CN209400106U - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
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- CN209400106U CN209400106U CN201822256207.1U CN201822256207U CN209400106U CN 209400106 U CN209400106 U CN 209400106U CN 201822256207 U CN201822256207 U CN 201822256207U CN 209400106 U CN209400106 U CN 209400106U
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- pcb board
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- pressure sensor
- pressure
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- 239000000758 substrate Substances 0.000 claims abstract description 88
- 239000004065 semiconductor Substances 0.000 claims abstract description 52
- 230000006835 compression Effects 0.000 claims abstract description 26
- 238000007906 compression Methods 0.000 claims abstract description 26
- 239000011521 glass Substances 0.000 claims description 39
- 238000012545 processing Methods 0.000 claims description 17
- 238000009826 distribution Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims 2
- 230000035945 sensitivity Effects 0.000 abstract description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 230000001419 dependent effect Effects 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920000297 Rayon Polymers 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- -1 boron ion Chemical class 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000003129 oil well Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
A kind of pressure sensor, comprising: semiconductor substrate, the semiconductor substrate include upper surface and opposite lower surface；Compression cavity in semiconductor substrate, the opening of the compression cavity are located at the lower surface of semiconductor substrate, and the corresponding semiconductor substrate of the compression cavity bottom is strain films；Strain resistor on strain films；Several ring-shaped grooves in strain films, several ring-shaped grooves are located at strain resistor two sides, and several ring-shaped grooves are for concentrating strain at strain resistor.The Sensitivity in Pressure Sensors of the utility model is promoted, and overload capacity is strong, is hardly damaged.
Description
Technical field
The utility model relates to sensor field more particularly to a kind of pressure sensors.
Background technique
Sensor is a kind of detection device, measured information can be experienced, and can will test the information experienced, by one
Set pattern rule is for conversion into the information output of electric signal or other required forms, with meet the transmission of information, processing, storage, display,
Record and control etc. require.It is to realize the automatic primary link detected and automatically control.
Wherein, pressure sensor is a kind of sensor the most commonly used in industrial practice, is widely used in various industry
Automatic control environment is related to water conservancy and hydropower, railway traffic, intelligent building, production automatic control, aerospace, military project, petrochemical industry, oil well, electricity
Numerous industries such as power, ship, lathe, pipeline.
Pressure sensor is many kinds of, has ceramic pressure resistance type, ceramic capacitor-type, silicon core body type, it is micro- molten that silicon strains sheet glass
Formula (abbreviation glass is micro- molten), film pressure resistance type.Wherein silicon core body type pressure sensor is usually the one side production strain in silicon wafer
Resistance, the another side of silicon wafer make deep etching and form cavity and strain films, finally on the glass substrate and cut silicon wafer bonding point
From forming complete core.
But the sensitivity of existing silicon core body type pressure sensor still have it is to be hoisted.
Utility model content
Technical problem to be solved in the utility model is how to improve Sensitivity in Pressure Sensors.
To solve the above-mentioned problems, the utility model provides a kind of pressure sensor, comprising:
Semiconductor substrate, the semiconductor substrate include upper surface and opposite lower surface；
Compression cavity in semiconductor substrate, the opening of the compression cavity are located at the lower surface of semiconductor substrate,
The corresponding semiconductor substrate of the compression cavity bottom is strain films；
Strain resistor on strain films；
Several ring-shaped grooves in strain films, several ring-shaped grooves are located at strain resistor two sides, described several
Ring-shaped groove is for concentrating strain at strain resistor.
Optionally, the depth of several ring-shaped grooves is less than the thickness of strain films, and the opening of ring-shaped groove is in strain films
Separate compression cavity surface.
Optionally, several ring-shaped grooves center having the same.
Optionally, the strain resistor is set on the corresponding extended line of one or more ring-shaped grooves of outermost.
Optionally, the quantity of the strain resistor is 4, and several annular channels are in 4 symmetrical fan-shaped distributions, fan
There is the connection of " ten " font, 4 strain resistors are set to " ten " word company on strain films between several ring-shaped grooves of shape distribution
On four angles connect.
Optionally, there are several concentric ring-shaped grooves, the ring-shaped groove structure in each sector is identical in each sector.
Optionally, further includes: substrate of glass, substrate of glass include upper surface and opposite lower surface, the substrate of glass
In there is the first pressure guide hole through substrate of glass upper and lower surfaces, the upper surface of the substrate of glass and semiconductor substrate
Lower surface be bonded together, the first pressure guide hole in substrate of glass is connected to the compression cavity in semiconductor substrate.
Optionally, further includes: pcb board has the second pressure guide hole through pcb board thickness, the PCB in the pcb board
There is processing circuit, the lower surface bonds of the substrate of glass make the second pilot on pcb board on pcb board upper surface on plate
Hole is connected to the first pressure guide hole in substrate of glass；Strain resistor is connect with the processing circuit on pcb board by line, it is described
The signal that processing circuit detects strain resistor is handled.
Optionally, further includes: upper cover plate has upper cover gas port on the upper cover plate, and the upper cover plate is pasted onto pcb board
Upper surface on, the upper cover plate seals the upper surface of pcb board and semiconductor substrate, forms closed pressure cavity, upper cover
Gas port and the gas of one end connect.
Optionally, further includes: lower cover plate has lower cover gas port on the lower cover plate, and the lower cover plate is pasted onto pcb board
Lower surface on, the lower cover plate seals the lower surface of pcb board and the second pressure guide hole, forms closed other side pressure chamber
The gas of body, lower cover gas port and the other end connects.
Compared with prior art, technical solutions of the utility model have the advantage that
The pressure sensor of the utility model forms several ring-shaped grooves in strain films, and several ring-shaped grooves are located at
Strain resistor two sides, by the way that several ring-shaped grooves are arranged, when strain films strain, strain can be along ring-shaped groove to strain
The direction of resistance is concentrated, so that the dependent variable at strain resistor increases, so that the variable quantity of the resistance value of strain resistor will increase,
So that the sensitivity of measurement increases, and when especially measuring micro-pressure with the pressure sensor of the utility model, several ring-shaped grooves
The strain for generating micro-pressure on strain films is concentrated to the direction of strain resistor, so that the dependent variable at strain resistor increases,
To which the variable quantity of the resistance value of strain resistor will increase, so that sensitivity of the pressure sensor when measuring micro-pressure increases.
And in the utility model, the strain films can keep identical as the thickness of the strain films of existing pressure sensor, be not necessarily to
Strain films are carried out it is thinned, strain films overload when strain films it is still not easily broken so that the pressure sensor of the utility model overloads
Ability is strong, is hardly damaged.
Further, the depth of several ring-shaped grooves is less than the thickness of strain films, and the opening of ring-shaped groove is in strain films
Separate compression cavity surface, several ring-shaped groove centers having the same, the strain resistor is set to outermost
The corresponding extended line of one or more ring-shaped grooves on, by aforementioned setting, several ring-shaped grooves correspond to deflecting strain resistor
The concentration effect at place further enhances, and dependent variable further increases at strain resistor, thus the variation of the resistance value of strain resistor
Amount can further increase, so that sensitivity of the pressure sensor when measuring micro-pressure further increases.
Further, the quantity of the strain resistor is 4, and several annular channels are in 4 symmetrical fan-shaped distributions, fan
There is the connection of " ten " font, 4 strain resistors are set to " ten " word company on strain films between several ring-shaped grooves of shape distribution
On four angles connect, this setup, " ten " word connection four angles on can obtain maximum deformation quantity, " ten " word connection
Four angles on the strain resistor 31 that is arranged can obtain maximum sensitivity.
Further, the upper surface of the substrate of glass and the lower surface of semiconductor substrate are bonded together, in substrate of glass
The first pressure guide hole be connected to the compression cavity in semiconductor substrate, it is subsequent by pressure sensor by the way that substrate of glass is arranged
After Nian Jie with pcb board, influence of the deformation of mount stress and/or pcb board to strain films on the one hand can be prevented, on the other hand, after
When continuous that pressure sensor is Nian Jie with PCB, viscose glue retaining pressure chamber can be prevented.
Detailed description of the invention
Fig. 1-5 is the structural schematic diagram of pressure sensor in the utility model embodiment.
Specific embodiment
As described in the background art, the sensitivity of existing pressure sensor still has to be hoisted.
The study found that the strain films of existing pressure sensor generally do preferable, for the measurement of micro-pressure, its is sensitive
Spend it is very low, although can be strained lepthymenia by reducing the thickness of strain films to improve the sensitivity of pressure sensor
When, so that strain films are easy to break.
For this purpose, the utility model provides a kind of pressure sensor and forming method thereof, pressure sensor is in strain films
Several ring-shaped grooves are formed, several ring-shaped grooves are located at strain resistor two sides, by the way that several ring-shaped grooves are arranged, work as strain
When film strains, strain can be concentrated along ring-shaped groove to the direction of strain resistor, so that the dependent variable at strain resistor increases
Greatly, so that the variable quantity of the resistance value of strain resistor will increase, so that the sensitivity of measurement increases, the utility model is especially used
Pressure sensor when measuring micro-pressure, strain that several ring-shaped grooves generate micro-pressure on strain films is to strain resistor
Direction is concentrated, so that the dependent variable at strain resistor increases, so that the variable quantity of the resistance value of strain resistor will increase, so that pressure
Sensitivity of the force snesor when measuring micro-pressure increases.And in the utility model, the strain films can keep with it is existing
Pressure sensor strain films thickness it is identical, it is thinned without being carried out to strain films, strain films overload when strain films be still not easy
Fragmentation is hardly damaged so that the pressure sensor overload capacity of the utility model is strong.
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.When the utility model embodiment is described in detail, for purposes of illustration only, schematic diagram
General proportion can be disobeyed and make partial enlargement, and the schematic diagram is example, should not limit the guarantor of the utility model herein
Protect range.In addition, the three-dimensional space of length, width and depth should be included in actual fabrication.
Fig. 1-5 is the structural schematic diagram of pressure sensor in the utility model embodiment.
It is the schematic diagram of the section structure of the Fig. 1 along the direction cutting line AB, the pressure sensor of the present embodiment with reference to Fig. 1-2, Fig. 2
3, comprising:
Semiconductor substrate 33, the semiconductor substrate 33 include upper surface and opposite lower surface；
Compression cavity 35 (referring to Fig. 2) in semiconductor substrate 33, the opening of the compression cavity 35, which is located at, partly to be led
The lower surface of body substrate 33, the corresponding semiconductor substrate in 35 bottom of compression cavity are strain films 37 (referring to Fig. 2)；
Strain resistor 31 on strain films 37；
Several ring-shaped grooves 32 in strain films 37, several ring-shaped grooves 32 are located at 31 two sides of strain resistor,
Several ring-shaped grooves 32 are for concentrating strain at strain resistor 31.
Specifically, the material of the semiconductor substrate 33 is semiconductor material, and in the present embodiment, the semiconductor substrate
33 material is silicon.In other embodiments, the material of the semiconductor substrate 33 can be germanium, SiGe, silicon-on-insulator
Or germanium on insulator.
The strain films 37 are identical as the material of semiconductor substrate 33.In an embodiment, by from semiconductor substrate 33
Lower surface etching removal part semiconductor substrate, forms compression cavity 35, the remaining part semiconductor in 35 bottom of compression cavity
Substrate is as strain films 37.
37 two sides of strain films there are when pressure difference, the strain films 37 can strain, so that strain films 37 be driven to answer
31 strain of power transformation resistance, the variation of pressure is obtained by measuring the variation of resistance value of strain resistor 31.
Strain resistor 31 is located on strain films 37.Strain resistor 31 is generally by 33 impurity ion of semiconductor substrate
It is formed, the foreign ion includes boron ion (B).
There are several ring-shaped grooves 32, several ring-shaped grooves 32 are located at 31 liang of strain resistor in the strain films 37
Side, for several ring-shaped grooves 32 for concentrating strain at strain resistor 31, the quantity of the ring-shaped groove is at least one
It is a.In the present embodiment, by the way that several ring-shaped grooves 32 are arranged, when strain films 37 strain, strain can be along ring-shaped groove
32 concentrate to the direction of strain resistor 31, so that the dependent variable at strain resistor 32 increases, thus the resistance value of strain resistor 32
Variable quantity will increase so that the sensitivity of measurement increases, especially measure micro-pressure with the pressure sensor of the utility model
When, the strain that several ring-shaped grooves 32 generate micro-pressure on strain films is concentrated to the direction of strain resistor 31, so that strain
Dependent variable at resistance 32 increases, so that the variable quantity of the resistance value of strain resistor 32 will increase, so that pressure sensor is being surveyed
Sensitivity when measuring micro-pressure increases.And in the utility model, the strain films 37 can be kept and existing pressure sensing
The thickness of the strain films of device is identical, thinned without carrying out to strain films, and strain films are still not easily broken when strain films overload, so that this
The pressure sensor overload capacity of utility model is strong, is hardly damaged.
In the present embodiment, the depth of several ring-shaped grooves 32 is less than the thickness of strain films 37, and ring-shaped groove 32 is opened
Mouth is in the surface of the separate compression cavity 35 of strain films 37, several ring-shaped grooves 32 center having the same, the strain
Resistance 32 is set on the corresponding extended line of one or more ring-shaped grooves 32 of outermost, by aforementioned setting, several annulars
Concentration effect at the corresponding deflecting strain resistor 31 of groove 32 further enhances, and dependent variable further increases at strain resistor 31,
To which the variable quantity of the resistance value of strain resistor 32 can further increase, so that pressure sensor is sensitive when measuring micro-pressure
Degree further increases.
In the present embodiment, the quantity of the strain resistor 31 is 4, and several annular channels 32 are in 4 symmetrical fans
Shape is distributed, and on the strain films 37 between several ring-shaped grooves 32 of sector distribution there is " ten " font to connect 38,4 strain resistors
31 are set on four angles of " ten " word connection 38, this setup, can obtain maximum on four angles of " ten " word connection 38
Deformation quantity, the strain resistor 31 that is arranged can obtain maximum sensitivity on four angles of " ten " word connection 38.
There are several concentric ring-shaped grooves 32,32 structure of ring-shaped groove in each sector is identical in each sector.?
In one embodiment, the side wall of the ring-shaped groove 32 is in circular arc type.In other embodiments, the side wall of the ring-shaped groove 32 is in
Broken line type.
The pressure sensor, further includes: substrate of glass 34, substrate of glass 34 include upper surface and opposite lower surface,
There is the first pressure guide hole 36 through 34 upper and lower surfaces of substrate of glass, the substrate of glass 34 in the substrate of glass 34
Upper surface and the lower surface of semiconductor substrate 33 be bonded together, the first pressure guide hole 36 in substrate of glass 34 is served as a contrast with semiconductor
Compression cavity 34 in bottom 33 is connected to.
It is subsequent after pressure sensor is Nian Jie with pcb board by the way that substrate of glass 34 is arranged, it on the one hand can prevent installation from answering
On the other hand influence of the deformation of power and/or pcb board to strain films 37 when subsequent that pressure sensor is Nian Jie with PCB, can be prevented
Only viscose glue retaining pressure chamber.
In conjunction with reference Fig. 3-Fig. 5, further includes: pcb board 4 has in the pcb board 4 and leads through the second of 4 thickness of pcb board
It presses hole 41 (referring to Fig. 4), there are processing circuit 7 (referring to Fig. 3), the lower surface bonds of the substrate of glass 34 on the pcb board 4
On 4 upper surface of pcb board, make the second pressure guide hole 41 on pcb board 4 with the first pressure guide hole 36 in substrate of glass 34 (with reference to figure
1) it is connected to；Strain resistor is connect with the processing circuit 7 on pcb board 4 by line, the processing circuit 7 examines strain resistor
The signal of survey is handled.
The processing circuit 7 includes the metallic circuit that several electronic components are connected with by resistance element, the processing
The processing that circuit 7 carries out the signal that strain resistor detects, which includes at least, amplifies the signal scene detected to strain resistor.
Also there is pad 8, the pad 8 is electrically connected with processing circuit 7, and treated detects for inciting somebody to action on the pcb board 4
Signal output.
The lower surface bonds of the substrate of glass 34 can use viscose glue or adhesive tape on 4 upper surface of pcb board.
In the present embodiment, further includes: upper cover plate 1 has upper cover gas port 2 on the upper cover plate 1, and the upper cover plate 1 is viscous
It is attached on the upper surface of pcb board 4, the upper cover plate 1 seals the upper surface of pcb board and semiconductor substrate, forms closed pressure
Power cavity, upper cover gas port 2 are connect with the gas of one end；Lower cover plate 5 has lower cover gas port 6 on the lower cover plate 5, described
Lower cover plate 5 is pasted on the lower surface of pcb board 4, and the lower cover plate 5 seals the lower surface of pcb board 4 and the second pressure guide hole 41,
Closed other side pressure cavity is formed, lower cover gas port 6 is connect with the gas of the other end, so that pressure sensor is capable of measuring two
The pressure difference of kind gas.
In another embodiment, can there was only upper cover plate 1, there is upper cover gas port 2, the upper cover on the upper cover plate 1
Plate 1 is pasted on the upper surface of pcb board 4, and the upper cover plate 1 seals the upper surface of pcb board and semiconductor substrate, is formed closed
Pressure cavity, upper cover gas port 2 connect with the gas of testing pressure, and the second pressure guide hole 41 on pcb board 4 is connect with atmosphere,
Pressure sensor is allowed to measure the pressure for the gas connecting with upper cover gas port 2.
In another embodiment, can there was only lower cover plate 5, there is lower cover gas port 6, the lower cover on the lower cover plate 5
Plate 5 is pasted on the lower surface of pcb board 4, and the lower cover plate 5 seals the lower surface of pcb board 4 and the second pressure guide hole 41, is formed
Closed pressure cavity, lower cover gas port 6 are connect with the gas of testing pressure, and strain films upper surface is contacted with atmosphere, so that
Pressure sensor can measure the pressure for the gas connecting with lower cover gas port 6.
An embodiment of the present invention additionally provides a kind of forming method of pressure sensor, specific as follows (to need to illustrate
, other of structure identical and similar with previous embodiment limit or description in the present embodiment, do not exist in the present embodiment
It repeats, specifically please refers to the restriction or description of corresponding portion in previous embodiment).
With reference to Fig. 2, semiconductor substrate 33 is provided, the semiconductor substrate 33 includes upper surface and opposite lower surface；Edge
The lower surface of semiconductor substrate 33, remove part semiconductor substrate, in semiconductor substrate 33 formed compression cavity 35, it is described by
The remaining semiconductor substrate in 35 bottom of cavity is pressed to form strain resistor 31 on strain films 37 as strain films 37；In strain films 37
Middle to form several ring-shaped grooves 32, several ring-shaped grooves 32 are located at 31 two sides of strain resistor, several ring-shaped grooves 32
For concentrating strain at strain resistor 31.
It etches the semiconductor substrate 35 and forms compression cavity 35 using wet-etching technology.What wet-etching technology used
Etching solution is TMAH or KOH.
Several ring-shaped grooves 32 are formed by plasma etching industrial, can be in semiconductor substrate before performing etching
The position that 33 upper surfaces do not need etching forms mask layer and removes the mask layer after etching forms several ring-shaped grooves 32.
The strain resistor 31 is formed by ion implanting, specifically the strain resistor 31 to be formed in semiconductor substrate 33
Position implanting impurity ion.In the particular embodiment, the foreign ion includes boron ion.
In one embodiment, the depth of several ring-shaped grooves 32 is less than the thickness of strain films 37, ring-shaped groove 32
It is open in the surface of the separate compression cavity 35 of strain films 37, several ring-shaped groove centers having the same, the strain
Resistance is formed on the corresponding extended line of one or more ring-shaped grooves of outermost.
In one embodiment, the strain resistor is formed by ion implanting, and the quantity of the strain resistor is 4, institute
It states several annular channels to be distributed in 4 symmetrical sectors, have on the strain films between several ring-shaped grooves of sector distribution
The connection of " ten " font, 4 strain resistors are set on four angles of " ten " word connection, have several concentric rings in each sector
Shape groove, it is each sector in ring-shaped groove structure it is identical.
With continued reference to Fig. 2, further includes: substrate of glass 34 is provided, substrate of glass 34 includes upper surface and opposite lower surface,
There is the first pressure guide hole 36 through substrate of glass upper and lower surfaces in the substrate of glass 34；By the substrate of glass 34
Upper surface and the lower surface of semiconductor substrate 33 be bonded together, the first pressure guide hole 36 in substrate of glass 34 is served as a contrast with semiconductor
Compression cavity 35 in bottom 33 is connected to.
The bonding technology can close technique or other suitable bonding technologies using silicon-silicon bond.
In conjunction with reference Fig. 3-5, further includes: provide pcb board 4, have in the pcb board 4 and led through the second of pcb board thickness
Hole 41 is pressed, there is processing circuit 7 on the pcb board 4；By the lower surface bonds of the substrate of glass 34 in 4 upper surface of pcb board
On, it is connected to the second pressure guide hole 41 on pcb board 4 (with reference to Fig. 2) with the first pressure guide hole 36 in substrate of glass 34；Form line
Strain resistor is connect with the processing circuit 7 on pcb board 4, at the signal that the processing circuit 7 detects strain resistor
Reason.
Further include: upper cover plate 1 is provided, there is upper cover gas port 2 on the upper cover plate 1；The upper cover plate 1 is pasted onto
On the upper surface of pcb board 4, the upper cover plate 1 seals the upper surface of pcb board 4 and semiconductor substrate, forms closed pressure chamber
Body, upper cover gas port 2 are connect with the gas of one end.
Further include: upper cover plate 5 is provided, there is upper cover gas port 6 on the upper cover plate 5；The lower cover plate 5 is pasted onto
On the lower surface of pcb board 4, the lower cover plate 5 seals the lower surface of pcb board 4 and the second pressure guide hole 41, is formed closed another
Lateral pressure cavity, lower cover gas port 6 are connect with the gas of the other end, so that pressure sensor is capable of measuring the pressure of two kinds of gas
Difference.
In another embodiment, can there was only upper cover plate 1, there is upper cover gas port 2, the upper cover on the upper cover plate 1
Plate 1 is pasted on the upper surface of pcb board 4, and the upper cover plate 1 seals the upper surface of pcb board and semiconductor substrate, is formed closed
Pressure cavity, upper cover gas port 2 connect with the gas of testing pressure, and the second pressure guide hole 41 on pcb board 4 is connect with atmosphere,
Pressure sensor is allowed to measure the pressure for the gas connecting with upper cover gas port 2.
In another embodiment, can there was only lower cover plate 5, there is lower cover gas port 6, the lower cover on the lower cover plate 5
Plate 5 is pasted on the lower surface of pcb board 4, and the lower cover plate 5 seals the lower surface of pcb board 4 and the second pressure guide hole 41, is formed
Closed pressure cavity, lower cover gas port 6 are connect with the gas of testing pressure, and strain films upper surface is contacted with atmosphere, so that
Pressure sensor can measure the pressure for the gas connecting with lower cover gas port 6.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (10)
1. a kind of pressure sensor characterized by comprising
Semiconductor substrate, the semiconductor substrate include upper surface and opposite lower surface；
Compression cavity in semiconductor substrate, the opening of the compression cavity is located at the lower surface of semiconductor substrate, described
The corresponding semiconductor substrate of compression cavity bottom is strain films；
Strain resistor on strain films；
Several ring-shaped grooves in strain films, several ring-shaped grooves are located at strain resistor two sides, several annulars
Groove is for concentrating strain at strain resistor.
2. pressure sensor as described in claim 1, which is characterized in that the depth of several ring-shaped grooves is less than strain films
Thickness, the opening of ring-shaped groove is on the surface of the separate compression cavity of strain films.
3. pressure sensor as claimed in claim 1 or 2, which is characterized in that during several ring-shaped grooves are having the same
The heart.
4. pressure sensor as claimed in claim 3, which is characterized in that the strain resistor be set to one of outermost or
On the corresponding extended line of multiple ring-shaped grooves.
5. pressure sensor as claimed in claim 1 or 2, which is characterized in that the quantity of the strain resistor is 4, described
Several annular channels are distributed in 4 symmetrical sectors, have " ten " on the strain films between several ring-shaped grooves of sector distribution
Font connection, 4 strain resistors are set on four angles of " ten " word connection.
6. pressure sensor as claimed in claim 5, which is characterized in that there are several concentric annular ditch in each sector
Slot, it is each sector in ring-shaped groove structure it is identical.
7. pressure sensor as described in claim 1, which is characterized in that further include: substrate of glass, substrate of glass include upper table
Face and opposite lower surface have the first pressure guide hole through substrate of glass upper and lower surfaces, institute in the substrate of glass
The lower surface of the upper surface and semiconductor substrate of stating substrate of glass is bonded together, the first pressure guide hole in substrate of glass with partly lead
Compression cavity connection in body substrate.
8. pressure sensor as claimed in claim 7, which is characterized in that further include: pcb board has in the pcb board and runs through
Second pressure guide hole of pcb board thickness has processing circuit on the pcb board, and the lower surface bonds of the substrate of glass are in pcb board
On upper surface, it is connected to the second pressure guide hole on pcb board with the first pressure guide hole in substrate of glass；By line by strain resistor
It is connect with the processing circuit on pcb board, the signal that the processing circuit detects strain resistor is handled.
9. pressure sensor as claimed in claim 8, which is characterized in that further include: upper cover plate has on the upper cover plate upper
Lid gas port, the upper cover plate are pasted on the upper surface of pcb board, and the upper cover plate serves as a contrast the upper surface of pcb board and semiconductor
Bottom sealing forms closed pressure cavity, the gas connection of upper cover gas port and one end.
10. pressure sensor as claimed in claim 8 or 9, which is characterized in that further include: lower cover plate has on the lower cover plate
There is lower cover gas port, the lower cover plate is pasted on the lower surface of pcb board, and the lower cover plate is by the lower surface of pcb board and second
Pressure guide hole sealing forms closed other side pressure cavity, the gas connection of lower cover gas port and the other end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822256207.1U CN209400106U (en) | 2018-12-29 | 2018-12-29 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822256207.1U CN209400106U (en) | 2018-12-29 | 2018-12-29 | Pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209400106U true CN209400106U (en) | 2019-09-17 |
Family
ID=67897111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822256207.1U Expired - Fee Related CN209400106U (en) | 2018-12-29 | 2018-12-29 | Pressure sensor |
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| Country | Link |
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| CN (1) | CN209400106U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109540355A (en) * | 2018-12-29 | 2019-03-29 | 菲比蓝科技(深圳)有限公司 | Pressure sensor and forming method thereof |
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2018
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109540355A (en) * | 2018-12-29 | 2019-03-29 | 菲比蓝科技(深圳)有限公司 | Pressure sensor and forming method thereof |
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| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200325 Address after: Building 2, Huarui science and Technology Park, intersection of Lingbi road and North Third Ring Road, high tech Zone, Suzhou City, Anhui Province 234000 Patentee after: Feineite sensor (Anhui) Co.,Ltd. Address before: 518103 Building 202, No. 18 Jinju Road, Fuyong Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: PHYBLUE TECHNOLOGY (SHENZHEN) Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190917 |