CN110184571A - High power pulse coating process - Google Patents
High power pulse coating process Download PDFInfo
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- CN110184571A CN110184571A CN201910377026.0A CN201910377026A CN110184571A CN 110184571 A CN110184571 A CN 110184571A CN 201910377026 A CN201910377026 A CN 201910377026A CN 110184571 A CN110184571 A CN 110184571A
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- CN
- China
- Prior art keywords
- reaction gas
- paint booth
- coating process
- high power
- power pulse
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The present invention relates to high power pulse application techniques fields, and disclose a kind of high power pulse coating process, the following steps are included: S1: paint booth pre-processes a1: carrying out surface cleaning to paint booth, it is ensured that the dirts such as coating chamber surface non-scale, iron rust, welding slag, dust and grease;A2: pass through hair dryer, paint booth inside is dried, Blower power must not be lower than 850W, and drying time is between 10min~15min, S2: the enough DC- generators of power are chosen, the minimum number of DC- generator is five, and wherein the quantity of guest machine is not less than two, S3: reaction gas sucks a1: reaction gas is sucked in paint booth, paint booth is equipped with gas flow testing device: the high power pulse coating process, it is pre-processed by S1, so that paint booth carries out surface cleaning, ensure coating chamber surface non-scale, iron rust, welding slag, the dirts such as dust and grease, so that it is guaranteed that measurement data is not accurate, the data entanglement of its non-property is avoided to occur.
Description
Technical field
The present invention relates to high power pulse application techniques field, specially a kind of high power pulse coating process.
Background technique
Study high voltage, high current, the technology of the generation and application of high power pulses.It is initially to answer material response real
It tests, flash X-ray is taken a picture and the needs of simulation effects of nuclear weapons and is occurred.The J in Britain's nuclear weapon research center in 1962.
C.Martin successfully combines existing Marx generator with transmission line technology, and it is short up to nanosecond to produce the duration
High power pulse, to open this brand-new field.Therewith, high-tech sector such as controlled thermonuclear fusion research, high power
The particle beams, high power laser, the development of high-power coherent radiation source technology and directed beams energy weapon, electromagnetic railgun are ground
System all puts forward new requirements the development of High pulse power technology, it is desirable to have high repetition frequency, the high power arteries and veins of long-life
It goes out existing.So High pulse power technology becomes extremely active one of the research field eighties.
The main parameters of high power pulse system have: pulse current (kilojoule~giggio), and pulse power (gigawatt~too
Watt), pulse current (kilo-ampere~megampere), pulse width (microsecond~nanosecond), pulse voltage.It will first be obtained from the low-power energy
The energy storage obtained gets up, these energy is then transformed into high power pulse through high-power pulse generator, and be transmitted to negative
It carries.The pulse duration being converted by certain energy is shorter, and the power obtained in load is higher.(such as DC fills the energy
Electric installation) provided by can be the energy (kinetic energy of such as huge flywheel turns) of electric energy, magnetic energy, chemical energy or other forms, but
It is in most cases electric energy.
In order to manufacture mix-crystal in sputtering technology according to prior art using synthesis target (compound target).So
The second material for describing the first basic material in DE60104709 and being introduced into the form of filling in the first basic material
The target of composition.Other method for manufacturing compound target is to squeeze to have under 100 μm with powdered-metal smelting process
Granular size two or more metal powders.
At this disadvantage is that, in order to realize that various concentration ratio must use other targets in mixing crystal layer respectively.It is right
When this manufactures this target type in coating, layer combination is not combined unanimously with the output of target material.
In documents application number CN201380037123.Data ginseng in the high power pulse coating process proposed in 6
There is the micro error in equivalent situation in number, wherein being 70% to the consumption of maximum reaction gas, limit range and there is dispute, and
Pretreatment work before its coating gas experiment is not in place, will lead to the not accurate of measurement data.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides a kind of high power pulse coating process, have measurement data essence
The advantages that quasi-, solves the problems, such as proposed in above-mentioned background technique.
(2) technical solution
To achieve the above object, the invention provides the following technical scheme: a kind of high power pulse coating process, including with
Lower step:
S1: paint booth pretreatment:
A1: surface cleaning is carried out to paint booth, it is ensured that coating chamber surface non-scale, iron rust, welding slag, dust and grease
Equal dirts;
A2: by hair dryer, being dried paint booth inside, and Blower power must not be lower than 850W, and drying time
Between 10min~15min;
S2: choosing the enough DC- generators of power, the minimum number of DC- generator is five, and wherein guest machine
Quantity is not less than two;
S3: reaction gas sucking:
A1: reaction gas is sucked in paint booth, and paint booth is equipped with gas flow testing device;
A2: it is monitored using gas flow testing device to wherein measuring respective reaction gas flow in paint booth, number
Value records and retains;
A3: the reaction gas partial pressure that measurement occupies the majority in paint booth, without lighting plasma;
S4: reaction gas measurement:
A1: the data of the subdivided step a2 record in S2 are subjected to registration reservation;
A2: reaction gas is sucked in paint booth and wherein measures respective reaction gas flow and at the same time measurement is in coating
The reaction gas partial pressure to occupy the majority in room, lights plasma;
S5: the sub-step a3: the reaction gas that measurement occupies the majority in paint booth in the sucking of step S2 reaction gas is repeated
Partial pressure, without lighting plasma and S3: the sub-step a2 of reaction gas measurement: reaction gas being sucked in paint booth
Wherein respective reaction gas flow is measured and at the same time the reaction gas partial pressure that measurement occupies the majority in paint booth, is lighted
Plasma, and carrying out step repetition in the case where multiple and different reaction gas flows, data carry out registration reservation;
S6: the discriminating measurement of reacting gas stream magnitude:
A1: using given partial pressure as major premise;
A2: in the case where major premise by the reacting gas stream magnitude measured in the case where no plasma from
The reacting gas stream magnitude measured in the case where having plasma subtracts and is equal to difference with reaction gas consumption.
Preferably, the nitrogen gas is used as reaction gas.
Preferably, the power of the DC- generator by means of switching sequence and preferably not interrupt power conveying
Apply on different target.
Preferably, one or more of coating parametric measurement reaction gas are consumed and are selected by this for coating
One or more of coating parameters to be painted on execution in transition mode and reaction gas consumption is by adjusting the painting
Parameter is filled to adjust, adjustable range is fitted referring to the variation of the data in the data recorded of the subdivided step a2 in S2 and S5
Degree is adjusted.
Preferably, the coating parameter is reaction gas partial pressure and reaction gas consumption is so adjusted, and is made
It obtains it and is generally at least maximum reaction gas consumes 50%~60%, wherein the reaction gas partial pressure is in the area
It is adjusted in domain, the limit inferior in the region causes the limes superiors in the maximum reaction gas consumption and the region to cause most
The 60% of big reaction gas consumption.
Preferably, the pulse duration settings duration range, so that reaction gas consumption is pressed with reaction gas part
Power is in the increase and decrease of correlation, therefore coating process is stablized
Preferably, the pulse power setting range, so that reaction gas consumption is to reaction gas partial pressure in related
Property increase and decrease, therefore coating process stablize.
(3) beneficial effect
Compared with prior art, the present invention provides a kind of high power pulse coating process, have it is following the utility model has the advantages that
1, the high power pulse coating process, is pre-processed by S1 paint booth, so that paint booth carries out surface cleaning, really
The dirts such as coating chamber surface non-scale, iron rust, welding slag, dust and grease are protected to avoid so that it is guaranteed that measurement data is not accurate
The data entanglement of its non-property occurs.
2, the high power pulse coating process, by alternative to equipment, the quantity control of DC- generator and its is spare
The indwelling of machine, it is ensured that be not interrupted during experimental method, influence data and involved and influenced.
Specific embodiment
The present invention provides a kind of technical solution: a kind of high power pulse coating process, comprising the following steps:
S1: paint booth pretreatment:
A1: surface cleaning is carried out to paint booth, it is ensured that coating chamber surface non-scale, iron rust, welding slag, dust and grease
Equal dirts;
A2: by hair dryer, being dried paint booth inside, and Blower power must not be lower than 850W, and drying time
Between 10min~15min;
S2: choosing the enough DC- generators of power, the minimum number of DC- generator is five, and wherein guest machine
Quantity is not less than two;
S3: reaction gas sucking:
A1: reaction gas is sucked in paint booth, and paint booth is equipped with gas flow testing device;
A2: it is monitored using gas flow testing device to wherein measuring respective reaction gas flow in paint booth, number
Value records and retains;
A3: the reaction gas partial pressure that measurement occupies the majority in paint booth, without lighting plasma;
S4: reaction gas measurement:
A1: the data of the subdivided step a2 record in S2 are subjected to registration reservation;
A2: reaction gas is sucked in paint booth and wherein measures respective reaction gas flow and at the same time measurement is in coating
The reaction gas partial pressure to occupy the majority in room, lights plasma;
S5: the sub-step a3: the reaction gas that measurement occupies the majority in paint booth in the sucking of step S2 reaction gas is repeated
Partial pressure, without lighting plasma and S3: the sub-step a2 of reaction gas measurement: reaction gas being sucked in paint booth
Wherein respective reaction gas flow is measured and at the same time the reaction gas partial pressure that measurement occupies the majority in paint booth, is lighted
Plasma, and carrying out step repetition in the case where multiple and different reaction gas flows, data carry out registration reservation;
S6: the discriminating measurement of reacting gas stream magnitude:
A1: using given partial pressure as major premise;
A2: in the case where major premise by the reacting gas stream magnitude measured in the case where no plasma from
The reacting gas stream magnitude measured in the case where having plasma subtracts and is equal to difference with reaction gas consumption.
Nitrogen gas is used as reaction gas.
The power of DC- generator by means of switching sequence and preferably not interrupt power conveying on different target
Apply.
One or more coating parametric measurement reaction gas are consumed and are selected by this for the one or more of coating
A coating parameter to be painted on to be executed and reaction gas consumption is adjusted by adjusting the coating parameter in transition mode
Section, adjustable range carry out appropriate adjusting referring to the variation of the data and the data in S5 of the subdivided step a2 record in S2.
Coating parameter is reaction gas partial pressure and reaction gas consumption is so adjusted, so that it is substantially
The 50%~60% of at least maximum reaction gas consumption, wherein the reaction gas partial pressure is adjusted in this region, institute
The limit inferior for stating region causes the limes superiors in the maximum reaction gas consumption and the region that maximum reaction gas is caused to disappear
The 60% of consumption.
Pulse duration settings duration range, so that reaction gas consumption is in correlation with reaction gas partial pressure
Increase and decrease, therefore coating process stablize
Pulse power setting range, so that reaction gas consumes the increase and decrease with reaction gas partial pressure in correlation, therefore
Coating process is stablized.
Below in conjunction with the embodiment of the present invention, technical solution in the embodiment of the present invention is clearly and completely retouched
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (7)
1. a kind of high power pulse coating process, which comprises the following steps:
S1: paint booth pretreatment:
A1: surface cleaning is carried out to paint booth, it is ensured that coating chamber surface non-scale, iron rust, welding slag, dust and grease etc. are dirty
Object;
A2: by hair dryer, being dried paint booth inside, and Blower power must not be lower than 850W, and drying time exists
Between 10min~15min;
S2: choosing the enough DC- generators of power, and the minimum number of DC- generator is five, and wherein the quantity of guest machine is not
Lower than two;
S3: reaction gas sucking:
A1: reaction gas is sucked in paint booth, and paint booth is equipped with gas flow testing device;
A2: being monitored using gas flow testing device to wherein measuring respective reaction gas flow in paint booth, numerical value note
It records and retains;
A3: the reaction gas partial pressure that measurement occupies the majority in paint booth, without lighting plasma;
S4: reaction gas measurement:
A1: the data of the subdivided step a2 record in S2 are subjected to registration reservation;
A2: reaction gas is sucked in paint booth and wherein measures respective reaction gas flow and at the same time measurement accounts in paint booth
Most reaction gas partial pressures, lights plasma;
S5: the sub-step a3: the reaction gas part that measurement occupies the majority in paint booth in the sucking of step S2 reaction gas is repeated
Pressure, without lighting plasma and S3: the sub-step a2 of reaction gas measurement: reaction gas being sucked in paint booth and is wherein surveyed
Amount respective reaction gas flow lights plasma and at the same time the reaction gas partial pressure that measurement occupies the majority in paint booth
Body, and carrying out step repetition in the case where multiple and different reaction gas flows, data carry out registration reservation;
S6: the discriminating measurement of reacting gas stream magnitude:
A1: using given partial pressure as major premise;
A2: in the case where major premise by the reacting gas stream magnitude measured in the case where no plasma from have etc. from
The reacting gas stream magnitude measured in the case where daughter subtracts and is equal to difference with reaction gas consumption.
2. a kind of high power pulse coating process according to claim 1, which is characterized in that the nitrogen gas is as anti-
Gas is answered to use.
3. a kind of high power pulse coating process according to claim 1, which is characterized in that the function of the DC- generator
Rate does not apply on different target interrupt power conveying by means of switching sequence and preferably.
4. a kind of high power pulse coating process according to claim 1, which is characterized in that one or more of coatings
Parametric measurement reaction gas is consumed and selected by this to be painted on for one or more of coating parameters of coating
It crosses in mode and executes and reaction gas consumption is adjusted by adjusting the coating parameter, adjustable range is referring to the subdivision in S2
The variation of the data and the data in S5 of step a2 record carries out appropriate adjusting.
5. a kind of high power pulse coating process according to claim 1, which is characterized in that the coating parameter is reaction
Gas partial pressure and reaction gas consumption so adjusting, so that it is generally at least maximum reaction gas consumption
50%~60%, wherein the reaction gas partial pressure is adjusted in this region, the limit inferior in the region cause it is described most
The limes superiors in big reaction gas consumption and the region leads to the 60% of maximum reaction gas consumption.
6. a kind of high power pulse coating process according to claim 1, which is characterized in that the pulse duration sets
Periodically long range, so that reaction gas consumes the increase and decrease with reaction gas partial pressure in correlation, therefore coating process is stablized.
7. a kind of high power pulse coating process according to claim 1, which is characterized in that the pulse power sets model
It encloses, so that reaction gas consumes the increase and decrease with reaction gas partial pressure in correlation, therefore coating process is stablized.
Priority Applications (1)
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CN201910377026.0A CN110184571A (en) | 2019-05-07 | 2019-05-07 | High power pulse coating process |
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CN201910377026.0A CN110184571A (en) | 2019-05-07 | 2019-05-07 | High power pulse coating process |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104272429A (en) * | 2011-12-05 | 2015-01-07 | 欧瑞康贸易股份公司(特吕巴赫) | Reactive sputtering process |
CN104411863A (en) * | 2012-07-10 | 2015-03-11 | 欧瑞康贸易股份公司(特吕巴赫) | High-power pulse coating method |
CN105154838A (en) * | 2015-09-22 | 2015-12-16 | 华南理工大学 | Method for depositing film through high ionization rate high power pulse magnetron sputtering |
CN109154077A (en) * | 2017-04-28 | 2019-01-04 | 应用材料公司 | For clean the vacuum system used in manufacture OLED device method, on substrate vacuum deposition come manufacture OLED device method and on substrate vacuum deposition come the equipment that manufactures OLED device |
-
2019
- 2019-05-07 CN CN201910377026.0A patent/CN110184571A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104272429A (en) * | 2011-12-05 | 2015-01-07 | 欧瑞康贸易股份公司(特吕巴赫) | Reactive sputtering process |
CN104411863A (en) * | 2012-07-10 | 2015-03-11 | 欧瑞康贸易股份公司(特吕巴赫) | High-power pulse coating method |
CN105154838A (en) * | 2015-09-22 | 2015-12-16 | 华南理工大学 | Method for depositing film through high ionization rate high power pulse magnetron sputtering |
CN109154077A (en) * | 2017-04-28 | 2019-01-04 | 应用材料公司 | For clean the vacuum system used in manufacture OLED device method, on substrate vacuum deposition come manufacture OLED device method and on substrate vacuum deposition come the equipment that manufactures OLED device |
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