CN110221519A - A kind of metallic mold for nano-imprint, board and its method for stamping - Google Patents
A kind of metallic mold for nano-imprint, board and its method for stamping Download PDFInfo
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- CN110221519A CN110221519A CN201910454138.1A CN201910454138A CN110221519A CN 110221519 A CN110221519 A CN 110221519A CN 201910454138 A CN201910454138 A CN 201910454138A CN 110221519 A CN110221519 A CN 110221519A
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 68
- 238000010438 heat treatment Methods 0.000 claims abstract description 67
- 230000000994 depressogenic effect Effects 0.000 claims abstract description 50
- 238000007373 indentation Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 238000005485 electric heating Methods 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000001755 vocal effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
This application discloses a kind of metallic mold for nano-imprint, board and its method for stamping；Including mold, the mold includes protrusion area and depressed area for imprinting impression materials, the mold；Nano impression board further includes heating element；The protrusion area that the heating element only corresponds to the mold is heated.Only mold protrusion is distinguished and is heated, the impression materials of depressed section after depressed section or partial melting imprint after imprinting can be thinned as far as possible, even melt remaining depressed section completely, follow-up process can be saved to the etch period of remaining depressed section, processing time is reduced, required imprinted pattern is formed；On the other hand the adhesion strength and adhered area that can also reduce die surface Yu remaining depressed section reduce mold to the probability of entire impression materials integrity violations during demoulding.
Description
Technical field
This application involves field of display technology more particularly to a kind of metallic mold for nano-imprint, board and its method for stamping.
Background technique
Nanometer embossing is the minute manufacturing technology developed rapidly in the world in recent years, with its superelevation figure essence
Degree, the features such as technique and equipment are simple, process throughput is high are paid close attention to by academia and industry, it is considered to be next-generation low
One of most potential technology of cost, mass production of nano structures.Due to the office of nanometer embossing itself and impression materials
Sex-limited, by imprinting with after knockout course, impression materials still suffer from residual thickness, during demoulding, it is easy to broken
The integrality of bad impression materials.
How during demoulding and coining, the integrality for not destroying impression materials, which reduces follow-up process, to be become so far most
The problem of to pay close attention to.
Summary of the invention
The purpose of the application is to provide a kind of metallic mold for nano-imprint, board and its method for stamping, to reduce follow-up process.
This application discloses a kind of nano impression boards, comprising: mold, for imprinting impression materials, the mold includes
Protrude area and depressed area；Nano impression board further includes heating element；The heating element only corresponds to the protrusion area of the mold
It is heated.
Optionally, the heating element includes warm table, and the nano impression board further includes moving parts, the movement
Component is connect with the mold, and the protrusion area of the mobile mold of the moving parts is contacted with the warm table carries out hot biography
It leads, the protrusion area of the mobile mold of the moving parts corresponds to the impression materials and imprinted.
Optionally, the protrusion area of the mold has multiple, and the surface in multiple protrusion areas is in same plane, corresponding institute
The surface for stating warm table is plane.
Optionally, the heating element is arranged in the protrusion area of the mold, heats to the protrusion area.
Optionally, the outer surface in the protrusion area is arranged in the heating element, and the surface of the heating element is plane,
It is consistent with the protrusion surface in area of the mold.
Optionally, the inner surface in the protrusion area, charging heating is arranged in the heating element.
Optionally, the range of the mold protrusion sector width is 3-500mm, and the heating element width range is 1-
498mm；The thickness of the depressed section of the impression materials is less than 10mm, and heating temperature is chosen as 50~300 DEG C.
Disclosed herein as well is a kind of metallic mold for nano-imprint, including multiple protrusion areas and depressed area and heating element；It is described
Heating element is arranged in the protrusion area of the mold；The protrusion area that the heating element only corresponds to the mold is heated.
Disclosed herein as well is a kind of method for stamping, comprising the following steps:
Impression materials are set；
Only mold protrusion area is heated；
The mold is pressed into impression materials；And
Demoulding is completed, required pattern is formed.
Optionally, described the step of only heating to mold protrusion area, includes:
Open warm table, preheating；
The mold is moved on the warm table, by the outer surface in the protrusion area of the mold and the warm table table
Face contact, only to carry out conduction heating to mold protrusion area；And
The mold is moved to above the impression materials to be imprinted, indentation is prepared.
The application only distinguishes mold protrusion and heats, and depressed section or partial melting pressure after coining can be thinned as far as possible
The impression materials of depressed section after print, even melt remaining depressed section completely, can save follow-up process to remaining
The etch period of depressed section reduces processing time, forms required imprinted pattern；On the other hand it can also reduce die surface
It is complete to entire impression materials to reduce mold during demoulding with the adhesion strength and adhered area of remaining depressed section
Property destroy probability.
Detailed description of the invention
Included attached drawing is used to provide that a further understanding of the embodiments of the present application, and which constitute one of specification
Point, for illustrating presently filed embodiment, and with verbal description come together to illustrate the principle of the application.Under it should be evident that
Attached drawing in the description of face is only some embodiments of the present application, for those of ordinary skill in the art, is not paying wound
Under the premise of the property made is laborious, it is also possible to obtain other drawings based on these drawings.In the accompanying drawings:
Fig. 1 is a kind of schematic diagram of imprint mold of the embodiment of the application；
Fig. 2 is the schematic diagram of the imprint mold of the embodiment of the application；
Fig. 3 is the schematic diagram of the imprint mold of the embodiment of the application；
Fig. 4 is the schematic diagram of the imprint mold of another embodiment of the application；
Fig. 5 is the schematic diagram of the imprint mold of another embodiment of the application；
Fig. 6 is the schematic diagram of the method for stamping of another embodiment of the application；
Fig. 7 is the schematic diagram of the method for stamping of another embodiment of the application；
Fig. 8 is the schematic diagram of the method for stamping of another embodiment of the application.
Wherein, 100, mold；110, area is protruded；120, depressed area；130, heating element；131, heater strip；140, it imprints
Material；141, depressed section；142, part is protruded；150, moving parts；151, wall is erected；152, transverse arm；160, substrate；200, it receives
Rice coining board.
Specific embodiment
It is to be appreciated that term used herein above, disclosed specific structure and function details, it is only for description
Specific embodiment is representative, but the application can be implemented by many alternative forms, be not construed as only
It is limited to the embodiments set forth herein.
In the description of the present application, term " first ", " second " are used for description purposes only, and it is opposite to should not be understood as instruction
Importance, or implicitly indicate the quantity of indicated technical characteristic.As a result, unless otherwise indicated, " first ", " are defined
Two " feature can explicitly or implicitly include one or more of the features；The meaning of " plurality " is two or two
More than.Term " includes " and its any deformation, mean and non-exclusive include, it is understood that there may be or addition is one or more that other are special
Sign, integer, step, operation, unit, component and/or combination thereof.
In addition, "center", " transverse direction ", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner",
The term of the orientation or positional relationship of the instructions such as "outside" is that orientation or relative positional relationship based on the figure describe, only
Be that the application simplifies description for ease of description, rather than indicate signified device or element must have a particular orientation,
It is constructed and operated in a specific orientation, therefore should not be understood as the limitation to the application.
Furthermore unless specifically defined or limited otherwise, term " installation ", " connected ", " connection " shall be understood in a broad sense, example
Such as it may be fixed connection or may be dismantle connection, or integral connection；It can be mechanical connection, be also possible to be electrically connected
It connects；It can be directly connected, it can also indirectly connected through an intermediary or the connection inside two elements.For ability
For the those of ordinary skill in domain, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Below with reference to the accompanying drawings it elaborates with optional embodiment to the application.
As shown in Figure 1, a kind of nano impression board 200 is disclosed, to impression materials as embodiments herein
140 coinings form coining pattern, and nano impression board 200 includes mold 100 and heating element 130, and the mold 100 is for pressing
Impression materials 140 are printed, the mold 100 includes protrusion area 110 and depressed area 120；The heating element 130 only corresponds to the mould
The protrusion area 110 of tool 100 is heated.It may need that a substrate 160 is arranged in moulding process, below mold 100, to hold
Carry impression materials 140.The corresponding impression materials 140 of the mold 100 are imprinted；The corresponding mold of impression materials 140
100 protrusion areas 110 are formed as depressed section 141, and corresponding 100 depressed area 120 of mold forms protrusion part 142.
The nano impression board 200 of this programme can be used for photoetching technique, imprints impression materials 140 by mold 100 and is formed
Imprinted pattern, instead of thin film photolithography, by imprinting with after knockout course, imprinted pattern coining is formed with 141 He of depressed section
Part 142 is protruded, the depressed section 141 of impression materials 140 still suffers from residual thickness, and remaining impression materials 140 are subsequent
Processing procedure in need etching processing procedure.And since residual impression materials 140 have adhesion strength to mold 100, during demoulding, very
It is easily destroyed the integrality of impression materials 140.The application only divides the protrusion of mold 100 area 110 and heats, proposes its temperature
Height is even up to preset to be close to or higher than 140 fusing point of impression materials, and depressed section 141 or part after coining can be thinned as far as possible
The impression materials 140 for melting depressed section 141 after imprinting, even melt remaining depressed section 141, after can saving completely
Continuous processing procedure reduces processing time, forms required imprinted pattern to the etch period of remaining depressed section 141；On the other hand
The adhesion strength and adhered area that 100 surface of mold and remaining depressed section 141 can also be reduced subtract during demoulding
Probability of the small mold 100 to entire 140 integrity violations of impression materials.
And if to the protrusion part 142 of impression materials 140 heat, can cause protrude part 142 impression materials 140 it is soft
Change, cause the profile ginseng Qi Buqi at 142 top of protrusion part, later period demoulding is caused to influence the whole integrality of impression materials 140,
Only the protrusion area 110 of mold 100 is heated, eliminates the recessed portion of remaining impression materials 140, reduces and part is protruded to residual
142 influence, the integrality of the impression materials profile after guaranteeing demoulding.
As shown in Fig. 2, the nano impression board 200 further includes moving parts 150, the heating element 130 includes adding
Thermal station, the moving parts 150 are connect with the mold 100, the protrusion area of the mobile mold 100 of the moving parts 150
110 contact progress heat transfer, the corresponding pressure in protrusion area 110 of the mobile mold 100 of the moving parts 150 with the warm table
Print material 140 is imprinted.Moving parts 150 move moulds 100 protrusion areas 110 contacted with warm table transmitting heat, be heated after,
Impression materials 140 are imprinted, after remaining depressed section 141 is heated, is softened or melts, make remaining depressed section
141 a part are pressed into the depressed area 120 of mold 100, form the profile in complete protrusion area 110 and 120 junction of depressed area,
The steeper this profile the better, guarantees the integrality of demoulding；Meanwhile moving parts 150 accelerates the speed of heating and coining, accelerates
The time of coining, the time of total processing procedure is more reduced, 150 emphasis of moving parts here is that can to protrude area with mold pre-
Then heating imprints back again, it further includes transverse arm 152 that moving parts 150, which not only includes perpendicular wall 151, and the vertical arm 151 connects institute
One end of cross wall 152 is stated, the other end connects the mold 100；Perpendicular wall 151 can imprint up and down, and transverse arm 152 can be with mold
It moves in parallel warm table to be preheated, the operability for imprinting board is higher.
Add specifically, indirect contact can be carried out to the protrusion area 110 of the mold 100 by the way of flat heated
Heat, the protrusion area 110 of the mold 100 have multiple, and the surfaces in multiple protrusion areas 110 are corresponding described in same plane
The surface of warm table is plane.110 flush of protrusion area of mold 100, surfaces and warm table when multiple protrusion areas 110
Plane contact, heat transfer of the protrusion area 110 of mold 100 by plane, thermally equivalent, remaining recessed portion are uniformly melted,
During demoulding, the integrality of impression materials 140 is improved.
Heating element 130 can be not only external warm table, the inside of mold 100 can also be arranged in, directly to institute
The protrusion area 110 for stating mold 100 is heated, as shown in figure 3, another embodiment as the application, discloses a kind of nanometer
Imprint mold 100, unlike a upper embodiment: the protrusion area 110 of the mold 100 is arranged in the heating element 130
On, the protrusion area 110 is heated.Heating element 130 is directly contacted with the protrusion area 110 of mold 100, heating effect
By force, melt the impression materials 140 of recess, remaining depressed section 141, quick heating, the setting of heating element 130 is in protrusion area 110
On, heating element 130 and impression materials 140 form closed space, and thermal loss is small, can almost melt completely remaining recessed
Concave portion point 141.
Specifically, the heating element 130 can be set in the outer surface in the protrusion area 110, the heating element 130
It can be electric heating wire 131, surface is a flat surface, consistent with 100 surfaces of the mold；Heating element 130 directly with
100, mold contacts, quick heating, heat is strong, protrudes area 110 to mold 100 and impression materials 140 directly conduct heat, heat
Utilization rate is high, and the plane of heating element 130 is directly contacted with the surface of the mold 100, the heat transfer in face and face, contact area
Maximization, therefore, mold 100 protrude area 110 and maximize the remnants for reducing recessed portion, reduce the subsequent manufactured time.
Certainly it is also possible that the heating element 130 can be set on the outer surface in the protrusion area 110, the protrusion
The outer surface in area 110 is equipped with cavity, and the heating element 130 is arranged in cavity, and the height of the heating element 130 is equal to institute
State the depth of cavity；Cavity in order to give 130 avoiding space of heating element, preferably make impression materials depressed section surfacing,
It is not take up the space surface in mold protrusion area 110, heat can be made to contact with impression materials with rapid aggregation heat
It is even, it avoids being softened close to the protrusion part 142 and the profile of the depressed section 141, guarantees the complete of impression materials profile
Whole property.
Specifically, the electric heating wire 131 can equidistantly be arranged in the surface that the mold 100 protrudes area 110.Heating
Silk 131 is equidistantly arranged in the surface that mold 100 protrudes area 110, while guaranteeing that heat is strong, can quickly be subtracted with uniform heat conduction
The impression materials 140 of thin depressed section 141 or until disappear, accelerate be thinned rate, accelerate demoulding process, reduce subsequent system
141 time of journey depressed section, certain heating element 130 are also possible to electrically heated rod.
Certainly, the heating element 130 also can be set in the inside in the protrusion area 110, from far from the protrusion area
110 outer surface direction is to heating.It is heated from inside.The inner surface in protrusion area 110 is arranged in heating element 130, directly
Plug-in heating, 130 heat of heating element are conducted to protrusion area 110, and depressed section 141 is heated in protrusion area 110, homogeneous heating,
The impression materials 140 of recessed portion 141 can uniformly melt, and run into the protrusion part 142 of two sides, have impression materials 140 completeer
Whole profile.
Specifically, the range that the mold 100 protrudes 110 width of area is 3-500mm；The width range of heating element 130
For 1-498mm；The overall thickness of the impression materials is 140-150nm；The thickness of the impression materials depressed section 141 is less than
10mm；Temperature is chosen as 50~300 DEG C.Such parameter area, can preferably 100 depressed area 120 of mold impression materials
The material intersection in 140 protrusion areas 110 corresponding with mold 100 has complete angle, and guarantee angle gradually becomes complete, does not influence mould
The impression materials 140 for having 100 depressed areas 120 can soften；During demoulding, if part 142 is protruded in the blocked up meeting adhesion of thickness,
Reduce mold 100 to the probability of 140 integrity violations of impression materials, can guarantee the complete of impression materials 140 within this range
Property.It can do within this range thin or melt remaining depressed section 141, the thickness of its depressed section 141 is made to be less than 10mm.
The impression materials 140 are organic material, such as polyimides；Thermal stability is good, general 140 conduct of impression materials
Etching barrier layer in display panel, this organic and macromolecule are suitable for the internal environment of display panel.
As another embodiment of the application, a kind of metallic mold for nano-imprint is disclosed, comprising:
Multiple protrusion areas 110 and depressed area 120 and heating element 130；The heating element 130 is arranged in the mold
100 protrusion area upper 110；The protrusion area 110 that the heating element 130 only corresponds to the mold 100 is heated.The application is only
The protrusion of mold 100 area 110 is divided and is heated, makes the raising of its temperature is even up to preset to be close to or higher than impression materials 140
The impression materials 140 of depressed section 141 after depressed section 141 or partial melting imprint after imprinting can be thinned, very in fusing point as far as possible
To being to melt remaining depressed section 141 completely, follow-up process can be saved to the etch period of remaining depressed section 141,
Processing time is reduced, required imprinted pattern is formed；On the other hand it can also reduce 100 surface of mold and remaining depressed section
141 adhesion strength and adhered area reduces mold 100 to entire 140 integrity violations of impression materials during demoulding
Probability.
As shown in fig. 6, another embodiment as the application, comprising the following steps:
S1: setting impression materials；
S2: only mold protrusion area is heated；
S3: the mold is pressed into impression materials；
S4: demoulding is completed, required pattern is formed.
Described the step of only mold protrusion area is heated further include:
S211: the related heating element of the mold is pressed directly into impression materials；
As shown in figure 8, if the step of only heating to mold protrusion area described in using includes:
S221: warm table, preheating are opened；
S222: the mold is moved on the warm table, and the outer surface in the protrusion area of the mold is added with described
Thermal station surface contact, only to carry out conduction heating to mold protrusion area；
S223: the mold is moved to above the impression materials to be imprinted, indentation is prepared.
It should be noted that the restriction for each step being related in this programme, in the premise for not influencing concrete scheme implementation
Under, it does not regard as being can be the step of making restriction to step sequencing, write on front what is first carried out, be also possible to
It executes, is possibly even performed simultaneously afterwards, as long as this programme can be implemented, all shall be regarded as belonging to the protection model of the application
It encloses.
The technology of the application can be widely applied to the imprint lithography processing procedure of various display panels.It is specific the above content is combining
Optional embodiment to made by the application further description, and it cannot be said that the specific implementation of the application is confined to this
A little explanations.For those of ordinary skill in the art to which this application belongs, without departing from the concept of this application, also
Several simple deduction or replace can be made, all shall be regarded as belonging to the protection scope of the application.
Claims (10)
1. a kind of nano impression board characterized by comprising
Mold, for imprinting impression materials, the mold includes protrusion area and depressed area；And
Heating element, the protrusion area that the heating element only corresponds to the mold is heated.
2. a kind of nano impression board as described in claim 1, which is characterized in that the heating element includes warm table, institute
Stating nano impression board further includes moving parts, and the moving parts is connect with the mold, described in the moving parts movement
After the protrusion area of mold contacts progress heat transfer with the warm table, the protrusion area for moving the mold again corresponds to the coining
Material is imprinted.
3. a kind of nano impression board as claimed in claim 2, which is characterized in that the protrusion area of the mold have it is multiple, it is more
In same plane, the surface of the corresponding warm table is plane on the surface in a protrusion area.
4. a kind of nano impression board as described in claim 1, which is characterized in that the heating element is arranged in the mold
Protrusion area on, the protrusion area is heated.
5. a kind of metallic mold for nano-imprint as claimed in claim 4, which is characterized in that the heating element is arranged in the protrusion
The outer surface in area, the surface of the heating element is plane, consistent with the protrusion surface in area of the mold.
6. a kind of metallic mold for nano-imprint as claimed in claim 4, which is characterized in that the heating element is arranged in the protrusion
The inside in area, from the outer surface direction far from the protrusion area to heating.
7. a kind of nano impression board as described in claim 1, which is characterized in that the range of the mold protrusion sector width is
3-500mm, the heating element width range are 1-498mm；The thickness of the depressed section of the impression materials is less than 10mm, adds
Hot temperature is chosen as 50~300 DEG C.
8. a kind of metallic mold for nano-imprint characterized by comprising
Multiple protrusion areas and depressed area；
Heating element is arranged in the protrusion area of the mold；The protrusion area that the heating element only corresponds to the mold carries out
Heating.
9. a kind of method for stamping, which comprises the following steps:
Impression materials are set；
Only mold protrusion area is heated；
The mold is pressed into impression materials；And
Demoulding is completed, required pattern is formed.
10. a kind of method for stamping as claimed in claim 9, which is characterized in that described only to protrude what area was heated to mold
Step includes:
Open warm table, preheating；
The mold is moved on the warm table, the outer surface in the protrusion area of the mold is connect with the warm table surface
Touching, only to carry out conduction heating to mold protrusion area；And
The mold is moved to above the impression materials to be imprinted, indentation is prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910454138.1A CN110221519A (en) | 2019-05-29 | 2019-05-29 | A kind of metallic mold for nano-imprint, board and its method for stamping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910454138.1A CN110221519A (en) | 2019-05-29 | 2019-05-29 | A kind of metallic mold for nano-imprint, board and its method for stamping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110221519A true CN110221519A (en) | 2019-09-10 |
Family
ID=67818543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910454138.1A Pending CN110221519A (en) | 2019-05-29 | 2019-05-29 | A kind of metallic mold for nano-imprint, board and its method for stamping |
Country Status (1)
| Country | Link |
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| CN (1) | CN110221519A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200742945A (en) * | 2006-05-15 | 2007-11-16 | Univ Nat Cheng Kung | Optical thermal nano-imprinting process |
| CN102591140A (en) * | 2011-12-30 | 2012-07-18 | 苏州锦元纳米科技有限公司 | Nano-imprinting method |
| US20140183783A1 (en) * | 2013-01-03 | 2014-07-03 | Elwha Llc | Nanoimprint lithography |
| CN103926789A (en) * | 2014-02-07 | 2014-07-16 | 南方科技大学 | Nano-imprinting template, system thereof and imprinting method |
| CN106681102A (en) * | 2016-12-13 | 2017-05-17 | 南方科技大学 | Nano-imprinting method |
-
2019
- 2019-05-29 CN CN201910454138.1A patent/CN110221519A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200742945A (en) * | 2006-05-15 | 2007-11-16 | Univ Nat Cheng Kung | Optical thermal nano-imprinting process |
| CN102591140A (en) * | 2011-12-30 | 2012-07-18 | 苏州锦元纳米科技有限公司 | Nano-imprinting method |
| US20140183783A1 (en) * | 2013-01-03 | 2014-07-03 | Elwha Llc | Nanoimprint lithography |
| CN103926789A (en) * | 2014-02-07 | 2014-07-16 | 南方科技大学 | Nano-imprinting template, system thereof and imprinting method |
| CN106681102A (en) * | 2016-12-13 | 2017-05-17 | 南方科技大学 | Nano-imprinting method |
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Application publication date: 20190910 |