CN110177440B

CN110177440B - Electronic device and preparation method

Info

Publication number: CN110177440B
Application number: CN201910431795.4A
Authority: CN
Inventors: 周意保
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-05-22
Filing date: 2019-05-22
Publication date: 2021-04-09
Anticipated expiration: 2039-05-22
Also published as: CN110177440A

Abstract

The application provides an electronic equipment, electronic equipment includes casing, circuit board, connecting piece, and sealing member, and the casing includes metal base member, and locates the plastic portion of metal base member towards the inside surface of electronic equipment, and metal base member and plastic portion form first recess, and the one end and the metal base member electricity of connecting piece are connected, and the other end meets with the circuit board, and the sealing member is located in the first recess in order to seal waterproof to first recess. One end of the connecting piece is directly electrically connected with the metal matrix, and the other end of the connecting piece is connected with the circuit board, so that the circuit board is electrically connected with the shell, and the circuit board is grounded. And this application is through addding the sealing member, arrange the sealing member in first recess to laminating completely and sealed through making the sealing member to first recess, thereby make water can't flow into the inside destruction of electronic equipment with the device through first recess, solve the problem that electronic equipment leaked, improved electronic equipment's waterproof performance. The application also provides a preparation method of the electronic equipment.

Description

Electronic device and preparation method

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to electronic equipment and a preparation method.

Background

With the continuous development of electronic devices, the electronic devices are favored by users due to their portability and rich and varied operability. But at the same time, the expectations and requirements of users for electronic devices are also increasing. For example, electronic devices are required to have excellent waterproof performance. However, in the current electronic device, the waterproof performance of the housing is poor, and water enters the electronic device from the housing to damage devices in the electronic device, which finally has a great influence on the electronic device.

Disclosure of Invention

In view of this, the present application provides an electronic device and a manufacturing method thereof, in which one end of a connecting member is electrically connected to the metal substrate, and the other end is connected to the circuit board, so as to achieve grounding of the circuit board. And then, the sealing element is additionally arranged to completely attach and seal the first groove, so that water cannot flow into the electronic equipment through the joint of the plastic part and the metal matrix to damage devices in the electronic equipment, the safety of the devices in the electronic equipment is ensured, and the problem of water leakage of the electronic equipment is solved.

The application first aspect provides an electronic equipment, electronic equipment includes casing, circuit board, connecting piece and sealing member, the casing includes metal base, and locates metal base orientation the plastic portion on the inside surface of electronic equipment, metal base with plastic portion forms first recess, so that metal base exposes, the one end of connecting piece with metal base electricity is connected, the other end with the circuit board meets, the sealing member is located in order to be right in the first recess seal waterproof.

The electronic equipment that this application first aspect provided is through directly being connected with metal matrix electricity with the one end of connecting piece, and the other end meets with the circuit board to realize the electric connection of circuit board and casing, make circuit board ground connection. And this application is through addding the sealing member, arrange the sealing member in first recess, and laminate completely and seal first recess through making the sealing member, thereby seal the junction of the plastic portion on casing surface and metal substrate, thereby make water can't flow into the inside device destruction with electronic equipment of electronic equipment through first recess, guaranteed the security of the inside device of electronic equipment, solve the problem that electronic equipment leaked, greatly improved electronic equipment's waterproof performance.

A second aspect of the present application provides a method for manufacturing an electronic device, including:

providing a metal matrix;

forming a plastic part on the metal base body, wherein the metal base body and the plastic part form a first groove;

forming a seal within the first groove to seal the first groove against water; and

and providing a connecting piece and a circuit board, wherein one end of the connecting piece is electrically connected with the metal matrix, and the other end of the connecting piece is connected with the circuit board.

The manufacturing method provided by the second aspect of the application has the advantages of simple workpiece and low cost, can be used for manufacturing the shell and the electronic equipment with excellent waterproof performance while electrically connecting the circuit board and the shell, and has great practicability.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be described below.

Fig. 1 is a schematic structural diagram of an electronic device according to a first embodiment of the present application.

Fig. 2 is a schematic structural diagram of an electronic device when the housing is a front shell in the embodiment of the present application.

Fig. 3 is a schematic structural diagram of an electronic device when the housing is a rear housing in the embodiment of the present application.

Fig. 4 is a schematic structural view of a housing in the related art.

Fig. 5 is a schematic view of an electronic device when the sealing member fills the first groove according to an embodiment of the disclosure.

Fig. 6 is a schematic structural diagram of an electronic device according to a second embodiment of the present application.

Fig. 7 is a schematic structural diagram of an electronic device according to a third embodiment of the present application.

Fig. 8 is a schematic structural diagram of a protruding portion and a plastic portion in a housing according to an embodiment of the present application.

Fig. 9 is a schematic structural view of a boss and a plastic part in a housing according to another embodiment of the present application.

Fig. 10 is a schematic structural diagram of an electronic device according to a fourth embodiment of the present application.

Fig. 11 is a schematic structural diagram of an electronic device according to a fifth embodiment of the present application.

Fig. 12 is a schematic structural diagram of an electronic device according to a sixth embodiment of the present application.

FIG. 13 is a schematic structural diagram of an electronic device according to a seventh embodiment of the present application

Fig. 14 is a schematic structural diagram of an electronic device according to an eighth embodiment of the present application.

Fig. 15 is a schematic structural diagram of a second groove in the first embodiment of the present application.

Fig. 16 is a schematic structural diagram of a second groove in the second embodiment of the present application.

Fig. 17 is a schematic structural diagram of a second groove in a third embodiment of the present application.

Fig. 18 is a schematic structural diagram of a second groove in a fourth embodiment of the present application.

Fig. 19 is a schematic structural diagram of a third groove in an embodiment of the present application.

Fig. 20 is a schematic structural diagram of a third groove in another embodiment of the present application.

Fig. 21 is a schematic view of a plastic part and a metal base in an electronic device according to an embodiment of the present disclosure.

Fig. 22 is a schematic view illustrating a connection relationship between a connector and a metal substrate in an electronic device according to an embodiment of the present application.

Fig. 23 is a schematic view illustrating a connection relationship between a connector and a metal substrate in an electronic device according to another embodiment of the present application.

Fig. 24 is a schematic view illustrating a connection relationship between a connector and a metal substrate in an electronic device according to still another embodiment of the present application.

Fig. 25 is a process flow diagram of a method of fabricating an electronic device in an embodiment of the present application.

Fig. 26 is a process flow diagram of a method of fabricating an electronic device in accordance with another embodiment of the present application.

Fig. 27 is a process flow diagram of a method of making an electronic device in accordance with yet another embodiment of the present application.

Reference numerals:

the display panel comprises electronic equipment-1, a shell-10, a back plate-11, a frame-12, an accommodating space-13, a metal base-100, a flat part-101, a convex part-102, a conductive part-103, a first conductive sub-part-104, a second conductive sub-part-105, a plastic part-110, a first groove-120, a second groove-130, a third groove-140, a fastener-150, a first positioning part-160, a second positioning part-170, a bent part-180, a sealing part-20, a connecting part-30, a circuit board-40 and a display screen-50.

Detailed Description

The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

The present application provides an electronic device 1. The electronic device 1 provided by the present application includes, but is not limited to, a mobile terminal such as a mobile phone, a tablet Computer, a notebook Computer, a palmtop Computer, a Personal Computer (PC), a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a wearable device, a smart band, a pedometer, and a fixed terminal such as a Digital TV, a desktop Computer, and the like.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to a first embodiment of the present application. The embodiment of the application provides an electronic device 1, and the electronic device 1 comprises a shell 10, a circuit board 40, a connecting piece 30 and a sealing piece 20. The housing 10 includes a metal base 100 and a plastic portion 110 disposed on a surface of the metal base 100 facing the inside of the electronic device 1. The metal base 100 and the plastic part 110 form a first groove 120. One end of the connector 30 is electrically connected to the metal base 100, and the other end is connected to the circuit board 40. The sealing member 20 is disposed in the first groove 120 to seal the first groove 120 against water. In the embodiments of the present application, "electrically connected" includes, but is not limited to, direct electrical connection or indirect electrical connection. For example, the direct electrical connection means that one end of the connection member 30 is connected to the metal substrate 100, so that the connection member 30 is in direct contact with the metal substrate 100, thereby achieving the purpose of direct electrical connection. The indirect electrical connection means that another conductive member is further disposed between one end of the connecting member 30 and the metal substrate 100, that is, one end of the connecting member 30 is connected to the conductive member, and the conductive member is connected to the metal substrate 100, so that the one end of the connecting member 30 and the metal substrate 100 are indirectly electrically connected through the conductive member. "abut" includes, but is not limited to, abutting or connecting, for example, the other end of the connecting member 30 can abut against the circuit board 40, thereby achieving the abutting effect; or the other end of the connecting member 30 may be connected to the circuit board 40, so as to achieve the connection effect. As shown in fig. 1, in the embodiment of the present application, one end of the connector 30 directly extends into the bottom of the first groove 120 and is connected to the metal base 100 in the first groove 120, and the other end of the connector 30 abuts against the circuit board 40. Second, the sealing member 20 seals the first groove 120 entirely to solve the problem of water leakage from the electronic device 1.

The terms "first", "second" and "third" as used in the present embodiments and in the following first groove 120, second groove 130 and third groove 140 are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the technical features of the first groove 120, the second groove 130, and the third groove 140 provided herein may explicitly or implicitly include at least one of the features. The technical features including "first" and "second" mentioned later in this application can be understood correspondingly. Furthermore, references to "comprising" in this application are intended to cover non-exclusive inclusions, not just those listed, but may alternatively include additional non-listed elements.

Next, the present application first makes some brief descriptions of the components in the electronic device 1.

The circuit board 40 carries a plurality of electronic components, and the plurality of electronic components are responsible for processing data and information in the electronic device 1, and are one of important components in the electronic device 1. In the related art, due to a problem of electromagnetic Compatibility (EMC), the circuit board 40 needs to be grounded, that is, the circuit board 40 needs to be electrically connected to a metal part in the housing 10. Alternatively, the Circuit Board 40 includes, but is not limited to, a Printed Circuit Board (PCB), a Flexible Printed Circuit (FPC), or the like.

As can be seen from the above, the circuit board 40 needs to be electrically connected to the metal portion in the housing 10 due to the problem of electromagnetic compatibility. And the connector 30 is a device for connecting the circuit board 40 with the housing 10. Optionally, one end of the connector 30 abuts or is connected to the circuit board 40, so as to achieve the purpose of electrically connecting one end of the connector 30 to the circuit board 40. The other end of the connecting member 30 is electrically connected to the housing 10 directly or indirectly, so that the other end of the connecting member 30 is electrically connected to the housing 10, and finally the circuit board 40 is electrically connected to the housing 10, i.e. the circuit board 40 is grounded. Alternatively, the connector 30 may include, but is not limited to, a spring. The elastic sheet has certain elasticity and can be bent and moved in a certain space, so that the elastic sheet is better electrically connected with the shell 10 or the circuit board 40.

The housing 10 is a device in the electronic apparatus 1 for carrying, fixing, and supporting various devices in the electronic apparatus 1, and functions as a "skeleton" in the electronic apparatus 1. Alternatively, the housing 10 of the present application may be a front case or a rear case. In addition, the material of the case 10 generally includes metal to constitute the ground of the electronic device 1. The material of the housing 10 may also be a combination of metal and plastic, i.e. the housing 10 may include a metal portion and a plastic portion 110. Alternatively, a metal base 100 of a metal part is provided, and then plastic is injected on the metal base 100 to form a plastic substrate, and finally the complete housing 10 is formed.

The display screen 50 mainly plays a role in the electronic device 1, and is used for converting an electrical signal into an optical signal and emitting light to form an image, or characters, or video, etc. for a user to watch. And the display screen 50 may also receive user operations and partial instructions. The display screen 50 generally has a display area and a non-display area, and the display area is generally an area for displaying characters, pictures, videos, and the like. The non-display area is usually disposed at the periphery of the display area, and the non-display area is usually opaque to shield the traces in the display screen 50. Alternatively, the display screen 50 may not include a non-display area, and thus may be configured in a full screen configuration. Further alternatively, when the display screen 50 does not include the non-display area and forms a full screen, the distance sensor, the ambient light sensor, the front camera and the like may be disposed in the accommodating space 13 formed by the display screen 50 and the housing 10 and located in the display area of the display screen 50. In addition, the Display screen 50 provided in the present application may be, but is not limited to, a Liquid Crystal Display (LCD) screen or an Organic Light-Emitting Diode (OLED) screen. Alternatively, the display screen 50 provided herein may be a flexible display screen.

The mounting structure of the electronic apparatus 1 depends on the type of the housing 10. The following examples are given. Referring to fig. 2 and 3, fig. 2 is a schematic structural diagram of an electronic device when a housing is a front shell according to an embodiment of the present disclosure; fig. 3 is a schematic structural diagram of an electronic device when the housing is a rear housing in the embodiment of the present application. As shown in fig. 2, when the housing 10 is a front case, the circuit board 40 is disposed on one side of the housing 10 and electrically connected to the metal base 100 in the housing 10 through the connection member 30. The display screen 50 is disposed at the other side of the housing 10, and the display screen 50 is also electrically connected to the housing 10. As shown in fig. 3, when the housing 10 is a rear shell, the housing 10 includes a back plate 11 and a frame 12 bent and extended from a periphery of the back plate 11, the frame 12 and the back plate 11 form an accommodating space 13, and the circuit board 40 is disposed in the accommodating space 13 and electrically connected to the metal base 100 in the housing 10 through the connecting member 30. The display screen 50 is also disposed in the receiving space 13 and connected to the frame 12, and the display screen 50 is also electrically connected to the housing 10. It should be understood that the present application is only exemplified by two typical mounting structures of the electronic device 1, and other mounting structures of the electronic device 1 also belong to the protection scope of the present application.

The plastic part 110 of the housing 10 of the present application is generally injection molded onto the surface of the metal substrate 100 by an injection molding process, and the plastic part 110 and the metal substrate 100 belong to two completely different substances, so that the joint between the plastic part 110 and the metal substrate 100 cannot be completely attached and sealed, and water can pass through the gap between the plastic part 110 and the metal substrate 100, thereby causing a water leakage problem. In the related art, at least one side surface of the metal base 100 is generally covered with the plastic part 110, so that at least one side surface of the housing 10 is plastic, and thus there is no connection point between the plastic and the metal base 100, so that water cannot enter from one side of the housing 10 or flow out from one side of the housing 10. Thus, water does not enter the electronic device 1, thereby solving the problem of water leakage.

In the related art, due to the problem of electromagnetic compatibility, one side of the housing 10 needs to be electrically connected to the display screen 50, so as to ground the display screen 50, and therefore, a part of the metal substrate 100 needs to be exposed at one side of the housing 10 to be electrically connected to the display screen 50. The other side of the housing 10 needs to be electrically connected to the circuit board 40 to ground the circuit board 40, so that a part of the metal substrate 100 on the other side of the housing 10 needs to be exposed to electrically connect to the circuit board 40. Therefore, the plastic part 110 cannot completely cover the surface of the metal base 100 on both sides of the housing 10, so that the joint between the plastic part 110 and the metal base 100 exists on both sides of the housing 10, and therefore, water flows in from one side of the housing 10 and flows out from the other side, so that the water enters into the electronic device 1, and great damage is caused to each device inside the electronic device 1, thereby greatly affecting the performance of the electronic device 1.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a housing in the related art. As shown in fig. 4, the plastic part 110 in the housing 10 covers a part of the surface of the metal substrate 100, so that a first groove 120 is formed on the metal substrate 100 and the plastic part 110 on the housing 10 to expose the metal substrate 100. One end of the connector 30 is electrically connected to the metal base 100 and the other end is connected to the circuit board 40. A similar configuration is also provided for the other side of the display screen 50. However, also due to the above structure, the joint between the plastic part 110 and the metal base 100 is formed on both side surfaces of the housing 10, and thus water leakage occurs. In addition, the position of the first groove 120 in the housing 10 is not specifically limited in the present application.

Therefore, in order to solve the above problem, the present application electrically connects the circuit board 40 to the housing 10 by directly electrically connecting one end of the connecting member 30 to the metal base 100 and connecting the other end to the circuit board 40, so that the circuit board 40 is grounded. And this application is through addding sealing member 20, arrange sealing member 20 in first recess 120, and laminate completely and sealed through making sealing member 20 to first recess 120, thereby it is waterproof to seal the junction of plastic portion 110 and metal matrix 100 to casing 10 side surface, thereby make water can't flow into inside each device destruction in electronic equipment 1 through first recess 120, the security of the inside device of electronic equipment 1 has been guaranteed, the problem of electronic equipment 1 leaks is solved, electronic equipment 1's waterproof performance has greatly been improved. In addition, the electronic device 1 provided by the present application not only can effectively prevent water, but also can prevent dust or other impurities from entering the inside of the housing 10. The other side of the housing 10, i.e. the structure of the housing 10 and the display screen 50, can also be designed similarly, and the description of the present application is omitted here. The specific structure of the housing 10, the sealing member 20, the connector 30, and the circuit board 40 and how they are engaged with each other will be described in detail below.

Additionally, for seal 20, seal 20 of the present application includes, but is not limited to, any one or combination of silicone, waterproof foam, polystyrene glue, polycarbonate glue, nylon glue, polyurethane glue. When the sealing member 20 is made of polystyrene glue, polycarbonate glue, nylon glue or polyurethane glue, sealing glue is added into the first groove 120 during the preparation process, and the sealing glue has cohesiveness, so that the sealing glue can be effectively bonded in the first groove 120, and the sealing glue can be completely attached to and sealed with the first groove 120. After the sealant water is solidified, the sealing member 20 is formed, so that the first groove 120 can be well sealed and waterproof. When the sealing member 20 is made of silicone rubber or waterproof foam, the sealing member 20 has elasticity, the sealing member 20 is connected with the side wall of the first groove 120, and the sealing member 20 is in a compressed state. The sealing member 20 has elasticity, so when the sealing member 20 is connected to the side wall of the first groove 120 and the sealing member 20 is in a compressed state, the sealing member 20 generates a resilience force opposite to the direction of the compression force, and the resilience force deforms the sealing member 20, so that a gap between the sealing member 20 and the side wall of the first groove 120 is filled, and the first groove 120 is completely attached and sealed, so that water cannot flow into the electronic device 1 through the first groove 120.

Referring to fig. 5, fig. 5 is a schematic view of an electronic device when a first groove is filled with a sealing member according to an embodiment of the present disclosure. Regarding the position of the sealing member 20, in an embodiment of the present application, as shown in fig. 1, a side of the sealing member 20 facing away from the flat portion 101 is lower than a side of the plastic portion 110 facing away from the flat portion 101, that is, the sealing member 20 does not fill the first groove 120. At this time, the sealing element 20 only needs to seal part of the side wall of the first groove 120 to prevent water from blocking in the first groove 120, and the water is prevented from flowing into the electronic device 1 through the first groove 120, so that the waterproof performance of the electronic device 1 can be improved, the using amount of the sealing element 20 can be saved, the weight of the electronic device 1 is reduced, and the cost of the electronic device 1 is reduced. In another embodiment of the present application, as shown in fig. 5, a side of the sealing member 20 facing away from the flat portion 101 is flush with a side of the plastic portion 110 facing away from the flat portion 101, that is, the sealing member 20 fills the first groove 120. At this time, the sealing element 20 completely seals the first groove 120, so that the waterproof performance is further improved, and as one side of the sealing element 20 away from the flat part 101 is flush with one side of the plastic part 110 away from the flat part 101, and other devices are suitably arranged on the flush surface of the sealing element 20, other devices can be arranged on the surfaces of the plastic part 110 and the sealing element 20, so that the space in which devices can be arranged inside the electronic device 1 is increased, and more devices can be arranged in the electronic device 1.

Please refer to fig. 6, fig. 6 is a schematic structural diagram of an electronic device according to a second embodiment of the present application. The electronic device 1 provided in this embodiment has substantially the same structure as the electronic device 1 provided in the first embodiment of this application, except that, in this embodiment, the metal base 100 includes a flat portion 101 and a protruding portion 102 extending from the flat portion 101 in a bent manner, the protruding portion 102 and the plastic portion 110 form the first groove 120, and one end of the connecting member 30 is connected to the protruding portion 102.

In this embodiment, a metal base material is first provided, and then the metal base material is partially protruded away from the surface of the metal base material, so that the metal base 100 is obtained. Therefore, the part of the metal base material which is not bent and protruded forms a flat part 101, the part of the metal base material surface which is bent and protruded forms a convex part 102, and one end of the connecting piece 30 is connected with the convex part 102. Thus, it is possible to connect with the metal base 100 without extending one end of the connecting member 30 into the bottom of the first groove 120, thereby reducing the difficulty of connection. In addition, the order of preparation of the first embodiment of the present application and the second embodiment of the present application may be different. For example, in the first embodiment of the present application, one end of the connecting member 30 may be connected to the metal base 100, and then the sealing member 20 may be inserted into the first groove 120. In the second embodiment of the present invention, since a portion of the metal substrate 100 is protruded, the sealing member 20 may be first added to the first groove 120, and then one end of the connecting member 30 is connected to the protrusion 102, and since there is no shielding of the sealing member 20, the difficulty of manufacturing is greatly reduced.

The protrusion 102 and the plastic part 110 form the first groove 120. The sidewall of the protruding portion 102 and the sidewall of the plastic portion 110 are enclosed to form a first groove 120, and for the specific structure of the first groove 120, the structure of the flat portion 101 and the protruding portion 102 is related. The following examples are given. The vertical distance between the bent part 180 of the metal substrate 100 and the plastic part 110 is greater than or equal to 0. Please refer to fig. 7, fig. 7 is a schematic structural diagram of an electronic device according to a third embodiment of the present application. The electronic device 1 according to the third embodiment of the present application has substantially the same structure as the electronic device 1 according to the second embodiment of the present application, except that the vertical distance between the bent portion 180 of the metal base 100 and the plastic portion 110 is equal to 0 in the present embodiment.

As is known from the above, the metal base 100 includes a flat portion 101 and a protruding portion 102 extending from the flat portion 101 by protruding the metal base in a direction away from the surface of the metal base. Therefore, the connection between the flat part 101 and the convex part 102 is the bending part 180 of the metal base 100. As shown in fig. 6, when the vertical distance between the bent portion 180 of the metal base 100 and the plastic portion 110 is greater than 0, that is, the flat portion 101 protrudes out of the plastic portion 110, so that the bent portion 180 of the metal base 100 and the plastic portion 110 are spaced apart from each other. At this time, the plastic part 110, the convex part 102 and the flat part 101 form the first groove 120, which greatly reduces the difficulty in manufacturing the convex part 102. As shown in fig. 7, when the vertical distance between the bent portion 180 of the metal base 100 and the plastic portion 110 is equal to 0, the bent portion 180 of the metal base 100 and the plastic portion 110 are directly connected. It can also be understood that the plastic part 110 completely covers the flat part 101 in bending connection with the convex part 102. The plastic part 110 and the protrusion 102 form a first groove 120. And because the side wall of the convex part 102 is obliquely arranged, the preparation difficulty of the sealing element 20 is greatly reduced.

Please refer to fig. 8 and 9 together, fig. 8 is a schematic structural diagram of a protrusion and a plastic part in a housing according to an embodiment of the present application; fig. 9 is a schematic structural view of a boss and a plastic part in a housing according to another embodiment of the present application. As shown in fig. 8, the housing 10 provided in the embodiment of the present application has substantially the same structure as the housing 10 shown in fig. 4, except that, in the embodiment, opposite sides of the protrusion 102 are connected to the plastic part 110. Alternatively, as shown in fig. 9, the housing 10 provided in the embodiment of the present application has substantially the same structure as the housing 10 shown in fig. 4, except that, in the embodiment, the protrusion 102 is spaced apart from the plastic part 110.

The configuration of the protrusion 102 and the plastic portion 110 will affect the shape and number of the first grooves 120. As shown in fig. 8, the sidewalls of the opposite sides of the protrusion 102 abut against the plastic part 110, and at this time, the protrusion 102 separates two first grooves 120, and the first grooves 120 are disposed on the opposite sides of the protrusion 102. Due to the arrangement of the protruding portion 102, the volume of the first groove 120 is reduced, so that the amount of the sealing member 20 is reduced, and the cost of the electronic device 1 is reduced. As shown in fig. 9, the protrusion 102 and the plastic part 110 are spaced apart from each other, that is, the sidewall of the protrusion 102 and the plastic part 110 are spaced apart from each other, at this time, the protrusion 102 and the plastic part 110 form an annular first groove 120, and the first groove 120 is disposed around the protrusion 102. At this time, the sealing member 20 can attach and seal all the joints between the metal base 100 and the plastic part 110 in the first groove 120, so that the waterproof effect is greatly improved.

Please refer to fig. 10, fig. 10 is a schematic structural diagram of an electronic device according to a fourth embodiment of the present application. The electronic device 1 according to this embodiment has substantially the same structure as the electronic device 1 according to the first embodiment of the present application, except that in this embodiment, the metal base 100 includes a flat portion 101 and a conductive portion 103 protruding on the surface of the flat portion 101, the conductive portion 103 and the plastic portion 110 form the first groove 120, and one end of the connecting member 30 is connected to the conductive portion 103.

In the present embodiment, the conductive portion 103 is provided on the surface of the flattened portion 101 in the first groove 120, and the conductive portion 103 is connected to the flattened portion 101. Therefore, the metal matrix 100 does not need to be bent and protruded to form the convex part 102, and the preparation difficulty is reduced. In addition, the metal substrate 100 may be an integral structure, that is, the conductive portion 103 is a part of the flat portion 101, and the conductive portion 103 and the flat portion 101 are integrally formed. Alternatively, the metal substrate 100 may be a separate structure, in which the conductive portion 103 is not integrally formed with the flat portion 101, and the conductive portion 103 is additionally disposed on the surface of the flat portion 101. The connecting member 30 is now in indirect electrical connection with the flat portion 101. Since the conductive portion 103 has a conductive property, electrical connection of the circuit board 40 and the flat portion 101 can be achieved. Optionally, the conductive portion 103 and the planarized portion 101 are made of the same material, so that the connection between the conductive portion 103 and the planarized portion 101 is more compact and reliable. Further alternatively, the conductive portion 103, the flat portion 101, and the connecting member 30 are made of the same material, so that the connection tightness and reliability between the conductive portion 103, the flat portion 101, and the connecting member 30 are further improved.

Referring to fig. 11, fig. 11 is a schematic structural diagram of an electronic device according to a fifth embodiment of the present application. The electronic device 1 according to the fifth embodiment of the present application has substantially the same structure as the electronic device 1 according to the fourth embodiment of the present application, except that in the present embodiment, the conductive portion 103 includes a first conductive sub-portion 104 connected to the flat portion, and a second conductive sub-portion 105 protruding from a side of the first conductive sub-portion 104 away from the flat portion 101, and the second conductive sub-portion 105 and the plastic portion 110 form the first groove 120.

The first conductive sub-portion 104 is disposed on the surface of the flat portion 101, the sidewall of the first conductive sub-portion 104 abuts against the plastic portion 110, and the second conductive sub-portion 105 is formed by protruding and extending the first conductive sub-portion 104 away from the flat portion 101, that is, the conductive portion 103 is an integrated structure, and the first conductive sub-portion 104 and the second conductive sub-portion 105 are integrally formed. The second conductive sub-portion 105 and the plastic portion 110 form the first groove 120. The first conductive sub-portion 104 moves the first groove 120 upward, that is, the first groove 120 is disposed near a side of the conductive portion 103 away from the flat portion 101, so that the depth of the first groove 120 is reduced, and the difficulty in manufacturing the sealing member 20 is reduced.

Similarly, the second conductive sub-portion 105 and the plastic portion 110 form the first groove 120. In the present application, the sidewall of the second conductive sub-portion 105 and the sidewall of the plastic portion 110 are enclosed to form a first groove 120. The specific structure of the first recess 120 is related to the structure of the second conductive sub-portion 105. The following examples are given. Referring to fig. 12, fig. 12 is a schematic structural diagram of an electronic device according to a sixth embodiment of the present application. In one embodiment of the present invention, as shown in fig. 11, a side of the second conductive sub-portion 105 close to the first conductive sub-portion 104 is spaced apart from the plastic portion 110, and the second conductive sub-portion 105, the plastic portion 110 and the first conductive sub-portion 104 form a first groove 120. In another embodiment of the present application, as shown in fig. 12, the electronic device 1 provided in this embodiment has a structure substantially the same as that of the electronic device 1 provided in fig. 11, except that in this embodiment, one side of the second conductive sub-portion 105 close to the first conductive sub-portion 104 abuts against the plastic portion 110, and at this time, the second conductive sub-portion 105 and the plastic portion 110 form the first groove 120.

Referring to fig. 13 and 14, fig. 13 is a schematic structural diagram of an electronic device according to a seventh embodiment of the present application; fig. 14 is a schematic structural diagram of an electronic device according to an eighth embodiment of the present application. In the embodiment of the present application, the size of the first groove 120 near the flat part 101 is smaller than the size of the first groove 120 away from the flat part 101. When the size of the first groove 120 near the flat portion 101 is smaller than the size of the first groove 120 away from the flat portion 101, it is more convenient to place the sealing member 20 in the first groove 120. In addition, as can be seen from the above, the first groove 120 near the flat portion 101 only needs to be sealed to block water from flowing into the electronic device 1 through the first groove 120, so that the application can further save the usage amount of the sealing member 20, further reduce the cost, and reduce the mass of the electronic device 1. As shown in fig. 13 and 14, the structure of the electronic device 1 in the seventh embodiment of the present application is substantially the same as the structure of the electronic device 1 in the second embodiment of the present application, and the structure of the electronic device 1 in the eighth embodiment of the present application is substantially the same as the structure of the electronic device 1 in the fifth embodiment of the present application, except that the protrusion 102 is disposed opposite to the plastic portion 110, and the second conductive sub-portion 105 is disposed opposite to the plastic portion 110, so that the size of the first groove 120 close to the flat portion 101 is smaller than the size of the first groove 120 away from the flat portion 101.

Please refer to fig. 15 and 16 together, fig. 15 is a schematic structural diagram of a second groove in the first embodiment of the present application; fig. 16 is a schematic structural diagram of a second groove in the second embodiment of the present application. A second groove 130 is formed on a side wall of the first groove 120, and the sealing member 20 is further disposed in the second groove 130.

As can be seen from the above, the first groove 120 is formed by the protrusion 102 and the plastic part 110, or the first groove 120 is formed by the second conductive sub-part 105 and the plastic part 110. Therefore, the sidewall of the first groove 120 is opened with a second groove 130, that is, one or both of the sidewall of the protrusion 102 and the sidewall of the plastic part 110 are opened with the second groove 130, or one or both of the sidewall of the second conductive sub-part 105 and the sidewall of the plastic part 110 are opened with the second groove 130. The second groove 130 is formed to enable the sealing element 20 to protrude towards two opposite sides, so that the sealing element 20 can better attach and seal the side wall of the first groove 120. Thereby, the sealing member 20 can seal the first groove 120 better and prevent water from flowing into the electronic device 1 through the first groove 120. In addition, the arrangement of the second groove 130 increases the contact area of the sealing member 20 and the housing 10, and thus, the adhesion between the sealing member 20 and the housing 10 can be increased, so that the sealing member 20 is more firmly adhered. Alternatively, the number of the second grooves 130 may be one or more. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. The greater the number of the second grooves 130, the further the sealing performance of the sealing member 20 to the first groove 120 can be improved, and the further the waterproof performance of the electronic apparatus 1 can be improved. As shown in fig. 15, the structure of the electronic device 1 adopted in the present embodiment is substantially the same as the structure of the electronic device 1 adopted in fig. 13, except that the sidewall of the plastic part 110 is provided with two arc-shaped second grooves 130, and the number of the second grooves 130 is two. As shown in fig. 16, the structure of the electronic device 1 adopted in the present embodiment is substantially the same as the structure of the electronic device 1 adopted in fig. 14, except that the second grooves 130 are formed on the side walls of the plastic part 110 and the conductive part 103, and the number of the second grooves 130 is four, so that the waterproof performance of the electronic device 1 is further improved.

Please refer to fig. 17 and 18 together, fig. 17 is a schematic structural diagram of a second groove in a third embodiment of the present application; fig. 18 is a schematic structural diagram of a second groove in a fourth embodiment of the present application. The second groove 130 extends toward the flat portion 101. The dimension of the second recess 130 adjacent to the first recess 120 is larger than the dimension of the second recess 130 facing away from the first recess 120.

As can be seen from the above, the provision of the second groove 130 can improve the waterproof sealing performance of the sealing member 20 against the first groove 120, thereby improving the waterproof performance of the electronic device 1. When the second groove 130 extends toward the flat part 101, and when the sealing member 20 is made of polystyrene glue, polycarbonate glue, nylon glue, or polyurethane glue, the sealing glue can more easily enter the second groove 130 when the sealing member 20 is prepared, so as to form the sealing member 20 in the second groove 130. Optionally, the size of the first groove 120 close to the flat part 101 is smaller than the size of the first groove 120 away from the flat part 101, at this time, the sidewall of the first groove 120 is inclined, and when the sealing glue is dropped onto the sidewall, the sealing glue flows into the first groove 120 along the sidewall due to the gravity. When the sealing glue meets the second groove 130 in the flowing process, the sealing glue automatically enters the second groove 130 due to the action of gravity and continuously flows downwards along the side wall of the second groove 130, so that the preparation difficulty is greatly reduced. When the size of the second groove 130 close to the first groove 120 is larger than the size of the second groove 130 away from the first groove 120, the opening on the second sidewall is larger, so that the sealing glue can flow into the second groove 130 more easily, and the difficulty of preparation is further reduced. Meanwhile, the size of the second groove 130 away from the first groove 120 is smaller, so that the use amount of the sealing element 20 is further saved, and the preparation cost is reduced. In addition, the size of the second groove 130 close to the first groove 120 is larger than the size of the second groove 130 away from the first groove 120, which can be understood as that the size of the second groove 130 close to the sidewall of the first groove 120 is larger than the size of the second groove 130 away from the sidewall of the first groove 120, and the sidewalls of the first groove 120 mentioned in this application are the same sidewall. As shown in fig. 17, the structure of the electronic device 1 adopted in the present embodiment is substantially the same as that of the electronic device 1 adopted in fig. 13, except that the second groove 130 is extended toward the flat part 101, the size of the second groove 130 close to the first groove 120 is larger than that of the second groove 130 away from the first groove 120, and the number of the second grooves 130 is two. As shown in fig. 18, the structure of the electronic apparatus 1 adopted in the present embodiment is substantially the same as that of the electronic apparatus 1 adopted in fig. 14, except that the second groove 130 is provided extending toward the flat part 101, the size of the second groove 130 close to the first groove 120 is larger than that of the second groove 130 away from the first groove 120, and the number of the second grooves 130 is four.

Please refer to fig. 19 and 20 together, fig. 19 is a schematic structural diagram of a third groove in an embodiment of the present application; fig. 20 is a schematic structural diagram of a third groove in another embodiment of the present application. The surface of the metal base 100 provided with the plastic part 110 is provided with a third groove 140, the third groove 140 is communicated with the first groove 120, and the sealing element 20 is further arranged in the third groove 140. The dimension of the third recess 140 adjacent to the first recess 120 is smaller than the dimension of the third recess 140 facing away from the first recess 120.

In the present application, a third groove 140 is formed on the surface of the metal substrate 100 at the joint of the plastic part 110 and the metal substrate 100, and the third groove 140 is communicated with the first groove 120. Therefore, when the sealing member 20 is made of polystyrene glue, polycarbonate glue, nylon glue, or polyurethane glue, when the sealing member 20 flows into the first groove 120, the sealing glue continuously flows into the third groove 140, so as to completely attach and seal the joint between the plastic part 110 and the metal substrate 100. From the above, it can be known that, just because the joint between the plastic part 110 and the metal substrate 100 cannot be completely attached and sealed, water flows into the first groove 120 from the joint between the plastic part 110 and the metal substrate 100, and then flows into the electronic device 1 from the first groove 120. The embodiment of the application not only seals the first groove 120 well, but also seals the joint of the plastic part 110 and the metal substrate 100 effectively through the third groove 140, so as to further prevent water from flowing into the first groove 120, thereby further improving the waterproof performance of the electronic device 1. The size of the third groove 140 close to the first groove 120 is smaller than the size of the third groove 140 away from the first groove 120, and after the sealing glue flows into the first groove 120, the sealing glue enters the third groove 140 along with the opening of the third groove 140 and continuously moves downwards along the side wall of the third groove 140 under the action of gravity, so that the sealing glue can easily flow into the third groove 140, and the process difficulty in preparation is reduced.

In addition, for the preparation of the third groove 140, since the sizes of the metal base 100 and the plastic part 110 in the electronic device 1 are small, the difficulty of the process of forming the third groove 140 after the plastic part 110 covers the metal base 100 is large. Therefore, the third groove 140 may be formed on the metal substrate 100, the third groove 140 may be covered with a temperature-sensitive material, the plastic part 110 may be formed on the metal substrate 100, and the temperature-sensitive material may be removed by controlling the temperature, so that the third groove 140 is exposed again. As shown in fig. 19, the electronic device 1 adopted in the present embodiment has a structure substantially the same as that of the electronic device 1 adopted in fig. 13, except that a trapezoidal third groove 140 is provided on the surface of the metal base 100 provided with the plastic part 110, the third groove 140 is communicated with the first groove 120, and the size of the third groove 140 is gradually increased in a direction away from the first groove 120. As shown in fig. 20, the electronic device 1 adopted in the present embodiment has a structure substantially the same as that of the electronic device 1 adopted in fig. 10, except that a trapezoidal third groove 140 is provided on the surface of the metal base 100 provided with the plastic part 110, the third groove 140 is communicated with the first groove 120, and the size of the third groove 140 is gradually increased along the direction away from the first groove 120.

Referring to fig. 21, fig. 21 is a schematic view of a plastic part and a metal substrate in an electronic device according to an embodiment of the present disclosure. The structure of the plastic part 110 and the metal base 100 in the electronic device 1 according to the present embodiment is substantially the same as the structure of the plastic part 110 and the metal base 100 in the electronic device 1 shown in fig. 20, except that the surface of the metal base 100 on which the plastic part 110 is disposed is wavy in the present embodiment. The surface of the metal substrate 100 is partially formed into a wave shape to increase the surface area of the metal substrate 100, and when plastic is injected on the portion of the metal substrate 100, the surface of the plastic near the metal substrate 100 is also formed into a wave shape to match the surface of the metal substrate 100. The wavy surface increases the contact area between the plastic part 110 and the metal substrate 100, so that the bonding performance and the sealing performance between the plastic part 110 and the metal substrate 100 are further increased, the amount of water flowing into the first groove 120 is reduced, and the waterproof performance of the electronic device 1 is improved.

Please refer to fig. 22, 23, and 24, in which fig. 22 is a schematic diagram illustrating a connection relationship between a connecting member and a metal substrate in an electronic device according to an embodiment of the present disclosure; fig. 23 is a schematic view illustrating a connection relationship between a connector and a metal substrate in an electronic device according to another embodiment of the present application; fig. 24 is a schematic view illustrating a connection relationship between a connector and a metal substrate in an electronic device according to still another embodiment of the present application. The connector 30 mainly serves to connect the circuit board 40 and the metal base 100, thereby electrically connecting the circuit board 40 and the metal base 100. The connection relationship between the connector 30 and the circuit board 40 and the metal substrate 100 affects the reliability of the electrical connection and the stability of the electronic transmission. First, looking at the connection relationship between the connecting member 30 and the metal substrate 100, the connecting member 30 and the metal substrate 100 may be fixedly connected or movably connected. The structure of the electronic device 1 provided in fig. 22, 23, and 24 is substantially the same as the structure of the electronic device 1 provided in fig. 21, except that, as shown in fig. 22, the connecting member 30 is detachable when the connecting member 30 is movably connected to the metal base 100 by the fastening member 150, which is easily implemented when the connecting member 30 needs to be replaced or the position of the connecting member 30 needs to be moved. As shown in fig. 23 and fig. 24, when the connecting member 30 is fixedly connected to the metal base 100 by welding (e.g., electric welding), etc., the position of the connecting member 30 is fixed, and the connecting member 30 is better connected to the metal base 100.

When the connecting member 30 is fixedly connected to the metal base 100, the connecting member 30 is provided with a first positioning portion 160, the metal base 100 is provided with a second positioning portion 170, and the second positioning portion 170 is used for being matched with the first positioning portion 160 to fixedly connect the connecting member 30 to the metal base 100. The arrangement of the first positioning portion 160 and the second positioning portion 170 can effectively fix the connecting member 30 on the metal base 100, and due to the arrangement of the first positioning portion 160 and the second positioning portion 170, the contact area of the connecting member 30 and the metal base 100 can be increased, the electronic transmission rate can be increased, and the grounding effect of the circuit board 40 can be improved. Alternatively, as shown in fig. 23, the first positioning portion 160 may have a convex structure, and the second positioning portion 170 may have a concave structure; alternatively, as shown in fig. 24, the first positioning portions 160 may have a concave structure, and the second positioning portions 170 may have a convex structure. As shown in fig. 23 and 24, the connecting member 30 may be connected to the plastic part 110 to further fix the connecting member 30.

When the other end of the connector 30 is connected to the circuit board 40, the other end of the connector 30 may abut against the circuit board 40, or the other end of the connector 30 may be connected to the circuit board 40. Alternatively, the connector 30 of the present application may be a spring plate, and since the spring plate has a certain elasticity, the spring plate may perform a bending movement so as to abut against the circuit board 40. Further alternatively, as shown in fig. 23, in an embodiment of the present application, the connector 30 and the circuit board 40 are abutted by point contact. The point contact can guarantee the consistency of the electronic channel, namely electrons enter the connecting piece 30 through the point contact, so that the problem that the loss of the electrons is different due to different resistances caused by uneven materials because the electrons enter the connecting piece 30 from multiple points is avoided. In another embodiment of the present application, the connector 30 is brought into abutment with the circuit board 40 by surface contact, as shown in fig. 24. The surface contact may increase the contact area of the connector 30 with the circuit board 40, thereby increasing the rate of electron transfer.

In addition, the above-mentioned modifications of the specific structures of the first groove 120, the second groove 130, the third groove 140, the connecting member 30, and the like in the present application are only examples of some common embodiments. Of course, the same improvements can be made to the first groove 120, the second groove 130, the third groove 140, the connecting member 30, and the like on the electronic device 1 provided in other embodiments of the present application, so as to solve the technical problems mentioned in the present application and obtain the same technical effects, and also belong to the scope of protection of the present application.

The above is a detailed description of the structure of the electronic device 1 of the present application, and according to the embodiments of the present application, a method for manufacturing the electronic device 1 is also provided. The method may be used to prepare the electronic device 1 of the above scheme. Of course, the electronic device 1 may be manufactured by using other manufacturing methods, which is not limited in this application. The electronic device 1 and the method for manufacturing the electronic device 1 provided in the embodiments of the present application may be used in combination with or separately from each other, which does not affect the essence of the present application.

Referring to fig. 25, fig. 25 is a process flow diagram of a method for manufacturing an electronic device according to an embodiment of the present disclosure. The embodiment of the application provides a preparation method of an electronic device 1, which comprises S100, S110, S120 and S130. The details of S100, S110, S120, and S130 are as follows.

S100, providing a metal substrate 100.

S110, forming a plastic part 110 on the metal base body 100, wherein the metal base body 100 and the plastic part 110 form a first groove 120.

S120, forming a sealing member 20 in the first groove 120 to seal and waterproof the first groove 120. And

and S130, providing a connecting piece 30 and a circuit board 40, wherein one end of the connecting piece 30 is electrically connected with the metal matrix 100, and the other end of the connecting piece is connected with the circuit board 40.

Wherein, S100, S110, S120, and S130 only represent that the present application includes four steps of S100, S110, S120, and S130, and do not mean the preparation sequence of the electronic device 1, for example, S120 and S130 are taken as an example. In the present application, S130 may be performed first, and then S120 may be performed. Specifically, please refer to the structure of the electronic device 1 shown in fig. 1 again. In this embodiment, after the first groove 120 is formed, one end of the connecting member 30 is electrically connected to the metal base 100, and the other end is connected to the circuit board 40. A seal 20 is then formed in the first groove 120 to seal the first groove 120. The manufacturing method provided by the embodiment of the application has the advantages of simple workpiece and low cost, can be used for manufacturing the shell 10 and the electronic device 1 with excellent waterproof performance while electrically connecting the circuit board 40 and the shell 10, and has great practicability.

Differences in the specific structure of the metal base 100 will also lead to differences in the method of manufacturing the electronic device 1, as will be exemplified below. Referring to fig. 26, fig. 26 is a process flow diagram of a method for manufacturing an electronic device according to another embodiment of the present disclosure. In the present embodiment, "S100, providing the metal base 100" includes S101, S102. The details of S101 and S102 are as follows. The manufacturing method provided by the embodiment of the present application can refer to the schematic structural diagram of the electronic device 1 shown in fig. 6.

S101, providing a metal base material.

S102, projecting the partial metal base material in a direction away from the surface of the metal base material to obtain a metal matrix 100; the metal substrate 100 includes a flat portion 101 and a protruding portion 102 bent and extended from the flat portion 101.

Referring to fig. 27, fig. 27 is a process flow diagram of a method for manufacturing an electronic device according to another embodiment of the present disclosure. In the present embodiment, "S100, providing the metal base 100" includes S103, S104. The details of S103 and S104 are as follows. The manufacturing method provided by the embodiment of the present application may refer to a schematic structural diagram of the electronic device 1 shown in fig. 10.

S103, providing a metal base material.

S104, arranging a conductive part 103 on part of the surface of the metal base material, and connecting the conductive part 103 with the surface of the metal base material to obtain a metal matrix 100; the metal substrate 100 includes a flat portion 101 and a conductive portion 103 protruding on a surface of the flat portion 101.

The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An electronic device, characterized in that the electronic device comprises:

the electronic equipment comprises a shell, a circuit board, a connecting piece and a sealing piece, wherein the shell comprises a metal base body and a plastic part arranged on the surface of the metal base body facing the inside of the electronic equipment, the metal base body and the plastic part form a first groove, one end of the connecting piece is electrically connected with the metal base body, the other end of the connecting piece is connected with the circuit board, and the sealing piece is arranged in the first groove to seal and waterproof the first groove; the metal base body comprises a flat part and a convex part bent and extended from the flat part, the convex part and the plastic part form the first groove, and one end of the connecting piece is connected with the convex part;

the sealing element completely attaches and seals the first groove, so that the joint of the plastic part on the surface of one side of the shell and the metal base body is sealed and waterproof, and water cannot flow into the electronic equipment through the first groove;

wherein the content of the first and second substances,

when the sealing element is polystyrene glue, polycarbonate glue, nylon glue or polyurethane glue, adding sealing glue into the first groove in the preparation process, wherein the sealing glue has cohesiveness and can be effectively bonded in the first groove, the sealing glue can be completely attached to and sealed with the first groove, and after the sealing glue is solidified, the sealing element is formed, and the first groove is well sealed and waterproof;

when the sealing member is silica gel or waterproof bubble cotton, the sealing member has elasticity, the sealing member with the lateral wall of first recess meets just the sealing member is in compression state, works as the sealing member with the lateral wall of first recess meets, just when the sealing member is in compression state, the sealing member can produce one with the rebound force of compression opposite direction, this rebound force can make the sealing member warp to fill up in the gap between the lateral wall of sealing member and first recess, thereby it is right first recess is laminated completely and is sealed, makes water unable to pass through first recess flow direction inside the electronic equipment.

2. The electronic device of claim 1, wherein opposing sides of the protrusion are contiguous with the plastic portion, or the protrusion is spaced apart from the plastic portion.

3. The electronic device of claim 1, wherein a dimension of the first recess proximate the flat portion is smaller than a dimension of the first recess away from the flat portion.

4. The electronic device of claim 1, wherein a second groove is disposed on a sidewall of the first groove, and the sealing element is further disposed in the second groove.

5. The electronic device of claim 4, wherein the second recess extends toward the flat portion.

6. The electronic device of claim 5, wherein a dimension of the second recess proximate to the first recess is greater than a dimension of the second recess away from the first recess.

7. The electronic device of claim 1, wherein a third groove is formed on the surface of the metal substrate on which the plastic part is formed, the third groove is communicated with the first groove, and the sealing member is further disposed in the third groove.

8. The electronic device of claim 7, wherein a dimension of the third recess proximate to the first recess is smaller than a dimension of the third recess away from the first recess.

9. The electronic device of claim 1, wherein the seal is resilient, the seal abuts a sidewall of the first recess, and the seal is in compression.

10. The electronic device according to claim 1, wherein the connecting member is provided with a first positioning portion, and the metal base is provided with a second positioning portion, and the second positioning portion is used for being matched with the first positioning portion to fixedly connect the connecting member to the metal base.

11. An electronic device, characterized in that the electronic device comprises:

the electronic equipment comprises a shell, a circuit board, a connecting piece and a sealing piece, wherein the shell comprises a metal base body and a plastic part arranged on the surface of the metal base body facing the inside of the electronic equipment, the metal base body and the plastic part form a first groove, one end of the connecting piece is electrically connected with the metal base body, the other end of the connecting piece is connected with the circuit board, and the sealing piece is arranged in the first groove to seal and waterproof the first groove; the metal base body comprises a flat part and a conductive part convexly arranged on the surface of the flat part, the conductive part and the plastic part form the first groove, and one end of the connecting piece is connected with the conductive part;

wherein the content of the first and second substances,

12. The electronic device of claim 11, wherein the conductive portion comprises a first conductive sub-portion connected to the flat portion and a second conductive sub-portion protruding from a side of the first conductive sub-portion away from the flat portion, and the second conductive sub-portion and the plastic portion form the first groove.

13. The electronic device of claim 11, wherein a dimension of the first recess proximate the flat portion is smaller than a dimension of the first recess away from the flat portion.

14. The electronic device of claim 11, wherein a second groove is disposed on a sidewall of the first groove, and the sealing element is further disposed in the second groove.

15. The electronic device of claim 14, wherein the second recess extends toward the flat portion.

16. The electronic device of claim 15, wherein a dimension of the second recess proximate to the first recess is greater than a dimension of the second recess away from the first recess.

17. An electronic device, characterized in that the electronic device comprises:

the electronic equipment comprises a shell, a circuit board, a connecting piece and a sealing piece, wherein the shell comprises a metal base body and a plastic part arranged on the surface of the metal base body facing the inside of the electronic equipment, the metal base body and the plastic part form a first groove, one end of the connecting piece is electrically connected with the metal base body, the other end of the connecting piece is connected with the circuit board, and the sealing piece is arranged in the first groove to seal and waterproof the first groove;

the surface of the metal matrix provided with the plastic part is provided with a third groove, the third groove is communicated with the first groove, and the sealing element is also arranged in the third groove;

wherein the content of the first and second substances,

18. The electronic device of claim 17, wherein a dimension of the third recess proximate to the first recess is smaller than a dimension of the third recess away from the first recess.

19. An electronic device, characterized in that the electronic device comprises:

the electronic equipment comprises a shell, a circuit board, a connecting piece and a sealing piece, wherein the shell comprises a metal base body and a plastic part arranged on the surface of the metal base body facing the inside of the electronic equipment, the metal base body and the plastic part form a first groove, one end of the connecting piece is electrically connected with the metal base body, the other end of the connecting piece is connected with the circuit board, and the sealing piece is arranged in the first groove to seal and waterproof the first groove; the sealing element has elasticity, is connected with the side wall of the first groove and is in a compressed state;

wherein the content of the first and second substances,

20. An electronic device, characterized in that the electronic device comprises:

the electronic equipment comprises a shell, a circuit board, a connecting piece and a sealing piece, wherein the shell comprises a metal base body and a plastic part arranged on the surface of the metal base body facing the inside of the electronic equipment, the metal base body and the plastic part form a first groove, one end of the connecting piece is electrically connected with the metal base body, the other end of the connecting piece is connected with the circuit board, and the sealing piece is arranged in the first groove to seal and waterproof the first groove; the connecting piece is provided with a first positioning part, the metal base body is provided with a second positioning part, and the second positioning part is used for being matched with the first positioning part so as to fixedly connect the connecting piece to the metal base body;

wherein the content of the first and second substances,

21. A method for manufacturing an electronic device, wherein the electronic device is the electronic device of any one of claims 1 to 10, the method comprising: providing a metal matrix; forming a plastic part on the metal base body, wherein the metal base body and the plastic part form a first groove; forming a seal within the first groove to seal the first groove against water; providing a connecting piece and a circuit board, wherein one end of the connecting piece is electrically connected with the metal matrix, and the other end of the connecting piece is connected with the circuit board;

wherein "providing a metal matrix" includes: providing a metal substrate; and projecting part of the metal base material in a direction away from the surface of the metal base material to obtain a metal matrix; the metal substrate comprises a flat part and a protruding part bent and extended from the flat part.

22. A method for manufacturing an electronic device, wherein the electronic device is the electronic device of any one of claims 11 to 16, the method comprising: providing a metal matrix; forming a plastic part on the metal base body, wherein the metal base body and the plastic part form a first groove; forming a seal within the first groove to seal the first groove against water; providing a connecting piece and a circuit board, wherein one end of the connecting piece is electrically connected with the metal matrix, and the other end of the connecting piece is connected with the circuit board;

wherein "providing a metal matrix" includes: providing a metal substrate; arranging a conductive part on part of the surface of the metal base material, and connecting the conductive part with the surface of the metal base material to obtain a metal matrix; the metal substrate comprises a flat part and a conductive part convexly arranged on the surface of the flat part.