CN110176553A - A kind of preparation method and display base plate of display base plate - Google Patents
A kind of preparation method and display base plate of display base plate Download PDFInfo
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- CN110176553A CN110176553A CN201910462902.XA CN201910462902A CN110176553A CN 110176553 A CN110176553 A CN 110176553A CN 201910462902 A CN201910462902 A CN 201910462902A CN 110176553 A CN110176553 A CN 110176553A
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- Prior art keywords
- area
- dyestripping
- protective film
- cutting
- display panel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Abstract
This application discloses a kind of preparation method of display base plate and display base plates, to improve dyestripping yield while reducing dyestripping difficulty.The preparation method of a kind of display base plate provided by the embodiments of the present application, comprising: the first protective film is set in the back side whole face of display panel；Wherein, display panel is included to bent area, waits for the first cutting area that bent area extending direction is connect with to bent area at least one；First protective film has the second cutting area and to dyestripping area, disconnects to dyestripping area with to other regions except dyestripping area；It include: first to be overlapped to dyestripping area with to bent area to dyestripping area and second to dyestripping area, first to dyestripping area, the second region formed to dyestripping area and the second cutting area is overlapped with the first cutting area；Cutting the first cutting area of removal and the second cutting area；Using second to dyestripping area the first protective film as dyestripping starting point, remove first protective film to dyestripping area.
Description
Technical field
This application involves field of display technology more particularly to the preparation methods and display base plate of a kind of display base plate.
Background technique
Screen Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) shows product comprehensively at present
Production, after obtaining the oled panel for attaching notacoria, it is also necessary to carry out terminal bending technique, it is curved that terminal bends process requirement removal
The notacoria of folding area.The prior art using go notacoria be using laser point investment by the way of hung down by a large amount of intensive in target area
Straight laser dot-matrix " ablation " goes out slot, to remove the notacoria of bent area.But due to the mutual heat affecting between laser point, laser
The depth for removing notacoria is not easy to control, and is often accompanied by notacoria and pressure sensitive adhesive (Pressure sensitive adhesive, PSA)
Sintering residual, goes notacoria sections bottom flatness poor, and there are foreign matter risks, and uses laser sintered hot work region
Larger, sintering edge often has the gap of materials hot deformation generation, influences to be sintered the form at edge and then influences stress distribution.
To sum up, prior art removal notacoria is difficult, and the technique for removing notacoria is easy to appear sintering residual, there is also burning
The case where edge generates gap is tied, the yield of notacoria removal is influenced, influences the quality for showing product.
Summary of the invention
The embodiment of the present application provides the preparation method and display base plate of a kind of display base plate, to reduce dyestripping difficulty
While improve dyestripping yield.
A kind of preparation method of display base plate provided by the embodiments of the present application, which comprises
In the back side whole face of the display panel, the first protective film is set；Wherein, the display panel is included wait bend
Area, to bent area extending direction and first cutting area being connect to bent area described at least one；First protection
Film has the second cutting area and to dyestripping area, described to disconnect to dyestripping area with to other regions except dyestripping area；It is described to
Dyestripping area includes: first to be overlapped with described to bent area to dyestripping area, described first to dyestripping area to dyestripping area and second, described
Second is overlapped to dyestripping area and second cutting area with first cutting area；
Cutting removes first cutting area and second cutting area；
Using described second to dyestripping area first protective film as dyestripping starting point, remove described to described in dyestripping area
First protective film.
The preparation method of display base plate provided by the embodiments of the present application, cutting the first cutting area of removal and the second cutting
Area that is, so that the first cutting area is separated along cutting line with display panel, and protects the second cutting area along cutting line and first
Cuticula separation, so that subsequent removing when first protective film in dyestripping area, it can be with second the first protective film to dyestripping area
For dyestripping starting point, the first protective film to dyestripping area is directly removed, dyestripping difficulty is reduced.Also, due to the first cutting area
It is separated along cutting line with display panel, the second cutting area is along cutting line and the first protection UF membrane, to dyestripping area and to dyestripping area
Except other regions disconnect, therefore during removing the first protective film to dyestripping area, will not take up to dyestripping area week
The film layer of border region will not influence the form to dyestripping area neighboring area film layer, will not influence the stress of neighboring area film layer
Distribution.The first protective film for directly treating dyestripping area removes, and can also avoid making using the first protective film of laser sintered removal
At sintering residual, flatness it is poor, influence sintering edge form the problems such as, can also avoid to display panel scratch.This
The guarantee while preparation method for the display base plate that application embodiment provides may be implemented to remove the first protective film to dyestripping area
Dyestripping yield, and then guarantee that display base plate prepares yield.
Optionally, first cutting area includes two chamfered regions of the display panel, and cutting removal described first is cut
Area and second cutting area are cut, is specifically included:
In each chamfered region, cutting removes first cutting area and second cutting area；
Alternatively, cutting removes first cutting area and second cutting area, another a chamfered region
A chamfered region, cutting remove first cutting area, second cutting area and the positive throwing with first cutting area
Shadow has overlapping described to dyestripping area.
Optionally, the first protective film is arranged in the back side whole face in the display panel, specifically includes:
First protective film is attached by the first joint adhesive whole face at the back side of the display panel；
Cutting removes first cutting area and second cutting area, specifically includes:
From the side for deviating from first protective film, first fitting is cut through along the boundary of first cutting area
Each film layer of the display panel on glue；
Along the boundary of second cutting area, first joint adhesive and first protective film are cut through.
Optionally, before or after the first protective film is arranged in the back side whole face of the display panel, this method further include:
The second protective film is attached by the second joint adhesive in the front of the display panel；
Each film layer of the display panel on first joint adhesive is cut through along the boundary of first cutting area,
It specifically includes:
Second protective film, second joint adhesive and described aobvious are cut through along the boundary of first cutting area
Show panel.
Optionally, with the orthographic projection with first cutting area have it is overlapping described in first protective film to dyestripping area
For dyestripping starting point, remove it is described to first protective film in dyestripping area before, this method further include:
Fixation member is set on first protective film except the area to dyestripping.
So as to further prevent removing to take up periphery film layer during dyestripping area and prevent periphery film layer
Fracture can also avoid the damaged tearing to each film layer of bent area display panel or pull deformation, further increase dyestripping yield.
Optionally, fixation member is set on first protective film except the area to dyestripping, specifically includes:
Bar shaped fixation member is respectively set on first protective film of dyestripping folding area two sides, perpendicular to institute
State display panel institute in the in-plane direction, the orthographic projection of the bar shaped fixation member is adjacent with the orthographic projection to dyestripping area.
In this way, during removing the first protective film to dyestripping area, with first protective film adjacent to dyestripping area not
Can be taken up, will not occur with the fracture of first protective film adjacent to dyestripping area, further increase dyestripping yield and aobvious
Show substrate yield.
Optionally, the fixation member includes buffer layer and the metal layer on the buffer layer, it is described to
Fixation member is set on first protective film except dyestripping area, is specifically included:
It is described to bent area except, the buffer layer for controlling the fixation member is contacted with first protective film.
The preparation method of display base plate provided by the embodiments of the present application, buffer layer connects with the first protective film in fixation member
Touching, so as to avoid the Electro-static Driven Comb between buffer layer and the first protective film.
Optionally, after the front of the display panel attaches the second protective film by the second joint adhesive, this method is also
It include: that cover board is set on second protective film；The orthographic projection of the cover board and the orthographic projection to bent area and
The orthographic projection no overlap of first cutting area；
Using the orthographic projection with first cutting area have it is overlapping described in dyestripping area first protective film as dyestripping
Starting point, remove it is described to first protective film in dyestripping area after, this method further include:
By first cutting area of the display panel and it is described be placed in supporting platform to bent area, wherein described
One protective film deviates from the supporting platform.
Optionally, using described second to dyestripping area first protective film as dyestripping starting point, remove described to dyestripping
First protective film in area, specifically includes:
Using the film layer of fixture clamping and the first cutting area overlapping, controls the fixture and drive and first cutting
The film layer of area overlapping is rotated to described to dyestripping area, and is moved along the cutting line of first protective film, remove it is described to
First protective film in dyestripping area.
Using the film layer of fixture clamping and the first cutting area overlapping, and angle rotation and movement are controlled to more hold
Easily remove the first protective film to dyestripping area.Also, due to fixture clamping with it is described first cutting area overlapping film layer, and with institute
The film layer for stating the first cutting area overlapping is the film layer for needing to remove, that is, the production belonged in display base plate preparation process is useless
The film layer of film, fixture clamping and the first cutting area overlapping is equivalent to using useless film is produced as dyestripping handle, that is, is not necessarily to volume
The dyestripping handle that outer setting fixture clamps, can save cost.
A kind of display base plate provided by the embodiments of the present application, the display base plate is using provided by the embodiments of the present application above-mentioned
Method is made.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly introduced, it should be apparent that, the drawings in the following description are only some examples of the present application, for this
For the those of ordinary skill in field, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is a kind of schematic diagram of the preparation method of display base plate provided by the embodiments of the present application；
Fig. 2 is a kind of positive structure schematic of display panel for attaching the first protective film provided by the embodiments of the present application；
Fig. 3 is the signal of display panel in a kind of display panel for attaching the first protective film provided by the embodiments of the present application
Figure；
Fig. 4 is the signal of the first protective film in a kind of display panel for attaching the first protective film provided by the embodiments of the present application
Figure；
Fig. 5 is a kind of structure schematic diagram of display panel for attaching the first protective film provided by the embodiments of the present application；
Fig. 6 is a kind of front of display panel for attaching the first protective film and the second protective film provided by the embodiments of the present application
Structural schematic diagram；
Fig. 7 is a kind of back side of display panel for attaching the first protective film and the second protective film provided by the embodiments of the present application
Structural schematic diagram；
Fig. 8 is a kind of schematic diagram of fixation member provided by the embodiments of the present application；
Fig. 9 is the schematic diagram of another fixation member provided by the embodiments of the present application；
Figure 10 is a kind of schematic diagram of supporting platform and fixation member set-up mode provided by the embodiments of the present application；
Figure 11 is the schematic diagram of a kind of fixture clamping and first cutting all film layers of area overlapping provided by the embodiments of the present application；
Figure 12 is the signal of another fixture clamping and first cutting all film layers of area overlapping provided by the embodiments of the present application
Figure；
Figure 13 is the signal of another fixture provided by the embodiments of the present application clamping with first cutting all film layers of area overlapping
Figure.
Specific embodiment
The embodiment of the present application provides a kind of preparation method of display base plate, as shown in Figure 1, which comprises
S101, back side whole face the first protective film of setting in the display panel；Wherein, the display panel include to
Bent area, to bent area extending direction and first cutting area being connect to bent area described at least one；Described first
Protective film has the second cutting area and to dyestripping area, described to disconnect to dyestripping area with to other regions except dyestripping area；Institute
Stating to dyestripping area includes: first to be overlapped with described to bent area to dyestripping area, described first to dyestripping area to dyestripping area and second,
Described second region formed to dyestripping area and second cutting area is overlapped with first cutting area；
S102, cutting remove first cutting area and second cutting area；
S103, using described second to dyestripping area first protective film as dyestripping starting point, remove described to dyestripping area
First protective film.
The preparation method of display base plate provided by the embodiments of the present application, cutting the first cutting area of removal and the second cutting
Area that is, so that the first cutting area is separated along cutting line with display panel, and protects the second cutting area along cutting line and first
Cuticula separation, so that subsequent removing when first protective film in dyestripping area, it can be with second the first protective film to dyestripping area
For dyestripping starting point, the first protective film to dyestripping area is directly removed, dyestripping difficulty is reduced.Also, due to the first cutting area
It is separated along cutting line with display panel, the second cutting area is along cutting line and the first protection UF membrane, to dyestripping area and to dyestripping area
Except other regions disconnect, therefore during removing the first protective film to dyestripping area, will not take up to dyestripping area week
The film layer of border region will not influence the form to dyestripping area neighboring area film layer, will not influence the stress of neighboring area film layer
Distribution.The first protective film for directly treating dyestripping area removes, and can also avoid making using the first protective film of laser sintered removal
At sintering residual, flatness it is poor, influence sintering edge form the problems such as, can also avoid to display panel scratch.This
The guarantee while preparation method for the display base plate that application embodiment provides may be implemented to remove the first protective film to dyestripping area
Dyestripping yield, and then guarantee that display base plate prepares yield.
It should be noted that the preparation method of display base plate provided by the embodiments of the present application, it is described to dyestripping area with wait tear
Other regions except film area disconnect, such as can be after attaching the first protective film along the first protection of boundary cutting to dyestripping area
Film.
The structure formed after step S101 is as shown in figs. 2 to 4, whole including display panel 1 and at the back side of display panel 1
The first protective film 2 is arranged in face.In order to which display panel and each region of the first protective film are illustrated, Fig. 3 only shows display
Panel, Fig. 4 only show the first protective film, wherein as shown in figure 3, display panel 1 is included to bent area 3, at least one institute
It states to 3 extending direction of bent area and first cutting area 4 being connect to bent area 3.As shown in figure 4, the first protective film 2 has
Second cutting area 6 and to dyestripping area 5, it is described to dyestripping area 5 include: first to dyestripping area 7 and second to dyestripping area 8, it is described
First is overlapped with described to bent area 3 to dyestripping area 7, the described second region formed to dyestripping area 8 and second cutting area 6
It is overlapped with first cutting area 4.It is subsequent, it, can be by the display of the first protective film of attaching as shown in Figure 2 after step S102
Panel overturning, as shown in figure 5, making the first protective film 2 upward, is removing when first protective film in dyestripping area, such as can be with
With the first protective film 2 in Fig. 5 in region 9 to dyestripping area 5 for dyestripping starting point, with Chong Die with the first cutting area 4 in region 9
Each film layer is as dyestripping handle, so that each film layer that first cutting area 4 covers in region 9 turns counterclockwise along the direction of the arrow
It is dynamic, directly remove the first protective film to dyestripping area.
Optionally, first cutting area includes two chamfered regions of the display panel, and cutting removal described first is cut
Area and second cutting area are cut, is specifically included:
In each chamfered region, cutting removes first cutting area and second cutting area；
Alternatively, cutting removes first cutting area and second cutting area, another a chamfered region
A chamfered region, cutting remove first cutting area, second cutting area and the positive throwing with first cutting area
Shadow has overlapping described to dyestripping area.
It should be noted that for the ease of bending and saving assembling space, each film layer of the display base plate of chamfered region covering
It is required to remove.
By taking the display panel of the first protective film of attaching as shown in Figure 2 as an example, the first cutting area 4 includes two chamferings in left and right
Area.And when the first cutting area includes two chamfered regions, with corresponding the first protective film to dyestripping area in one of chamfered region
For dyestripping starting point.
Therefore, can an only chamfered region wherein, make the first cutting area along cutting line and display along cutting wire cutting
Panel separation, the second cutting area along cutting line with first protect UF membrane, and first to dyestripping area and second between dyestripping area
Without cutting, so as to using the second dyestripping area as dyestripping starting point, and in another chamfered region, chamfered region is covered
Each film layer of display base plate all removes, it can cuts through display panel and the first protection along the boundary of the first cutting area
Film, i.e., first to dyestripping area and second to also be cut between dyestripping area so that first to dyestripping area and second to dyestripping area
Separation, so as to all remove each film layer of the corresponding display base plate in chamfered region.
It is of course also possible to cutting removes first cutting area and second cutting area in each chamfered region,
The first protective film entirely to dyestripping area is gone as dyestripping starting point to dyestripping area using one of chamfered region corresponding second
It removes, equally also may be implemented while dyestripping, each film layer of the corresponding display base plate in chamfered region is all removed.
Optionally, the first protective film is arranged in the back side whole face in the display panel, specifically includes:
First protective film is attached by the first joint adhesive whole face at the back side of the display panel；
Step S102 cutting removes first cutting area and second cutting area, specifically includes:
S1021, from the side for deviating from first protective film, cut through described the along the boundary of first cutting area
Each film layer of the display panel on one joint adhesive；
S1022, along the boundary of second cutting area, cut through first joint adhesive and first protection
Film.
It should be noted that by taking the display panel for being pasted with the first protective film as shown in Fig. 2,5 as an example, to dyestripping position
Between two the second cutting areas, the boundary of the second cutting area for being cut includes the first sub- boundary 10 and the sub- side of third
Boundary 12, in Fig. 2, first to dyestripping area and second is the second sub- boundary 11 to the boundary between dyestripping area, then for being cut
The boundary of the first cutting area be overlapped with the first sub- boundary 10, the second sub- boundary 11 and the sub- boundary 12 of third.In the specific implementation,
From the side for deviating from first protective film 2, cut through along the first sub- boundary 10, the second sub- boundary 11 and the sub- boundary 12 of third
Each film layer of the display panel on the first joint adhesive (not shown), later again along the first sub- boundary 10 and the sub- side of third
Boundary 12 cuts through first joint adhesive and first protective film 2, to realize on the first sub- boundary 10 and third
First protective film of 12 second cutting area of boundary disconnects and the first sub- boundary 10, the second sub- boundary 11 and the sub- boundary 12 of third
Display panel disconnects.
It should be noted that the preparation method of display base plate provided by the embodiments of the present application, such as can be cut using laser
It cuts, it is contemplated that display panel thickness deviation and laser cutting depth tolerances, therefore certain thickness is stayed on the first protective film
Degree is reserved as buffering, so that the first protective film of damage from laser is prevented, and the first joint adhesive thickness is generally 25 microns (μm),
Thickness is lower, does not cut the first joint adhesive on the second sub- boundary, so that the first joint adhesive is keeping whole to dyestripping area
Body facilitates removing for the first joint adhesive.The preparation method of display base plate i.e. provided by the embodiments of the present application, the first protective film are logical
It crosses the first joint adhesive whole face and is attached at the first protective film, only along the boundary of second cutting area, cut through first patch
Close glue and first protective film, thus it is subsequent remove the first protective film during, the first joint adhesive also removes therewith.
Certainly, when cutting to the first joint adhesive, the first joint adhesive can also be not exclusively cut on the second sub- boundary,
Such as cut the half of the first joint adhesive thickness of the first joint adhesive.
Optionally, before or after the first protective film is arranged in the back side whole face of the display panel, this method further include:
The second protective film is attached by the second joint adhesive in the front of the display panel；
Step S1021 cuts through the display surface on first joint adhesive along the boundary of first cutting area
Each film layer of plate, specifically includes:
Second protective film, second joint adhesive and described aobvious are cut through along the boundary of first cutting area
Show panel.
As shown in fig. 6, the first protective film 2, the first joint adhesive 13, the second protective film 15 are attached at by the second joint adhesive 14
The front of display panel 1, the first protective film 2 are attached at the back side of display panel 1 by the first joint adhesive 13.
It should be noted that the first protective film 2 that the display panel back side is set be counterdie or notacoria (BottomFilm,
BF), being arranged can be upper protective film (Top ProtectFilm, TPF) in positive second protective film 15 of display panel.First
Joint adhesive 13 and the second joint adhesive 14 can be same joint adhesive and be also possible to joint adhesive not of the same race.When the first joint adhesive and
Two joint adhesives select same joint adhesive, such as can be pressure sensitive adhesive (Pressure sensitive adhesive, PSA).When
So, the first protective film is also possible to other protective films in display base plate preparation process.
By taking Fig. 6 as an example, cutting removes first cutting area and second cutting area specifically includes: from display panel
Front, along the first sub- boundary 10, the second sub- boundary 11 and the sub- boundary 12 of third cut through the second protective film 15, second fitting
Glue 14 and display panel 1, later again along the first sub- boundary 10 and the sub- boundary 12 of third cut through first joint adhesive with
And first protective film 2.It is subsequent, display panel as shown in FIG. 6 can be overturn, as shown in fig. 7, making the first protective film
2 upward, is removing when first protective film in dyestripping area, such as can be with the first protection in Fig. 7 in region 9 to dyestripping area 5
Film is dyestripping starting point, and the film layer covered using the first cutting area 4 in region 9 is as dyestripping handle, so that stack in region 9 the
One protective film 2, the first joint adhesive 13, display panel 1, the second joint adhesive 14 and the second protective film 15 are along the direction of the arrow
It rotates counterclockwise, directly removes the first protective film to dyestripping area.
It still include two need in left and right it should be noted that being pasted with the display panel of the first protective film and the second protective film
The chamfered region to be removed can be in the region of two chamfered regions covering, from the front of display panel, edge in the specific implementation
First sub- boundary, the second sub- boundary and the sub- boundary of third cut through the second protective film, the second joint adhesive and display panel, and
The first joint adhesive and the first protective film are cut through along the first sub- boundary and the sub- boundary of third.Be also possible to wherein one fall
Angular region, from the front of display panel, along the first sub- boundary, the second sub- boundary and the sub- boundary of third cut through the second protective film,
Second joint adhesive and display panel, and the first joint adhesive and the first guarantor are cut through along the first sub- boundary and the sub- boundary of third
Cuticula, and in another chamfered region, along the first sub- boundary, the second sub- boundary and the sub- boundary of third cut through the second protective film,
Second joint adhesive, display panel, the first joint adhesive and the first protective film.
It should be noted that display panel provided by the embodiments of the present application, can be Organic Light Emitting Diode (Organic
Light-Emitting Diode, OLED) display panel, specifically, display panel viewing area include: underlay substrate, buffer layer,
Each film layer of pixel circuit, each film layer of electroluminescent device, encapsulated layer.It may also include tool between buffer layer and each film layer of pixel circuit
There is the adhesive layer of modified, hydrophilic and thin heat effect, electroluminescent device is located at viewing area and including luminescent layer.Wherein, chamfering
Area and the non-display area for being located at display panel to bent area, do not include luminescent layer, i.e., chamfered region and to bent area include: lining
The film layer that substrate, buffer layer, multilayer line stack, encapsulated layer.
It should be noted that underlay substrate, which can be flexible substrate substrate, is also possible to non-flexible underlay substrate.Work as substrate
When substrate is flexible substrate substrate, the second protective film can only be attached to viewing area, in such cases, along first cutting area
Boundary cut through each film layer of the display panel on first joint adhesive, specifically include: along it is described first cutting
The boundary in area cuts through the display panel.
Optionally, with the orthographic projection with first cutting area have it is overlapping described in first protective film to dyestripping area
For dyestripping starting point, remove it is described to first protective film in dyestripping area before, this method further include:
Fixation member is set on first protective film except the area to dyestripping.
So as to further prevent removing to take up periphery film layer during dyestripping area and prevent periphery film layer
Fracture can also avoid the damaged tearing to each film layer of bent area display panel or pull deformation, further increase dyestripping yield.
After being cut to chamfered region, as shown in figure 8, making the first protective film upward, fixation member 16 is set to
On first protective film 2 except dyestripping area 5.
Optionally, fixation member is set on first protective film except the area to dyestripping, specifically includes:
As shown in figure 8, bar shaped fixed part is respectively set on first protective film 2 of 5 two sides of dyestripping folding area
Part 17, in the in-plane direction, the orthographic projection of the bar shaped fixation member 17 is with described wait tear perpendicular to display panel institute
The orthographic projection in film area 5 is adjacent.
By perpendicular to display panel institute in the in-plane direction, the orthographic projection of the bar shaped fixation member 17 and institute
State it is adjacent to the orthographic projection in dyestripping area 5, in this way, subsequent the first protective film using in region 9 to dyestripping area 5 is dyestripping starting point,
During removing the first protective film to dyestripping area, it will not be taken up with first protective film adjacent to dyestripping area, also not
It can occur to further increase dyestripping yield and display base plate yield with the fracture of first protective film adjacent to dyestripping area.
It should be noted that considering mechanical movement tolerance, the distance between two bar shaped fixation members can also be slightly larger
The distance between in the width to dyestripping area, such as two bar shaped fixation members can be made >=to dyestripping sector width+machinery fortune
Dynamic tolerance × 2.
Optionally, in Fig. 8, fixation member 16 further includes connecting the connecting component 18 of two bar shaped fixation members 17.
Optionally, the fixation member includes buffer layer and the metal layer on the buffer layer, it is described to
Fixation member is set on first protective film except dyestripping area, is specifically included:
It is described to bent area except, the buffer layer for controlling the fixation member is contacted with first protective film.
The preparation method of display base plate provided by the embodiments of the present application, buffer layer connects with the first protective film in fixation member
Touching, so as to avoid metal layer from directly contacting with the first protective film caused by Electro-static Driven Comb, buffer layer connects with the first protective film
Touching can also avoid fixation member from moving on the first protective layer.
By taking fixation member includes two bar shaped fixation members 17 as an example, as shown in figure 9, bar shaped fixation member 17 includes: slow
Rush layer 19 and the metal layer 20 on the buffer layer 19.
Optionally, the material of the buffer layer is silica gel, and the material of the metal layer for example can be stainless steel, certain institute
The material for stating metal layer also can choose high strength alloy material.
The preparation method of display base plate provided by the embodiments of the present application, the material of buffer layer is silica gel in fixation member, can
To avoid Electro-static Driven Comb.
Optionally, after the front of the display panel attaches the second protective film by the second joint adhesive, this method is also
It include: that cover board is set on second protective film；The orthographic projection of the cover board and the orthographic projection to bent area and
The orthographic projection no overlap of first cutting area；
Using the orthographic projection with first cutting area have it is overlapping described in dyestripping area first protective film as dyestripping
Starting point, remove it is described to first protective film in dyestripping area after, this method further include:
By first cutting area of the display panel and it is described be placed in supporting platform to bent area, wherein described
One protective film deviates from the supporting platform.
It should be noted that cover board for example can be glass cover-plate (cover glass, CG), ordinary circumstance, chamfered region and
It is not provided with CG to bent area, after the cutting process, so that the first protective film is upward, then to bent area compared to being provided with CG
Region be in vacant state, display base plate preparation method provided by the embodiments of the present application, by the first cutting area of display panel
And it is placed in supporting platform to bent area, supporting platform supports the first cutting area of display panel and to bent area, thus should
Region is not at vacant state, so that the setting of subsequent fixed component and dyestripping operation are easier.
By taking display panel as shown in FIG. 6 as an example, to by display panel be placed in supporting platform and setting fixation member into
Row illustrates.As shown in Figure 10, after the cutting process, the display of the first protective film 2 and the second protective film 15 will be pasted with
Panel 1 is placed in supporting platform 21, and the buffer layer 19 of control bar shaped fixation member 17 is contacted with the first protective film 2.
Optionally, using described second to dyestripping area first protective film as dyestripping starting point, remove described to dyestripping
First protective film in area, specifically includes:
Using the film layer of fixture clamping and the first cutting area overlapping, controls the fixture and drive and first cutting
The film layer of area overlapping is rotated to described to dyestripping area, and is moved along the cutting line of first protective film, remove it is described to
First protective film in dyestripping area.
Using the film layer of fixture clamping and the first cutting area overlapping, and angle rotation and movement are controlled to more hold
Easily remove the first protective film to dyestripping area.Also, due to fixture clamping with it is described first cutting area overlapping film layer, and with institute
The film layer for stating the first cutting area overlapping is the film layer for needing to remove, that is, the production belonged in display base plate preparation process is useless
The film layer of film, fixture clamping and the first cutting area overlapping is equivalent to using useless film is produced as dyestripping handle, that is, is not necessarily to volume
The dyestripping handle that outer setting fixture clamps, can save cost.
It should be noted that the cutting line of first protective film is boundary to dyestripping area, fixture clamping with
First cutting all film layers of area overlapping.By taking display panel attaches the first protective film and the second protective film as an example, as shown in figure 11, folder
22 clamping of tool, first protective film 2 Chong Die with first cutting area 4, the first joint adhesive 13, display panel 1, the second joint adhesive
14 and second protective film 15, it is subsequent, it controls the fixture and the film layer of the first cutting area overlapping is driven counterclockwise to turn
It is dynamic, and moved along the cutting line of first protective film, remove first protective film 2 to dyestripping area.In addition,
Fixture can be clamped in the arbitrary region with the film layer of the first cutting area overlapping, for example, as shown in figure 12, fixture 22 can clamp
In the region of the second cutting area 6 covering.It is of course also possible to be as shown in figure 13, fixture 22 can be clamped in dyestripping area 5 and
The region of second cutting area 6 covering.
Next, being mentioned so that display panel whole face is pasted with the first protective film, the second protective film as an example to the embodiment of the present application
The preparation method using fixation member and the display base plate of fixture supplied is illustrated, the preparation method packet of display base plate
It includes:
S301, the first protective film is arranged by the first joint adhesive whole face at the display panel back side, in the front of display panel
By the second joint adhesive whole face, the second protective film is set；
S302, a chamfered region, from the front of display panel, along the first sub- boundary, the second sub- boundary and the sub- side of third
Boundary cuts through the second protective film, the second joint adhesive and display panel, then passes through along the first sub- boundary and the sub- boundary cutting of third
The first joint adhesive and the first protective film are worn, in another chamfered region, along the first sub- boundary, the second sub- boundary and the sub- boundary of third
Cut through the second protective film, the second joint adhesive, display panel, the first joint adhesive and the first protective film；
S303, flip displays panel make the first protective film upward, and control fixation member is contacted with the first protective film, so that
The orthographic projection of fixation member is adjacent with the orthographic projection to dyestripping area；
S304, the film layer with chamfering area overlapping is clamped using fixture, controls the film of the fixture drive and chamfering area overlapping
Floor is rotated to described to dyestripping area, and is moved along the cutting line of first protective film, and the institute to dyestripping area is removed
State the first protective film.
It should be noted that provided by the embodiments of the present application using fixation member and the preparation side of the display base plate of fixture
Method, such as can use laser cutting device and carry out cutting technique, control laser cutting depth and laser cutting position.Also need
To utilize the ancillary equipment with fixation member and fixture, wherein fixation member can be connect with cylinder column, so that control is solid
Determine component to contact with the first protective film, fixation member can also be controlled using automatically controlled mode and be contacted with the first protective film.Fixture
The film layer of fixture clamping and chamfering area overlapping can be controlled using automatically controlled mode.
Next, by taking display panel is pasted with the first protective film, the second protective film and cover board as an example, the embodiment of the present application
The preparation method of the display base plate using supporting platform, fixation member and fixture of offer is illustrated, display base plate
Preparation method include:
S401, the first protective film is arranged by the first joint adhesive whole face at the display panel back side, in the front of display panel
The second protective film is set by the second joint adhesive whole face, and cover board is set far from the side of display panel in the second protective film；Its
In, in chamfered region and to the not set cover board in the corresponding region in bent area；
S402, a chamfered region, from the front of display panel, along the first sub- boundary, the second sub- boundary and the sub- side of third
Boundary cuts through the second protective film, the second joint adhesive and display panel, then passes through along the first sub- boundary and the sub- boundary cutting of third
The first joint adhesive and the first protective film are worn, in another chamfered region, along the first sub- boundary, the second sub- boundary and the sub- boundary of third
Cut through the second protective film, the second joint adhesive, display panel, the first joint adhesive and the first protective film；
S403, flip displays panel make the first protective film upward, and by the first cutting area of display panel and to be curved
Folding area is placed in supporting platform；
S404, control fixation member contacted with the first protective film so that the orthographic projection of fixation member with it is described to dyestripping area
Orthographic projection it is adjacent；
S405, the film layer with chamfering area overlapping is clamped using fixture, controls the film of the fixture drive and chamfering area overlapping
Floor is rotated to described to dyestripping area, and is moved along the cutting line of first protective film, and the institute to dyestripping area is removed
State the first protective film.
It should be noted that the display base provided by the embodiments of the present application using supporting platform, fixation member and fixture
The preparation method of plate, such as can use laser cutting device and carry out cutting technique, it is also necessary to using with supporting platform, fixation
The ancillary equipment of component and fixture.
A kind of display base plate provided by the embodiments of the present application, the display base plate is using provided by the embodiments of the present application above-mentioned
Method is made.
Display base plate provided by the embodiments of the present application, due to the system using above-mentioned display base plate provided by the embodiments of the present application
Preparation Method is made, and guarantees dyestripping yield while may be implemented to remove the first protective film to dyestripping area, and then guarantees display base
Plate prepares yield.
In conclusion the preparation method and display base plate of display base plate provided by the embodiments of the present application, cutting removal first
Cutting area and the second cutting area that is, so that the first cutting area is separated along cutting line with display panel, and make the second cutting
Area is along cutting line and the first protection UF membrane, so that subsequent removing when first protective film in dyestripping area, can with second to
First protective film in dyestripping area is dyestripping starting point, directly removes the first protective film to dyestripping area, reduces dyestripping difficulty.And
And since the first cutting area is separated with display panel along cutting line, the second cutting area along cutting line and the first protection UF membrane, to
Dyestripping area is disconnected with to other regions except dyestripping area, therefore during removing the first protective film to dyestripping area, no
The film layer to dyestripping area neighboring area can be taken up, will not influence the form to dyestripping area neighboring area film layer, week will not be influenced
The stress distribution of border region film layer.The first protective film for directly treating dyestripping area removes, and can also avoid utilizing laser sintered
It removes caused by the first protective film that sintering residual, flatness are poor, influence the problems such as form at sintering edge, can also avoid pair
Display panel scratches.The preparation method of display base plate provided by the embodiments of the present application may be implemented to remove and protect to the first of dyestripping area
Guarantee dyestripping yield while cuticula, and then guarantees that display base plate prepares yield.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (10)
1. a kind of preparation method of display base plate, which is characterized in that the described method includes:
In the back side whole face of the display panel, the first protective film is set；Wherein, the display panel is included to bent area,
At least one is described to bent area extending direction and first cutting area connecting to bent area；First protective film has
Second cutting area and to dyestripping area, described other regions to except dyestripping area and the area to dyestripping disconnect；It is described wait tear
Film area includes: first to be overlapped with described to bent area to dyestripping area, described first to dyestripping area to dyestripping area and second, and described
Two regions formed to dyestripping area and second cutting area are overlapped with first cutting area；
Cutting removes first cutting area and second cutting area；
Using described second to dyestripping area first protective film as dyestripping starting point, remove described first to dyestripping area
Protective film.
2. the method according to claim 1, wherein first cutting area includes two of the display panel
Chamfered region, cutting remove first cutting area and second cutting area, specifically include:
In each chamfered region, cutting removes first cutting area and second cutting area；
Alternatively, cutting removes first cutting area and second cutting area, in another institute a chamfered region
Chamfered region is stated, cutting removes first cutting area, second cutting area and has with the orthographic projection of first cutting area
Overlapping is described to dyestripping area.
3. the method according to claim 1, wherein the back side whole face in the display panel is arranged first
Protective film specifically includes:
First protective film is attached by the first joint adhesive whole face at the back side of the display panel；
Cutting removes first cutting area and second cutting area, specifically includes:
From deviate from first protective film side, along the boundary of first cutting area cut through first joint adhesive it
On each film layer of the display panel；
Along the boundary of second cutting area, first joint adhesive and first protective film are cut through.
4. according to the method described in claim 3, it is characterized in that, the back side whole face setting first in the display panel is protected
Before or after film, this method further include: the second protective film is attached by the second joint adhesive in the front of the display panel；
Each film layer of the display panel on first joint adhesive is cut through along the boundary of first cutting area, specifically
Include:
Second protective film, second joint adhesive and the display surface are cut through along the boundary of first cutting area
Plate.
5. the method according to claim 1, wherein there is overlapping institute with the orthographic projection with first cutting area
Stating to first protective film in dyestripping area is dyestripping starting point, remove it is described to first protective film in dyestripping area before,
This method further include:
Fixation member is set on first protective film except the area to dyestripping.
6. according to the method described in claim 5, it is characterized in that, first protective film except the area to dyestripping it
Upper setting fixation member specifically includes:
Bar shaped fixation member is respectively set on first protective film of dyestripping folding area two sides, perpendicular to described aobvious
Show panel institute in the in-plane direction, the orthographic projection of the bar shaped fixation member is adjacent with the orthographic projection to dyestripping area.
7. according to the method described in claim 5, it is characterized in that, the fixation member includes buffer layer and is located at described slow
The metal layer on layer is rushed, fixation member is set on first protective film except the area to dyestripping, is specifically included:
It is described to bent area except, the buffer layer for controlling the fixation member is contacted with first protective film.
8. according to the method described in claim 4, it is characterized in that, passing through the second fitting sticker in the front of the display panel
After attached second protective film, this method further include: cover board is set on second protective film；The orthographic projection of the cover board with
It is described to the orthographic projection of bent area and the orthographic projection no overlap of first cutting area；
Using the orthographic projection with first cutting area have it is overlapping described in dyestripping area first protective film as dyestripping originate
End, remove it is described to first protective film in dyestripping area after, this method further include:
By first cutting area of the display panel and it is described be placed in supporting platform to bent area, wherein it is described first protect
Cuticula deviates from the supporting platform.
9. the method according to claim 1, wherein being to first protective film in dyestripping area with described second
Dyestripping starting point removes first protective film to dyestripping area, specifically includes:
Using the film layer of fixture clamping and the first cutting area overlapping, controls the fixture and drive and the first cutting area weight
Folded film layer is rotated to described to dyestripping area, and is moved along the cutting line of first protective film, is removed described to dyestripping
First protective film in area.
10. a kind of display base plate, which is characterized in that the display base plate uses method system according to any one of claims 1 to 9
?.
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| CN201910462902.XA CN110176553B (en) | 2019-05-30 | 2019-05-30 | Preparation method of display substrate and display substrate |
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| CN201910462902.XA CN110176553B (en) | 2019-05-30 | 2019-05-30 | Preparation method of display substrate and display substrate |
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| CN110176553B CN110176553B (en) | 2021-04-27 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110854058A (en) * | 2019-10-25 | 2020-02-28 | 深圳市华星光电技术有限公司 | Fixing device and manufacturing method of display panel |
| CN113150702A (en) * | 2021-04-29 | 2021-07-23 | 业成科技（成都）有限公司 | Optical film assembly, processing method thereof and electronic equipment |
| CN113690286A (en) * | 2021-08-24 | 2021-11-23 | 京东方科技集团股份有限公司 | Protective film, display module, manufacturing method of display module and display device |
| US11244843B2 (en) | 2019-10-25 | 2022-02-08 | Tcl China Star Optoelectronics Technology Co., Ltd | Fixing device and method of manufacturing display panel |
| CN114479695A (en) * | 2022-01-13 | 2022-05-13 | 昆山国显光电有限公司 | Protection film structure and display panel |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014101269A (en) * | 2012-10-25 | 2014-06-05 | Nippon Electric Glass Co Ltd | Cutting method of glass film |
| CN109166894B (en) * | 2018-08-31 | 2021-04-02 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof, protective film and display device |
| CN109585700B (en) * | 2018-12-14 | 2020-06-19 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and display device |
-
2019
- 2019-05-30 CN CN201910462902.XA patent/CN110176553B/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110854058A (en) * | 2019-10-25 | 2020-02-28 | 深圳市华星光电技术有限公司 | Fixing device and manufacturing method of display panel |
| WO2021077488A1 (en) * | 2019-10-25 | 2021-04-29 | Tcl华星光电技术有限公司 | Fixing device and method for manufacturing display panel |
| US11244843B2 (en) | 2019-10-25 | 2022-02-08 | Tcl China Star Optoelectronics Technology Co., Ltd | Fixing device and method of manufacturing display panel |
| CN113150702A (en) * | 2021-04-29 | 2021-07-23 | 业成科技（成都）有限公司 | Optical film assembly, processing method thereof and electronic equipment |
| CN113150702B (en) * | 2021-04-29 | 2022-10-18 | 业成科技（成都）有限公司 | Optical film assembly, processing method thereof and electronic equipment |
| CN113690286A (en) * | 2021-08-24 | 2021-11-23 | 京东方科技集团股份有限公司 | Protective film, display module, manufacturing method of display module and display device |
| CN114479695A (en) * | 2022-01-13 | 2022-05-13 | 昆山国显光电有限公司 | Protection film structure and display panel |
| CN114479695B (en) * | 2022-01-13 | 2023-11-03 | 昆山国显光电有限公司 | Protective film structure and display panel |
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| Publication number | Publication date |
|---|---|
| CN110176553B (en) | 2021-04-27 |
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