CN110212296A - A kind of three-dimensional doublet bay applied to 5G millimeter wave - Google Patents

A kind of three-dimensional doublet bay applied to 5G millimeter wave Download PDF

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Publication number
CN110212296A
CN110212296A CN201910520134.9A CN201910520134A CN110212296A CN 110212296 A CN110212296 A CN 110212296A CN 201910520134 A CN201910520134 A CN 201910520134A CN 110212296 A CN110212296 A CN 110212296A
Authority
CN
China
Prior art keywords
feed point
medium substrate
bay
earth plate
millimeter wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910520134.9A
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Chinese (zh)
Inventor
张为
刘秀博
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Tianjin University
Original Assignee
Tianjin University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin University filed Critical Tianjin University
Priority to CN201910520134.9A priority Critical patent/CN110212296A/en
Publication of CN110212296A publication Critical patent/CN110212296A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/16Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines

Landscapes

  • Waveguide Aerials (AREA)

Abstract

The present invention relates to a kind of three-dimensional doublet bays applied to 5G millimeter wave, including medium substrate (1), the solder ball (4) below the dipole radiating element (2), the earth plate positioned at medium substrate lower surface and feed point (3), earth plate and feed point of medium substrate upper surface, the metal throuth hole (5) for connecting radiating element and feed point.There are annular air gap flutings between earth plate and feed point.

Description

A kind of three-dimensional doublet bay applied to 5G millimeter wave
Technical field
The invention patent relates to microwave and millimeter wave fields of communication technology, more particularly to a kind of small in size and high performance application In the three-dimensional doublet bay of 5G millimeter wave.
Background technique
With the rapid development of wireless communication, frequency spectrum resource is more and more in short supply, exploitation and using millimeter wave frequency spectrum resource at For the emphasis of the 5th third-generation mobile communication technology, 5G millimeter wave mobile communication has channel capacity wide, and data transmission bauds waits spies fastly Point.And critical component one of of the antenna as 5G millimeter wave mobile communication, it is desirable that its small in size and performance is high.
Compared with conventional microwave antenna, the antenna volume of millimeter wave frequency band is smaller, more with the integration degree of radio-frequency front-end It is high.Conventional patch type micro-wave antenna impedance frequency band is narrow, and volume is big, so being not suitable for the application of millimeter wave frequency band.
Summary of the invention
In order to solve the above-mentioned technical problem, the purpose of the present invention is to provide the small in size and structures of one kind to be simply applied to The three-dimensional doublet bay of 5G millimeter wave.Technical scheme is as follows:
A kind of three-dimensional doublet bay applied to 5G millimeter wave, including medium substrate 1, be located at medium substrate on table Solder below the dipole radiating element 2 in face, the earth plate positioned at medium substrate lower surface and feed point 3, earth plate and feed point Ball 4, the metal throuth hole 5 for connecting radiating element and feed point.There are annular air gap flutings between earth plate and feed point.
Preferably, radiating element is made of two centrosymmetric rectangular metals;The length of each rectangular metal is 2.3mm, width 0.5mm.Size s slot as 0.25mm in the air gap.The feed point is identical by amplitude, and 180 ° of phase phase difference Differential signal feed-in.
The present invention and the advantage of existing invention are:
1. making dipole antenna realize stereoscopic three-dimensional structure from planar structure, convenient for integrated;
2. bay is single layer structure, small in size, at low cost.
3. patch type structure makes application more convenient;
4. bay has the unit for electrical property parameters such as excellent standing wave and gain in millimeter wave frequency band.
5. bay can be used alone, it can also be combined into array format application, expandability is strong.
Detailed description of the invention
Fig. 1 is the cross-sectional view for the three-dimensional doublet bay that the present invention is applied to 5G millimeter wave;
Fig. 2 is the top view for the three-dimensional doublet bay that the present invention is applied to 5G millimeter wave;
Fig. 3 is the bottom view for the three-dimensional doublet bay that the present invention is applied to 5G millimeter wave;
Fig. 4 is the reflection coefficient of inventive antenna array element.
Fig. 5 is phi=0 ° antenna pattern of the inventive antenna array element in 28GHz.
Fig. 6 is phi=90 ° antenna pattern of the inventive antenna array element in 28GHz.
Specific embodiment
To keep the technical problem to be solved in the present invention, technical solution and advantage clearer, below in conjunction with attached drawing and tool Body embodiment is described in detail.
As shown in Figure 1-3, bay of the invention includes medium substrate 1;Dipole positioned at medium substrate upper surface Radiating element 2;Earth plate and feed point 3 positioned at medium substrate lower surface;Solder ball 4 below earth plate and feed point;Connect spoke Penetrate the metal throuth hole 5 of unit and feed point.
The medium substrate is made of square medium substrate;The radiating element is by two centrosymmetric rectangular metals It constitutes;The earth plate and feed point are made of the metal of base lower surface, and it is empty to there is annular between the earth plate and feed point Gas gap.
1 surface shape of medium substrate is square;The medium substrate 1 is cube structure, and surface shape is in Square, length l1 are 6mm, and width w1 is 6mm, and height h is 1.4mm;The baseplate material is organic material, ceramic material Material, semiconductor material and is not limited to above-mentioned material.
The three-dimensional doublet bay, it is characterised in that: the radiating element 2 is located on the medium substrate 1 Surface.
The radiating element is made of two centrosymmetric rectangular metals;Its length l2 is 2.3mm, and width w2 is 0.5mm;
The metal that the earth plate and feed point 3 are located at 1 lower surface of medium substrate is constituted.And between the earth plate and feed point There are annular air gap flutings.Size s slot as 0.25mm in the air gap.
The feed point is identical by amplitude, 180 ° of phase phase difference of differential signal feed-in.
The metal throuth hole is through medium substrate 1 and connects dipole radiating element 2 and earth plate, metal described in feed point 3. Through-hole diameter is that D1 is 0.2mm.
The solder ball 4 is located at earth plate, the lower surface of feed point 3.The solder ball material be slicker solder, copper, silver, gold and not It is limited to above-mentioned material.Solder ball diameter is 0.3mm.

Claims (4)

1. a kind of three-dimensional doublet bay applied to 5G millimeter wave, including medium substrate (1), it is located at table on medium substrate Below the dipole radiating element (2) in face, the earth plate positioned at medium substrate lower surface and feed point (3), earth plate and feed point Solder ball (4), the metal throuth hole (5) for connecting radiating element and feed point.There are annular air gaps to open between earth plate and feed point Slot.
2. bay according to claim 1, which is characterized in that radiating element is by two centrosymmetric rectangular metals It constitutes;The length of each rectangular metal is 2.3mm, width 0.5mm.
3. bay according to claim 1, which is characterized in that slot size s as 0.25mm in the air gap.
4. bay according to claim 1, which is characterized in that the feed point is identical by amplitude, and 180 ° of phase phase difference Differential signal feed-in.
CN201910520134.9A 2019-06-17 2019-06-17 A kind of three-dimensional doublet bay applied to 5G millimeter wave Pending CN110212296A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910520134.9A CN110212296A (en) 2019-06-17 2019-06-17 A kind of three-dimensional doublet bay applied to 5G millimeter wave

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910520134.9A CN110212296A (en) 2019-06-17 2019-06-17 A kind of three-dimensional doublet bay applied to 5G millimeter wave

Publications (1)

Publication Number Publication Date
CN110212296A true CN110212296A (en) 2019-09-06

Family

ID=67793029

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910520134.9A Pending CN110212296A (en) 2019-06-17 2019-06-17 A kind of three-dimensional doublet bay applied to 5G millimeter wave

Country Status (1)

Country Link
CN (1) CN110212296A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112909512A (en) * 2021-02-08 2021-06-04 上海安费诺永亿通讯电子有限公司 Ultra-wideband antenna and antenna array

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2499986Y (en) * 2001-09-27 2002-07-10 华硕电脑股份有限公司 Antinna module
US8081125B2 (en) * 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
CN106099373A (en) * 2016-07-19 2016-11-09 电子科技大学 A kind of feed structure is with the broadband dipole antenna of parallel resonance ring
CN106129612A (en) * 2016-08-10 2016-11-16 四川中测微格科技有限公司 A kind of broadband dipole antenna of feeding substrate integrated waveguide
CN108011185A (en) * 2017-11-20 2018-05-08 北京航空航天大学 A kind of low section printing sleeve dual polarized antenna for LTE communication
CN109244641A (en) * 2018-08-07 2019-01-18 清华大学 Encapsulating antenna and its manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2499986Y (en) * 2001-09-27 2002-07-10 华硕电脑股份有限公司 Antinna module
US8081125B2 (en) * 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
CN106099373A (en) * 2016-07-19 2016-11-09 电子科技大学 A kind of feed structure is with the broadband dipole antenna of parallel resonance ring
CN106129612A (en) * 2016-08-10 2016-11-16 四川中测微格科技有限公司 A kind of broadband dipole antenna of feeding substrate integrated waveguide
CN108011185A (en) * 2017-11-20 2018-05-08 北京航空航天大学 A kind of low section printing sleeve dual polarized antenna for LTE communication
CN109244641A (en) * 2018-08-07 2019-01-18 清华大学 Encapsulating antenna and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112909512A (en) * 2021-02-08 2021-06-04 上海安费诺永亿通讯电子有限公司 Ultra-wideband antenna and antenna array

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RJ01 Rejection of invention patent application after publication

Application publication date: 20190906

RJ01 Rejection of invention patent application after publication