CN110174077A - 3 dimension measuring devices, electronic component mounting apparatus and 3 dimension measurement methods - Google Patents
3 dimension measuring devices, electronic component mounting apparatus and 3 dimension measurement methods Download PDFInfo
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- CN110174077A CN110174077A CN201910129413.2A CN201910129413A CN110174077A CN 110174077 A CN110174077 A CN 110174077A CN 201910129413 A CN201910129413 A CN 201910129413A CN 110174077 A CN110174077 A CN 110174077A
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- pattern light
- electronic component
- dimension
- image data
- projection arrangement
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
Abstract
The present invention provides 3 dimension measuring devices, electronic component mounting apparatus and 3 dimension measurement methods, inhibits the enlargement and increased costs of device.3 dimension measuring devices include projection arrangement, and pattern light emission is gone out；Reflection component reflects pattern light；The image data of the object of filming apparatus, the image data for the object for having obtained the 1st pattern light illuminated and illuminated the 2nd pattern light reflected by reflection component；And control device, the image data based on object calculate 3 dimension shapes of object.
Description
Technical field
The present invention relates to 3 dimension measuring devices, electronic component mounting apparatus and 3 dimension measurement methods.
Background technique
As patent document 1 is open, it is known that from multiple directions to object illumination pattern light, measure 3 dimension shapes of object
The technology of shape.
Patent document 1: Japanese Unexamined Patent Publication 2003-202296 bulletin
Pattern light is projected from projection arrangement.By the image data to the object from the illuminated pattern light of multiple directions into
Row image procossing, so that the measurement accuracy of 3 dimension shapes improves.If in order to make to throw to object illumination pattern light from multiple directions
The quantity of image device increases, it is likely that keeps device enlarged and increased costs.
Summary of the invention
The purpose of mode of the invention is, inhibits the enlargement and increased costs of device.
Mode according to the invention provides one kind 3 and ties up measuring device, includes projection arrangement, pattern light emission is gone out；
Reflection component reflects pattern light；Filming apparatus, the image data for the object for having obtained the 1st pattern light illuminated
With the image data of the object of illuminated the 2nd pattern light reflected by the reflection component；And control device,
Based on the image data of the object, 3 dimension shapes of the object are calculated.
The effect of invention
Mode according to the present invention, it is therefore intended that be able to suppress the enlargement and increased costs of device.
Detailed description of the invention
Fig. 1 is the schematic diagram for indicating an example of 3 dimension measuring devices involved in the 1st embodiment.
Fig. 2 is the schematic diagram for indicating an example of 3 dimension measuring devices involved in the 1st embodiment.
Fig. 3 is the functional block diagram for indicating an example of control device involved in the 1st embodiment.
Fig. 4 is the schematic diagram for indicating an example of pattern data involved in the 1st embodiment.
Fig. 5 is the flow chart for indicating an example of 3 dimension measurement methods involved in the 1st embodiment.
Fig. 6 is the schematic diagram for indicating an example of 3 dimension measuring devices involved in the 2nd embodiment.
Fig. 7 is the schematic diagram for indicating an example of electronic component mounting apparatus involved in the 3rd embodiment.
Fig. 8 is the schematic diagram for indicating an example of 3 dimension measuring devices involved in the 3rd embodiment.
The explanation of label
1 ... 3 dimension measuring device, 2 ... workbench, 3 ... projection arrangements, 4 ... filming apparatus, 5 ... control devices, 6 ... reflections
Component, the 1st reflecting surface of 6A ..., the 2nd reflecting surface of 6B ..., the 3rd reflecting surface of 6C ..., 10 ... electronic component mounting apparatus, 11 ... suction nozzles,
12 ... mounting heads, 13 ... electronic part feeders, 14 ... base board delivery devices, 15 ... installation head driving apparatus, 16 ... suction nozzles
Driving device, 20 ... shells, 21 ... position-measurement devices, 31 ... light sources, 32 ... optical modulation elements, 33 ... projection optical systems,
33S ... outgoing plane, 41 ... imaging optical systems, 41S ... the plane of incidence, 42 ... capturing elements, 51 ... input and output portions, 52 ... patterns
Generating unit, 53 ... image data acquisition units, 54 ... phase value calculation parts, 55 ... 3 dimension shape calculation parts, 100 ... control devices,
331 ... the 1st regions, 332 ... the 2nd regions, C ... electronic component, MP ... installation site, P ... substrate, PL ... pattern light, PL1 ...
1 pattern light, the 2nd pattern light of PL2 ..., the 3rd pattern light of PL3 ..., S ... object, the supply position SP ..., T ... lug boss, TP ... measurement
Position.
Specific embodiment
In the following, be illustrated on one side to embodiment according to the present invention on one side referring to attached drawing, but the present invention and unlimited
Due to this.The structural element for the embodiment being illustrated below can be appropriately combined.In addition, sometimes without using the knot of a part
Structure element.
In the following description, XYZ orthogonal coordinate system is set, the position in each portion is closed referring to the XYZ orthogonal coordinate system
System is illustrated.The direction for being parallel to the X-axis of predetermined surface is set as X-direction, the Y orthogonal to X-axis of predetermined surface will be parallel to
The direction of axis is set as Y direction, and the direction for being parallel to the Z axis orthogonal with predetermined surface is set as Z-direction.In addition, will be with X-axis
The rotation at center or inclined direction are set as θ X-direction, by centered on Y-axis rotation or inclined direction be set as θ Y-direction, will be with Z
Rotation or inclined direction centered on axis are set as θ Z-direction.X/Y plane is predetermined surface.
[the 1st embodiment]
< 3 ties up measuring device >
The 1st embodiment is illustrated.Fig. 1 and Fig. 2 indicates 3 dimension measuring device 1 involved in present embodiment
The schematic diagram of one example.As shown in Figures 1 and 2,3 dimension measuring devices 1 include workbench 2, to as measurement object object
Object S is supported；Projection arrangement 3 projects pattern light PL；Reflection component 6 reflects pattern light PL；Shooting dress
4 are set, the image data for the object S for having obtained pattern light PL illuminated；And control device 5, it is based on being taken by filming apparatus 4
The image data of the object S obtained calculates the 3 dimension shapes of object S.
Projection arrangement 3 includes light source 31, issues light；Optical modulation element 32 carries out light to the light projected from light source 31
It modulates and generates pattern light PL；And projection optical system 33, by the pattern light PL generated from optical modulation element 32 to object S
Projection.
Optical modulation element 32 includes Digital Micromirror Device (Digital Mirror Device:DMD).In addition, optical modulating element
Part 32 also may include the liquid crystal display panel of infiltration type, also may include the liquid crystal display panel of reflection-type.Optical modulation element 32 be based on from
Control device 5 export pattern data and generate pattern light PL.Projection arrangement 3 is by the pattern based on pattern data and after patterning
Light PL exposes to object S.
Reflection component 6 reflects pattern light PL and exposes to object S.The reflecting surface of reflection component 6 is planar.Instead
Component 6 is penetrated to reflect the pattern light PL projected from projection arrangement 3 and expose to object S.
Filming apparatus 4 includes imaging optical system 41, and the pattern light PL reflected by object S is imaged；And
Capturing element 42 obtains the image data of object S via imaging optical system 41.Capturing element 42 is comprising cmos image
Sensor (Complementary Metal Oxide Semiconductor Image Sensor) or ccd image sensor
The solid-state image pickup element of (Charge Coupled Device Image Sensor).
The position of filming apparatus 4 is fixed.Filming apparatus 4 is configured at the side+Z of the object S supported by workbench 2.Shooting
The plane of incidence 41S of the imaging optical system 41 of device 4 is opposite with object S.The optical axis AX of imaging optical system 41 is parallel with Z axis.
The position of reflection component 6 is fixed.Reflection component 6 is configured at the light between the plane of incidence 41S of imaging optical system 41 and object S
At least part around axis AX.The position of projection arrangement 3 is fixed.Projection arrangement 3 is in the side+Z compared with reflection component 6
To at least part being configured at around optical axis AX.The relative position quilt of projection arrangement 3, reflection component 6 and filming apparatus 4
It is fixed.
Control device 5 includes computer system, is controlled projection arrangement 3 and filming apparatus 4.Control device 5 has
Arithmetic processing apparatus comprising processor as such as CPU (Central Processing Unit) and include such as ROM
The storage device of memory as (Read Only Memory) or RAM (Random Access Memory) and reservoir.
Arithmetic processing apparatus implements calculation process according to the computer program stored in the storage device.
3 dimension measuring devices 1 are based on pattern sciagraphy, measure to the 3 dimension shapes of object S.For projection arrangement 3,
Object for example is exposed to while making the candy strip light of sinuous lightness distribution carry out phase offset as pattern light PL
Body S.Pattern light PL exposes to object S from multiple directions.
The image data for the object S that filming apparatus 4 has obtained pattern light PL illuminated.Filming apparatus 4, which at least obtains, to be shone
The image data and the illuminated image data of the object S of 2nd pattern light PL2 of the object S of the 1st pattern light PL1 are penetrated.It injects
Incident direction to the 1st pattern light PL1 of object S is different with the incident direction of the 2nd pattern light PL2.
As shown in Figure 1, the 1st pattern light PL1 is projected from projection arrangement 3, the pattern light PL of direct irradiation to object S.Such as
Shown in Fig. 2, the 2nd pattern light PL2 is projected from projection arrangement 3, reflects and expose to the pattern light PL of object S in reflection component 6.
Control device 5 controls optical modulation element 32, so that from will be from the 1st pattern light PL1 of projection arrangement 3
2nd pattern light PL2 of the 1st irradiating state and self-reflection component in future 6 that expose to object S exposes to the 2nd irradiation shape of object S
The variation of one of state is another one.
As shown in Figure 1, control device 5 controls optical modulation element 32 when irradiating the 1st pattern light PL1 to object S
System, so that project pattern light PL from the 1st region 331 of the outgoing plane 33S of projection optical system 33, without from outgoing plane 33S
The 2nd region 332 project pattern light PL.The pattern light PL projected from the 1st region 331 is not via reflection component 6, but as the
1 pattern light PL1 direct irradiation is to object S.
As shown in Fig. 2, control device 5 controls optical modulation element 32 when irradiating the 2nd pattern light PL2 to object S
System, so that project pattern light PL from the 2nd region 332 of the outgoing plane 33S of projection optical system 33, without from outgoing plane 33S
The 1st region 331 project pattern light PL.The pattern light PL projected from the 2nd region 332 exposes to reflection component by optical axis AX
6.The pattern light PL projected from the 2nd region 332 exposes to object S as the 2nd pattern light PL2 via reflection component 6.
In Fig. 1 and example shown in Fig. 2, the 1st region 331 is to be located at-X compared with the optical axis of projection optical system 33
The region of the half of the outgoing plane 33S of side, the 2nd region 332 are the penetrating positioned at the side+X compared with the optical axis of projection optical system 33
Appear 33S half region.The pattern light PL projected from the 1st region 331 exposes to the object S supported by workbench 2.From
The pattern light PL that 2 regions 332 are projected exposes to the reflecting surface of reflection component 6, after the reflective surface of reflection component 6, irradiation
To the object S supported by workbench 2.
< control device >
Fig. 3 is the functional block diagram for indicating an example of control device 5 involved in present embodiment.Control device 5 has
Have: input and output portion 51, pattern generation portion 52, image data acquisition unit 53, phase value calculation part 54 and 3 tie up shape calculation part
55。
Pattern generation portion 52 generates pattern data.The pattern data generated by pattern generation portion 52, via input and output portion
51 and export to optical modulation element 32.Optical modulation element 32 generates pattern based on the pattern data generated by pattern generation portion 52
Light PL.It include the 1st pattern data and the 2nd pattern data by the pattern data that pattern generation portion 52 generates, the 1st pattern data is used
In object S will be exposed to from the 1st pattern light PL1 of projection arrangement 3 without via reflection component 6, the 2nd pattern data is used for
The 2nd pattern light PL2 from projection arrangement 3 is exposed into object S via reflection component 6.
Fig. 4 is the schematic diagram for indicating an example of pattern data involved in present embodiment.As shown in Fig. 4 (A),
When 1st pattern light PL1 is irradiated to object S, the 1st pattern data is generated, optical modulation element 32 is controlled, so that from throwing
Pattern light PL is projected in the 1st region 331 of the outgoing plane 33S of shadow optical system 33, is not projected from the 2nd region 332 of outgoing plane 33S
Pattern light PL.As shown in Fig. 4 (B), when irradiating the 2nd pattern light PL2 to object S, the 2nd pattern data is generated, to light modulation
Element 32 is controlled so that project pattern light PL from the 2nd region 332 of the outgoing plane 33S of projection optical system 33, not from
Project pattern light PL in the 1st region 331 of outgoing plane 33S.
Image data acquisition unit 53 obtains image data via input and output portion 51, from capturing element 42.Image data takes
The image data of the object S that has obtained the 1st pattern light PL1 illuminated of portion 53 and the illuminated object S of 2nd pattern light PL2
Image data.
The brightness based on view data of phase value calculation part 54 carries out the respective phase value of multiple pixels of image data
It calculates.The multiple images data of object S of the phase value calculation part 54 based on the pattern light PL after having distinguished phase offset illuminated
Same point brightness, the phase value of the pixel of image data corresponding with the point is calculated.Phase value calculation part 54
Multiple respective brightness of point based on view data, calculate the respective phase value of multiple pixels of image data.
The 3 dimension multiple respective phase values of pixel based on view data of shape calculation part 55, to multiple with image data
Multiple respective altitude informations of point of the respective corresponding object S of pixel are calculated, and are calculated the 3 dimension shapes of object S.
< 3 ties up measurement method >
Next, being illustrated to 3 dimension measurement methods involved in present embodiment.Fig. 5 is to indicate present embodiment institute
The flow chart of one example of 3 dimension measurement methods being related to.
Pattern generation portion 52 generates the 1st pattern data.As illustrated referring to Fig. 4 (A), from the 1st area of outgoing plane 33S
Pattern light PL is projected in domain 331, does not project pattern light PL from the 2nd region 332 of outgoing plane 33S, generates the 1st pattern data.1st figure
Case data are exported to the optical modulation element 32 of projection arrangement 3.Control device 5 controls optical modulation element 32, so that from
Pattern light PL is projected in 1st region 331, does not project pattern light PL from the 2nd region 332.Projection arrangement 3 projects the 1st pattern light PL1.
As shown in Figure 1, the 1st pattern light PL1 direct irradiation projected from projection arrangement 3 is to object S without via reflection component 6.
Projection arrangement 3 exposes to object S while making the 1st pattern light PL1 phase offset.Filming apparatus 4 obtains multiple
The illuminated image data (step S10) of the object S of 1st pattern light PL1.
The image data of the object S for the 1st pattern light PL1 that filming apparatus 4 has obtained phase offset illuminated.Image data
Acquisition unit 53 obtains the image data of object S from the capturing element 42 of filming apparatus 4 via input and output portion 51.
Brightness of the phase value calculation part 54 based on multiple images data, to the respective phase value of multiple pixels of image data
Calculated (step S20).
In addition, pattern generation portion 52 generates the 2nd pattern data.As illustrated referring to Fig. 4 (B), from outgoing plane 33S's
Pattern light PL is projected in 2nd region 332, does not project pattern light PL from the 1st region 331 of outgoing plane 33S, generates the 2nd pattern data.
2nd pattern data is exported to the optical modulation element 32 of projection arrangement 3.Control device 5 controls optical modulation element 32, so that
It obtains from the 2nd region 332 and projects pattern light PL, do not project pattern light PL from the 1st region 331.Projection arrangement 3 projects the 2nd pattern light
PL2.As shown in Fig. 2, the 2nd pattern light PL2 projected from projection arrangement 3 is reflected in reflection component 6, object S is exposed to.
Projection arrangement 3 exposes to object S while making the 2nd pattern light PL2 phase offset.Filming apparatus 4 obtains multiple
The illuminated image data (step S30) of the object S of 2nd pattern light PL2.
The image data of the object S for the 2nd pattern light PL2 that filming apparatus 4 has obtained phase offset illuminated.Image data
Acquisition unit 53 obtains the image data of object S from the capturing element 42 of filming apparatus 4 via input and output portion 51.
Brightness of the phase value calculation part 54 based on multiple images data, to the respective phase value of multiple pixels of image data
Calculated (step S40).
The image data of 3 object Ss of the dimension shape calculation parts 55 based on illuminated 1st pattern light PL1 and the illuminated 2nd
The image data of the object S of pattern light PL2 is calculated (step S50) to the 3 dimension shapes of object S.
The 3 dimension multiple respective phase values of pixel based on view data of shape calculation part 55, to the 3 of object S dimension shapes into
Row calculates.3 dimension shape calculation parts 55 are based on phase value, according to the principle of triangulation, to the height in each pixel of image data
Degree is according to being calculated.Altitude information in each point on the surface of altitude information and object S in each pixel of image data is 1
It is corresponding to 1.Altitude information in each point on the surface of object S indicates the coordinate value of each point in 3 dimension spaces.3 dimension shapometers
Calculation portion 55 calculates the 3 dimension shapes of object S based on the altitude information in each point.
< effect >
As described above, according to the present embodiment, it is arranged and the pattern light PL projected from projection arrangement 3 is carried out instead
The reflection component 6 penetrated.Even if projection arrangement 3 is 1 as a result, also object can be exposed to from the 1st direction by the 1st pattern light PL1
2nd pattern light PL2 is exposed to object S by the 2nd different direction of 1 direction S, Cong Yu.That is, do not increase the quantity of projection arrangement 3,
Object S can be exposed to from multiple directions by pattern light PL.Therefore, to 3 dimension measuring devices 1 enlargement and increased costs into
Row inhibits.In addition, image procossing is carried out by the image data to the object S from the illuminated pattern light PL of multiple directions, from
And the measurement accuracy of the 3 dimension shapes of object S improves.
In the present embodiment, by controlling optical modulation element 32, irradiate the 1st pattern light PL1's to object S
1st irradiating state and to irradiate one of the 2nd irradiating state variation of the 2nd pattern light PL2 to object S be another one.It is shone the 1st
It penetrates under state, pattern light PL is projected from the 1st region 331 of the outgoing plane 33S of projection arrangement 3 towards object S.Shape is irradiated the 2nd
Under state, pattern light PL is projected from the 2nd region 332 of the outgoing plane 33S of projection arrangement 3 towards reflection component 6.In projection arrangement 3
In the state of obtaining maintenance with the relative position of filming apparatus 4, the exit direction of the pattern light PL from projection arrangement 3 is carried out
Control, therefore to the drop of the measurement accuracy of 3 dimension shapes caused by the variation of the relative position as projection arrangement 3 and filming apparatus 4
It is low to be inhibited.
The plane of incidence 41S and object S that filming apparatus 4 is configured to imaging optical system 41 are opposite.The configuration of reflection component 6 is entering
Penetrate at least part around the optical axis AX of the imaging optical system 41 between face 41S and object S.The configuration of projection arrangement 3 exists
At least part around the optical axis AX of imaging optical system 41 between plane of incidence 41S and object S.Reflection component 6 configures
In the position compared with projection arrangement 3 closer to object S.Projection arrangement 3 is configured at the side (side-X) of optical axis AX, reflecting part
Part 6 is configured at the other side (side+X) of optical axis AX.The pattern light PL projected from projection arrangement 3 is exposed to anti-by optical axis AX
Penetrate component 6.As a result, in the state of inhibiting the enlargement of 3 dimension measuring devices 1, the 1st pattern light PL1 and the 2nd pattern light PL2
Respectively expose to object S.
[the 2nd embodiment]
The 2nd embodiment is illustrated.In the following description, to the knot identical or same with above-mentioned embodiment
Structure element marks same label, simplifies or the description thereof will be omitted.
Fig. 6 is the schematic diagram for indicating an example of 3 dimension measuring devices 1 involved in present embodiment.3 dimension measuring devices
1 includes projection arrangement 3, and pattern light PL is projected；Reflection component 6 reflects pattern light PL；And filming apparatus
4, the image data for the object S for having obtained pattern light PL illuminated.
In the present embodiment, reflection component 6 includes the 1st reflecting surface 6A, the 2nd reflecting surface 6B and the 3rd reflecting surface 6C.1st
Reflecting surface 6A, the 2nd reflecting surface 6B and the 3rd reflecting surface 6C are individually planar.1st reflecting surface 6A, the 2nd reflecting surface 6B and the 3rd are anti-
Face 6C is penetrated towards different directions.
In the present embodiment, pattern light PL exposes to object S from 3 directions.The 1st of object S is exposed to from the 1st direction
Pattern light PL1 is the pattern light PL for reflecting and exposing to object S from the injection of projection arrangement 3, in the 1st reflecting surface 6A.From the 2nd side
It is to be projected from projection arrangement 3, reflected in the 2nd reflecting surface 6B and expose to object S to the 2nd pattern light PL2 for exposing to object S
Pattern light PL.The 3rd pattern light PL3 that object S is exposed to from the 3rd direction is to project, from projection arrangement 3 in the 3rd reflecting surface 6C
Reflect and expose to the pattern light PL of object S.
Pattern light PL can simultaneously be exposed to the 1st reflecting surface 6A, the 2nd reflecting surface 6B and the 3rd reflecting surface by projection arrangement 3
6C.By the way that the pattern light PL from projection arrangement 3 is simultaneously exposed to the 1st reflecting surface 6A, the 2nd reflecting surface 6B and the 3rd reflection
Face 6C, so that the 1st pattern light PL1, the 2nd pattern light PL2 and the 3rd pattern light PL3 simultaneously expose to object S.Filming apparatus 4 takes
The object S of illuminated 1st pattern light PL1, the 2nd pattern light PL2 and the 3rd pattern light PL3 simultaneously image data.Control dress
5 image datas based on object S are set, the 3 dimension shapes of object S are calculated.
As described above, according to the present embodiment, even if not controlling optical modulation element 32, by will be from
The pattern light PL that projection arrangement 3 projects exposes to the 1st reflecting surface 6A, the 2nd reflecting surface 6B and the 3rd reflecting surface 6C respectively, thus
1st pattern light PL1, the 2nd pattern light PL2 and the 3rd pattern light PL3 can be exposed to object S from different directions.
In addition, by the way that the pattern light PL from projection arrangement 3 is simultaneously exposed to the 1st reflecting surface 6A, the 2nd reflection respectively
Face 6B and the 3rd reflecting surface 6C, so that the 1st pattern light PL1, the 2nd pattern light PL2 and the 3rd pattern light PL3 are respectively simultaneously exposed to
Object S.Filming apparatus 4 can simultaneously obtain illuminated 1st pattern light PL1, the 2nd pattern light PL2 and the 3rd pattern light respectively
The image data of the object S of PL3.
In addition, in the present embodiment, the pattern light PL projected from projection arrangement 3, not direct irradiation to object S.It can also
At least part with the pattern light PL in the same manner as above-mentioned embodiment, projected from projection arrangement 3, direct irradiation to object
S。
In the present embodiment, be also possible to reflection component 6 with the 1st reflecting surface 6A and the 2nd reflecting surface 6B without
3rd reflecting surface 6C.Alternatively, it is also possible to being that reflection component 6 has towards different directions and is greater than or equal to 4 multiple reflections
Face.
[the 3rd embodiment]
The 3rd embodiment is illustrated.In the following description, to the knot identical or same with above-mentioned embodiment
Structure element marks same label, simplifies or the description thereof will be omitted.
Fig. 7 is the schematic diagram for indicating an example of electronic component mounting apparatus 10 involved in present embodiment.Such as Fig. 7
Shown, electronic component mounting apparatus 10 has the 3 dimension measuring devices 1 illustrated in the above-described embodiment.
Electronic component mounting apparatus 10 installs electronic component C to substrate P.Electronic component mounting apparatus 10 includes installation
First 12, there is the suction nozzle 11 kept to electronic component C；Electronic part feeder 13 supplies electronic component C；Base
Plate conveying device 14 conveys the substrate P of mounted electronic component C；And control device 100, to electronic component
Mounting device 10 is controlled.
Electronic part feeder 13 includes: tep reel, is supported to holding band；And feeder, to from tep reel
The electronic component C that the holding band of extraction is kept is conveyed.In addition, electronic part feeder 13 also may include to multiple
The pallet that electronic component C is kept.Electronic part feeder 13 supplies electronic component C to supply position SP.
Base board delivery device 14 includes conveyer belt, conveys to substrate P；And clamp system, pacify to being delivered to
The position of the substrate P of holding position MP is fixed.
Suction nozzle 11 detachably keeps electronic component C.Suction nozzle 11, which can be, to be adsorbed electronic component C and is kept
Absorption suction nozzle, be also possible to clip electronic component C and the grasping suction nozzle that keeps.
The electronic component C that mounting head 12 is kept suction nozzle 11 is installed to substrate P.Mounting head 12 is driven by mounting head and is filled
15 are set, is moved respectively in X-direction and Y direction.Suction nozzle 11 by being set to the suction nozzle driving device 16 of mounting head 12,
It is moved respectively relative to mounting head 12 in Z-direction and θ Z-direction.Suction nozzle 11 passes through installation head driving apparatus 15 and suction nozzle
Driving device 16 can be moved in this 4 directions in X-direction, Y direction, Z-direction and θ Z-direction.12 energy of mounting head
It is enough to be moved to supply position SP as defined in electronic part feeder 13 and between installation site MP as defined in substrate P
It is dynamic.
Mounting head 12 is at the SP of supply position using suction nozzle 11 to the electronic component C supplied from electronic part feeder 13
After being kept, conveyed to the substrate P for being configured at installation site MP.The electronic component C that mounting head 12 is kept suction nozzle 11 to
It is configured at the substrate P installation of installation site MP.
3 dimension measuring devices 1 measure the 3 dimension shapes of the electronic component C kept by suction nozzle 11.3 dimension measuring devices 1 are matched
It is placed in the movement routine of the mounting head 12 between supply position SP and installation site MP.Mounting head 12 utilizes at the SP of supply position
After suction nozzle 11 keeps electronic component C, to before substrate P conveying, electronic component C is configured to the measurement position for tieing up measuring devices 13
TP.The measurement position TP of 3 dimension measuring devices 1 refer to, the position that can irradiate pattern light PL of 3 dimension measuring devices 1.3 dimension measurements
Device 1 measures 3 dimension shapes for the electronic component C for being held in suction nozzle 11 and configuring in measurement position TP.
As shown in fig. 7, projection arrangement 3, filming apparatus 4 and reflection component 6 are supported by shell 20.Projection arrangement 3, shooting dress
Set 4 and the relative position of reflection component 6 be fixed.Filming apparatus 4 is configured at the side-Z compared with measurement position TP.Filming apparatus 4
Plane of incidence 41S can be opposite with the electronic component C of measurement position TP is configured at.
Reflection component 6 configures the image optics system between plane of incidence 41S and the electronic component C for being configured at measurement position TP
At least part around the optical axis AX of system 41.Projection arrangement 3 is configured in plane of incidence 41S and the electricity for being configured at measurement position TP
At least part around the optical axis AX of imaging optical system 41 between subassembly C.The configuration of reflection component 6 is filled with projection
Set 3 positions compared to closer measurement position TP.
Fig. 8 is the schematic diagram for indicating an example of 3 dimension measuring devices 1 involved in present embodiment.As shown in figure 8,
Reflection component 6 configures 2 around optical axis AX.Projection arrangement 3 configures around optical axis AX.
1st reflection component 6 is configured at the side-X of optical axis AX.1st projection arrangement 3 is configured at the side+X of optical axis AX.1st throws
Image device 3 can irradiate the 2nd pattern light PL2 to the 1st reflection component 6.In the 2nd pattern light PL2 that the 1st reflection component 6 reflects,
Expose to the electronic component C in measurement position TP configuration.In addition, the 1st projection arrangement 3 can directly irradiate the 1st pattern light PL1
To the electronic component C in measurement position TP configuration.
2nd reflection component 6 is configured at the side+Y of optical axis AX.2nd projection arrangement 3 is configured at the side-Y of optical axis AX.2nd throws
Image device 3 can irradiate the 2nd pattern light PL2 to the 2nd reflection component 6.In the 2nd pattern light PL2 that the 2nd reflection component 6 reflects,
Expose to the electronic component C in measurement position TP configuration.In addition, the 2nd projection arrangement 3 can directly irradiate the 1st pattern light PL1
To the electronic component C in measurement position TP configuration.
As described above, to the electronic component C configured in measurement position TP, from 4 direction irradiation patterns light PL.Filming apparatus
It is the image data of the 4 electronic component C for having obtained the 1st pattern light PL1 from the 1st projection arrangement 3 illuminated respectively, illuminated
The image data of the electronic component C of the 2nd pattern light PL2 from the 1st reflection component 6 illuminated comes from the 2nd projection arrangement 3
The 1st pattern light PL1 electronic component C image data and illuminated the 2nd pattern light PL2 from the 2nd reflection component 6
Electronic component C image data.Control device 5 is based on the image data obtained by filming apparatus 4, to 3 dimensions of electronic component C
Shape is calculated.
3 dimension shapes of the 3 dimension measuring devices 1 to the mounting portion of electronic component C in electronic component C, at least being contacted with substrate P
Shape is calculated.The mounting portion of electronic component C includes the lower surface of the electronic component C opposite with the surface of substrate P.In the ministry of electronics industry
In the case that part C has the lug boss T being inserted into the hole of substrate P, the mounting portion of electronic component C includes lug boss T.Lug boss T
It can be metal lead, be also possible to plastic protrusion.
In the present embodiment, electronic component C has lug boss T.In the position in the hole of the substrate P of installation site MP configuration
It sets, is measured by position-measurement device 21.Indicate the measurement data output of the position-measurement device 21 of the position in the hole of substrate P
To control device 100.
Control device 100 and installation head driving apparatus 15, suction nozzle driving device 16, position-measurement device 21 and control device
5 are separately connected.Control device 100 is before installing electronic component C to substrate P, by 3 dimension measuring devices 1 to electronic component C's
3 dimension shapes measure.The 3 dimension shapes of electronic component C include the orthogonal seat of XYZ provided out in electronic component mounting apparatus 10
The coordinate data at each position of the electronic component C in mark system.Measurement data of the mounting head 12 based on 3 dimension measuring devices 1, to electronics
The relative position of component C and substrate P is adjusted, and electronic component C is installed on substrate P.
For example, in the case where electronic component C has lug boss T, image data of the control device 5 based on electronic component C,
The position of lug boss T in X-direction, Y direction and θ Z-direction is calculated.Indicate 3 dimension measurements of the position of lug boss T
The measurement data of device 1 is exported to control device 100.
The measurement data of measurement data and position-measurement device 21 of the control device 100 based on 3 dimension measuring devices 1, to peace
Dress head driving apparatus 15 and suction nozzle driving device 16 are controlled, on one side the lug boss T to the electronic component C for being held in suction nozzle 11
It is adjusted with the relative position in the hole for the substrate P for being supported in base board delivery device 14, on one side pacifies electronic component C to substrate P
Dress, so that the lug boss T of electronic component C to be inserted into the hole of substrate P.
As described above, according to the present embodiment, shape is tieed up to the 3 of electronic component C by 3 dimension measuring devices 1
It measures.The 3 dimension shapes of electronic component C include the coordinate data of the mounting portion of electronic component C.Therefore, mounting head 12 can
Based on the measurement data of 3 dimension measuring devices 1, the relative position of electronic component C and substrate P are adjusted on one side, it on one side will be electric
Subassembly C is accurately installed on substrate P.
[other embodiment]
In addition, in the above-described embodiment, the pattern light PL (the 2nd pattern light PL2) for being set as projecting from projection arrangement 3 shines
It is incident upon reflection component 6.It is also possible to expose to the reflection component of middle conversion from the pattern light PL that projection arrangement 3 projects, in transfer
The pattern light PL that reflection component reflects exposes to reflection component 6.By the reflection component converted in setting, so as to
The relative position of projection arrangement 3, reflection component 6 and filming apparatus 4 is arbitrarily determined.
In the above-described embodiment, the reflecting surface of reflection component 6 is set as planar.The reflecting surface of reflection component 6 can also
To be curved.The reflecting surface of reflection component 6 is also possible to the center of reflecting surface far from the concave shape of optical axis AX.
Claims (9)
1. one kind 3 ties up measuring device, include
Projection arrangement goes out pattern light emission；
Reflection component reflects pattern light；
Filming apparatus, the image data for the object for having obtained the 1st pattern light illuminated and illuminated by the reflection component
The image data of the object of the 2nd pattern light reflected；And
Control device calculates 3 dimension shapes of the object based on the image data of the object.
2. 3 dimension measuring device according to claim 1, wherein
The 1st pattern light is the pattern light from the projection arrangement direct irradiation to the object.
3. 3 dimension measuring device according to claim 2, wherein
The projection arrangement has the optical modulation element for generating pattern light,
The 3 dimension measuring device has control device, which controls the optical modulation element, so as to institute
It states the state of the 1st pattern light described in object illumination and changes to one of state of the 2nd pattern light described in the object illumination
For another one.
4. 3 dimension measuring device according to claim 1, wherein
The reflection component includes the 1st reflecting surface and the 2nd reflecting surface,
The 1st pattern light is the pattern light that the object is exposed to by the 1st reflective surface,
The 2nd pattern light is the pattern light that the object is exposed to by the 2nd reflective surface.
5. 3 dimension measuring device according to claim 4, wherein
Pattern light is simultaneously exposed to the 1st reflecting surface and the 2nd reflecting surface by the projection arrangement.
6. 3 dimension measuring device according to any one of claim 1 to 5, wherein
The plane of incidence of the imaging optical system of the filming apparatus is opposite with the object,
Around the optical axis of the imaging optical system of the reflection component configuration between the plane of incidence and the object
At least part,
The pattern light projected from the projection arrangement, exposes to the reflection component by the optical axis.
7. a kind of electronic component mounting apparatus, includes
Mounting head has the suction nozzle kept to electronic component, and the electronic component that the suction nozzle is kept is installed
In substrate；And
3 dimension measuring device described in any one of claims 1 to 6, to the 3 of the electronic component that the suction nozzle is kept
Dimension shape measures.
8. electronic component mounting apparatus according to claim 7, wherein
Measurement data of the mounting head based on the 3 dimension measuring device, to the opposite position of the electronic component and the substrate
It sets and is adjusted.
9. one kind 3 ties up measurement method, it includes following step:
By the 1st pattern light irradiation to object；
By the 2nd pattern light irradiation reflected by reflection component to the object；
The image data for the object for having obtained the 1st pattern light illuminated and the illuminated institute of the 2nd pattern light
State the image data of object；And
Based on the image data of the object, 3 dimension shapes of the object are calculated.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018029084A JP7215826B2 (en) | 2018-02-21 | 2018-02-21 | Three-dimensional measuring device, electronic component mounting device, and three-dimensional measuring method |
| JP2018-029084 | 2018-02-21 |
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| CN110174077A true CN110174077A (en) | 2019-08-27 |
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| CN (1) | CN110174077B (en) |
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| JP7297694B2 (en) * | 2020-01-16 | 2023-06-26 | 株式会社東芝 | System and method |
| JP7338656B2 (en) * | 2021-03-10 | 2023-09-05 | 株式会社豊田中央研究所 | Measuring device, measuring method and its program |
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| JP2001004325A (en) | 1999-06-17 | 2001-01-12 | Hitachi Via Mechanics Ltd | Alignment inspecting device for solder ball |
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| JPH0377006A (en) * | 1989-08-21 | 1991-04-02 | Fujitsu Ltd | Device for measuring shape of object |
| JP2004235671A (en) * | 1996-04-23 | 2004-08-19 | Matsushita Electric Ind Co Ltd | Electronic component mounting device |
| JP2003329424A (en) * | 2002-05-14 | 2003-11-19 | Mitsubishi Electric Corp | Three-dimensional shape measuring instrument |
| CN103134446A (en) * | 2008-02-26 | 2013-06-05 | 株式会社高永科技 | Apparatus and method for measuring a three-dimensional shape |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110174077B (en) | 2023-07-18 |
| JP7215826B2 (en) | 2023-01-31 |
| JP2019144137A (en) | 2019-08-29 |
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