CN110191579A - Circuit board assemblies and electronic equipment - Google Patents
Circuit board assemblies and electronic equipment Download PDFInfo
- Publication number
- CN110191579A CN110191579A CN201910502905.1A CN201910502905A CN110191579A CN 110191579 A CN110191579 A CN 110191579A CN 201910502905 A CN201910502905 A CN 201910502905A CN 110191579 A CN110191579 A CN 110191579A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- connecting plate
- board assemblies
- assemblies
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
Abstract
The application provides a kind of circuit board assemblies and electronic equipment.Circuit board assemblies include first circuit board, connecting plate, second circuit board.First circuit board, connecting plate and second circuit board are cascading, and connecting plate electrical connection first circuit board and second circuit board.Connecting plate includes the reinforcement part for connecting ontology and being arranged on connection ontology, and reinforcement part is used to enhance the intensity of connecting plate.Since reinforcement part improves the intensity of connecting plate, so that the intensity for improving the circuit board assemblies that connecting plate connection first circuit board and second circuit board are formed avoids circuit board assemblies and is easy to loosen and lead to not normal use so that circuit board assemblies are stronger.Electronic equipment includes center and circuit board assemblies, and center is used to support circuit board assemblies.Due to improving the intensity of circuit board assemblies, circuit board assemblies are stronger, so that the electronic device steady operation on circuit board assemblies, and then improve the stability of electronic equipment operation.
Description
Technical field
This application involves electronic technology field more particularly to a kind of circuit board assemblies and electronic equipment.
Background technique
Printed circuit board is electronic component important in electronic equipment, it is the support of electronic component in electronic equipment
Body and the carrier of electronic component electrical connection.As electronic equipment tends to precise treatment, however unstable printed circuit board
The working condition of electronic component on meeting direct interference to printed circuit board, to make entire electronic equipment that can not stablize fortune
Make.It would therefore be highly desirable to improve printed circuit board.
Summary of the invention
The application provides a kind of circuit board assemblies and electronic equipment, improves the intensity of the circuit board assemblies, and described
Circuit board assemblies are stronger, avoid the circuit board assemblies and are easy to loosen and lead to not normal use.
The circuit board assemblies include first circuit board, connecting plate, second circuit board.The first circuit board, the company
Fishplate bar and the second circuit board are cascading, and the connecting plate is electrically connected the first circuit board and second electricity
Road plate.The connecting plate includes the reinforcement part for connecting ontology and being arranged on the connection ontology, and the reinforcement part is for increasing
The intensity of the strong connecting plate.Since the reinforcement part improves the intensity of connecting plate, to improve the connecting plate connection
The intensity for the circuit board assemblies that the first circuit board and second circuit board are formed, so that the circuit board assemblies are more firm
Gu and avoiding the circuit board assemblies and being easy to loosen and lead to not normal use.Due to the first circuit board, the connection
Plate and the second circuit board are cascading, and reduce the electronic device being arranged on the first circuit board and setting exists
The interference of electromagnetic wave signal between electronic device on the second circuit board.Due to connecting plate electrical connection first electricity
Road plate and the second circuit board so that between on first circuit board and second circuit board can mutual transmission telecommunications number, be convenient for
Electricity is transmitted between the electronic device being arranged on the first circuit board and the electronic device being arranged on the second circuit board
Signal.
The application also provides a kind of electronic equipment, and the electronic equipment includes center and the circuit board assemblies, it is described in
Frame is used to support the circuit board assemblies.Due to improving the intensity of the circuit board assemblies, the circuit board assemblies are more firm
Gu so that the electronic device steady operation on the circuit board assemblies, and then improving the stability of the electronic equipment operation.
Detailed description of the invention
Fig. 1 is the schematic perspective view for the circuit board assemblies that the application first embodiment provides.
Fig. 2 is the schematic view of the front view for the circuit board assemblies that the application first embodiment provides.
Fig. 3 is the configuration schematic diagram for the circuit board assemblies that the application first embodiment provides.
Fig. 4 is the schematic perspective view for the circuit board assemblies that the application second embodiment provides.
Fig. 5 is the configuration schematic diagram for the circuit board assemblies that the application second embodiment provides.
Fig. 6 is the schematic perspective view of the connecting plate in the circuit board assemblies that the application second embodiment provides.
Fig. 7 is the schematic perspective view for the circuit board assemblies that the application third embodiment provides.
Fig. 8 is the configuration schematic diagram for the circuit board assemblies that the application third embodiment provides.
Fig. 9 is the schematic perspective view of the connecting plate in the circuit board assemblies that the application third embodiment provides.
Figure 10 is the schematic perspective view for the circuit board assemblies that the 4th embodiment of the application provides.
Figure 11 is the schematic perspective view of the connecting plate in the circuit board assemblies that the 4th embodiment of the application provides.
Figure 12 is the schematic perspective view for the circuit board assemblies that the 5th embodiment of the application provides.
Figure 13 is the configuration schematic diagram for the circuit board assemblies that the 5th embodiment of the application provides.
Figure 14 is the schematic perspective view of the connecting plate in the circuit board assemblies that the 5th embodiment of the application provides.
Figure 15 is the schematic perspective view for the circuit board assemblies that the application sixth embodiment provides.
Figure 16 is the configuration schematic diagram for the circuit board assemblies that the application sixth embodiment provides.
Figure 17 is the schematic perspective view of the connecting plate in the circuit board assemblies that the application sixth embodiment provides.
Enlarged structure schematic diagram of Figure 18 Figure 15 along the broken section of I-I line.
Figure 19 is the schematic perspective view for the circuit board assemblies that the 7th embodiment of the application provides.
Figure 20 is enlarged structure schematic diagram of the Figure 19 along the broken section of II-II line.
Figure 21 is the schematic perspective view for the circuit board assemblies that the 8th embodiment of the application provides.
Figure 22 is enlarged structure schematic diagram of the Figure 21 along the broken section of III-III line.
Figure 23 is the schematic perspective view for the circuit board assemblies that the 9th embodiment of the application provides.
Figure 24 is the configuration schematic diagram for the circuit board assemblies that the 9th embodiment of the application provides.
Figure 25 is the schematic perspective view for the circuit board assemblies that the tenth embodiment of the application provides.
Figure 26 is the configuration schematic diagram for the circuit board assemblies that the tenth embodiment of the application provides.
Figure 27 is the enlarged structure schematic diagram in Figure 26 at IV.
Figure 28 is the schematic perspective view for the circuit board assemblies that the 11st embodiment of the application provides.
Figure 29 is enlarged structure schematic diagram of the Figure 28 along the part section of V-V line.
Figure 30 is the schematic perspective view of electronic equipment provided by the present application.
Figure 31 is the configuration schematic diagram of electronic equipment provided by the present application.
Specific embodiment
Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is retouched
It states, it is clear that described embodiment is only a part of embodiment of the application, rather than whole embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall in the protection scope of this application.
Also referring to Fig. 1 to Fig. 3, Fig. 1 is the stereochemical structure for the circuit board assemblies that the application first embodiment provides
Schematic diagram；Fig. 2 is the schematic view of the front view for the circuit board assemblies that the application first embodiment provides；Fig. 3 is the application the
The configuration schematic diagram for the circuit board assemblies that one embodiment provides.In the present embodiment, the circuit board assemblies 10 wrap
Include first circuit board 11, connecting plate 12, second circuit board 13.The first circuit board 11, the connecting plate 12 and described second
Circuit board 13 is cascading, and the connecting plate 12 is electrically connected the first circuit board 11 and the second circuit board 13.
The connecting plate 12 includes the reinforcement part 122 for connecting ontology 121 and being arranged on the connection ontology 121, the reinforcement part
122 for enhancing the intensity of the connecting plate 12.
The connecting plate 12 includes connection ontology 121 and reinforcement part 122, and the setting of reinforcement part 122 is in the connection sheet
On body 121；Since the reinforcement part 122 plays a supporting role to the connection ontology 121, to improve the connection ontology
121 intensity improves the intensity of the connecting plate 12.The first circuit board 11, connecting plate 12 and second circuit board 13 according to
It is secondary to be stacked, and the connecting plate 12 is electrically connected the first circuit board 11 and the second circuit board 13；Due to the benefit
Strong portion 122 improves the intensity of connecting plate 12, so that improving the connecting plate 12 connects the first circuit board 11 and second
The intensity for the circuit board assemblies 10 that circuit board 13 is formed avoids described so that the circuit board assemblies 10 are stronger
Circuit board assemblies 10 are easy to loosen and lead to not normal use.Further, due to the first circuit board 11, the connection
Plate 12 and the second circuit board 13 are cascading, reduce the electronic device that is arranged on the first circuit board 11 with
The interference of electromagnetic wave signal between electronic device on the second circuit board 13 is set.Since the connecting plate 12 is electrically connected
The first circuit board 11 and the second circuit board 13, so that can be mutual between on first circuit board 11 and second circuit board 13
Phase transmission telecommunications number convenient for the electronic device being arranged on the first circuit board 11 and is arranged on the second circuit board 13
Electronic device between transmission telecommunications number.It should be understood that the circuit board assemblies 10 are for carrying multiple electronic devices.It is described
Multiple electronic devices are separately positioned on the first circuit board 11 and the second circuit board 13, wherein the multiple electronics
Device, which is separately positioned in the first circuit board 11, can carry one surface of electronic device or can carry electronic device
Two opposite surfaces, the multiple electronic device, which can also be separately positioned in the second circuit board 13, can carry electronics
One surface of device or two opposite surfaces that electronic device can be carried.Wherein, it is arranged in the first circuit board 11
On electronic device between the transmission of electric signal is carried out by route in the first circuit board 11.It is arranged in second circuit board
The transmission of electric signal is carried out between electronic device on 13 by the route on the second circuit board 13.It is arranged described first
By the connecting plate 12 between electronic device on circuit board 11 and the electronic device being arranged on the second circuit board 13
Carry out the transmission of electric signal.In the present embodiment, electronic device is arranged in the first circuit board 11 and second circuit board 13
On, in another embodiment, electronic device is arranged in the first circuit board 11, second circuit board 13 and the connecting plate
On 12, to improve the area that the circuit board assemblies 10 install electronic device, improves the circuit board assemblies 10 and accommodate
The quantity of electronic component.
Specifically, the circuit board assemblies 10 can be but be not limited in electronic equipment for carrying electronic device, and
Make the component that electrical connection is realized between the electronic device.The electronic equipment can be mobile phone, tablet computer, notebook electricity
Brain, Ultra-Mobile PC (Ultra-mobilie Personal Computer, UMPC), net book, individual digital help
Manage the electronic product with circuit board assemblies 10 such as (Personal Digital Assistant, PDA).The first circuit board
11 can be but be not limited to printed circuit board (printed circuit board, PCB), ceramic circuit board, ultrathin circuit board
Deng wiring board.The second circuit board 13 can be but be not limited to printed circuit board, ceramic circuit board, ultrathin circuit board etc.
Wiring board.The material of the connecting plate 12 one of can be but be not limited to aluminium alloy, stainless steel, titanium alloy or more
Kind；What the connecting plate 12 can be but be not limited to printed circuit board, ceramic circuit board, ultrathin circuit board etc. can be realized electricity
The wiring board that signal is transmitted and can be played a supporting role.The connecting plate 12 is by being arranged on the connecting plate 12 interconnecting piece
124 connect with the first circuit board 11, the second circuit board 13.The interconnecting piece 124 is by the first circuit board 11, institute
It states connecting plate 12 and the second circuit board 13 is fixed together, and be electrically connected the first circuit board 11, the connecting plate 12
And the second circuit board 13, so that the connecting plate 12 is electrically connected the first circuit board 11 and the second circuit board
13.Wherein, the interconnecting piece 124 can be but be not limited to the component that pad, copper post etc. have conduction electric signal effect.
It is referring to Figure 4 together the stereochemical structure for the circuit board assemblies that the application second embodiment provides to Fig. 6, Fig. 4
Schematic diagram；Fig. 5 is the configuration schematic diagram for the circuit board assemblies that the application second embodiment provides；Fig. 6 is the application the
The schematic perspective view for the connecting plate in circuit board assemblies that two embodiments provide.The circuit board group that present embodiment provides
Part 10 and the circuit board assemblies 10 that the application first embodiment provides are essentially identical, the difference is that, in present embodiment
In, the connection ontology 121 includes multiple successively end to end connection branches 1211, and the connection branch 1211, which encloses, to be set as leading to
Hole 1212, the reinforcement part 122 connect two different connection branches 1211.Since the reinforcement part 122 connects different two
A connection branch 1211 plays a supporting role to the connection branch 1211, strengthens the intensity of the connection branch 1211, from
And the intensity of the connection ontology 121 is improved, improve the intensity of the connecting plate 12.The first circuit board 11 and packet
The connecting plate 12 and the second circuit board 13 for including the connection ontology 121 and the reinforcement part 122 are cascading, by
The intensity of connecting plate 12 is improved in the reinforcement part 122, so that improving the connecting plate 12 connects the first circuit board
11 and the intensity of the circuit board assemblies 10 that is formed of second circuit board 13 kept away so that the circuit board assemblies 10 are stronger
Exempt from the circuit board assemblies 10 to be easy to loosen and lead to not normal use.Further, due to the connection ontology 121
Multiple connection branches 1211 surround through-hole 1212, reduce the weight of the connection ontology 121, have saved the connection originally
The material of body 121.
Referring to fig. 4 to fig. 6, the through-hole 1212 includes first through hole 1212a and the second through-hole 1212b.At this
In embodiment, the connection ontology 121 includes that successively end to end first connection branch 1211a, second connect branch
1211b, the third connection of connection branch 1211c and the 4th branch 1211d.First connection the branch 1211a, the part third
Connection branch 1211c, part the 4th connection branch 1211d and the reinforcement part 122 surround the first through hole 1212a；
The second connection branch 1211b, the part third connection branch 1211c, part the 4th connection branch 1211d and institute
It states reinforcement part 122 and surrounds the second through-hole 1212b.The reinforcement part 122 connects branch 1211c and described the to the third
Four connection branch 1211d play a supporting role, and improve the third connection branch 1211c and the 4th connection branch
The intensity of 1211d improves the intensity of the connecting plate 12 to improve the intensity of the connection ontology 121.It is understood that
Ground, the shape that the multiple successively end to end connection branch 1211 is formed are not limited to shown in Fig. 5, the connection branch
1211 quantity and it is the multiple successively it is end to end connection branch 1211 formed shape can according to actual needs and
Design.
It is referring to Figure 7 together the stereochemical structure for the circuit board assemblies that the application third embodiment provides to Fig. 9, Fig. 7
Schematic diagram；Fig. 8 is the configuration schematic diagram for the circuit board assemblies that the application third embodiment provides；Fig. 9 is the application the
The schematic perspective view for the connecting plate in circuit board assemblies that three embodiments provide.Circuit board assemblies in present embodiment
10 can also be in conjunction with any one in the circuit board assemblies 10 that previously described first embodiment to second embodiment provides
A embodiment, in the present embodiment, the reinforcement part 122 include described in first end 1221, second end 1222 and connection
The middle part 1223 of first end 1221 and second end 1222, the first end 1221 and the second end 1222 are separately connected described
Branch 1211 is connected, the size of the reinforcement part 122 is gradually increased from the middle part 1223 to the first end 1221, and institute
The size for stating reinforcement part 122 is gradually increased from the middle part 1223 to the second end 1222.
Since the reinforcement part 122 plays a supporting role to the connection ontology 121, to improve the connection ontology
121 intensity improves the intensity of the connecting plate 12.Due to the reinforcement part 122 size from the middle part 1223 to
The first end 1221 gradually increases, and further improves supporting role of the reinforcement part 122 to the connection ontology 121,
To improve the intensity of the connection ontology 121, the intensity of the connecting plate 12 is improved；Accordingly, due to the reinforcement
The size in portion 122 is gradually increased from the middle part 1223 to the second end 1222, further improves the reinforcement part 122
Supporting role to the connection ontology 121 improves the connecting plate to improve the intensity of the connection ontology 121
12 intensity.Since the reinforcement part 122 improves the intensity of connecting plate 12, thus improve the connecting plate 12 connect it is described
The intensity for the circuit board assemblies 10 that first circuit board 11 and second circuit board 13 are formed, so that the circuit board assemblies 10 are more
Add securely, avoids the circuit board assemblies 10 and be easy to loosen and lead to not normal use.It is to be appreciated that the first end
1221 refer to the end face intersected in the reinforcement part 122 with ontology connection ontology 121；The second end 1222 refers to described
Opposite another end face intersected with the connection ontology 121 in reinforcement part 122.
Also referring to Figure 10 to Figure 11, Figure 10 is the three-dimensional knot for the circuit board assemblies that the 4th embodiment of the application provides
Structure schematic diagram；Figure 11 is the schematic perspective view of the connecting plate in the circuit board assemblies that the 4th embodiment of the application provides.
The circuit board assemblies 10 that present embodiment provides and the circuit board assemblies 10 that third embodiment provides are essentially identical, difference
Be, in the present embodiment, the reinforcement part 122 from the middle part 1223 to 1221 rounding off of first end, and
The reinforcement part 122 is from the middle part 1223 to the part of 1221 rounding off of first end along perpendicular to the first end
Projection on 1221 directions is not overlapped.The reinforcement part 122 from the middle part 1223 to 1222 rounding off of second end,
And the reinforcement part 122 from the middle part 1223 to the part of 1222 rounding off of second end along perpendicular to described second
The projection on 1222 directions is held not to be overlapped.Since the reinforcement part 122 is round from the middle part 1223 to the first end 1221
It slips over and crosses, avoid the reinforcement part 122 and generate stress from the middle part 1223 to the part of 1221 transition of first end
It concentrates；Accordingly, due to the reinforcement part 122 from the middle part 1223 to 1222 rounding off of second end, avoid
The reinforcement part 122 generates stress concentration from the middle part 1223 to the part of 1222 transition of second end.
Also referring to Figure 12 to Figure 14, Figure 12 is the three-dimensional knot for the circuit board assemblies that the 5th embodiment of the application provides
Structure schematic diagram；Figure 13 is the configuration schematic diagram for the circuit board assemblies that the 5th embodiment of the application provides；Figure 14 is this Shen
Please the 5th embodiment provide circuit board assemblies in connecting plate schematic perspective view.Circuit board in present embodiment
Component 10 can also be in conjunction with appointing in the circuit board assemblies 10 that previously described first embodiment is provided to the 4th embodiment
It anticipates an embodiment, in the present embodiment, the reinforcement part 122 includes the sub- reinforcement part 1224 of multiple intersections, and described
The round and smooth connection in intersection of multiple sub- reinforcement parts 1224.Support is played to the connection ontology 121 due to the reinforcement part 122 to make
With, thus improve it is described connection ontology 121 intensity, improve the intensity of the connecting plate 12；The reinforcement part 122 includes
The sub- reinforcement part 1224 of multiple intersections, every sub- reinforcement part 1224 plays a supporting role to the connection ontology 121, into one
Step improves the intensity of the connection ontology 121, the intensity of the connecting plate 12 is improved, so that the circuit board assemblies 10 are more
Add securely, avoids the circuit board assemblies 10 and be easy to loosen and lead to not normal use.Further, the multiple sub- benefit
The round and smooth connection in intersection in strong portion 1224, the stress for avoiding the intersection of every sub- reinforcement part 1224 is concentrated, and is increased
The size of the multiple 1224 intersection of sub- reinforcement part further increases to increase the supporting role of the reinforcement part 122
The intensity of the connecting plate 12 avoids the circuit board assemblies 10 and is easy so that the circuit board assemblies 10 are stronger
It loosens and leads to not normal use.
Also referring to Figure 15 to Figure 18, Figure 15 is the three-dimensional knot for the circuit board assemblies that the application sixth embodiment provides
Structure schematic diagram；Figure 16 is the configuration schematic diagram for the circuit board assemblies that the application sixth embodiment provides；Figure 17 is this Shen
Please sixth embodiment provide circuit board assemblies in connecting plate schematic perspective view；Office of Figure 18 Figure 15 along I-I line
The enlarged structure schematic diagram of portion's section view.Circuit board assemblies 10 in present embodiment can also be implemented in conjunction with previously described first
Any one embodiment in circuit board assemblies 10 that mode is provided to the 5th embodiment, it is in the present embodiment, described
Reinforcement part 122 is equipped with groove 1225 in face of the surface of the second circuit board 13, and the opening of the groove 1225 is towards described the
Two circuit boards 13, the second circuit board 13 seals the opening, and forms sealing space with the groove 1225.It is understood that
, electronic device 30 is provided on the second circuit board.Since the reinforcement part 122 faces the table of the second circuit board 13
Face is equipped with groove 1225, and the second circuit board 13 seals the opening, so that the corresponding groove of the second circuit board 13
The electronic device 30 of 1225 settings is housed in the sealing space, to shield the electronics device for being housed in the sealing space
Part 30.Electromagnetic wave signal outside sealing space cannot be introduced into the sealing space, avoid outside the sealing space
Electromagnetic wave signal interfere the running of the electronic device 30 in the sealing space, ensure that the electronics device in the sealing space
Part 30 stablizes running；The electromagnetic wave signal that the electronic device 30 in the sealing space generates simultaneously can not be radiated described close
Outside is closed, reduces the electronic device 30 in the sealing space to the dry of the electronic device 30 outside the sealing space
It disturbs.It should be understood that the electronic device 30 that the corresponding groove 1225 of the second circuit board 13 is arranged refers to described second
Electronic device of the circuit board 13 in the groove 1225 on the part perpendicular to the projection on 13 direction of second circuit board
30。
Also referring to Figure 19 to Figure 20, Figure 19 is the three-dimensional knot for the circuit board assemblies that the 7th embodiment of the application provides
Structure schematic diagram；Figure 20 is enlarged structure schematic diagram of the Figure 19 along the broken section of II-II line.Circuit board group in present embodiment
Part 10 can also be in conjunction with any in the circuit board assemblies 10 that previously described first embodiment to sixth embodiment provides
One embodiment, in the present embodiment, the first circuit board 11 is along the direction perpendicular to the connecting plate 12
Projection drops into the connecting plate 12.The circuit board assemblies 10 further include the first bonding piece 14a.First bonding piece
14a covers the gap between 12 periphery of 11 periphery of first circuit board and the connecting plate, and the first bonding piece 14a covers
Cover the gap between 13 periphery of 12 periphery of connecting plate and the second circuit board.The first bonding piece 14a has bonding
Effect, since the first bonding piece 14a covers the seam between 12 periphery of 11 periphery of first circuit board and the connecting plate
Gap makes the first circuit board 11 and the connecting plate 12 be bonded together, and improves the first circuit board 11 and the company
Firm degree between fishplate bar 12 avoids the circuit board assemblies 10 so that the circuit board assemblies 10 are stronger
It is easy to loosen and lead to not normal use.And the first circuit board 11 is along the direction perpendicular to the connecting plate 12
Projection drops into the connecting plate 12, so that the size of the first circuit board 11 is less than the size of the connecting plate 12, just
Covering the first bonding piece 14a in the gap between 11 periphery of first circuit board and 12 periphery of connecting plate.Correspondingly,
Since the first bonding piece 14a covers the gap between 13 periphery of 12 periphery of connecting plate and the second circuit board, make
The connecting plate 12 is bonded together with the second circuit board 13, improves the connecting plate 12 and the second circuit board plate
Firm degree between 13 avoids the circuit board assemblies 10 and is easy so that the circuit board assemblies 10 are stronger
It loosens and leads to not normal use.
In the present embodiment, the first circuit board 11 is fallen in the projection on the direction perpendicular to the connecting plate 12
Enter into the connecting plate 12.In a kind of embodiment party, the connecting plate 12 is in the direction perpendicular to the second circuit board 13
On projection drop into the second circuit board 13.In another embodiment, the first circuit board 11 is along vertical
It is dropped into the connecting plate 12 in the projection on the direction of the connecting plate 12；And the second circuit board 13 along perpendicular to
Projection on the direction of the connecting plate 12 drops into the connecting plate 12.It should be understood that the first circuit board 11
Size refers to the first circuit board 11 along the area perpendicular to the projection on 13 direction of second circuit board, the connecting plate 12
Size refer to the connecting plate 12 along the area perpendicular to the projection on 13 direction of second circuit board.Passing through the connection
After the first circuit board 11 is connect by portion 124 with the connecting plate 12, due to the work of 124 own vol of interconnecting piece
With making can have gap between the first circuit board 11 and the connecting plate 12.Wherein, the interconnecting piece 124 can be but
It is not limited to the component that pad, copper post etc. have conduction electric signal effect.The first bonding piece 14a can by but be not limited to by
The one or more of organic silica gel, acrylic type resin and unsaturated polyester (UP), epoxy resin etc. have the material of cementation
Composition.
Referring to Figure 2 together 1 to Figure 22, Figure 21 are the three-dimensional knot for the circuit board assemblies that the 8th embodiment of the application provides
Structure schematic diagram；Figure 22 is enlarged structure schematic diagram of the Figure 21 along the broken section of III-III line.Circuit board in present embodiment
Component 10 can also be in conjunction with appointing in the circuit board assemblies 10 that previously described first embodiment is provided to the 7th embodiment
It is viscous to be provided with second in the present embodiment for embodiment of anticipating between the first circuit board 11 and the connecting plate 12
Part 14b is tied, the connecting plate 12 is provided with third bonding piece 14c with second circuit board 13.The second bonding piece 14b has viscous
Knot effect makes described due to being provided with the two bonding pieces 14b between the first circuit board 11 between the connecting plate 12
First circuit board 11 is bonded together with the connecting plate 12, improves between the first circuit board 11 and the connecting plate 12
Firmness so that the circuit board assemblies 10 are stronger, avoid the circuit board assemblies 10 be easy to loosen and
Lead to not normal use.Correspondingly, the third bonding piece 14c have cementation, due to the second circuit board 13 it
Between the three bonding pieces 14c is provided between the connecting plate 12, improve the second circuit board 13 and the connecting plate
Firmness between 12 avoids the circuit board assemblies 10 and is easy so that the circuit board assemblies 10 are stronger
It loosens and leads to not normal use.It is to be appreciated that the second bonding piece 14b can by but be not limited to by organic silica gel,
There is the one or more of acrylic type resin and unsaturated polyester (UP), epoxy resin etc. the material of cementation to form.It is described
Third bonding piece 14c can by but be not limited to by the one of organic silica gel, acrylic type resin and unsaturated polyester (UP), epoxy resin etc.
Kind or a variety of material compositions with cementation.
Referring to Figure 2 together 3 to Figure 24, Figure 23 are the three-dimensional knot for the circuit board assemblies that the 9th embodiment of the application provides
Structure schematic diagram；Figure 24 is the configuration schematic diagram for the circuit board assemblies that the 9th embodiment of the application provides.Present embodiment
In the circuit board group that can also be provided to the 8th embodiment in conjunction with previously described first embodiment of circuit board assemblies 10
Any one embodiment in part 10, in the present embodiment, the circuit board assemblies 10 further include at least one connector
15.The first circuit board 11 offers the first mounting portion 111.The connecting plate 12 offers the second mounting portion 123.Described
Two circuit boards 13 offer third mounting portion 131.First mounting portion 111 is pacified with second mounting portion 123 and third
Dress portion 131 is oppositely arranged.The connector 15 passes through first mounting portion 111, the second mounting portion 123 and third mounting portion
131, to connect the first circuit board 11, the connecting plate 12 and the second circuit board 13.The connector 15 passes through institute
The first mounting portion 111, second mounting portion 123 and the third mounting portion 131 are stated, thus by institute's first circuit board 11, institute
It states connecting plate 12 and the second circuit board 13 is fixed, make the first circuit board 11 and the connecting plate 12 and the second electricity
Road plate 13 is securely attached together, and improves the intensity of the circuit board assemblies 10, is avoided the circuit board assemblies 10 and is held
Easily loosens and lead to not normal use.It should be understood that the material of the connector 15 can be but be not limited to carbon steel, no
The metal material or alloy material of rust steel, copper etc.；The quantity of the connector 15 is configured as needed, present embodiment
Described in connector 15 quantity be four.
Referring to Figure 2 together 5 to Figure 26, Figure 25 are the three-dimensional knot for the circuit board assemblies that the tenth embodiment of the application provides
Structure schematic diagram；Figure 26 is the configuration schematic diagram for the circuit board assemblies that the tenth embodiment of the application provides；Figure 27 is Figure 26
Enlarged structure schematic diagram at middle IV.Circuit board assemblies 10 in present embodiment can also be implemented in conjunction with previously described first
Any one embodiment in circuit board assemblies 10 that mode is provided to the 9th embodiment, it is in the present embodiment, described
Circuit board assemblies 10 further include bolster 16, and the bolster 16 at least partly exposes first mounting portion 111, the buffering
Part 16 have perforation 161, the connector 15 pass through the perforation 161 connect the first circuit board 11, the connecting plate 12,
And the second circuit board 13, the bolster 16 is for buffering the work that the connector 15 is transmitted to the first circuit board 11
Firmly.Since the bolster 16 can buffer the active force that the connector 15 reaches the first circuit board 11, reduce
The connector 15 is transmitted to effect of the active force of the first circuit board 11 to the first circuit board 11, it is therefore prevented that due to
The active force that the connector 15 reaches the first circuit board 11 makes the connector 15 and the first circuit board greatly very much
It is generated between 11 and loosens and fall off.It should be understood that the bolster 16 having of being but be not limited to scolding tin, washer etc.
The component of buffer function power.
Referring to Figure 2 together 8 to Figure 29, Figure 28 are the solid for the circuit board assemblies that the 11st embodiment of the application provides
Structural schematic diagram；Figure 29 is enlarged structure schematic diagram of the Figure 28 along the part section of V-V line.Circuit board group in present embodiment
Part 10 can also be in conjunction with any in the circuit board assemblies 10 that previously described first embodiment is provided to the tenth embodiment
One embodiment, in the present embodiment, the circuit board assemblies 10 further include shielding case 17, and the setting of shielding case 17 exists
Gap is provided on the second circuit board 13 and between the connecting plate 12, the circuit board assemblies 10 further include the 4th viscous
Part 14d is tied, the 4th bonding piece 14d is arranged in the gap between the shielding case 17 and the second circuit board 13.By
It is arranged in the gap between the shielding case 17 and the second circuit board 13 in the 4th bonding piece 14d, and described
Four bonding piece 14d can buffer the active force that the shielding case 17 reaches the connecting plate 12, reduce the shielding case 17 and reach
The active force of the connecting plate 12 prevents the active force of the connecting plate 12 so that the circuit board assemblies 10 are stronger
The active force that the connecting plate 12 is reached due to the shielding case 17 is too big and damages the connecting plate 12.It is understood that
, the first circuit board 11 drops into the second circuit in the projection on the direction perpendicular to the second circuit board 13
On plate 13, so that the size of the first circuit board 11 is less than the size of second connecting plate 13；The connecting plate 12 is on edge
It is dropped on the second circuit board 13 perpendicular to the projection on the direction of the second circuit board 13, so that the connecting plate 12
Size be less than the second circuit board 13 size.The 4th bonding piece 14d can by but be not limited to by organic silica gel, third
There is the one or more of olefin(e) acid type resin and unsaturated polyester (UP), epoxy resin etc. the material of cementation to form.Described
Four bonding piece 14d can be but be not limited to the component that encapsulating compound etc. has buffer function.
Also referring to Figure 30 to Figure 31, Figure 30 is the schematic perspective view of electronic equipment provided by the present application；Figure 31
For the configuration schematic diagram of electronic equipment provided by the present application.The electronic equipment 1 includes center 20 and the circuit board group
Part 10, the center 20 are used to support the circuit board assemblies 10.It is described due to improving the intensity of the circuit board assemblies 10
Circuit board assemblies 10 are stronger, so that the electronic device steady operation on the circuit board assemblies 10, and then improve described
The stability that electronic equipment 1 is run.
Further, referring to Figure 30 to Figure 31, the circuit board assemblies 10 further include at least one connector 15,
The connector 15 is for the first circuit board 11, the connecting plate 12 and the second circuit board 13 to be fixed in described
Frame 20.Since the first circuit board 11, the connecting plate 12 and the second circuit board 13 being consolidated by the connector 15
The fixed extremely center 20, so as to which the circuit board assemblies 10 are securely fixed on the center 20.Due to improving
The intensity of the circuit board assemblies 10, the circuit board assemblies 10 are stronger, so that the electronics on the circuit board assemblies 10
Device steady operation, and then improve the stability that the electronic equipment 1 is run.
The embodiment of the present application is described in detail above, specific case used herein to the principle of the application and
Embodiment is expounded, the description of the example is only used to help understand the method for the present application and its core ideas；
At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the application
There is change place, in conclusion the contents of this specification should not be construed as limiting the present application.
Claims (12)
1. a kind of circuit board assemblies, which is characterized in that the circuit board assemblies include first circuit board, connecting plate, second circuit
Plate, the first circuit board, the connecting plate and the second circuit board are cascading, and the connecting plate is electrically connected institute
First circuit board and the second circuit board are stated, the connecting plate includes connection ontology and is arranged on the connection ontology
Reinforcement part, the reinforcement part are used to enhance the intensity of the connecting plate.
2. circuit board assemblies as described in claim 1, which is characterized in that the connection ontology includes multiple successively joining end to end
Connection branch, the connection branch, which encloses, is set as through-hole, and the reinforcement part connects two different connection branches.
3. circuit board assemblies as claimed in claim 2, which is characterized in that the reinforcement part include first end, second end and
The middle part of the first end and second end is connected, the first end and the second end are separately connected the connection branch, institute
The size for stating reinforcement part is gradually increased from the middle part to the first end, and the size of the reinforcement part is from the middle part
It is gradually increased to the second end.
4. circuit board assemblies as described in claim 1, which is characterized in that the reinforcement part includes the sub- reinforcement of multiple intersections
Portion, and the round and smooth connection in intersection of the multiple sub- reinforcement part.
5. circuit board assemblies as described in claim 1, which is characterized in that the first circuit board is along perpendicular to the connection
Projection on the direction of plate drops into the connecting plate, and the circuit board assemblies further include the first bonding piece, and described first is viscous
Knot part covers the gap between the first circuit board periphery and the connecting plate periphery, and described in first bonding piece covering
Gap between connecting plate periphery and the second circuit board periphery.
6. circuit board assemblies as described in claim 1, which is characterized in that set between the first circuit board and the connecting plate
It is equipped with the second bonding piece, the connecting plate and second circuit board are provided with third bonding piece.
7. circuit board assemblies as claimed in claim 6, which is characterized in that second bonding piece is arranged in first circuit
Between plate and the reinforcement part, and the third bonding piece is arranged between the reinforcement part and the second circuit board.
8. circuit board assemblies as described in claim 1, which is characterized in that the circuit board assemblies further include at least one connection
Part, the first circuit board offer the first mounting portion, and the connecting plate offers the second mounting portion, and the second circuit board is opened
Equipped with third mounting portion, first mounting portion is oppositely arranged with second mounting portion and third mounting portion, the connection
Part passes through first mounting portion, the second mounting portion and third mounting portion, first circuit board, connecting plate and second to connect
Circuit board.
9. circuit board assemblies as claimed in claim 8, which is characterized in that the circuit board assemblies further include bolster, described
Bolster at least partly exposes first mounting portion, and the bolster has perforation, and the connector connects across the perforation
The first circuit board, the connecting plate and the second circuit board are connect, the bolster is for buffering the connector transmission
To the active force of the first circuit board.
10. circuit board assemblies as described in claim 1, which is characterized in that the circuit board assemblies further include shielding case, described
Shielding case setting is provided with gap on the second circuit board and between the connecting plate, and the circuit board assemblies further include
4th bonding piece, the 4th bonding piece are arranged in the gap between the shielding case and the second circuit board.
11. a kind of electronic equipment, which is characterized in that the electronic equipment includes center and claim 1-10 described in any item
Circuit board assemblies, the center are used to support the circuit board assemblies.
12. electronic equipment as claimed in claim 11, which is characterized in that the circuit board assemblies further include at least one connection
Part, the connector are used to the first circuit board, the connecting plate and the second circuit board being fixed to the center.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910502905.1A CN110191579B (en) | 2019-06-11 | 2019-06-11 | Circuit board assembly and electronic equipment |
| PCT/CN2020/093400 WO2020248845A1 (en) | 2019-06-11 | 2020-05-29 | Circuit board assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910502905.1A CN110191579B (en) | 2019-06-11 | 2019-06-11 | Circuit board assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110191579A true CN110191579A (en) | 2019-08-30 |
| CN110191579B CN110191579B (en) | 2020-12-08 |
Family
ID=67721283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910502905.1A Active CN110191579B (en) | 2019-06-11 | 2019-06-11 | Circuit board assembly and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110191579B (en) |
| WO (1) | WO2020248845A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933841A (en) * | 2019-12-24 | 2020-03-27 | 维沃移动通信有限公司 | Adapter plate, circuit board and electronic equipment |
| WO2020248845A1 (en) * | 2019-06-11 | 2020-12-17 | Oppo广东移动通信有限公司 | Circuit board assembly and electronic device |
| WO2021147676A1 (en) * | 2020-01-20 | 2021-07-29 | 华为技术有限公司 | Electronic assembly and electronic device |
| CN115023033A (en) * | 2021-09-18 | 2022-09-06 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
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| US20150003029A1 (en) * | 2013-06-28 | 2015-01-01 | Canon Kabushiki Kaisha | Stacked semiconductor device, printed circuit board, and method for manufacturing stacked semiconductor device |
| CN108235832A (en) * | 2017-03-09 | 2018-06-29 | 华为技术有限公司 | The mainboard and terminal of a kind of consumption electronic product |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5667388A (en) * | 1994-11-14 | 1997-09-16 | Intel Corporation | Printed circuit board adapter carrier for input/output cards |
| EP3561953B1 (en) * | 2016-12-20 | 2022-02-09 | Kyocera Corporation | Antenna module |
| CN110191579B (en) * | 2019-06-11 | 2020-12-08 | Oppo广东移动通信有限公司 | Circuit board assembly and electronic equipment |
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2019
- 2019-06-11 CN CN201910502905.1A patent/CN110191579B/en active Active
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2020
- 2020-05-29 WO PCT/CN2020/093400 patent/WO2020248845A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150003029A1 (en) * | 2013-06-28 | 2015-01-01 | Canon Kabushiki Kaisha | Stacked semiconductor device, printed circuit board, and method for manufacturing stacked semiconductor device |
| CN108235832A (en) * | 2017-03-09 | 2018-06-29 | 华为技术有限公司 | The mainboard and terminal of a kind of consumption electronic product |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020248845A1 (en) * | 2019-06-11 | 2020-12-17 | Oppo广东移动通信有限公司 | Circuit board assembly and electronic device |
| CN110933841A (en) * | 2019-12-24 | 2020-03-27 | 维沃移动通信有限公司 | Adapter plate, circuit board and electronic equipment |
| WO2021147676A1 (en) * | 2020-01-20 | 2021-07-29 | 华为技术有限公司 | Electronic assembly and electronic device |
| CN115023033A (en) * | 2021-09-18 | 2022-09-06 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020248845A1 (en) | 2020-12-17 |
| CN110191579B (en) | 2020-12-08 |
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