthly, the annealed composite board is taken out and placed in a hot-pressing die for hot pressing. The hot pressure is set under the conditions of 400-450 ℃, and the step-by-step load fixing is carried out: a pressure of 1000kN is maintained for 30-60min followed by a pressure of 600kN for 30 min.
Sixthly, annealing the composite board obtained by hot pressing at the temperature of 350 ℃/2h at 250-.
The second embodiment is as follows: this embodiment is different from the first embodiment in that the volume fraction of spherical SiCp in the first step is 5%, and the other embodiments are the same as the first embodiment.
The third concrete implementation mode: this embodiment is different from the first embodiment in that the volume fraction of spherical SiCp in the first step is 15%, and the other embodiments are the same as the first embodiment.
The fourth concrete implementation mode: the difference between this embodiment and the first embodiment is that the rolling temperature in the second step is 400 ℃, and the other steps are the same as those in the first embodiment.
The fifth concrete implementation mode: the difference between the present embodiment and the first embodiment is that the thickness ratio of Ti, AMCs, and Mg in the fourth step is: 0.3:0.5:2 are otherwise the same as in embodiment one.
The sixth specific implementation mode: the difference between the present embodiment and the first embodiment is that the thickness ratio of Ti, AMCs, and Mg in the fourth step is: the other steps are the same as those in the first embodiment.
As shown in fig. 1, which is a macroscopic view of a cross section of a composite plate manufactured according to a first embodiment and a comparative example, the view (a) is a Ti/AMCs/Mg/AMCs/Ti composite plate, and the view (b) is a Ti/Al/Mg/Al/Ti composite plate, as can be seen from the figure, the density between the connection interfaces of the Ti/AMCs/Mg/AMCs/Ti composite plate is far greater than that of the connection interfaces of the Ti/Al/Mg/Al/Ti composite plate, so that the connection structure is more uniform;
as shown in fig. 2, a graph showing the change in vickers hardness values at different positions of the composite board manufactured in the first embodiment and the comparative example is shown, where a is the change in vickers hardness at different positions of the Ti/Al/Mg/Al/Ti composite board, and b is the change in vickers hardness at different positions of the Ti/AMCs/Mg/AMCs/Ti composite board, and it can be seen from the graph that the vickers hardness at different positions of Ti/AMCs/Mg/AMCs/Ti is far greater than the vickers hardness at different positions of the Ti/Al/Mg/Al/Ti composite board.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. The method for improving the performance of the Mg/Ti connection interface is characterized in that an aluminum-based composite material is introduced to replace an aluminum layer, so that a titanium/aluminum-based composite material/magnesium/aluminum-based composite material/titanium composite plate is prepared, and the preparation method of the titanium/aluminum-based composite material/magnesium/aluminum-based composite material/titanium composite plate specifically comprises the following steps:
preparing a silicon carbide particle reinforced aluminum matrix composite;
rolling the prepared aluminum-based composite material;
(III) respectively carrying out surface cleaning on titanium or titanium alloy, aluminum-based composite material and magnesium or magnesium alloy;
fourthly, stacking the cleaned titanium or titanium alloy, aluminum-based composite material and magnesium or magnesium alloy into a composite board in the sequence of 'titanium/aluminum-based composite material/magnesium/aluminum-based composite material/titanium';
placing the composite board in a hot-pressing mould for hot pressing;
sixthly, annealing the composite board obtained by hot pressing to obtain a titanium/aluminum-based composite material/magnesium/aluminum-based composite material/titanium composite board with interface intermetallic compounds distributed uniformly and finely;
in the step (one), the aluminum matrix composite material is prepared by adopting a semi-solid stirring casting method, and the method comprises the following specific steps:
introducing Ar + CO before the aluminum alloy is completely melted2Mixing the gas, keeping the temperature for 1h at about 100 ℃ above the melting point of the aluminum alloy, and completely melting the aluminum alloy;
then cooling to a semi-solid state, wherein the temperature is 550-;
after the silicon carbide particles are completely doped, carrying out homogenization stirring for 15-30min and stirring degassing for 10 min;
heating the melt to be about 100 ℃ above the melting point of the aluminum alloy in the stirring degassing process, preserving the heat for 10min, pouring the melt into a die-casting die, and setting the step-by-step load: maintaining pressure for 5s at 100N and 180s at 450N, and selecting general compression resistance: demoulding at the speed of 0.5mm/s to obtain the silicon carbide particle reinforced aluminum matrix composite;
the aluminum alloy proportioning materials comprise, by mass, 4.03% of Cu, 1.54% of Mg, 0.145% of Si, 0.19% of Fe, 0.55% of Mn and 93.545% of Al;
the size of the spherical silicon carbide particles is 10 micrometers, the spherical silicon carbide particles account for 5-20% of the total volume of the silicon carbide and the aluminum alloy, the spherical silicon carbide particles are placed in a drying furnace in advance, the temperature is raised to 600 ℃ along with the furnace, and the temperature is kept for 1-3 hours;
preheating the die-casting die to 150 ℃ before use, brushing graphite oil, then preheating to 400 ℃ and preserving heat for 1-3 h;
in the step (II), the die-casting aluminum-based composite material with the thickness of 3-5mm is subjected to n-pass hot rolling at the temperature of 400-450 ℃ and the speed of 2-5 m/s;
in the step (IV), the thickness ratio of the titanium or titanium alloy and aluminum-based composite material to the magnesium or magnesium alloy is as follows: 0.3:0.5-1:2.
2. The method as claimed in claim 1, wherein the step (V) includes hot pressing at 400-450 ℃ to set the step-by-step load: the pressure is maintained at 1000kN for 30-60min, and then at 600kN for 30 min.
3. The method for improving the performance of the Mg/Ti connecting interface as claimed in claim 1, wherein the annealing in the step (six) is performed at 250-350 ℃/2 h.
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