CN110176509B - Stainless steel substrate for flexible solar cell - Google Patents
Stainless steel substrate for flexible solar cell Download PDFInfo
- Publication number
- CN110176509B CN110176509B CN201910508945.7A CN201910508945A CN110176509B CN 110176509 B CN110176509 B CN 110176509B CN 201910508945 A CN201910508945 A CN 201910508945A CN 110176509 B CN110176509 B CN 110176509B
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- Prior art keywords
- stainless steel
- parts
- steel substrate
- steel foil
- prepare
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- 239000010935 stainless steel Substances 0.000 title claims abstract description 67
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 67
- 239000000758 substrate Substances 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims description 52
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 33
- 239000011888 foil Substances 0.000 claims description 33
- 239000002245 particle Substances 0.000 claims description 30
- 238000003756 stirring Methods 0.000 claims description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 26
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 22
- 229910052700 potassium Inorganic materials 0.000 claims description 22
- 239000011591 potassium Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 20
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 18
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 18
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 18
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 18
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 16
- 238000001291 vacuum drying Methods 0.000 claims description 16
- 229920002379 silicone rubber Polymers 0.000 claims description 14
- 239000004945 silicone rubber Substances 0.000 claims description 14
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 claims description 13
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 claims description 13
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims description 13
- 229910052757 nitrogen Inorganic materials 0.000 claims description 13
- 239000002994 raw material Substances 0.000 claims description 13
- 229920001971 elastomer Polymers 0.000 claims description 10
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000003377 acid catalyst Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000011541 reaction mixture Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- 239000007795 chemical reaction product Substances 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000007791 liquid phase Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000006722 reduction reaction Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract description 9
- 239000010408 film Substances 0.000 abstract description 8
- 239000007864 aqueous solution Substances 0.000 description 9
- 239000008367 deionised water Substances 0.000 description 9
- 229910021641 deionized water Inorganic materials 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000000047 product Substances 0.000 description 6
- 238000004448 titration Methods 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000001914 filtration Methods 0.000 description 3
- 238000003760 magnetic stirring Methods 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- RWLKLQMGXYQEOQ-UHFFFAOYSA-N N1C(CCC1)=O.[Cu] Chemical compound N1C(CCC1)=O.[Cu] RWLKLQMGXYQEOQ-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910508945.7A CN110176509B (en) | 2019-06-13 | 2019-06-13 | Stainless steel substrate for flexible solar cell |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910508945.7A CN110176509B (en) | 2019-06-13 | 2019-06-13 | Stainless steel substrate for flexible solar cell |
Publications (2)
Publication Number | Publication Date |
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CN110176509A CN110176509A (en) | 2019-08-27 |
CN110176509B true CN110176509B (en) | 2020-12-01 |
Family
ID=67698438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910508945.7A Active CN110176509B (en) | 2019-06-13 | 2019-06-13 | Stainless steel substrate for flexible solar cell |
Country Status (1)
Country | Link |
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CN (1) | CN110176509B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113773674B (en) * | 2021-08-30 | 2022-04-08 | 温州瑞银不锈钢制造有限公司 | Production process of surface-coated stainless steel and surface-coated stainless steel |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5878475A (en) * | 1981-11-04 | 1983-05-12 | Kanegafuchi Chem Ind Co Ltd | Thin film solar battery |
JP4293385B2 (en) * | 1998-01-27 | 2009-07-08 | 株式会社半導体エネルギー研究所 | Method for manufacturing photoelectric conversion device |
JP5480782B2 (en) * | 2010-01-21 | 2014-04-23 | 富士フイルム株式会社 | Solar cell and method for manufacturing solar cell |
JP2013004835A (en) * | 2011-06-20 | 2013-01-07 | Fuji Electric Co Ltd | Flexible solar cell module and fire spread prevention sheet of the same |
JP6445965B2 (en) * | 2013-02-19 | 2018-12-26 | 日鉄ケミカル&マテリアル株式会社 | LAMINATE, SOLAR CELL MEMBER, SOLAR CELL, DISPLAY DEVICE MEMBER, DISPLAY DEVICE AND LAMINATE MANUFACTURING METHOD |
CN109354729A (en) * | 2018-07-24 | 2019-02-19 | 黄山市尚义橡塑制品有限公司 | Graphene enhances rubber and preparation method thereof |
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2019
- 2019-06-13 CN CN201910508945.7A patent/CN110176509B/en active Active
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Publication number | Publication date |
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CN110176509A (en) | 2019-08-27 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20201113 Address after: Room E03, building 1, yuanchuangke, 265 Suixi Road, Sandikou street, Xiangshan District, Huaibei City, Anhui Province Applicant after: Huaibei zhichuangfeng Information Technology Co.,Ltd. Address before: 325000 No. 21 Wuniu Street, Yongjia County, Wenzhou City, Zhejiang Province Applicant before: Chen Jianyi |
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TR01 | Transfer of patent right |
Effective date of registration: 20230703 Address after: No. 20-3A, 20-5, and 20-6, Block 7, Block A, Liyuan Metal Logistics City, No. 38 Sanlu, Tancun Industrial Zone, Chencun Town, Shunde District, Foshan City, Guangdong Province, 528000 (Residence application) Patentee after: FOSHAN SHENGWEISITE METAL TECHNOLOGY Co.,Ltd. Address before: Room E03, Building 1, Yuanchuangke, No. 265, Suixi Road, Sandikou Street, Xiangshan District, Huaibei City, Anhui Province, 235000 Patentee before: Huaibei zhichuangfeng Information Technology Co.,Ltd. |
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TR01 | Transfer of patent right |