CN110186596A - A kind of spring force snesor - Google Patents
A kind of spring force snesor Download PDFInfo
- Publication number
- CN110186596A CN110186596A CN201910454749.6A CN201910454749A CN110186596A CN 110186596 A CN110186596 A CN 110186596A CN 201910454749 A CN201910454749 A CN 201910454749A CN 110186596 A CN110186596 A CN 110186596A
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- CN
- China
- Prior art keywords
- spring force
- chip
- pressure
- force snesor
- diaphragm
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/02—Measuring force or stress, in general by hydraulic or pneumatic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention provides a kind of spring force snesor.Spring force snesor includes sensor main body, and including the first surface and second surface being oppositely arranged along its thickness direction, first surface is provided with fluid chamber on second surface for receiving spring force to be measured；Diaphragm positioned at second surface and seals fluid chamber, and the endoceliac fluid pressure of liquid carrying；Pressure chip is surveyed, is connected to fluid chamber, to measure the fluid pressure signal in fluid chamber；Pressure chip is surveyed in chip substrate, carrying；Signal processor, to handle the fluid pressure signal surveyed in the hydraulic cavities that pressure chip measures and export.By fluid chamber, diaphragm, survey pressure chip, chip substrate and signal processor, it may be implemented accurate and measure spring force in real time, in addition, the fluid pressure signal in fluid chamber is directly measured using pressure chip is surveyed, the size of spring force snesor can be reduced, and improves the accuracy of spring force sensor measuring spring force.
Description
Technical field
The invention belongs to load cell technical fields, and in particular to a kind of spring force snesor, especially one kind are used for
The spring force snesor of power circuit breaker.
Background technique
Power circuit breaker is the Primary Component for maintaining power equipment normal operation, and mechanical spring type power circuit breaker has fortune
Row is reliable, and advantage easy to maintain is widely used in high-tension electricity breaker.On the large spring applied in breaker usually
It can bear immense pressure, move it quickly, execute switch motion.But it bears immense pressure be easy to cause spring creep for a long time,
Weakening elasticity, switching speed is caused to decline, three-phase/variable connector acts the problems such as asynchronous, and so that switch motion is failed when serious,
Cause serious electric power accident.In order to improve the reliability of breaker, it is necessary to which it is accurate in real time to carry out to pressure on spring
Detection.
Because the spring volume in breaker is big, it is strong to bear pressure, and transmit pressure by solid, so tradition is suitable for
The pressure of liquid/gas body/pressure test mode all cannot be directly used to its pressure test.
Summary of the invention
The present invention is directed at least solve one of the technical problems existing in the prior art, a kind of spring force snesor is provided.
The present invention provides a kind of spring force snesor, comprising:
Sensor main body, the sensor main body include the first surface and the second table being oppositely arranged along its thickness direction
Face, the first surface are provided with fluid chamber on the second surface for receiving spring force to be measured；
Diaphragm, the diaphragm is located at the second surface and seals the fluid chamber, and the endoceliac liquid pressure of liquid carrying
Power；
Pressure chip is surveyed, the survey pressure chip is arranged in the fluid chamber, to measure the fluid pressure in the fluid chamber
Signal；
Chip substrate, the chip substrate are arranged in the sensor main body and carry the survey pressure chip；
Signal processor, the signal processor are electrically connected with survey pressure chip, to measured by survey pressure chip
Fluid pressure signal handled and the fluid pressure signal that exports that treated.
Optionally, the spring force snesor further includes at least one sealing element and at least one liquid injection channel, institute
The first end for stating liquid injection channel is connected to the fluid chamber, and the second end of the liquid injection channel runs through the sensor
Other arbitrary surfaces of the main body in addition to the second surface, the second end of the sealing element and the corresponding liquid injection channel
It is tightly connected.
Optionally, the fluid chamber is sealed to form by the sensor main body, the diaphragm and the chip substrate.
Optionally, in a ring, the spring force snesor further includes the pressure ring positioned at the second surface, institute to the diaphragm
The marginal end portion that pressure ring is pressed on the diaphragm is stated, the diaphragm is fixed on the second surface.
Optionally, the spring force snesor further includes the bearing base and briquetting positioned at the second surface, the pressure
Block is folded between the bearing base and the diaphragm, and is abutted respectively with the bearing base and the diaphragm.
Optionally, the survey pressure chip uses MEMS chip.
Optionally, the signal processor includes signal processing unit and data transmission unit, the signal processing unit
It is electrically connected with survey pressure chip, the data transmission unit is electrically connected with the signal processing unit；Wherein,
The signal processing unit, for receiving the fluid pressure signal for surveying pressure chip measurement, and by the liquid
Pressure signal amplifies, analog-to-digital conversion and temperature-compensating, with the fluid pressure signal that obtains that treated；
The data transmission unit, for fluid pressure signal to be sent to receiving end by treated.
Optionally, the peace being recessed from its first surface to the direction of the second surface is provided on the sensor main body
Tankage, the signal processor are arranged in the mounting groove.
Optionally, the spring force snesor further include between the chip substrate and the signal processor extremely
Few four pins, the survey pressure chip are electrically connected by the pin with the signal processor.
Optionally, the diaphragm uses rubber, Plastic macromolecule polymer material or Multi-layer elastic composite material system
It is formed.
Spring force snesor of the invention, including sensor main body, including the first table being oppositely arranged along its thickness direction
Face and second surface, first surface are provided with fluid chamber on second surface for receiving spring force to be measured；Diaphragm is located at
Second surface simultaneously seals fluid chamber, and the endoceliac fluid pressure of liquid carrying；Pressure chip is surveyed, is connected to fluid chamber, to measure liquid
Endoceliac fluid pressure signal；Pressure chip is surveyed in chip substrate, carrying；Signal processor surveys what pressure chip measured to handle
Fluid pressure signal in hydraulic cavities simultaneously exports.By fluid chamber, diaphragm, pressure chip, chip substrate and signal processor are surveyed, it can
To realize accurate and measure spring force in real time, the fluid pressure signal in fluid chamber is directly measured in addition, using and surveying pressure chip,
The size of spring force snesor can be reduced, and improves the accuracy of spring force sensor measuring spring force.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the spring force snesor of the embodiment of the present invention；
Fig. 2 is the top view of spring force snesor shown in Fig. 1；
Fig. 3 is the bottom view of spring force snesor shown in Fig. 1.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, with reference to the accompanying drawing and specific embodiment party
Present invention is further described in detail for formula.
As shown in Figure 1, Figure 2 and Figure 3, the present invention relates to a kind of spring force snesor 100, the spring force snesor 100 packets
It includes sensor main body 110, diaphragm 120, survey pressure chip 130, chip substrate 140 and signal processor 150.Sensor main body 110
Including the first surface 111 and second surface 112 being oppositely arranged along its thickness direction, first surface 111 is for receiving bullet to be measured
Spring force, second surface 112 are equipped with fluid chamber 112a.Diaphragm 120 is located at second surface 112 and seals fluid chamber 112a, and holds
Fluid pressure in carrier fluid body cavity 112a.It surveys pressure chip 130 to be located in fluid chamber 112a, to measure the liquid in fluid chamber 112a
Pressure signal.Chip substrate 140 is arranged in sensor main body 110 and carries survey pressure chip 130.Signal processor 150 and core
Plate base 140 is electrically connected, and is believed fluid pressure after the fluid pressure signal that pressure chip 130 measures is handled and exports processing is surveyed
Number.
Specifically, when in use, spring force snesor 100 is placed in 200 lower section of spring, spring force snesor 100
First surface 111 and 200 following table face contact of spring, meanwhile, which is placed on horizontal bearing platform (such as
The briquetting 183 hereafter recorded), when sensor reaches dynamic balance, the briquetting 183 by equivalent is provided on diaphragm 120 branch
The fluid pressure that support force is provided with liquid in fluid chamber 112a, the pressure are consistent with spring force.It can be with finally, surveying pressure chip 130
Detect that the fluid pressure signal in fluid chamber 112a, signal processor 150 will survey the fluid pressure signal for pressing chip 130 to measure
It is handled and is exported, actual spring force size can be calculated by the fluid pressure signal exported.
The spring force snesor 100 of the present embodiment structure, by set fluid chamber on sensor main body 110
112a, diaphragm 120 and survey pressure chip 130, chip substrate 140 and signal processor 150, may be implemented accurate and real-time measurement
Spring force, in addition, directly detecting simultaneously output liquid chamber using pressure chip 130, chip substrate 140 and signal processor 150 is surveyed
Fluid pressure signal in 112a can make the height of spring force sensor 100 reach 1cm hereinafter, greatly reducing spring
On the other hand the size of force snesor 100 directly detects the fluid pressure signal in fluid chamber 112a using pressure chip 130 is surveyed,
The measurement accuracy of spring force snesor 100 can be improved.
It should be noted that the concrete shape, material and the way of contact for sensor main body 110 do not do rising limit
It is fixed, for example, also correspondence is annulus to sensor main body 110 as shown in Figure 1, the cross section of spring 200 is circular ring shape in the embodiment
Shape, stainless steel material, the first surface 111 and 200 surface parallel contact of spring of sensor main body 110, but above embodiment
The scope of application of the invention is not limited.
Explanation is needed further exist for, the specific structure of fluid chamber 112a is not defined, for example, such as Fig. 1
Shown, hydraulic cavities 112a can be alternating share cavity, but this does not limit the scope of application of the invention.
As shown in Figure 1, spring force snesor 100 further includes liquid injection channel 160 and sealing element 170.Liquid injection is logical
The first end in road 160 is connected to fluid chamber 112a, the second end of liquid injection channel 160 through first surface 111 and with sealing
Part 170 is tightly connected.
As shown in Figure 1, fluid chamber 112a is sealed to form by sensor main body 110, diaphragm 120 and chip substrate 140.Specifically
Chip 130 is first installed to chip substrate 140 before the spring force snesor 100 using the present embodiment by ground, then by chip
The sealing installation of substrate 140 is into the groove (not showing that in figure) inside hydraulic cavities 112a, then by diaphragm 120 and hydraulic cavities
112a sealing installation, later, injected using set liquid injection channel 160 into fluid chamber 112a liquid medium (for example,
Water, hydraulic oil or certain mixing liquids etc.), until gapless is hydraulically full in fluid chamber 112a, liquid injection channel 160
Medium, and then sealing element 170 is installed to corresponding liquid injection channel to realize sealing.
It should be noted that the quantity of liquid injection channel is not limited to situation as shown in Figure 1, those skilled in the art
Member can according to actual needs, the quantity of actual liquid injection channel required for determining and position etc..
In addition, chip substrate 140 can be tightly connected using adhesive and sensor main body 110, sealing element 170 can be adopted
It is tightly connected with modes such as welding with corresponding liquid injection channel 160, but the present invention is not limited thereto.
In order to realize the sealed connection of diaphragm 120 Yu sensor main body 110, the edge of diaphragm 120 can be with sensor master
The second surface 112 of body 110 bonds, in this way it can be ensured that diaphragm 120 and second surface 112 are tightly connected.Certainly, diaphragm 120
Other than it can use bonding mode, some other connection type can also be used, to realize sealing between the two.
As shown in Figure 1, in order to further effectively ensure the sealing performance between diaphragm 120 and sensor main body 110, spring
Force snesor 100 further includes the pressure ring 181 positioned at second surface 112, and pressure ring 181 is pressed on the marginal end portion of diaphragm 120, will
Diaphragm 120 is fixed on second surface 112.Pressure ring 181 and sensor main body 110 are solid using modes such as welding or self-lockings
Fixed, pressure ring 181 is circular ring shape in embodiment, but above embodiment does not limit the scope of application of the invention.
As shown in Figure 1, Figure 3, spring force snesor 100 further includes the bearing base 182 and briquetting positioned at second surface 112
183.The structure annular in shape of briquetting 183, is folded between bearing base 182 and diaphragm 120, and respectively with bearing base 182 and
Diaphragm 120 abuts.
Specifically, in the course of work of practical spring force snesor 100, when measuring spring force, spring 200 and sensor
The first surface 111 of main body 110 contacts, and diaphragm 120 is contacted with briquetting 183, and briquetting 183 is contacted with bearing base 182, in spring
After applying pressure on 200, pressure successively passes through sensor main body 110, diaphragm 120 and briquetting 183 and is transmitted to bearing base 182
On, according to the interaction principle of power, the power being transmitted on bearing base 182 is transferred to liquid via briquetting 183, diaphragm 120
In chamber 112a, suffered pressure is transmitted on survey pressure chip 130 by the liquid medium in hydraulic cavities 112a, is read and is surveyed pressure chip 130
Pressure data, can reflect the pressure born on spring 200.
Set briquetting 183, can effectively ensure that pressure suffered by spring 200 can be transmitted sufficiently in the present embodiment
Onto the liquid medium in hydraulic cavities 112a, the accuracy of spring force snesor 100 is improved.And, it is preferable that briquetting 183
The outer profile edge of cross section and the outer profile edge of the cross section fluid chamber 112a coincide or close to insides.
In the present invention survey pressure chip 130 using MEMS (Micro-Electro-Mechanical-Systems,
MEMS) chip.
As shown in Figure 1,150 signal processor of signal processor includes signal processing unit 151 and data transmission unit
152.Signal processing unit 151 is electrically connected with pressure chip 130 is surveyed, for receiving the fluid pressure signal surveying pressure chip 130 and measuring,
And amplify fluid pressure signal, analog-to-digital conversion and temperature-compensating, with the fluid pressure signal that obtains that treated.Data pass
Defeated unit 152 is electrically connected with signal processing unit 151, for by treated, fluid pressure signal to be sent to receiving end.
It is recessed as shown in Figure 1, being provided on sensor main body 110 from first surface 111 to the direction of second surface 112
Mounting groove 190, convenient for placement signal processor 150.
As shown in Figure 1, spring force snesor 100 further include between chip substrate 140 and signal processor 150 extremely
Few four pins 141 are surveyed pressure chip 130 and are electrically connected by pin 141 with signal processor 150, but the present invention is not with this
It is limited.
In the present invention, diaphragm 120 can use rubber, Plastic macromolecule polymer material or multilayer elastic composite wood
Material production is formed, can also be using rigid materials such as stainless steels, and the present invention is not limited thereto.
Spring force snesor 100 in the present embodiment is by fluid chamber 112a, the diaphragm being arranged on sensor main body 110
120, pressure chip 130, chip substrate 140 and signal processor 150 are surveyed, may be implemented accurate and measure spring force in real time, separately
Outside, the fluid pressure signal in fluid chamber 112a is directly measured using survey pressure chip 130, spring force snesor 100 can be reduced
Size, and improve spring force snesor 100 measure spring force accuracy.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of spring force snesor characterized by comprising
Sensor main body, the sensor main body include the first surface and second surface being oppositely arranged along its thickness direction, institute
First surface is stated for receiving spring force to be measured, is provided with fluid chamber on the second surface；
Diaphragm, the diaphragm is located at the second surface and seals the fluid chamber, and the endoceliac fluid pressure of liquid carrying；
Pressure chip is surveyed, the survey pressure chip is arranged in the fluid chamber, to measure the fluid pressure signal in the fluid chamber；
Chip substrate, the chip substrate are arranged in the sensor main body and carry the survey pressure chip；
Signal processor, the signal processor are electrically connected with survey pressure chip, to liquid measured by survey pressure chip
Body pressure signal is handled and the fluid pressure signal that exports that treated.
2. spring force snesor according to claim 1, which is characterized in that the spring force snesor further includes at least one
A sealing element and at least one liquid injection channel, the first end of the liquid injection channel is connected to the fluid chamber, described
The second end of liquid injection channel runs through other arbitrary surfaces of the sensor main body in addition to the second surface, the sealing
Part is tightly connected with the second end of the corresponding liquid injection channel.
3. spring force snesor as claimed in any of claims 1 to 2, which is characterized in that the fluid chamber is by institute
Sensor main body, the diaphragm and the chip substrate is stated to be sealed to form.
4. spring force snesor according to claim 1, which is characterized in that in a ring, the spring force passes the diaphragm
Sensor further includes the pressure ring positioned at the second surface, and the pressure ring is pressed on the marginal end portion of the diaphragm, by the film
Piece is fixed on the second surface.
5. spring force snesor as claimed in any of claims 1 to 3, which is characterized in that the spring force sensing
Device further includes the bearing base and briquetting positioned at the second surface, and the briquetting is folded in the bearing base and the diaphragm
Between, and abutted respectively with the bearing base and the diaphragm.
6. spring force snesor as claimed in any of claims 1 to 3, which is characterized in that the survey pressure chip is adopted
Use MEMS chip.
7. spring force snesor as claimed in any of claims 1 to 3, which is characterized in that the signal processor
Including signal processing unit and data transmission unit, the signal processing unit is electrically connected with survey pressure chip, the data
Transmission unit is electrically connected with the signal processing unit；Wherein,
The signal processing unit, for receiving the fluid pressure signal for surveying pressure chip measurement, and by the fluid pressure
Signal amplifies, analog-to-digital conversion and temperature-compensating, with the fluid pressure signal that obtains that treated；
The data transmission unit, for fluid pressure signal to be sent to receiving end by treated.
8. spring force snesor as claimed in any of claims 1 to 3, which is characterized in that the sensor main body
On be provided with the mounting groove being recessed from its first surface to the direction of the second surface, the signal processor is arranged described
In mounting groove.
9. spring force snesor as claimed in any of claims 1 to 3, which is characterized in that the spring force sensing
Device further includes at least four pins between the chip substrate and the signal processor, and the survey pressure chip passes through institute
Pin is stated to be electrically connected with the signal processor.
10. spring force snesor as claimed in any of claims 1 to 3, which is characterized in that the diaphragm uses rubber
Glue, Plastic macromolecule polymer material or Multi-layer elastic composite material make to be formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910454749.6A CN110186596A (en) | 2019-05-29 | 2019-05-29 | A kind of spring force snesor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910454749.6A CN110186596A (en) | 2019-05-29 | 2019-05-29 | A kind of spring force snesor |
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| CN110186596A true CN110186596A (en) | 2019-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910454749.6A Pending CN110186596A (en) | 2019-05-29 | 2019-05-29 | A kind of spring force snesor |
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Citations (9)
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|---|---|---|---|---|
| US7421903B2 (en) * | 2005-10-27 | 2008-09-09 | Amnon Brosh | Internal pressure simulator for pressure sensors |
| DE102008030363A1 (en) * | 2008-06-26 | 2010-01-14 | Continental Automotive Gmbh | Sensor arrangement, has housing body for accommodating sensor element, and diaphragm fastened to housing body and surrounding cavity that contains pressure transmission medium, where sensor element is arranged in cavity |
| CN201852666U (en) * | 2010-09-28 | 2011-06-01 | 刘胜 | Pressure transmitter of integrated pressure chip |
| US8215176B2 (en) * | 2009-05-27 | 2012-07-10 | Continental Automotive Systems, Inc. | Pressure sensor for harsh media sensing and flexible packaging |
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| CN206945201U (en) * | 2017-07-10 | 2018-01-30 | 深圳瑞德感知科技有限公司 | A kind of integrated form MEMS oil-filled pressure transducers |
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| CN108534919A (en) * | 2018-02-28 | 2018-09-14 | 南京元感微电子有限公司 | A kind of spring force Sensors ＆ Application |
-
2019
- 2019-05-29 CN CN201910454749.6A patent/CN110186596A/en active Pending
Patent Citations (9)
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|---|---|---|---|---|
| US7421903B2 (en) * | 2005-10-27 | 2008-09-09 | Amnon Brosh | Internal pressure simulator for pressure sensors |
| DE102008030363A1 (en) * | 2008-06-26 | 2010-01-14 | Continental Automotive Gmbh | Sensor arrangement, has housing body for accommodating sensor element, and diaphragm fastened to housing body and surrounding cavity that contains pressure transmission medium, where sensor element is arranged in cavity |
| US8215176B2 (en) * | 2009-05-27 | 2012-07-10 | Continental Automotive Systems, Inc. | Pressure sensor for harsh media sensing and flexible packaging |
| CN201852666U (en) * | 2010-09-28 | 2011-06-01 | 刘胜 | Pressure transmitter of integrated pressure chip |
| CN203534754U (en) * | 2013-10-25 | 2014-04-09 | 江西晨明实业有限公司 | Miniature low-pressure gauge |
| CN104132767A (en) * | 2014-07-25 | 2014-11-05 | 北京控制工程研究所 | Pressure sensor based on MEMS |
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Application publication date: 20190830 |