CN110221635A - A kind of condition test-control method and condition test-control device - Google Patents
A kind of condition test-control method and condition test-control device Download PDFInfo
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- CN110221635A CN110221635A CN201910416631.4A CN201910416631A CN110221635A CN 110221635 A CN110221635 A CN 110221635A CN 201910416631 A CN201910416631 A CN 201910416631A CN 110221635 A CN110221635 A CN 110221635A
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- humidity
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D22/00—Control of humidity
- G05D22/02—Control of humidity characterised by the use of electric means
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D27/00—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
- G05D27/02—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
Abstract
The present invention relates to a kind of condition test-control method and condition test-control devices, are related to condition test-control technical field.The technical solution mainly used are as follows: a kind of condition test-control method includes the following steps: to be measured in real time the humidity of external environment, obtains real-time humidity detected value;By comparing the real-time humidity detected value and setting humidity value, frequency control is carried out to the driving voltage of semiconductor chilling plate, the driving voltage of fan, to be adjusted in real time according to the difference of real-time humidity detected value and setting humidity value to the refrigerating capacity of the semiconductor chilling plate, the revolving speed of fan, condition test-control device is enable smoothly to change the humidity of external environment.A kind of condition test-control device adjusts the humidity of environment using above-mentioned condition test-control method.Present invention is mainly used for the refrigerating capacity of semiconductor chilling plate, the revolving speed of radiator fan can be adjusted according to the humidity of external environment, so that condition test-control device be enable smoothly to change the humidity of environment, the energy consumption and noise of condition test-control device are reduced.
Description
Technical field
The present invention relates to a kind of condition test-control technical fields, fill more particularly to a kind of condition test-control method and condition test-control
It sets.
Background technique
Condition test-control device is used primarily on electric distribution cabinet (e.g., power distribution cabinet, instrument box), guarantees electric distribution cabinet working environment
Humidity be no more than a threshold value.Specifically, condition test-control device actively will be in confined space using semiconductor refrigerating mode
Humid air sucks dehumidifying air duct by fan, liquid water is condensed into after cooling assembly, then cabinet body is discharged by aqueduct,
To realize that the temperature and humidity to confined space carries out effective management and control.
In existing condition test-control device, the work of semiconductor chilling plate, fan is directly controlled by ON/OFF;Specifically,
If ambient humidity is greater than the set value, semiconductor chilling plate and fan are opened, and the operating voltage of semiconductor chilling plate, fan is
Definite value;If closing semiconductor chilling plate and fan if ambient humidity is not more than setting value.
But above-mentioned existing condition test-control device can only start or stop the operation of semiconductor chilling plate, fan, it cannot
The refrigerating capacity of semiconductor chilling plate and the revolving speed of radiator fan are adjusted according to the variation of external environment;Not only make environment in this way
Humidity variation acutely, and the acute variation of humidity can have an impact in performance to electronic device and service life;And it also results in
The energy consumption of condition test-control device is higher, noise is also larger.
Summary of the invention
In view of this, the present invention provides a kind of condition test-control method and condition test-control device, main purpose is according to outer
The humidity of boundary's environment adjusts the refrigerating capacity of semiconductor chilling plate, the revolving speed of radiator fan, so that condition test-control device be enable to put down
Quietly change the humidity of environment.
In order to achieve the above objectives, present invention generally provides following technical solutions:
On the one hand, the embodiment of the present invention provides a kind of condition test-control method, wherein the condition test-control method includes such as
Lower step:
The humidity of external environment is measured in real time, real-time humidity detected value is obtained;
By comparing the real-time humidity detected value and setting humidity value, driving voltage, fan to semiconductor chilling plate
Driving voltage carry out frequency control, with according to real-time humidity detected value and setting humidity value difference to the semiconductor refrigerating
The refrigerating capacity of piece, the revolving speed of fan are adjusted in real time.
The object of the invention to solve the technical problems also can be used following technical measures and further realize.
Preferably, by comparison real-time humidity detected value and setting humidity value, driving voltage, wind to semiconductor chilling plate
The driving voltage of fan carries out the step of frequency control, comprising:
According to the operating voltage range of real-time humidity detected value, setting humidity value, semiconductor chilling plate, adjusting is described partly to be led
The real-time working voltage value and working frequency of body cooling piece;
According to the operating voltage range of semiconductor chilling plate, the operating voltage range of real-time working voltage value, fan, adjust
The real-time working voltage value and working frequency of the fan.
Preferably, it according to the operating voltage range of real-time humidity detected value and setting humidity value, semiconductor chilling plate, adjusts
The step of real-time working voltage value and working frequency of the semiconductor chilling plate, specifically:
If the real-time humidity detected value is not more than the setting humidity value, the real-time work for stating semiconductor chilling plate
As voltage value be zero, the working frequency of the semiconductor chilling plate is zero;
If the real-time humidity detected value is greater than the setting humidity value, it is calculated using the following equation out and described partly leads
The real-time working voltage value and working frequency of body cooling piece:
VLI=((HI-HS)/100) × (U1-U2)+U2;
RL=VLI × T:
Wherein, VLI is the real-time working voltage value of semiconductor chilling plate, and HS is setting humidity value, and HT is real-time humidity inspection
Measured value, U1 are the maximum operating voltage of semiconductor chilling plate, and U2 is the minimum operating voltage of semiconductor chilling plate, and RL is semiconductor
The working frequency of cooling piece, T are voltage to frequency convert coefficient.
Preferably, according to the operating voltage range of semiconductor chilling plate, real-time working voltage value, fan operating voltage model
The step of enclosing, adjusting the real-time working voltage value and working frequency of fan, comprising: the real-time working voltage value of fan, real-time work
The calculation method of working frequency, specifically:
VFI=(VLI-U2)/(U1-U2) × (U3-U4)+U4;
FR=VFI × T:
Wherein, VFI is the real-time working voltage of fan, and FR is the real-time working frequency of fan, and U1 is semiconductor chilling plate
Maximum operating voltage, U2 be semiconductor chilling plate minimum operating voltage, VLI be semiconductor chilling plate real-time working voltage
Value, U3 are the maximum operating voltage of fan, and U4 is the minimum operating voltage of fan, and T is voltage to frequency convert coefficient.
Preferably, the operating voltage range of the semiconductor chilling plate is DC5-12V.
Preferably, the operating voltage range of the fan is DC4-12V.
Preferably, external environment is measured in real time by humidity sensor, obtains real-time humidity detected value.
On the other hand, the embodiment of the present invention provides a kind of condition test-control device, wherein the condition test-control device uses
Condition test-control method described in any of the above embodiments adjusts the humidity of environment.
The object of the invention to solve the technical problems also can be used following technical measures and further realize.
Preferably, the condition test-control device includes:
Humidity sensor, the humidity sensor are used for the humidity of real-time monitoring external environment;
Semiconductor chilling plate;
Fan;
Control mainboard, the control mainboard are connect with the humidity sensor, semiconductor chilling plate, fan respectively;
Wherein, the control mainboard can be according to real-time humidity detected value and setting humidity value, drive to semiconductor chilling plate
The driving voltage progress frequency control of dynamic voltage, fan, so that condition test-control device can smoothly change the humidity of environment.
Preferably, the condition test-control device further includes the temperature sensor for real-time monitoring ambient temperature;Its
In, the temperature sensor is connect with the control mainboard.
By above-mentioned technical proposal, condition test-control method of the invention and condition test-control device at least have following beneficial effect
Fruit:
On the one hand, condition test-control method provided in an embodiment of the present invention passes through according to real-time humidity detected value and setting humidity
Value carries out frequency control to the driving voltage of semiconductor chilling plate, the driving voltage of fan, and then can be according to the wet of external environment
The revolving speed of the degree adjustment refrigerating capacity of semiconductor chilling plate, fan makes the refrigerating capacity of semiconductor chilling plate, the revolving speed of fan and in real time
Humidity Detection value and the difference of setting humidity value are substantially proportional, and condition test-control device is enable smoothly to change the wet of environment in this way
Degree reduces the energy consumption and noise of condition test-control device, enhances the service life and performance of electronic device.
Further, condition test-control method provided in an embodiment of the present invention, according to real-time humidity detected value and Humidity Detection
Difference, the operating voltage range of semiconductor chilling plate of value, obtain the real-time working of semiconductor chilling plate according to corresponding formula
Voltage and working frequency;Work further according to the real-time working voltage of semiconductor chilling plate, operating voltage range, fan is electric
Range is pressed, the real-time working voltage and working frequency of fan are obtained according to corresponding formula;The mode of this variable frequency adjustment voltage
It can make the refrigerating capacity of semiconductor chilling plate, the heat dissipation capacity of fan and real-time humidity detected value and set the difference of humidity value more
Match, further make humidity regulation more stable and is further reduced energy consumption.
On the other hand, the embodiment of the present invention also provides a kind of condition test-control device, wherein condition test-control device is using above-mentioned
Condition test-control method adjust the humidity of environment;Therefore, the condition test-control device of the embodiment of the present invention has any of the above-described
Beneficial effect will not repeat them here.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention and the accompanying drawings.
Detailed description of the invention
Fig. 1 is a kind of working principle diagram for condition test-control method that the embodiment of the present invention provides;
Fig. 2 is a kind of structural schematic diagram for condition test-control method that the embodiment of the present invention provides.
Specific embodiment
It is of the invention to reach the technical means and efficacy that predetermined goal of the invention is taken further to illustrate, below in conjunction with
Specific embodiment, structure, feature and its effect applied according to the present invention is described in detail such as in attached drawing and preferred embodiment
Afterwards.In the following description, what different " embodiment " or " embodiment " referred to is not necessarily the same embodiment.In addition, one or more
Special characteristic, structure or feature in a embodiment can be combined by any suitable form.
Embodiment 1
As shown in Figure 1, the present embodiment provides a kind of condition test-control methods comprising following steps:
Step 1 is measured in real time the humidity of external environment, obtains real-time humidity detected value.
Preferably, being mainly measured in real time by humidity of the humidity sensor 11 to external environment.
Step 2 passes through the comparison real-time humidity detected value and setting humidity value, to the driving electricity of semiconductor chilling plate 3
Pressure, the driving voltage progress frequency control of fan 4, with the refrigeration according to real-time humidity detected value to the semiconductor chilling plate 3
It measures, the revolving speed 3 of fan is adjusted in real time.
Condition test-control method provided in this embodiment by according to real-time humidity detected value and setting humidity value, to semiconductor
The driving voltage of cooling piece, the driving voltage of fan carry out frequency control, and then can be adjusted according to the humidity of external environment and partly be led
The revolving speed of the refrigerating capacity of body cooling piece, fan, makes the refrigerating capacity of semiconductor chilling plate, the revolving speed of fan and Humidity Detection value and sets
The difference for determining humidity value is substantially proportional, and condition test-control device is enable smoothly to change the humidity of environment in this way, reduces environment and surveys
The energy consumption and noise for controlling device, enhance the service life and performance of electronic device.
Embodiment 2
Preferably, the present embodiment provides a kind of condition test-control method, the step of referring in a upper embodiment, is " real by comparison
When Humidity Detection value and setting humidity value, frequency control is carried out to the driving voltage of the driving voltage of semiconductor chilling plate, fan
The step of ", it specifically includes:
Step 21, according to real-time humidity detected value, setting humidity value, semiconductor chilling plate operating voltage range, adjust
The real-time working voltage value and working frequency of the semiconductor chilling plate;
Step 22, according to the operating voltage range of semiconductor chilling plate, real-time working voltage value, fan operating voltage model
It encloses, adjusts the real-time working voltage value and working frequency of the fan.
Preferably, the adjusting method of step 21 is as follows: if (1) the real-time humidity detected value is not more than the setting humidity
When value, then the real-time working voltage value of semiconductor chilling plate is zero, the working frequency of semiconductor chilling plate is zero.(2) if it is described
When real-time humidity detected value is greater than the setting humidity value, then, and the real-time working voltage value and working frequency of semiconductor chilling plate
Calculation formula it is as follows:
VLI=((HI-HS)/100) × (U1-U2)+U2 formula (1);
RL=VLI × T formula (2);
Wherein, formula (1) is the calculation formula of the real-time working voltage value of semiconductor chilling plate, and formula (2) is semiconductor refrigerating
The calculation formula of the working frequency of piece;Wherein, VLI is the real-time working voltage value of semiconductor chilling plate, and HS is setting humidity value,
HI is real-time humidity detected value, and U1 is the maximum operating voltage of semiconductor chilling plate, and U2 is the minimum work of semiconductor chilling plate
Voltage, RL are the working frequency of semiconductor chilling plate, and T is voltage to frequency convert coefficient.It should be noted that due to humidity
Unit be percentage, it is therefore desirable to divided by 100.
Preferably, step 22 includes: the calculation method of the real-time working voltage value of fan, real-time working frequency, specifically:
VFI=(VLI-U2)/(U1-U2) × (U3-U4)+U4 formula (3);
FR=VFI × T formula (4);
Wherein, formula (3) is the calculation formula of the real-time working voltage value of fan, and formula (4) is the meter of the working frequency of fan
Calculate formula;Wherein, VFI is the real-time working voltage of fan, and FR is the real-time working frequency of fan, and U1 is semiconductor chilling plate
Maximum operating voltage, U2 are the minimum operating voltage of semiconductor chilling plate, and VLI is the real-time working voltage of semiconductor chilling plate
Value, U3 are the maximum operating voltage of fan, and U4 is the minimum operating voltage of fan, and T is voltage to frequency convert coefficient.
Condition test-control method provided in this embodiment according to the difference of real-time humidity detected value and Humidity Detection value, is partly led
The operating voltage range of body cooling piece obtains the real-time working voltage and work frequency of semiconductor chilling plate according to corresponding formula
Rate;Further according to the real-time working voltage of semiconductor chilling plate, operating voltage range, the operating voltage range of fan, according to
Corresponding formula obtains the real-time working voltage and working frequency of fan;The mode of this variable frequency adjustment voltage can make semiconductor system
It cold refrigerating capacity, the heat dissipation capacity of fan and real-time humidity detected value and sets the difference of humidity value and more matches, further make wet
Degree adjusts more stable and is further reduced energy consumption.
Preferably, the operating voltage range of the semiconductor chilling plate in the present embodiment be DC5-12V (here, DC refer to
It is direct current);So formula (1) specifically: VLI=((HI-HS)/100) × (12-5)+5.Further preferably, the work of fan
Making voltage range is DC4-12V;So formula (3) specifically: VFI=(VL work -5)/(12-5) × (12-4)+4.
Embodiment 3
On the other hand, the present embodiment provides a kind of condition test-control devices, and as depicted in figs. 1 and 2, condition test-control device uses
Condition test-control method described in any of the above-described embodiment adjusts the humidity of environment.
Preferably, the condition test-control device in the present embodiment includes: humidity sensor 11, semiconductor chilling plate 3, fan 4
And control mainboard 2.Wherein, humidity sensor 11 is used for the humidity of real-time monitoring external environment.Control mainboard 2 respectively with it is described wet
Sensor 11, semiconductor chilling plate 3, fan 4 is spent to connect.Wherein, the control mainboard 2 can be according to real-time humidity detected value and setting
Determine humidity value, frequency control is carried out to the driving voltage of semiconductor chilling plate, the driving voltage of fan, so that condition test-control device
The humidity of environment can smoothly be changed.Preferably, control cardboard 2 is mainly according to method as described in example 2 to semiconductor refrigerating
The driving voltage of piece, the driving voltage of fan carry out frequency control.
Preferably, condition test-control device further includes the temperature sensor 12 for real-time monitoring ambient temperature;Wherein,
Temperature sensor 12 is connect with control mainboard 2.Here, the condition test-control device of the present embodiment mainly uses 11 He of humidity sensor
The temperature and relative humidity 1 that temperature sensor 12 integrates.Preferably, the fan of above-described embodiment is radiator fan.Preferably
Ground, the condition test-control device in the present embodiment are miniature environment measure and control device.
Preferably, condition test-control device further includes display screen;Wherein, the display screen is connect with control mainboard;Wherein, exist
(that is, setting humidity value) can be set on display screen to humidity value.
The present embodiment also provides a kind of condition test-control device, wherein condition test-control device uses above-mentioned condition test-control side
Method adjusts the humidity of environment;Therefore, the condition test-control device of the present embodiment has any of the above-described beneficial effect, different herein
One repeats.
To sum up, a kind of condition test-control method provided in an embodiment of the present invention and condition test-control device pass through according to real-time humidity
Detected value and setting humidity value carry out frequency control, Jin Erneng to the driving voltage of semiconductor chilling plate, the driving voltage of fan
The revolving speed that the refrigerating capacity of semiconductor chilling plate, fan are adjusted according to the humidity of external environment, make semiconductor chilling plate refrigerating capacity,
The revolving speed of fan and the difference of Humidity Detection value and setting humidity value are substantially proportional, enable condition test-control device so smoothly
Change the humidity of environment, reduces the energy consumption and noise of condition test-control device, avoid ambient humidity acute variation to electronic device
Etc. equipment performance and the service life have an impact, to enhance the service life and performance of electronic device.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, according to
According to technical spirit any simple modification, equivalent change and modification to the above embodiments of the invention, this hair is still fallen within
In the range of bright technical solution.
Claims (10)
1. a kind of condition test-control method, which is characterized in that the condition test-control method includes the following steps:
The humidity of external environment is measured in real time, real-time humidity detected value is obtained;
Drive by comparing the real-time humidity detected value and setting humidity value, to the driving voltage, fan of semiconductor chilling plate
Dynamic voltage carries out frequency control, with according to the difference of real-time humidity detected value and setting humidity value to the semiconductor chilling plate
Refrigerating capacity, fan revolving speed adjusted in real time.
2. condition test-control method according to claim 1, which is characterized in that pass through comparison real-time humidity detected value and setting
Humidity value, the step of frequency control is carried out to the driving voltage of the driving voltage of semiconductor chilling plate, fan, comprising:
According to the operating voltage range of real-time humidity detected value, setting humidity value, semiconductor chilling plate, the semiconductor system is adjusted
Cold real-time working voltage value and working frequency;
According to the operating voltage range of semiconductor chilling plate, the operating voltage range of real-time working voltage value, fan, described in adjusting
The real-time working voltage value and working frequency of fan.
3. condition test-control method according to claim 2, which is characterized in that according to real-time humidity detected value and setting humidity
Value, the operating voltage range of semiconductor chilling plate, adjust the real-time working voltage value and working frequency of the semiconductor chilling plate
The step of, specifically:
If the real-time humidity detected value is not more than the setting humidity value, the real-time working electricity for stating semiconductor chilling plate
Pressure value is zero, the working frequency of the semiconductor chilling plate is zero;
If the real-time humidity detected value is greater than the setting humidity value, it is calculated using the following equation out the semiconductor system
Cold real-time working voltage value and working frequency:
VLI=((HI-HS)/100) × (U1-U2)+U2;
RL=VLI × T;
Wherein, VLI is the real-time working voltage value of semiconductor chilling plate, and HS is setting humidity value, and HI is real-time humidity detected value,
U1 is the maximum operating voltage of semiconductor chilling plate, and U2 is the minimum operating voltage of semiconductor chilling plate, and RL is semiconductor refrigerating
The working frequency of piece, T are voltage to frequency convert coefficient.
4. condition test-control method according to claim 3, which is characterized in that according to the operating voltage model of semiconductor chilling plate
It encloses, the operating voltage range of real-time working voltage value, fan, adjusts the real-time working voltage value of fan and the step of working frequency
Suddenly, comprising: the calculation method of the real-time working voltage value of fan, real-time working frequency, specifically:
VFI=(VLI-U2)/(U1-U2) × (U3-U4)+U4;
FR=VFI × T;
Wherein, VFI be fan real-time working voltage, FR be fan real-time working frequency, U1 be semiconductor chilling plate most
High working voltage, U2 are the minimum operating voltage of semiconductor chilling plate, and VLI is the real-time working voltage value of semiconductor chilling plate,
U3 is the maximum operating voltage of fan, and U4 is the minimum operating voltage of fan, and T is voltage to frequency convert coefficient.
5. condition test-control method according to claim 4, which is characterized in that the operating voltage model of the semiconductor chilling plate
It encloses for DC5-12V.
6. condition test-control method according to claim 4, which is characterized in that the operating voltage range of the fan is DC4-
12V。
7. condition test-control method according to claim 1-6, which is characterized in that by humidity sensor to the external world
Environment is measured in real time, and obtains real-time humidity detected value.
8. a kind of condition test-control device, which is characterized in that the condition test-control device is described in any item using claim 1-7
Condition test-control method adjusts the humidity of environment.
9. condition test-control device according to claim 8, which is characterized in that the condition test-control device includes:
Humidity sensor, the humidity sensor are used for the humidity of real-time monitoring external environment;
Semiconductor chilling plate;
Fan;
Control mainboard, the control mainboard are connect with the humidity sensor, semiconductor chilling plate, fan respectively;
Wherein, the control mainboard can be according to real-time humidity detected value and setting humidity value, to the driving electricity of semiconductor chilling plate
Pressure, the driving voltage progress frequency control of fan, so that condition test-control device can smoothly change the humidity of environment.
10. condition test-control device according to claim 9, which is characterized in that the condition test-control device further includes being used for
The temperature sensor of real-time monitoring ambient temperature;Wherein, the temperature sensor is connect with the control mainboard.
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