CN110943293B

CN110943293B - Feed network device and antenna

Info

Publication number: CN110943293B
Application number: CN201911133106.8A
Authority: CN
Inventors: 陈礼涛; 高彬; 黄明达; 李轶帆
Original assignee: Comba Telecom Technology Guangzhou Ltd
Current assignee: Comba Telecom Technology Guangzhou Ltd
Priority date: 2019-11-19
Filing date: 2019-11-19
Publication date: 2021-05-28
Anticipated expiration: 2039-11-19
Also published as: CN110943293A

Abstract

The invention relates to a feed network device and an antenna. And a feed network circuit is arranged on the surface of one side of the feed network board. The cover plate is connected with the feed network board through the support columns, and a first grounding metal layer is arranged on the side surface, facing the feed network board, of the cover plate. The feed network circuit faces the first grounding metal layer and is provided with a gap with the first grounding metal layer. Air between the feed network board and the cover board is used as a medium, and an air microstrip mode is adopted, so that the cost can be reduced. The supporting column can control the distance between the feed network circuit and the ground, ensure that the traditional feed network device can be simulated, and keep the good performance of the traditional feed network device; compared with the traditional feed network device with a four-layer plate structure, the feed network device with the four-layer plate structure has the advantages that the thickness size of the feed network device can be reduced due to the reduction of the layer number, so that the low profile can be realized, and the physical space size can be reduced under the condition of ensuring the qualified indexes.

Description

Feed network device and antenna

Technical Field

The present invention relates to the field of communications technologies, and in particular, to a feed network device and an antenna.

Background

In mobile communication network coverage, a 5G Massive MIMO antenna is one of the key devices of the coverage network, and the gain of the antenna is determined by the loss of the feed network. Since the dielectric loss tangent of the dielectric material determines the loss of the power divider of the feed network device, the PCB with low dielectric loss is the key point of research in various large board factories.

A general feed network device adopts a high-frequency PCB (specifically made of PTFE) as a power divider to be arranged on a bottom plate, the high-frequency PCB generally comprises an upper stratum, a middle circuit layer and a lower stratum which are sequentially arranged, the high-frequency PCB is bonded with the bottom plate through a PP dielectric layer, and the high-frequency PCB is connected with the bottom plate through a metal through hole, so that the structure formed by combining the high-frequency PCB with the bottom plate is a four-layer plate. The PTFE has low dielectric constant and low dielectric loss, and becomes a preferred high-frequency PCB (printed Circuit Board) material, but the cost is higher; in addition, the dielectric loss tangent of the epoxy resin plate with low cost is 10 times that of the common material, and the dielectric constant deviation is large, so that the epoxy resin plate cannot be used for manufacturing the feed network device.

Disclosure of Invention

In view of the above, there is a need to overcome the drawbacks of the prior art and to provide a feeding network device and an antenna, which can reduce the cost and simplify the structure.

The technical scheme is as follows: a feed network arrangement comprising: the surface of one side of the feed network board is provided with a feed network circuit; the feed network board comprises a cover plate and support columns, the cover plate is connected with the feed network board through the support columns, a first grounding metal layer is arranged on the side surface, facing the feed network board, of the cover plate, and a gap is formed between the feed network circuit and the first grounding metal layer, facing the first grounding metal layer.

In the feed network device, the air between the feed network board and the cover board is used as a medium, and an air microstrip mode is adopted, so that the cost can be reduced, and meanwhile, a board with high dielectric loss (such as a low-cost epoxy resin board) can be adopted to manufacture the feed network board, so that the cost can be further reduced; in addition, the support column can control the distance between the feed network circuit and the ground, so that the traditional feed network device can be simulated, and the good performance of the traditional feed network device is kept; in addition, compared with the traditional feed network device with a four-layer plate structure, the thickness size of the feed network device can be reduced due to the reduction of the layer number, so that the low profile is favorably realized, and a large amount of physical space size can be reduced under the condition of ensuring the qualified indexes.

In one embodiment, a second ground metal layer is disposed on the other side surface of the feed network board.

In one embodiment, a boundary closing piece is arranged between the feed network board and the cover plate and is arranged along the circumference of the edge of the cover plate, and at least part of the feed network circuit is positioned in an area enclosed by the boundary closing piece.

In one embodiment, the boundary enclosure is a metal plate or a PCB board with a shielding function.

In one embodiment, a third ground metal layer is arranged on the side surface of the cover plate, which faces away from the feed network board, a plurality of protrusions are arranged at intervals on the boundary enclosure, a plurality of first through holes which correspond to the protrusions in a one-to-one manner are arranged on the cover plate, and the protrusions penetrate through the first through holes and are connected with the third ground metal layer in a welding manner;

a fourth grounding metal layer is further arranged on the side surface of the feed network board facing the cover board, the fourth grounding metal layer and the feed network circuit are located on the same side surface of the feed network board, the fourth grounding metal layer and the feed network circuit are isolated from each other, and the boundary sealing piece is further connected with the fourth grounding metal layer in a welding mode.

In one embodiment, the bump is welded on the third ground metal layer by using an SMT process; the boundary closing part is welded and arranged on the fourth grounding metal layer by adopting an SMT process.

In one embodiment, the boundary closure includes a plurality of first metal posts spaced circumferentially along the edge of the cover plate.

In one embodiment, a third ground metal layer is arranged on a side surface of the cover plate, which faces away from the feed network board, a plurality of first through holes corresponding to the first metal posts one by one are formed in the cover plate, and one ends of the first metal posts penetrate through the first through holes and then are connected with the third ground metal layer in a welding mode;

a fourth grounding metal layer is further arranged on the side surface of the feed network board facing the cover board, the fourth grounding metal layer and the feed network circuit are located on the same side surface of the feed network board, the fourth grounding metal layer and the feed network circuit are isolated from each other, and the other end of the first metal column is connected with the fourth grounding metal layer in a welding mode.

In one embodiment, one end of the first metal pillar is soldered to the third ground metal layer by using an SMT process, and the other end of the first metal pillar is soldered to the fourth ground metal layer by using an SMT process.

In one embodiment, the feed network device further includes a second metal pillar, a filter circuit is further disposed on a side surface of the cover plate facing away from the feed network board, the filter circuit is isolated from the third ground metal layer, a second through hole is further disposed on the cover plate, the second metal pillar is disposed in the second through hole, and the filter circuit is electrically connected to the feed network circuit through the second metal pillar; the support column is a third metal column, a third through hole corresponding to the third metal column is further formed in the cover plate, one end of the third metal column is welded on the fourth grounding metal layer, and the other end of the third metal column penetrates through the third through hole to be connected with the third grounding metal layer in a welded mode.

In one embodiment, the supporting column comprises a main body and two plugs connected to two ends of the main body respectively; the diameter of the plug is smaller than that of the main body, and one plug is inserted into the third through hole and then is connected with the third grounding metal layer in a welding mode; and a jack matched with the other plug is arranged on the feed network board, and the other plug is inserted into the jack and is connected with the fourth grounding metal layer in a welding mode.

In one embodiment, the feed network line comprises a calibration network line and a power division network line; the calibration network circuit is located in an area formed by the boundary closing piece and the cover plate in an enclosing mode, and the power division network circuit is located outside the area formed by the boundary closing piece and the cover plate in an enclosing mode.

In one embodiment, the feed network board is an epoxy board, a PTFE board, or a hydrocarbon board.

An antenna comprises the feed network device.

In the antenna, the air between the feed network board and the cover board is used as a medium, and an air microstrip mode is adopted, so that the cost can be reduced, and meanwhile, the feed network board can be made of a board with high dielectric loss (such as a low-cost epoxy resin board), so that the cost can be further reduced; in addition, the support column can control the distance between the feed network circuit and the ground, so that the traditional feed network device can be simulated, and the good performance of the traditional feed network device is kept; in addition, compared with the traditional feed network device with a four-layer plate structure, the thickness size of the feed network device can be reduced due to the reduction of the layer number, so that the low profile is favorably realized, and a large amount of physical space size can be reduced under the condition of ensuring the qualified indexes.

Drawings

Fig. 1 is a schematic structural diagram of a feeding network device according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a feeding network apparatus according to another embodiment of the present invention;

FIG. 3 is a first exploded view of FIG. 2;

FIG. 4 is a second exploded view of FIG. 2;

fig. 5 is an exploded schematic view of a feeder network device according to another embodiment of the present invention, in which the boundary enclosure is discontinuous;

fig. 6 is a schematic structural diagram of a feeding network apparatus according to yet another embodiment of the present invention;

FIG. 7 is an exploded view of FIG. 6;

fig. 8 is a schematic structural diagram of a feeding network apparatus according to still another embodiment of the present invention;

fig. 9 is a schematic structural diagram of a support column in the feeding network device according to an embodiment of the present invention.

Reference numerals:

10. a feed network board; 11. a feed network line; 111. calibrating a network line; 112. a power division network line; 12. a fourth ground metal layer; 13. a jack; 20. a cover plate; 21. a third ground metal layer; 22. a first through hole; 30. a support pillar; 31. a main body; 32. a plug; 40. a boundary enclosure; 41. a protrusion; 42. a first metal pillar; 50. a second metal pillar; 60. and (7) soldering tin materials.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the description of the present invention, it should be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected" to another element, there are no intervening elements present.

In one embodiment, referring to fig. 1 to 4, a feeding network device includes a feeding network board 10, a cover board 20 and a supporting pillar 30. And a feed network circuit 11 is arranged on one side surface of the feed network board 10. The cover plate 20 is connected to the feed network board 10 through the support columns 30, and a first ground metal layer is disposed on a side surface of the cover plate 20 facing the feed network board 10. The feed network line 11 faces the first ground metal layer and has a gap with the first ground metal layer.

In the feed network device, the air between the feed network board 10 and the cover board 20 is used as a medium, and an air microstrip mode is adopted, so that the cost can be reduced, and meanwhile, a board with high dielectric loss (such as a low-cost epoxy resin board) can be adopted to manufacture the feed network board 10, so that the cost can be further reduced; in addition, the supporting column 30 can control the distance between the feed network circuit 11 and the ground, so that the traditional feed network device can be simulated, and the good performance of the traditional feed network device is kept; in addition, compared with the traditional feed network device with a four-layer plate structure, the thickness size of the feed network device can be reduced due to the reduction of the layer number, so that the low profile is favorably realized, and a large amount of physical space size can be reduced under the condition of ensuring the qualified indexes.

Further, referring to fig. 1 to 4, a second ground metal layer is disposed on the other side surface of the feeding network board 10. Therefore, the first grounding metal layer and the second grounding metal layer both play a role in shielding, so that interference of an external magnetic field on the feed network circuit 11 is prevented, influence of an external environment is avoided, the feed network circuit 11 is protected from being damaged by external force impact, the working is stable and reliable, consistency of electrical characteristics such as calibration signal amplitude, phase and impedance of each port is guaranteed, signal amplitude and phase calibration is achieved better, the signal calibration capability of the ports of the multi-array antenna is improved remarkably, the multi-array antenna is particularly suitable for a large-scale array antenna system of 5G communication, and the multi-array antenna is particularly suitable for a large-scale array antenna system of 5G communication.

Further, referring to fig. 2, 3, 6 to 8, a boundary sealing member 40 is disposed between the feeding network board 10 and the cover board 20. The border sealing element 40 is arranged along the circumference of the edge of the cover plate 20, and at least part of the feed network line 11 is positioned in the area enclosed by the border sealing element 40.

In one embodiment, referring to fig. 3 and 4, the boundary sealing member 40 is a metal plate or a PCB plate with a shielding function. In this manner, the boundary sealing member 40 is a continuous metal sheet sealing boundary, and plays a good role in shielding.

Further, referring to fig. 2 to 4, a third ground metal layer 21 is disposed on a side surface of the cover plate 20 facing away from the feeding network board 10. The boundary closing member 40 is provided with a plurality of protrusions 41 at intervals, the cover plate 20 is provided with a plurality of first through holes 22 corresponding to the protrusions 41 one by one, and the protrusions 41 are connected with the third grounding metal layer 21 in a welding mode after penetrating through the first through holes 22. Therefore, on one hand, the third ground metal layer 21 and the first ground metal layer are grounded together, so that a good shielding effect can be achieved; on the other hand, the third ground metal layer 21 is located on the side surface of the cover plate 20 facing away from the feeding network board 10, so as to facilitate the welding connection with the boundary closing member 40.

In addition, a fourth ground metal layer 12 is further disposed on a side surface of the feeding network board 10 facing the cover board 20. The fourth ground metal layer 12 and the feed network line 11 are located on the same side surface of the feed network board 10, and the fourth ground metal layer 12 and the feed network line 11 are isolated from each other. The boundary closure member 40 is also soldered to the fourth ground metal layer 12. In this way, since the fourth ground metal layer 12 is further provided on the side surface of the feeding network board 10 facing the cover plate 20, the boundary closing member 40 can be welded on the fourth ground metal layer 12, and the feeding network board 10, the boundary closing member 40 and the cover plate 20 can be combined together conveniently.

In one embodiment, the bump 41 is soldered on the third ground metal layer 21 by using solder 60 through an SMT process. The boundary closure member 40 is soldered to the fourth ground metal layer 12 using solder 60 by an SMT process. Therefore, the SMT process is adopted for welding operation, the assembly operation is convenient, the assembly efficiency is high, and the production cost can be reduced.

Referring to fig. 5 to 8, the boundary closing member 40 may be discontinuous, unlike the continuous closing boundary in the above-mentioned embodiment, and further, the boundary closing member 40 includes a plurality of first metal posts 42. A plurality of the first metal posts 42 are spaced along the circumference of the edge of the cap plate 20. Specifically, when the distance between adjacent first metal pillars 42 is not greater than 1/20 λ, the first metal pillars 42 have a better shielding effect, which is equivalent to that of a continuous closed boundary. Therein, it should be understood that λ is related to the operating frequency band.

Further, referring to fig. 5 to 8, a third ground metal layer 21 is disposed on a side surface of the cover plate 20 facing away from the feeding network board 10. The cover plate 20 is provided with a plurality of first through holes 22 corresponding to the first metal posts 42 one to one, and one ends of the first metal posts 42 are connected with the third ground metal layer 21 in a welding manner after penetrating through the first through holes 22.

In addition, a fourth ground metal layer 12 is further disposed on a side surface of the feeding network board 10 facing the cover board 20. The fourth ground metal layer 12 and the feed network circuit 11 are located on the same side surface of the feed network board 10, the fourth ground metal layer 12 and the feed network circuit 11 are isolated from each other, and the other end of the first metal column 42 is connected to the fourth ground metal layer 12 by welding.

In one embodiment, one end of the first metal pillar 42 is soldered to the third ground metal layer 21 by using solder 60 through an SMT process, and the other end of the first metal pillar 42 is soldered to the fourth ground metal layer 12 by using solder 60 through an SMT process. Therefore, the SMT process is adopted for welding operation, the assembly operation is convenient, the assembly efficiency is high, and the production cost can be reduced.

Further, referring to fig. 8, the feeding network device further includes a second metal pillar 50. The side surface of the cover plate 20 facing away from the feed network board 10 is also provided with a filter circuit. The filter circuit and the third ground metal layer 21 are isolated from each other. A second through hole is further formed in the cover plate 20, and the second metal column 50 is disposed in the second through hole. The filter circuit is electrically connected to the feed network line 11 through the second metal pillar 50. In this way, since the filter circuit is further disposed on the side surface of the cover plate 20 facing away from the feeding network board 10, after the filter circuit is electrically connected to the feeding network line 11, it is equivalent to integrating a filter on the feeding network device, so that the feeding network device has a filtering function. In addition, similar to the filter circuit, a circuit with other functions may be integrated on the side surface of the cover plate 20 facing away from the feeding network plate 10, and the integrated circuit is connected to the feeding network line 11, so as to enhance the function of the feeding network device, and at the same time, the device size of the feeding network device can be greatly reduced due to the reasonable use of space.

In one embodiment, referring to fig. 3 to 8, the supporting pillar 30 is a third metal pillar. And a third through hole corresponding to the third metal column is further formed in the cover plate 20. One end of the third metal column is welded on the fourth grounding metal layer 12, and the other end of the third metal column penetrates through the third through hole to be welded with the third grounding metal layer 21. Therefore, on one hand, the third metal column plays a role in supporting and isolating, and can better control the distance between the feed network board 10 and the cover board 20, and on the other hand, after the third metal column is connected with the third ground metal layer 21 and the fourth ground metal layer 12, the third ground metal layer 21 and the fourth ground metal layer 12 can be commonly arranged, and meanwhile, the supporting column 30 is convenient to install.

In one embodiment, referring to fig. 3, 4 and 9, the supporting column 30 includes a main body 31 and two plugs 32 respectively connected to two ends of the main body 31. The diameter of the plug 32 is smaller than that of the main body 31, and one of the plugs 32 is inserted into the third through hole and then is connected with the third ground metal layer 21 by welding. The feeding network board 10 is provided with a jack 13 corresponding to another plug 32, and the other plug 32 is inserted into the jack 13 and connected with the fourth ground metal layer 12 by welding. In this way, after the plug 32 of the supporting column 30 is inserted into the jack 13, the main body 31 of the supporting column 30 is abutted against the fourth grounding metal layer 12, so that the supporting column 30 and the fourth grounding metal layer 12 can be connected together conveniently. In addition, after the plug 32 of the supporting column 30 is inserted into the third through hole, the main body 31 of the supporting column 30 is abutted to the first grounding metal layer, so as to primarily determine the function of the cover plate 20, and the plug 32 of the supporting column 30 can be connected with the third grounding metal layer 21 by welding. In addition, since two ends of the main body 31 of the supporting pillar 30 respectively contact with the third grounding metal layer 21 and the first grounding metal layer, the third grounding metal layer 21 and the fourth grounding metal layer 12 can be commonly grounded.

Alternatively, the shape of the support column 30 is not limited and may be a cylindrical body, a rectangular body, or the like.

Optionally, the end surfaces of the two ends of the supporting column 30 are specifically planes, so that the supporting column 30 can be conveniently subjected to mechanical adsorption, for example, magnetic adsorption or negative pressure adsorption, and thus automatic assembly and assembly can be realized.

It is understood that the first metal post 42 and the second metal post 50 are similar to the support post 30, which facilitates the welding assembly operation and is not described in detail.

In one embodiment, referring to fig. 6 to 8, the feeding network line 11 includes a calibration network line 111 and a power dividing network line 112. The calibration network line 111 is located in the area enclosed by the border seal 40 and the cover plate 20, and the power distribution network line 112 is located outside the area enclosed by the border seal 40 and the cover plate 20. Therefore, the area formed by the enclosing of the boundary enclosing piece 40 and the cover plate 20 plays a good electromagnetic shielding role on the calibration network circuit 111, prevents the interference of an external magnetic field on the calibration network circuit 111, avoids the influence of an external environment, protects the calibration network circuit 111 from being damaged by external force impact, works stably and reliably, is beneficial to ensuring the consistency of electrical characteristics such as the amplitude, the phase and the impedance of a calibration signal of each port, better realizes the calibration of the amplitude and the phase of the signal, obviously improves the signal calibration capability of a multi-array antenna port, is particularly suitable for a large-scale array antenna system of 5G communication, and is particularly suitable for a large-scale array antenna system of 5G communication. In addition, the power distribution network circuit 112 does not need to be shielded and can be arranged outside the area formed by the enclosing of the boundary enclosing piece 40 and the cover plate 20, so that the sizes of the cover plate 20 and the boundary enclosing piece 40 are correspondingly set according to the design requirements of the product, and only the circuit on the feed network circuit 11 which needs to be shielded needs to be arranged in the area formed by the enclosing of the boundary enclosing piece 40 and the cover plate 20, so that the product design is flexible, and compared with the traditional multilayer board, the material can be greatly saved, and the cost of the feed network device is greatly reduced.

Of course, in one embodiment, referring to fig. 1 to 5, the feed network circuit 11 is located entirely within the area enclosed by the border seal 40 and the cover plate 20.

In one embodiment, the feed network board 10 is an epoxy board, a PTFE board, or a hydrocarbon board. Therefore, when the epoxy resin board is adopted, the cost of the feed network device can be greatly reduced due to the lower cost of the epoxy resin board.

In one embodiment, an antenna comprises the feeding network device according to any one of the above embodiments.

In the antenna, the air between the feed network board 10 and the cover board 20 is used as a medium, and an air microstrip mode is adopted, so that the cost can be reduced, and meanwhile, the feed network board 10 can be made of a board with high dielectric loss (such as a low-cost epoxy resin board), so that the cost can be further reduced; in addition, the supporting column 30 can control the distance between the feed network circuit 11 and the ground, so that the traditional feed network device can be simulated, and the good performance of the traditional feed network device is kept; in addition, compared with the traditional feed network device with a four-layer plate structure, the thickness size of the feed network device can be reduced due to the reduction of the layer number, so that the low profile is favorably realized, and a large amount of physical space size can be reduced under the condition of ensuring the qualified indexes.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A feed network apparatus, comprising:

the surface of one side of the feed network board is provided with a feed network circuit;

the feed network board comprises a cover plate and support columns, wherein the cover plate is connected with the feed network board through the support columns, a first grounding metal layer is arranged on the side surface of the cover plate facing the feed network board, and a gap is formed between the feed network circuit facing the first grounding metal layer and the first grounding metal layer;

a third grounding metal layer is arranged on the side surface of the cover plate back to the feed network board, a fourth grounding metal layer is also arranged on the side surface of the feed network board facing the cover plate, the fourth grounding metal layer and the feed network circuit are positioned on the same side surface of the feed network board, and the fourth grounding metal layer and the feed network circuit are isolated from each other; the support column is a third metal column, a third through hole corresponding to the third metal column is further formed in the cover plate, one end of the third metal column is welded on the fourth grounding metal layer, and the other end of the third metal column penetrates through the third through hole to be connected with the third grounding metal layer in a welded mode.

2. The feed network device of claim 1, wherein a second ground metal layer is disposed on the other side surface of the feed network board.

3. The feed network device of claim 1, wherein a boundary enclosure is disposed between the feed network board and the cover plate, the boundary enclosure is disposed along a circumference of an edge of the cover plate, and at least a portion of the feed network line is located in an area enclosed by the boundary enclosure.

4. The feed network arrangement of claim 3, wherein the boundary enclosure is a metal plate or a PCB plate with shielding function.

5. The feed network device according to claim 4, wherein the boundary enclosure is provided with a plurality of spaced protrusions, the cover plate is provided with a plurality of first through holes corresponding to the protrusions one to one, and the protrusions are connected with the third grounding metal layer in a welding mode after penetrating through the first through holes; the boundary closure member is also connected to the fourth ground metal layer by soldering.

6. The feed network device of claim 5, wherein the bump is soldered to the third ground metal layer using an SMT process; the boundary closing part is welded and arranged on the fourth grounding metal layer by adopting an SMT process.

7. The feed network device of claim 3, wherein the boundary enclosure includes a plurality of first metal posts spaced circumferentially along an edge of the cover plate.

8. The feed network device according to claim 7, wherein the cover plate is provided with a plurality of first through holes corresponding to the first metal posts one by one, and one ends of the first metal posts are connected with the third grounding metal layer in a welding manner after penetrating through the first through holes;

the fourth grounding metal layer and the feed network circuit are positioned on the same side surface of the feed network board, the fourth grounding metal layer and the feed network circuit are isolated from each other, and the other end of the first metal column is connected with the fourth grounding metal layer in a welding mode.

9. The feed network device of claim 8, wherein one end of the first metal pillar is soldered to the third ground metal layer by SMT, and the other end of the first metal pillar is soldered to the fourth ground metal layer by SMT.

10. The feeding network device according to claim 5 or 8, further comprising a second metal pillar, wherein a filter circuit is further disposed on a side surface of the cover plate facing away from the feeding network board, the filter circuit is isolated from the third ground metal layer, a second through hole is further disposed on the cover plate, the second metal pillar is disposed in the second through hole, and the filter circuit is electrically connected to the feeding network circuit through the second metal pillar.

11. The feed network device of claim 10, wherein the support column comprises a body and two plugs connected to two ends of the body respectively; the diameter of the plug is smaller than that of the main body, and one plug is inserted into the third through hole and then is connected with the third grounding metal layer in a welding mode; and a jack matched with the other plug is arranged on the feed network board, and the other plug is inserted into the jack and is connected with the fourth grounding metal layer in a welding mode.

12. The feed network device according to any one of claims 3 to 8, wherein the feed network line comprises a calibration network line and a power division network line; the calibration network circuit is located in an area formed by the boundary closing piece and the cover plate in an enclosing mode, and the power division network circuit is located outside the area formed by the boundary closing piece and the cover plate in an enclosing mode.

13. The feed network device according to any one of claims 1 to 8, wherein the feed network board is an epoxy resin board, a PTFE board or a hydrocarbon board.

14. An antenna characterized in that it comprises a feeding network arrangement according to any one of claims 1 to 13.