CN110198596B - Connecting circuit board and display device - Google Patents

Connecting circuit board and display device Download PDF

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Publication number
CN110198596B
CN110198596B CN201910447478.1A CN201910447478A CN110198596B CN 110198596 B CN110198596 B CN 110198596B CN 201910447478 A CN201910447478 A CN 201910447478A CN 110198596 B CN110198596 B CN 110198596B
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circuit board
area
blocking
region
layer
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CN110198596A (en
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李哲
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Shanghai Tianma Microelectronics Co Ltd
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Shanghai Tianma Microelectronics Co Ltd
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention discloses a connecting circuit board and a display device, wherein the connecting circuit board comprises a connecting area and a blocking area; the connecting area is provided with at least one golden finger, and the golden finger is used for electrically connecting a first bonding pad of a binding area on the part to be connected; the blocking area is used for covering at least one second bonding pad of the non-binding area on the part to be connected, and the second bonding pad is electrically insulated from the blocking area. The blocking area is used for covering the second bonding pad of the non-binding area on the part to be connected, and the blocking area is electrically insulated from the second bonding pad, so that moisture is effectively prevented from entering the part to be connected from the second bonding pad on the part to be connected and further causing corrosion of a circuit in the part to be connected, and the effect of prolonging the service life of the part to be connected is achieved.

Description

Connecting circuit board and display device
Technical Field
The embodiment of the invention relates to a display technology, in particular to a connecting circuit board and a display device.
Background
The display panel is widely applied to electronic products such as mobile phones, tablets and computers, and the service life of the display panel also influences the service life of the electronic products.
Before the display panel leaves a factory, a series of tests such as visual inspection (VT inspection) are performed, and pads for inspection such as VT inspection pads (VT pad) are exposed in the air, so that moisture in the air easily permeates into the display panel through the VT pad, and the service life of the display panel is affected.
Disclosure of Invention
The invention provides a connecting circuit board and a display device, which are used for effectively preventing moisture from permeating into a display panel and prolonging the service life of the display device.
In a first aspect, an embodiment of the present invention provides a connection circuit board, where the connection circuit board includes a connection area and a blocking area; the connecting area is provided with at least one golden finger, and the golden finger is used for electrically connecting a first bonding pad of a binding area on the part to be connected; the blocking area is used for covering at least one second bonding pad of the non-binding area on the part to be connected, and the second bonding pad is electrically insulated from the blocking area.
In a second aspect, an embodiment of the present invention further provides a display device, including a connection circuit board and a display panel, where the connection circuit board includes a connection region and a blocking region; the connecting area is provided with at least one golden finger; the display panel comprises a binding area and a non-binding area, wherein the binding area is provided with at least one first bonding pad, the non-binding area is provided with at least one second bonding pad, and the second bonding pad is used for testing the display panel;
at least one first bonding pad is bound with at least one golden finger;
the barrier region covers the second pad.
According to the invention, the connecting circuit board comprising the connecting area and the blocking area is adopted, the connecting area is provided with at least one gold finger, the blocking area is used for covering the second bonding pad of the non-binding area on the part to be connected, and the blocking area is electrically insulated from the second bonding pad, so that the phenomenon that moisture enters the part to be connected from the second bonding pad on the part to be connected to further cause the corrosion of a circuit in the part to be connected is effectively avoided, and the effect of prolonging the service life of the part to be connected is achieved.
Drawings
Fig. 1 is a schematic structural diagram of a connection circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a connection circuit board and a corresponding display panel according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view taken along line A1A2 in FIG. 1;
FIG. 4 is a cross-sectional view taken along line A3A4 of FIG. 1;
FIG. 5 is a cross-sectional view taken along line A5A6 of FIG. 1;
FIG. 6 is a cross-sectional view of a connection circuit board;
FIG. 7 is a cross-sectional view of a connection circuit board;
FIG. 8 is a cross-sectional view of a connection circuit board;
fig. 9 is a schematic structural diagram of a display device according to an embodiment of the present invention;
FIG. 10 is a cross-sectional view taken along line A7A8 of FIG. 9;
fig. 11 is a cross-sectional view of a display device.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of a connection circuit board according to an embodiment of the present invention, and fig. 2 is a schematic structural diagram of a connection circuit board and a corresponding display panel according to an embodiment of the present invention, referring to fig. 1 and fig. 2, a connection circuit board 11 according to an embodiment of the present invention can be bound and connected with a component to be connected, the component to be connected may be a display panel 12, and the connection circuit board 11 and the display panel 12 shown in fig. 2 are not bound yet; the connection circuit board 11 includes a connection region 111 and an isolation region 110, the connection region 111 is provided with at least one gold finger 114, the gold finger 114 is electrically connected to a first pad 206 of a bonding region 121 on the display panel 12, the isolation region 110 is used for covering at least one second pad of a non-bonding region 120 on the display panel 12, and the second pad is electrically insulated from the isolation region 110.
Specifically, the connection circuit board 11 can electrically connect the display panel 12 and the motherboard, and one side of the connection circuit board 11, on which the gold finger 114 is disposed, is bound to the display panel, and the other side is connected to the motherboard. The connection region 111 includes at least one gold finger 114, the gold finger 114 is used for being bound with a first bonding pad 206 on the binding region 121 on the display panel 12, the first bonding pad 206 is electrically connected with a driver and/or a control signal line in the display panel 12, and after the connection circuit board 11 is bound with the display panel 12, the first bonding pad 206 is electrically connected with the gold finger 114 on the connection circuit board 11, so that the display panel 12 is electrically connected with the motherboard. The connection region 111 of the connection circuit board 11 serves to supply signals to driver and/or control signal lines provided in the display panel 12, and for example, data signals output from a main board may be transmitted to driving ICs on the display panel 12 so that the display panel 12 operates normally; the non-bonding area 120 of the display panel 12 includes at least one second pad, where the second pad is some exposed pads of the display panel 12, and the second pad is not generally used for bonding with other components, such as a driver IC or a circuit board, for example, the second pad may be a VT pad used for testing the display panel 12. The VT pad may be used for the display panel 12 to receive the test signal provided by the test apparatus before the circuit board 11 and the driver IC are not bonded, so as to implement the lighting test of the display panel. Such as VT pad, may be applied with a test signal from the test device after being connected to the test device, and the test of the display panel may be a lighting test for checking the operation of the organic light emitting diode in each sub-pixel;
after the connecting circuit board 11 is bonded to the display panel 12, the gold finger on the connecting region 111 is electrically connected to the first pad on the bonding region 121, and the blocking region 110 covers the VT pad on the non-bonding region 120 to block the VT pad from the outside (such as air, etc.), so as to prevent moisture in the air from penetrating into the display panel 12 from the VT pad to cause corrosion of the circuit in the display panel 12, thereby prolonging the service life of the display panel 12. The blocking region 110 is electrically insulated from the VT pad, for example, the water blocking performance of the pad is poor, if the VT pad is covered by the pad, if the water blocking performance of the connection circuit board 11 is poor, moisture may enter the display panel 12 through the pad covering the VT pad on the connection circuit board 11, and therefore, no pad is disposed on the blocking region 110, and a material with a strong water blocking performance, such as an inorganic material, may be disposed, so as to efficiently block moisture from entering the display panel 12, thereby preventing moisture from corroding lines in the display panel 12, and improving the service life of the display panel 12.
According to the technical scheme, the connecting circuit board comprises the connecting area and the blocking area, the connecting area is provided with the at least one golden finger, the blocking area is used for covering the second bonding pad of the non-binding area on the to-be-connected part, and the blocking area is electrically insulated from the second bonding pad, so that moisture is effectively prevented from entering the to-be-connected part from the second bonding pad on the to-be-connected part, corrosion of a circuit in the to-be-connected part is further caused, and the effect of prolonging the service life of the to-be-connected part is achieved.
Optionally, with continued reference to fig. 1 and fig. 2, there may be a plurality of gold fingers 114, and the plurality of gold fingers 114 are arranged in at least one row along the first direction Y; the blocking region 110 may include a first blocking region and a second blocking region, the first blocking region and the second blocking region are respectively disposed at two sides of the connecting region 111 along the second direction X, and the first direction Y is perpendicular to the second direction X.
For example, the blocking region 110 on the left of the connection region 111 in fig. 1 may be regarded as a first blocking region, the blocking region 110 on the right of the connection region 111 in fig. 1 may be regarded as a second blocking region, and the number of gold fingers in the connection region 111 may match the number of first pads in the bonding region 121 in the display panel 12; the positions and the number of the blocking regions 110 may also be determined according to the positions of the pads of the non-bonding regions 120 on the display panel 12, for example, the VT pads on the display panel 12 are generally disposed on two sides of the bonding region 121, and thus the blocking regions 110 on the connecting circuit board 11 are also disposed on two sides of the bonding region 111. If the display panel 12 further includes other pads exposed outside like VT pads, the connection circuit board 11 may also be provided with corresponding blocking regions 110. The to-be-connected component may also be other components than the display panel 12, and the connection circuit board 11 may be provided with the connection region 111 and the blocking region 110, which are matched with each other, on the to-be-connected component.
Optionally, fig. 3 is a cross-sectional view taken along a direction A1a2 in fig. 1; FIG. 4 is a cross-sectional view taken along line A3A4 of FIG. 1; FIG. 5 is a cross-sectional view taken along line A5A6 of FIG. 1; referring to fig. 1 to 5, the connection circuit board includes a substrate 112, a conductive layer 113 and a protection layer 115 sequentially disposed, wherein the substrate 112 may be made of PI (polyimide), the conductive layer 113 may be made of copper, and the protection layer 115 may also be made of PI. The conductive layer 113 includes a gold finger 114 and a trace connected to the gold finger 114, and the passivation layer 115 covers the trace of the conductive layer and exposes the connection region and the blocking region.
Specifically, the barrier region 110 may be provided with a barrier layer 116, the barrier layer 116 and the substrate 112 are sequentially disposed, the substrate 112 may provide support for the barrier layer 116, and the substrate 112 is shared by the barrier layer 116 and the conductive layer 113, so that no additional process is required in the manufacturing process of the circuit board 11; when the circuit board 11 is connected with the part to be connected, the barrier layer 116 covers the second pad on the part to be connected, so that moisture is prevented from entering the second pad, and further, the moisture is prevented from corroding circuits and devices in the part to be connected through the second pad; the connection region comprises a substrate 112 and gold fingers 114 which are arranged in sequence, wherein the connection region can comprise a plurality of gold fingers 114 which are used for being bound with the first bonding pads of the binding region on the part to be connected; other areas on the connection circuit board may include a substrate 112, a conductive layer 113, and a protective layer 115, which are sequentially disposed; in this embodiment, only the structure that the connecting circuit board is a single-sided board is shown, the connecting circuit board may also be a double-sided board, when the connecting circuit board is a double-sided board, at least one side of the connecting circuit board is provided with a blocking area, and the positions and the number of the blocking areas may be specifically set according to the type of the component to be connected.
For example, the connection Circuit board shown in fig. 1 may be a double-sided board, such as a double-sided FPC (Flexible Printed Circuit), and fig. 6 is a cross-sectional view of a connection Circuit board; FIG. 7 is a cross-sectional view of a connection circuit board; FIG. 8 is a cross-sectional view of a connection circuit board; for example, the connecting circuit board may be the connecting circuit board in fig. 1, and fig. 6 may be a cross-sectional view taken along a direction A1a2 in fig. 1; FIG. 7 is a cross-sectional view taken along line A3A4 in FIG. 1; FIG. 8 is a cross-sectional view taken along line A5A6 in FIG. 1; referring to fig. 6-8, the barrier region 110 may be provided with a barrier layer 116, a substrate 112 and a back barrier layer 1161, wherein the material and thickness of the back barrier layer 1161 may be the same as those of the barrier layer 116, and may be differently configured according to the parts to be connected; the connection region 110 may include a gold finger 114, a substrate 112, and a back gold finger 1141, and the back gold finger 1141 may have the same function as the gold finger 114, which is not described herein again; other areas of the pcb may include the substrate 112, the conductive layer 113, the passivation layer 115, the backside conductive layer 1131 and the backside passivation layer 1151, wherein the backside conductive layer 115 may be copper, the backside passivation layer 1151 may be PI, the backside conductive layer 1131 is disposed opposite to the conductive layer 113, and the backside passivation layer 1151 is disposed opposite to the passivation layer 115. When the connecting circuit board is a double-sided board, the connecting area and the blocking area in the two sides of the connecting circuit board can be respectively arranged according to the type of the component to be connected, and are not limited to the type illustrated in the embodiment, so as to block the phenomenon that moisture enters the component to be connected and further causes corrosion of the internal circuit thereof.
The thickness of the barrier layer 116 may be set to be between 30 nanometers and 2 micrometers. Too thick a barrier layer 116 affects the overall thickness of the circuit board to be connected to the components to be connected, and too thin a barrier layer 116 may result in poor water resistance of the barrier layer 116 and may still maintain the sameThere is a portion of moisture entering the member to be connected to corrode a wire in the member to be connected, thereby affecting the life span of the member to be connected. The material of the barrier layer 116 may be an inorganic material, such as SiNxOr Al2O3，SiNxAnd Al2O3The waterproof performance of the connecting circuit board is stronger, and the waterproof performance of the connecting circuit board after being connected with the parts to be connected can be further improved. Of course, the choice of inorganic material may also be other than SiNxAnd Al2O3Other materials with stronger water-resisting performance.
Optionally, the connection circuit board may be a TAB circuit board or an FPC circuit board, and a TAB circuit board or an FPC circuit board is used, and a driver chip of a to-be-connected component may be disposed on the connection circuit board, so as to facilitate reduction of a size of the to-be-connected circuit board, and if the to-be-connected circuit board is a display panel, the TAB circuit board or the FPC circuit board is used, and an IC of the display panel may be disposed on the connection circuit board, so as to avoid disposing the IC in a step area of the display panel, thereby achieving an effect of improving a screen ratio of the display panel, and better satisfying.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a display device according to an embodiment of the present invention, the display device includes a connection circuit board 11 and a display panel 12, wherein the connection circuit board 11 and the display panel 12 are bound, and the connection circuit board 11 includes a connection area 111 and an isolation area 110; the connection region 111 is provided with at least one gold finger; the display panel 12 comprises a binding region and a non-binding region, wherein the binding region is provided with at least one first bonding pad, the non-binding region is provided with at least one second bonding pad, and the second bonding pad is used for testing the display panel 12; the at least one first bonding pad is bound with the at least one gold finger; the blocking region 110 is used to cover the second pad.
Specifically, the connection circuit board 11 can electrically connect the display panel 12 and the motherboard, and one side of the connection circuit board 11, on which the gold finger 114 is disposed, is bound to the display panel, and the other side is connected to the motherboard. The connection region 111 includes at least one gold finger 114, the gold finger 114 is used for being bound with a first bonding pad 206 on the binding region 121 on the display panel 12, the first bonding pad 206 is electrically connected with a driver and/or a control signal line in the display panel 12, and after the connection circuit board 11 is bound with the display panel 12, the first bonding pad 206 is electrically connected with the gold finger 114 on the connection circuit board 11, so that the display panel 12 is electrically connected with the motherboard. The connection region 111 of the connection circuit board 11 serves to supply signals to driver and/or control signal lines provided in the display panel 12, and for example, data signals output from a main board may be transmitted to driving ICs on the display panel 12 so that the display panel 12 operates normally; the non-bonding area 120 of the display panel 12 includes at least one second pad, where the second pad is some exposed pads of the display panel 12, and the second pad is not generally used for bonding with other components, such as a driver IC or a circuit board, for example, the second pad may be a VT pad used for testing the display panel 12. The VT pad may be used for the display panel 12 to receive the test signal provided by the test apparatus before the circuit board 11 and the driver IC are not bonded, so as to implement the lighting test of the display panel. Such as VT pad, may be applied with a test signal from the test device after being connected to the test device, and the test of the display panel may be a lighting test for checking the operation of the organic light emitting diode in each sub-pixel;
taking the second pad as VT pad as an example, after the connection circuit board 11 is bound with the display panel 12, the gold finger on the connection region 111 is electrically connected to the first pad on the binding region, and the blocking region 110 covers the VT pad on the non-binding region to block the VT pad from the outside (such as air, etc.), so as to prevent moisture in the air from permeating into the display panel 12 from the VT pad to cause corrosion of the circuit in the display panel 12, thereby prolonging the service life of the display panel 12. The blocking region 110 is electrically insulated from the VT pad, for example, the water blocking performance of the pad is poor, if the VT pad is covered by the pad, and if the water blocking performance of the connection circuit board 11 is poor, moisture may enter the display panel 12 through the pad covering the VT pad on the connection circuit board 11, and therefore, no pad is disposed on the blocking region 110, and a material with a strong water blocking performance, such as an inorganic material, may be disposed, so as to efficiently block moisture from entering the display panel 12, and improve the service life of the display panel.
The technical scheme of this embodiment, through adopting the display device including connecting circuit board and display panel, wherein, connecting circuit board includes joining region and separation zone, the separation zone is used for covering the second pad in display panel non-binding district, thereby keep apart the second pad in non-binding district with the external world, avoid external moisture to get into display panel and corrode circuit and device in the display panel through the second pad, influence display panel's life, the problem of blocking water of second pad need not to be considered again in the display panel manufacturing process simultaneously, thereby reduce display panel's cost of manufacture.
Alternatively, fig. 10 is a cross-sectional view taken along a direction A7A8 in fig. 9, and referring to fig. 9 and 10, the connection circuit board 11 includes the substrate 112 and the gold finger 114, and the display panel 12 may include the substrate 201, the buffer layer 202, the gate insulating layer 203, and the interlayer insulating layer 204, which are sequentially stacked, and further include the first pad 206, the first pad 207, and the passivation layer 205 on the interlayer insulating layer 204; the connection region to the circuit board 11 is provided with the barrier layer 116, and the glue layer 301 is provided between the first pad 302 and the gold finger 114, and between the barrier layer 116 and the second pad 207. The specific structure of the display panel 12 is different according to the type of the display panel 12, and the present embodiment only illustrates one structure of the display panel 12, and it is understood that the display panel 12 provided in the present embodiment may be of other types.
For example, the adhesive layer 301 may include a first adhesive layer and a second adhesive layer, the first adhesive layer is disposed between the first pad 302 and the gold finger 114, and the first adhesive layer includes an anisotropic conductive adhesive layer; and a second glue layer is disposed between the barrier layer 116 and the second bonding pad 207. The anisotropic conductive adhesive layer contains conductive balls 302, and after the connecting circuit board 11 is connected with the display panel 12 through the adhesive layer 301, the golden fingers 114 in the connecting circuit board 11 are electrically connected with the first bonding pads 206 in the display panel 12 due to the action of the conductive balls 302 in the anisotropic conductive adhesive layer, so that the transmission of signals between the display panel 12 and an external device is realized; the second adhesive layer can also be an anisotropic conductive adhesive layer, if the second adhesive layer and the first adhesive layer are both anisotropic conductive adhesive layers, when the connecting circuit board 11 and the display panel 12 are fixed together by using the adhesive layer 301, the adhesive layer 301 can be manufactured at one time, that is, the adhesive layer 301 can be manufactured only by coating adhesive once, so that the manufacturing procedures are reduced, the manufacturing cost is saved, and meanwhile, the adhesive layer 301 can also enable the connection of the connecting circuit board 11 and the display panel to be firmer.
For example, fig. 11 is a cross-sectional view of a display device, which may be the display device shown in fig. 9, and fig. 11 is a cross-sectional view taken along a direction A7A8 in fig. 9, different from fig. 10, in which a gap is formed between the first adhesive layer 304 and the second adhesive layer 303 of the adhesive layer 301, and the second adhesive layer 303 covers the barrier layer 116 and covers the second pad 207; the second adhesive layer 303 may be a water-blocking adhesive layer, and the material of the water-blocking adhesive layer may be a water-absorbing polymer material, such as polyacrylate or polyacrylamide, and a small amount of other auxiliary water-absorbing materials (such as inorganic silicon nitride, silicon oxide or zinc oxide) may also be added. Through setting up the glue film that blocks water to cover second pad 207, but moisture is separated to barrier layer 116, permeates to second pad 207 department through display device's front, and the glue that blocks water has the ability that blocks water, also can strengthen the effect that blocks water, and the glue film that blocks water still can prevent that moisture from permeating to second pad 207 department from display device's side moreover, also sets up the glue film that blocks water and can further improve display device's the performance that blocks water, improves display device's life.
Optionally, the connection circuit board 12 includes a substrate, a conductive layer, and a protective layer sequentially disposed; the conductive layer comprises a golden finger and a routing wire electrically connected with the golden finger; the protective layer covers the traces and exposes the connection region and the blocking region.
Alternatively, the material of the barrier layer may be an inorganic material, such as SiNxOr Al2O3And the thickness of the barrier layer 116 may be set to be between 30 nanometers and 2 micrometers. The thickness of the barrier layer 116 is too thick, which affects the overall thickness of the circuit board after being connected to the component to be connected, and if the thickness of the barrier layer 116 is too thin, the water-blocking performance of the barrier layer 116 is weak, and a part of water can still enter the display panel 12, thereby corroding the traces in the display panel 12. And inorganic materials, e.g. SiNxOr Al2O3The waterproof performance of the connection circuit board 11 is stronger, and the waterproof performance after the connection circuit board is connected with the display panel 12 can be further improved. Of course, the choice of inorganic material is also possibleMay be SiN removingxAnd Al2O3Other materials with stronger water-resisting performance.
Optionally, the number of the golden fingers is multiple, and the plurality of golden fingers are arranged in at least one row along the first direction Y; the blocking region 110 includes a first blocking region and a second blocking region, the first blocking region and the second blocking region are respectively disposed at two sides of the connection region 111 along the second direction X, and the first direction Y is perpendicular to the second direction X;
the unbound region of the display panel 12 includes a first unbound region and a second unbound region;
the area of the first blocking area is larger than that of the first unbound area, and the area of the second blocking area is larger than that of the second unbound area.
Specifically, the area of the first blocking region is larger than the area of the first non-binding region, which can be understood as that the area of the blocking layer 116 in the first blocking region is larger than the area of the second pad 207 on the first non-binding region in the display panel 12, for example, the area of the blocking layer 116 is larger than the area of the second pad 207 by 10%, so as to ensure that the blocking layer 116 can completely cover the second pad 207, and can block moisture from permeating to the second pad 207 and further permeating into the display device, thereby improving the service life of the display device.
Alternatively, the connection circuit board 12 is a TAB (Tape Automated Bonding) circuit board or an FPC circuit board.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (15)

1. A connection circuit board is characterized by comprising a connection area and a blocking area; the connecting area is provided with at least one golden finger, and the golden finger is used for electrically connecting a first bonding pad of a binding area on the part to be connected; the blocking area is used for completely covering at least one second bonding pad of the non-binding area on the part to be connected so as to prevent moisture from entering the part to be connected from the second bonding pad, and the second bonding pad is electrically insulated from the blocking area;
the number of the golden fingers is multiple, and the plurality of the golden fingers are arranged in at least one row along a first direction; the blocking area comprises a first blocking area and a second blocking area, the first blocking area and the second blocking area are respectively arranged on two sides of the connecting area along the second direction, and the first direction is perpendicular to the second direction.
2. The connection circuit board according to claim 1, wherein the connection circuit board comprises a substrate, a conductive layer and a protective layer which are sequentially disposed; the conductive layer comprises the golden finger and a routing wire electrically connected with the golden finger; the protective layer covers the wires and exposes the connecting area and the blocking area.
3. The connection circuit board according to claim 1 or 2, wherein the blocking region is provided with a blocking layer.
4. The connection circuit board according to claim 3, wherein the material of the barrier layer is an inorganic material.
5. The connection circuit board of claim 4, wherein the material of the barrier layer is SiNxOr Al2O3。
6. The connection circuit board of claim 5, wherein the barrier layer has a thickness of 30 nanometers to 2 micrometers.
7. The connection circuit board according to claim 1, wherein the connection circuit board is a TAB circuit board or an FPC circuit board.
8. A display device is characterized by comprising a connecting circuit board and a display panel, wherein the connecting circuit board comprises a connecting area and a blocking area; the connecting area is provided with at least one golden finger; the display panel comprises a binding area and a non-binding area, wherein the binding area is provided with at least one first bonding pad, the non-binding area is provided with at least one second bonding pad, and the second bonding pad is used for testing the display panel;
at least one first bonding pad is bound with at least one golden finger;
the barrier area completely covers the second bonding pad to prevent moisture from entering the part to be connected from the second bonding pad;
the number of the golden fingers is multiple, and the plurality of the golden fingers are arranged in at least one row along a first direction; the blocking areas comprise a first blocking area and a second blocking area, the first blocking area and the second blocking area are respectively arranged on two sides of the connecting area along a second direction, and the first direction is perpendicular to the second direction;
the non-binding region of the display panel comprises a first non-binding region and a second non-binding region;
the first barrier region covers the first unbound region and the second barrier region covers the second unbound region;
the area of the first barrier region is larger than that of the first unbound region, and the area of the second barrier region is larger than that of the second unbound region.
9. The display device according to claim 8, wherein the barrier region of the connection circuit board is provided with a barrier layer;
the first pad with between the golden finger, and the barrier layer with set up the glue film between the second pad.
10. The display device according to claim 9, wherein the adhesive layer comprises a first adhesive layer and a second adhesive layer; the first adhesive layer is arranged between the first bonding pad and the golden finger and comprises an anisotropic conductive adhesive layer;
the second glue layer is arranged between the blocking layer and the second bonding pad.
11. A display device as claimed in claim 10, wherein the second glue layer is a water-blocking glue layer.
12. The display device according to claim 11, wherein the material of the water-blocking glue layer comprises a water-absorbent polymer material.
13. The display device according to claim 9, wherein the connection circuit board includes a substrate, a conductive layer, and a protective layer which are provided in this order; the conductive layer comprises the golden finger and a routing wire electrically connected with the golden finger; the protective layer covers the wires and exposes the connecting area and the blocking area.
14. The display device according to claim 9, wherein a material of the barrier layer is an inorganic material.
15. The display device according to any one of claims 8 to 14, wherein the connection circuit board is a TAB circuit board or an FPC circuit board.
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