CN110224231B - Calibration network device and Massive MIMO array antenna - Google Patents
Calibration network device and Massive MIMO array antenna Download PDFInfo
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- CN110224231B CN110224231B CN201910608778.3A CN201910608778A CN110224231B CN 110224231 B CN110224231 B CN 110224231B CN 201910608778 A CN201910608778 A CN 201910608778A CN 110224231 B CN110224231 B CN 110224231B
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- 239000002184 metal Substances 0.000 claims abstract description 121
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 230000008054 signal transmission Effects 0.000 claims abstract description 6
- 239000000523 sample Substances 0.000 claims description 42
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- 238000003786 synthesis reaction Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000004891 communication Methods 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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Abstract
The invention discloses a calibration network device and a Massive MIMO array antenna, wherein the whole calibration network device is arranged in a concave shape, the calibration network device comprises a top metal layer, a first dielectric substrate, a middle metal layer, a second dielectric substrate and a bottom metal layer which are sequentially laminated and pressed, and the middle metal layer comprises a middle metal ground and a calibration network for signal transmission. The invention has the advantages of improving the board utilization rate of the PCB board and lower production cost, and meanwhile, the calibration network, the top metal layer, the bottom metal layer, the first layer dielectric substrate, the second layer dielectric substrate and the conductive grounding hole form a closed strip line transmission mode, so that the influence of external environment can be avoided, the consistency of the electric characteristics such as the amplitude, the phase and the impedance of the radio frequency port calibration signal of the calibration network device is ensured, the port signal calibration capability of the Massive MIMO array antenna is obviously improved, and the invention is particularly suitable for a large-scale array antenna system for 5G communication.
Description
Technical Field
The present invention relates to the field of communications technologies, and in particular, to a calibration network device and a passive MIMO array antenna.
Background
The calibration network is generally processed by a PCB (printed circuit board), the raw materials of the PCB are high-frequency copper-clad plates with standard sizes, and factories for producing the high-frequency copper-clad plates release some standard sizes for sale in the market; the PCB processor can calculate the utilization rate of the high-frequency copper-clad plate according to parameters such as the size, the process, the layer number and the like of the PCB to be processed, thereby calculating the material cost. Because the large-scale MIMO array antenna ports are more, the size of the calibration network is larger than that of a conventional intelligent antenna, and the calibration network in the prior art adopts a whole board design scheme, so that the PCB board utilization rate is relatively low, and the production cost of the calibration network is higher.
Disclosure of Invention
The invention mainly aims to provide a calibration network device for a Massive MIMO array antenna, which aims to solve the problems that the utilization rate of a PCB board in the process of producing a calibration network in the prior art is relatively low and the production cost of the calibration network is high.
In order to achieve the above objective, the present invention provides a calibration network device for a Massive MIMO array antenna, where the calibration network device is integrally configured in a concave shape, and the calibration network device includes a top metal layer, a first dielectric substrate, an intermediate metal layer, a second dielectric substrate, and a bottom metal layer that are sequentially stacked and laminated, and the intermediate metal layer includes an intermediate metal ground and a calibration network for signal transmission.
Preferably, the calibration network device is divisible into a first region, a second region and a connection region;
the first area and the second area are vertically arranged on the same side of the connecting area, and the first area and the second area are arranged at intervals to form the concave shape.
Preferably, the calibration network comprises a multi-stage power splitting combining network and a plurality of parallel directional couplers; the multi-stage power distribution synthesis network is formed by N-stage cascade connection of N Wilkinson power dividers and is provided with M dividing ports and 1 total port, wherein the total port is a calibration port, N=2 n-1,M＝2n, and N is a positive integer; the parallel directional couplers are arranged in one-to-one correspondence with the split ports, the coupling ends of the parallel directional couplers are connected with branches of the Wilkinson power divider, the isolation ends of the parallel directional couplers are connected with terminal loads, the input ends of the parallel directional couplers are connected with radio frequency connectors of the Massive MIMO array antenna, and the output ends of the parallel directional couplers are connected with feed probes of the Massive MIMO array antenna.
Preferably, a plurality of radio frequency connector fixing holes penetrating through the calibration network device are formed in the calibration network device, wherein the top metal layer faces away from the surface of the first dielectric substrate, radio frequency connector bonding pads are arranged on the periphery of the radio frequency connector fixing holes, and radio frequency connector avoidance areas are arranged on the periphery of the radio frequency connector bonding pads.
Preferably, the calibration network device is provided with a plurality of feed probe fixing holes and a plurality of metal screw grounding holes penetrating through the calibration network device, the top metal layer is away from the surface of the first dielectric substrate and/or the bottom metal layer is away from the surface of the second dielectric substrate, the circumference side of the feed probe fixing holes is provided with feed probe pads, and the circumference side of the feed probe pads is provided with feed probe avoidance areas.
Preferably, the calibration network device is provided with a chip resistor connecting hole penetrating through the second dielectric substrate and the bottom metal layer, the bottom metal layer deviates from the surface of the second dielectric substrate, the periphery of the chip resistor connecting hole is provided with a chip resistor pad, and the periphery of the chip resistor pad is provided with a chip resistor avoiding area.
Preferably, the shape of the radio frequency connector avoidance area, the feed probe avoidance area and the patch resistor avoidance area is round or square.
Preferably, the calibration network device is provided with a plurality of plastic rivet fixing holes penetrating through the calibration network device, and the plastic rivet fixing holes are used for fixing the calibration network device on the metal plate of the Massive MIMO array antenna through plastic rivets.
Preferably, the calibration network device is provided with a plurality of conductive ground holes extending through the calibration network device.
In order to achieve the above object, the present invention further provides a Massive MIMO array antenna, where the Massive MIMO array antenna includes a metal plate, a power division network, and the calibration network device according to any one of the above, the power division network and the calibration network device are respectively disposed on two surfaces of the metal plate opposite to each other, and the top metal layer is attached to the metal plate.
According to the technical scheme, the network calibration device is integrally arranged in the shape of the concave, namely the top metal layer, the first medium substrate, the middle metal layer, the second medium substrate and the bottom metal layer which are arranged in a laminated and pressed mode are all arranged in the shape of the concave, and the calibration net for signal transmission is arranged on the middle metal layer, so that the board utilization rate of a PCB (printed circuit board) is improved while the signal calibration function of the network calibration device is realized, the generation cost of the network calibration device is reduced, and the overall production cost of the Massive MIMO array antenna is reduced.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a calibration network device according to the present invention;
FIG. 2 is a schematic diagram of an exploded view of an embodiment of a calibration network device according to the present invention;
FIG. 3 is a schematic diagram illustrating an embodiment of an intermediate metal layer of the calibration network device according to the present invention;
FIG. 4 is an enlarged schematic view of the portion A in FIG. 3;
FIG. 5 is a schematic diagram illustrating an embodiment of a top metal layer of the calibration network device according to the present invention;
FIG. 6 is an enlarged view of the portion B of FIG. 5;
FIG. 7 is a schematic diagram illustrating an embodiment of an underlying metal layer of a calibration network device according to the present invention;
FIG. 8 is an enlarged view of the structure of portion C in FIG. 7;
FIG. 9 is a schematic diagram illustrating a second dielectric substrate of a calibration network device according to an embodiment of the present invention;
fig. 10 is an enlarged schematic view of the portion D in fig. 9.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1-10 together, in order to achieve the above objective, the present invention provides a calibration network device 100 for a Massive MIMO array antenna (not shown), the calibration network device 100 is integrally configured in a concave shape, the calibration network device 100 includes a top metal layer 10, a first dielectric substrate 20, an intermediate metal layer 30, a second dielectric substrate 40, and a bottom metal layer 50 that are sequentially stacked and laminated, and the intermediate metal layer 30 includes an intermediate metal ground 31 and a calibration network 32 for signal transmission.
In this embodiment, the calibration network device 100 is applied to a Massive MIMO array antenna, where the Massive MIMO array antenna generally includes a plurality of radiating elements (not shown) arranged in an array, a plurality of radio frequency connectors (not shown), a plurality of feed probes (not shown), and the like, and the Massive MIMO array antenna further includes a metal plate (not shown), a power division network (not shown) disposed on the metal plate, and the like, where the power division network feeds the radiating elements through the feed probes, and the radio frequency connectors are used to receive radio frequency signals and transmit the radio frequency signals to the radiating elements to radiate into space.
In this embodiment, the calibration network device 100 is configured to calibrate the radio frequency signal radiated by the radiating element. In the process of producing the calibration network device 100, a plurality of concave areas are divided on a whole PCB board, each two concave areas are divided into a group, the two concave areas in the same group are mutually embedded, the calibration network 32 is printed in a single concave area, and then the whole PCB board is cut into a plurality of concave middle metal layers 30 along the edges of the concave areas, thereby improving the board utilization rate of the PCB board and reducing the production cost.
It can be appreciated that the top metal layer 10, the first dielectric substrate 20, the second dielectric substrate 40, and the bottom metal layer 50 are also formed into a concave shape by the same process as that of the middle metal layer 30, and the top metal layer 10, the middle metal layer 30 of the first dielectric substrate 20, the second dielectric substrate 40, and the bottom metal layer 50 are sequentially laminated and pressed together, so that the whole calibration network device 100 formed after the pressing is configured into a concave shape, and since the top metal layer 10, the first dielectric substrate 20, the middle metal layer 30, the second dielectric substrate 40, and the bottom metal layer 50 are configured into a concave shape, the utilization rate of the board can be further improved, and the production cost of the calibration network device 100 is further reduced.
In this embodiment, the top metal layer 10 is used as an upper metal layer, the middle metal layer 30 is used as a middle metal layer, the bottom metal layer 50 is used as a lower metal layer, and the top metal layer 10, the middle metal layer 30 and the bottom metal layer 50 are electrically connected to each other, and at least one of them is grounded, preferably the middle metal layer 30 is grounded.
In summary, according to the present invention, the calibration network device 100 is integrally configured in a concave shape, that is, the top metal layer 10, the first dielectric substrate 20, the middle metal layer 30, the second dielectric substrate 40, and the bottom metal layer 50 are all configured in a concave shape in a lamination and press-fit manner, and the calibration network 32 for signal transmission is configured in the middle metal layer 30, so that the signal calibration function of the calibration network device 100 is realized, the board utilization rate of the PCB board in the production process is improved, and the production cost of the calibration network device 100 is reduced, thereby reducing the overall production cost of the Massive MIMO array antenna.
Referring to fig. 1, specifically, the calibration network device 100 may be divided into a first area 101, a second area 102, and a connection area 103; the first area 101 and the second area 102 are vertically disposed on the same side of the connection area 103, and the first area 101 and the second area 102 are spaced apart to form the concave shape.
In this embodiment, the calibration network device 100 may be divided into a first area 101, a second area 102 and a connection area 103, where the first area 101, the second area 102 and the connection area 103 are integrally formed, the first area 101, the second area 102 and the connection area 103 may be square areas, the first area 101 and the second area 102 are all vertically disposed on the same side of the connection area 103, and the first area 101 and the second area 102 are disposed at intervals to form the concave shape, and the concave shape may also be described as a U shape; a notch area is formed between the first area 101 and the second area 102, when the calibration network device 100 is not cut into a single calibration network device 100, the notch area is filled with the first area 101 or the second area 102 of another calibration network device 100 in the same group, that is, when the whole PCB board is not cut into a single calibration network device 100, the two calibration network devices 100 in the same group are mutually embedded together, in this way, the waste of the PCB board at the position of the notch area is avoided, and a plurality of calibration network devices 100 are formed by fully utilizing the limited area of the PCB board, thereby improving the utilization rate of the PCB board.
Referring to fig. 4, the calibration network 32 preferably includes a multi-stage power splitting and combining network (not shown) and a plurality of parallel directional couplers 321; the multi-stage power distribution and synthesis network is formed by N-stage cascading of N wilkinson power dividers 322, and has M split ports 3221 and 1 total port 3222 (see fig. 3), wherein the total port 3222 is a calibration port, n=2 n-1,M＝2n, and N is a positive integer; the parallel directional couplers 321 are arranged in one-to-one correspondence with the split ports 3221, the coupling ends 3211 of the parallel directional couplers 321 are connected with branches of the wilkinson power divider 322, the isolation ends 3212 of the parallel directional couplers 321 are connected with terminal loads, the input ends 3213 of the parallel directional couplers 321 are connected with radio frequency connectors of the Massive MIMO array antenna, and the output ends 3214 of the parallel directional couplers 321 are connected with feed probes of the Massive MIMO array antenna.
In this embodiment, for example, 31 wilkinson power splitters 3225 are cascaded, the multi-stage power splitting and combining network has 32 split ports 3221 and 1 total ports 3222, the parallel directional couplers 321 are arranged in a one-to-one correspondence with the split ports 3221, and also have 32 coupling ends 3211 of the parallel directional couplers 321 are connected with branches of the wilkinson power splitters 322, that is, one of the split ports 3221, the isolation ends 3212 of the parallel directional couplers 321 are connected with a terminal load, that is, a 50 ohm resistor, the input end 3213 of the parallel directional couplers 321 is connected with a radio frequency connector of the Massive MIMO array antenna, and the output ends 3214 of the parallel directional couplers 321 are connected with a feeding probe of the Massive MIMO array antenna, which is used for feeding the radiating element. It is to be understood that the present embodiment is only illustrated by 32 split ports 3221, and is not limited thereto.
In this embodiment, when the communication base station (not shown) works, a radio frequency signal sent by a transmitting end (not shown) of the signal transceiver (not shown) enters the radio frequency connector of the Massive MIMO array antenna, and then is transmitted to an output end 3214 of the parallel directional coupler 321 through an input end of a main signal channel of the calibration network 32, that is, an input end 3213 of the parallel directional coupler 321, and the output end 3214 of the parallel directional coupler 321 transmits the radio frequency signal to a corresponding radiating unit through the feed probe and radiates the radio frequency signal to space through the radiating unit; meanwhile, the coupling end 3211 of the parallel directional coupler 321 couples the rf signal passing through the main signal channel, and the coupled rf signal passes through the output end of the coupled signal channel, that is, the coupling end 3211 of the parallel directional coupler 321 enters the wilkinson power divider 322 connected thereto and is finally transmitted to the calibration port, that is, the main port 3222, and is finally received by the receiving end of the signal transceiver.
Referring to fig. 4 and 6, the calibration network device 100 is preferably provided with a plurality of radio frequency connector fixing holes 323 penetrating through the calibration network device 100, wherein a radio frequency connector bonding pad 11 (see fig. 6) is disposed on a peripheral side of the radio frequency connector fixing holes 323 on a surface of the top metal layer 10 facing away from the first dielectric substrate 20, and a radio frequency connector avoiding area 12 is disposed on a peripheral side of the radio frequency connector bonding pad 11.
In this embodiment, the rf connector fixing hole 323 penetrates through the calibration network device 100 to fix the rf connector on the calibration network device 100, the rf connector pad 11 is used for fixing the rf connector on the top metal layer 10 by welding, and since the top metal layer 10 is grounded, an rf connector avoiding area 12 is provided on the peripheral side of the rf connector pad 11 to avoid the rf connector from contacting with the bottom metal layer 50 to cause a short circuit.
Referring to fig. 6, specifically, pins (not shown) of the rf connector include a central pin (not shown) for transmitting an rf signal and a plurality of fixing pins (not shown) around the central pin for fixing the rf connector, preferably, the number of the fixing pins is 4, the 4 fixing pins are uniformly arranged around the central pin, and the rf connector is fixed on the calibration network device 100 through the 4 fixing pins, so as to improve connection stability of the rf connector. Correspondingly, the rf connector fixing hole 323 includes a fixing pin fixing hole 3232 and a central pin fixing hole 3231 corresponding to the number of the fixing pins, the fixing pins are fixed on the calibration network device 100 through the fixing pin fixing hole 3232, the central pin is fixed on the calibration network device 100 through the central pin fixing hole 3231, and the central pin is connected with the input end 3213 of the parallel directional coupler 321. It will be appreciated that the fixing pin fixing hole 3232 and the central pin fixing hole 3231 are provided with bonding pads, and at least the peripheral side of the bonding pad of the central pin fixing hole 3231 is provided with a relief area (not shown) to prevent the central pin from being shorted to the top metal layer 10. It is understood that the rf connector mounting holes 323 may be metallized vias.
Referring to fig. 4, preferably, the calibration network device 100 is provided with a plurality of feed probe fixing holes 13 and a plurality of metal screw grounding holes 14 penetrating through the calibration network device 100, and a feed probe pad (not shown) is disposed on a peripheral side of the feed probe fixing hole 13 and a feed probe avoiding area 15 is disposed on a peripheral side of the feed probe pad on a surface of the top metal layer 10 facing away from the first dielectric substrate 20 and/or a surface of the bottom metal layer 50 facing away from the second dielectric substrate 40.
In this embodiment, the feeding probe passes through the feeding probe fixing hole 13 to be fixedly connected with the calibration network device 100, and one end of the feeding probe is connected with the output end 3214 of the parallel directional coupler 321 of the calibration network 32 on the intermediate metal layer 30, and the other end of the feeding probe is connected with the radiating unit, so as to receive the radio frequency signal transmitted by the radio frequency connector and transmit the radio frequency signal to the radiating unit.
In this embodiment, a feeding probe pad is disposed on a peripheral side of the feeding probe fixing hole 13 on a surface of the top metal layer 10 facing away from the first dielectric substrate 20 and/or a surface of the bottom metal layer 50 facing away from the second dielectric substrate 40, so as to fix the feeding probe on the calibration network device 100 through the feeding probe pad, and a feeding probe avoiding area 15 is disposed on a peripheral side of the feeding probe pad, so as to prevent the feeding probe from contacting with the top metal layer 10 and/or the bottom metal layer 50 to cause a short circuit.
In this embodiment, the metal screw grounding hole 14 is disposed adjacent to the feed probe fixing hole 13, two adjacent feed probe fixing holes 13 are configured with one metal screw grounding hole 14, one feed probe fixing hole 13 that is separately disposed is configured with one metal screw grounding hole 14, and the metal screw of the Massive MIMO array antenna is fixed on the calibration network device 100 through the metal screw grounding hole 14. It is understood that the electrical probe fixing holes 13 and the metal screw grounding holes 14 may be metallized vias.
Referring to fig. 7-10, preferably, the calibration network device 100 is provided with a chip resistor connection hole 16 penetrating through the second dielectric substrate 40 and the bottom metal layer 50, and on a surface of the bottom metal layer 50 facing away from the second dielectric substrate 40, a chip resistor pad 17 is disposed on a peripheral side of the chip resistor connection hole 16, and a chip resistor avoiding area 18 is disposed on a peripheral side of the chip resistor pad 17.
In this embodiment, the chip resistor of the Massive MIMO array antenna is connected to the calibration network 32 of the intermediate metal layer 30 through the chip resistor connection hole 16, where the chip resistor includes a 50Ω resistor for implementing impedance matching, that is, the termination load and a power dividing resistor of the wilkinson power divider 322, and the termination load is disposed on the surface of the bottom metal layer 50 and is connected to the isolation end 3212 of the parallel directional coupler 321 through the chip resistor connection hole 16; the power dividing resistor is disposed on the surface of the bottom metal layer 50 and is connected to the two branches of the wilkinson power divider 322 through the chip resistor connection hole 16, so as to implement the power dividing function of the wilkinson power divider 322.
In this embodiment, the chip resistor that should be originally disposed on the middle metal layer 30 is disposed on the bottom metal layer 50, and the chip resistor is electrically connected to the calibration network 32 through the chip resistor connection hole 16, so as to ensure that the middle metal layer 30 and the second dielectric substrate 40 are closely attached, and ensure good grounding performance therebetween; the situation that the grounding is poor due to the fact that a gap exists between the middle metal layer 30 and the second dielectric substrate 40 when the chip resistor is directly arranged on the middle metal layer 30 is avoided. It is understood that the chip resistor connection holes 16 may be metallized vias.
In this embodiment, a chip resistor pad 17 is disposed on a peripheral side of the chip resistor connection hole 16, so that the chip resistor is fixed on the bottom metal layer 50 through the chip resistor pad 17, and a chip resistor avoiding area 18 is disposed on a peripheral side of the chip resistor pad 17, so as to prevent the chip resistor from being in contact with the bottom metal layer 50 and shorting.
Preferably, the shapes of the radio frequency connector avoidance area 12, the feed probe avoidance area 15 and the chip resistor avoidance area 18 are circular or square.
In this embodiment, the shapes of the rf connector avoidance area 12, the feed probe avoidance area 15 and the chip resistor avoidance area 18 are preferably round or square, so that good insulation performance is ensured, the shapes are easy to form, and the production process is simplified. It is understood that the avoidance area may have other shapes, and the present embodiment is not limited thereto.
Preferably, a plurality of plastic rivet fixing holes 19 penetrating through the calibration network device 100 are provided on the calibration network device 100, and the plastic rivet fixing holes 19 are used for fixing the calibration network device 100 to the metal plate of the Massive MIMO array antenna through plastic rivets.
In this embodiment, the plastic rivet fixing hole 19 is disposed at an edge position of the calibration network device 100 or in a blank area in the calibration network device 100, and the calibration network device 100 is fixed on the metal plate of the Massive MIMO array antenna by passing through the plastic rivet fixing hole 19 through a plastic rivet, so as to ensure the overall stability of the calibration network device 100.
Preferably, the calibration network device 100 is provided with a plurality of conductive ground holes 21 extending through the calibration network device 100.
In this embodiment, the conductive ground holes 21 may be metallized vias, the conductive ground holes 21 are densely arranged, at least a portion of the conductive ground holes 21 are arranged on two sides of the strip line of the calibration network 32, and at least a portion of the conductive ground holes 21 are arranged at the edge of the calibration network device 100. The calibration network 32 of the middle metal layer 30, the top metal layer 10, the bottom metal layer 50, the first dielectric substrate, the second dielectric substrate and the conductive grounding hole 21 form a closed strip line transmission mode, and by adopting such an integrated architecture design, the influence of external environment is avoided, the consistency of the electrical characteristics such as the amplitude, the phase and the impedance of the radio frequency port calibration signal of the calibration network device 100 is ensured, the port signal calibration capability of the Massive MIMO array antenna is remarkably improved, and the antenna is particularly suitable for a large-scale array antenna system for 5G communication.
In order to achieve the above objective, the present invention further provides a Massive MIMO array antenna, where the Massive MIMO array antenna includes a metal plate, a power division network, and the calibration network device 100 as described above, the power division network and the calibration network device 100 are respectively disposed on two surfaces of the metal plate opposite to each other, and the top metal layer 10 is attached to the metal plate.
In this embodiment, the power dividing network is used for feeding the feeding probe, the metal plate is used for supporting the calibration network device 100, and the Massive MIMO array antenna includes the calibration network device 100, so that the foregoing calibration network device 100 has at least the beneficial effects, and will not be described herein.
In this embodiment, the calibration network device 100 and the Massive MIMO array antenna are suitable for the calibration network 32 of the Massive MIMO antenna with the operating frequency band of Sub 6GHz, including 2.3G frequency band (2.3 GHz-2.5 GHz), 2.6G frequency band (2.496 GHz-2.690 GHz), 3.5G frequency band (3.3 GHz-3.8 GHz), 4.5G frequency band (4.4 GHz-5.2 GHz), and so on.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (9)
1. The calibration network device for the Massive MIMO array antenna is characterized by being integrally arranged in a concave shape, and comprises a top metal layer, a first dielectric substrate, an intermediate metal layer, a second dielectric substrate and a bottom metal layer which are sequentially laminated and pressed, wherein the intermediate metal layer comprises an intermediate metal ground and a calibration network for signal transmission;
The top metal layer, the first dielectric substrate, the middle metal layer, the second dielectric substrate and the bottom metal layer are all arranged in a concave shape;
Wherein the calibration network device is divided into a first area, a second area and a connection area;
the first area and the second area are vertically arranged on the same side of the connecting area, the first area and the second area are arranged at intervals to form the concave shape, and the first area, the second area and the connecting area are integrally formed.
2. The calibration network device of claim 1,
The calibration network comprises a multi-stage power distribution synthesis network and a plurality of parallel directional couplers;
The multi-stage power distribution synthesis network is formed by N-stage cascade connection of N Wilkinson power dividers and is provided with M dividing ports and 1 total port, wherein the total port is a calibration port, N=2 n-1,M＝2n, and N is a positive integer;
The parallel directional couplers are arranged in one-to-one correspondence with the split ports, the coupling ends of the parallel directional couplers are connected with branches of the Wilkinson power divider, the isolation ends of the parallel directional couplers are connected with terminal loads, the input ends of the parallel directional couplers are connected with radio frequency connectors of the Massive MIMO array antenna, and the output ends of the parallel directional couplers are connected with feed probes of the Massive MIMO array antenna.
3. The calibration network device of claim 2, wherein a plurality of radio frequency connector fixing holes penetrating through the calibration network device are formed in the calibration network device, wherein radio frequency connector bonding pads are arranged on the periphery side of the radio frequency connector fixing holes on the surface, facing away from the first dielectric substrate, of the top metal layer, and radio frequency connector avoidance areas are arranged on the periphery side of the radio frequency connector bonding pads.
4. The calibration network device according to claim 2, wherein a plurality of feed probe fixing holes and a plurality of metal screw grounding holes penetrating through the calibration network device are formed in the calibration network device, and a feed probe pad is formed on the periphery of the feed probe fixing hole and a feed probe avoiding area is formed on the periphery of the feed probe pad on the surface of the top metal layer facing away from the first dielectric substrate and/or the surface of the bottom metal layer facing away from the second dielectric substrate.
5. The calibration network device of claim 2, wherein a chip resistor connection hole penetrating through the second dielectric substrate and the bottom metal layer is formed in the calibration network device, and a chip resistor pad is formed on a peripheral side of the chip resistor connection hole and a chip resistor avoiding area is formed on a peripheral side of the chip resistor pad on a surface of the bottom metal layer, which faces away from the second dielectric substrate.
6. The calibration network device of any one of claims 3-5, wherein the rf connector avoidance region, the feed probe avoidance region, and the chip resistor avoidance region are circular or square in shape.
7. The calibration network device of claim 1, wherein a plurality of plastic rivet attachment holes are provided through the calibration network device for attaching the calibration network device to a metal plate of the Massive MIMO array antenna by plastic rivets.
8. The calibration network device of claim 1, wherein the calibration network device has a plurality of conductive ground holes disposed therethrough.
9. A Massive MIMO array antenna, characterized in that the Massive MIMO array antenna comprises a metal plate, a power division network and the calibration network device according to any one of claims 1-8, the power division network and the calibration network device are respectively disposed on two surfaces of the metal plate opposite to each other, and the top metal layer is attached to the metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910608778.3A CN110224231B (en) | 2019-07-05 | 2019-07-05 | Calibration network device and Massive MIMO array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910608778.3A CN110224231B (en) | 2019-07-05 | 2019-07-05 | Calibration network device and Massive MIMO array antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110224231A CN110224231A (en) | 2019-09-10 |
| CN110224231B true CN110224231B (en) | 2024-06-14 |
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| CN110691461A (en) * | 2019-10-08 | 2020-01-14 | 摩比科技（深圳）有限公司 | 5G antenna integrated network device |
| CN110943293B (en) * | 2019-11-19 | 2021-05-28 | 京信通信技术(广州)有限公司 | Feed network device and antenna |
| CN111130658A (en) * | 2019-12-05 | 2020-05-08 | 瑞声科技(新加坡)有限公司 | Antenna calibration network device and MIMO antenna |
| WO2021109091A1 (en) * | 2019-12-05 | 2021-06-10 | 瑞声声学科技(深圳)有限公司 | Antenna calibration network apparatus and mimo antenna |
| CN113363734A (en) * | 2021-05-13 | 2021-09-07 | 武汉虹信科技发展有限责任公司 | Massive MIMO array antenna |
| CN115377670B (en) * | 2022-07-26 | 2023-07-04 | 四川领航未来通信技术有限公司 | Flat-panel array antenna with phase shift and dislocation |
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| WO2011101851A1 (en) * | 2010-02-17 | 2011-08-25 | Galtronics Corporation Ltd. | Antennas with novel current distribution and radiation patterns, for enhanced antenna isolation |
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| CN105762513B (en) * | 2016-03-03 | 2019-04-12 | 福建省汇创新高电子科技有限公司 | A kind of miniaturization high-isolation double frequency mimo antenna applied to WLAN |
| CN106936521B (en) * | 2017-01-12 | 2020-04-28 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Compact antenna feed calibration network |
| CN208240859U (en) * | 2018-04-17 | 2018-12-14 | 上海安费诺永亿通讯电子有限公司 | A kind of Massive MIMO array antenna |
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