CN117594455A - A kind of interference-free installation device for microelectronic chip shell - Google Patents

A kind of interference-free installation device for microelectronic chip shell Download PDF

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Publication number
CN117594455A
CN117594455A CN202410076735.6A CN202410076735A CN117594455A CN 117594455 A CN117594455 A CN 117594455A CN 202410076735 A CN202410076735 A CN 202410076735A CN 117594455 A CN117594455 A CN 117594455A
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CN
China
Prior art keywords
fixed
shell
suction
fixing
housing
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Granted
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CN202410076735.6A
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Chinese (zh)
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CN117594455B (en
Inventor
李文军
郑学军
刘尚合
沈强
王树钢
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Kairui Electronics Zhucheng Co ltd
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Kairui Electronics Zhucheng Co ltd
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Priority to CN202410076735.6A priority Critical patent/CN117594455B/en
Publication of CN117594455A publication Critical patent/CN117594455A/en
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Publication of CN117594455B publication Critical patent/CN117594455B/en
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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明公开了一种微电子芯片外壳无干涉安装装置,涉及微电子芯片加工领域,包括设置在机架上的运载板以及安设架;运载板的表面设有多个承载槽块,承载槽块的表面设有对准槽;安设架靠近承载槽块的一侧表面设有固定头,固定头内设置有固定腔室,固定头的边缘设置有插头,当插头插入对准槽后,固定腔室与承载槽块正对固定腔室的一侧表面形成活动区,本发明可通过承载槽块与固定头的配合,对外壳的安装方向进行限制,具体的,将芯片放置在承载槽块上,再通过固定腔室对覆盖于芯片外的外壳进行固定,随后,下放固定头,使插头插入对准槽,以使固定腔室与承载槽块正对固定腔室的一侧表面形成活动区,之后放开对外壳的限制,使得外壳下落。

The invention discloses a non-interference mounting device for a microelectronic chip shell, which relates to the field of microelectronic chip processing. It includes a carrier plate and a mounting frame arranged on a frame; the surface of the carrier plate is provided with a plurality of bearing groove blocks, and the bearing groove blocks The surface of the block is provided with an alignment groove; the side surface of the mounting frame close to the bearing groove block is provided with a fixed head, a fixed chamber is provided in the fixed head, and a plug is provided on the edge of the fixed head. When the plug is inserted into the alignment groove, The side surface of the fixed chamber and the bearing groove block facing the fixed chamber forms an active area. The present invention can limit the installation direction of the shell through the cooperation of the bearing groove block and the fixed head. Specifically, the chip is placed in the bearing groove. On the block, the shell covering the chip is fixed through the fixing cavity. Then, the fixing head is lowered and the plug is inserted into the alignment slot so that the fixing cavity and the load-bearing slot block are opposite to the side surface of the fixing cavity. activity area, and then release the restrictions on the shell, allowing the shell to fall.

Description

Microelectronic chip shell interference-free mounting device
Technical Field
The invention relates to the technical field of microelectronic chip processing, in particular to a microelectronic chip shell interference-free mounting device.
Background
The microelectronic technology is a new technology developed along with integrated circuits, especially ultra-large scale integrated circuits, corresponding microelectronic chips are arranged in various devices in the modern society to assist the devices to complete work better, and when the microelectronic chips are manufactured, corresponding protective shells are arranged outside the microelectronic chips in order to protect the safety of the microelectronic chips and prolong the service lives of the microelectronic chips.
When the existing microelectronic chip shell is installed, the shell on one side of the chip is installed, then the chip is overturned, and then the shell installation work on the other side is completed. In the prior art, for example, in the chinese patent publication No. CN112654225B, a microelectronic chip housing interference-free mounting device is disclosed, which can self-heal after cutting by means of a connecting strip made of a poly (sebacoyl) adi (hexamethylene dicarbamate) elastomer material, and the arrangement of a cutter, so that devices such as the connecting strip and a connecting column do not interfere with the mounting device and the working device to assemble the housings on both sides of the chip, thereby greatly improving the working efficiency of users, fixing the chip on the connecting strip by corresponding glue, and then processing the connecting strip, so that the chip can safely finish the production work such as lifting.
However, the technical solution provided in the above patent document has limitations in specific operation, because it aims at the problem generated when the chip is transferred by the clamping device, but the calibration problem in the mounting process is not considered, because the chip size is small, the mounting operation can be performed only by controlling the chamber of the housing to align with the chip when the housing is mounted, once the chip edge and the housing chamber edge are scratched, the chip edge or the housing chamber edge damage phenomenon easily occurs, and the chip quality is affected.
Disclosure of Invention
The invention provides a microelectronic chip shell interference-free mounting device, which aims to solve the problem of how to prevent scraping between the edge of a chip and the edge of a shell cavity when the shell is mounted.
In order to solve the technical problems, the invention specifically provides the following technical scheme:
a microelectronic chip shell interference-free mounting device comprises a carrying plate arranged on a rack and a mounting frame capable of approaching to or separating from the carrying plate;
the surface of the carrying plate is provided with a plurality of carrying groove blocks for storing chips, and the surface of the carrying groove blocks is provided with alignment grooves;
a fixed head is arranged on the surface of one side of the installation frame, which is close to the bearing groove block, a fixed cavity is arranged in the fixed head, a plug which can be inserted into the alignment groove is arranged at the edge of the fixed head, when the plug is inserted into the alignment groove, the fixed cavity and the bearing groove block are opposite to one side surface of the fixed cavity to form an active area, the fixed cavity can fix the shell covered outside the chip, and the limit on the shell is released after the active area is formed so as to guide the shell to fall down through self weight.
As a preferable scheme of the invention, the installation frame comprises a fixed plate, wherein an air extraction column connected with the frame is arranged on one side surface of the fixed plate, the air extraction column can be close to or far away from the carrying plate with the fixed plate, and the fixed head is arranged on the other side of the fixed plate;
when the shell is positioned in the fixed cavity, the air extraction column is used for fixing the shell by extracting air between the shell and the fixed cavity, and a fixing ring is arranged on the inner wall of the top of the fixed cavity.
As a preferable scheme of the invention, the fixed head comprises a sealing ring cover fixedly arranged on the other side surface of the fixed plate, plugs are arranged on the two side surfaces of the sealing ring cover, a driving piece is arranged in the sealing ring cover and is positioned in the central area of the sealing ring cover, two ends of the driving piece are respectively provided with a movable section in sealing connection with the inner side wall of the sealing ring cover, and the fixed cavity is formed between the driving piece and the two movable sections;
the central area of the fixed plate is connected with a suction pull column in a penetrating way, one end of the suction pull column is connected with one side surface of the driving piece, which is close to the shell, in a conducting way, and the other end of the suction pull column extends into the air extraction column;
when the air extraction column extracts air, the air extraction column guides the air between the shell and the fixed cavity to be exhausted, and meanwhile, the air extraction column also slides along the inner wall of the air extraction column to guide the belt moving sheet and the two movable sections to lift along with the shell.
As a preferable scheme of the invention, after the shell is driven to rise by the moving plate and the two movable sections, the bottom end of the front projection of the shell is positioned between the bottom end of the front projection of the plug and the bottom end of the front projection of the movable section.
As a preferable mode of the invention, the holding space is arranged in the fixed plate;
every all there is the clearance between movable segment and the sealing ring cover inside wall, be connected with the promotion strip post in the clearance, the surface mounting of promotion strip post has the promotion post that runs through to holding in the interval, the lateral wall of promotion post has cup jointed the elastic component that is located in holding the interval.
As a preferable scheme of the invention, a stabilizing ring cover is arranged on the surface of one side of the driving piece far away from the shell, the stabilizing ring cover corresponds to the fixing ring, a balance column penetrating into the accommodating space is arranged on the surface of the stabilizing ring cover, and when the shell is fixed in the fixing cavity, the fixing ring enters the stabilizing ring cover and guides the surface of the fixing ring to be flush with the inner wall of the top of the fixing cavity.
As a preferable scheme of the invention, the bearing groove block comprises a fixed table cover positioned on the surface of the bearing plate, a holding piece is arranged in the fixed table cover, the alignment groove is arranged on one side surface of the fixed table cover, which is close to the plug, a suction piece hole is arranged on the surface of the fixed table cover, which corresponds to the fixed cavity, the suction piece hole is communicated with the holding piece, and the holding piece holds the fixed chip through the suction piece hole after the plug is inserted into the alignment groove.
As a preferred embodiment of the present invention, the suction member hole is provided in a central region of the stationary platen cover.
As a preferable scheme of the invention, the surface of the fixed table cover is provided with a plurality of auxiliary suction holes, all the auxiliary suction holes are arranged outside the suction piece holes and form a structure matched with the shape of the bottom of the shell, and the auxiliary suction holes can be used for sucking the bottom of the shell.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the mounting direction of the shell can be limited through the cooperation of the bearing groove block and the fixing head, specifically, the chip is firstly placed on the bearing groove block, then the shell covered outside the chip is fixed through the fixing chamber, then the fixing head is lowered, the plug arranged at the edge of the fixing head can be inserted into the alignment groove, so that a movable area is formed by the fixing chamber and the bearing groove block opposite to one side surface of the fixing chamber, and then the limitation of the shell is released, so that the shell falls in the movable area through self weight.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are exemplary only and that other implementations can be obtained from the extensions of the drawings provided without inventive effort.
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a structure of a carrier block according to the present invention;
FIG. 3 is a schematic view of a pumping column according to the present invention;
FIG. 4 is a schematic view of the structure of the fixed plate of the present invention;
FIG. 5 is a schematic view of a stabilizer ring housing according to the present invention;
fig. 6 is a schematic view of a driving plate structure in the present invention.
Reference numerals in the drawings are respectively as follows:
1. a carrying plate; 2. installing a frame; 3. a frame; 4. a bearing groove block; 5. an alignment groove; 6. a fixed head; 7. a plug; 8. fixing the plate; 9. an air pumping column; 10. a fixing ring; 11. a seal ring cover; 12. a belt moving plate; 13. a movable section; 14. a suction pull column; 15. a receiving space; 16. pushing the bar column; 17. pushing the column; 18. an elastic member; 19. a stabilizing ring cover; 20. a balance column; 21. a fixed table cover; 22. a suction member hole; 23. and a secondary suction hole.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The main reasons for scraping the edges of the chip from the edges of the housing chamber are as follows: 1. the shell is not aligned, and the second chip shakes; 3. the housing is inclined when being lowered, so as to reduce the probability of scraping, as shown in fig. 1 to 6, the invention provides a microelectronic chip housing interference-free mounting device, which comprises a carrying plate 1 arranged on a frame 3 and a mounting frame 2 which can approach or separate from the carrying plate 1;
the surface of the carrying plate 1 is provided with a plurality of carrying groove blocks 4 for storing chips, and the surface of the carrying groove blocks 4 is provided with alignment grooves 5;
the fixed head 6 is arranged on one side surface of the installation frame 2 close to the bearing groove block 4, a fixed cavity is arranged in the fixed head 6, a plug 7 capable of being inserted into the alignment groove 5 is arranged at the edge of the fixed head 6, after the plug 7 is inserted into the alignment groove 5, the fixed cavity and the bearing groove block 4 are opposite to one side surface of the fixed cavity to form a movable area, the fixed cavity can fix a shell covered outside a chip, and after the movable area is formed, the limit on the shell is released to guide the shell to fall through self weight.
According to the invention, the mounting direction of the shell can be limited through the cooperation of the bearing groove block 4 and the fixing head 6, specifically, the chip is firstly placed on the bearing groove block 4, then the shell covered outside the chip is fixed through the fixing cavity, then the fixing head 6 is lowered, the plug 7 arranged at the edge of the fixing head 6 can be inserted into the alignment groove 5, so that a movable area is formed by the fixing cavity and the bearing groove block 4 opposite to one side surface of the fixing cavity, and then the limitation of the shell is released, so that the shell falls in the movable area through self weight.
The arrangement of the active area can reduce the probability of misalignment of the housing and the probability of tilting of the housing when it is lowered during the whole operation.
The structure of the frame 3 is shown in fig. 1, and includes an upper portion and a lower portion, the lower portion can carry a plurality of bearing groove blocks 4 to move linearly, the upper portion can carry the housing to move left and right, front and back and up and down, and the mode of implementing these movements can use the prior art, which is not described here.
In some embodiments, the installation frame 2 comprises a fixed plate 8, one side surface of the fixed plate 8 is provided with an air extraction column 9 connected with the frame 3, the air extraction column 9 can be close to or far away from the carrier plate 1 with the fixed plate 8, and the fixed head 6 is arranged on the other side of the fixed plate 8;
when the shell is positioned in the fixed cavity, the air extraction column 9 is used for fixing the shell by extracting air between the shell and the fixed cavity, and the inner wall of the top of the fixed cavity is provided with a fixed ring 10.
In order to enable the shell to be quickly fixed or released, when the shell needs to be fixed, the shell is directly placed in the fixed cavity, then the suction operation is carried out on the suction column 9 through a suction device such as an external air pump and the like, and then the gas between the shell and the fixed cavity can be extracted to reduce the pressure so as to enable the shell to be held in the fixed cavity, so that the purpose of fixing the shell is achieved;
once the casing needs to be released, the pumping operation of the pumping column 9 is stopped, gas can be injected between the casing and the fixed chamber, then the pressure between the casing and the fixed chamber returns to the initial state, and the casing gradually falls along with the increase of the gas.
In some embodiments, the fixed head 6 comprises a sealing ring cover 11 fixedly installed on the other side surface of the fixed plate 8, plugs 7 are arranged on two side surfaces of the sealing ring cover 11, a driving piece 12 is arranged in the sealing ring cover 11, the driving piece 12 is positioned in the central area of the sealing ring cover 11, two ends of the driving piece 12 are provided with movable sections 13 which are in sealing connection with the inner side wall of the sealing ring cover 11, and a fixed cavity is formed between the driving piece 12 and the two movable sections 13;
the central area of the fixed plate 8 is connected with a suction pull column 14 in a penetrating way, one end of the suction pull column 14 is connected with one side surface of the driving piece 12 close to the shell in a conducting way, and the other end extends into the air extraction column 9;
when the suction column 9 draws gas, the suction column 14 guides the gas between the housing and the fixed chamber to be exhausted, and at the same time, the suction column 14 slides along the inner wall of the suction column 9 to guide the belt moving plate 12 and the two movable sections 13 to lift up with the housing.
Since the plug 7 can be inserted into the alignment slot 5, in order to prevent the shell from directly colliding with the chip in the process, when the air extraction column 9 extracts air, the air extraction column 9 guides the air between the shell and the fixed cavity to be exhausted through the air extraction column 14, the air extraction column 14 is driven by the air while extracting air, then the air extraction column 14 slides along the inner side wall of the air extraction column 9, and then the air extraction column 14 guides the guide belt moving sheet 12 and the two movable sections 13 to lift up with the shell, so that the bottom of the shell is not flush with the bottom end of the plug 7.
In some embodiments, when the housing is lifted with the moving plate 12 and the two movable segments 13, the bottom end of the front projection of the housing is located between the bottom end of the front projection of the plug 7 and the bottom end of the front projection of the movable segments 13.
The arrangement is to ensure that the distance between the bottom of the shell and the chip is smaller as much as possible on the premise of preventing collision, and the scraping of the edge of the chip and the shell can be fully avoided.
In some embodiments, a containment compartment 15 is provided within the fixed panel 8;
gaps exist between each movable section 13 and the inner side wall of the sealing ring cover 11, pushing bar columns 16 are connected in the gaps, pushing columns 17 penetrating into the containing spaces 15 are installed on the surfaces of the pushing bar columns 16, and elastic pieces 18 (optional springs) located in the containing spaces 15 are sleeved on the side walls of the pushing columns 17.
When the suction pull column 14 guides the belt moving plate 12 and the two movable sections 13 to lift with the shell, the two movable sections 13 respectively push the corresponding pushing bar columns 16 to lift together, then the lifting pushing bar columns 16 lift with the pushing columns 17, and when the pushing columns 17 lift, the elastic piece 18 is pressed;
after that, once the suction operation on the suction column 9 is stopped (i.e. the active area is formed at this time), the elastic member 18 is reset to push the push column 17 and the push bar 16 downward, and when the push bar 16 descends, the active section 13 is pushed to reset, and the active section 13 is not deformed during the resetting process, and meanwhile, the shaking phenomenon is not easy to occur during the descending process of the housing.
In some embodiments, a stabilizing ring cover 19 is mounted on a surface of a side of the belt plate 12 away from the housing, the stabilizing ring cover 19 corresponds to the fixing ring 10, a balance post 20 penetrating into the accommodating space 15 is mounted on a surface of the stabilizing ring cover 19, and when the housing is fixed in the fixing chamber, the fixing ring 10 enters the stabilizing ring cover 19 and guides the surface of the fixing ring 10 to be flush with the inner wall of the top of the fixing chamber.
Once the shell is sucked into the fixed cavity, the shell presses the fixed ring 10 to enable the surface of the shell to be flush with the inner wall of the top of the fixed cavity, the stabilizing ring cover 19 can play a role in stabilizing along with the lifting of the driving piece 12, so that the driving piece 12 cannot incline, and once the driving piece 12 pushes the shell to descend, the stabilizing ring cover 19 can drive the balance column 20 to descend along with the driving piece 12, and at the moment, the balance column 20 can limit the position of the stabilizing ring cover 19, so that the driving piece 12 cannot shake.
The fixing ring 10 can play a role in buffering, once the casing descends, the fixing ring 10 will be in the state shown in fig. 6, and even if the casing is scratched, the casing only obliquely collapses the fixing ring 10 due to buffering of the fixing ring 10, so that chips cannot be scratched.
In some embodiments, the carrying groove block 4 comprises a fixed table cover 21 positioned on the surface of the carrying plate 1, a holding piece is arranged in the fixed table cover 21, the alignment groove 5 is arranged on one side surface of the fixed table cover 21 close to the plug 7, a suction piece hole 22 is arranged on the surface of the fixed table cover 21 corresponding to the fixed cavity, the suction piece hole 22 is communicated with the holding piece, and when the plug 7 is inserted into the alignment groove 5, the holding piece holds the fixed chip through the suction piece hole 22. The suction member hole 22 is provided in the center region of the stationary table cover 21.
When the chip is placed, the chip is directly placed in the groove on the surface of the fixed table cover 21 (refer to fig. 2, meanwhile, the suction piece can select a small suction device, for example, a suction bag, the suction bag is equivalent to a compressed air cylinder, the movable end of the air cylinder is positioned at the corresponding position of the alignment groove 5, the inner space of the air cylinder can be increased by pressing the movable section 13 at the alignment groove 5, after the inner space is increased, the pressure is reduced, namely, the position of holding the chip can be realized at the suction piece hole 22, and the suction piece can also be an electric suction device, and the contact switch is arranged at the alignment groove 5), and after the plug 7 is inserted into the alignment groove 5, the suction piece holds the fixed chip through the suction piece hole 22.
To further secure stability at the time of installation, in some embodiments, the surface of the fixed stage cover 21 is provided with a plurality of auxiliary suction holes 23, all of the auxiliary suction holes 23 are disposed outside the suction member holes 22 and form a structure matching with the outer shape of the bottom of the housing, and the auxiliary suction holes 23 can hold the bottom of the housing.
In order to prevent the housing from shaking after being mounted, the suction member may be an electric suction device, which has a persistence, and when the housing is mounted, all the auxiliary suction holes 23 are sucked to the bottom of the housing.
The invention is particularly used when:
the chip is placed on the bearing groove block 4, then the shell is placed in the fixed cavity, then the pumping operation is carried out on the pumping column 9 through a pumping air device such as an external air pump and the like, then the air between the shell and the fixed cavity can be pumped out to enable the pressure to be reduced, so that the shell is sucked in the fixed cavity, the purpose of fixing the shell is achieved, when the pumping column 9 pumps out the air, the pumping column 9 guides the air between the shell and the fixed cavity to be discharged through the pumping column 14, the pumping column 14 is driven by the air while pumping, then the pumping column 14 slides along the inner side wall of the pumping column 9, then the pumping column 14 guides the movable sheet 12 and the two movable sections 13 to lift up with the shell, the bottom of the shell is not flush with the bottom end of the plug 7, when the pumping column 14 guides the movable sheet 12 and the two movable sections 13 to lift up with the shell, the corresponding pushing columns 16 are respectively pushed up, then the lifting columns 16 lift up with the pushing columns 17, and the elastic pieces 18 are pressed when the lifting columns 17 are lifted up.
The fixed head 6 is lowered, the plug 7 arranged at the edge of the fixed head 6 can be inserted into the alignment groove 5, so that a movable area is formed on the surface of one side of the fixed cavity opposite to the bearing groove block 4, then the pumping operation on the pumping column 9 is stopped, the elastic piece 18 can reset to push the pushing column 17 and the pushing bar 16 to descend, when the pushing bar 16 descends, the movable section 13 can be pushed to reset and cannot deform in the resetting process of the movable section 13, meanwhile, the shaking phenomenon cannot occur easily in the descending process of the shell, and then the shell can realize the installation operation under the condition that the position of the shell and the position of a chip are confirmed.
The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application, the scope of which is defined by the claims. Various modifications and equivalent arrangements may be made to the present application by those skilled in the art, which modifications and equivalents are also considered to be within the scope of the present application.

Claims (9)

1. The interference-free mounting device for the microelectronic chip shell is characterized by comprising a carrying plate (1) arranged on a rack (3) and a mounting frame (2) which can be close to or far from the carrying plate (1);
the surface of the carrying plate (1) is provided with a plurality of carrying groove blocks (4) for storing chips, and the surface of the carrying groove blocks (4) is provided with an alignment groove (5);
the utility model discloses a fixed device is characterized by comprising a mounting frame (2), a bearing groove block (4) and a fixed cavity, wherein the fixed cavity is arranged on one side surface of the mounting frame (2) close to the bearing groove block (4), the fixed cavity is arranged in the fixed cavity (6), a plug (7) capable of being inserted into the alignment groove (5) is arranged on the edge of the fixed cavity (6), after the plug (7) is inserted into the alignment groove (5), the fixed cavity and the bearing groove block (4) are opposite to one side surface of the fixed cavity to form an active area, the fixed cavity can fix a shell covered outside a chip, and after the active area is formed, the limit of the shell is released to guide the shell to fall through self weight.
2. A microelectronic die housing interference-free mounting device according to claim 1, characterized in that the mounting frame (2) comprises a fixed plate (8), one side surface of the fixed plate (8) is provided with a suction column (9) connected with the frame (3), the suction column (9) can bring the fixed plate (8) towards the carrier plate (1) or away from the carrier plate, and the fixed head (6) is arranged at the other side of the fixed plate (8);
when the shell is positioned in the fixed cavity, the air extraction column (9) is used for fixing the shell by extracting air between the shell and the fixed cavity, and a fixing ring (10) is arranged on the inner wall of the top of the fixed cavity.
3. The interference-free mounting device of the microelectronic chip shell according to claim 2, characterized in that the fixing head (6) comprises a sealing ring cover (11) fixedly mounted on the other side surface of the fixing plate (8), plugs (7) are arranged on two side surfaces of the sealing ring cover (11), a driving piece (12) is arranged in the sealing ring cover (11), the driving piece (12) is positioned in the central area of the sealing ring cover (11), movable sections (13) in sealing connection with the inner side walls of the sealing ring cover (11) are arranged at two ends of the driving piece (12), and the fixing cavity is formed between the driving piece (12) and the two movable sections (13);
the central area of the fixed plate (8) is connected with a suction pull column (14) in a penetrating way, one end of the suction pull column (14) is connected with one side surface of the driving piece (12) close to the shell in a conducting way, and the other end of the suction pull column extends into the air extraction column (9);
when the air extraction column (9) extracts air, the air extraction column (14) guides the air between the shell and the fixed cavity to be exhausted, and meanwhile, the air extraction column (14) also slides along the inner wall of the air extraction column (9) to guide the driving piece (12) and the two movable sections (13) to lift along with the shell.
4. A microelectronic die housing interference-free mounting device according to claim 3, characterized in that the bottom end of the housing orthographic projection is located between the bottom end of the plug (7) orthographic projection and the bottom end of the movable section (13) orthographic projection after the housing is lifted up with the movable section (13) and the movable section (12).
5. A microelectronic die housing interference-free mounting device according to claim 3 or 4, characterized in that a receiving space (15) is provided in the fixing plate (8);
every movable segment (13) all have the clearance between sealed ring cover (11) inside wall, be connected with in the clearance and promote strip post (16), the surface mounting who promotes strip post (16) has and runs through to holding pushing post (17) in interval (15), the lateral wall of pushing post (17) cup joints elastic component (18) that are located in holding interval (15).
6. The interference-free mounting device for a microelectronic chip housing according to claim 5, characterized in that a stabilizing ring cover (19) is mounted on a surface of a side of the driving piece (12) far from the housing, the stabilizing ring cover (19) corresponds to the fixing ring (10), a balancing post (20) penetrating into the accommodating space (15) is mounted on a surface of the stabilizing ring cover (19), and when the housing is fixed in the fixing chamber, the fixing ring (10) enters the stabilizing ring cover (19) and guides the surface of the fixing ring (10) to be flush with the inner wall of the top of the fixing chamber.
7. A microelectronic die housing interference-free mounting device according to claim 3, characterized in that the bearing groove block (4) comprises a fixed table cover (21) positioned on the surface of the carrying plate (1), a holding piece is arranged in the fixed table cover (21), the alignment groove (5) is arranged on one side surface of the fixed table cover (21) close to the plug (7), a suction piece hole (22) is arranged on the surface of the fixed table cover (21) at a position corresponding to the fixed cavity, the suction piece hole (22) is communicated with the holding piece, and the holding piece holds the fixed die through the suction piece hole (22) after the plug (7) is inserted into the alignment groove (5).
8. A microelectronic die housing interference-free mounting device according to claim 7, characterized in that the suction member aperture (22) is arranged in a central area of the stationary table cover (21).
9. The device for interference-free mounting of a microelectronic die housing according to claim 7 or 8, characterized in that the surface of the stationary table cover (21) is provided with a plurality of auxiliary suction holes (23), all auxiliary suction holes (23) are arranged outside the suction member holes (22) and form a structure matching the shape of the housing bottom, and the auxiliary suction holes (23) can hold the housing bottom.
CN202410076735.6A 2024-01-19 2024-01-19 A device for installing a microelectronic chip housing without interference Active CN117594455B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410076735.6A CN117594455B (en) 2024-01-19 2024-01-19 A device for installing a microelectronic chip housing without interference

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202410076735.6A CN117594455B (en) 2024-01-19 2024-01-19 A device for installing a microelectronic chip housing without interference

Publications (2)

Publication Number Publication Date
CN117594455A true CN117594455A (en) 2024-02-23
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CN120497186A (en) * 2025-07-17 2025-08-15 京隆科技(苏州)有限公司 Chip transfer assembly, chip transfer method and application

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CN216928554U (en) * 2022-03-30 2022-07-08 重庆赛宝工业技术研究院有限公司 Microelectronic chip transportation clamping structure
WO2022165958A1 (en) * 2021-02-05 2022-08-11 天芯互联科技有限公司 Chip packaging method and chip packaging mechanism
CN217881462U (en) * 2021-04-27 2022-11-22 上海火芯微电子有限公司 Protection support plate for electronic chip packaging
CN115752548A (en) * 2022-11-30 2023-03-07 江苏驭芯传感器科技有限公司 Semiconductor sensor chip inspection device

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US5362986A (en) * 1993-08-19 1994-11-08 International Business Machines Corporation Vertical chip mount memory package with packaging substrate and memory chip pairs
US6007357A (en) * 1995-05-26 1999-12-28 Rambus Inc. Chip socket assembly and chip file assembly for semiconductor chips
KR20010044946A (en) * 1999-11-01 2001-06-05 마이클 디. 오브라이언 Heater block for manufacturing semiconductor package
CN110190033A (en) * 2019-04-25 2019-08-30 黄金平 A kind of use for electronic products chip fixture apparatus
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CN217881462U (en) * 2021-04-27 2022-11-22 上海火芯微电子有限公司 Protection support plate for electronic chip packaging
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120497186A (en) * 2025-07-17 2025-08-15 京隆科技(苏州)有限公司 Chip transfer assembly, chip transfer method and application

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