CN110190033A - A kind of use for electronic products chip fixture apparatus - Google Patents
A kind of use for electronic products chip fixture apparatus Download PDFInfo
- Publication number
- CN110190033A CN110190033A CN201910337044.6A CN201910337044A CN110190033A CN 110190033 A CN110190033 A CN 110190033A CN 201910337044 A CN201910337044 A CN 201910337044A CN 110190033 A CN110190033 A CN 110190033A
- Authority
- CN
- China
- Prior art keywords
- shell
- supporting plate
- electronic products
- fixture apparatus
- chip fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of use for electronic products chip fixture apparatus, including shell, the inside of the shell is equipped with sliding slot, and the internal slide of sliding slot is connected with supporting plate, the bottom of the supporting plate is arranged in arrays the first contact, the bottom of the shell is embedded with connecting plate, and the top of connecting plate is equipped with the second wafer, the bottom of the connecting plate is fixedly installed with stitch, the two sides of the shell are mounted on limiting device, and the front and back side of shell two sides bottom end is welded with mounting ear, the inner bottom of the shell is symmetrically installed with damping spring, and the bottom end of damping spring is fixedly connected with pressing plate, the surface inserting of the pressing plate has thermally conductive sheet, the top of the shell is embedded with cooling fan, and the outer surface of cooling fan is equipped with radiating fin.The inventive structure designs advantages of simple, and easy to operate, fixation easy to disassemble, good heat dissipation effect, safety and stability is applied widely, is conducive to popularize.
Description
Technical field
The invention belongs to technical field of electronic products, and in particular to a kind of use for electronic products chip fixture apparatus.
Background technique
Electronic product is the Related product using electric energy as working foundation, specifically includes that wrist-watch, smart phone, phone, TV
Machine, video disc player (VCD, SVCD, DVD), video recorder, video camera, radio, radio cassette player, combination sound box, compact disc player (CD), electricity
Brain, game machine, mobile communication product etc..Because early production is mainly the therefore named electronic product of basic original part with electron tube.Electronics produces
As long as the inside control element of product still controls chip, existing control chip fixes the mainboard for being encapsulated in electronic product mostly
On, on the one hand this mode is not easy to disassembling, assembling and replacing, and it is on the other hand bad for the heat dissipation effect of chip, reduce making for chip
With the service life, it is unfavorable for widely popularizing.
Summary of the invention
The purpose of the present invention is to provide a kind of use for electronic products chip fixture apparatus, to solve to mention in above-mentioned background technique
It has the fixed encapsulation of chip in technology and is not easy to disassembling, assembling and replacing, and the problem that heat dissipation effect is bad.
To achieve the above object, present invention employs following technical solutions:
The inside of a kind of use for electronic products chip fixture apparatus, including shell, the shell is equipped with sliding slot, and sliding slot is interior
Portion slidably connects the supporting plate through outer casing frontispiece, and the bottom of the supporting plate is arranged in arrays the first contact, the shell
Bottom is embedded with connecting plate, and the top of connecting plate is equipped with the second wafer being arranged in a one-to-one correspondence with the first contact, the connection
The bottom of plate is fixedly installed with the stitch being connected to one by one with the second wafer, and the two sides of the shell are mounted on for fixed pallet
Limiting device, and the front and back side of shell two sides bottom end is welded with mounting ear, and the inner bottom of the shell is symmetrically installed with
Four groups of damping springs, and the bottom end of damping spring is fixedly connected with pressing plate, the surface inserting of the pressing plate has thermally conductive sheet, described outer
The top of shell is located at the positive upper end of thermally conductive sheet embedded with cooling fan, and the outer surface of cooling fan is equipped with radiating fin.
Preferably, the side that the two sides of the shell are located at sliding slot is equipped with installation chamber, and limiting device includes passing through
The sliding block that pin shaft is hinged on the indoor connecting rod of installation cavity and is slidably connected on installation chamber inner wall, one end one of the connecting rod
Formula is connected with the protrusive board protruded into shell, and resilient bullet is fixedly mounted between the other end of connecting rod and the side wall for installing chamber
Spring, the side of the sliding block is fixedly connected with the handrail for stretching out shell, and the end side of sliding block is fixedly connected with and connecting rod
The block of fitting, the inner sidewall of the shell and protrusive board junction are equipped with the through-hole with installation chamber, and the outside of shell
Wall and handrail junction are equipped with the limit opening with installation chamber.
Preferably, the top of the supporting plate is equipped with mounting groove, and gathers and be inlaid with and the first contact at the slot bottom of mounting groove
The metal slot being connected to one by one, the two sides front and back end that the top of the supporting plate is located at mounting groove is mounted on elastic snap-gauge, and holds in the palm
The two sides of plate are equipped with the groove for supporting plate limit.
Preferably, the lower shape of first contact is semicircle ball-type, and the bottom of the first contact and the second wafer
Top is fitted and connected.
Preferably, the top activity of the cooling fan is connected with dustproof filter screen, and the side of cooling fan is connected with electricity
Source line.
Preferably, the surface of the mounting ear is equipped with threaded hole, and the bottom of mounting ear is pasted with yielding rubber gasket.
Preferably, the shell and supporting plate are matrix made of polyethylene, and the front end of supporting plate is equipped with pull slot.
Technical effect and advantage of the invention: a kind of use for electronic products chip fixture apparatus proposed by the present invention, and it is existing
Technology is compared, and is had the advantage that
1, can be in order to be installed to chip by having the mounting groove of metal slot on supporting plate, while utilizing on supporting plate
Elastic snap-gauge clamping effectively can be fixed to chip with the pressing plate that interior of shell bottom end is connected using damping spring；
2, can have using the second wafer being connected on the first contact mating connection plate being connected to metal slot with stitch
The stitch of realization chip and the circuit board or other elements of electronic product of effect are connected, and do not influence to dismount chip；
3, when pushing handrail to slide in limit opening, realize that the block of slider end contacts fitting with connecting rod,
And one end of connecting rod is driven to rotate, so that the convex block of the connecting rod other end be made to take in installation cavity, handrail is unclamped, or push and help
When hand returns in situ, realizes that protrusive board protrudes into shell again under the action of return spring, thereby may be ensured that the limiting device
In protrusive board stretch out with the groove grafting of supporting plate two sides, the installation site of supporting plate is defined, while supporting plate pull being facilitated to take
Out；
4, the heat that chip operation generates is transmitted at the top of pressing plate by the thermally conductive sheet of clamp surface, then cooling fan
Heat is shed shell, finally the dispersion of the even heat for the shell that sheds is gone out using radiating fin, effective chip carries out
Heat dissipation.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is front section view of the invention；
Fig. 3 is the top view of supporting plate of the present invention；
Fig. 4 is the cross-sectional view of limiting device of the present invention.
In figure: 1 shell, 101 installation chambers, 102 through-holes, 103 limit openings, 2 sliding slots, 3 supporting plates, 301 mounting grooves, 302
Metal slot, 303 elastic snap-gauges, 304 grooves, 4 first contacts, 5 connecting plates, 6 the second wafers, 7 stitch, 8 limiting devices, 801
Connecting rod, 802 return springs, 803 protrusive boards, 804 handrails, 805 sliding blocks, 806 blocks, 9 damping springs, 10 pressing plates, 11 thermally conductive sheets, 12
Cooling fan, 13 radiating fins, 14 mounting ears.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Herein
Described specific embodiment is only used to explain the present invention, is not intended to limit the present invention.Based on the embodiments of the present invention,
Every other embodiment obtained by those of ordinary skill in the art without making creative efforts, belongs to this hair
The range of bright protection.
It is described outer the present invention provides a kind of use for electronic products chip fixture apparatus as shown in Figs 1-4, including shell 1
The inside of shell 1 is equipped with sliding slot 2, and the internal slide of sliding slot 2 is connected with through the positive supporting plate 3 of shell 1, the bottom of the supporting plate 3
Portion is arranged in arrays the first contact 4, and the bottom of the shell 1 is embedded with connecting plate 5, and the top of connecting plate 5 is equipped with and the
The second wafer 6 that one contact 4 is arranged in a one-to-one correspondence, the bottom of the connecting plate 5 is fixedly installed with to be connected to one by one with the second wafer 6
Stitch 7, the two sides of the shell 1 are mounted on the limiting device 8 for fixed pallet 3, and the front and back of 1 two sides bottom end of shell
Side is welded with mounting ear 14, and the inner bottom of the shell 1 is symmetrically installed with four groups of damping springs 9, and the bottom of damping spring 9
End is fixedly connected with pressing plate 10, and the surface inserting of the pressing plate 10 has thermally conductive sheet 11, and the top of the shell 1 is located at thermally conductive sheet 11
Positive upper end be embedded with cooling fan 12, and the outer surface of cooling fan 12 is equipped with radiating fin 13.
Preferably, the side that the two sides of the shell 1 are located at sliding slot 2 is equipped with installation chamber 101, and limiting device 8 wraps
The sliding block 805 for including the connecting rod 801 being hinged in installation chamber 101 by pin shaft and being slidably connected on installation 101 inner wall of chamber,
One end integral type of the connecting rod 801 is connected with the protrusive board 803 protruded into shell 1, and the other end of connecting rod 801 and installation chamber
Return spring 802 is fixedly installed between 101 side wall, the side of the sliding block 805 is fixedly connected with the handrail for stretching out shell 1
804, and the end side of sliding block 805 is fixedly connected with the block 806 being bonded with connecting rod 801, the inner sidewall of the shell 1 with
803 junction of protrusive board is equipped with the through-hole 102 being connected to installation chamber 101, and the lateral wall of shell 1 is set with 804 junction of handrail
There is the limit opening 103 being connected to installation chamber 101.
By using above-mentioned technical proposal, when pushing handrail 804 to slide in limit opening 103, sliding block is realized
The block 806 of 805 ends contacts fitting with connecting rod 801, and one end of connecting rod 801 is driven to rotate, to make 801 other end of connecting rod
Convex block 803 take in installation cavity 101, handrail 804 is unclamped, or push handrail 804 when returning in situ, in return spring
It realizes that protrusive board 803 is protruded into again in shell 1 under the action of 802, thereby may be ensured that the protrusive board 803 in the limiting device 8 stretches out
With 304 grafting of groove of 3 two sides of supporting plate, the installation site of supporting plate 3 is defined, while 3 pull of supporting plate being facilitated to take out.
Preferably, the top of the supporting plate 3 is equipped with mounting groove 301, and gathers and be inlaid with and the at the slot bottom of mounting groove 301
The metal slot 302 that one contact 4 is connected to one by one, the two sides front and back end that the top of the supporting plate 3 is located at mounting groove 301 are mounted on
Elastic snap-gauge 303, and the two sides of supporting plate 3 are equipped with the groove 304 limited for supporting plate 3.
By using above-mentioned technical proposal, mounting groove 301 cooperates elastic snap-gauge 303 that can be fixed on supporting plate 3 in order to chip
On, while can be inserted into realize and the first touching in order to the stitch of chip with the metal slot 302 that the first contact 4 is connected to one by one
Piece 4 connect, using groove 304 cooperate limiting device 8 can the installation site effectively to supporting plate 3 fix.
Preferably, the lower shape of first contact 4 is semicircle ball-type, and the bottom of the first contact 4 and the second wafer 6
Top be fitted and connected.
By using above-mentioned technical proposal, bottom end is that the first contact 4 of semicircle ball-type can be anti-when supporting plate is mobile
It is blocked when only the first contact 4 is contacted with the second wafer 6, while guaranteeing connecing between the first contact 4 and corresponding the second wafer 6
Touch effect.
Preferably, the top activity of the cooling fan 12 is connected with dustproof filter screen, and the side connection of cooling fan 12
There is power supply line.
By using above-mentioned technical proposal, the dustproof filter screen of activity clamping can effectively play dust-proof effect, and replacement is clear
It washes and also facilitates.
Preferably, the surface of the mounting ear 14 is equipped with threaded hole, and the bottom of mounting ear 14 is pasted with yielding rubber pad
Piece.
By using above-mentioned technical proposal, the setting of threaded hole can be easily installed ear 14 and external bolt is cooperated to be fixed on electricity
On the mainboard of sub- product or other installation sites, at the same yielding rubber gasket can be improved mounting ear 14 installation stability and
Cushioning ability.
Preferably, the shell 1 is matrix made of polyethylene with supporting plate 3, and the front end of supporting plate 3 is equipped with pull slot.
By using above-mentioned technical proposal, shell 1 made of polyethylene and supporting plate 3 all have good insulated heat performance
Setting with anticorrosive temperature capacity, pull slot can be in order to push 3 pull of supporting plate, consequently facilitating the installation of supporting plate 3 is taken out.
Working principle: first shell 1 using mounting ear 14 cooperate external bolt be mounted on electronic product circuit board or
The position of chip is needed, while the stitch 7 on connecting plate 5 and circuit board or other elements encapsulation or connection, then
Being blocked in the mounting groove 301 on chip installation supporting plate 3 with elastic snap-gauge 303, the metal stitch of chip is plugged on metal at this time
In slot 302, then in the sliding slot 2 in the whole insertion shell 1 of supporting plate 3, pass through convex block 803 in limiting device 9 and 3 liang of supporting plate
304 grafting of groove of side is defined the installation site of supporting plate 3, and the first contact 4 connects with the one-to-one correspondence of the second wafer 6 at this time
Touching, the circuit board or other elements of the metal stitch and electronic product of realizing chip are connected, while pressing plate 10 is pressed in chip
Top, can have using the cooling fan 12 of the 11 mating band radiating fin 13 of thermally conductive sheet on pressing plate 10 effectively chip is carried out it is scattered
Heat operation.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features,
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (7)
1. a kind of use for electronic products chip fixture apparatus, including shell (1), it is characterised in that: the inside of the shell (1) is equipped with
Sliding slot (2), and the internal slide of sliding slot (2) is connected with through shell (1) positive supporting plate (3), the bottom of the supporting plate (3) is in
Matrix arrangement has the first contact (4), and the bottom of the shell (1) is embedded with connecting plate (5), and the top of connecting plate (5) is equipped with
The second wafer (6) being arranged in a one-to-one correspondence with the first contact (4), the bottom of the connecting plate (5) are fixedly installed with and the second touching
The stitch (7) that piece (6) is connected to one by one, the two sides of the shell (1) are mounted on the limiting device (8) for fixed pallet (3),
And the front and back side of shell (1) two sides bottom end is welded with mounting ear (14), the inner bottom of the shell (1) is symmetrically installed with four
Group damping spring (9), and the bottom end of damping spring (9) is fixedly connected with pressing plate (10), the surface inserting of the pressing plate (10) has
Thermally conductive sheet (11), the positive upper end that the top of the shell (1) is located at thermally conductive sheet (11) is embedded with cooling fan (12), and radiation air
The outer surface of machine (12) is equipped with radiating fin (13).
2. a kind of use for electronic products chip fixture apparatus according to claim 1, it is characterised in that: the shell (1)
The side that two sides are located at sliding slot (2) is equipped with installation chamber (101), and limiting device (8) includes being hinged on installation by pin shaft
Connecting rod (801) in chamber (101) and the sliding block (805) being slidably connected on installation chamber (101) inner wall, the connecting rod
(801) one end integral type is connected with the protrusive board (803) protruded into shell (1), and the other end of connecting rod (801) and installation chamber
(101) it is fixedly installed between side wall return spring (802), the side of the sliding block (805) is fixedly connected with stretching shell
(1) handrail (804), and the end side of sliding block (805) is fixedly connected with the block (806) being bonded with connecting rod (801), institute
It states the inner sidewall of shell (1) and protrusive board (803) junction is equipped with the through-hole (102) being connected to installation chamber (101), and shell
(1) lateral wall is equipped with the limit opening (103) being connected to installation chamber (101) with handrail (804) junction.
3. a kind of use for electronic products chip fixture apparatus according to claim 1, it is characterised in that: the supporting plate (3)
Top is equipped with mounting groove (301), and gathers at the slot bottom of mounting groove (301) and be inlaid with the gold being connected to one by one with the first contact (4)
Belong to slot (302), the two sides front and back end that the top of the supporting plate (3) is located at mounting groove (301) is mounted on elastic snap-gauge
(303), and the two sides of supporting plate (3) are equipped with the groove (304) for supporting plate (3) limit.
4. a kind of use for electronic products chip fixture apparatus according to claim 1, it is characterised in that: first contact
(4) lower shape is semicircle ball-type, and is fitted and connected at the top of the bottom of the first contact (4) and the second wafer (6).
5. a kind of use for electronic products chip fixture apparatus according to claim 1, it is characterised in that: the cooling fan
(12) top activity is connected with dustproof filter screen, and the side of cooling fan (12) is connected with power supply line.
6. a kind of use for electronic products chip fixture apparatus according to claim 1, it is characterised in that: the mounting ear (14)
Surface be equipped with threaded hole, and the bottom of mounting ear (14) is pasted with yielding rubber gasket.
7. a kind of use for electronic products chip fixture apparatus according to claim 1, it is characterised in that: the shell (1) with
Supporting plate (3) is matrix made of polyethylene, and the front end of supporting plate (3) is equipped with pull slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910337044.6A CN110190033B (en) | 2019-04-25 | 2019-04-25 | Chip fixing device for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910337044.6A CN110190033B (en) | 2019-04-25 | 2019-04-25 | Chip fixing device for electronic product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110190033A true CN110190033A (en) | 2019-08-30 |
| CN110190033B CN110190033B (en) | 2021-05-25 |
Family
ID=67714880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910337044.6A Active CN110190033B (en) | 2019-04-25 | 2019-04-25 | Chip fixing device for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110190033B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113109357A (en) * | 2021-04-09 | 2021-07-13 | 徐州盛科半导体科技有限公司 | Detachable semiconductor analysis device |
| WO2022105306A1 (en) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技（上海）有限公司 | Novel cooling apparatus |
| CN116631950A (en) * | 2023-07-20 | 2023-08-22 | 弘润半导体(苏州)有限公司 | Semiconductor chip packaging box |
| CN117594455A (en) * | 2024-01-19 | 2024-02-23 | 凯瑞电子(诸城)有限公司 | Microelectronic chip shell interference-free mounting device |
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| CN1257209A (en) * | 1998-11-17 | 2000-06-21 | 埃皮技术公司 | Small interval contactor |
| CN1848549A (en) * | 2005-03-10 | 2006-10-18 | 安普泰科电子有限公司 | IC package, IC socket, and IC socket assembly |
| CN208235051U (en) * | 2018-04-27 | 2018-12-14 | 江苏菲拉凯恋新材料科技股份有限公司 | A kind of yarn recoverable apparatus |
| CN208622704U (en) * | 2018-07-17 | 2019-03-19 | 江西意科斯光电科技有限公司 | A kind of ic chip package structure |
-
2019
- 2019-04-25 CN CN201910337044.6A patent/CN110190033B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1257209A (en) * | 1998-11-17 | 2000-06-21 | 埃皮技术公司 | Small interval contactor |
| CN1848549A (en) * | 2005-03-10 | 2006-10-18 | 安普泰科电子有限公司 | IC package, IC socket, and IC socket assembly |
| CN208235051U (en) * | 2018-04-27 | 2018-12-14 | 江苏菲拉凯恋新材料科技股份有限公司 | A kind of yarn recoverable apparatus |
| CN208622704U (en) * | 2018-07-17 | 2019-03-19 | 江西意科斯光电科技有限公司 | A kind of ic chip package structure |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022105306A1 (en) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技（上海）有限公司 | Novel cooling apparatus |
| CN113109357A (en) * | 2021-04-09 | 2021-07-13 | 徐州盛科半导体科技有限公司 | Detachable semiconductor analysis device |
| CN116631950A (en) * | 2023-07-20 | 2023-08-22 | 弘润半导体(苏州)有限公司 | Semiconductor chip packaging box |
| CN116631950B (en) * | 2023-07-20 | 2023-10-17 | 弘润半导体(苏州)有限公司 | Semiconductor chip packaging box |
| CN117594455A (en) * | 2024-01-19 | 2024-02-23 | 凯瑞电子(诸城)有限公司 | Microelectronic chip shell interference-free mounting device |
| CN117594455B (en) * | 2024-01-19 | 2024-04-16 | 凯瑞电子(诸城)有限公司 | Microelectronic chip shell interference-free mounting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110190033B (en) | 2021-05-25 |
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Effective date of registration: 20210510 Address after: 101500 room 106-566, building 2, courtyard 8, Xingsheng South Road, Miyun District, Beijing Applicant after: VACCINE AND HEALTH INSTITUTE Address before: 416000 No.61, Xihu Township, Longshan County, Xiangxi Tujia and Miao Autonomous Prefecture, Hunan Province Applicant before: Huang Jinping |
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Effective date of registration: 20221118 Address after: 311200 room 602, 6th floor, building 1, No.111, Hongxing Road, economic and Technological Development Zone, Xiaoshan District, Hangzhou City, Zhejiang Province Patentee after: Zhongyi (Hangzhou) Pharmaceutical Technology Co.,Ltd. Address before: 101500 room 106-566, building 2, courtyard 8, Xingsheng South Road, Miyun District, Beijing Patentee before: VACCINE AND HEALTH INSTITUTE |
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