CN110208886A - Light extraction structures manufacturing method, dot structure and display panel - Google Patents
Light extraction structures manufacturing method, dot structure and display panel Download PDFInfo
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- CN110208886A CN110208886A CN201910435782.4A CN201910435782A CN110208886A CN 110208886 A CN110208886 A CN 110208886A CN 201910435782 A CN201910435782 A CN 201910435782A CN 110208886 A CN110208886 A CN 110208886A
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- electrically
- backing plate
- light extraction
- conductive backing
- extraction structures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
Abstract
The present invention discloses a kind of light extraction structures manufacturing method, method includes the following steps: obtaining molding die, molding die has the setting of multiple intervals and opening up type chamber, and the cavity wall of various chamber is curved surface；Photic zone is formed in the plate face that bottom plate is equipped with type chamber；Photic zone is separated with molding die, photic zone after separation is as light extraction structures, light extraction structures include multiple spaced convex lenses and the interconnecting piece for connecting each convex lens, and the convex lens of light extraction structures is used to align setting one by one with the sub-pixel of dot structure.In addition, invention additionally discloses a kind of dot structure and display panels.The technical solution of the application be meant to ensure that the lens in light extraction structures can corresponding sub-pixel shape, size it is completely the same, thus guarantee using the light extraction structures display device improve light output efficiency effect, realize the promotion of display image quality.
Description
Technical field
The present invention relates to field of display technology, in particular to a kind of light extraction structures manufacturing method, dot structure and display
Panel.
Background technique
With improving the light output efficiency of display panel using various means to the high performance continuous pursuit of display device,
To improve display image quality.The mode that one of which improves light output is that light extraction is arranged in the light emitting structure of display device
Structure, light extraction structures are traditionally arranged to be lens array, and each sub-pixel corresponds in lens array in light emitting structure one is saturating
Mirror setting, improves light output efficiency by lens arrangement.
However, light extraction structures generally directly take the mode of photoetching to make above pixel layer at present, due to lens
Structure has radian, it usually needs in addition make photomask, and to make arcuate structure by lithography, to the production of photomask require compared with
Height will have a direct impact on the formed precision of light extraction structures if produced photomask quality is bad.In addition, pixel layer with
Light extraction structures are formed using different exposure masks, may cause the mistake in light extraction structures between lens and pixel layer sub-pixel
Position or shape misfit.In this way, can not only improve the light output efficiency of display device, results even in and generate distortion mixing
Color image.
Summary of the invention
The main object of the present invention is to provide a kind of light extraction structures manufacturing method, it is intended to guarantee saturating in light extraction structures
Mirror can corresponding sub-pixel shape, size it is completely the same, thus guarantee using the light extraction structures display device improve
The effect of light output efficiency realizes the promotion of display image quality.
To achieve the above object, a kind of light extraction structures manufacturing method proposed by the present invention, the light extraction structures manufacture
Method the following steps are included:
Molding die is obtained, the molding die has the setting of multiple intervals and opening up type chamber, each type chamber
Cavity wall be curved surface；
In the molding die there is the surface of the type chamber to form photic zone；
The photic zone is separated with the molding die, the photic zone after separation is mentioned as light extraction structures, the light
Taking structure includes multiple spaced convex lenses and the interconnecting piece for connecting each convex lens, the convex lens of the light extraction structures
Mirror is used to align setting one by one with the sub-pixel of dot structure.
Optionally, the acquisition molding die, the molding die have the setting of multiple intervals and opening up type chamber,
The cavity wall of each type chamber be curved surface the step of include:
The first electrically-conductive backing plate is obtained, the second electrically-conductive backing plate is obtained, there are multiple intervals to set on first electrically-conductive backing plate surface
The cavity set；
Uncured polymeric layer is laid on second electrically-conductive backing plate surface；
Have the surface of multiple spaced cavitys towards the uncured polymer first electrically-conductive backing plate
After layer, first electrically-conductive backing plate is pressed on second electrically-conductive backing plate；
Apply predeterminated voltage between first electrically-conductive backing plate and second electrically-conductive backing plate；
After the type chamber that the polymeric layer in each cavity is respectively formed that cavity wall is curved surface, solidify the polymeric layer；
First electrically-conductive backing plate and second electrically-conductive backing plate are separated, the second conductive base for having the polymeric layer is solidified
Plate is as the molding die.
Optionally, the step of the first electrically-conductive backing plate of the acquisition includes:
Initial first electrically-conductive backing plate is provided；
Patterned process is carried out to initial first electrically-conductive backing plate using molding exposure mask, makes initial first conductive base
The surface of plate forms multiple spaced cavitys, obtains first electrically-conductive backing plate.
Optionally, initial first electrically-conductive backing plate is the silicon plate of heavy doping, described to use molding exposure mask to described initial
First electrically-conductive backing plate carry out patterned process the step of include:
Photoetching treatment is carried out using surface of the molding exposure mask to the silicon plate, forms the surface of the silicon plate multiple
The cavity；Alternatively,
Initial first electrically-conductive backing plate is the glass substrate that surface is covered with conductive layer, described to use molding exposure mask to institute
Stating the step of the first electrically-conductive backing plate carries out patterned process includes:
Photoetching treatment is carried out to the conductive layer using the molding exposure mask, the surface of the conductive layer is made to form multiple institutes
State cavity.
Optionally, described to have the surface of multiple spaced cavitys not solid described in first electrically-conductive backing plate
Before the polymeric layer of change, further includes:
In first electrically-conductive backing plate there is the surface of multiple spaced cavitys to form insulating layer.
Optionally, the thickness range of the insulating layer is [0.1 μm, 15 μm]；And/or
The range of the predeterminated voltage is [0,200V].
Optionally, described before the molding die forms euphotic step with the surface of the type chamber, also wrap
It includes:
There is the surface of the type chamber to carry out release treatment the molding die.
In addition, to achieve the goals above, the application also provides a kind of dot structure, the dot structure includes:
Pixel defining layer, the pixel defining layer, which is enclosed, to be set to form multiple pixel holes；
Pixel layer, the pixel layer include multiple sub-pixels, and each sub-pixel is respectively arranged in the pixel hole；
Light extraction structures manufacture, the light extraction structures using as above described in any item light extraction structures manufacturing methods
Interconnecting piece including multiple spaced convex lenses and each convex lens of connection, the light extraction structures are set to the pixel
It defines on layer, the convex lens and the sub-pixel align setting one by one.
Optionally, the light extraction structures are [1.3,2.4] to the ranges of indices of refraction of visible light wave range.
In addition, to achieve the goals above, the application also provides a kind of display panel, the display panel includes institute as above
The dot structure stated.
Technical solution of the present invention forms molding die multiple opening up by using molding mask fabrication molding die
And cavity wall is the type chamber of curved surface；Photic zone is formed on the surface that molding die is formed with type chamber；By photic zone and molding die point
From the photic zone after separation is as light extraction structures.Photic zone can be used as in the part that the cavity wall of type chamber forms protrusion curved surface
Mirror, since the structure of molding die is fixed, using molding die production light extraction structures compared to directly being defined in pixel
The stability that light extraction structures are shaped on layer is preferable, and being formed by light-extraction layer can be in the son defined with pixel defining layer
The corresponding position of pixel forms lens, make lens in light extraction structures can corresponding sub-pixel shape, size complete one
It causes, may be implemented precisely to align between lens and sub-pixel, to guarantee to improve light using the display device of the light extraction structures
The effect of delivery efficiency realizes the promotion of display image quality.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of present invention pixel structure；
Fig. 2 is the flow example figure of one embodiment of light extraction structures manufacturing method of the present invention；
Fig. 3 is the schematic cross-sectional view that the stage is throughout managed when preparing light extraction structures using step in Fig. 2；
Fig. 4 is the flow diagram of an embodiment of the molding die that the present invention prepares light extraction structures；
Fig. 5 is the schematic cross-sectional view that the stage is managed everywhere in the molding die for preparing light extraction structures using step in Fig. 4.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 100 | Pixel defining layer | 300 | Light extraction structures |
| 110 | Protrusion | 310 | Convex lens |
| 120 | Pixel hole | 320 | Interconnecting piece |
| 200 | Pixel layer | 400 | Light transmission laminating layer |
| 210 | Sub-pixel | 01 | Molding die |
| 1 | First electrically-conductive backing plate | 2a | Second electrically-conductive backing plate |
| 11 | Cavity | 4 | Photic zone |
| 3 | Polymeric layer | 32 | Groove |
| 31 | Type chamber | 2 | Substrate |
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being related to " first ", " second " etc. in the present invention is used for description purposes only, and should not be understood as referring to
Show or imply its relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " are defined as a result,
Two " feature can explicitly or implicitly include at least one of the features.In addition, the technical solution between each embodiment can
It to be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when the combination of technical solution occurs
Conflicting or cannot achieve when, will be understood that the combination of this technical solution is not present, also not the present invention claims protection model
Within enclosing.
The present invention proposes a kind of dot structure, can be applied particularly in the display panels such as liquid crystal, OLED, quantum dot.
In embodiments of the present invention, referring to Fig.1, which includes pixel defining layer 100, pixel layer 200, light extraction
Structure 300 and light transmission laminating layer 400.
Wherein, the pixel defining layer 100, which is enclosed, sets to form multiple pixel holes 120, and two pixel of arbitrary neighborhood hole, 120 interval is set
It sets and is formed with protrusion 110.Pixel layer 200 includes multiple sub-pixels 210, and each sub-pixel 210 is respectively arranged on the pixel
In hole 120.100 protrusions 110 of pixel defining layer are isolated by adjacent sub-pixel 210, the phase for avoiding adjacent subpixels 210 luminous
It mutually influences, the display quality of picture can be improved.
Light extraction structures 300 include multiple spaced convex lenses 310 and the interconnecting piece for connecting each convex lens 310
320, the interconnecting piece 320 is arranged with raised 110 contraposition, and the convex lens 310 is aligned one by one with the sub-pixel 210 and set
It sets.The light that the sub-pixel 210 that convex lens 310 can align setting to it issues carries out optically focused, and increase is mapped to aobvious from sub-pixel 210
Show the incidence angle of panel surface, on the one hand can avoid the damage that the light that sub-pixel 210 issues is totally reflected in display panel
It loses, different colours light interferes with each other in the avoidable adjacent subpixels 210 of another aspect.
Light transmission laminating layer 400 can be used between light extraction structures 300 and pixel defining layer 100 to be fixed, to avoid saturating
Dislocation between mirror and sub-pixel 210.Specifically, OCA optical cement can be used in light transmission laminating layer 400.
Further, in order to guarantee that light extraction structures 300 act on the raising of light output efficiency, light extraction structures 300 are right
The ranges of indices of refraction of visible light wave range is [1.3,2.4], if refractive index less than 1.3, may cause, there are still light to show
Reflection in panel and cause to lose, if refractive index is greater than 2.4, may cause light and excessively converge and influence to show picture
Show quality.Wherein, light extraction structures 300 are preferably [1.5,2.0] to the ranges of indices of refraction of visible light wave range, it is ensured that aobvious
Show that not will lead to light while panel has preferable display effect loses in display panel internal reflection.
Further, the present invention also proposes a kind of display panel, which may be provided with above-mentioned dot structure.Picture
The specific structure of plain structure is referring to above-described embodiment, since display panel uses whole technical sides of above-mentioned all embodiments
Case, therefore at least all beneficial effects brought by the technical solution with above-described embodiment, this is no longer going to repeat them.Its
In, light extraction structures 300 are set to display panel close to the side of user, and pixel defining layer 100 is set to display panel far from user
Side.
In addition, the present invention also proposes a kind of light extraction structures manufacturing method, for manufacturing dot structure in above-described embodiment
Light extraction structures 300.
Specifically, combining referring to Fig. 2 and Fig. 3, wherein Fig. 2 is one embodiment of light extraction structures manufacturing method of the present invention
Flow diagram, Fig. 3 are each processing stage that the preparation process of light extraction structures 300 is made using the manufacturing step of Fig. 2
Schematic cross-sectional view, the light extraction structures manufacturing method the following steps are included:
Step S10 obtains molding die 01, and the molding die 01 is made to have the setting of multiple intervals and opening up type
Chamber 31, the cavity wall of each type chamber 31 are curved surface；
Wherein, molding die 01 can be specifically using molding mask fabrication.Exposure mask is formed specially and in pixel defining layer 100
The corresponding optical mask of Position Design in pixel hole 120.The position of the obtained each type chamber 31 of molding die 01 and pixel
The position for defining the pixel hole 120 in layer 100 is corresponding.
Specifically, the cavity wall of type chamber 31 is curved surface, the opening of curved surface is the opening of type chamber 31.Molding die 01 can be specific
Including a substrate 2, multiple type chambers 31 are set to the side of substrate 2, and the middle part of curved surface is arranged close to substrate 2, and the opening of curved surface deviates from
The substrate 2 setting.Wherein, type chamber 31 can be the structure of the indent in a plate face of substrate 2；In addition, molding die 01 can also wrap
The projective structure that multiple intervals are set to a plate face of substrate 2 is included, type chamber 31 is the structure of indent on each projective structure, adjacent protrusion
There is groove 32 between structure.
Step S20 forms photic zone 4 on the surface that the molding die 01 is formed with type chamber 31；
The polymer of one layer of high grade of transparency is deposited on the surface that molding die 01 is formed with type chamber 31, and uses and is heating and curing
Or the cured mode of ultraviolet light forms photic zone 4.Specifically, the substrate 2 that photic zone 4 is formed in molding die 01 is equipped with type chamber
31 one side.
Step S30 separates the photic zone 4 with the molding die 01, and the photic zone 4 after separation is used as light extraction knot
Structure 300.
Obtained light extraction structures 300 include multiple spaced convex lenses 310 and each convex lens 310 of connection
Interconnecting piece 320, the convex lenses 310 of the light extraction structures 300 is used to align one by one with the sub-pixel 210 of dot structure and set
It sets.The curved surface transmittance section of protrusion is formed at the corresponding type chamber 31 of photic zone 4 after separation, which can be used as convex lens
310,4 respective slot 32 of photic zone after separation is formed by interconnecting piece 320 of the part as light extraction structures 300.Due to picture
The position that element defines the pixel hole 120 of layer 100 is correspondingly formed the medium-sized chamber 31 of molding die 01, therefore, in pixel defining layer 100
It is formed with pixel layer 200 in pixel hole 120, and the convex lens 310 of obtained light extraction structures 300 is in light extraction structures 300
After the contraposition connection of pixel defining layer 100, the convex lens 310 in light extraction structures 300 can be with the sub- picture in pixel defining layer 100
The contraposition setting one by one of element 210.
Technical solution of the present invention makes shaping mould by using the molding mask fabrication molding die 01 of pixel defining layer 100
Tool 01 forms the type chamber 31 that multiple opening up and cavity wall is curved surface；It is formed on the surface that molding die 01 is formed with type chamber 31
Photosphere 4；Photic zone 4 is separated with molding die 01, the photic zone 4 after separation is used as light extraction structures 300.Photic zone is in type chamber
The part that 31 cavity wall forms protrusion curved surface can be used as lens, and the structure of molding die 01 is fixed, therefore use molding die 01
It is preferable compared to the stability for shaping light extraction structures 300 directly in pixel defining layer 100 to make light extraction structures 300, and
And be formed by light-extraction layer 300 and can form lens in the corresponding position of the sub-pixel 210 that is defined with pixel defining layer 100,
Make lens in light extraction structures 300 can corresponding sub-pixel 210 shape, size it is completely the same, lens and sub-pixel 210
Between may be implemented precisely to align, thus guarantee using the light extraction structures 300 display device improve light output efficiency effect
Fruit realizes the promotion of display image quality.
Further, in conjunction with referring to Fig. 4 and Fig. 5, wherein Fig. 4 is the molding die that the present invention prepares light extraction structures 300
The flow diagram of 01 embodiment, Fig. 5 are the signal using each processing stage that molding die 01 is made the step of Fig. 4
Property cross-section diagram, in embodiments of the present invention, obtain molding die 01 the step of specifically include:
Step S11 obtains the first electrically-conductive backing plate 1, obtains the second electrically-conductive backing plate 2a, 1 surface of the first electrically-conductive backing plate tool
There are multiple spaced cavitys 11；
First electrically-conductive backing plate 1 and the second electrically-conductive backing plate 2a are specially conductive substrate, can be integrally formed for conductive material
Substrate, can also be substrate that conductive material and insulating materials are compounded to form.
Wherein, the step of obtaining the first electrically-conductive backing plate 1 specifically includes: providing initial first electrically-conductive backing plate；It is covered using molding
Film carries out patterned process to initial first electrically-conductive backing plate, and the surface of initial first electrically-conductive backing plate is made to form multiple
Every the cavity 11 of setting, first electrically-conductive backing plate 1 is obtained.
Specifically, the silicon plate of heavy doping can be used in initial first electrically-conductive backing plate and/or the second electrically-conductive backing plate 2a, such as can lead to
Overweight dopant (such as phosphorus, arsenic, antimony, boron) is doped silicon plate.In addition, initial first electrically-conductive backing plate and/or second leading
The glass substrate that surface is deposited with conductive layer can also be used in electric substrate 2a.Conductive layer can specifically use conductive metal (as silver, aluminium,
Copper etc.) or the materials such as metal oxide (such as ITO) formed.
When initial first electrically-conductive backing plate is the silicon plate of heavy doping, using the molding exposure mask to the surface of the silicon plate into
Row photoetching treatment makes the surface of the silicon plate form concaveconvex structure corresponding with the pixel defining layer 100.Alternatively, initial
When first electrically-conductive backing plate is that surface is covered with the glass substrate of conductive layer, light is carried out to the conductive layer using the molding exposure mask
Quarter processing makes the surface of the conductive layer form concaveconvex structure corresponding with the pixel defining layer 100.Specifically, forming
Exposure mask is used to form the position of the protrusion 110 of pixel defining layer 100, is similarly formed protrusion on the surface of conductive layer or silicon plate,
Molding exposure mask is used to form the position in the pixel hole 120 of pixel defining layer 100, forms cavity on the surface of conductive layer or silicon plate
11, therefore multiple spaced cavitys 11 are formed on the surface of initial first electrically-conductive backing plate.
Step S12 is laid with uncured polymeric layer 3 on the surface the second electrically-conductive backing plate 2a；
When the second electrically-conductive backing plate 2a is the silicon plate of heavy doping, one layer of uncured polymeric material is coated on the surface of silicon plate
Material forms polymeric layer 3, when the second electrically-conductive backing plate 2a is that surface is covered with the glass substrate of conductive layer, applies in conductive layer surface
One layer of cloth uncured polymer material forms polymeric layer 3.Wherein, the thickness of polymeric layer 3 should be according to the thickness of object lens
Degree is selected, specifically, the thickness of polymeric layer 3 should be less than the height between the lens curved surface highest point being pre-designed and edge
It is poor to spend.
First electrically-conductive backing plate 1 is had the surface of multiple spaced cavitys 11 not solid described in by step S13
After the polymeric layer 3 of change, first electrically-conductive backing plate 1 is pressed on the second electrically-conductive backing plate 2a；
One that first electrically-conductive backing plate 1 is had multiple spaced cavitys 11 presses facing towards uncured polymeric layer 3
Together in the second electrically-conductive backing plate 2a.Protrusion and the since polymeric layer 3 is uncured, during pressing, in the first electrically-conductive backing plate 1
The surface of two electrically-conductive backing plate 2a contacts, and uncured polymer material is squeezed effect and is filled in the recessed of the first electrically-conductive backing plate 1
In chamber 11.
Step S14 applies predeterminated voltage between first electrically-conductive backing plate 1 and the second electrically-conductive backing plate 2a；
The range of predeterminated voltage is adjustable in 0 to 200V, can be according to convex lens 310 in required light extraction structures 300
Thickness is selected, and the thickness of convex lens 310 can be determined according to targeted refractive index needed for the lens.Specifically, the
One electrically-conductive backing plate 1 is as anode, and the second electrically-conductive backing plate 2a is as cathode.First electrically-conductive backing plate 1 and the second electrically-conductive backing plate 2a due to
Voltage exists and forms electric field, and electric field action flows uncured polymer layer flow direction the second electrically-conductive backing plate 2a, and not solid
The polymeric layer 3 of change is obstructed effect by cavity wall close to the fluid of cavity wall in the cavity 11 of the first electrically-conductive backing plate 1, makes cavity
The polymer at 11 middle parts is greater than deformation width of the polymer of close cavity wall by electric field action by the amplitude of deformation of electric field action
Degree, to make the type chamber 31 of the formation curved surface of polymeric layer 3 in each cavity 11 of the first electrically-conductive backing plate 1.
Wherein, in order to avoid the voltage breakdown polymeric layer 3 of application, before step S13, further includes: described first
There is electrically-conductive backing plate 1 surface of multiple spaced cavitys 11 to form insulating layer, specifically, can have in the first electrically-conductive backing plate 1
There is the surface of multiple spaced cavitys 11 to be coated with one layer of insulating materials, the setting of insulating layer does not influence the first electrically-conductive backing plate 1
Surface texture after patterning.If thickness of insulating layer is excessive, electric field can be weakened to the shaping efficiency of polymer, insulating layer thickness
It spends small, then possibly can not effectively avoid voltage breakdown polymeric layer 3, therefore the thickness range of the insulating layer can be chosen for
[0.1 μm, 15 μm].Wherein, in order to which polymeric layer 3 will not be punctured while making polymer quick shape forming cavity 31, insulating layer
Thickness range is preferably [1 μm, 2 μm].
Step S15, after the type chamber 31 that the polymeric layer 3 in each cavity 11 is respectively formed that cavity wall is curved surface, solidification
The polymeric layer 3；
It is separated between type chamber 31 by the protrusion of the first electrically-conductive backing plate 1, UV light is used to polymeric layer 3 after molding
Change.
Step S16, separates first electrically-conductive backing plate 1 and the second electrically-conductive backing plate 2a, and solidification has the polymeric layer 3
The second electrically-conductive backing plate 2a as the molding die 01.
Cured polymeric layer 3 separates preceding first electrically-conductive backing plate 1 in the first electrically-conductive backing plate 1 and the second electrically-conductive backing plate 2a and is equipped with
Protrusion position, the first electrically-conductive backing plate 1 and the second electrically-conductive backing plate 2a separation after formed groove 32, in the first electrically-conductive backing plate 1
Anteposition is separated with the second electrically-conductive backing plate 2a in the polymeric layer 3 in the cavity 11 of the first electrically-conductive backing plate 1, forms multiple interval settings
Type chamber 31, and the cavity wall of type chamber 31 is the opening upwards of curved surface and curved surface.
Solidify the molding die for thering is the second electrically-conductive backing plate 2a of polymeric layer 3 after molding to can be used as light extraction structures 300
01.Wherein, the second electrically-conductive backing plate 2a can be used as the substrate 2 in molding die 01.
Molding die 01 is prepared using step S11 to step S16, method is simple and the shape of the medium-sized chamber 31 of molding die 01
It is controllable with position and stablize, it is ensured that medium-sized 31 position of chamber of molding die 01 fix and accurately, to guarantee obtained light
Extracting structure 300 can be completely the same with shape, the size of 100 sub-pixel 210 of pixel defining layer, lens 310 and sub-pixel 210
Between may be implemented precisely to align, mentioned to be further ensured that using the display device light output efficiency of the light extraction structures 300
High effect realizes the promotion of display image quality.
In addition, molding die 01 can be gold other than preparing molding die 01 in the way of step S11 to step S16
Belong to material or cured high molecular material etc. and is integrally formed material.For example, aligning out type using molding exposure mask on sheet metal
The region at the place of chamber 31 carries out the operation such as punch forming to sheet metal after contraposition, and the sheet metal of shape forming cavity 31 can also
As molding die 01.
Further, for the ease of the demoulding of light extraction structures 300, before step S20, further includes: to the molding die
01 surface with the type chamber 31 carries out release treatment.Specifically, C4F8 can be used to the 3 carry out table of polymeric layer after solidification
Surface treatment makes to be rapidly separated between the polymeric layer 3 after solidifying and the photic zone 4 of forming.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical areas in scope of patent protection of the invention.
Claims (10)
1. a kind of light extraction structures manufacturing method, which is characterized in that the light extraction structures manufacturing method the following steps are included:
Molding die is obtained, the molding die has the setting of multiple intervals and opening up type chamber, the chamber of each type chamber
Wall is curved surface；
In the molding die there is the surface of the type chamber to form photic zone；
The photic zone is separated with the molding die, the photic zone after separation is as light extraction structures, the light extraction knot
Structure includes multiple spaced convex lenses and the interconnecting piece for connecting each convex lens, and the convex lens of the light extraction structures is used
In aligning setting one by one with the sub-pixel of dot structure.
2. light extraction structures manufacturing method as described in claim 1, which is characterized in that the acquisition molding die, it is described at
Pattern tool has the setting of multiple intervals and opening up type chamber, and the cavity wall of each type chamber includes: for the step of curved surface
The first electrically-conductive backing plate is obtained, the second electrically-conductive backing plate is obtained, first electrically-conductive backing plate surface has multiple spaced
Cavity；
Uncured polymeric layer is laid on second electrically-conductive backing plate surface；
First electrically-conductive backing plate is had into the surface of multiple spaced cavitys towards after the uncured polymeric layer,
First electrically-conductive backing plate is pressed on second electrically-conductive backing plate；
Apply predeterminated voltage between first electrically-conductive backing plate and second electrically-conductive backing plate；
After the type chamber that the polymeric layer in each cavity is respectively formed that cavity wall is curved surface, solidify the polymeric layer；
First electrically-conductive backing plate and second electrically-conductive backing plate are separated, solidifying has the second electrically-conductive backing plate of the polymeric layer to make
For the molding die.
3. light extraction structures manufacturing method as claimed in claim 2, which is characterized in that the step for obtaining the first electrically-conductive backing plate
Suddenly include:
Initial first electrically-conductive backing plate is provided；
Patterned process is carried out to initial first electrically-conductive backing plate using molding exposure mask, makes initial first electrically-conductive backing plate
Surface forms multiple spaced cavitys, obtains first electrically-conductive backing plate.
4. light extraction structures manufacturing method as claimed in claim 3, which is characterized in that initial first electrically-conductive backing plate is attached most importance to
The silicon plate of doping, it is described to include: to the step of initial first electrically-conductive backing plate progress patterned process using molding exposure mask
Photoetching treatment is carried out using surface of the molding exposure mask to the silicon plate, forms the surface of the silicon plate multiple described recessed
Chamber；Alternatively,
Initial first electrically-conductive backing plate is the glass substrate that surface is covered with conductive layer, described to use molding exposure mask to described first
Begin the first electrically-conductive backing plate carry out patterned process the step of include:
Photoetching treatment is carried out to the conductive layer using molding exposure mask, the surface of the conductive layer is made to form multiple cavitys.
5. the light extraction structures manufacturing method as described in any one of claim 2 to 4, which is characterized in that described by described
One electrically-conductive backing plate has the surface of multiple spaced cavitys towards before the uncured polymeric layer, further includes:
In first electrically-conductive backing plate there is the surface of multiple spaced cavitys to form insulating layer.
6. light extraction structures manufacturing method as claimed in claim 5, which is characterized in that the thickness range of the insulating layer is
[0.1 μm, 15 μm]；And/or
The range of the predeterminated voltage is [0,200V].
7. light extraction structures manufacturing method according to any one of claims 1 to 4, which is characterized in that it is described it is described at
There is pattern tool the surface of the type chamber to be formed before euphotic step, further includes:
There is the surface of the type chamber to carry out release treatment the molding die.
8. a kind of dot structure, which is characterized in that the dot structure includes:
Pixel defining layer, the pixel defining layer, which is enclosed, to be set to form multiple pixel holes；
Pixel layer, the pixel layer include multiple sub-pixels, and each sub-pixel is respectively arranged in the pixel hole；
Light extraction structures manufacture, the light using the light extraction structures manufacturing method as described in any one of claims 1 to 7
Extracting structure includes multiple spaced convex lenses and the interconnecting piece for connecting each convex lens, and the light extraction structures are set to
In the pixel defining layer, the convex lens and the sub-pixel align setting one by one.
9. dot structure as claimed in claim 8, which is characterized in that refractive index of the light extraction structures to visible light wave range
Range is [1.3,2.4].
10. a kind of display panel, which is characterized in that the display panel includes dot structure as claimed in claim 8 or 9.
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