CN110216801A - A kind of method for cutting silicon chips of size adjustable - Google Patents
A kind of method for cutting silicon chips of size adjustable Download PDFInfo
- Publication number
- CN110216801A CN110216801A CN201910616594.1A CN201910616594A CN110216801A CN 110216801 A CN110216801 A CN 110216801A CN 201910616594 A CN201910616594 A CN 201910616594A CN 110216801 A CN110216801 A CN 110216801A
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- Prior art keywords
- cutting
- silicon chips
- size adjustable
- angle
- bar material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Silicon Compounds (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a kind of method for cutting silicon chips of size adjustable, it is related to silicon wafer cutting technique field, specially a kind of method for cutting silicon chips of size adjustable, the monocrystalline bar material of appropriate length is chosen including user, monocrystalline bar material is fixed by the fixing tool body of angle adjustable, make that synchronous rotary can be formed between both, monocrystalline bar material is driven to carry out angular adjustment by tool assembly, to change the cross-sectional area in cutting process, the method for cutting silicon chips of size adjustable is indirectly realized.The method for cutting silicon chips of the size adjustable, the present invention is will to cut machine platform to optimize, change past silico briquette fixed form, the Cutting platform of carrying silico briquette can carry out level angle adjustment, adjust the angle is 90-30 °, by the adjustment silicon wafer of angle, in the case where width is constant, side length is continuously increased, and can cut out the silicon wafer of 157*157mm-157*314mm specification, realizes the silicon wafer of 0 cost switching cutting various specifications size.
Description
Technical field
The present invention relates to silicon wafer cutting technique field, specially a kind of method for cutting silicon chips of size adjustable.
Background technique
Content provides inexhaustible source up to 25.8% element silicon for the production of monocrystalline silicon, due to silicon in the earth's crust
Element is one of the most abundant element of reserves in the earth's crust, to solar battery in this way be destined into mass market product and
Speech, the advantage of reserves are also one of the reason of silicon becomes photovoltaic main material, and solar silicon wafers cutting field have passed through the more than ten years
Technology upgrading, the practical production cost for reducing photovoltaic cell of Buddha's warrior attendant wire cutting is upgraded to by mortar cutting, it is flat for photovoltaic
Valence online is made that due contribution.
The cutting mode of diamond wire slice special planes all at present is vertical cutting, it is desirable that square rod is necessary for section pros
The rectangular parallelepiped structure of shape is in such a way that not can control cut lengths at slice end, and all cut lengths have crystal bar ruler
Very little decision cannot meet the use demand of people very well.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of method for cutting silicon chips of size adjustable, solve above-mentioned
The cutting mode of all diamond wire slice special planes proposed in background technique is vertical cutting, it is desirable that square rod is necessary for section
The rectangular parallelepiped structure of square is in such a way that not can control cut lengths at slice end, and all cut lengths have crystalline substance
Stick size decision problem.
In order to achieve the above object, the present invention is achieved by the following technical programs: a kind of silicon wafer cutting of size adjustable
Method chooses the monocrystalline bar material of appropriate length including user, by the fixing tool body of angle adjustable to monocrystalline bar
Material is fixed, and makes that synchronous rotary can be formed between both, drives monocrystalline bar material to carry out angular adjustment by tool assembly,
To change the cross-sectional area in cutting process, the method for cutting silicon chips of size adjustable is indirectly realized.
Optionally, described step 1: take monocrystalline bar material several, monocrystal rod is cut according to the materials demand of user
Disconnected processing, and need to calculate the corresponding angular values of side length.
Optionally, described to be operated step 2: monocrystal rod is adjusted the angle according to given rotation.
Optionally, described to measure step 3: being crossed by user, both sides are adjusted from conventional vertical 90 ° when silico briquette is truncated
The whole angle to be calculated in the first step.
Optionally, described step 4: ready silico briquette is placed in the corresponding chopper and slicer being transformed, slice pedestal into
The corresponding angle adjustment of row, opens normal slice program.
Optionally, described step 5: using cutting equipment to monocrystal rod carry out MATERIAL CUTTING processing, can be obtained after the completion
The silicon wafer of dimension.
The present invention provides a kind of method for cutting silicon chips of size adjustable, have it is following the utility model has the advantages that
The present invention is will to cut machine platform to optimize, and changes past silico briquette fixed form, and the cutting for carrying silico briquette is flat
Platform can carry out level angle adjustment, and adjusting the angle is 90-30 °, through the adjustment silicon wafer of angle in the case where width is constant
Side length is continuously increased, and can cut out the silicon wafer of 157*157mm-157*314mm specification, realizes 0 cost switching cutting various specifications
The silicon wafer of size reduces processing cost, is photovoltaic cheap internet access power-assisted；Die size adjustment is real by the adjustment of cutting angle
Existing, the characteristic of casting unit is played to the full extent, avoids large area scrap build caused by upgrading because of size.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.
The present invention provides a kind of technical solution: a kind of method for cutting silicon chips of size adjustable, including user chooses properly
The monocrystalline bar material of length is fixed monocrystalline bar material by the fixing tool body of angle adjustable, makes between both
Synchronous rotary can be formed, drives monocrystalline bar material to carry out angular adjustment by tool assembly, to change the cross in cutting process
Sectional area indirectly realizes the method for cutting silicon chips of size adjustable.
Step 1: taking monocrystalline bar material several, truncation is carried out to monocrystal rod according to the materials demand of user, and
Need to calculate the corresponding angular values of side length.
Step 2: monocrystal rod is adjusted the angle operation according to given rotation.
It is measured step 3: being crossed by user, both sides are adjusted in the first step from conventional vertical 90 ° when silico briquette is truncated
The angle calculated.
Step 4: ready silico briquette is placed in the corresponding chopper and slicer being transformed, slice pedestal carries out corresponding angle
Degree adjustment, opens normal slice program.
Step 5: carrying out MATERIAL CUTTING processing to monocrystal rod using cutting equipment, dimension can be obtained after the completion
Silicon wafer.
The present invention is will to cut machine platform to optimize, and changes past silico briquette fixed form, and the cutting for carrying silico briquette is flat
Platform can carry out level angle adjustment, and adjusting the angle is 90-30 °, through the adjustment silicon wafer of angle in the case where width is constant
Side length is continuously increased, and can cut out the silicon wafer of 157*157mm-157*314mm specification, realizes 0 cost switching cutting various specifications
The silicon wafer of size reduces processing cost, is photovoltaic cheap internet access power-assisted；Die size adjustment is real by the adjustment of cutting angle
Existing, the characteristic of casting unit is played to the full extent, avoids large area scrap build caused by upgrading because of size.
In conclusion the method for cutting silicon chips of the size adjustable, cutting method when use is as follows:
Case study on implementation one
1, by taking the silicon wafer of 157*233 as an example, there is the silicon wafer demand of order 157*233, call in monocrystal rod, carry out according to demand
Truncation, calculates the corresponding angle of side length of needs, monocrystal rod is truncated according to given adjustment angle；
2, by measurement of crossing, 233mm side length needs the both sides in silico briquette truncation to be adjusted to (to count from conventional vertical 90 °
Good angle)；
3, ready silico briquette is placed in the corresponding chopper and slicer being transformed, slice pedestal carries out corresponding angle tune
It is whole, normal slice program is opened, the silicon wafer of 157*233 specification can be obtained after the completion.
Case study on implementation two
1, a collection of silico briquette is caused there are 2 corresponding surface side lengths not conform to due to processing procedure exception in evolution process flour milling process
Lattice, Opposite side survey find one side side length 157mm, and another side side length only has 153mm, and routinely this batch of silico briquette of slicing mode cannot
Slice, can only scrap processing；
2, small side's ingot that this batch has side length defect is placed in the chopper and slicer that we were transformed, pedestal angle tune will be sliced
Whole 3 °, find that side length has met 157mm specification after scribing line, silicon wafer cutting, which terminates can be obtained, after starting slice program meets often
Advise the 157*157mm specification silicon wafer of specification.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of method for cutting silicon chips of size adjustable, it is characterised in that cutting method is as follows: user chooses appropriate length
Monocrystalline bar material is fixed monocrystalline bar material by the fixing tool body of angle adjustable, and making can be with shape between both
At synchronous rotary, monocrystalline bar material is driven to carry out angular adjustment by tool assembly, thus change the cross-sectional area in cutting process,
Indirectly realize the method for cutting silicon chips of size adjustable.
2. a kind of method for cutting silicon chips of size adjustable according to claim 1, it is characterised in that: described step 1: taking
Monocrystalline bar material is several, carries out truncation to monocrystal rod according to the materials demand of user, and need to calculate side length pair
The angular values answered.
3. a kind of method for cutting silicon chips of size adjustable according to claim 1, it is characterised in that: described step 2: will
Monocrystal rod adjusts the angle operation according to given rotation.
4. a kind of method for cutting silicon chips of size adjustable according to claim 1, it is characterised in that: described step 3: logical
User's scribing line measurement is crossed, both sides are adjusted to the angle calculated in the first step from conventional vertical 90 ° when silico briquette is truncated.
5. a kind of method for cutting silicon chips of size adjustable according to claim 1, it is characterised in that: described step 4: will
Ready silico briquette is placed in the corresponding chopper and slicer being transformed, and slice pedestal carries out corresponding angle adjustment, and unlatching is normally cut
Piece program.
6. a kind of method for cutting silicon chips of size adjustable according to claim 1, it is characterised in that: described step 5: sharp
MATERIAL CUTTING processing is carried out to monocrystal rod with cutting equipment, the silicon wafer of dimension can be obtained after the completion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910616594.1A CN110216801A (en) | 2019-07-09 | 2019-07-09 | A kind of method for cutting silicon chips of size adjustable |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910616594.1A CN110216801A (en) | 2019-07-09 | 2019-07-09 | A kind of method for cutting silicon chips of size adjustable |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112497537A (en) * | 2020-10-23 | 2021-03-16 | 尚天保 | Novel single crystal square rod cutting method |
| CN112519013A (en) * | 2020-10-23 | 2021-03-19 | 尚天保 | Novel single crystal round bar cutting method |
| CN113696356A (en) * | 2020-05-09 | 2021-11-26 | 泰州隆基乐叶光伏科技有限公司 | Preparation method of monocrystalline silicon wafer, battery piece and battery assembly |
| CN114789516A (en) * | 2022-05-16 | 2022-07-26 | 北京石晶光电科技股份有限公司 | Y-cutting method and tool for crystal heat dissipation plate wafer |
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| DE69631353T2 (en) * | 1995-04-22 | 2004-12-09 | Hct Shaping Systems Sa | Method for orienting single crystals for cutting in a cutting machine and device for carrying out the method |
| CN102581970A (en) * | 2012-03-06 | 2012-07-18 | 英利能源（中国）有限公司 | Adjusting device for crystalline silicon block for solar battery component and cutting method |
| CN102825666A (en) * | 2012-08-16 | 2012-12-19 | 保定天威英利新能源有限公司 | Adhesion method for correcting size of polycrystalline silicon block |
| CN109571567A (en) * | 2018-11-12 | 2019-04-05 | 安徽徽之润食品股份有限公司 | A kind of automatic row of cutting machine |
| CN208896174U (en) * | 2018-08-06 | 2019-05-24 | 白国强 | Slicing device |
-
2019
- 2019-07-09 CN CN201910616594.1A patent/CN110216801A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69631353T2 (en) * | 1995-04-22 | 2004-12-09 | Hct Shaping Systems Sa | Method for orienting single crystals for cutting in a cutting machine and device for carrying out the method |
| CN102581970A (en) * | 2012-03-06 | 2012-07-18 | 英利能源（中国）有限公司 | Adjusting device for crystalline silicon block for solar battery component and cutting method |
| CN102825666A (en) * | 2012-08-16 | 2012-12-19 | 保定天威英利新能源有限公司 | Adhesion method for correcting size of polycrystalline silicon block |
| CN208896174U (en) * | 2018-08-06 | 2019-05-24 | 白国强 | Slicing device |
| CN109571567A (en) * | 2018-11-12 | 2019-04-05 | 安徽徽之润食品股份有限公司 | A kind of automatic row of cutting machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113696356A (en) * | 2020-05-09 | 2021-11-26 | 泰州隆基乐叶光伏科技有限公司 | Preparation method of monocrystalline silicon wafer, battery piece and battery assembly |
| CN112497537A (en) * | 2020-10-23 | 2021-03-16 | 尚天保 | Novel single crystal square rod cutting method |
| CN112519013A (en) * | 2020-10-23 | 2021-03-19 | 尚天保 | Novel single crystal round bar cutting method |
| CN114789516A (en) * | 2022-05-16 | 2022-07-26 | 北京石晶光电科技股份有限公司 | Y-cutting method and tool for crystal heat dissipation plate wafer |
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Application publication date: 20190910 |